TW202019000A - Method for manufacturing flexible organic electroluminescent (EL) display capable of alleviating the complexity of operation - Google Patents

Abstract

The present invention provides a method for manufacturing a flexible organic electroluminescent (EL) display capable of alleviating the complexity of the operation. The method for manufacturing the flexible organic EL display is related to the manufacturing of a multilayer laminated substrate 10. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated so that the first resin layer 11B and the second resin layer 12B face each other. This manufacturing method includes a preceding step which is a step before the step of laminating the first laminated substrate 11 and the second laminated substrate 12. The preceding step includes a previous processing step. The previous processing step is performed on at least one of the first laminated substrate 11 and the second laminated substrate 12, and is a processing related to the cutting of at least one of the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B. This manufacturing method further includes a rear step that is a step after the step of laminating the plurality of laminated substrates. In the previous processing step, at least one of the plurality of laminated substrates is cut. The rear step includes a rear laminating step of laminating one of cut laminated substrates on another one of uncut laminated substrates. In the previous processing step, the at least one of the plurality of laminated substrates is subjected to the pre-processing for breaking the laminated substrate in the rear step that is a step after the step of laminating the plurality of laminated substrates.

Description

Manufacturing method of flexible organic EL display

The invention relates to a method for manufacturing a flexible organic EL display.

An organic EL (electro luminescence) display includes a light emitting element in which a light emitting layer, an electrode, and a substrate are stacked. In a flexible organic EL display, a flexible substrate is used as the substrate. In the manufacturing process of the flexible organic EL display, a resin layer is formed on the glass layer, and a light-emitting layer is formed on the resin layer (for example, Patent Document 1). [Prior Technical Literature] [Patent Literature]

[Patent Document 1] Republication Patent WO2011/030716 Gazette

[Problems to be solved by the invention]

Proposed a new structure of light-emitting elements. The light-emitting element has a first resin layer and a second resin layer provided to face each other. A light-emitting layer and the like are provided between the first resin layer and the second resin layer. Since the structure is different from the conventional light-emitting element, in the manufacturing process of the light-emitting element of the new structure, for example, there is a possibility that the cutting operation of the laminated substrate in which the glass layer and the resin layer are laminated becomes complicated.

An object of the present invention is to provide a method for manufacturing a flexible organic EL display that can ease the complexity of operations. [Technical means to solve the problem]

The manufacturing method of a flexible organic EL display related to the present invention is a manufacturing method of a flexible organic EL display related to the manufacture of a multilayer build-up substrate, the multilayer build-up substrate having a plurality of build-up substrates in which a glass layer and a resin layer are stacked, The plurality of laminated substrates includes a first laminated substrate laminated with a first glass layer and a first resin layer, and a second laminated substrate laminated with a second glass layer and a second resin layer, and the first resin layer and the above The second resin layer is laminated in a manner opposed to each other. The manufacturing method of the flexible organic EL display includes a preceding step, which is a step before the step of laminating the plurality of laminated substrates, and the preceding step includes the lamination of the plurality of laminated substrates At least one of them performs a processing step before the processing associated with the cutting of at least one of the glass layer and the resin layer. The processing associated with the cutting of at least one of the glass layer and the resin layer includes, for example, processing for cutting the glass layer, processing for cutting the resin layer, pre-processing for breaking the glass layer, and for cutting the resin One or more of the pre-processed layer breaks. Since the processing related to the above cutting is performed on at least one of the plurality of laminated substrates in the previous step, in the step after the step of laminating the plurality of laminated substrates (hereinafter referred to as the "post-step"), the multi-layer laminate The cutting-related steps required for the substrate can be reduced. Since there is less processing for a multilayer build-up substrate whose structure is more complicated than that of a build-up substrate, the complexity of the operation is eased.

In one example of the method for manufacturing the flexible organic EL display described above, the glass layer is cut in the preceding processing step. In this manufacturing method, since the glass layer is cut in the previous step, for example, when the resin layer of the multilayer build-up substrate is cut by laser, the gas generated by the laser irradiation will be emitted from the glass layer. When the cut part is discharged, the possibility of gas affecting the quality of the resin layer becomes low.

In one example of the method for manufacturing the flexible organic EL display described above, the resin layer is cut in the preceding processing step. In this manufacturing method, since the resin layer is cut in the previous step, there is no need to cut the resin layer sandwiched by the glass layer in the subsequent step, and the complexity of the operation is eased.

In one example of the method for manufacturing the flexible organic EL display described above, it further includes a post-step, which is a step after the lamination step of the plurality of laminated substrates, and in the foregoing processing step, the plurality of laminated substrates One is cut, and the subsequent step includes the step of laminating one of the plurality of laminated substrates that have been cut on the other of the plurality of laminated substrates that have not been cut. In this manufacturing method, since one build-up substrate is cut in the previous step, the steps related to the cutting required for the multi-layer build-up substrate in the subsequent step are reduced, and the complexity of the operation is eased. Since one laminated substrate can be laminated on another laminated substrate that has not been cut, the accuracy required for position management of each laminated substrate in the lamination operation can be eased compared to the case where two laminated substrates that have been cut are laminated.

In one example of the method for manufacturing the flexible organic EL display, in the preceding processing step, at least one of the plurality of build-up substrates is pre-processed to enable the build-up substrate to laminate the plurality of build-up substrates The step after the step is broken in the subsequent step. In this manufacturing method, since the pre-processing is performed in the previous step, the steps related to the cutting required for the multilayer build-up substrate in the subsequent step are reduced, and the complexity of the operation is reduced.

In one example of the method for manufacturing the flexible organic EL display described above, in the pre-processing, a scribe line is formed on the glass layer. In this manufacturing method, since the scribe line is formed in the glass layer in the previous step, for example, when the resin layer of the multilayer build-up substrate is cut by laser, the scribe line portion of the glass layer is broken by gas , The gas is discharged from the cut-off part. The possibility of gas affecting the quality of the resin layer becomes low.

In one example of the method for manufacturing the flexible organic EL display described above, in the preceding processing step, both of the plurality of laminated substrates are cut. In this manufacturing method, since both of the laminated substrates are cut in the previous step, there is no need to perform the steps related to the cutting on the multilayered laminated substrate in the subsequent step, and the complexity of the operation is alleviated. [Effect of invention]

According to the present invention, the complexity of operations related to the cutting of the multilayer substrate can be reduced.

(Implementation form) The manufacturing method of the flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary machines and portable machines. An example of stationary machines are personal computers and television receivers. Examples of portable devices are mobile information terminals, wearable computers, and notebook personal computers. Examples of mobile information terminals are smartphones, tablets, and portable game consoles. Examples of wearable computers are head-mounted displays and smart watches.

The flexible organic EL display has a light-emitting element in which a light-emitting layer, an electrode, and a substrate are stacked, a first protective film covering the light-emitting element from one side, and a second protective film covering the light-emitting element from the other side. For the first protective film and the second protective film, for example, PET (polyethylene terephthalate) is used. Furthermore, one of the first protective film and the second protective film may be omitted. In the light-emitting element manufacturing step, a plurality of light-emitting elements are manufactured from one multilayer build-up substrate 10 shown in FIG. 1.

The multilayer build-up substrate 10 is manufactured in the middle of the manufacture of the flexible organic EL display. The multilayer build-up substrate 10 includes a first build-up substrate 11 in which a first glass layer 11A and a first resin layer 11B are stacked, and a second build-up substrate 12 in which a second glass layer 12A and a second resin layer 12B are stacked. The multilayer build-up substrate 10 is formed by stacking the first build-up substrate 11 and the second build-up substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer build-up substrate 10 further has a conductive layer 13. The conductive layer 13 is formed on, for example, the first resin layer 11B of the first build-up substrate 11. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with members for electronic components such as OLED (Organic Light Diode) and TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B constitute a light-emitting element.

The first glass layer 11A of the first build-up substrate 11 and the second glass layer 12A of the second build-up substrate 12 use the same material and are formed in the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, and for example, glass having various compositions such as alkali metal oxide-containing glass or alkali-free glass can be used. An example of glass containing alkali metal oxide is soda lime glass. In this embodiment, alkali-free glass is used for the first glass layer 11A and the second glass layer 12A. The thicknesses of the first glass layer 11A and the second glass layer 12A are not particularly limited, but are preferably about 0.5 mm, for example. The first glass layer 11A has a first plane 14A on which the first resin layer 11B is formed, and a second plane 14B paired with the first plane 14A. The second glass layer 12A has a first plane 15A on which the second resin layer 12B is formed, and a second plane 15B paired with the first plane 15A.

The first resin layer 11B of the first build-up substrate 11 and the second resin layer 12B of the second build-up substrate 12 use the same material and are formed in the same size. The composition of the first resin layer 11B and the second resin layer 12B is not particularly limited, and for example, polyimide (PI) can be used. The thicknesses of the first resin layer 11B and the second resin layer 12B are not particularly limited, but are preferably within a range of, for example, 10 μm or more and 30 μm or less.

FIG. 2 is a plan view of the first build-up substrate 11. The first unit build-up substrate 21 is formed by cutting the first build-up substrate 11 into a lattice shape along the planned cutting section 16 shown by the broken line in FIG. 2. Similarly to the second build-up substrate 12, a second unit build-up is formed by cutting the second build-up substrate 12 into a lattice shape along the planned cutting section 17 (not shown in FIG. 2, for example, refer to FIG. 11 ). Substrate 22. The dimensions of the first unit build-up substrate 21 and the second unit build-up substrate 22 in plan view correspond to the predetermined size of the light-emitting element in plan view. In this embodiment, the size of the first unit build-up substrate 21 in plan view and the size of the second unit build-up substrate 22 in plan view are equal to each other. By laminating the first unit build-up substrate 21 and the second unit build-up substrate 22 such that the first resin layer 11B and the second resin layer 12B face each other, the unit build-up substrate 20 as the multilayer build-up substrate 10 is constructed (refer to FIG. 19 ).

The cutting of the first build-up substrate 11 and the second build-up substrate 12 uses at least one of a laser processing apparatus and a scribing processing apparatus. FIG. 3 is an example of the configuration of a laser processing device, and FIG. 4 is an example of the configuration of a scribing processing device. In FIGS. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4. In addition, a cutting device (not shown) may be used for cutting the first build-up substrate 11 and the second build-up substrate 12.

As shown in FIG. 3, the laser processing apparatus 30 includes: a laser device 31 for cutting the first build-up substrate 11 and the second build-up substrate 12; and a mechanical drive system 32 for making the first build-up substrate 11 And the second build-up substrate 12 moves relative to the laser device 31; and the first control unit 33, which controls the laser device 31 and the mechanical drive system 32.

The laser device 31 processes one of the resin layer and the glass layer in the first build-up substrate 11 and the second build-up substrate 12. The laser device 31 includes: a laser oscillator 34 for irradiating the first build-up substrate 11 and the second build-up substrate 12 with laser light; and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing apparatus 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing apparatus 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 is composed of, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. In addition, the transmission optical system 35 includes, for example, an X-axis direction moving mechanism for moving the laser irradiation head equipped with the laser oscillator 34 in the X-axis direction. The laser light irradiated from the laser oscillator 34 is irradiated toward the first laminated substrate 11 and the second laminated substrate 12 via the transmission optical system 35.

The mechanical drive system 32 and the laser device 31 are arranged to face each other in the Z-axis direction. The mechanical drive system 32 is composed of a bed 36, a processing table 37, and a moving device 38. The first build-up substrate 11 or the second build-up substrate 12 is placed on the processing table 37. The moving device 38 moves the processing table 37 with respect to the bed 36 in the horizontal direction (X-axis direction and Y-axis direction). The moving device 38 is a well-known mechanism having a guide rail, a moving table, a motor, and the like.

The first control unit 33 has an arithmetic processing device that executes a predetermined control program. The arithmetic processing device includes, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may have one or more microcomputers. The first control unit 33 further has a memory unit. In the memory section, it stores various control programs and information used in various control processes. The memory section has, for example, a non-volatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31 or the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. In the case where the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be arbitrarily set.

As shown in FIG. 4, the scribing processing apparatus 40 moves the scribing wheel 50 and the first build-up substrate 11 or the second build-up substrate 12 relative to each other in the X-axis direction and the Y-axis direction to move to the first build-up substrate 11 Or, the second build-up substrate 12 forms a scribe line along the X-axis direction and the Y-axis direction. The scribing processing device 40 includes: a processing device 41 for processing the first build-up substrate 11 or the second build-up substrate 12; a transport device 42 for transporting the first build-up substrate 11 or the second build-up substrate 12; and the second The control unit 43 controls the processing device 41 and the conveying device 42.

The conveying device 42 is composed of a pair of rails 44, a table 45, a linear drive device 46, a rotating device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribing processing device 40 of FIG. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing processing device 40, and the table 4 is moved back and forth along the pair of rails 44 by the linear drive device 46. The rotating device 47 rotates the table 45 about the central axis C. The first build-up substrate 11 or the second build-up substrate 12 is placed on the stage 45. An example of the linear drive device 46 is a feed screw device. The rotating device 47 has a motor as a driving source.

The processing device 41 is composed of a horizontal drive device 48, a vertical drive device 49, a scoring wheel 50, and the like. The scoring wheel 50 is installed in a holder unit for holding the scoring wheel 50. The holder unit is mounted on a scoring head for holding the holder unit. The scoring head moves in the X-axis direction by the horizontal drive device 48 and moves in the Z-axis direction by the vertical drive device 49. By the scoring wheel 50 moving in the X-axis direction, a scribe line along the X-axis direction is formed on the first build-up substrate 11 and the second build-up substrate 12.

The scoring wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. An example of the material constituting the scoring wheel 50 is sintered diamond (Poly Crystalline Diamond), superhard metal, single crystal diamond, and polycrystalline diamond. For the scoring wheel 50, for example, any one of the scoring wheel 50A shown in FIG. 5(a) and the scoring wheel 50B shown in FIG. 5(b) can be used.

The scoring wheel 50A shown in FIG. 5(a) is composed of a disc-shaped body portion 51 and a V-shaped blade tip portion 52. The so-called V-shaped cross-section refers to a cross section of the scribe wheel 50A cut along a plane along the thickness direction of the scribe wheel 50A (hereinafter referred to as "thickness direction DT"), toward the outer periphery of the scribe wheel 50A And the shape of the front end is tapered.

An insertion hole 53 penetrating the main body 51 is formed in the center of the main body 51 in the thickness direction DT. The pin is inserted into the insertion hole 53. The blade tip portion 52 has a first inclined surface 52A and a second inclined surface 52B as two inclined surfaces forming a V-shaped cross section. The first inclined surface 52A and the second inclined surface 52B are symmetrical with respect to the center of the scribe wheel 50A in the thickness direction DT and a rotation center plane RC orthogonal to the thickness direction DT.

Compared with the scoring wheel 50B shown in FIG. 5(b) and the scoring wheel 50A, the shape of the blade tip portion 52 is different. The first inclined surface 52A and the second inclined surface 52B in the blade tip portion 52 of the scoring wheel 50B are asymmetric with respect to the rotation center plane RC. In one example, in the cross section of the scoring wheel 50B along the thickness direction, the first angle θ1 formed by the line segment L1 parallel to the radial direction of the scoring wheel 50B and the first slope 52A is greater than the line segment L1 and the second slope 52B The resulting second angle θ2. Furthermore, if the position of the front end of the blade tip portion 52 in the direction along the line segment L1 deviates from the rotation center plane RC, the first angle θ1 may be equal to the second angle θ2.

The second control unit 43 has an arithmetic processing device that executes a predetermined control program. The arithmetic processing device has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further has a memory unit. In the memory section, it stores various control programs and information used in various control processes. The memory section has, for example, a non-volatile memory and a volatile memory. The second control unit 43 may be provided in the processing device 41 or the transport device 42 or may be provided separately from the processing device 41 and the transport device 42. In the case where the second control unit 43 is provided separately from the processing device 41 and the conveying device 42, the arrangement position of the second control unit 43 can be arbitrarily set.

[Manufacturing method of flexible organic EL display] Next, the details of the manufacturing method of the flexible organic EL display will be described. FIG. 6 shows an example of the steps of the manufacturing method of the flexible organic EL display.

In the manufacturing method of a flexible organic EL display, a multilayer build-up substrate 10 is manufactured, which has a first build-up substrate 11 in which a first glass layer 11A and a first resin layer 11B are stacked, and a second glass in which The second buildup substrate 12 of the layer 12A and the second resin layer 12B is stacked so that the first resin layer 11B and the second resin layer 12B face each other. In this embodiment, at least one of the first build-up substrate 11 and the second build-up substrate 12 is cut to a predetermined size before the first build-up substrate 11 and the second build-up substrate 12 are stacked. When the first build-up substrate 11 and the second build-up substrate 12 are each cut to a predetermined size, the multilayer build-up substrate 10 becomes a unit build-up substrate 20 of a predetermined size. When one of the first build-up substrate 11 and the second build-up substrate 12 is cut to a predetermined size, after the first build-up substrate 11 and the second build-up substrate 12 are stacked, the first build-up substrate 11 and the second build-up substrate 12 are stacked. The other of the build-up substrates 12 is cut to a predetermined size and manufactured as a unit build-up substrate 20 as the multilayer build-up substrate 10. Then, the light-emitting element is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit build-up substrate 20. Then, the first protective film and the second protective film are mounted on the first resin layer 11B and the second resin layer 12B. With this, a flexible organic EL display is manufactured.

As shown in FIG. 6, the manufacturing method of the flexible organic EL display is divided into a step before the steps of stacking the first build-up substrate 11 and the second build-up substrate 12, that is, the previous step, and the build-up of the first build-up substrate 11 and the first 2 The step after the step of laminating the substrate 12 is a subsequent step. The previous step includes the previous layer stacking step and the previous step processing step. The previous stacking step is a step of manufacturing the first build-up substrate 11 and the second build-up substrate 12. The previous processing step is a step of performing processing related to cutting on the first build-up substrate 11 and the second build-up substrate 12 before the comparative build-up step. The subsequent step includes the subsequent step of laminating and peeling. The subsequent stacking step is a step of stacking the first build-up substrate 11 and the second build-up substrate 12. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B by laser peeling (LLO: Laser Lift Off), and peeling the second glass layer 12A and the second resin layer 12B. Hereinafter, the details of each step will be described.

In the previous stacking step, any one of the following first to fourth examples can be selected. The first-stage stacking steps are common to the first to fourth examples, so the symbols related to the first and second build-up substrates 11 and 12 are collectively marked in FIGS. 7 to 9. In the second example to the fourth example, the previous-stage stacking step doubles as a part of the previous-stage processing step.

In the first example, the first laminated substrate 11 is manufactured by forming the first resin layer 11B over the entirety of the first plane 14A of the first glass layer 11A, and by the entirety of the first plane 15A over the second glass layer 12A The second resin layer 12B is formed to manufacture the second build-up substrate 12. The method of forming the first resin layer 11B on the first plane 14A of the first glass layer 11A and the method of forming the second resin layer 12B on the first plane 15A of the second glass layer 12A can be selected by applying a resin layer to the glass layer Method, or a method of laminating a resin layer with a bonding layer interposed between the glass layers. In addition, as a method of fixing the resin layer to the glass layer, heat hardening treatment or heat and pressure treatment by pressing method can be selected.

In the second example and the third example, the planned cutting portion 16A to be cut in the first glass layer 11A of the first build-up substrate 11 is formed on the first glass layer 11A so as not to be covered by the first resin layer 11B The first resin layer 11B. The second resin layer 12B is formed on the second glass layer 12A such that the planned cut portion 17A to be cut in the second glass layer 12A of the second build-up substrate 12 is not covered by the second resin layer 12B.

In the second example, as shown in FIG. 7, a groove 18 is formed in the cut portion 16A of the first glass layer 11A, and a first resin layer 11B is formed on the first glass layer 11A so that the groove 18 is exposed. The cut portion 17A of the glass layer 12A forms a groove 19, and a second resin layer 12B is formed on the second glass layer 12A so that the groove 19 is exposed. The groove 18 is opened on the first plane 14A side of the first glass layer 11A. The groove 19 is opened on the first flat surface 15A side of the second glass layer 12A. For example, in the method of coating the first resin layer 11B made of varnish on the first glass layer 11A with a roller or the like, the varnish is not applied to the groove 18 of the first glass layer 11A, so no special coating is used In the method, the first resin layer 11B is formed so that the groove 18 is exposed. The method of applying the second resin layer 12B made of, for example, varnish to the second glass layer 12A with a roller or the like is also the same. Furthermore, the groove 18 may be formed only in the planned cutting portion 16A of the first glass layer 11A, or the groove 19 may be formed only in the planned cutting portion 17A of the second glass layer 12A.

In the third example, as shown in FIG. 8, the mask MS1 is formed in the cut portion 16A of the first glass layer 11A, and the first resin layer 11B is formed on the first glass layer 11A. The mask MS1 is formed on the first plane 14A side of the first glass layer 11A. In this case, the first resin layer 11B is not formed in the portion of the first resin layer 11B corresponding to the cut portion 16A of the first glass layer 11A by the mask MS1. Then, the mask MS1 is removed. In addition, a mask MS2 is formed in the portion 17A to be cut of the second glass layer 12A, and a second resin layer 12B is formed in the second glass layer 12A. The mask MS2 is formed on the first flat surface 15A side of the second glass layer 12A. In this case, the second resin layer 12B is not formed in the portion of the second resin layer 12B corresponding to the cut portion 17A of the second glass layer 12A by the mask MS2. Then, the mask MS2 is removed. In addition, the mask MS1 may be formed only in the planned cutting portion 16A of the first glass layer 11A, or the mask MS2 may be formed only in the planned cutting portion 17A of the second glass layer 12A.

In the fourth example, as shown in FIG. 9, the portion of the first resin layer 11B corresponding to the planned cutting portion 16A of the first glass layer 11A (cutting portion 16B) is cut to cut the second resin layer In 12B, the portion corresponding to the planned cutting portion 17A of the second glass layer 12A (the planned cutting portion 17B) is removed. The first resin layer 11B and the second resin layer 12B are removed by any of laser, fracture, and cutting. In addition, only the portion of the first resin layer 11B corresponding to the planned cut portion 16A of the first glass layer 11A and the second resin layer 12B may correspond to the planned cut portion 17A of the second glass layer 12A One of the parts is removed.

FIG. 10 shows a combination example of the processing of the first build-up substrate 11 and the second build-up substrate 12 in the previous processing step, that is, the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second An example of a pattern combination in which at least one of the glass layers 12A performs processing related to cutting. In the previous processing step, any of the patterns shown in FIG. 10 can be selected. In one example, in the previous processing step, one of the first glass layer 11A and the second glass layer 12A is cut. In one example, in the previous processing step, one of the first resin layer 11B and the second resin layer 12B is cut. In one example, in the previous processing step, the first glass layer 11A and the first resin layer 11B are respectively cut. In one example, in the previous processing step, the second glass layer 12A and the second resin layer 12B are respectively cut. In one example, in the previous processing step, three of the first glass layer 11A, the first resin layer 11B, the second glass layer 12A, and the second resin layer 12B are cut. In one example, in the previous processing step, the first glass layer 11A, the first resin layer 11B, the second glass layer 12A, and the second resin layer 12B are respectively cut.

The previous processing step may also include a pre-processing step of performing pre-processing on at least one of the first build-up substrate 11 and the second build-up substrate 12 to break at least one of the first build-up substrate 11 and the second build-up substrate 12. An example of the pre-processing is to form a scribe line on each of the first glass layer 11A and the first resin layer 11B of the first build-up substrate 11, and the second glass layer 12A and the second resin layer 12B of the second build-up substrate 12 Each forms a score line. The formation of the scribe lines of the glass layer and the resin layer uses a laser processing device 30 or a scoring processing device 40.

In the pre-processing step, for example, each of the first glass layer 11A and the first resin layer 11B is pre-processed using different means, and each of the second glass layer 12A and the second resin layer 12B is using different means Implement pre-processing. In one example of the pre-processing step, the planned cut portion 16A of the first glass layer 11A is scribed by the scoring wheel 50, and the planned cut portion 16B of the first resin layer 11B is scribed by the laser. The planned cut portion 17A of the second glass layer 12A is scribed by the scoring wheel 50, and the planned cut portion 17B of the second resin layer 12B is scribed by the laser. In this way, in this embodiment, preprocessing of different means is performed on the glass layer and the resin layer.

Furthermore, in the pre-processing step, the scheduled cutting portion 16A of the first glass layer 11A may be scribed by laser, and the scheduled cutting portion 16B of the first resin layer 11B may be scribed by the scoring wheel 50 . Moreover, in the pre-processing step, the planned cut portion 17A of the second glass layer 12A may be scribed by laser, and the planned cut portion 17B of the second resin layer 12B may be scribed by the scoring wheel 50.

As shown in FIG. 11, scribe lines are formed in the cut-to-be-cut portions 16A to be cut in the first glass layer 11A and the cut-to-be-cut portions 16B in the first resin layer 11B, respectively. A scribe line is formed in the cut-to-be-cut portion 17A to be cut in the second glass layer 12A and the cut-to-be-cut portion 17B in the second resin layer 12B, respectively.

Furthermore, at least one of the first build-up substrate 11 and the second build-up substrate 12 may be replaced by the pre-processing for breaking at least one of the first build-up substrate 11 and the second build-up substrate 12. At least one of pre-processing for breaking the glass layer and pre-processing for breaking the resin layer.

In the later layer stacking step, any one of the first processing sequence of the previous processing step shown in FIG. 12 and the second processing sequence of the previous processing step shown in FIG. 16 can be selected. Hereinafter, the build-up of the first build-up substrate 11 and the second build-up substrate 12 manufactured by the first process order and the build-up of the first build-up substrate 11 and the second build-up substrate 12 manufactured by the second process order will be described. In addition, the first build-up substrate 11 and the second build-up substrate 12 shown in FIGS. 15, 18, and 19 show the first build-up substrate 11 and the second build-up substrate manufactured by the first example of the previous stacking step 12.

As shown in FIG. 12, the first processing sequence includes a first cutting step of cutting the first build-up substrate 11 to a predetermined size and a second cutting step of cutting the second build-up substrate 12 to a predetermined size. The first processing sequence is executed in the order of the first cutting step and the second cutting step. In addition, the first step sequence may be executed in the order of the second cutting step and the first cutting step.

As shown in FIG. 13( a ), in the first cutting step, the order and processing type of cutting the first build-up substrate 11 can be arbitrarily selected. The first build-up substrate 11 may be cut in the order of the first resin layer 11B and the first glass layer 11A, or may be cut in the order of the first glass layer 11A and the first resin layer 11B. Regarding the cutting of the first glass layer 11A and the first resin layer 11B, either of the laser processing apparatus 30 and the scribing processing apparatus 40 may be used. In addition, regarding the cutting of the first glass layer 11A and the first resin layer 11B, the planned cutting portion 16A and the first of the first glass layer 11A may be cut by the laser processing device 30 or the scribing processing device 40 The planned cut portion 16B of the resin layer 11B is broken after being scored, and can also be cut by the laser processing apparatus 30.

As shown in FIG. 13( b ), in the second cutting step, the order and processing type of cutting the second build-up substrate 12 can be arbitrarily selected. The second build-up substrate 12 may be cut in the order of the second resin layer 12B and the second glass layer 12A, or may be cut in the order of the second glass layer 12A and the second resin layer 12B. For the cutting of the second glass layer 12A and the second resin layer 12B, either of the laser processing device 30 and the scribing processing device 40 may be used. In addition, regarding the cutting of the second glass layer 12A and the second resin layer 12B, it is also possible to use the laser processing device 30 or the scribing processing device 40 to cut the planned portion 17A and the second of the second glass layer 12A The portion 17B to be cut of the resin layer 12B is broken after being scored, and may also be cut by the laser processing device 30. In addition, in at least one of the first cutting step and the second cutting step, the glass layer and the resin layer may be cut by a cutting device.

In the first cutting step and the second cutting step, when cutting each of the glass layer and the resin layer by laser, or when scoring each of the glass layer and the resin layer At this time, instead of the laser processing apparatus 30 shown in FIG. 3, the laser processing apparatus 30A shown in FIG. 14 is used. The laser processing device 30A is different from the laser processing device 30 in the configuration of the laser device. Hereinafter, a different configuration of the laser processing device 30A will be described.

The laser device 31A of the laser processing device 30A includes a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser, and the second laser oscillator 34B is a CO ₂ laser. The laser light irradiated from the first laser oscillator 34A and the laser light irradiated from the second laser oscillator 34B are irradiated to the first build-up substrate 11 and the second build-up substrate 12 via the transmission optical system 35. Furthermore, the transmission optical system 35 may be provided separately from the transmission optical system corresponding to the first laser oscillator 34A and the transmission optical system corresponding to the second laser oscillator 34B.

The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type of processing object (glass layer or resin layer) for the first build-up substrate 11 and the second build-up substrate 12. For example, the first control unit 33 defines the processing order of the glass layer and the resin layer as the type of processing object by a control program memorized in advance, and selects the first laser oscillator 34A and the second laser according to the prescribed processing order Oscillator 34B.

As shown in FIG. 15, in the subsequent lamination step, the first unit build-up substrate 21 as the first build-up substrate 11 cut to a predetermined size by the first cutting step and the cut by the second cutting step The second unit build-up substrate 22, which is cut into the second build-up substrate 12 of a predetermined size, is bonded, for example, via the adhesive layer SD. With this, the unit build-up substrate 20 as the multilayer build-up substrate 10 of a predetermined size is manufactured.

As shown in FIG. 16, in the second processing sequence of this embodiment, only the second cutting step is performed. In addition, in the second step sequence, only the first cutting step is performed. In this way, after cutting one of the first build-up substrate 11 and the second build-up substrate 12 to a predetermined size, one of the first build-up substrate 11 and the second build-up substrate 12 is bonded to the first build-up substrate 11 and the first 2 The other of the laminated substrate 12. The processing order and processing method of one of the first build-up substrate 11 and the second build-up substrate 12 can be selected as shown in FIG. 13(a)(b).

After the second processing sequence, the subsequent lamination step is to laminate one of the cut first build-up substrate 11 and the second build-up substrate 12 on the other of the uncut first build-up substrate 11 and the second build-up substrate 12 By. In one example, as shown in FIG. 17, in the subsequent lamination step, a plurality of second build-up substrates 12 cut to a predetermined size by the second cutting step are bonded to the first before the cut to a predetermined size Build-up substrate 11.

After the second processing sequence, the subsequent stacking step includes the subsequent processing step. The subsequent processing step is a step of cutting the other of the uncut first build-up substrate 11 and the second build-up substrate 12 into a predetermined size. In one example, as shown in FIG. 18, in the second cutting step, the second build-up substrate 12 is cut to a predetermined size. The processing order and processing method of the second build-up substrate 12 can select the processing order and processing method shown in FIG. 13(b). With this, the unit build-up substrate 20 as the multilayer build-up substrate 10 of a predetermined size is manufactured.

In the peeling step, a laser peeling device (not shown) is used. In this embodiment, UV laser is used as the laser of the laser stripping device. As shown in FIG. 19( a ), the first resin layer 11B and the first glass layer 11A are peeled by irradiating the first resin layer 11B with laser light from the first glass layer 11A side. In the case where the first resin layer 11B and the first glass layer 11A are peeled off, the laser is irradiated so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 19( b ), the second resin layer 12B and the second glass layer 12A are peeled by irradiating the second resin layer 12B with laser light from the second glass layer 12A side. When the second resin layer 12B and the second glass layer 12A are peeled off, the laser is irradiated so as to be orthogonal to the second plane 15B of the second glass layer 12A. Furthermore, the order of peeling the first glass layer 11A and the second glass layer 12A from the unit build-up substrate 20 can be arbitrarily changed. For example, after the second resin layer 12B and the second glass layer 12A are peeled off, the first resin layer 11B and the first glass layer 11A may be peeled off.

After removing the first glass layer 11A and the second glass layer 12A (see FIG. 19(c)) from the multilayer build-up substrate 10, that is, after manufacturing the light-emitting element, the first protective film is mounted so as to cover the first resin layer 11B, The second protective film is mounted so as to cover the second resin layer 12B, thereby manufacturing a flexible organic EL display.

FIG. 20 shows a unit build-up substrate 20, which is a multilayer build-up substrate 10 of a predetermined size when the first glass layer 11A and the second glass layer 12A are scribed by the scoring wheel 50B shown in FIG. 5(b). In the cross section of the unit build-up substrate 20 shown in FIG. 20, the direction orthogonal to the thickness direction T of the unit build-up substrate 20 is defined as the width direction W. In the cross section of the unit build-up substrate 20, the side facing the center of the unit build-up substrate 20 in the width direction W is set to the inside, and the direction toward the end of the width direction W is set to the outside.

As shown in FIG. 20, in the first cutting step, the first glass is placed so that the cut surface 23A of the first glass layer 11A of the unit buildup substrate 20 is located outside the cut surface 23B of the first resin layer 11B Layer 11A is cut. In the second cutting step, the second glass layer 12A is cut so that the cut surface 24A of the second glass layer 12A of the unit build-up substrate 20 is located outside the cut surface 24B of the second resin layer 12B. More specifically, in the first cutting step, the width WD1 of the first glass layer 11A is formed as the cut surface 23A narrowing from the second plane 14B of the first glass layer 11A toward the first plane 14A The first glass layer 11A is cut by a method. In the second cutting step, the second glass is formed in such a manner that the width WD2 of the second glass layer 12A is narrowed from the second plane 15B of the second glass layer 12A toward the first plane 15A toward the first plane 15A. Layer 12A is cut. Since the first glass layer 11A and the second glass layer 12A are scribed by the scoring wheel 50B, in the first cutting step, the scoring processing device 40 is formed to form the first glass layer in the cross-sectional view shown in FIG. 20 The width WD1 of 11A scribes the first glass layer 11A in accordance with a scribe line (crack) narrowed from the second plane 14B of the first glass layer 11A toward the first plane 14A. Next, the scribed first glass layer 11A is broken. In the second cutting step, the processing device 40 is scored to be formed in the cross-sectional view shown in FIG. 20. The width WD2 of the second glass layer 12A moves from the second plane 15B of the second glass layer 12A toward the first plane 15A On the other hand, the second glass layer 12A is scribed by narrowing the scribe line (crack). Next, the scribed second glass layer 12A is broken. In addition, instead of the scribe wheel 50B, the cutting surface 23A of the first glass layer 11A and the cutting surface 24A of the second glass layer 12A shown in FIG. 20 may be formed by the laser processing device 30.

In the unit build-up substrate 20 shown in FIG. 20, the second plane 14B of the first glass layer 11A is formed up to the end in the width direction W of the first resin layer 11B, and the second plane 15B of the second glass layer 12A is formed up to the first 2 The edge of the resin layer 12B in the width direction W. That is, in the thickness direction T, the edge of the first resin layer 11B in the width direction W does not overlap with the cut surface 23A of the first glass layer 11A, and the edge of the second resin layer 12B in the width direction W and the second glass layer The cut surface 24A of 12A does not overlap. Therefore, when the edge of the first resin layer 11B in the width direction W and the edge of the second resin layer 12B in the width direction W are irradiated with the laser of the laser peeling device, the laser does not pass through the first glass layer 11A The cut surface 23A and the cut surface 24A of the second glass layer 12A.

The function of this embodiment will be described. In the first processing sequence of the previous processing step, after cutting the first build-up substrate 11 and the second build-up substrate 12 to a predetermined size to manufacture the first unit build-up substrate 21 and the second unit build-up substrate 22, by The first unit build-up substrate 21 is bonded to the second unit build-up substrate 22 to manufacture the unit build-up substrate 20 as the multilayer build-up substrate 10. For example, when the first resin layer 11B and the second resin layer 12B are cut by the laser processing apparatuses 30 and 30A, the first resin layer 11B and the second resin layer 12B are exposed, so the laser On the other hand, the gas generated when the first resin layer 11B and the second resin layer 12B are processed is discharged to the outside of the first build-up substrate 11 and the second build-up substrate 12.

In the second processing sequence of the previous processing step, one of the first build-up substrate 11 and the second build-up substrate 12 is cut to a predetermined size before the first build-up substrate 11 and the second build-up substrate 12 are bonded together. For example, when one of the first resin layer 11B and the second resin layer 12B is cut by the laser processing apparatuses 30 and 30A, one of the first resin layer 11B and the second resin layer 12B is exposed, Therefore, the gas generated when one of the first resin layer 11B and the second resin layer 12B is processed by laser is discharged to the outside of one of the first build-up substrate 11 and the second build-up substrate 12. In a state where one of the first build-up substrate 11 and the second build-up substrate 12 is bonded to the other of the first build-up substrate 11 and the second build-up substrate 12, the first resin layer 11B and the second resin layer 12B Partly exposed. Therefore, when the other of the first resin layer 11B and the second resin layer 12B is cut by the laser processing apparatuses 30 and 30A, the first resin layer 11B and the first resin layer are processed by laser In the case of the other of the 2 resin layers 12B, the gas generated is discharged to the outside of the first build-up substrate 11 and the second build-up substrate 12.

The effect of this embodiment will be described. (1) The manufacturing method of the flexible organic EL display includes performing processing related to the cutting of at least one of the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A The previous processing steps. Therefore, in the subsequent processing steps, the steps related to the cutting required for the multilayer build-up substrate 10 are eliminated. The multi-layer build-up substrate 10 whose structure is more complicated than the first build-up board 11 and the second build-up board 12 is less processed, so the complexity of the work is eased.

(2) In the previous processing step, by cutting at least one of the first glass layer 11A and the second glass layer 12A, the first resin layer 11B and the second The gas generated when at least one of the resin layers 12B is cut is discharged from the cut glass layer of the first glass layer 11A and the second glass layer 12A. Since the gas is prevented from staying between the resin layer and the glass layer, the possibility that the gas will affect the quality of at least one of the first resin layer 11B and the second resin layer 12B becomes low.

(3) In the previous processing step, by cutting at least one of the first resin layer 11B and the second resin layer 12B, there is no need to sandwich the first glass layer 11A and the second glass layer 12A in the subsequent step At least one of the first resin layer 11B and the second resin layer 12B is cut, and the complexity of the operation is alleviated.

(4) In the case of cutting one of the first build-up substrate 11 and the second build-up substrate 12 in the previous processing step, the later build-up step is to cut the cut first build-up substrate 11 and the second build-up substrate One of 12 is laminated on the other of the uncut first laminated substrate 11 and the second laminated substrate 12. In the previous step, one of the first build-up substrate 11 and the second build-up substrate 12 is cut, so in the latter step, the steps related to the cutting required for the multilayer build-up substrate 10 are cut off, and the complexity of the operation is alleviated . Since one of the cut first laminated substrate 11 and the second laminated substrate 12 is laminated on the other of the uncut first laminated substrate 11 and the second laminated substrate 12, the first unit laminated substrate is the same as In comparison with the case where 21 and the second unit build-up substrate 22 are stacked, the accuracy required for the position management of the first unit build-up substrate 21 and the second unit build-up substrate 22 in the subsequent stacking step is relaxed. In addition, when the multilayer build-up substrate 10 is transported for the next step, the multilayer build-up substrate 10 can be easily transported because it is transported without being separated into the first unit build-up substrate 21 and the second unit build-up substrate 22.

(5) In the previous processing step, at least one of the first build-up substrate 11 and the second build-up substrate 12 is pre-processed so that the first build-up substrate 11 and the second build-up substrate 12 can be broken in the subsequent step. In this manufacturing method, the pre-processing is performed in the previous step, and the steps related to the cutting required for the multilayer build-up substrate 10 are reduced in the subsequent step, and the complexity of the operation is reduced.

(6) In the first processing step, by cutting both the first build-up substrate 11 and the second build-up substrate 12, there is no need to perform cutting-related steps on the multilayer build-up substrate 10 in the subsequent step. The complexity is eased.

(7) In the previous lamination step, the first resin layer 11B is formed so that at least one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A is not covered with resin And the second resin layer 12B. In this manufacturing method, it is not necessary to cut at least one of the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B in the subsequent step. Compared with the first build-up substrate 11 and the second build-up substrate 12, the multi-layer build-up substrate 10 having a more complicated structure requires less processing, and the complexity of the operation is alleviated.

(8) In the previous lamination step, the grooves 18 and 19 are formed in the first glass layer 11A and the second glass layer 12A, the first resin layer 11B is formed in the first glass layer 11A so that the groove 18 is exposed, and the groove 19 is exposed In this way, the second resin layer 12B is formed on the second glass layer 12A. For example, in the case where the first glass layer 11A and the second glass layer 12A are coated with a varnish (Varnish) as the raw material of the first resin layer 11B and the second resin layer 12B, the varnish of the coating device does not contact the groove For the parts 18 and 19, varnish is applied to the parts excluding the planned cutting part 16A of the first glass layer 11A and the planned cutting part 17A of the second glass layer 12A. There is no need to remove the first resin layer 11B and the second resin layer 12B corresponding to the planned cutting portions 16A and 17A, and the complexity of the operation can be reduced. Furthermore, in the case where the groove 18 is formed in the first glass layer 11A and the groove 19 is not formed in the second glass layer 12A, there is no need to remove the first resin layer 11B corresponding to the cut-to-be-cut portion 16A. The complexity of the processing operation of the substrate 10 is alleviated. In the case where the groove 19 is formed in the second glass layer 12A and the groove 18 is not formed in the first glass layer 11A, there is no need to remove the second resin layer 12B corresponding to the planned cut portion 17A. The complexity of processing operations can be eased.

(9) In the previous lamination step, the first resin layer 11B is formed on the first glass layer 11A, the second resin layer 12B is formed on the second glass layer 12A, and the planned cut portion 16B and the second of the first resin layer 11B At least one of the cut portions 17B of the resin layer 12B is removed. In this manufacturing method, it is possible to accurately form a state in which at least one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A is not covered with resin.

(10) In the previous step of lamination, the mask MS1 is formed on the cut portion 16A of the first glass layer 11A, the first resin layer 11B is formed on the first glass layer 11A, and the mask MS1 is removed. The mask MS2 is formed in the portion 17A to be cut of the second glass layer 12A, the second resin layer 12B is formed in the second glass layer 12A, and the mask MS2 is removed. In this manufacturing method, a state in which the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A are not covered with resin can be formed accurately. Furthermore, in the case where the mask MS1 is formed in the planned cut portion 16A of the first glass layer 11A and the mask MS2 is not formed in the planned cut portion 17A of the second glass layer 12A, the first The state in which the portion 16A to be cut of the glass layer 11A is covered with resin. In the case where the mask MS2 is formed in the planned cutting portion 17A of the second glass layer 12A and the mask MS1 is not formed in the planned cutting portion 16A of the first glass layer 11A, the second glass layer 12A can be accurately formed The portion 17A to be cut is covered with resin.

(11) The previous processing step includes a first cutting step of cutting out a first unit build-up substrate 21 of a predetermined size from the first build-up substrate 11 and a second unit build-up substrate 22 of a predetermined size cut out from the second build-up substrate 12 Step 2 cut off. As shown in FIG. 20, in the first cutting step, the cut surface 23A of the first glass layer 11A of the first unit build-up substrate 21 is positioned outside the cut surface 23B of the first resin layer 11B. 1 The glass layer 11A is cut. In the second cutting step, the second glass layer 12A is cut so that the cut surface 24A of the second glass layer 12A of the second unit build-up substrate 22 is located outside the cut surface 24B of the second resin layer 12B . In this manufacturing method, the laser for peeling the glass layer and the resin layer is not irradiated to the first resin layer without being affected by the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A 11B and the second resin layer 12B. Since the first resin layer 11B and the second resin layer 12B are appropriately irradiated with laser light, the quality of the first resin layer 11B peeled from the first glass layer 11A and the second resin layer 12B peeled from the second glass layer 12A The quality is not easy to reduce.

(12) As shown in FIG. 20, in the first cutting step, the width WD1 of the first glass layer 11A is formed so as to narrow the cut surface 23A from the second plane 14B toward the first plane 14A. The first glass layer 11A is cut. In the second cutting step, the second glass layer 12A is cut so that the width WD2 of the second glass layer 12A is formed as the cut surface 24A narrows from the second plane 15B toward the first plane 15A. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut to form inclined cut surfaces 23A, 24A, even if the influence of manufacturing errors is considered, it is not easy to be in a direction different from the intended direction The inclined cut surface is formed.

(13) As shown in FIG. 20, in the first cutting step, the width WD1 of the first glass layer 11A to form the scribe line (crack) that narrows from the second plane 14B toward the first plane 14A The first glass layer 11A is scribed in a manner to break the scribed first glass layer 11A. In the second cutting step, the second glass layer 12A is scribed such that the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A, The scribed second glass layer 12A is broken. In this manufacturing method, the cut surface 23A of the first glass layer 11A located outside the cut surface 23B of the first resin layer 11B can be efficiently formed, and the cut surface 23A of the second resin layer 12B can be formed efficiently. The cut surface 24B is located on the cut surface 24A of the outer second glass layer 12A.

(14) In the first cutting step and the second cutting step, a scoring wheel 50B having a blade tip portion 52 having an asymmetric shape with respect to the rotation center plane RC shown in FIG. 5(b) is used for scoring The first glass layer 11A and the second glass layer 12A. In this manufacturing method, the shape of the cutting surface 23A of the first glass layer 11A inclined with respect to the second plane 14B and the second glass layer inclined with respect to the second plane 15B are defined by the shape of the blade tip portion 52 The shape of the cut surface 24A of 12A can easily cut the first glass layer 11A and the second glass layer 12A.

(15) The method further includes a peeling step of peeling the first glass layer 11A and the first resin layer 11B by laser peeling, and peeling the second glass layer 12A and the second resin layer 12B. In this manufacturing method, the first glass layer 11A and the first resin layer 11B can be efficiently peeled off, and the second glass layer 12A and the second resin layer 12B can be efficiently peeled off.

(16) In the pre-processing of the previous processing step, each of the first glass layer 11A and the first resin layer 11B is pre-processed by different means, and each of the second glass layer 12A and the second resin layer 12B Use different means to implement pre-processing. In this manufacturing method, preprocessing suitable for each of the first glass layer 11A and the first resin layer 11B can be selected, and preprocessing suitable for each of the second glass layer 12A and the second resin layer 12B can be selected. The first glass layer 11A and the first resin layer 11B are appropriately pre-processed, and the second glass layer 12A and the second resin layer 12B are appropriately pre-processed to improve the quality at the time of cutting.

(17) In the pre-processing of the previous processing step, the first glass layer 11A and the second glass layer 12A are scored by the scoring wheel 50, and the first resin layer 11B and the second resin layer 12B are lasered Carve out. In this manufacturing method, the existing apparatus can be used to scribe the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B, respectively.

(18) Since the pre-processing is included in the previous step before the post-layering step, the pre-processing is performed in a state where the first build-up substrate 11 and the second build-up substrate 12 are not stacked. Therefore, for example, unlike the case where the first resin layer 11B and the second resin layer 12B of the multilayer build-up substrate 10 are pre-processed with laser, even if the laser is used for the pre-processing of the first resin layer 11B and the second resin layer 12B It is also possible to suppress the gas generated when the first resin layer 11B and the second resin layer 12B are irradiated with laser light from staying in the multilayer build-up substrate 10. Therefore, the possibility of lowering the quality of the first resin layer 11B and the second resin layer 12B due to the influence of gas is reduced.

(Modification) The above embodiment is an example of the form of the method for manufacturing a flexible organic EL display related to the present invention, and is not intended to limit the form. The manufacturing method of the flexible organic EL display related to the present invention can take a form different from the form exemplified in the embodiments. An example of this is a configuration in which a part of the configuration of the embodiment is replaced, changed, or omitted, or a configuration in which a new configuration is added to the embodiment. In the following modified examples, the same symbols as those of the embodiment are denoted for the parts that are common to the embodiments, and the description thereof is omitted.

In the above embodiment, instead of forming the conductive layer 13 on the first build-up substrate 11, the conductive layer 13 may be formed on the second build-up substrate 12, or in addition to forming the conductive layer 13 on the first build-up substrate 11, or on the second build-up substrate. 12 Formation of conductive layer 13.

In the above embodiment, in the case where the first build-up substrate 11 and the second build-up substrate 12 are manufactured by any of the second to fourth examples of the previous stacking step, the first 1 The cutting step and the second cutting step are omitted. In this case, the first build-up substrate 11 that has not been cut to a predetermined size and the second build-up substrate 12 that has not been cut to a predetermined size are stacked in the subsequent lamination step to manufacture the multilayer build-up substrate 10. FIG. 21 is an example of the multilayer build-up substrate 10 in which the first build-up substrate 11 and the second build-up substrate 12 manufactured by the third or fourth example of the previous build-up step are stacked in the later build-up step. In this case, the subsequent step has a post-processing step performed between the post-stacking step and the peeling step. In the subsequent processing step, the unit laminated substrate 20 is manufactured by cutting the planned portion 16A of the first glass layer 11A and the planned portion 17A of the second glass layer 12A.

In the preprocessing step of the above embodiment, the type of preprocessing performed on the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A can be arbitrarily changed. In one example, the first glass layer 11A and the second glass layer 12A may be pre-processed by different methods, or the first resin layer 11B and the second resin layer 12B may be processed by different methods. Implement pre-processing. The preprocessing of the same means may be performed on each of the first glass layer 11A and the first resin layer 11B, or the preprocessing of the same means may be performed on each of the second glass layer 12A and the second resin layer 12B. The preprocessing of the same means may be performed on each of the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A.

In the pre-processing step of the above embodiment, either one of the first glass layer 11A and the first resin layer 11B may be pre-processed, or any one of the second glass layer 12A and the second resin layer 12B Implement pre-processing. In the case where preprocessing is performed on at least one of the first glass layer 11A and the second glass layer 12A without performing preprocessing on the first resin layer 11B and the second resin layer 12B, the following steps may be performed in the following steps The first glass layer 11A and the second glass layer 12A are broken. That is, the first cutting step and the second cutting step of the previous processing step are omitted, and the first stacked substrate 11 that has not been cut to a predetermined size and the second stacked substrate that has not been cut to a predetermined size are separated in the subsequent stacking step 12 to build up a multilayer build-up substrate 10. Then, in the subsequent processing step, for example, at least one of the first resin layer 11B and the second resin layer 12B of the multilayer build-up substrate 10 is cut by laser. In this case, the gas layer formed when the first resin layer 11B and the second resin layer 12B are processed by laser breaks the glass layer on which the score line is formed. The gas is discharged from the cut portion of the broken glass layer to the outside of the multilayer build-up substrate 10. Therefore, the possibility of gas affecting the quality of the first resin layer 11B and the second resin layer 12B becomes low.

In the subsequent stacking step of the above embodiment, when the first build-up substrate 11 and the second build-up substrate 12 are not cut to a predetermined size, the laser can be performed in the previous processing step as follows Cutting of the first resin layer 11B and the second resin layer 12B. When the first resin layer 11B and the second resin layer 12B are continuously cut by laser, the first resin layer 11B and the second resin layer may be irradiated with laser light from the first glass layer 11A side. In the order of 12B, it may be cut in the order of the second resin layer 12B and the first resin layer 11B by irradiating laser from the second glass layer 12A side.

10: Multilayer laminated substrate 11: The first multilayer substrate 11A: 1st glass layer 11B: 1st resin layer 12: Second build-up substrate 12A: 2nd glass layer 12B: 2nd resin layer 13: conductive layer 14A: 1st plane 14B: 2nd plane 15A: 1st plane 15B: 2nd plane

FIG. 1 is a cross-sectional view of a multilayer build-up substrate related to the manufacturing method of the embodiment. FIG. 2 is a plan view of the first build-up substrate of FIG. 1. FIG. Fig. 3 is a schematic diagram showing the configuration of a laser processing apparatus. Fig. 4 is a schematic diagram showing the configuration of a scoring processing device. Figure 5 is a cross-sectional view of a scribing wheel. 6 is a flowchart showing the manufacturing method of the embodiment. Fig. 7 is a diagram showing a second example of the previous step of lamination. FIG. 8 is a diagram showing a third example of the previous stacking procedure. Fig. 9 is a diagram showing a fourth example of the previous step of lamination. FIG. 10 is a diagram showing the processing object and the number of processing layers in the previous processing step. Fig. 11 is a diagram showing an example of the processing steps in the preceding stage. FIG. 12 is a flowchart showing a part of the first processing sequence of the previous processing step. Fig. 13 is a diagram showing the processing order and types of processing in the previous processing step. 14 is a schematic diagram showing the structure of a laser processing apparatus. FIG. 15 is a diagram showing an example of the subsequent stacking procedure. FIG. 16 is a flowchart showing a part of the second processing sequence of the previous processing step. Fig. 17 is a diagram showing an example of the post-stage stacking procedure. Fig. 18 is a diagram showing an example of the processing steps in the latter stage. FIG. 19 is a diagram showing an example of the peeling step. 20 is a cross-sectional view showing an example of a unit build-up substrate. FIG. 21 is a diagram showing an example of the subsequent layer stacking procedure related to the manufacturing method of the modification.

10: Multilayer laminated substrate

11: The first multilayer substrate

11A: 1st glass layer

11B: 1st resin layer

12: Second build-up substrate

12A: 2nd glass layer

12B: 2nd resin layer

13: conductive layer

14A: 1st plane

14B: 2nd plane

15A: 1st plane

15B: 2nd plane

Claims (8)

A method for manufacturing a flexible organic EL display, which relates to a flexible method for manufacturing a multilayer build-up substrate, the multilayer build-up substrate having a plurality of build-up substrates having a glass layer and a resin layer stacked therein, the plurality of build-up substrates including the build-up 1 a first build-up substrate with a glass layer and a first resin layer, and a second build-up substrate with a second glass layer and a second resin layer stacked, and laminated so that the first resin layer and the second resin layer face each other ; The manufacturing method of the flexible organic EL display includes a previous step, which is a step before the step of laminating the plurality of laminated substrates; The preceding step includes a preceding step of performing processing related to cutting of at least one of the glass layer and the resin layer on at least one of the plurality of laminated substrates. The method for manufacturing a flexible organic EL display according to claim 1, wherein In the preceding processing step, the glass layer is cut. The method for manufacturing a flexible organic EL display according to claim 1, wherein In the preceding processing step, the resin layer is cut. The method for manufacturing a flexible organic EL display according to claim 2, wherein In the preceding processing step, the resin layer is cut. The method for manufacturing a flexible organic EL display according to any one of claims 1 to 4, further comprising a subsequent step, which is a step after the step of laminating the plurality of laminated substrates; In the preceding processing step, one of the plurality of laminated substrates is cut; The second-stage step includes a later-stage lamination step of stacking one of the plurality of laminated substrates that have been cut on the other of the plurality of laminated substrates that have not been cut. The method for manufacturing a flexible organic EL display according to claim 1, wherein In the preceding processing step, at least one of the plurality of laminated substrates is pre-processed so that the laminated substrate can be broken in a subsequent step that is a step following the step of laminating the plurality of laminated substrates. The method for manufacturing a flexible organic EL display according to claim 6, wherein In the above-mentioned pre-processing, a score line is formed in the above-mentioned glass layer. The method for manufacturing a flexible organic EL display according to claim 1, wherein In the preceding processing step, both of the plurality of laminated substrates are cut.

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