JP2020071965A - Flexible organic el display manufacturing method - Google Patents

Abstract

To provide a method for manufacturing a flexible organic EL display that can reduce the complexity of work.SOLUTION: A flexible organic EL display manufacturing method is related to manufacturing of a multilayer laminated substrate 10 that includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated, and in which the first resin layer 11B and the second resin layer 12B are laminated so as to face each other. The manufacturing method includes a pre-stage step that is a step prior to a step of laminating the first laminated substrate 11 and the second laminated substrate 12. The pre-stage step includes a pre-processing step of performing processing related to cutting of at least one of the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B for at least one of the first laminated substrate 11 and the second laminated substrate 12.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method for manufacturing a flexible organic EL display.

  An organic EL (electro luminescence) display includes a light emitting device in which a light emitting layer, electrodes, and a substrate are laminated. In a flexible organic EL display, a flexible substrate is used as the substrate. In a manufacturing process of a flexible organic EL display, a resin layer is formed on a glass layer, and a light emitting layer and the like are formed on the resin layer (for example, Patent Document 1).

Republished Patent WO2011 / 030716

  A light emitting device having a new structure has been proposed. This light emitting device has a first resin layer and a second resin layer provided so as to face each other. A light emitting layer or the like is provided between the first resin layer and the second resin layer. Since the structure of the light emitting device is different from that of the conventional light emitting device, the manufacturing process of the light emitting device having the new structure may involve complicated work for cutting a laminated substrate having glass layers, resin layers and the like laminated.

  An object of the present invention is to provide a method for manufacturing a flexible organic EL display that can reduce the complexity of work.

A method for manufacturing a flexible organic EL display according to the present invention includes a plurality of laminated substrates in which a glass layer and a resin layer are laminated, and the plurality of laminated substrates include a first glass layer and a first resin layer laminated. A multi-layer laminated substrate including one laminated substrate and a second laminated substrate in which a second glass layer and a second resin layer are laminated, and laminated so that the first resin layer and the second resin layer face each other. A method of manufacturing a flexible organic EL display relating to the manufacturing of, including a pre-stage step that is a step prior to the step of laminating the plurality of laminated substrates, wherein the pre-stage step is at least one of the plurality of laminated substrates, It includes a pre-processing step of performing processing related to cutting at least one of the glass layer and the resin layer.
The processing related to the cutting of at least one of the glass layer and the resin layer is, for example, the processing of cutting the glass layer, the processing of cutting the resin layer, the preprocessing for breaking the glass layer, and the processing for breaking the resin layer. Includes one or more of pre-processing. By performing the processing related to the cutting in at least one of the plurality of laminated boards in the preceding step, the cutting required for the multilayer laminated board in the steps after the step of laminating the plurality of laminated boards (hereinafter referred to as “the latter step”) The number of steps regarding is reduced. Since the number of processes for the multilayer laminated substrate having a more complicated structure than the laminated substrate is reduced, the complexity of the work is reduced.

In one example of the method for manufacturing the flexible organic EL display, the glass layer is cut in the pre-processing step.
In this manufacturing method, since the glass layer is cut in the previous step, for example, when cutting the resin layer of the multilayer laminated substrate with a laser, the gas generated with laser irradiation is discharged from the cut portion of the glass layer, and the gas is The risk of affecting the quality of the resin layer is reduced.

In an example of the method for manufacturing the flexible organic EL display, the resin layer is cut in the pre-processing step.
In this manufacturing method, since the resin layer is cut in the former step, it is not necessary to cut the resin layer sandwiched between the glass layers in the latter step, and the complexity of the work is reduced.

In one example of the method for manufacturing the flexible organic EL display, the method further includes a post-stage step that is a step after the step of laminating the plurality of laminated substrates, and in the pre-processing step, one of the plurality of laminated substrates is cut, The latter-stage step includes a latter-stage lamination step of laminating one of the cut laminated substrates on the other of the uncut plural laminated substrates.
In this manufacturing method, one of the laminated substrates is cut in the former step, so that the cutting step required for the multilayer laminated substrate in the latter step is reduced, and the complexity of the work is reduced. Since one laminated board can be laminated on the other uncut laminated board, the accuracy required for position management of each laminated board in the stacking work is relaxed compared to the case where both cut laminated boards are stacked. It

In an example of the method for manufacturing the flexible organic EL display, in the pre-processing step, a pre-processing for breaking the laminated substrate in a post-step that is a step after the step of laminating the plurality of laminated substrates is performed. It is applied to at least one of the laminated substrates.
In this manufacturing method, the preliminary processing is performed in the former step, so that the step related to cutting necessary for the multilayer laminated substrate in the latter step is reduced, and the complexity of the work is reduced.

In an example of the method for manufacturing the flexible organic EL display, a scribe line is formed in the glass layer in the preliminary processing.
In this manufacturing method, since the scribe line is formed in the glass layer in the previous step, for example, when cutting the resin layer of the multilayer laminated substrate with a laser, the scribe line portion of the glass layer is broken by the gas, and the gas is cut. Discharged from. There is less risk that the gas will affect the quality of the resin layer.

In an example of the method for manufacturing the flexible organic EL display, both of the plurality of laminated substrates are cut in the pre-processing step.
In this manufacturing method, since both laminated substrates are cut in the former step, it is not necessary to perform a cutting-related step on the multilayer laminated substrate in the latter step, and the complexity of the work is reduced.

  ADVANTAGE OF THE INVENTION According to this invention, the complexity of the operation | work regarding cutting of a laminated substrate can be eased.

Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of embodiment. The top view of the 1st laminated substrate of FIG. The schematic diagram which shows the structure of a laser processing apparatus. The schematic diagram which shows the structure of a scribe processing apparatus. Sectional drawing of a scribing wheel. 3 is a flowchart showing a manufacturing method of the embodiment. The figure which shows the 2nd example of a front | former stage lamination process. The figure which shows the 3rd example of a front | former stage lamination process. The figure which shows the 4th example of a front | former stage lamination process. The figure which shows the process target and the number of process layers of a front-end process process. The figure which shows an example of a front-end process. The flowchart which shows a part of 1st processing procedure of a former process. The figure which shows the processing order and processing type in a front-end processing process. The schematic diagram which shows the structure of a laser processing apparatus. The figure which shows an example of a latter stage lamination process. The flowchart which shows a part of 2nd processing procedure of a former process. The figure which shows an example of a latter stage lamination process. The figure which shows an example of a latter process. The figure which shows an example of a peeling process. Sectional drawing which shows an example of a unit laminated substrate. The figure which shows an example of the back | latter stage lamination process regarding the manufacturing method of a modification.

(Embodiment)
A method for manufacturing a flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary devices, mobile devices, and the like. Examples of stationary devices are personal computers and television receivers. Examples of mobile devices are personal digital assistants, wearable computers, and notebook personal computers. Examples of mobile information terminals are smartphones, tablets, and mobile game consoles. Examples of wearable computers are head mounted displays and smart watches.

  The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are laminated, a first protective film that covers the light emitting device from one side, and a second protective film that covers the light emitting device from the other side. PET (polyethylene terephthalate) is used for the first protective film and the second protective film, respectively. One of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from the single multilayer laminated substrate 10 shown in FIG.

  The multilayer laminated substrate 10 is manufactured at an intermediate stage of manufacturing a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated. Have and. The multilayer laminated substrate 10 is configured by laminating the first laminated substrate 11 and the second laminated substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with an electronic device member such as an OLED (Organic Light Diode) or a TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B form a light emitting device.

  The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and have the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, but glass having various compositions such as glass containing an alkali metal oxide or non-alkali glass can be used. An example of glass containing an alkali metal oxide is soda lime glass. In this embodiment, non-alkali glass is used for the first glass layer 11A and the second glass layer 12A. The thickness of each of the first glass layer 11A and the second glass layer 12A is not particularly limited, but is preferably about 0.5 mm, for example. The first glass layer 11A has a first flat surface 14A on which the first resin layer 11B is formed, and a second flat surface 14B paired with the first flat surface 14A. The second glass layer 12A has a first flat surface 15A on which the second resin layer 12B is formed, and a second flat surface 15B paired with the first flat surface 15A.

  The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and have the same size. The compositions of the first resin layer 11B and the second resin layer 12B are not particularly limited, but polyimide (PI) can be used, for example. The thickness of each of the first resin layer 11B and the second resin layer 12B is not particularly limited, but is preferably in the range of 10 μm or more and 30 μm or less, for example.

FIG. 2 is a plan view of the first laminated substrate 11.
The first unit laminated board 21 is formed by cutting the first laminated board 11 in a lattice shape along the planned cutting portion 16 indicated by the broken line in FIG. Similarly, with respect to the second laminated substrate 12, the second unit laminated substrate 22 is formed by cutting the second laminated substrate 12 in a grid shape along the planned cutting portion 17 (not shown in FIG. 2, see FIG. 11, for example). To be done. The size of the first unit laminated board 21 and the second unit laminated board 22 in plan view corresponds to a predetermined size of the light emitting device in plan view. In the present embodiment, the size of the first unit laminated board 21 in plan view and the size of the second unit laminated board 22 in plan view are equal to each other. By laminating the first unit laminated substrate 21 and the second unit laminated substrate 22 so that the first resin layer 11B and the second resin layer 12B face each other, the unit laminated substrate 20 as the multilayer laminated substrate 10 (see FIG. 19). ) Is configured.

  At least one of a laser processing device and a scribing device is used to cut the first laminated substrate 11 and the second laminated substrate 12. FIG. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4. A dicing machine (not shown) may be used to cut the first laminated substrate 11 and the second laminated substrate 12.

  As shown in FIG. 3, the laser processing apparatus 30 includes a laser device 31 for cutting the first laminated substrate 11 and the second laminated substrate 12, and a first laminated substrate 11 and a second laminated substrate for the laser device 31. A mechanical drive system 32 for moving the substrate 12 and a first controller 33 for controlling the laser device 31 and the mechanical drive system 32 are provided.

The laser device 31 processes one of the resin layer and the glass layer in the first laminated substrate 11 and the second laminated substrate 12. The laser device 31 has a laser oscillator 34 for irradiating the first laminated substrate 11 and the second laminated substrate 12 with laser light, and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing device 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. Further, the transmission optical system 35 includes an X-axis direction moving mechanism for moving the laser irradiation head, in which the laser oscillator 34 is incorporated, in the X-axis direction. The laser light emitted from the laser oscillator 34 is emitted toward the first laminated substrate 11 and the second laminated substrate 12 via the transmission optical system 35.

  The mechanical drive system 32 is arranged to face the laser device 31 in the Z-axis direction. The mechanical drive system 32 includes a bed 36, a processing table 37, and a moving device 38. The first laminated substrate 11 or the second laminated substrate 12 is placed on the processing table 37. The moving device 38 moves the processing table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

  The first controller 33 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may include one or more microcomputers. The first control unit 33 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31, may be provided in the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. When the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be set arbitrarily.

  As shown in FIG. 4, in the scribing apparatus 40, the scribing wheel 50 and the first laminated substrate 11 or the second laminated substrate 12 move relative to each other in the X-axis direction and the Y-axis direction. 11 or the second laminated substrate 12 is formed with scribe lines along the X-axis direction and the Y-axis direction. The scribing processing device 40 includes a processing device 41 for processing the first laminated substrate 11 or the second laminated substrate 12, a conveying device 42 for conveying the first laminated substrate 11 or the second laminated substrate 12, and a processing device. 41 and a second control unit 43 that controls the transport device 42.

  The transfer device 42 includes a pair of rails 44, a table 45, a linear drive device 46, a rotation device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribing device 40 of FIG. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing device 40, and the linear drive device 46 causes the table 45 to reciprocate along the pair of rails 44, and the rotating device 47. This causes the table 45 to rotate about the central axis C. The first laminated substrate 11 or the second laminated substrate 12 is placed on the table 45. An example of the linear drive device 46 has a feed screw device. The rotating device 47 has a motor that serves as a drive source.

  The processing device 41 includes a lateral drive device 48, a vertical drive device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50. The holder unit is attached to a scribing head for holding the holder unit. The scribing head is moved in the X-axis direction by the lateral drive device 48, and is moved in the Z-axis direction by the vertical drive device 49. By moving the scribing wheel 50 in the X-axis direction, scribe lines are formed in the first laminated substrate 11 and the second laminated substrate 12 along the X-axis direction.

  The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of the material forming the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented carbide, single crystal diamond, and polycrystalline diamond. As the scribing wheel 50, for example, one of the scribing wheel 50A having the shape shown in FIG. 5A and the scribing wheel 50B having the shape shown in FIG. 5B can be used.

  The scribing wheel 50A shown in FIG. 5A is composed of a disk-shaped main body 51 and a blade edge 52 having a V-shaped cross section. The V-shaped cross section is a shape that tapers toward the outer peripheral edge of the scribing wheel 50A in a cross section obtained by cutting the scribing wheel 50A along a plane along the thickness direction of the scribing wheel 50A (hereinafter referred to as "thickness direction DT"). ..

An insertion hole 53 that penetrates the body 51 in the thickness direction DT is formed in the center of the body 51. A pin is inserted into the insertion hole 53.
The blade edge portion 52 has a first slope 52A and a second slope 52B, which are two slopes forming a V-shaped cross section. The first slope 52A and the second slope 52B are the centers of the scribing wheel 50A in the thickness direction DT and are symmetrical with respect to the rotation center plane RC orthogonal to the thickness direction DT.

  The scribing wheel 50B shown in FIG. 5 (b) is different from the scribing wheel 50A in the shape of the cutting edge portion 52. The first slope 52A and the second slope 52B in the cutting edge portion 52 of the scribing wheel 50B are asymmetric with respect to the rotation center plane RC. In an example, in the cross section of the scribing wheel 50B along the thickness direction, the first angle θ1 formed by the line segment L1 parallel to the radial direction of the scribing wheel 50B and the first slope surface 52A is the line segment L1 and the second slope surface 52B. Is larger than the second angle θ2 formed by. The first angle θ1 may be equal to the second angle θ2 as long as the position of the tip of the cutting edge portion 52 is displaced with respect to the rotation center plane RC in the direction along the line segment L1.

  The second control unit 43 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The second controller 43 may be provided in the processing device 41, may be provided in the transport device 42, or may be provided separately from the processing device 41 and the transport device 42. When the second control unit 43 is provided separately from the processing device 41 and the transfer device 42, the arrangement position of the second control unit 43 can be set arbitrarily.

[Method for manufacturing flexible organic EL display]
Next, details of the method for manufacturing the flexible organic EL display will be described. FIG. 6 shows an example of steps of a method for manufacturing a flexible organic EL display.

  In the method of manufacturing a flexible organic EL display, the first laminated substrate 11 in which the first glass layer 11A and the first resin layer 11B are laminated, and the second laminated layer 11 in which the second glass layer 12A and the second resin layer 12B are laminated. A multilayer laminated substrate 10 having a laminated substrate 12 and in which the first resin layer 11B and the second resin layer 12B are laminated so as to face each other is manufactured. In this embodiment, at least one of the first laminated substrate 11 and the second laminated substrate 12 is cut into a predetermined size before the first laminated substrate 11 and the second laminated substrate 12 are laminated. When the first laminated substrate 11 and the second laminated substrate 12 are each cut into a predetermined size, the multilayer laminated substrate 10 becomes a unit laminated substrate 20 having a predetermined size. When one of the first laminated substrate 11 and the second laminated substrate 12 is cut into a predetermined size, after laminating the first laminated substrate 11 and the second laminated substrate 12, the first laminated substrate 11 and the second laminated substrate 12 are laminated. The other one is cut into a predetermined size to manufacture a unit laminated substrate 20 as the multilayer laminated substrate 10. Then, by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20, a light emitting device is manufactured. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thereby, a flexible organic EL display is manufactured.

  As shown in FIG. 6, in the method for manufacturing a flexible organic EL display, a first step, which is a step prior to the step of laminating the first laminated substrate 11 and the second laminated substrate 12, a first laminated substrate 11 and a second laminated substrate 11 The two-layer substrate 12 is divided into a subsequent step, which is a step after the step of stacking the two-layer board 12. The pre-stage process includes a pre-stage lamination process and a pre-stage processing process. The pre-stage laminating step is a step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The pre-processing step is a step of performing processing related to cutting on the first laminated substrate 11 and the second laminated substrate 12 before the laminating step. The second-stage process includes a second-stage stacking process and a peeling process. The latter-stage laminating step is a step of laminating the first laminated substrate 11 and the second laminated substrate 12. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by laser lift off (LLO). The details of each step will be described below.

  In the first-stage laminating step, any one of the following first to fourth examples can be selected. Since the first-stage laminating step is common to each of the first to fourth examples, the reference numerals relating to the first laminated substrate 11 and the second laminated substrate 12 are also attached to FIGS. 7 to 9. In the second to fourth examples, the pre-stage stacking step also serves as part of the pre-stage processing step.

  In the first example, the first laminated substrate 11 is manufactured by forming the first resin layer 11B over the entire first plane 14A of the first glass layer 11A, and the entire first plane 15A of the second glass layer 12A is produced. The second laminated substrate 12 is manufactured by forming the second resin layer 12B over the same. The method for forming the first resin layer 11B on the first flat surface 14A of the first glass layer 11A and the method for forming the second resin layer 12B on the first flat surface 15A of the second glass layer 12A are respectively the resin for the glass layer. A method of applying a layer or a method of laminating a resin layer on a glass layer via an adhesive layer can be selected. As a method for fixing the resin layer to the glass layer, heat curing treatment or heating and pressure treatment by a pressing method can be selected.

  In the second example and the third example, the first glass layer 11A is provided with the first glass layer 11A so that the planned cut portion 16A in the first glass layer 11A of the first laminated substrate 11 that is to be cut is not covered with the first resin layer 11B. 1 Resin layer 11B is formed. The second resin layer 12B is formed on the second glass layer 12A so that the planned cutting portion 17A in the second glass layer 12A of the second laminated substrate 12 that is to be cut is not covered with the second resin layer 12B.

  In the second example, as shown in FIG. 7, the groove 18 is formed in the planned cutting portion 16A of the first glass layer 11A, and the first resin layer 11B is formed in the first glass layer 11A so that the groove 18 is exposed. Then, the groove 19 is formed in the planned cutting portion 17A of the second glass layer 12A, and the second resin layer 12B is formed in the second glass layer 12A so that the groove 19 is exposed. The groove 18 is open to the first plane 14A side of the first glass layer 11A. The groove 19 is open to the first plane 15A side of the second glass layer 12A. For example, in the method of applying the first resin layer 11B made of, for example, varnish to the first glass layer 11A with a roller or the like, the varnish is not applied to the groove 18 of the first glass layer 11A. The first resin layer 11B can be formed so that 18 is exposed. The same applies to the method of applying the second resin layer 12B made of, for example, varnish to the second glass layer 12A with a roller or the like. The groove 18 may be formed only in the planned cutting portion 16A of the first glass layer 11A, or the groove 19 may be formed only in the planned cutting portion 17A of the second glass layer 12A.

  In the third example, as shown in FIG. 8, the mask MS1 is formed on the planned cutting portion 16A of the first glass layer 11A, and the first resin layer 11B is formed on the first glass layer 11A. The mask MS1 is formed on the first plane 14A side of the first glass layer 11A. In this case, the first resin layer 11B is not formed on the portion of the first resin layer 11B corresponding to the planned cutting portion 16A of the first glass layer 11A by the mask MS1. After that, the mask MS1 is removed. Further, the mask MS2 is formed on the planned cutting portion 17A of the second glass layer 12A, and the second resin layer 12B is formed on the second glass layer 12A. The mask MS2 is formed on the first plane 15A side of the second glass layer 12A. In this case, the second resin layer 12B is not formed on the portion of the second resin layer 12B corresponding to the planned cutting portion 17A of the second glass layer 12A by the mask MS2. After that, the mask MS2 is removed. The mask MS1 may be formed only on the planned cutting portion 16A of the first glass layer 11A, or the mask MS2 may be formed only on the planned cutting portion 17A of the second glass layer 12A.

  In the fourth example, as shown in FIG. 9, a portion (planned cutting portion 16B) corresponding to the planned cutting portion 16A of the first glass layer 11A in the first resin layer 11B is cut, and the second resin layer 12B is cut. The portion (planned cutting portion 17B) corresponding to the planned cutting portion 17A of the second glass layer 12A is removed. The first resin layer 11B and the second resin layer 12B are removed by any of laser, break, and dicing. Only one of the portion of the first resin layer 11B corresponding to the planned cutting portion 16A of the first glass layer 11A and the portion of the second resin layer 12B corresponding to the planned cutting portion 17A of the second glass layer 12B is removed. Good.

  FIG. 10 shows an example of a combination of processing of the first laminated substrate 11 and the second laminated substrate 12 in the pre-processing step, that is, the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass. An example of a combination of patterns for performing processing related to cutting on at least one of the layers 12A is shown. In the former processing step, any of the patterns shown in FIG. 10 can be selected. In one example, in the pre-processing step, one of the first glass layer 11A and the second glass layer 12A is cut. In one example, in the pre-processing step, one of the first resin layer 11B and the second resin layer 12B is cut. In one example, the first-stage processing step cuts the first glass layer 11A and the first resin layer 11B, respectively. In one example, the first-stage processing step cuts each of the second glass layer 12A and the second resin layer 12B. In one example, the pre-processing step cuts three of the first glass layer 11A, the first resin layer 11B, the second glass layer 12A, and the second resin layer 12B. In one example, the first-stage processing step cuts each of the first glass layer 11A, the first resin layer 11B, the second glass layer 12A, and the second resin layer 12B.

  The pre-processing step may include a preliminary processing step in which at least one of the first laminated substrate 11 and the second laminated substrate 12 is subjected to preliminary processing for breaking at least one of the first laminated substrate 11 and the second laminated substrate 12. .. As an example of the pre-processing, scribe lines are formed in each of the first glass layer 11A and the first resin layer 11B of the first laminated substrate 11, and the second glass layer 12A and the second resin layer 12B of the second laminated substrate 12 are formed. A scribe line is formed on each. A laser processing device 30 or a scribing device 40 is used to form the scribe lines of the glass layer and the resin layer.

  In the preprocessing step, for example, the first glass layer 11A and the first resin layer 11B are preprocessed by different means, and the second glass layer 12A and the second resin layer 12B are processed by different means. Pre-process. In one example of the pre-processing step, the scribing wheel 50 scribes the planned cutting portion 16A of the first glass layer 11A and the laser scribes the planned cutting portion 16B of the first resin layer 11B. The planned cutting portion 17A of the second glass layer 12A is scribed by the scribing wheel 50, and the planned cutting portion 17B of the second resin layer 12B is scribed by the laser. Thus, in this embodiment, the glass layer and the resin layer are preprocessed by different means.

  In the preliminary processing step, the planned cutting portion 16A of the first glass layer 11A may be scribed by the laser, and the scribing wheel 50 may scribe the planned cutting portion 16B of the first resin layer 11B. Further, in the preliminary processing step, the planned cutting portion 17A of the second glass layer 12A may be scribed by a laser, and the planned cutting portion 17B of the second resin layer 12B may be scribed by the scribing wheel 50.

  As shown in FIG. 11, a scribe line is formed in each of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 16B of the first resin layer 11B. A scribe line is formed in each of the planned cutting part 17A of the second glass layer 12A and the planned cutting part 17B of the second resin layer 12B.

  Note that, in place of the pre-processing for breaking at least one of the first laminated substrate 11 and the second laminated substrate 12, at least the pre-processing for breaking the glass layer and the pre-processing for breaking the resin layer One may be applied to at least one of the first laminated substrate 11 and the second laminated substrate 12.

  In the latter-stage laminating step, either the first machining procedure of the former-stage machining step shown in FIG. 12 or the second machining procedure of the former-stage machining step shown in FIG. 16 can be selected. Hereinafter, the lamination of the first laminated substrate 11 and the second laminated substrate 12 manufactured by the first processing procedure and the lamination of the first laminated substrate 11 and the second laminated substrate 12 manufactured by the second processing procedure will be described. To do. The first laminated substrate 11 and the second laminated substrate 12 shown in FIG. 15, FIG. 18, and FIG. 19 are the first laminated substrate 11 and the second laminated substrate manufactured by the first example of the preceding-stage laminating step. 12 is shown.

  As shown in FIG. 12, the first processing procedure includes a first cutting step of cutting the first laminated substrate 11 into a predetermined size and a second cutting step of cutting the second laminated substrate 12 into a predetermined size. The first processing procedure is executed in the order of the first cutting process and the second cutting process. The first process procedure may be performed in the order of the second cutting process and the first cutting process.

  As shown in FIG. 13A, in the first cutting step, the order of cutting the first laminated substrate 11 and the processing type can be arbitrarily selected. The first laminated substrate 11 may be cut in the order of the first resin layer 11B and the first glass layer 11A, or may be cut in the order of the first glass layer 11A and the first resin layer 11B. For cutting the first glass layer 11A and the first resin layer 11B, either the laser processing device 30 or the scribe processing device 40 may be used. Further, for cutting the first glass layer 11A and the first resin layer 11B, the laser processing device 30 or the scribing device 40 scribes the planned cutting part 16A of the first glass layer 11A and the planned cutting part 16B of the first resin layer 11B. After that, it may be broken or cut by the laser processing device 30.

  As shown in FIG. 13B, in the second cutting step, the order of cutting the second laminated substrate 12 and the processing type can be arbitrarily selected. The second laminated substrate 12 may be cut in the order of the second resin layer 12B and the second glass layer 12A, or may be cut in the order of the second glass layer 12A and the second resin layer 12B. For cutting the second glass layer 12A and the second resin layer 12B, either the laser processing device 30 or the scribe processing device 40 may be used. Further, for cutting the second glass layer 12A and the second resin layer 12B, the laser processing device 30 or the scribing device 40 scribes the planned cutting part 17A of the second glass layer 12A and the planned cutting part 17B of the second resin layer 12B. After that, it may be broken or cut by the laser processing device 30. Note that the glass layer and the resin layer may be cut by a dicing device in at least one of the first cutting step and the second cutting step.

  In the first cutting step and the second cutting step, when cutting each of the glass layer and the resin layer with a laser or when scribing each of the glass layer and the resin layer, instead of the laser processing device 30 shown in FIG. The laser processing apparatus 30A shown in FIG. 14 is used. The laser processing device 30A is different from the laser processing device 30 in the configuration of the laser device. Hereinafter, a different configuration of the laser processing device 30A will be described.

The laser device 31A of the laser processing device 30A has a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser and the second laser oscillator 34B is a CO ₂ laser. The laser light emitted from the first laser oscillator 34A and the laser light emitted from the second laser oscillator 34B are applied to the first laminated substrate 11 and the second laminated substrate 12 via the transmission optical system 35. The transmission optical system 35 may be provided with a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B separately.

  The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type (glass layer or resin layer) of the processing target for the first laminated substrate 11 and the second laminated substrate 12. For example, the first control unit 33 determines the processing order of the glass layer and the resin layer, which are the types of processing targets, according to a control program stored in advance, and the first laser oscillator 34A and the second laser oscillator according to the determined processing order. Select 34B.

  As shown in FIG. 15, in the subsequent laminating step, the first unit laminated board 21 which is the first laminated board 11 cut into a predetermined size in the first cutting step, and the predetermined unit size in the second cutting step are cut. The second unit laminated substrate 22, which is the second laminated substrate 12, is bonded to the second unit laminated substrate 22 via the adhesive layer SD, for example. As a result, the unit laminated board 20 which is the multilayer laminated board 10 having a predetermined size is manufactured.

  As shown in FIG. 16, in the second processing procedure of this embodiment, only the second cutting step is executed. In addition, in the second step procedure, only the first cutting step may be executed. In this way, after one of the first laminated substrate 11 and the second laminated substrate 12 is cut into a predetermined size, the first laminated substrate 11 and the second laminated substrate 12 are provided on the other of the first laminated substrate 11 and the second laminated substrate 12. One of 12 is bonded. As one of the processing order and the processing method of the first laminated substrate 11 and the second laminated substrate 12, the processing order and the processing method shown in FIGS. 13A and 13B can be selected.

  In the subsequent laminating step after the second processing procedure, one of the cut first laminated substrate 11 and the second laminated substrate 12 is laminated on the other of the uncut first laminated substrate 11 and the second laminated substrate 12. .. In one example, as shown in FIG. 17, in the subsequent laminating step, the plurality of second laminated substrates 12 cut into the predetermined size in the second cutting step are attached to the first laminated substrate 11 before being cut into the predetermined size. It is matched.

  The second-stage laminating step after the second processing procedure includes the second-step processing step. The post-processing step is a step of cutting the other of the uncut first laminated substrate 11 and second laminated substrate 12 into a predetermined size. In one example, as shown in FIG. 18, the second laminated substrate 12 is cut into a predetermined size in the second cutting step. As the processing order and processing method of the second laminated substrate 12, the processing order and processing method shown in FIG. 13B can be selected. As a result, the unit laminated board 20 which is the multilayer laminated board 10 having a predetermined size is manufactured.

  A laser lift-off device (not shown) is used in the peeling process. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in FIG. 19A, the first resin layer 11B and the first glass layer 11A are peeled off by irradiating the first resin layer 11B with a laser from the first glass layer 11A side. When peeling off the first resin layer 11B and the first glass layer 11A, the laser is applied so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 19B, the second resin layer 12B and the second glass layer 12A are separated by irradiating the second resin layer 12B with a laser from the second glass layer 12A side. When peeling off the second resin layer 12B and the second glass layer 12A, the laser is applied so as to be orthogonal to the second plane 15B of the second glass layer 12A. The order in which the first glass layer 11A and the second glass layer 12A are peeled from the unit laminated substrate 20 can be arbitrarily changed. For example, after peeling the second resin layer 12B and the second glass layer 12A, the first resin layer 11B and the first glass layer 11A may be peeled.

  After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see FIG. 19 (c)), that is, after the production of the light emitting device, the first protective film is formed so as to cover the first resin layer 11B. Is attached, and the second protective film is attached so as to cover the second resin layer 12B, whereby a flexible organic EL display is manufactured.

  FIG. 20 shows a unit laminated substrate 20 which is a multilayer laminated substrate 10 of a predetermined size when the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50B shown in FIG. 5B. In the cross section of the unit laminated substrate 20 shown in FIG. 20, the direction orthogonal to the thickness direction T of the unit laminated substrate 20 is defined as the width direction W. In the cross section of the unit laminated substrate 20, the side toward the center of the unit laminated substrate 20 in the width direction W is the inside, and the direction toward the end in the width direction W is the outside.

  As shown in FIG. 20, in the first cutting step, the first glass layer 11A of the unit laminated substrate 20 is positioned so that the cutting surface 23A of the first glass layer 11A is located outside the cutting surface 23B of the first resin layer 11B. Cut layer 11A. In the second cutting step, the second glass layer 12A is cut such that the cut surface 24A of the second glass layer 12A of the unit laminated substrate 20 is located outside the cut surface 24B of the second resin layer 12B. More specifically, in the first cutting step, the first cut surface 23A is formed such that the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B of the first glass layer 11A toward the first plane 14A. The glass layer 11A is cut. In the second cutting step, the second glass layer 12A is cut so as to form a cutting surface 24A in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B of the second glass layer 12A toward the first plane 15A. Has been done. Since the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50B, in the first cutting step, the scribing processing device 40 moves from the second plane 14B of the first glass layer 11A in the cross-sectional view shown in FIG. The first glass layer 11A is scribed so that a scribe line (crack) in which the width WD1 of the first glass layer 11A becomes narrower toward the first plane 14A is formed. Next, the scribed first glass layer 11A is broken. In the second cutting step, the scribing device 40 has a scribe line in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B of the second glass layer 12A toward the first plane 15A in the cross-sectional view shown in FIG. The second glass layer 12A is scribed so that (cracks) are formed. Next, the scribed second glass layer 12A is broken. Instead of the scribing wheel 50B, the laser processing apparatus 30 may form the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A shown in FIG.

  In the unit laminated substrate 20 shown in FIG. 20, the second flat surface 14B of the first glass layer 11A is formed up to the edge of the first resin layer 11B in the width direction W, and the edge of the second resin layer 12B in the width direction W is formed. The second plane 15B of the second glass layer 12A is formed up to. That is, in the thickness direction T, the edge in the width direction W of the first resin layer 11B and the cut surface 23A of the first glass layer 11A do not overlap each other, and the edge in the width direction W of the second resin layer 12B and the edge 2 The cut surface 24A of the glass layer 12A does not overlap. Therefore, when the laser of the laser lift-off device is irradiated to the widthwise W edge of the first resin layer 11B and the widthwise W edge of the second resin layer 12B, the laser cuts the first glass layer 11A. It does not pass through the surface 23A and the cut surface 24A of the second glass layer 12A.

The operation of this embodiment will be described.
In the first processing procedure of the pre-processing step, the first unit board 11 and the second unit board 12 are cut into a predetermined size to manufacture the first unit board 21 and the second unit board 22, and then the first unit board is manufactured. By laminating the laminated substrate 21 and the second unit laminated substrate 22, the unit laminated substrate 20 which is the multilayer laminated substrate 10 is manufactured. For example, when the first resin layer 11B and the second resin layer 12B are cut by the laser processing devices 30 and 30A, the first resin layer 11B and the second resin layer 12B are exposed, and therefore the first resin layer 11B and the second resin layer 12B are exposed by the laser. Gas generated when processing the second resin layer 12B is discharged to the outside of the first laminated substrate 11 and the second laminated substrate 12.

  In the second processing procedure of the first-stage processing step, one of the first laminated substrate 11 and the second laminated substrate 12 is cut into a predetermined size before the first laminated substrate 11 and the second laminated substrate 12 are bonded together. For example, when one of the first resin layer 11B and the second resin layer 12B is cut by the laser processing device 30 or 30A, one of the first resin layer 11B and the second resin layer 12B is exposed, so that the first Gas generated when processing one of the resin layer 11B and the second resin layer 12B is discharged to the outside of one of the first laminated substrate 11 and the second laminated substrate 12. When one of the first laminated substrate 11 and the second laminated substrate 12 is bonded to the other of the first laminated substrate 11 and the second laminated substrate 12, part of the first resin layer 11B and the second resin layer 12B is Exposed. Therefore, this occurs when the other of the first resin layer 11B and the second resin layer 12B is cut by the laser processing devices 30 and 30A, and when the other of the first resin layer 11B and the second resin layer 12B is processed by the laser. The gas is discharged to the outside of the first laminated substrate 11 and the second laminated substrate 12.

The effects of this embodiment will be described.
(1) A method of manufacturing a flexible organic EL display includes a pre-stage process of performing a process related to cutting at least one of the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A. Including steps. For this reason, the steps relating to cutting necessary for the multilayer laminated substrate 10 in the subsequent processing step are deleted. Since the number of processes for the multilayer laminated substrate 10 having a complicated structure is smaller than that of the first laminated substrate 11 and the second laminated substrate 12, the complexity of the work is alleviated.

  (2) By cutting at least one of the first glass layer 11A and the second glass layer 12A in the pre-processing step, for example, at least one of the first resin layer 11B and the second resin layer 12B of the multilayer laminated substrate 10 is laser-cut. The gas generated when cutting is discharged from the cut glass layer of the first glass layer 11A and the second glass layer 12A. Since the gas is suppressed from staying between the resin layer and the glass layer, it is less likely that the gas affects the quality of at least one of the first resin layer 11B and the second resin layer 12B.

  (3) The first resin layer 11B sandwiched between the first glass layer 11A and the second glass layer 12A in the latter step by cutting at least one of the first resin layer 11B and the second resin layer 12B in the former step. Also, it is not necessary to cut at least one of the second resin layer 12B, and the complexity of the work is alleviated.

  (4) When one of the first laminated substrate 11 and the second laminated substrate 12 is cut in the former processing step, one of the cut first laminated substrate 11 and the second laminated substrate 12 is cut in the latter laminating step. It is laminated on the other of the first laminated substrate 11 and the second laminated substrate 12 which are not present. Since one of the first laminated substrate 11 and the second laminated substrate 12 is cut in the former step, the step relating to the cutting necessary for the multilayer laminated substrate 10 in the latter step is deleted, and the complexity of the work is eased. Since one of the cut first laminated board 11 and the cut second laminated board 12 is laminated on the other of the uncut first laminated board 11 and the second laminated board 12, the first unit laminated board 21 and the second unit laminated board 21 are formed. Compared with the case where the laminated substrates 22 are laminated, the accuracy required for position management of the first unit laminated substrate 21 and the second unit laminated substrate 22 in the subsequent laminating step is relaxed. In addition, when the multilayer laminated substrate 10 is carried to perform the next step, the multilayer laminated substrate 10 can be easily carried because the first unit laminated substrate 21 and the second unit laminated substrate 22 can be conveyed without being separated. Can be transported.

  (5) In the pre-processing step, pre-processing for breaking the first laminated substrate 11 and the second laminated substrate 12 in the latter step is performed on at least one of the first laminated substrate 11 and the second laminated substrate 12. In this manufacturing method, the preliminary processing is performed in the former step, so that the steps relating to cutting necessary for the multilayer laminated substrate 10 in the latter step are reduced, and the complexity of the work is reduced.

  (6) By cutting both the first laminated substrate 11 and the second laminated substrate 12 in the pre-processing step, it becomes unnecessary to perform a cutting-related step on the multi-layer laminated substrate 10 in the post-process, and the complexity of the work is eased. It

  (7) The first resin layer 11B and the second resin layer 12B are formed so that at least one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A is not covered with the resin in the preceding laminating step. Form. In this manufacturing method, it is not necessary to cut at least one of the planned cutting part 16B of the first resin layer 11B and the planned cutting part 17B of the second resin layer 12B in the subsequent step. The number of processes required for the multilayer laminated substrate 10 having a more complicated structure than the first laminated substrate 11 and the second laminated substrate 12 is reduced, and the complexity of the work is eased.

  (8) Grooves 18 and 19 are formed in the first glass layer 11A and the second glass layer 12A in the first-stage laminating step, the first resin layer 11B is formed in the first glass layer 11A so that the groove 18 is exposed, and the groove is formed. A second resin layer 12B is formed on the second glass layer 12A so that 19 is exposed. For example, when the varnish that is the base of the first resin layer 11B and the second resin layer 12B is applied to the first glass layer 11A and the second glass layer 12A, the varnish of the application device is applied to the portions where the grooves 18 and 19 are formed. However, the varnish is applied to the portions of the first glass layer 11A other than the planned cutting portion 16A and the second glass layer 12A other than the planned cutting portion 17A. The work of removing the first resin layer 11B and the second resin layer 12B corresponding to the planned cutting portions 16A and 17A becomes unnecessary, and the complexity of the work is reduced. In addition, when the groove 18 is formed in the first glass layer 11A and the groove 19 is not formed in the second glass layer 12A, the work of removing the first resin layer 11B corresponding to the planned cutting portion 16A becomes unnecessary, and the multilayer stacking is performed. The complexity of the work of processing the substrate 10 is alleviated. When the groove 19 is formed in the second glass layer 12A and the groove 18 is not formed in the first glass layer 11A, the work of removing the second resin layer 12B corresponding to the planned cutting portion 17A becomes unnecessary, and the multilayer laminated substrate 10 The complexity of the processing work is reduced.

  (9) In the first-stage laminating step, the first resin layer 11B is formed on the first glass layer 11A, the second resin layer 12B is formed on the second glass layer 12A, and the cut portion 16B and the second cut portion 16B of the first resin layer 11B are formed. At least one of the planned cutting portions 17B of the resin layer 12B is removed. With this manufacturing method, it is possible to accurately form a state in which at least one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A is not covered with the resin.

  (10) In the pre-stage laminating step, the mask MS1 is formed on the planned cutting portion 16A of the first glass layer 11A, the first resin layer 11B is formed on the first glass layer 11A, and the mask MS1 is removed. The mask MS2 is formed on the planned cutting portion 17A of the second glass layer 12A, the second resin layer 12B is formed on the second glass layer 12A, and the mask MS2 is removed. With this manufacturing method, it is possible to accurately form a state in which the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A are not covered with the resin. If the mask MS1 is formed on the planned cutting portion 16A of the first glass layer 11A and the mask MS2 is not formed on the planned cutting portion 17A of the second glass layer 12A, the planned cutting portion 16A of the first glass layer 11A is made of resin. The state not covered with can be accurately formed. When the mask MS2 is formed on the planned cutting portion 17A of the second glass layer 12A and the mask MS1 is not formed on the planned cutting portion 16A of the first glass layer 11A, the planned cutting portion 17A of the second glass layer 12A is covered with the resin. It is possible to accurately form a state that is not performed.

  (11) The first-stage processing step is a first cutting step of cutting out a first unit laminated board 21 of a predetermined size from the first laminated board 11 and a second cutting step of cutting out a second unit laminated board 22 of a predetermined size from the second laminated board 12. And a cutting step. As shown in FIG. 20, in the first cutting step, the cutting surface 23A of the first glass layer 11A of the first unit laminated substrate 21 is positioned outside the cutting surface 23B of the first resin layer 11B. 1 Glass layer 11A is cut. In the second cutting step, the second glass layer 12A is cut such that the cut surface 24A of the second glass layer 12A of the second unit laminated substrate 22 is located outside the cut surface 24B of the second resin layer 12B. In this manufacturing method, the laser for separating the glass layer and the resin layer is not affected by the cut surface 23A of the first glass layer 11A and the cut surface 24A of the second glass layer 12A and the first resin layer 11B and the first resin layer 11B. 2 The resin layer 12B is irradiated. Since the first resin layer 11B and the second resin layer 12B are appropriately irradiated with laser, the quality of the first resin layer 11B peeled from the first glass layer 11A and the second resin peeled from the second glass layer 12A. The quality of the layer 12B does not easily deteriorate.

  (12) As shown in FIG. 20, in the first cutting step, a cutting surface 23A is formed so that the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A. 1 Glass layer 11A is cut. In the second cutting step, the second glass layer 12A is cut so that the cutting surface 24A in which the width WD2 of the second glass layer 12A becomes narrower from the second flat surface 15B toward the first flat surface 15A is formed. In this manufacturing method, since the first glass layer 11A and the second glass layer 12A are cut with the intention of forming the inclined cut surfaces 23A and 24A, even if the influence of the manufacturing error is taken into consideration, a direction different from the intended direction. It is difficult to form an inclined cut surface.

  (13) As shown in FIG. 20, in the first cutting step, scribe lines (cracks) are formed in which the width WD1 of the first glass layer 11A becomes narrower from the second plane 14B toward the first plane 14A. Then, the first glass layer 11A is scribed, and the scribed first glass layer 11A is broken. In the second cutting step, the second glass layer 12A is scribed and scribed so that a scribe line (crack) is formed in which the width WD2 of the second glass layer 12A becomes narrower from the second plane 15B toward the first plane 15A. The broken second glass layer 12A is broken. In this manufacturing method, the cut surface 23A of the first glass layer 11A located outside the cut surface 23B of the first resin layer 11B can be efficiently formed, and the cut surface 24B of the second resin layer 12B is cut outside. It is possible to efficiently form the cut surface 24A of the second glass layer 12A located at the position.

  (14) In the first cutting process and the second cutting process, the first glass layer 11A and the first glass layer 11A are formed by using the scribing wheel 50B having the cutting edge portion 52 having an asymmetric shape with respect to the rotation center plane RC shown in FIG. 5B. The second glass layer 12A is scribed. In this manufacturing method, the shape of the cutting surface 23A of the first glass layer 11A inclined with respect to the second plane 14B and the shape of the cutting surface 24A of the second glass layer 12A inclined with respect to the second plane 15B are the cutting edge portions. It is defined by the shape of 52, and the first glass layer 11A and the second glass layer 12A can be easily cut.

  (15) The method further includes a peeling step of peeling off the first glass layer 11A and the first resin layer 11B by laser lift-off and peeling off the second glass layer 12A and the second resin layer 12B. In this manufacturing method, the first glass layer 11A and the first resin layer 11B can be efficiently peeled off, and the second glass layer 12A and the second resin layer 12B can be efficiently peeled off.

  (16) In the pre-processing of the pre-processing step, the first glass layer 11A and the first resin layer 11B are pre-processed by different means, and the second glass layer 12A and the second resin layer 12B are respectively processed. Pre-processing by different means. In this manufacturing method, the pre-processing suitable for each of the first glass layer 11A and the first resin layer 11B can be selected, and the pre-processing suitable for each of the second glass layer 12A and the second resin layer 12B can be selected. The first glass layer 11A and the first resin layer 11B are appropriately pre-processed, and the second glass layer 12A and the second resin layer 12B are appropriately pre-processed, and the quality at the time of cutting is improved.

  (17) In the preliminary processing of the first-stage processing step, the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50, and the first resin layer 11B and the second resin layer 12B are scribed by a laser. In this manufacturing method, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B can be scribed using an existing device.

  (18) Since the pre-processing is included in the pre-stage process before the post-stage laminating process, the pre-fabrication is performed in a state where the first laminated substrate 11 and the second laminated substrate 12 are not laminated. Therefore, unlike the case where the first resin layer 11B and the second resin layer 12B of the multilayer laminated substrate 10 are pre-processed by laser, for example, the laser is used for pre-processing the first resin layer 11B and the second resin layer 12B. Also, the gas generated by irradiating the first resin layer 11B and the second resin layer 12B with laser is prevented from staying in the multilayer laminated substrate 10. Therefore, the possibility that the quality of the first resin layer 11B and the second resin layer 12B is deteriorated due to the influence of gas is reduced.

(Modification)
The above embodiment is an example of a form that the method for manufacturing a flexible organic EL display according to the present disclosure can take, and is not intended to limit the form. The method for manufacturing the flexible organic EL display according to the present disclosure may take a form different from the form exemplified in the embodiment. An example thereof is a form in which a part of the configuration of the embodiment is replaced, changed, or omitted, or a configuration in which a new configuration is added to the embodiment. In the following modified examples, the same parts as those of the embodiment are designated by the same reference numerals and the description thereof will be omitted.

  In the above-described embodiment, instead of forming the conductive layer 13 on the first laminated substrate 11 or in addition to forming the conductive layer 13 on the first laminated substrate 11, the conductive layer 13 is formed on the second laminated substrate 12. Layer 13 may be formed.

  In the above embodiment, when the first laminated substrate 11 and the second laminated substrate 12 are manufactured by any of the second to fourth examples of the pre-stage laminating step, the first cutting step and the The two cutting steps may be omitted. In this case, the multi-layer laminated substrate 10 is manufactured by laminating the first laminated substrate 11 that is not cut to the predetermined size and the second laminated substrate 12 that is not cut to the predetermined size in the subsequent laminating step. FIG. 21 is an example of a multilayer laminated substrate 10 in which the first laminated substrate 11 and the second laminated substrate 12 manufactured by the third example or the fourth example of the former laminating step are laminated in the latter laminating step. In this case, the latter-stage process has a latter-stage processing process performed between the latter-stage laminating process and the peeling process. In the subsequent processing step, the unit laminated substrate 20 is manufactured by cutting the planned cutting part 16A of the first glass layer 11A and the planned cutting part 17A of the second glass layer 12A.

  In the pre-processing step of the above embodiment, the types of pre-processing performed on the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A can be arbitrarily changed. .. In one example, the first glass layer 11A and the second glass layer 12A may be pre-processed by different means, or the first resin layer 11B and the second resin layer 12B may be pre-processed by different means. Pre-processing may be performed. The first glass layer 11A and the first resin layer 11B may be pre-processed by the same means, or the second glass layer 12A and the second resin layer 12B may be pre-processed by the same means. May be given. The first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A may be pre-processed by the same means.

  In the pre-processing step of the above embodiment, either the first glass layer 11A or the first resin layer 11B may be pre-processed, or the second glass layer 12A or the second resin layer 12B may be pre-processed. It may be processed. In the case where at least one of the first glass layer 11A and the second glass layer 12A is preliminarily processed and the first resin layer 11B and the second resin layer 12B are not preliminarily processed, the first glass layer is formed as follows in a subsequent step. You may break 11A and 12 A of 2nd glass layers. That is, the first cutting step and the second cutting step of the former processing step are omitted, and the first laminated substrate 11 that is not cut to the predetermined size and the second laminated substrate 12 that is not cut to the predetermined size in the latter laminating step are provided. The layers are laminated to manufacture the multilayer laminated substrate 10. Then, in the subsequent processing step, for example, at least one of the first resin layer 11B and the second resin layer 12B of the multilayer laminated substrate 10 is cut with a laser. In this case, the glass layer on which the scribe line is formed is broken by the gas generated when the first resin layer 11B and the second resin layer 12B are processed by the laser. The gas is discharged to the outside of the multilayer laminated substrate 10 from the cut portion of the broken glass layer. For this reason, the gas is less likely to affect the quality of the first resin layer 11B and the second resin layer 12B.

  When the first laminated substrate 11 and the second laminated substrate 12 are not cut to a predetermined size in the latter-stage laminating step of the above embodiment, the first resin layer 11B and the second resin layer 12B are cut by the laser in the former-stage machining step. May be implemented as follows. When the first resin layer 11B and the second resin layer 12B are continuously cut by the laser, even if the first resin layer 11B and the second resin layer 12B are cut in this order by irradiating the laser from the first glass layer 11A side. Alternatively, the second resin layer 12B and the first resin layer 11B may be cut in this order by irradiating a laser from the second glass layer 12A side.

10: multilayer laminated substrate 11: first laminated substrate 11A: first glass layer 11B: first resin layer 12: second laminated substrate 12A: second glass layer 12B: second resin layer

Claims (7)

A plurality of laminated substrates in which a glass layer and a resin layer are laminated, wherein the plurality of laminated substrates are a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a first laminated substrate. A method for manufacturing a flexible organic EL display, which comprises a second laminated substrate in which two resin layers are laminated, and a multilayer laminated substrate in which the first resin layer and the second resin layer are laminated so as to face each other. hand,
Including a preceding step which is a step prior to the step of stacking the plurality of laminated substrates,
The pre-stage process includes a pre-stage process process of performing a process related to cutting at least one of the glass layer and the resin layer on at least one of the plurality of laminated substrates. The method for manufacturing a flexible organic EL display according to claim 1, wherein the glass layer is cut in the pre-processing step. The method for manufacturing a flexible organic EL display according to claim 1, wherein the resin layer is cut in the pre-processing step. The method further includes a subsequent step that is a step after the step of stacking the plurality of laminated substrates
In the pre-processing step, one of the plurality of laminated substrates is cut,
The flexible organic material according to any one of claims 1 to 3, wherein the post-stage step includes a post-stage lamination step of laminating one of the cut laminated substrates on the other of the uncut laminated substrates. Manufacturing method of EL display. The at least one of the plurality of laminated substrates is subjected to preliminary processing for breaking the laminated substrate in a latter step that is a step after the step of laminating the plurality of laminated substrates in the first-stage processing step. Flexible organic EL display manufacturing method. The method for manufacturing a flexible organic EL display according to claim 5, wherein a scribe line is formed in the glass layer in the preliminary processing. The method of manufacturing a flexible organic EL display according to claim 1, wherein both of the plurality of laminated substrates are cut in the pre-processing step.