KR20200012737A - Method and apparatus for dividing multilayered substrate - Google Patents

Abstract

The present invention relates to cutting a multilayer substrate such as an OLED using a scribe wheel. The present invention is to suppress the scribe wheel dislocated from a desired line for forming a cutting line. A method for cutting a flexible OLED (multilayer substrate) comprising a first PET layer (L2), a second Pl layer (L1), and a second PET layer (L3) includes a first layer cutting step and a wheel cutting step. In the first layer cutting step, a first groove (G1) having an opening angle (θ) in the range of 45-100 degrees is formed on the first PET layer (L2). In the wheel cutting step, a cutting line (SL) is formed on the Pl layer (L1) while the scribe wheel (SW) passes through the first groove (G1).

Description

METHOD AND APPARATUS FOR DIVIDING MULTILAYERED SUBSTRATE}

The present invention relates to a method and apparatus for dividing a multilayer substrate such as a flexible OLED (organic LED).

As a method of cutting a multilayer board | substrate like an OLED board | substrate, the method of conventionally irradiating a laser beam from one surface and forming a cutting line along a desired line is known (for example, refer patent document 1).

In said multilayer board | substrate, the material different from layer to layer is used in many cases. In this case, it is necessary to form a cutting line using a different light source for each layer of a multilayer substrate, and the apparatus structure which cuts a multilayer substrate becomes complicated.

Therefore, in cutting a multilayer substrate, a method of forming a cutting line using a scribing wheel for some layers is conceived.

For example, in an OLED having a structure in which a light emitting layer has a polyimide (PI) layer and a polyethylene terephthalate (PET) layer adhered to the surface of the polyimide layer by an adhesive layer, the PET layer and the adhesive layer are used for irradiation of laser light. It removes by forming a groove | channel, and a cutting line is formed in a PI layer through a scribe wheel through this groove | channel.

Japanese Patent Application Publication No. 2018-15784

In the above cutting method, conventionally, the groove width of the groove passing through the scribe wheel is relatively wide (for example, larger than 200 µm), and the opening angle is also relatively large (for example, 150 °). Here, the opening angle of the groove is an angle formed by two side walls of the groove.

When the scribe wheel passes through the groove having the groove width and the opening angle as described above, the scribe wheel is not sufficiently confined to the groove, and the scribe wheel blades may be penetrated into the PI layer in an oblique state. If the blade of the scribe wheel once penetrates the PI layer, the scribe wheel does not follow the movement even if the machining point is moved mechanically. There was. Therefore, the formed cutting line may be largely out of the original line which wants to form a cutting line.

An object of the present invention is to suppress the cutting line formed by the scribe wheel from deviating significantly from the original line in the cutting of the multilayer substrate using the scribe wheel.

Below, some embodiment is described as a means to solve a subject. These embodiments can be combined arbitrarily as needed.

The method of cutting | disconnecting multilayer boards, such as flexible OLED, concerning the consistency of this invention is a method of cutting the multilayer board which consists of a 1st PET layer, a PI layer, and a 2nd PET layer. The method includes the following steps.

A first laser cutting step of forming a first groove in the first PET layer in an opening angle in the range of 45 to 100 degrees.

A wheel cutting step of forming a cut portion in the PI layer while passing the wheel cutting means through the first groove.

In the method of cutting the said multilayer board | substrate, the opening angle of the 1st groove through which the wheel cutting means which forms a cut part in a PI layer passes is 45-100 degree | times. Thereby, when the wheel cutting means is inserted into the first groove, the wheel cutting means can be restrained in the first groove.

Therefore, even if the wheel cutting means is inserted into the first groove in an oblique state, the first groove functions as a "guide", the state in which the wheel cutting means is obliquely corrected, and at the time of forming the cutting line, The insertion state of the wheel cutting means can be suppressed from fluctuating greatly from an appropriate state. As a result, it is possible to suppress that the cut portion formed by the wheel cutting means is greatly deviated from the original line.

The width | variety of the 1st groove | channel formed in a 1st laser cutting step may be 40-200 micrometers. Thereby, the 1st groove which is more optimal in suppressing the movement of a wheel cutting means can be formed.

The method for cutting the multilayer substrate may further include a second laser cutting step of forming a second groove in the second PET layer in correspondence with the cutting portion after the wheel cutting step. As a result, the multilayer substrate can be more easily cut.

An apparatus according to another aspect of the present invention is a cutting device for a multilayer substrate consisting of a first PET layer, a PI layer, and a second PET layer.

The cutting device includes a laser cutting means and a wheel cutting means. The laser cutting means forms a first groove in the first PET layer having an opening angle in the range of 45 to 100 degrees. The wheel cutting means forms a cut portion in the PI layer while passing through the first groove.

In the said cutting device of a multilayer board | substrate, the laser cutting means makes the opening angle of the 1st groove | channel through which the wheel cutting means which forms a cut part in PI layer pass through 45-100 degree. Thereby, when the wheel cutting means is inserted into the first groove, the wheel cutting means can be restrained in the first groove.

Therefore, even if the wheel cutting means is inserted into the first groove in an oblique state, the first groove functions as a "guide", the state in which the wheel cutting means is obliquely corrected, and at the time of forming the cutting line, The insertion state of the wheel cutting means can be suppressed from fluctuating greatly from an appropriate state. As a result, it is possible to suppress that the cut portion formed by the wheel cutting means is greatly deviated from the original line.

Since the said 1st groove can restrain a wheel cutting means suitably, it can suppress that the cut part formed by the wheel cutting means largely escapes from an original line.

1 is a view showing a cross-sectional structure of an OLED substrate.
It is a figure which shows the whole structure of a cutting device.
3 is a diagram schematically illustrating a cutting operation of an OLED substrate.
4 is a diagram illustrating the definition of the opening angle and the groove width of the first groove.

(Form to carry out invention)

1. First embodiment

(1) Structure of Flexible OLED

Hereinafter, the cutting method of the multilayer board | substrate by one Embodiment of this invention is demonstrated. In this embodiment, flexible OLED (henceforth OLED substrate P1) is employ | adopted as an example of the multilayer board | substrate which is an object to cut | disconnect.

Therefore, at first, the structure of OLED substrate P1 is demonstrated using FIG. 1 is a diagram illustrating a cross-sectional structure of an OLED substrate.

As shown in FIG. 1, the OLED substrate P1 has a three-layer structure, and has a PI layer L1, a first PET layer L2, and a second PET layer L3.

The PI layer L1 is a substrate made of polyimide (PI), and an OLED (organic LED) is formed on one surface. Specifically, for example, a light emitting layer, a driving element (for example, a TFT (thin film transistor)) for controlling light emission by the light emitting layer, and an OLED wiring are formed.

The first PET layer L2 and the second PET layer L3 are films made of polyethylene terephthalate (PET), and protect the OLED formed on the surface of the PI layer L1.

The first PET layer L2 is bonded to one surface of the PI layer L1 by the first adhesive layer L4.

On the other hand, the second PET layer L3 is bonded to the other surface of the PI layer L1 by the second adhesive layer L5.

Among the first PET layer L2 or the second PET layer L3, the PET layer (first PET layer L2) on the side where the groove into which the scribe wheel SW (described later) is inserted is formed of the OLED substrate P1. ), The PET layer (second PET layer L3) on the opposite side to the light emitting surface side of the OLED substrate P1.

(2) cutting device

Next, the structure of the cutting device 1 of this embodiment is demonstrated using FIG. 2 is a diagram showing the overall configuration of a cutting device. The cutting device 1 is a device for cutting the OLED substrate P1 having the above configuration by using a laser irradiation and a scribe wheel.

The cutting device 1 includes a laser device 3 (an example of laser cutting means), a scribe wheel cutting device 5, a machine drive system 7, and a control unit 9.

The laser device 3 is a device for irradiating the laser light L to the OLED substrate P1. The laser apparatus 3 has a laser oscillator which outputs the laser beam L, and the transmission optical system which transmits the said laser beam L to the machine drive system 7 mentioned later (all are not shown). Although not shown, the transmission optical system includes a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. In addition, the transmission optical system has, for example, an X axis direction moving mechanism (not shown) for moving the laser irradiation head (not shown) incorporating the laser oscillator and other optical systems in the X axis direction. . The laser oscillator of the laser device 3 is a CO ₂ laser, for example.

The scribe wheel cutting device 5 is a device which cuts a board | substrate by rotating the scribe wheel SW (an example of a wheel cutting means). In the present embodiment, the scribe wheel cutting device 5 is used to form a cutting line (an example of a cutting portion) in the PI layer L1 of the OLED substrate P1.

The scribe wheel SW is a disk-shaped member whose outer peripheral part was formed in V shape. The outer peripheral portion of the scribe wheel SW is a blade forming a cutting line in the PI layer L1. The scribe wheel SW is 5-15 mm in diameter, for example, and the vertex angle of the V-shaped blade tip is 20-50 degrees.

The machine drive system 7 includes a bed 11, a processing table 13 on which the OLED substrate P1 is placed, and a moving device 15 for moving the processing table 13 in the horizontal direction with respect to the bed 11. ) The moving device 15 is a known mechanism having a guide rail, a moving table, a motor, and the like.

The control unit 9 includes a processor (for example, a CPU), a storage device (for example, a ROM, a RAM, an HDD, an SSD, and the like), and various interfaces (for example, an A / D converter and a D / A converter). Computer interface). The control unit 9 performs various control operations by executing a program stored in a storage unit (corresponding to part or all of the storage area of the storage device).

Although the control part 9 may be comprised by the single processor, it may be comprised from several independent processors for each control.

Although not shown, the control unit 9 is connected to a sensor for detecting the size, shape and position of the OLED substrate P1, a sensor and a switch for detecting the state of each device, and an information input device.

In this embodiment, the control part 9 can control the laser device 3. In addition, the control unit 9 can control the scribe wheel cutting device 5. In addition, the control unit 9 can control the mobile device 15.

(3) cutting method of OLED substrate

3, the cutting operation of the OLED substrate P1 by the laser light L and the scribe wheel SW will be described. 3 is a diagram schematically showing a cutting operation of an OLED substrate.

First, as shown to Fig.3 (a), OLED board | substrate P1 is arrange | positioned on the process table 13 with 1st PET layer L2 facing up. Then, the laser apparatus 3 irradiates the laser beam L toward the 1st PET layer L2. The laser device 3 and / or the OLED substrate P1 are moved while irradiating the laser light L, and the laser light L is irradiated along a desired line. Thereby, the PET layer and the contact bonding layer where the laser beam L was irradiated are removed, and the first groove G1 is formed along the desired line (first laser cutting step).

In this embodiment, when irradiating the laser beam L to the 1st PET layer L2 in a 1st laser cutting step, the focus of the laser beam L is made as small as possible, and the position of the said focus is made 1st. It sets on the surface of PET layer L2. Thereby, as shown to Fig.3 (a), the 1st groove G1 with small opening angle (theta) (it mentions later) and groove width W (it mentions later) can be formed.

In addition, the opening angle θ and / or the groove width W of the first groove G1 may be adjusted by adjusting the position of the focal point of the laser beam L (the position in the height direction of the OLED substrate P1). have.

After forming the first groove G1, as shown in FIG. 3B, the scribe wheel SW is passed through the first groove G1, and a predetermined load is applied to cut the blade tip of the scribe wheel SW. In the state pushed in PI layer L1, the scribe wheel cutting device 5 and / or OLED board | substrate P1 is moved, and the scribe wheel SW is rotated (wheel cutting step).

As a load applied to the PI layer L1 from the scribe wheel SW, the load of 0.15 Mpa-0.20 Mpa can be used, for example.

By moving the scribe wheel cutting device 5 and / or OLED substrate P1 and moving along the first groove G1 while driving the scribe wheel SW, as shown in Fig. 3B, PI In the layer L1, a cutting line SL may be formed along the first groove G1.

After forming the cutting line SL, as shown in FIG. 3C, the OLED substrate P1 is inverted. Accordingly, the second PET layer L3 of the OLED substrate P1 faces upward.

Furthermore, as shown in FIG.3 (d), the laser beam L is irradiated to the surface of the 2nd PET layer L3 so that it may correspond to the cutting line SL. Thereby, the PET layer and the contact bonding layer where the laser beam L was irradiated are removed, and the second groove G2 is formed so as to correspond to the cutting line SL (second laser cutting step).

At this time, since the trace of formation of the first groove G1 can be visually recognized from the second PET layer L3 side, the laser beam L is irradiated along the trace of formation of the first groove G1. As a result, the second groove G2 corresponding to the overlapping line SL may be formed.

When the second groove G2 is formed, the first groove G1, the cutting line SL, and the second groove G2 are formed on the OLED substrate P1 on a predetermined line. As a result, the OLED substrate P1 is cut along the predetermined line.

In addition, the irradiation conditions (focus position) of the laser beam L at the time of forming the 2nd groove G2 may be made the same as the irradiation conditions (focus position) at the time of formation of the 1st groove G1, and are different. You may do it.

The irradiation conditions of the laser beam L at the time of forming the second grooves G2 are the same as the irradiation conditions at the time of the formation of the first grooves G1, thereby being substantially the same shape as the first grooves G1 (openings). The second groove G2 of the angle θ and the groove width W is about the same as the first groove G1.

In addition, by making the irradiation conditions of the laser beam L the same, it is not necessary to change the irradiation conditions for each groove formation, and therefore the cutting efficiency of the OLED substrate P1 can be improved.

On the other hand, when making the irradiation conditions of the laser beam L at the time of forming the 2nd groove G2 different from the irradiation conditions at the time of formation of the 1st groove G1, for example, 2nd grooves ( At the time of formation of G2), by setting the position of the focal point of the laser beam L to a position shifted from the surface of the second PET layer L3, the second groove (the large opening angle? And the groove width W) is large. G2) can be formed.

Since the second groove G2 is not used (not formed) at the time of forming the cutting line SL by the scribe wheel SW, the second groove G2 is formed by cutting the first groove G1 and cutting. As long as it overlaps with the line SL sufficiently, you may have arbitrary opening angle (theta) and groove width W. As shown in FIG.

(4) Example

Hereinafter, the specific Example of OLED substrate P1 by the cutting method demonstrated above is demonstrated. In the present Example, the thickness of the PI layer L1 was 20 micrometers, and the OLED substrate P1 whose thickness of the 1st PET layer L2 and the 2nd PET layer L3 is 100 micrometers was cut | disconnected.

Moreover, as scribe wheel SW which forms cutting line SL, the thing whose diameter is 10 mm and a blade tip angle is 30 degrees was used.

In addition, in this embodiment, when forming the first groove G1 in the first PET layer L2, the focus of the laser beam L is minimized, and the position of the focus is the first PET layer L2. ), The first groove G1 was formed at a scanning speed of 500 mm / second. As a result, the first groove G1 having an opening angle θ of about 45 ° and a groove width W of about 40 to 50 μm could be formed.

After forming said 1st groove | channel G1, the pushing pressure to PI layer L1 shall be 0.2 Mpa, and the scanning speed shall be 300 mm / sec, PI layer L1 by said scribe wheel SW. The cutting line SL was formed in the.

As for the cutting line SL formed in the said Example, the shift | offset | difference amount from the target line (the line which wanted to form cutting line SL) was ± 15 micrometers or less.

On the other hand, in the conventional cutting method in which the opening angle of the first groove G1 is about 150 ° and the groove width is larger than 200 μm, the deviation between the target line and the actually formed cutting line SL is ± 50 μm or more. It was.

As described above, the method for cutting the OLED substrate P1 described above can be formed without any significant deviation from the target line (first groove G1). In comparison, improvements are seen.

After forming the cutting line SL, the OLED substrate P1 is inverted and the formation traces of the first grooves G1 are formed under the same conditions as the irradiation conditions of the laser light L when the first grooves G1 are formed. A laser beam L was irradiated to the 2nd PET layer L3 along this. Accordingly, the second groove G2 having a shape similar to the first groove G1 is formed in the second PET layer L3.

(5) Optimization of the shape of the first groove

As mentioned above, by making opening angle (theta) and groove width W of 1st groove | channel G1 small, the shift | offset | difference amount of cutting line SL and the target line (1st groove | channel G1) became small.

This is because the opening angle θ and the groove width W of the first groove G1 are made smaller as described above, so that the scribe wheel SW is constrained to the first groove G1, and the scribe wheel SW is made to be made. When inserted into the groove G1, the insertion direction of the scribe wheel SW is corrected in an appropriate direction, and even when the cutting line SL is formed, the insertion state of the scribe wheel SW varies greatly from an appropriate state. It is because it does not.

That is, in the formation of the cutting line SL using the scribe wheel SW, the shape (opening angle θ / groove width W) of the first groove G1 is a target line (first groove ( It is considered to be an important factor in forming the cutting line SL which does not deviate from G1)).

Therefore, below is examined whether the first groove G1 having a shape (opening angle θ / groove width W) is optimal in forming an appropriate cutting line SL.

First, the definition of the opening angle θ and the groove width W for determining the shape of the first groove G1 will be described with reference to FIG. 4. 4 is a diagram illustrating the definition of the opening angle and the groove width of the first groove.

As shown to Fig.4 (a), opening angle (theta) is defined as the angle which the two side walls which form the 1st groove G1 make. On the other hand, as shown in FIG.4 (b), groove width W is defined as the distance between the edges of the 1st groove G1.

First, the optimum value of the opening angle (theta) was examined.

Specifically, when the blade tip of the scribe wheel SW is inserted into the first groove G1 having the opening angle θ at 45 °, 100 °, and 130 °, the scribe wheel SW is formed of the PI layer ( How much can be tilted from the direction perpendicular to L1 (referred to as the tilt shift width), and how far the blade edge of the scribe wheel SW can move in the width direction of the first groove G1 (called the parallel shift width). Was calculated by simulation.

Table 1 below shows the simulation results.

As described above, when the opening angle θ is in the range of 45 ° to 100 °, it is understood that the movement of the scribe wheel SW is suppressed when the scribe wheel SW is inserted into the first groove G1. have. That is, if the opening angle θ is set in the range of 45 ° to 100 °, when the scribe wheel SW is inserted into the first groove G1, the scribe wheel SW is appropriately adapted to the first groove G1. You can restrain.

Moreover, the range of the groove width W of the 1st groove G1 was also examined.

In the case where the opening angle θ is in the above-described angle range, the first groove G1 can suppress the deviation of the scribe wheel SW when the groove width W is in the range of 40 to 200 μm. It turned out.

2. Other Embodiments

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary of invention. In particular, the plurality of embodiments and modified examples written in the present specification can be arbitrarily combined as necessary.

The cutting method of said OLED substrate P1 is applicable also to the multilayer board | substrate formed from several resin layer other than OLED substrate P1. Moreover, said cutting direction can also be applied also to multilayer board | substrates which have layers (for example, metal layer) other than a resin layer.

In the above, OLED substrate P1 had three layers (PI layer L1, 1st PET layer L2, and 2nd PET layer L3), but the board | substrate which has two layers, and four or more layers The above cutting method can also be applied to a substrate having a layer.

The structure of the laser apparatus 3, the scribe wheel cutting device 5, and the machine drive system 7 is not limited to the structure demonstrated by said embodiment.

The shape of the OLED substrate P1 is not particularly limited.

The present invention can be widely applied to cutting of flexible OLEDs.

1: cutting device
3: laser device
5: scribe wheel cutting device
SW: scribe wheel
7: machine drive system
11: bed
13: machining table
15: moving device
9: control unit
L: laser light
P1: OLED substrate
L1: PI layer
L2: first PET layer
L3: second PET layer
L4: first adhesive layer
L5: second adhesive layer
G1: first groove
G2: second groove
SL: Cutting Line
W: groove width
θ: opening angle

Claims (4)

As a method of cutting the multilayer substrate which consists of a 1st PET layer, a PI layer, and a 2nd PET layer,
A first laser cutting step of forming a first groove in the first PET layer having an opening angle in a range of 45 to 100 degrees;
And a wheel cutting step of forming a cut in the PI layer while passing a wheel cutting means through the first groove. The method of claim 1,
The width | variety of the said 1st groove formed in a said 1st laser cutting step is a method of cutting | disconnecting a multilayer board | substrate in the range of 40-200 micrometers. The method according to claim 1 or 2,
And a second laser cutting step of forming a second groove in the second PET layer corresponding to the cutting portion after the wheel cutting step. An apparatus for cutting a multilayer substrate consisting of a first PET layer, a PI layer, and a second PET layer,
Laser cutting means for forming a first groove in the first PET layer having an opening angle in a range of 45 to 100 degrees;
A cutting device of a multilayer substrate having wheel cutting means for forming a cut in the PI layer while passing through the first groove.

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