TWI722162B - Laser processing device and laser processing method - Google Patents

Abstract

The subject of the present invention is to make it difficult for the inner resin layer to be processed when the surface side layer is processed when the multiple-layer resin substrate is fully cut by a laser processing device.

The laser processing device 1 is a device for cutting a plurality of resin substrates P having a first resin layer L1 and a second resin layer L2 from the surface side, and includes a first laser oscillator 9A and a second laser oscillator器9B. The first laser oscillator 9A is a device for generating the first laser light R1 for cutting the first resin layer L1. The first laser light R1 has a lower absorptivity relative to the second resin layer L2 than the first resin layer L1. The second laser oscillator 9B is a device for generating the second laser light R2 for cutting the second resin layer L2. The second laser light R2 has a higher absorptivity with respect to the second resin layer L2 than the first resin layer L1.

Description

Laser processing device and laser processing method

The present invention relates to a laser processing device and a laser processing method, especially a device and method for cutting a resin substrate by irradiating laser light.

The types of resin substrates are classified into single-layer resin substrates and multiple-layer resin substrates. The plural resin substrates include a plurality of resin layers of different materials. In addition, functional films (inorganic, metal, organic) may be laminated depending on the product.

As an apparatus for cutting a plurality of resin substrates, a laser processing apparatus is used (for example, refer to Patent Document 1). In the plural-layer resin substrate, only the upper layer is cut (half-cut processing) or all the layers are cut (full-cut processing) by a laser processing device.

[Prior Technical Literature]

[Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 2014-8511

When performing full-cut processing on multiple layers of resin substrates, when the layer below the surface layer (for example, the intermediate layer) is made of a material with a higher absorption rate than laser light, the intermediate layer may be more The surface layer is processed first. In this case, the discharge of debris generated inside the surface layer is hindered by the surface layer. Therefore, the debris enters the boundary of the resin layer or accumulates inside or generates heat to deteriorate the peripheral portion.

The object of the present invention is to make it difficult for the inner resin layer to be processed when the surface side layer is processed when the multiple layer resin substrate is fully cut by a laser processing device.

Hereinafter, various aspects will be described as means for solving the problems. These aspects can be combined arbitrarily as needed.

A laser processing device of one aspect of the present invention is a device for cutting a plurality of resin substrates having a first resin layer and a second resin layer from the surface side, and includes a first laser device and a second laser device .

The first laser device is a device for generating the first laser light for cutting the first resin layer. Compared with the first resin layer, the first laser system has a lower absorptivity relative to the second resin layer.

The second laser device is a device for generating the second laser light for cutting the second resin layer. Compared with the first resin layer, the second laser light system has a higher absorptivity with respect to the second resin layer.

In this device, the conditions (laser power, etc.) under which the second resin layer is not processed when the first resin layer is cut by the first laser light are selected. The reason is that the first laser system has a lower absorptivity relative to the second resin layer than the first resin layer. As a result, when the first resin layer is cut, the second resin layer is not easily processed.

After the first resin layer is cut, the second resin layer is cut by the second laser light. The debris generated at this time is discharged from the cut portion of the first resin layer to the outside. Therefore, the debris generated during the processing of the second resin layer does not stay in the first resin layer.

The absorption rate of the first laser light with respect to the second resin layer may be 30% or less, preferably 20% or less.

The absorption rate of the second laser light with respect to the second resin layer may be 70% or more, preferably 80% or more.

Alternatively, the second resin layer includes PI, the first laser device is a CO ₂ laser, and the second laser device is a UV laser.

Another aspect of the laser processing method of the present invention is a method of cutting a plurality of resin substrates having a first resin layer and a second resin layer from the surface side, and includes the following steps.

◎The first cutting step, which cuts the first resin layer by generating the first laser light. The first laser light system described above is compared with the first resin layer as compared to the second resin layer. Low absorption rate

◎The second cutting step, after the first cutting step, by generating a second laser light and irradiating the cut part of the first resin layer to cut the second resin layer, the above-mentioned second laser light system and Compared with the first resin layer, the absorption rate is higher than that of the second resin layer

In this method, when the first resin layer is cut by the first laser light, the second resin layer is not processed. The reason is that the first laser system has a lower absorptivity relative to the second resin layer than the first resin layer. As a result, when the first resin layer is cut, defects caused by the processing of the second resin layer are less likely to occur.

After the first resin layer is cut, the second resin layer is cut by the second laser light. The debris generated at this time is discharged from the cut portion of the first resin layer to the outside. Therefore, the debris generated during the processing of the second resin layer does not stay in the first resin layer.

In the laser processing device and the laser processing method of the present invention, when the multiple-layer resin substrate is fully cut, the resin layer on the inner side is not easily processed when the resin layer on the surface side is processed.

1‧‧‧Laser processing device

3‧‧‧Laser device

5‧‧‧Mechanical drive system

7‧‧‧Control Department

9‧‧‧Laser Oscillator

9A‧‧‧The first laser oscillator

9B‧‧‧The second laser oscillator

11‧‧‧Transmission optical system

13‧‧‧Base

15‧‧‧Processing table

17‧‧‧Mobile device

19‧‧‧Cut off

L1‧‧‧The first resin layer

L2‧‧‧Second resin layer

L3‧‧‧The third resin layer

P‧‧‧Resin substrate

Fig. 1 is a schematic diagram of a laser processing apparatus according to the first embodiment of the present invention.

Figure 2 is a flow chart showing the control action of full-cut processing.

Fig. 3 is a schematic cross-sectional view showing the structure of the resin substrate.

Fig. 4 is a schematic cross-sectional view showing the processing state of the resin substrate.

Fig. 5 is a plan view showing the state of the cut portion in the embodiment of the present invention.

Fig. 6 is a plan view showing the state of the cut portion in the comparative example.

1. The first embodiment

(1) Overall composition

Fig. 1 shows the overall structure of a laser processing apparatus 1 for cutting a resin substrate according to an embodiment of the present invention. Fig. 1 is a schematic diagram of a laser processing apparatus according to the first embodiment of the present invention.

The laser processing device 1 is a device that performs full-cut processing on the resin substrate P. The so-called resin substrate refers to what is also called a resin sheet or a resin film.

The laser processing device 1 includes a laser device 3. The laser device 3 has a first laser oscillator 9A for irradiating the resin substrate P with laser light. The first laser oscillator 9A is, for example, a CO ₂ laser. The laser device 3 has a second laser oscillator 9B for irradiating the resin substrate P with laser light. The second laser oscillator 9B is, for example, a UV laser.

The laser device 3 has a transmission optical system 11 that transmits laser light to the mechanical drive system described below. The transmission optical system 11 has, for example, a condenser lens, a plurality of reflecting mirrors, a beam, a beam expander, etc., but it is not shown. In addition, the transmission optical system 11 has, for example, a first laser oscillator 9A, a second laser oscillator 9B, and a laser head (not shown) incorporating other optical systems to move in the X-axis direction. X-axis direction moving mechanism (not shown).

The transmission optical system 11 may have different optical mechanisms in the first laser oscillator 9A and the second laser oscillator 9B, or may be capable of switching and using a shared optical mechanism.

The laser processing device 1 includes a mechanical drive system 5. The mechanical drive system 5 has a base 13, a processing table 15 on which the resin substrate P is placed, and a moving device 17 that moves the processing table 15 in a horizontal direction relative to the base 13. The moving device 17 is a well-known mechanism having a guide rail, a moving table, a motor, and the like.

The laser processing device 1 includes a control unit 7. The control unit 7 is a computer system with a processor (such as CPU), a memory device (such as ROM, RAM, HDD, SSD, etc.), and various interfaces (such as A/D converter, D/A converter, communication interface, etc.) . The control section 7 performs various control actions by executing programs stored in the memory section (corresponding to part or all of the memory area of the memory device).

The control unit 7 may be composed of a single processor, or may be composed of a plurality of independent processors for each control.

A sensor for detecting the size, shape, and position of the resin substrate P, a sensor and a switch for detecting the state of each device, and an information input device are connected to the control unit 7, but not shown.

In this embodiment, the control unit 7 can control the first laser oscillator 9A and the second laser oscillator 9B. In addition, the control unit 7 can control the mobile device 17. Furthermore, the control unit 7 can control the transmission optical system 11.

As shown in FIG. 3, the resin substrate P is a plural-layer resin substrate composed of plural layers of resin. Fig. 3 is a schematic cross-sectional view showing the structure of the resin substrate. Specifically, the resin substrate P has a three-layer structure, and has a first resin layer L1, a second resin layer L2, and a third resin layer L3 from the front side.

As an example, the first resin layer L1 contains PET. The second resin layer L2 contains PI. The third resin layer L3 contains PET.

As an example, each resin layer is bonded to each other by an adhesive layer.

As an example, a circuit is formed on the upper surface of the second resin layer L2.

(2) Action

2 to 4, the processing operation of the resin substrate P implemented by laser light will be described. Figure 2 is a flow chart showing the control action of full-cut processing. Fig. 4 is a schematic cross-sectional view showing the processing state of the resin substrate.

The control unit 7 drives the laser oscillator 9 to perform cutting of the resin substrate P. Hereinafter, the cutting operation will be specifically described.

In step S1, the first resin layer L1 is cut. Specifically, the control unit 7 drives the first laser oscillator 9A to move the laser light along the cutting line C. As shown in FIG. 3, the first resin layer L1 is cut by the first laser light R1. The scanning frequency of the laser light can be 1 time or multiple times.

When the first resin layer L1 is cut by the first laser light R1, the second resin layer L2 is not processed. The reason is that the first laser light R1 has a lower absorptivity relative to the second resin layer L2 than the first resin layer L1. As a result, when the first resin layer L1 is cut, defects caused by the processing of the second resin layer L2 are less likely to occur.

As a specific example, _{the absorption rate of the CO 2} laser with respect to PI is about 30% when the absorption rate of the CO 2 laser is in the 9.4 μ band.

In step S2, the second resin layer L2 is cut. Specifically, the control unit 7 drives the second laser oscillator 9B to move the laser light along the cutting line C. The scanning frequency of the laser light can be 1 time or multiple times. As shown in FIG. 4, the second resin layer L2 is cut by the second laser light R2. The debris generated at this time is discharged from the cut portion 19 of the first resin layer L1 to the outside. Furthermore, the second laser light R2 has a higher absorptivity with respect to the second resin layer L2 than with the first resin layer L1, and therefore effectively cuts the second resin layer L2.

As a specific example, the absorption rate of UV laser relative to PI is about 90%.

In step S3, the third resin layer L3 is cut. At this time, the second laser oscillator 9B, that is, a UV laser is used.

Next, using FIGS. 5 and 6, an embodiment and a comparative example will be described. Fig. 5 is a plan view showing the state of the cut portion in the embodiment of the present invention. Fig. 6 is a plan view showing the state of the cut portion in the comparative example.

Example: The first resin layer is PET, the second resin layer is PI, and the laser device is a CO ₂ laser.

Comparative example: The first resin layer is PET, the second resin layer is PI, and the laser device is a UV laser.

In either case, only the first resin layer was cut, and observation was performed in this state.

As shown in FIG. 5, in the embodiment, the width Z of the area where the debris expands relative to the cut portion 19 is small.

As shown in FIG. 6, in a comparative example (for example, a case where a UV laser is used to cut the first layer), the width Z of the area becomes extremely long as the debris expands with respect to the cut portion 19.

2. Other implementation forms

In the foregoing, one embodiment of the present invention has been described, but the present invention is not limited to the above-mentioned embodiment, and various changes can be made without departing from the spirit of the invention.

In the above-mentioned resin substrate, the resin layer has three layers, but the resin layer may be two layers or four or more layers.

The above-mentioned substrates are all composed of resin layers, but other layers (for example, metal layers, ceramic layers) may be provided under the two resin layers.

The specific configuration of the laser device and the mechanical drive system is not limited to the above-mentioned embodiment.

The shape of the resin substrate and the shape of the cut portion are not particularly limited.

[Industrial availability]

The present invention can be widely applied to a laser processing device and a laser processing method for cutting a resin substrate by irradiating laser light.

L1‧‧‧The first resin layer

L2‧‧‧Second resin layer

L3‧‧‧The third resin layer

P‧‧‧Resin substrate

R2‧‧‧The second laser beam

Claims (3)

A laser processing device, which is used to cut a plurality of resin substrates having a first resin layer and a second resin layer from the surface side, and is provided with: a first laser device for generating 1 A device for the first laser light cut by the resin layer, and the first laser light system has a lower absorptivity relative to the second resin layer than the first resin layer; and A laser device that generates a second laser light for cutting the second resin layer, and the second laser light system is relative to the second resin layer compared to the first resin layer. The resin layer has a higher absorption rate; the first resin layer includes PET, the second resin layer includes PI, the first laser device is a CO ₂ laser, and the second laser device is a UV laser. A laser processing method, which cuts a plurality of resin substrates having a first resin layer and a second resin layer from the surface side, and includes: a first cutting step, which generates a first laser light to cut The first resin layer is cut, and the first laser light system has a lower absorptivity relative to the second resin layer than that of the first resin layer; and the second cutting step is After the first cutting step, the second resin layer is cut by generating a second laser light and irradiating it to the cut portion of the first resin layer. The second laser light is different from the first resin layer. In terms of layer, the absorption rate is higher than that of the second resin layer; the first resin layer includes PET, the second resin layer includes PI, the first laser device is a CO ₂ laser, and the The second laser device is a UV laser. A laser processing method, which cuts a plurality of resin substrates having a first resin layer and a second resin layer from the surface side; the first resin layer includes PET, and the second resin layer includes PI, and includes: The first cutting step is to cut _{the first resin layer by generating CO 2} laser; and the second cutting step is to generate UV laser and irradiate it after the first cutting step. The cut portion of the first resin layer cuts the second resin layer.

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