JP2018001204A - Laser machining device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To solve a problem peculiar to a resin substrate, when the resin substrate is subjected to full-cut machining in a laser machining device.SOLUTION: A laser machining device 1 is a device for cutting a resin substrate P. The laser machining device 1 is equipped with a laser device 3 and a machining table 15. The laser device 3 generates a laser beam for cutting the resin substrate P. The machining table 15 has an upper surface 15a on which the resin substrate P is placed. On the upper surface 15a, a groove 15b corresponding to a cutting line C of the resin substrate P is formed.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a laser processing apparatus, and more particularly to an apparatus for cutting a resin substrate by irradiating a laser beam.

The types of resin substrates are divided into single layer resin substrates and multilayer resin substrates. The multilayer resin substrate is a substrate including a plurality of resin layers of different materials.
As a device for cutting the resin substrate, a laser processing device is used (for example, see Patent Document 1). With the laser processing apparatus, only a part of the upper side of the resin substrate is cut (half cut processing) or all is cut (full cut processing).

JP 2014-8511 A

In general, when performing laser processing, the resin substrate is fixed to a table by suction. Therefore, in the case of full cut processing, the following problems may occur.
First, melted resin may adhere to the table.
Second, debris (processing waste) generated during processing may adhere to the table.
In either case, it is necessary to remove the deposits from the table.

  An object of the present invention is to eliminate problems peculiar to a resin substrate when the resin substrate is fully cut in a laser processing apparatus.

  Hereinafter, a plurality of modes will be described as means for solving the problems. These aspects can be arbitrarily combined as necessary.

A laser processing apparatus according to an aspect of the present invention is an apparatus for cutting a resin substrate. The laser processing apparatus includes a laser device and a processing table.
The laser device generates laser light for cutting the resin substrate.
The processing table has an upper surface on which the resin substrate is placed. A groove corresponding to the cutting line of the resin substrate is formed on the upper surface.
In this apparatus, the laser apparatus cuts the resin substrate along the cutting line with laser light. At this time, the melted resin and debris are dropped and accommodated in the groove of the table. Therefore, they hardly adhere to the upper surface of the table.

The width of the groove may be wider than the heat affected width of the resin substrate by the laser beam.
In this apparatus, since the width of the groove is sufficiently wide, the melted resin and debris reliably fall into the groove of the processing table.

The laser processing apparatus may further include an air moving device for moving the air in the groove.
In this device, the air moving device can move the melted resin and debris in the groove to the outside by the moving air. Therefore, the deposition of the substance in the groove is prevented.

  In the laser processing apparatus according to the present invention, a problem peculiar to the resin substrate hardly occurs when the resin substrate is fully cut.

The schematic diagram of the laser processing apparatus of 1st Embodiment of this invention. The top view of a process table and a resin substrate. The typical sectional view of a processing table and a resin substrate. The typical sectional view of a processing table and a resin substrate. The typical sectional view showing the processing state of a resin substrate. The typical sectional view of the processing table and resin substrate of a 2nd embodiment. The typical sectional view showing the processing state of the resin substrate of a 2nd embodiment. The schematic diagram of the laser processing apparatus of 3rd Embodiment. The top view of the process table and resin substrate of 3rd Embodiment.

1. First Embodiment (1) Overall Configuration FIG. 1 shows an overall configuration of a laser processing apparatus 1 for cutting a resin substrate according to an embodiment of the present invention. FIG. 1 is a schematic diagram of a laser processing apparatus according to a first embodiment of the present invention.
The laser processing apparatus 1 is an apparatus for full-cutting the resin substrate P. The resin substrate is also called a resin sheet or a resin film.

The laser processing apparatus 1 includes a laser apparatus 3. The laser device 3 has a laser oscillator 9 for irradiating the resin substrate P with laser light.
The laser device 3 includes a transmission optical system 11 that transmits laser light to a mechanical drive system described later. The transmission optical system 11 includes, for example, a condensing lens, a plurality of mirrors, a prism, and a beam expander, although not shown. Further, the transmission optical system 11 includes, for example, an X-axis direction moving mechanism (not shown) for moving a laser irradiation head (not shown) in which the laser oscillator 9 and other optical systems are incorporated in the X-axis direction. Have.

  The laser processing apparatus 1 includes a mechanical drive system 5. The mechanical drive system 5 includes a bed 13, a processing table 15 on which the resin substrate P is placed, and a moving device 17 that moves the processing table 15 in the horizontal direction with respect to the bed 13. The moving device 17 is a known mechanism having a guide rail, a moving table, a motor, and the like.

The laser processing apparatus 1 includes a control unit 7. The control unit 7 includes a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, an A / D converter, a D / A converter, a communication interface, etc.). It is a computer system. The control unit 7 performs various control operations by executing a program stored in the storage unit (corresponding to a part or all of the storage area of the storage device).
The control unit 7 may be configured by a single processor, but may be configured by a plurality of independent processors for each control.

Although not shown, the controller 7 is connected to a sensor for detecting the size, shape and position of the resin substrate P, sensors and switches for detecting the state of each device, and an information input device.
In this embodiment, the control unit 7 can control the laser oscillator 9. Further, the control unit 7 can control the moving device 17. Further, the control unit 7 can control the transmission optical system 11.

  The laser oscillator 9 is composed of a laser tube similar to the conventional one. The laser oscillator 9 is, for example, a picosecond UV laser.

The upper surface 15a of the processing table 15 will be described with reference to FIGS. FIG. 2 is a plan view of the processing table and the resin substrate. FIG. 3 is a schematic cross-sectional view of the processing table and the resin substrate.
As shown in FIG. 2, a plurality of grooves 15b are formed on the upper surface 15a. The groove 15b has a shape that is lowered downward from the plane portion. The groove 15b corresponds to the cutting line C of the resin substrate P. “Corresponding” means that the cutting line C is located within the width of the groove 15b. In the present embodiment, the cutting line C is disposed at the center in the width direction of the groove 15b or in the vicinity thereof. Note that the cutting line C may be a solid line or a virtual line.

(2) Operation The processing operation of the resin substrate P by laser light will be described with reference to FIGS. FIG. 4 is a schematic cross-sectional view of the processing table and the resin substrate.
First, as shown in FIG. 3, the resin substrate P is placed on the upper surface 15 a of the processing table 15. Specifically, the resin substrate P is placed so that the cutting line C of the resin substrate P corresponds to the groove 15b. In this embodiment, the resin substrate P is a single layer.

  Subsequently, the resin substrate P is sucked or pressed against the processing table 15 by an apparatus (not shown).

  Next, the control unit 7 drives the laser oscillator 9 to execute the cutting of the resin substrate P (that is, the cutting unit 19 is formed). The laser oscillator 9 cuts the resin substrate P into a plurality of pieces by moving the laser light along the cutting line C. The number of scans of the laser beam may be one or more times.

  Since the groove 15b corresponding to the cutting line C of the resin substrate P is formed on the upper surface 15a of the processing table 15 as described above, the laser device 3 moves the resin substrate P along the cutting line C by the laser light R. When cutting, the melted resin and debris fall into the groove 15b of the processing table 15 and are accommodated. Therefore, they are difficult to adhere to the upper surface 15 a of the processing table 15.

The groove 15b will be described in more detail with reference to FIG. FIG. 5 is a schematic cross-sectional view showing a processed state of the resin substrate. In FIG. 5, for simplification of the drawing, the dimensional ratio of each part is different from the actual one.
As shown in FIG. 5, the width W <b> 3 of the groove 15 b is wider than the width W <b> 1 of the cut portion 19 and wider than the width W <b> 2 of the heat affected zone 20 by the laser beam R of the resin substrate P. The heat affected zone 20 refers to a portion that is deformed by the heat of the laser beam. Thus, since the width of the groove 15b is sufficiently wide, the melted resin and debris surely fall into the groove 15b of the processing table 15.
As an example, the width W3 of the groove 15b is about 3 mm. The width W1 of the cutting part 19 is 20 to 30 μm. The width W2 of the heat affected zone 20 is about 200 μm.

2. Second Embodiment In the first embodiment, the resin substrate is a single layer, but the resin substrate may be a multilayer.
Such an embodiment will be described with reference to FIGS. 6 and 7. FIG. 6 is a schematic cross-sectional view of a processing table and a resin substrate according to the second embodiment. FIG. 7 is a schematic cross-sectional view showing a processed state of the resin substrate of the second embodiment.

As shown in FIG. 6, the resin substrate P1 is a multilayer resin substrate made of a multilayer resin. Specifically, the resin substrate P1 has a three-layer structure, and has a first resin layer L1, a second resin layer L2, and a third resin layer L3 from the front side.
As an example, the first resin layer L1 includes PET. The second resin layer L2 includes PI. The third resin layer L3 includes PET.
As an example, the resin layers are bonded to each other by an adhesive layer.
As an example, a circuit is formed on the upper surface of the second resin layer L2.

First, as shown in FIG. 6, the resin substrate P <b> 1 is placed on the upper surface 15 a of the processing table 15. Specifically, the resin substrate P is placed so that the cutting line C of the resin substrate P1 corresponds to the groove 15b.
Subsequently, the resin substrate P <b> 1 is sucked or pressed against the processing table 15 by an apparatus (not shown).

  Next, the control unit 7 drives the laser oscillator 9 to execute the cutting of the resin substrate P1 (that is, the cutting unit 19 is formed). As shown in FIG. 7, the laser oscillator 9 cuts the resin substrate P1 into a plurality of pieces by moving the laser light along the cutting line C. The number of scans of the laser beam may be one or more times.

  Since the groove 15b corresponding to the cutting line C of the resin substrate P1 is formed on the upper surface 15a of the processing table 15 as described above, the laser device 3 uses the laser light R to cut the resin substrate P1 along the cutting line C. When cutting, the melted resin and debris fall into the groove 15b of the processing table 15 and are accommodated. Therefore, they are difficult to adhere to the upper surface 15 a of the processing table 15.

3. Third Embodiment In the first embodiment and the second embodiment, the melt and debris dropped in the processing table are deposited as they are. However, these deposits may be positively removed.
Such an embodiment will be described with reference to FIGS. FIG. 8 is a schematic diagram of a laser processing apparatus according to the third embodiment. FIG. 9 is a plan view of the processing table and the resin substrate according to the third embodiment.

As shown in FIG. 8, the laser processing apparatus 1 further includes a blow device 21 (an example of an air moving device) for generating an air flow in the groove.
The blowing device 21 can move the melted resin and debris in the groove 15b to the outside from the groove 15b by an air flow. Therefore, the deposition of the substance in the groove 15b is prevented.

As shown in FIG. 9, the blow device 21 includes a main body 21 a having a pump and the like, a nozzle 23, and a hose 25. The nozzle 23 is disposed at one end of each groove 15b. The hose 25 connects the nozzle 23 and the main body 21a.
The blow device 21 further has a collection device 27. The collection device 27 includes a main body 27 a having a tank or the like, a nozzle 29, and a hose 31. The nozzle 29 is connected to the other end of each groove 15b. The hose 31 connects the nozzle 29 and the main body 27a.
With the above configuration, the air supplied from the blow device 21 passes through the groove 15b and is recovered by the recovery device 27. Thereby, the melted resin and debris in the groove 15b are recovered. In particular, there is an advantage that the residue in the groove 15b can be collected during the processing of the resin substrate P.
The air moving device may be a suction device that sucks air in the groove.

4). Other Embodiments Although a plurality of embodiments of the present invention have been described above, the present invention is not limited to the above embodiments, and various modifications can be made without departing from the scope of the invention.
The specific configurations of the laser device and the mechanical drive system are not limited to the above embodiments.
The cutting shape of the resin substrate is not particularly limited.

    The present invention can be widely applied to a laser processing apparatus that cuts a resin substrate by irradiating a laser beam.

1: Laser processing device 3: Laser device 5: Machine drive system 7: Control unit 9: Laser oscillator 11: Transmission optical system 13: Bed 15: Processing table 15a: Upper surface 15b: Groove 17: Moving device 21: Blow device 21a: Main body 23: Nozzle 25: Hose 27: Recovery device 27a: Tank 29: Nozzle C: Cutting line L1: First resin layer L2: Second resin layer L3: Third resin layer P: Resin substrate P1: Resin substrate

Claims (3)

A laser processing apparatus for cutting a resin substrate,
A laser device that generates laser light for cutting the resin substrate;
A processing table having a top surface on which the resin substrate is placed, and a groove corresponding to a cutting line of the resin substrate is formed on the top surface;
A laser processing apparatus comprising:   The laser processing apparatus according to claim 1, wherein a width of the groove is wider than a thermal influence width of the resin substrate by the laser beam.   The laser processing apparatus according to claim 1, further comprising an air moving device for moving the air in the groove.

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