KR20200013578A - Cutting method and cutting apparatus of multilayer substrate - Google Patents

Abstract

An objective of the present invention is to prevent an adhesion layer melted by heat by laser irradiation from being ejected to the outside when cutting a multilayer substrate with the adhesion layer using laser irradiation. A method for cutting a flexible OLED (multilayer substrate) consisting of a first PET layer (L2), a PI layer (L1), a second PET layer (L3), a first adhesion layer (L4), and a second adhesion layer (L5) comprises a first laser cutting step, a second laser cutting step, and a wheel cutting step. In the first laser cutting step, a first groove (G1) is formed on the first PET layer (L2) and the first adhesion layer (L4) by irradiation of a laser beam (L). In the second laser cutting step, a second groove (G2) is formed on the second PET layer (L3) and the second adhesion layer (L5) in correspondence with the first groove (G1) by irradiation of a laser beam (L) after the first laser cutting step. In the wheel cutting step, a cutting line (SL) is formed on the PI layer (L1) while a scribe wheel (SW) passes through the first groove (G1) or the second groove (G2).

Description

CUTTING METHOD AND CUTTING APPARATUS OF MULTILAYER SUBSTRATE}

TECHNICAL FIELD This invention relates to the cutting method and apparatus of multilayer boards, such as flexible OLED (organic LED).

As a method of cutting a multilayer board | substrate like an OLED board | substrate, the method of conventionally irradiating a laser beam from one surface and forming a cutting line along a desired line is known (for example, refer patent document 1).

In said multilayer board | substrate, different materials are used for every layer in many cases. In this case, it is necessary to form a cutting line using a different light source for each layer of a multilayer substrate, and the apparatus structure which cuts a multilayer substrate becomes complicated.

Moreover, when an electronic circuit is formed in one resin layer of a multilayer board | substrate like an OLED substrate, when the said resin layer is cut | disconnected with a laser beam, a resin layer may carbonize. In the case where the graphite formed by carbonization of the resin layer extends over the wirings, the conductive graphite may short the electronic circuit.

Therefore, in cutting of a multilayer substrate, a method of forming a cutting line using a scribe wheel has been conceived for some layers (particularly, layers in which an electronic circuit is formed).

For example, in an OLED having a structure in which a light emitting layer has a polyimide (PI) layer and a polyethylene terephthalate (PET) layer adhered to both surfaces of the polyimide layer by an adhesive layer, one of the PET layer and the adhesive layer is lasered. The light is removed by irradiation to form a groove, and a scribe wheel is passed through the groove to form a cutting line in the PI layer.

Japanese Unexamined Patent Publication No. 2018-15784

In the above conventional cutting method, after forming a groove in one of the PET layers formed on both surfaces of the PI layer, passing a scribe wheel through the groove, and forming a cutting line in the PI layer, the other PET layer is further formed. Was forming a groove in. Therefore, when forming a groove in the other PET layer, the adhesive layer melts due to heat generated by laser irradiation, and the melted adhesive layer (adhesive) may be ejected to the outside.

Although a multilayer board is cut | disconnected in the state mounted on the process table, when an adhesive melts and it ejects to the outside, it can be considered that the ejected adhesive adheres to the process table surface.

If an adhesive adheres to the surface of the processing table, the adhesive reattaches to the multilayer substrate and contaminates the surface, and / or the multilayer substrate is placed in a non-horizontal state on the processing table so that the multilayer substrate cannot be cut properly. I can think of becoming.

Moreover, in order to suppress the contamination of the process table by the ejection of the adhesive to the exterior, in the conventional cutting method, for example, the process table is recessed, for example, the part corresponding to the cutting part of the multilayer board | substrate of a process table is recessed. I needed to study the structure.

An object of the present invention is to suppress that an adhesive layer is ejected to the outside by heat of laser irradiation in cutting of a multilayer substrate such as an OLED having an adhesive layer using laser irradiation.

Below, some aspect is demonstrated as a means to solve a subject. These aspects can be arbitrarily combined as needed.

A method of cutting a multilayer substrate such as a flexible OLED according to one aspect of the present invention is a method of cutting a multilayer substrate including a first PET layer, a PI layer, a second PET layer, a first adhesive layer, and a second adhesive layer. The first adhesive layer adheres the first PET layer to the PI layer. The second adhesive layer adheres the second PET layer to the PI layer. The cutting method of a multilayer board | substrate is provided with the following steps.

First laser cutting step of forming a first groove on the first PET layer and the first adhesive layer by laser irradiation.

◎ A 2nd laser cutting step which forms a 2nd groove in a 2nd PET layer and a 2nd contact bonding layer in correspondence with a 1st groove | channel by a laser irradiation after a 1st laser cutting step.

◎ A wheel cutting step of forming a cutout portion in the PI layer while passing the wheel cutting means through the first groove or the second groove after the second laser cutting step.

In the said cutting method, after forming a 1st groove | channel in a 1st PET layer and a 2nd contact bonding layer by a laser irradiation, and forming a 2nd groove | channel in a 2nd PET layer and a 2nd contact bonding layer, a PI layer is formed by wheel cutting means. The cut portion is formed in the. Since the cutout is not formed in the PI layer after the formation of either the first groove or the second groove, the adhesive layer melted while forming the other of the first groove or the second groove by laser irradiation, for example, to the outside through the cutout. Ejection can be suppressed. That is, a PI layer turns into a "cover" and can suppress that a melted adhesive layer blows out to the outside.

The opening angle of the groove | channel which lets a wheel cutting means pass in a wheel cutting step at least among a 1st groove | channel or a 2nd groove | channel may be 45-100 degree | times.

Thereby, the 1st groove | channel or 2nd groove | channel through which a wheel cutting means passes can function as a "guide," and it can suppress that the cut part formed by the wheel cutting means largely escapes from an original line.

The width | variety of 40-200 micrometers of the width | variety of the groove | channel which lets a wheel cutting means pass in a wheel cutting step at least among a 1st groove or a 2nd groove | channel may be sufficient.

Thereby, the 1st groove | channel or 2nd groove | channel through which a wheel cutting means passes can function as a "guide," and it can suppress that the cut part formed by the wheel cutting means largely escapes from an original line.

The cutting apparatus of the multilayer substrate which concerns on another aspect of this invention is a 1st adhesive layer which adhere | attaches a 1st PET layer, a PI layer, a 2nd PET layer, and a 1st PET layer to a PI layer, and a 2nd PET layer to a PI layer. It is an apparatus which cut | disconnects the multilayer substrate which consists of a 2nd contact bonding layer. The cutting device includes a laser cutting means and a wheel cutting means.

The laser cutting means forms a first groove in the first PET layer and the first adhesive layer by laser irradiation, and forms a second groove in the second PET layer and the second adhesive layer in correspondence with the first groove.

The wheel cutting means forms a cut in the PI layer while passing through the first groove or the second groove after the formation of the first groove and the second groove.

In the said cutting device, after a 1st groove | channel is formed in a 1st PET layer and a 2nd contact bonding layer by a laser cutting means, and a 2nd groove | channel is formed in a 2nd PET layer and a 2nd contact bonding layer, by a wheel cutting means, Cuts are formed in the PI layer. Since the cutout is not formed in the PI layer after the formation of either the first groove or the second groove, the adhesive layer melted while forming the other of the first groove or the second groove by laser irradiation, for example, to the outside through the cutout. Ejection can be suppressed. That is, a PI layer turns into a "cover" and can suppress that a melted adhesive layer blows out to the outside.

When forming a groove in the PET layer of the multilayer substrate by laser irradiation, it is possible to suppress that the adhesive layer melted by heat by laser irradiation is ejected to the outside.

1 is a diagram showing a cross-sectional structure of an OLED substrate.
2 is a view showing an overall configuration of a cutting device.
3 is a diagram schematically illustrating a cutting operation of an OLED substrate.
4 is a diagram showing the definition of the opening angle and the groove width.

1. First embodiment

(1) Structure of Flexible OLED

Hereinafter, the cutting method of the multilayer board | substrate which concerns on one Embodiment of this invention is demonstrated. In this embodiment, as an example of the multilayer board | substrate which is an object to cut | disconnect, flexible OLED (henceforth called OLED substrate P1) is employ | adopted.

Therefore, first, the structure of OLED substrate P1 is demonstrated using FIG. 1 is a diagram illustrating a cross-sectional structure of an OLED substrate.

As shown in FIG. 1, OLED substrate P1 has a three-layer structure, and has PI layer L1, 1st PET layer L2, and 2nd PET layer L3.

The PI layer (L1) is a substrate made of polyimide (PI), and an OLED (organic LED) is formed on one surface. Specifically, for example, a light emitting layer, a driver element (for example, a TFT (thin film transistor)) for controlling light emission by the light emitting layer, and an OLED wiring are formed.

The first PET layer L2 and the second PET layer L3 are films made of polyethylene terephthalate (PET) and protect the OLED formed on the surface of the PI layer (L1).

The 1st PET layer L2 is adhere | attached on one surface of PI layer L1 by the 1st contact bonding layer L4. The 1st contact bonding layer L4 is formed of an acryl-type or urethane type adhesive agent, for example.

On the other hand, 2nd PET layer L3 is adhere | attached on the other surface of PI layer L1 by 2nd contact bonding layer L5. The second adhesive layer L5 is formed of, for example, an acrylic or urethane adhesive.

Among the first PET layer L2 or the second PET layer L3, the PET layer on the side where the groove into which the scribe wheel SW (described later) is inserted is formed on the back side of the OLED substrate P1 and on the opposite side thereof. The PET layer becomes the light emitting surface side of the OLED substrate P1.

(2) cutting device

Next, the structure of the cutting device 1 of this embodiment is demonstrated using FIG. 2 is a diagram illustrating an overall configuration of a cutting device. The cutting device 1 is a device for cutting the OLED substrate P1 having the above configuration by using laser irradiation and a scribe wheel.

The cutting device 1 includes a laser device 3 (an example of laser cutting means), a scribe wheel cutting device 5, a machine drive system 7, and a control unit 9.

The laser device 3 is a device for irradiating the laser light L to the OLED substrate P1. The laser apparatus 3 has a laser oscillator which outputs the laser light L, and the transmission optical system which transmits the said laser light L to the machine drive system 7 mentioned later (all are not shown). Although not shown, the transmission optical system includes a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. The transmission optical system has, for example, an X axis direction moving mechanism (not shown) for moving a laser irradiation head (not shown) equipped with a laser oscillator and another optical system in the X axis direction. The laser oscillator of the laser device 3 is a CO ₂ laser, for example.

The scribe wheel cutting device 5 is a device for cutting a substrate by rolling a scribe wheel SW (an example of wheel cutting means). In the present embodiment, the scribe wheel cutting device 5 is used to form a cutting line (an example of a cutting portion) in the PI layer L1 of the OLED substrate P1.

The scribe wheel SW is a disk-shaped member whose outer peripheral part was formed in V shape. The outer peripheral portion of the scribe wheel SW is a blade forming a cutting line in the PI layer L1. The scribe wheel SW is 5-15 mm in diameter, for example, and the vertex angle of the V-shaped blade tip is 20-50 degrees.

The machine drive system 7 includes a bed 11, a processing table 13 on which the OLED substrate P1 is placed, and a moving device 15 for moving the processing table 13 in the horizontal direction with respect to the bed 11. Have The moving device 15 is a known mechanism having a guide rail, a moving table, a motor, and the like.

The control unit 9 includes a processor (for example, a CPU), a storage device (for example, a ROM, a RAM, an HDD, an SSD, and the like), and various interfaces (for example, an A / D converter and a D / A converter). Computer interface). The control unit 9 performs various control operations by executing a program stored in the storage unit (corresponding to part or all of the storage area of the storage device).

The control part 9 may be comprised by the single processor, but may be comprised by the several independent processor for each control.

Although not shown, the control unit 9 is connected with a sensor for detecting the size, shape and position of the OLED substrate P1, a sensor and a switch for detecting the state of each device, and an information input device.

In this embodiment, the control part 9 can control the laser apparatus 3. In addition, the control unit 9 can control the scribe wheel cutting device 5. In addition, the control unit 9 can control the mobile device 15.

(3) cutting method of OLED substrate

3, the cutting operation of the OLED substrate P1 by the laser light L and the scribe wheel SW will be described. 3 is a diagram schematically illustrating a cutting operation of an OLED substrate.

First, as shown to Fig.3 (a), the OLED substrate P1 is arrange | positioned on the process table 13 with the 1st PET layer L2 up. Then, the laser apparatus 3 irradiates the laser beam L toward the 1st PET layer L2. The laser device 3 and / or the OLED substrate P1 are moved while irradiating the laser light L, and the laser light L is irradiated along a desired line. As a result, the first PET layer L2 and the first adhesive layer L4 at the point where the laser light L is irradiated are removed, and the first groove G1 is formed along the desired line (first laser cutting step). ).

After forming the 1st groove G1 in the 1st PET layer L2 and the 1st contact bonding layer L4, as shown to (b) of FIG. 3, OLED substrate P1 is reversed. As a result, the second PET layer L3 of the OLED substrate P1 faces upward.

In addition, as shown in FIG. 3C, the laser light L is irradiated to the surface of the second PET layer L3 so as to correspond to the first groove G1. As a result, the second PET layer L3 and the second adhesive layer L5 at the point where the laser light L is irradiated are removed, and the second groove G2 is formed so as to correspond to the first groove G1. 2 laser cutting steps).

At this time, since the formation trace of the first groove G1 can be visually recognized from the second PET layer L3 side, the laser light L is irradiated along the formation trace of the first groove G1. Thereby, the 2nd groove | channel G2 (overlapping) corresponding to the cutting line SL can be formed.

In the present embodiment, when irradiating the laser light L to the second PET layer L3 and the second adhesive layer L5 in the second laser cutting step, the laser light L can be focused as small as possible. Then, the position of the focal point is set on the surface of the second PET layer L3.

Thereby, as shown in FIG.3 (c), the 1st groove | channel G1 with small opening angle (theta) and the groove | channel width W can be formed. Specifically, for example, the second groove G2 in which the opening angle θ is in the range of 45 ° to 100 ° and the groove width is in the range of 40 μm to 200 μm can be formed. have.

In addition, opening angle (theta) is defined as the angle which the two side walls which form the groove of a PET layer make, as shown to Fig.4 (a). On the other hand, the groove width W is defined by the distance between the edges of the first groove G1, as shown in Fig. 4B. 4 is a diagram showing definitions of an opening angle and a groove width of a groove.

Moreover, the opening angle (theta) and / or the groove width W of the 1st groove | channel G1 can also be adjusted by adjusting the position of the focal point (position of the height direction of the OLED substrate P1) of the laser beam L. have.

Moreover, the irradiation conditions (focus position) of the laser beam L at the time of forming the 2nd groove G2 may be made the same as the irradiation conditions (focus position) at the time of formation of the 1st groove G1, and are different. You may also

By making the irradiation condition of the laser light L at the time of forming the 2nd groove G2 the same as the irradiation condition at the time of formation of the 1st groove G1, it is substantially the same shape as the 1st groove G1 (opening The second groove G2 of the angle θ and the groove width W is almost equal to the first groove G1 can be formed.

Moreover, by making the irradiation conditions of laser beam L the same, it is not necessary to change irradiation conditions for every groove formation, and therefore cutting efficiency of OLED substrate P1 can be improved.

Returning to FIG. 3, after forming the second groove G2, as shown in FIG. 3D, the scribe wheel SW is passed through the second groove G2, and a predetermined load is applied to the scribe wheel ( In the state which pushed the blade edge | tip of SW into PI layer L1, the scribe wheel cutting device 5 and / or OLED board | substrate P1 are moved and the scribe wheel SW is rotated (wheel cutting step).

As a load applied to the PI layer L1 from the scribe wheel SW, the load of 0.15 Mpa-0.20 Mpa can be used, for example.

By moving the scribe wheel cutting device 5 and / or OLED board | substrate P1 and moving along the 1st groove | channel G1, while driving the scribe wheel SW, as shown to FIG. 3 (d), PI In the layer L1, the cutting line SL can be formed along the first groove G1 and the second groove G2.

As mentioned above, the 2nd groove | channel G2 which lets the scribe wheel SW pass at least has the opening angle (theta) in the range of 45 degrees-100 degrees, for example, and / or the groove width is 40, for example. It exists in the range of micrometer-200 micrometers.

Thereby, the 2nd groove | channel G2 through which the scribe wheel SW passes is functioning as a "guide," and it can suppress that the cutting line SL formed by the scribe wheel SW largely escapes from an original line. .

When the cutting line SL is formed, the first groove G1, the second groove G2, and the cutting line are cut on the predetermined line (for example, the cutting line of the OLED substrate P1) to the OLED substrate P1. The line SL is formed to overlap. As a result, the OLED substrate P1 is cut along the predetermined line.

As described above, in the cutting method of the OLED substrate P1 according to the present embodiment, the first groove G1 is formed in the first PET layer L2 and the first adhesive layer L4 by the irradiation of the laser light L. After forming and forming the second groove G2 in the second PET layer L3 and the second adhesive layer L5, the cutting line SL is formed in the PI layer by the scribe wheel SW.

Since the cutting line SL is not formed in the PI layer after the formation of one of the first grooves G1 or the second grooves G2, the other of the first grooves G1 or the second grooves G2 is laser lighted ( By irradiating L), it can suppress that the contact bonding layer (1st contact bonding layer L4, 2nd contact bonding layer L5) melt | dissolved during formation to the processing table 13 via a cutting line SL, for example. . That is, PI layer L1 turns into a "cover", and it can suppress that a melted adhesive layer blows off to the process table 13.

In the said cutting method, the contact bonding layer (adhesive) melt | dissolved in the process table 13 is ejected, and it does not adhere. Therefore, the adhesive adheres to the OLED substrate P1 and the other OLED substrate P1 during cutting, so that the emitting surface of the OLED substrate P1 is contaminated by the adhered adhesive, and / or the carbonized adhesive by heating. Is attached between the wirings and short-circuits can be suppressed. As a result, the yield of an OLED element can be improved.

Moreover, in the said cutting method, since the ejection of the adhesive agent to the processing table 13 in the cutting of OLED substrate P1 is suppressed, it corresponds to the cutting part of OLED substrate P1 in the processing table 13. I do not need processing such as pitting part.

2. Other Embodiments

As mentioned above, although one Embodiment of this invention was described, this invention is not limited to the said embodiment, A various change is possible in the range which does not deviate from the summary of invention. In particular, the plurality of embodiments and modifications described herein can be arbitrarily combined as necessary.

The cutting method of said OLED substrate P1 is applicable also to the multilayer substrate formed from several resin layers other than OLED substrate P1. Moreover, the said cutting method can also be applied also to multilayer board | substrates which have layers (for example, metal layer) other than a resin layer.

The cutting of the PI layer L1 using the scribe wheel SW inverts the OLED substrate P1 again after the formation of the second groove G2 so that the first groove G1 faces upward, and the first groove ( The cutting line SL may be formed in the PI layer L1 while passing the scribe wheel SW through G1).

In this case, at least, in the first groove G1 through which the scribe wheel SW passes, the opening angle θ is in the range of 45 ° to 100 °, and / or the groove width is 40 μm to 200 It is preferable to exist in the range of micrometer.

Thereby, the 1st groove | channel G1 through which the scribe wheel SW passes is functioning as a "guide," and it can suppress that the cutting line SL formed by the scribe wheel SW is largely deviated from the original line. .

In the above, the OLED substrate P1 had three layers (PI layer (L1), first PET layer (L2), second PET layer (L3)), but a substrate having two layers, and four layers. The above cutting method can also be applied to a substrate having the above-mentioned layer.

The structure of the laser apparatus 3, the scribe wheel cutting device 5, and the machine drive system 7 is not limited to the structure demonstrated by said embodiment.

The shape of OLED substrate P1 is not specifically limited.

The present invention can be widely applied to cutting of flexible OLEDs.

1: cutting device
3: laser device
5: scribe wheel cutting device
SW: scribe wheel
7: machine drive system
11: bed
13: machining table
15: moving device
9: control unit
L: laser light
P1: OLED substrate
L1: PI layer
L2: first PET layer
L3: second PET layer
L4: first adhesive layer
L5: second adhesive layer
G1: first groove
G2: 2nd home
SL: Cutting Line
W: groove width
θ: opening angle

Claims (4)

Cutting a multilayer substrate comprising a first PET layer, a PI layer, a second PET layer, a first adhesive layer for adhering the first PET layer to the PI layer, and a second adhesive layer for adhering the second PET layer to the PI layer As a way to,
A first laser cutting step of forming a first groove in the first PET layer and the first adhesive layer by laser irradiation;
A second laser cutting step of forming a second groove in the second PET layer and the second adhesive layer in correspondence with the first groove by laser irradiation after the first laser cutting step;
And a wheel cutting step of forming a cut in the PI layer while passing a wheel cutting means through the first groove or the second groove after the second laser cutting step. The method of claim 1,
The opening angle of the groove | channel through which the said wheel cutting means passes at least in the said wheel cutting step among the said 1st groove | channel or the said 2nd groove | channel is a method of cutting | disconnecting a multilayer board | substrate. The method according to claim 1 or 2,
The width | variety of the groove | channel which passes the said wheel cutting means in at least the said wheel cutting step among the said 1st groove | channel or the said 2nd groove | channel is a method of cutting | disconnecting a multilayer board | substrate. Cutting a multilayer substrate comprising a first PET layer, a PI layer, a second PET layer, a first adhesive layer for adhering the first PET layer to the PI layer, and a second adhesive layer for adhering the second PET layer to the PI layer As a device to
Laser cutting to form a first groove in the first PET layer and the first adhesive layer by laser irradiation, and to form a second groove in the second PET layer and the second adhesive layer in correspondence with the first groove. Sudan,
And a wheel cutting means for forming a cut in the PI layer while passing through the first groove or the second groove after formation of the first groove and the second groove.

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