JP2007237188A - Laser scribing method and laminated substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser scribing method in which, with pattern damage of a laminated substrate taken into consideration, a reformed layer can be formed in a deep position in the thickness direction of the laminated substrate, and also to provide an electrooptical apparatus and electronic equipment. <P>SOLUTION: In the laser scribing method, in a droplet discharging head 10 as the laminated substrate in which a plurality of first and second laminated members 12, 13 are dividedly formed on the surface of the sealed substrate 11, a reformed layer Rc is formed inside the sealed substrate 11 by emitting a laser beam 60 to a laser irradiation surface S2 of the sealed substrate 11 corresponding to a gap between the adjacent first laminated members 12. The method includes a refractive substance arranging process in which a silicon material 41 is arranged on the laser irradiation surface S2 and a laser irradiation process in which the laser beam 60 is emitted to the laser irradiation surface S2 through the silicon material 41. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a laser scribing method for cutting a multilayer substrate and a multilayer substrate cut by the laser scribing method.

  Conventionally, a laser scribing method for cutting a laminated substrate using laser light is known. For example, in the laser scribing method described in Patent Document 1, the laser beam condensing point is set inside the laminated substrate to be cut, that is, the laser beam power density is maximized at the condensing point. By applying light and utilizing the phenomenon of multiphoton absorption, a modified layer is formed at the condensing point. And the method of cut | disconnecting from the modification | reformation area | region by applying external force to a laminated substrate is used.

JP 2002-192371 A

  However, in a laminated substrate in which a laminated member is formed on the surface of the base material, in order to prevent damage to the laminated member due to laser light irradiation, the laser irradiation surface of the base material is irradiated with laser light so as to avoid the laminated member. There is a need. For this reason, the irradiation width of the laser beam is limited, the laser irradiation width on the laser irradiation surface is narrowed, and the modified layer cannot be formed deeply from the laser irradiation surface with respect to the thickness direction of the substrate. there were.

  The present invention has been made to solve the above problems, and its purpose is to prevent damage to the laminated member of the laminated substrate, and to form a modified layer at a deep position with respect to the thickness direction of the base material. Another object of the present invention is to provide a laser scribing method and a laminated substrate.

  In order to solve the above-described problem, in the present invention, a laminated substrate in which a plurality of laminated members are partitioned on the surface of a base material, and facing the laser irradiation surface of the base material corresponding to the space between adjacent laminated members. A laser scribing method for irradiating a laser beam to form a modified layer inside a substrate, wherein a refractive material arranging step of arranging a refractive material having a refractive index larger than at least air above the laser irradiation surface; And a laser irradiation step of irradiating a laser beam toward the laser irradiation surface through a refractive material.

  According to the laser scribing method of the present invention, the irradiated laser light is incident on the refractive material toward the laser irradiation surface of the substrate. The incident laser light is refracted in the refractive material according to the refractive index of the refractive material, and is incident on the laser irradiation surface of the substrate through the refractive material. The laser light incident on the laser irradiation surface of the base material is refracted according to the refractive index of the base material, and is condensed inside the base material. Therefore, the laser beam condensed toward the laser irradiation surface of the base material is refracted by the refractive material before being incident on the laser irradiation surface of the base material. The laser irradiation width on the laser irradiation surface is longer than the incident light, and the modified layer can be formed by condensing the laser beam at a position deep in the thickness direction of the base material from the laser irradiation surface of the base material. .

  In the refractive material arrangement step of the laser scribing method of the present invention, the refractive material may be arranged at a position where the condensing point of the laser reaches the opposite surface of the laser irradiation surface.

  According to this, if the laser irradiation is performed toward one of the surfaces of the base material, the modified layer is formed almost in the entire thickness direction of the base material. It is not necessary to irradiate and processing work can be simplified.

  In the laser irradiation step of the laser scribing method of the present invention, the laser beam may be irradiated so that the laser irradiation width on the refractive member is within the width between the adjacent laminated members.

  According to this, since the laser beam is not irradiated to the laminated member by irradiating the laser beam within the width between the laminated substrates, damage to the laminated member due to the laser beam irradiation can be prevented. Can do.

  In the refractive material arranging step of the laser scribing method of the present invention, the refractive material may be a silicon material.

  According to this, the laser light is refracted by the refractive index of the silicon material as the refractive material, and the refracted laser light is incident on the laser irradiation surface of the base material. The modified layer can be formed by condensing light.

  In the refractive material arrangement step of the laser scribing method of the present invention, the refractive material may be a lens material.

  According to this, the laser light is refracted by the refractive index of the lens material as a refractive material, and the refracted laser light is incident on the laser irradiation surface of the base material. Can be condensed to form a modified layer.

  In the refractive material arranging step of the laser scribing method of the present invention, the refractive material may be composed of two or more different materials.

  According to this, the laser light is condensed at a position deep in the thickness direction of the base material from the laser irradiation surface of the base material, and a modified layer can be formed. Since the laser beams having different refractive indexes are incident on the base material through the above substances, two or more condensing points can be formed inside the base material, and the modified layer can be efficiently formed. it can.

  In the refractive material arrangement step of the laser scribing method of the present invention, the mask may be arranged so that the mask is provided with a refractive material and the refractive material of the mask is positioned above the laser irradiation surface.

  According to this, since the refractive material is arranged using the mask, workability can be improved.

  In the refractive material arrangement step of the laser scribing method of the present invention, a refractive material may be arranged, and a suppressing member that suppresses transmission of laser light may be arranged above the laminated member.

  According to this, since the suppressing member that suppresses the transmission of the laser light is disposed on the upper portion of the laminated member, it is possible to prevent the laminated member from being damaged by the irradiation of the laser light.

  The gist of the laminated substrate of the present invention is that it has been processed by the laser scribing method described above.

  According to this, it is possible to simplify the cutting work by forming the modified layer at a deep position with respect to the thickness direction of the base material in consideration of the damage of the laminated member of the laminated substrate, so that the inexpensive and highly reliable lamination is achieved. A substrate can be provided.

  Hereinafter, first to third embodiments of the present invention will be described with reference to the drawings.

[First embodiment]
(Mother board configuration)
First, the configuration of the mother board will be described. 1 shows an outline of a mother substrate, FIG. 1 (a) shows a plan view, and FIG. 1 (b) shows a cross-sectional view taken along line AA of FIG. 1 (a).

  As shown in FIGS. 1A and 1B, the mother substrate 1 includes a sealing substrate 11 as a base material, a first laminated member 12 as a laminated member, and a second laminated member on the surface of the sealing substrate 11. The laminated member 13 is formed, and the droplet discharge heads 10 as a plurality of laminated substrates are partitioned and configured. One droplet discharge head 10 irradiates laser light toward the laser irradiation surface S <b> 2 or S <b> 3 of the sealing substrate 11 between the divided droplet discharge heads 10. The substrate is cut by forming the modified layer and divided from the mother substrate 1.

(Configuration of laminated substrate)
Next, the configuration of the multilayer substrate will be described. FIG. 2 is a cross-sectional view showing a configuration of a droplet discharge head as a laminated substrate.

  In FIG. 2, the droplet discharge head 10 includes a sealing substrate 11 as a base material made of silicon single crystal, a first laminated member 12 formed on one surface of the sealing substrate 11, and a sealing substrate 11. It is comprised with the 2nd lamination | stacking member 13 etc. which were formed in the other surface. The first laminated member 12 includes a compliance substrate 14 having a supply hole 21 for supplying a functional liquid, and the second laminated member 13 includes an actuator substrate 15 and a nozzle hole 31 bonded to the actuator substrate 15. It has a nozzle plate 30 having it. The actuator substrate 15 includes a drive film 22, a wiring 25 for applying a voltage to the drive unit 22a that is a part of the drive film 22, and a silicon oxide layer 26a and a zirconium oxide layer 26b that are in contact with the drive unit 22a. The pressure chamber member 27 includes an elastic film 26 and a pressure chamber 27a.

(Configuration of laser irradiation device)
Next, a laser irradiation apparatus for forming a modified layer inside the sealing substrate 11 of the mother substrate 1 will be described. FIG. 3 is a schematic diagram showing the configuration of the laser irradiation apparatus.

  As shown in FIG. 3, the laser irradiation apparatus 100 includes a laser light source 101 that emits pulsed laser light, a dichroic mirror 102 that reflects the emitted pulsed laser light, and a condenser lens that collects the reflected pulsed laser light. 103. In addition, a stage 107 on which the mother substrate 1 to be processed is placed, and an X-axis slide unit 110 and a Y-axis slide unit 108 that move the stage 107 in the X and Y axis directions with respect to the condenser lens 103 are provided. ing. In addition, a Z-axis slide mechanism 104 that adjusts the position of the focusing point of the pulsed laser light by changing the position of the focusing lens 103 in the Z-axis direction with respect to the mother substrate 1 placed on the stage 107 is provided. . Furthermore, an imaging device 112 is provided that is located on the opposite side of the condenser lens 103 with the dichroic mirror 102 interposed therebetween.

  The laser irradiation apparatus 100 includes a main computer 120 that controls each of the above components. The main computer 120 includes an image processing unit 124 that processes image information captured by the imaging apparatus 112 in addition to a CPU and various memories. is doing. The imaging device 112 incorporates a coaxial incident light source and a CCD (solid-state imaging device). Visible light emitted from the coaxial incident light source passes through the condenser lens 103 and is focused.

  Connected to the main computer 120 are an input unit 125 for inputting data of various processing conditions used in laser processing and a display unit 126 for displaying various information at the time of laser processing. In addition, a laser control unit 121 that controls the output, pulse width, and pulse period of the laser light source 101, and a lens control unit 122 that drives the Z-axis slide mechanism 104 to control the position of the condenser lens 103 in the Z-axis direction. It is connected. Further, a stage control unit 123 that drives a servo motor (not shown) that moves the X-axis slide unit 110 and the Y-axis slide unit 108 along the rails 109 and 111, respectively, is connected.

  The Z-axis slide mechanism 104 that moves the condensing lens 103 in the Z-axis direction has a built-in position sensor capable of detecting the moving distance, and the lens control unit 122 detects the output of the position sensor and collects the light. The position of the lens 103 in the Z-axis direction can be controlled. Therefore, the thickness of the substrate W can be measured by moving the condenser lens 103 in the Z-axis direction so that the focus of the visible light emitted from the coaxial incident light source of the imaging device 112 is aligned with the surface of the substrate W. It is.

  The laser light source 101 is an Nd: YAG laser that generates pulsed laser light. Other lasers that can be used for the laser light source 101 include an Nd: YVO 4 laser, an Nd: YLF laser, and a titanium sapphire laser.

  In this embodiment, the stage 107 is supported by the Y-axis slide unit 108, but is supported by the X-axis slide unit 110 by reversing the positional relationship between the X-axis slide unit 110 and the Y-axis slide unit 108. It is good also as a form. Moreover, it is preferable to support the stage 107 on the Y-axis slide part 108 via a θ table (not shown). According to this, it is possible to make the mother substrate W more perpendicular to the optical axis 101a.

(Laser scribing method)
Next, the laser scribing method according to this embodiment will be described. FIG. 4 is a process diagram showing a laser scribing method in the present embodiment.

  In the refractive material arrangement step of FIG. 4A, a refractive material having a refractive index larger than at least air is arranged above the laser irradiation surface S2. In the present embodiment, the silicon material 41 as a refractive material is disposed. The silicon material 41 is disposed so as to substantially cover the laser irradiation surface S2, and when the laser beam is irradiated, the silicon material 41 is appropriately high so that the condensing point of the laser light substantially reaches the opposite surface of the laser irradiation surface S2. Adjusted. Further, the silicon material 41 is provided in the mask 40, and the mask 40 is arranged so that the silicon material 41 of the mask 40 is positioned above the laser irradiation surface S2.

  The mask 40 is provided with a suppression member 42 that suppresses the transmission of laser light, and the mask 40 is disposed so that the suppression member 42 is positioned above the first laminated member 12. The suppressing member 42 is for suppressing the transmission of the laser beam by reflecting, absorbing, scattering, etc. the irradiated laser beam and preventing the first laminated member 12 from being damaged. For example, a metal material or a resin material can be used for the suppressing member 42. The suppression member 42 does not need to be provided so as to cover the entire surface of the first laminated member 12, and may be provided at least near the region irradiated with the laser light.

  In the laser irradiation step of FIG. 4B, the laser irradiation apparatus 100 is used to focus the laser light emitted from the laser light source 101 toward the laser irradiation surface S <b> 2 through the silicon material 41. Then, the laser beam 60 is irradiated in the direction perpendicular to the laser irradiation surface S2 and along the planned cutting line L so that the condensing point P1 of the laser beam 60 is located inside the sealing substrate 11. At this time, irradiation is performed so that the irradiation width of the laser light 60 on the laser irradiation surface S1 of the silicon material 41 is within the width W between the adjacent first laminated members 12.

  The laser beam 60 is scanned while irradiating the laser beam 60 along the planned cutting line L with a condensing point set at a position P1 that reaches the surface opposite to the laser irradiation surface S2. Thereafter, the position of the condensing point is moved in the Z-axis direction so that the position of the condensing point approaches the laser irradiation surface S <b> 2, and scanning is performed along the planned cutting line L while irradiating the laser beam 60. The modified layer Rc along the planned cutting line L is formed by scanning a plurality of times until the position P2 of the condensing point is reached.

  In the dividing step of FIG. 4C, an external force is applied to the laminated substrate 10, so that stress is applied to the modified layer Rc, and the sealing substrate 11 is cut starting from the modified layer Rc. Divided.

  Therefore, according to the first embodiment, there are the following effects.

  (1) The laser beam 60 irradiated to the laser irradiation surface S2 of the sealing substrate 11 so that the irradiation width of the laser beam 60 is within the width W between the first laminated members 12 is irradiated with the laser beam of the silicon material 41. Incident on the surface S1. The incident laser beam 60 is refracted according to the refractive index of the silicon material 41 and is incident on the laser irradiation surface S <b> 2 through the silicon material 41. The laser light 60 incident on the laser irradiation surface S <b> 2 is refracted according to the refractive index of the sealing substrate 11 and is condensed inside the sealing substrate 11. Therefore, since the laser beam 60 irradiated toward the laser irradiation surface S2 is refracted by the silicon material 41 before being incident on the laser irradiation surface S2, the laser beam 60 is directly incident on the laser irradiation surface S2. However, the irradiation width of the laser beam 60 on the laser irradiation surface S2 becomes longer, and the laser beam 60 is condensed at a deep position in the thickness direction of the sealing substrate 11 from the laser irradiation surface S2, thereby forming the modified layer Rc. it can.

  (2) Since the suppression member 42 that suppresses the transmission of the laser beam 60 is disposed above the first stacked member 12, the irradiation width of the laser beam 60 on the laser irradiation surface S <b> 2 of the silicon material 41 is the first stacked member 12. Even if the gap width W is exceeded, damage to the first laminated member 12 can be prevented.

[Second Embodiment]
Next, a second embodiment will be described. Note that the configuration of the mother substrate, the configuration of the droplet discharge head as the laminated substrate, and the configuration of the laser irradiation apparatus are the same as those in the first embodiment, and a description thereof will be omitted.

(Laser scribing method)
FIG. 5 is a process diagram showing a laser scribing method in the present embodiment.

  In the refractive material arrangement step of FIG. 5A, a refractive material having a refractive index larger than at least air is arranged above the laser irradiation surface S2. In the present embodiment, the lens material 51 as a refractive material is disposed. The lens material 51 is disposed so as to substantially cover the laser irradiation surface S2, and the lens so that the condensing point of the laser light almost reaches the opposite surface of the laser irradiation surface S2 when the laser light is irradiated. The curvature, installation height, etc. are adjusted accordingly.

  In the laser irradiation process of FIG. 5B, the laser irradiation apparatus 100 is used to focus the laser light emitted from the laser light source 101 toward the laser irradiation surface S <b> 2 through the lens material 51. Then, the laser beam 60 is irradiated in the direction perpendicular to the laser irradiation surface S2 and along the planned cutting line L so that the condensing point P1 of the laser beam 60 is located inside the sealing substrate 11. At this time, irradiation is performed so that the irradiation width of the laser light 60 on the laser irradiation surface S1 of the lens material 51 is within the width W between the adjacent first laminated members 12.

  The laser beam 60 is scanned while irradiating the laser beam 60 along the planned cutting line L with a condensing point set at a position P1 that reaches the surface opposite to the laser irradiation surface S2. Thereafter, the position of the condensing point is moved in the Z-axis direction so that the position of the condensing point approaches the laser irradiation surface S <b> 2, and scanning is performed along the planned cutting line L while irradiating the laser beam 60. The modified layer Rc along the planned cutting line L is formed by scanning a plurality of times until the position P2 of the condensing point is reached.

  In the dividing step of FIG. 5C, by applying an external force to the laminated substrate 10, stress is applied to the modified layer Rc, and the sealing substrate 11 is cut starting from the modified layer Rc. Divided.

  Therefore, according to said 2nd Embodiment, there exists an effect shown below.

  (1) The laser beam 60 irradiated to the laser irradiation surface S <b> 2 of the sealing substrate 11 so that the irradiation width of the laser beam 60 is within the width W between the first laminated members 12 is irradiated with the laser beam of the lens material 51. Incident on the surface S1. The incident laser beam 60 is refracted according to the refractive index of the lens material 51 and is incident on the laser irradiation surface S <b> 2 through the lens material 51. The laser beam 60 incident on the laser irradiation surface S <b> 2 is refracted according to the refractive index of the sealing substrate 11 and is condensed inside the sealing substrate 11. Accordingly, since the laser beam 60 irradiated toward the laser irradiation surface S2 is refracted by the lens material 51 before being incident on the laser irradiation surface S2, the laser beam 60 is directly incident on the laser irradiation surface S2. However, the irradiation width of the laser beam 60 on the laser irradiation surface S2 becomes longer, and the laser beam 60 is condensed at a deep position in the thickness direction of the sealing substrate 11 from the laser irradiation surface S2, thereby forming the modified layer Rc. it can.

[Third embodiment]
Next, a third embodiment will be described. Note that the configuration of the mother substrate, the configuration of the droplet discharge head as the laminated substrate, and the configuration of the laser irradiation apparatus are the same as those in the first embodiment, and a description thereof will be omitted.

(Laser scribing method)
FIG. 6 is a process diagram showing the laser scribing method in the present embodiment.

  In the refractive substance arrangement step of FIG. 6A, two or more different refractive substances having a refractive index larger than at least air are arranged above the laser irradiation surface S2. In the present embodiment, the refractive member 61 made of the silicon material 61a and the optical glass 61b is disposed as the refractive material. Of the two materials, the refractive member 61 has a smaller refractive index disposed in the center portion, and a larger refractive index disposed in the outer peripheral portion thereof. In the present embodiment, since the refractive index of the optical glass 61b is smaller than that of the silicon material 61a, the optical glass 61b is disposed at the center of the refractive member 61, and the silicon material 61a is disposed at the outer periphery of the optical glass 61b. Is done. The refracting member 61 is disposed so as to substantially cover the laser irradiation surface S2, and when the laser beam is irradiated, the refractive point 61 of the lens so that the condensing point of the laser beam almost reaches the opposite surface of the laser irradiation surface S2. The curvature, installation height, etc. are adjusted as appropriate.

  In the laser irradiation process of FIG. 6B, the laser irradiation apparatus 100 is used to focus the laser light emitted from the laser light source 101 toward the laser irradiation surface S <b> 2 through the refractive member 61. Then, the laser beam 60 is irradiated inside the sealing substrate 11 in a direction perpendicular to the laser irradiation surface S2 and along the planned cutting line L. At this time, irradiation is performed so that the irradiation width of the laser beam 60 on the laser irradiation surface S1 of the refractive member 61 is within the width W between the adjacent first laminated members 12.

  Laser light 60 applied to the refraction member 61 is refracted by the silicon material 61a and the optical glass 61b, and laser light 60a and 60b having different refraction angles are incident on the laser irradiation surface S2. Among these, the condensing point of the laser beam 60a is set at a position P1 that reaches the surface opposite to the laser irradiation surface S2, and the condensing point of the laser beam 60b is at a position P2 of the central portion of the thickness of the sealing substrate 11. Scanning is performed while irradiating the laser beam 60 along the scheduled cutting line L. Thereafter, the position of the condensing point is moved in the Z-axis direction so that the position of the condensing point approaches the laser irradiation surface S <b> 2, and scanning is performed along the planned cutting line L while irradiating the laser beam 60. Then, the modified layer Rc along the planned cutting line L is formed by scanning a plurality of times until reaching the condensing point position P3.

  In the dividing step of FIG. 6C, by applying an external force to the laminated substrate 10, stress is applied to the modified layer Rc, and the sealing substrate 11 is cut starting from the modified layer Rc. Divided.

  Therefore, according to the third embodiment, there are the following effects.

  (1) The laser beam 60 irradiated to the laser irradiation surface S <b> 2 of the sealing substrate 11 so that the irradiation width of the laser beam 60 is within the width W between the first laminated members 12 is irradiated with the laser beam of the refractive member 61. Incident on the surface S1. The incident laser beam 60 is refracted according to the refractive index of each of the silicon material 61a and the optical glass 61b constituting the refraction member 61, and is incident on the laser irradiation surface S2 via the refraction member 61. The laser beams 60a and 60b incident on the laser irradiation surface S2 are refracted according to the refractive index of the sealing substrate 11, and are condensed at two different points (P1 and P2) inside the sealing substrate 11. Accordingly, since the laser beam 60 irradiated toward the laser irradiation surface S2 is refracted by the refractive member 61 before being incident on the laser irradiation surface S2, the laser beam 60 is directly incident on the laser irradiation surface S2. However, the irradiation width of the laser beam 60 on the laser irradiation surface S2 is increased, and the laser beam 60 is condensed at a deep position in the thickness direction of the sealing substrate 11 from the laser irradiation surface S2, and the modified layer Rc can be formed. Since two different condensing points are formed inside the stop substrate 11, the modified layer can be formed efficiently.

  The present invention is not limited to the above-described embodiment, and the following modifications are given.

  (Modification 1) In the first to third embodiments, as the refractive material, the refractive member 61 composed of the silicon material 41, the lens material 51, the silicon material 61a and the optical glass 61b is arranged, but the invention is not limited to this. As the refractive material, a refractive material having a refractive index larger than at least air may be disposed. For example, quartz, optical glass, diamond, etc., or a combination thereof may be used. Even in this case, since the laser beam 60 is refracted before the laser beam 60 is irradiated on the laser irradiation surface S2 of the multilayer substrate 11, the laser beam 60 is condensed at a deep position in the thickness direction of the multilayer substrate 10. In addition, the modified layer Rc can be formed.

  (Modification 2) In the first to third embodiments, the silicon material 41, the lens material 51, and the refractive member 61 are disposed above the laser irradiation surface S2 of the sealing substrate 11, but the present invention is not limited to this. For example, you may contact | connect the laser irradiation surface S2. Even in this case, the laser beam 60 can be refracted before the laser beam 60 is incident on the laser irradiation surface S2.

  (Modification 3) In the first to third embodiments, the laser beam 60 is irradiated toward the laser irradiation surface S2, but the present invention is not limited to this. The laser beam 60 may be irradiated toward the laser irradiation surface S3 on the second laminated member 13 side. In this case, a refractive material may be disposed above the laser irradiation surface of the sealing substrate 11 on the second laminated member 13 side. Even in this case, the irradiated laser beam 60 is incident on the sealing substrate 11 through the refractive material, so that the laser beam 60 is condensed and modified at a deep position in the thickness direction of the laminated substrate 10. The layer Rc can be formed.

  (Modification 4) In the second embodiment, the convex lens material 51 is used as the refractive material, but the present invention is not limited to this. For example, a Fresnel lens or a gravity lens may be used. Even in this case, the laser beam 60 can be refracted, and the refracted laser beam 60 is formed with a plurality of condensing points inside the sealing substrate 11, so that the modified layer Rc can be efficiently used. It can be formed well.

  (Modification 5) In the second and third embodiments, the lens material 51 and the refracting member 61 are disposed above the laser irradiation surface S2, but may be disposed using a mask as in the first embodiment. Furthermore, a suppressing member 42 that suppresses the transmission of the laser beam 60 may be disposed on the first laminated member 12. In this way, workability can be improved by preventing damage to the first laminated member 12 due to irradiation of the laser beam 60 and using the mask.

  (Modification 6) In the first to third embodiments, a solid refractive material is used, but the present invention is not limited to this. For example, it may be a liquid, for example, water or ethyl alcohol can be used. Even in this case, the laser beam 60 can be refracted before entering the laser irradiation surface S <b> 2 of the sealing substrate 11.

  (Modification 7) Although the first to third embodiments have been described using the droplet discharge head 10 as a laminated substrate, the present invention is not limited to this. For example, the laminated substrate may be a semiconductor device. Even in this case, it is possible to easily divide the semiconductor chip configured for each pattern partitioned on the silicon substrate by irradiating the laser beam without damaging the pattern.

The structure of a laminated substrate is shown, (a) is a top view, (b) schematic sectional drawing. The structure of a droplet discharge head is shown, (a) is a top view, (b) is a schematic sectional drawing. The schematic diagram which shows the structure of a laser irradiation apparatus. Process drawing which shows the laser scribing method in 1st Embodiment. Process drawing which shows the laser scribing method in 2nd Embodiment. Process drawing which shows the laser scribing method in 3rd Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Mother substrate, 10 ... Droplet discharge head as laminated substrate, 11 ... Sealing substrate as base material, 12 ... First laminated member as laminated member, 13 ... Second laminated member as laminated member, 40 ... Mask: 41... Silicon material as refractive material, 42... Suppressing member, 51. Lens material as refractive material, 60, 60 a, 60 b... Laser light, 61. Silicon material, 61b ... Optical glass constituting the refractive member, 100 ... Laser irradiation device, L ... Cutting line, S1, S2, S3 ... Laser irradiation surface, W ... First laminated member width, P1, P2 ... Condensing Point position, Rc ... modified layer.

Claims (9)

A laminated substrate in which a plurality of laminated members are partitioned on the surface of a base material, wherein the base material is irradiated with laser light toward the laser irradiation surface of the base material corresponding to the space between the adjacent laminated members. A laser scribing method for forming a modified layer inside
A refractive substance arranging step of arranging a refractive substance having a refractive index larger than at least air above the laser irradiation surface;
And a laser irradiation step of irradiating the laser beam toward the laser irradiation surface through the refractive material. The laser scribing method according to claim 1, wherein
In the refractive material arranging step, the refractive material is arranged at a position where a condensing point of the laser reaches a surface opposite to the laser irradiation surface. The laser scribing method according to claim 1 or 2,
In the laser irradiation step, the laser scribing method is characterized in that the laser beam is irradiated so that a laser irradiation width on the refractive member is within a width between adjacent laminated members. In the laser scribing method according to any one of claims 1 to 3,
The laser scribing method, wherein in the refractive material arranging step, the refractive material is a silicon material. In the laser scribing method according to any one of claims 1 to 3,
In the refractive material arranging step, the refractive material is a lens material. In the laser scribing method according to any one of claims 1 to 5,
In the refractive material arranging step, the refractive material is composed of two or more different materials. In the laser scribing method according to any one of claims 1 to 6,
In the refractive material arranging step, the mask is arranged so that the refractive material is provided in a mask, and the refractive material of the mask is positioned above the laser irradiation surface. In the laser scribing method according to any one of claims 1 to 7,
In the refractive material arranging step, the refractive material is arranged, and a suppressing member for suppressing the transmission of the laser light is arranged above the laminated member. A laminated substrate processed by the laser scribing method according to claim 1.

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