JP2020053208A - Method and apparatus for cutting substrate pieces - Google Patents

Abstract

To form a cutting line for cutting out a substrate piece on a multilayer substrate while maintaining a state where a PET layer is easily peeled off from the substrate piece.SOLUTION: A method of cutting out a substrate piece SP1 that extends in an X direction and a Y direction and in which a first PET layer L2 is peeled off at one end in the Y direction, from a multilayer substrate P1 composed of the first PET layer L2, a PI layer L1, a second PET layer L3, a first adhesive layer L4, and a second adhesive layer L5, includes: a step of forming a plurality of first cutting lines SL1 extending in the Y direction on the multilayer substrate P1 at intervals corresponding to the width in the X direction of the substrate pieces SP1; and a peeling cutting line forming step of forming a fourth cutting line SL4 that extends in the X direction and peels off the first PET layer L2 from one end in the Y direction of the substrate piece SP1.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method of cutting out a substrate piece from a multilayer substrate including a first PET layer, a PI layer, and a second PET layer, and an apparatus for cutting out a substrate piece from the multilayer substrate.

2. Description of the Related Art Conventionally, there has been known a method of cutting one substrate small piece from a multilayer substrate on which a plurality of substrate small pieces such as an OLED substrate are formed.
When cutting a substrate piece from a multilayer substrate, a cutting line is formed along the side of each cut piece. As a method for forming a cutting line on the multilayer substrate, there is known a method of irradiating a laser beam from one surface of the multilayer substrate to form a cutting line along a desired line (for example, Patent Document 1). See).

In a small piece of a substrate on which an electric circuit such as an OLED substrate is formed, a protective layer is provided to protect an electric circuit which is weak against oxidation of the OLED or the like. Therefore, the multilayer substrate from which the substrate pieces are cut out includes a polyimide (PI) substrate layer (hereinafter referred to as a PI layer) having an electric circuit formed on the surface thereof, and a polyethylene terephthalate (PET) bonded to the PI layer via an adhesive layer. ) And a protective layer (referred to as a PET layer).
A connection terminal for connecting the electric circuit to an external circuit is formed on the surface of the PI layer on which the electric circuit is formed.

  In a small piece of substrate having a PI layer on which an electric circuit and a connection terminal are formed and a PET layer for protecting the same, a portion of the PI layer where the electric circuit is formed needs to be protected by the PET layer, while the formation of the connection terminal The part must be exposed to the outside. Therefore, after cutting out the substrate piece from the multilayer substrate, the PET layer is peeled from the portion of the substrate piece where the connection terminal is formed.

JP 2018-15784 A

  As described above, in the multilayer substrate, the PET layer is adhered to the PI layer by the adhesive layer (adhesive). In this case, when a cutting line for cutting out a substrate piece is formed on the multilayer substrate by laser irradiation, the state of the adhesive layer may change due to the laser irradiation. It is presumed that the change in the state of the adhesive layer makes it difficult to peel the PET layer from the substrate pieces.

  SUMMARY OF THE INVENTION An object of the present invention is to form a cutting line for cutting out a small piece of a substrate in a multilayer substrate while maintaining a state in which the PET layer is easily peeled from the small piece of a substrate when cutting the small piece of the substrate from the multilayer substrate.

Hereinafter, a plurality of modes will be described as means for solving the problems. These embodiments can be arbitrarily combined as needed.
A cutting method according to an aspect of the present invention is a method of cutting a substrate piece from a multilayer substrate. The multilayer substrate includes a first PET layer, a PI layer, a second PET layer, a first adhesive layer for bonding the first PET layer to the PI layer, and a second adhesive layer for bonding the second PET layer to the PI layer. The substrate piece is a substrate extending in the first direction and the second direction. In the substrate piece, the first PET layer is peeled off at one end in the first direction. The method for cutting out a substrate piece includes the following steps.
A first cutting line forming step of forming a plurality of first cutting lines extending along the first direction on the multilayer substrate at intervals corresponding to the width of the substrate piece in the second direction;
ピ ー A peeling cutting line forming step that extends along the second direction after the first cutting line forming step and forms a peeling cutting line for peeling the first PET layer from one end of the substrate piece in the first direction.

In the above cutting method, a peeling cut line extending in the second direction for peeling the first PET layer from one end of the substrate piece is formed after the formation of the first cut line extending in the first direction.
By setting the cutting lines in the above order, it is possible to minimize the damage caused to the peeling cutting lines. Therefore, the cutting lines for cutting the substrate pieces while maintaining the state where the PET layer is easily peeled from the substrate pieces are maintained. Can be formed on a multilayer substrate.

The method for cutting out a substrate piece may further include the following steps.
◎ After the first cutting line forming step, a second cutting line extending in the second direction is formed at a portion of the multilayer substrate corresponding to the side of the small piece of the substrate opposite to the side from which the first PET layer is peeled. 2 cutting line forming step.
◎ After forming the second cutting line, forming a third cutting line extending in the second direction at a position of the multilayer substrate corresponding to a side of the small piece of the substrate from which the first PET layer is peeled. Step.
This makes it possible to form a cutting line for cutting out the substrate piece on the multilayer substrate while maintaining a state where the PET layer is easily peeled from the substrate piece.

The first cutting line, the second cutting line, and the third cutting line may include a groove formed in the first PET layer and the first adhesive layer, and a PI cutting line formed in the PI layer. In this case, the above-described clipping method may further include the following steps.
◎ forming a fourth groove at a position corresponding to the position where the first cutting line of the second PET layer and the second adhesive layer is formed by irradiating the first laser beam;
Forming a fifth groove at a position corresponding to a position where the second cutting line and the third cutting line of the second PET layer and the second adhesive layer are formed by irradiating the first laser beam;
This makes it possible to reliably cut out the substrate pieces.

The first cutting line forming step may include the following steps.
◎ forming a first groove at a position where a first cutting line of the first PET layer and the first adhesive layer is formed by irradiating the first laser beam;
Forming a first PI cutting line in the PI layer while passing the wheel cutting means through the first groove;
Thereby, the cutting line can be efficiently formed by the method of forming the cutting line most suitable for the PET layer and the PI layer.

The second cutting line forming step may include the following steps.
◎ forming a second groove at a position where a second cutting line of the first PET layer and the first adhesive layer is formed by irradiating the first laser beam;
Forming a fourth cutting line on the first PET layer and the first adhesive layer for peeling the first PET layer from the substrate piece by irradiating the first laser beam;
Forming a second PI cutting line in the PI layer while passing the wheel cutting means through the second groove;
This makes it possible to efficiently form a cutting line and simultaneously form a peeling cutting line by a method for forming a cutting line that is optimal for the PET layer and the PI layer.

The third cutting line forming step may include the following steps.
Forming a third groove at a position where a third cutting line of the first PET layer and the first adhesive layer is formed by irradiating the first laser beam;
Forming a third PI cutting line in the PI layer by irradiating the second laser beam through the third groove;
The third PI cutting line can be formed by an optimal method of forming a cutting line at a position where the PET layer of the PI layer is peeled off.

The peeling cutting line forming step may include a step of forming a groove corresponding to the peeling cutting line in the first PET layer and the first adhesive layer by irradiating the first laser beam.
Thereby, the peeling cut line can be formed by the method most suitable for the first PET layer and the first adhesive layer.

A cutting device according to another aspect of the present invention is a device for cutting a substrate piece from a multilayer substrate. The multilayer substrate is a substrate including a first PET layer, a PI layer, a second PET layer, a first adhesive layer that adheres the first PET layer to the PI layer, and a second adhesive layer that adheres the second PET layer to the PI layer. The substrate piece is a substrate that extends in the first direction and the second direction and has a first PET layer peeled off at one end in the first direction.
The cutting device includes first cutting line forming means.
The first cutting line forming means forms a plurality of first cutting lines extending along the first direction on the multilayer substrate at intervals corresponding to the width of the substrate pieces in the second direction. Thereafter, the first cutting line forming means extends along the second direction and forms a peeling cutting line for peeling the first PET layer from one end of the substrate piece in the first direction.

In the above-described cutting device, the first cutting line forming means forms the peeling cutting line extending in the second direction for peeling the first PET layer from one end of the substrate piece after forming the first cutting line extending in the first direction. Has formed.
By setting the cutting lines in the above order, it is possible to minimize the damage caused to the peeling cutting lines. Therefore, the cutting lines for cutting the substrate pieces while maintaining the state where the PET layer is easily peeled from the substrate pieces are maintained. Can be formed on a multilayer substrate.

  When cutting out a small piece of substrate from which the first PET layer has been peeled off at one end from a multilayer substrate composed of a first PET layer, a PI layer, and a second PET layer, the small piece extends in the second direction and extends from one end of the small piece of substrate in the first direction. By forming the peeling cut line for peeling the first PET layer after forming the first cutting line extending along the first direction, the peeling line for the first PET layer is maintained while maintaining the state where the first PET layer is easily peeled off from the substrate piece. Can be formed on the multilayer substrate.

The figure which shows the cross-section of a multilayer substrate. The figure which shows the plane structure of a multilayer substrate. The figure which shows the structure of the cutting-out apparatus which concerns on 1st Embodiment. The figure which shows the structure of a cutting device. The figure which shows the structure of a peeling apparatus. The figure which shows typically the case where the cutting method of the board | substrate small piece is seen from the upper surface direction of a multilayer board. FIG. 1 is a diagram schematically illustrating a method of cutting out a substrate piece when viewed from a cross-sectional direction of a multilayer substrate (part 1). The figure (the 2) which shows typically the case where the cutting method of the board piece is seen from the section direction of the multilayer board.

1. First Embodiment (1) Structure of Multilayer Substrate Hereinafter, a method for cutting a substrate piece from a multilayer substrate according to an embodiment of the present invention will be described. In the following, a method of cutting out a substrate piece SP1 including one OLED layer d from a multilayer substrate in which a plurality of OLED layers d are formed in an array will be described as an example of a method of cutting out the substrate piece SP1. Therefore, first, the configuration of the multilayer substrate P1 will be described with reference to FIGS. FIG. 1 is a diagram showing a cross-sectional structure of a multilayer substrate. FIG. 1A shows a cross-sectional structure of the multilayer substrate viewed from the Y direction, and FIG. 1B shows a cross-sectional structure of the multilayer substrate viewed from the X direction. FIG. 2 is a diagram illustrating a planar structure of the multilayer substrate.
1 and 2, the horizontal direction of the multilayer substrate P1 is defined as “X direction”, and the vertical direction is defined as “Y direction”. The vertical direction (Y direction) of the multilayer substrate P1 is defined as a first direction, and the horizontal direction (X direction) is defined as a second direction.

The multilayer substrate P1 is a rectangular substrate extending in the X and Y directions. The multilayer substrate P1 has a three-layer structure, and includes a PI layer L1, a first PET layer L2, and a second PET layer L3.
The PI layer L1 is a substrate made of polyimide (PI). As shown in FIG. 2, on one surface of the PI layer L1, a plurality of OLED layers d (organic LEDs) are formed in an array in the X and Y directions. Specifically, for example, a light emitting layer, a driving element (for example, a TFT (thin film transistor)) for controlling light emission by the light emitting layer, and a wiring of the OLED layer d are formed.
Each OLED layer d formed on the multilayer substrate P1 is cut out from the multilayer substrate P1 as a substrate piece SP1.

At one end of the OLED layer d in the Y direction (first direction), a connection portion d1 for connecting the OLED layer d to an external circuit is formed. A protective film (for example, a SiO ₂ film) for protecting the OLED layer d from moisture in the air is formed at the connection part d1.

The first PET layer L2 and the second PET layer L3 are films made of polyethylene terephthalate (PET), and protect the OLED layer d formed on the surface of the PI layer L1. However, the first PET layer L2 corresponding to the connection part d1 of the OLED layer d is peeled off when the OLED layer d is cut out as the substrate piece SP1.
The first PET layer L2 is bonded to the surface of the PI layer L1 on the side where the OLED layer d is formed by the first adhesive layer L4. The first adhesive layer L4 is formed of, for example, an acrylic or urethane-based adhesive.
On the other hand, the second PET layer L3 is bonded to the surface of the PI layer L1 on the side opposite to the side on which the OLED layer d is formed by the second adhesive layer L5. The second adhesive layer L5 is formed of, for example, an acrylic or urethane-based adhesive.

(2) Extraction device Next, the configuration of the extraction device 1 of the present embodiment will be described with reference to FIG. FIG. 3 is a diagram illustrating a configuration of the cutting device according to the first embodiment. The cutting device 1 cuts out the substrate small piece SP1 including one OLED layer d from the multilayer substrate P1 having the above configuration, and the first PET layer L2 in the region corresponding to the connection part d1 of the OLED layer d of the substrate small piece SP1. And an apparatus for separating the first adhesive layer L4 from the substrate small piece SP1.
The cutting device 1 includes a transport device 3, a cutting device 5, and a peeling device 7.
The transport device 3 is a device for transporting the multilayer substrate P1 to the cutting device 5 and the peeling device 7. The transport device 3 is, for example, a belt conveyor. The cutting device 5 is installed in the transport device 3 on the upstream side in the transport direction of the multilayer substrate P1. The peeling device 7 is installed in the transport device 3 on the downstream side of the cutting device 5 in the transport direction of the multilayer substrate P1.

(2-1) Cutting Apparatus The cutting apparatus 5 is an apparatus that forms a cutting line (scribe line) for cutting out the substrate piece SP1 from the multilayer substrate P1. Hereinafter, the configuration of the cutting device will be described with reference to FIG. FIG. 4 is a diagram illustrating a configuration of the cutting device.
The cutting device 5 includes a first cutting line forming unit 51, a second cutting line forming unit 53, a mechanical drive system 55, and a control unit 57.

The first cutting line forming means 51 includes a cutting line (scribe line) for cutting out the substrate piece SP1 from the multilayer substrate P1, and a fourth cutting line SL4 (for separating the first PET layer L2 from one end of the substrate piece SP1). This is an apparatus for forming a peeling cutting line. When forming the cutting line for cutting out the substrate piece SP1, the first cutting line forming means 51 forms a groove in the PET layer and the adhesive layer of the multilayer substrate P1 by irradiating a laser beam, and a scribe wheel in the groove. A cutting line (referred to as a PI cutting line) is formed in the PI layer L1 through the SW (described later).
On the other hand, when forming the fourth cutting line SL4 for peeling off the first PET layer L2 from one end of the substrate piece SP1, the first cutting line forming means 51 uses the laser beam to irradiate the PET layer of the multilayer substrate P1 with the PET layer. A groove corresponding to the fourth cutting line SL4 is formed in the adhesive layer.
Specifically, the first cutting line forming means 51 includes a first laser device 51A and a scribe wheel cutting device 51B.

The first laser device 51A has a laser oscillator that outputs the first laser light LA1, and a transmission optical system that transmits the first laser light LA1 to a mechanical drive system 55 described later (both are shown). Zu). Although not shown, the transmission optical system includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. The transmission optical system has, for example, an X-axis direction moving mechanism (not shown) for moving a laser irradiation head (not shown) incorporating a laser oscillator and other optical systems in the X-axis direction. ing. The laser oscillator of the first laser device 51A is, for example, a CO ₂ laser.

The scribe wheel cutting device 51B is a device that cuts a substrate by rolling a scribe wheel SW (an example of a wheel cutting unit). In the present embodiment, the scribe wheel cutting device 51B is used for forming a PI cutting line on the PI layer L1 of the multilayer substrate P1.
The scribe wheel SW is a disk-shaped member having an outer peripheral portion formed in a V-shape. The outer peripheral portion of the scribe wheel SW serves as a blade for forming a PI cutting line in the PI layer L1. The scribe wheel SW has a diameter of, for example, 5 to 15 mm, and the apex angle of the V-shaped cutting edge is set to 20 to 50 °.

The second cutting line forming means 53 forms a PI cutting line on the PI layer L1 by irradiating the PI layer L1 with the second laser beam LA2 through a groove formed in the first PET layer L2 and the first adhesive layer L4. It is a device to do.
The second cutting line forming means 53 includes a laser oscillator that outputs the second laser light LA2, and a transmission optical system that transmits the second laser light LA2 to a mechanical drive system 55 to be described later (all of them). Not shown). Although not shown, the transmission optical system includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. The transmission optical system has, for example, an X-axis direction moving mechanism (not shown) for moving a laser irradiation head (not shown) incorporating a laser oscillator and other optical systems in the X-axis direction. ing. The laser oscillator of the second cutting line forming means 53 is, for example, a UV laser.

As described above, the connection portion d1 of the OLED layer d has the protective film such as SiO ₂ formed thereon and is brittle. If an attempt is made to form a cutting line on the brittle connection part d1 using a scribe wheel SW or the like, the connection part d1 and / or the OLED layer d may be broken.
Therefore, the connection line d1 of the OLED layer d forms a cutting line by irradiation with the second laser beam LA2. This makes it possible to form a cutting line for cutting out the substrate piece SP1 in the vicinity of the connection portion d1 without breaking the brittle protective layer or the like.

The mechanical drive system 55 is a mechanism that moves the multilayer substrate P1 in the horizontal direction and rotates around the central axis. Specifically, the mechanical drive system 55 includes a bed 55A, a processing table 55B on which the multilayer substrate P1 is placed, and a moving device 55C that moves the processing table 55B in the horizontal direction with respect to the bed 55A. I have. The moving device 55C is a known mechanism having a guide rail, a moving table, a rotating mechanism, a motor, and the like.
In the cutting device 5 of the present embodiment, the moving device 55C moves the multilayer substrate P1 relative to the first cutting line forming unit 51 and the second cutting line forming unit 53, thereby cutting the multilayer substrate P1. Form a line.

  The mechanical drive system 55 includes a mechanism for rotating the multilayer board P1 (the processing table 55B) and a mechanism for turning the multilayer board P1 upside down (both not shown).

The control unit 57 has a processor (for example, CPU), a storage device (for example, ROM, RAM, HDD, SSD, etc.), and various interfaces (for example, A / D converter, D / A converter, communication interface, etc.). It is a computer system. The control unit 57 performs various control operations by executing a program stored in the storage unit (corresponding to part or all of the storage area of the storage device).
The control unit 57 may be configured by a single processor, or may be configured by a plurality of independent processors for each control.

Although not shown, a sensor for detecting the size, shape and position of the multilayer board P1, sensors and switches for detecting the state of each device, and an information input device are connected to the control unit 57, although not shown.
In this embodiment, the control unit 57 can control the first cutting line forming unit 51, the second cutting line forming unit 53, and the moving device 55C.

(2-2) Peeling Device The peeling device 7 is a device for peeling the first PET layer L2 from the connection part d1 formed at one end in the first direction of the substrate piece SP1 (multilayer substrate P1). The peeling device 7 of the present embodiment is a device that peels off the first PET layer L2 from the substrate piece SP1 by bonding the first PET layer L2 to be peeled off with a tape and separating the tape from the multilayer substrate P1. .
Hereinafter, the configuration of the peeling device will be described with reference to FIG. FIG. 5 is a diagram illustrating a configuration of the peeling device. The peeling device 7 mainly includes a table 71, an adhesive tape 73, and a pressure roller 75.

  The table 71 is a table for fixing and mounting the multilayer substrate P1 from which the first PET layer L2 is to be peeled. In the present embodiment, the table 71 fixes the multilayer substrate P1 to the table 71 by bringing the space between the multilayer substrate P1 and the table 71 into a vacuum state.

  The adhesive tape 73 is arranged in a state of being bridged between the delivery bobbin 73A and the winding bobbin 73B with the adhesive surface facing the multilayer substrate P1 side. The delivery bobbin 73A is a bobbin that sends out the adhesive tape 73. The take-up bobbin 73B is a bobbin that takes up the adhesive tape 73 sent from the sending bobbin 73A.

The pressure roller 75 is a roller that presses the adhesive surface of the adhesive tape 73 bridged between the delivery bobbin 73A and the winding bobbin 73B against the surface of the first PET layer L2 with a predetermined force. Further, the pressure roller 75 is movable in the first direction of the multilayer substrate P1 in a state where the adhesive surface of the adhesive tape 73 is pressed against the surface of the first PET layer L2.
As the pressure roller 75 moves in the first direction, the adhesive surface of the adhesive tape 73 pressed by the first PET layer L2 separates from the multilayer substrate P1, and at the same time, the PET layer adhered to the adhesive surface becomes the multilayer substrate. Peeled from P1 (substrate piece SP1).

  The moving direction of the pressure roller 75 when the PET layer is peeled off is not limited to the first direction of the multilayer substrate P1, but may be a second direction perpendicular to the first direction. Alternatively, the pressure roller 75 may move in an arbitrary direction within a horizontal plane (a plane parallel to the main surface of the multilayer substrate P1).

  In addition, the peeling device 7 includes a control unit (not shown) that controls the pressure roller 75, the delivery bobbin 73A, and the winding bobbin 73B. The control unit is a computer system having a processor, a storage device, and various interfaces.

(3) Cutting Method of Substrate Piece Hereinafter, a method of cutting a substrate piece SP1 including one OLED layer d from a multilayer substrate P1 in which a plurality of OLED layers d are formed in an array will be described with reference to FIGS. explain. FIG. 6 is a diagram schematically illustrating a method of cutting out a substrate piece when viewed from the upper surface direction of the multilayer substrate. 7 and 8 are diagrams schematically showing a method of cutting out a small piece of a substrate when viewed from a cross-sectional direction of a multilayer substrate.
For simplicity of description, in FIG. 6, a portion of the multilayer substrate P1 where two OLED layers d, two in the horizontal direction and two in the vertical direction, are formed is cut out to obtain a small piece of substrate. The method for cutting out SP1 is shown. On the other hand, FIGS. 7 and 8 show a method of cutting out a substrate piece SP1 by cutting out a portion where one OLED layer d is formed in the multilayer substrate P1.

  In the following description, it is assumed that the moving device 55C of the cutting device 5 can linearly move the multilayer substrate P1 on the processing table 55B in one direction. That is, in the following description, it is assumed that the cutting device 5 can scan the first cutting line forming unit 51 and the second cutting line forming unit 53 only in one direction of the multilayer substrate P1 placed on the processing table 55B. I do.

Before cutting, the first PET layer L2 of the multilayer substrate P1 is placed on the processing table 55B so that the Y direction of the multilayer substrate P1 is parallel to the moving direction of the multilayer substrate P1 in the cutting device 5. The multilayer substrate P1 is placed.
After placing the multilayer substrate P1 on the processing table 55B, the first cutting line forming means 51 sets the plurality of first cutting lines SL1 extending along the Y direction (first direction) in the X direction (second direction) of the substrate piece SP1. ) Is formed on the multilayer substrate P1 with an interval corresponding to the width in the (direction) (first cutting line forming step).

Specifically, as shown in FIGS. 6A and 7A, a first groove G1 is formed at a position where the first cutting line SL1 of the first PET layer L2 and the first adhesive layer L4 is formed. Form.
The first groove G1 is moved by the moving device 55C while the first laser device 51A irradiates the first laser beam LA1 to the position where the first cutting line SL1 of the first PET layer L2 and the first adhesive layer L4 is formed by the first laser device 51A. The first laser beam LA1 can be formed by scanning the multilayer substrate P1 along the Y direction.
It is preferable that the groove formed by the first laser beam LA1 has an opening angle θ in a range of 45 ° to 100 °. The opening angle θ is defined as the angle formed by the two side walls of the groove. Further, the groove width is preferably in the range of 40 μm to 200 μm.

After forming the first groove G1, as shown in FIG. 6B and FIG. 7B, the scribe wheel SW is passed through the first groove G1, and the position corresponding to the first groove G1 of the PI layer L1 is formed. Then, a first PI cutting line PS1 is formed.
Specifically, the multi-layer substrate P1 is moved in the Y direction while the scribe wheel SW is passed through the first groove G1 and the cutting edge of the scribe wheel SW is pushed into the PI layer L1 while applying a predetermined load. The first PI cutting line PS1 can be formed by rolling the SW.
As described above, the first cutting line SL1 constituted by the first groove G1 and the first PI cutting line PS1 can be formed at a position corresponding to the side extending in the Y direction (first direction) of the substrate piece SP1.

After forming the first cutting line SL1, the multilayer substrate P1 is rotated by 90 ° so that the X direction of the multilayer substrate P1 is parallel to the moving direction of the multilayer substrate P1 by the moving device 55C.
After rotating the multilayer substrate P1 by 90 °, a cutting line is formed at a position corresponding to a side in the X direction (second direction) of the substrate piece SP1.
In the present embodiment, among the two sides of the substrate piece SP1 extending in the X direction, first, at a position of the multilayer substrate P1 corresponding to the side of the substrate piece SP1 opposite to the side where the first PET layer L2 is peeled off, The second cutting line SL2 is formed (second cutting line forming step).

Specifically, as shown in (c) of FIG. 6 and (c) of FIG. 7, a position (connection part d1) where the second cutting line SL2 of the first PET layer L2 and the first adhesive layer L4 is formed exists. A second groove G2 is formed at a position corresponding to the side opposite to the side).
The second groove G2 is moved by the moving device 55C while the first laser device 51A irradiates the first laser beam LA1 to the position where the second cutting line SL2 of the first PET layer L2 and the first adhesive layer L4 is formed by the first laser device 51A. The first laser beam LA1 can be formed by scanning the multilayer substrate P1 along the X direction.

In addition, as shown in FIGS. 6C and 7C, in the present embodiment, the X of the multilayer substrate P1 that can be formed by irradiating the first laser beam LA1 simultaneously with the formation of the second groove G2. Other grooves extending in the direction are also formed. Specifically, the third groove G3 and the fourth cutting line SL4 are simultaneously formed in the first PET layer L2 and the first adhesive layer L4 (peeling cutting line forming step).
The third groove G3 is a groove for forming a third cutting line SL3 described later. The fourth cutting line SL4 is a groove for peeling the first PET layer L2 from one end of the substrate piece SP1 in the Y direction.

The third groove G3 is formed by the first laser device 51A at a position where the third cutting line SL3 of the first PET layer L2 and the first adhesive layer L4 is formed (a position corresponding to the side on the side where the connection portion d1 exists). It can be formed by scanning the first laser beam LA1 along the X direction of the multilayer substrate P1 by moving the moving device 55C while irradiating one laser beam LA1.
The fourth cutting line SL4 is located at a position where the first laser device 51A forms the fourth cutting line SL4 of the first PET layer L2 and the first adhesive layer L4 (a position corresponding to a boundary between the OLED layer d and the connection part d1). ) Is irradiated with the first laser beam LA1, while the moving device 55C moves to scan the first laser beam LA1 along the X direction of the multilayer substrate P1.

After forming the second groove G2, the third groove G3, and the fourth cutting line SL4, as shown in FIGS. 6D and 7D, the scribe wheel SW is passed through the second groove G2, A second PI cutting line PS2 is formed in the PI layer L1 at a position corresponding to the second groove G2.
Accordingly, the second groove G2 and the second PI cutting line PS2 are formed at positions corresponding to the side of the substrate piece SP1 extending in the X direction (second direction) on the side where the first PET layer L2 is not peeled. A second cutting line SL2 to be formed can be formed.

After the formation of the second cutting line SL2, the multilayer substrate corresponding to the other of the two sides of the substrate piece SP1 extending in the X direction (second direction), that is, the side on which the first PET layer L2 is peeled off. A third cutting line SL3 is formed at the position P1 (third cutting line forming step).
Specifically, as shown in (e) of FIG. 6 and (e) of FIG. 8, the second laser beam LA2 output from the second cutting line forming means 53 has already been formed as described above. By irradiating the PI layer L1 through the third groove G3, a third PI cutting line PS3 is formed in the PI layer L1.
Thereby, a third cutting line SL3 constituted by the third groove G3 and the third PI cutting line PS3 can be formed at a position corresponding to the side on which the first PET layer L2 is peeled off.

  After forming the first to fourth cutting lines SL1 to SL4, the multilayer substrate P1 is turned upside down, and the multilayer substrate P1 is further rotated by 90 °. Accordingly, in a state where the second PET layer L3 of the multilayer substrate P1 faces upward, the Y direction of the multilayer substrate P1 is parallel to the moving direction of the multilayer substrate P1 by the moving device 55C.

After the reversal of the front and back of the multilayer substrate P1 and the 90 ° rotation, as shown in FIGS. 6F and 8F, the multilayer substrate P1 corresponds to the first cutting line SL1 of the second PET layer L3 and the second adhesive layer L5. A fourth groove G4 is formed at the position where the fourth groove G4 will be formed.
The fourth groove G4 is moved by the moving device 55C while irradiating the first laser beam LA1 to the position corresponding to the first cutting line SL1 of the second PET layer L3 and the second adhesive layer L5 by the first laser device 51A. The first laser beam LA1 can be formed by scanning the multilayer substrate P1 along the Y direction.

After forming the fourth groove G4 in the second PET layer L3, the multilayer substrate P1 is rotated by 90 ° so that the X direction of the multilayer substrate P1 is parallel to the moving direction of the multilayer substrate P1 by the moving device 55C.
Thereafter, as shown in FIG. 6G and FIG. 8G, a fifth PET line L3 and a second adhesive layer L5 are placed at positions corresponding to the second cutting line SL2 and the third cutting line SL3. A groove G5 is formed.

  The fifth groove G5 is irradiated with the first laser beam LA1 by the first laser device 51A at a position corresponding to the second cutting line SL2 and the third cutting line SL3 of the second PET layer L3 and the second adhesive layer L5, The first laser beam LA1 can be formed by scanning the multilayer substrate P1 along the X direction by moving the moving device 55C.

  After forming the first cutting line SL1 to the fourth cutting line SL4 for cutting the substrate piece SP1 from the multilayer substrate P1 as described above, the multilayer substrate P1 on which these cutting lines are formed is separated by the transport device 3. It is transported to the device 7. The first PET layer L2 existing in the region corresponding to the connection portion d1 of the substrate piece SP1 is peeled by the peeling device 7.

Further, the first cutting line SL1 to the third cutting line SL3 formed on the multilayer substrate P1, as shown in FIGS. 6H and 8H, the X direction (second direction) and the Y direction. A substrate piece SP1 extending in the (first direction) and including one OLED layer d can be cut out from the multilayer substrate P1.
In addition, as shown in FIG. 8H, in the cut-out substrate piece SP1, the first PET layer L2 and the first adhesive layer L4 do not exist at a position corresponding to the connection portion d1 of the OLED layer d. A first PET layer L2 and a second PET layer L3 are present at the position.
That is, only the connection portion d1 is exposed, and other portions of the OLED layer d are protected by the first PET layer L2 and the second PET layer L3.

(4) Summary In the cutting method for cutting out the substrate piece SP1 from the multilayer substrate P1 described with reference to FIGS. 6 to 8 described above, the X direction for peeling the first PET layer L2 from one end of the substrate piece SP1 in the Y direction. Is formed after the formation of the first cutting line SL1 extending in the Y direction. Further, other cutting lines (second cutting lines SL2 and third cutting lines SL3) extending in the X direction are also formed after the formation of the first cutting lines SL1.

  When forming a cutting line in the above-mentioned multilayer substrate P1, generally, after forming a cutting line extending in one direction and then forming a cutting line extending in another direction intersecting this cutting line, the cutting line formed first The cut line formed earlier may be damaged, for example, when the cut PET layer is re-fused.

  Therefore, by forming the fourth cutting line SL4 extending in the X direction after forming the first cutting line SL1 extending in the Y direction, damage to the fourth cutting line SL4 (and the third cutting line SL3) is minimized. Since the first PET layer L2 can be easily peeled off from the substrate piece SP1, a cutting line for cutting out the substrate piece SP1 can be formed on the multilayer substrate P1.

  On the other hand, even if the first cutting line SL1 is damaged by the formation of the fourth cutting line SL4, there is no problem in cutting the substrate piece SP1 from the multilayer substrate P1. This is because the cutting of the substrate piece SP1 from the multilayer substrate P1 is performed by holding the vicinity of the first cutting line SL1 of the multilayer substrate P1 and adsorbing the substrate piece SP1 to separate the substrate piece SP1 from the multilayer substrate P1. This is because the fusion of the PET layer at the time of forming the cutting line can be broken at the time of the separation.

In order to confirm the above effects, as a comparative example, as a comparative example, a fourth cutting line SL4 for separating the first PET layer L2 and a cutting line on two sides extending in the X direction of the substrate piece SP1 (second cutting line SL2, third cutting line SL3). A cutting line SL3) was first formed, and then two side cutting lines (first cutting lines SL1) extending in the Y direction were formed, and the first PET layer L2 was peeled off from the substrate piece SP1.
As a result, in the comparative example described above, the first PET layer L2 could not be appropriately peeled after 30 trials out of 720 trials of the first PET layer L2. That is, in the case of the comparative example, the failure rate of the peeling of the first PET layer L2 was about 4%.

  On the other hand, when the above-described cutting method of the present embodiment is used, that is, when the fourth cutting line SL4 is formed after the formation of the first cutting line SL1, the peeling of the first PET layer L2 is performed 240 times. Even if it tried, peeling of the first PET layer L2 did not fail. That is, in the case of the present embodiment, the failure rate of the peeling of the first PET layer L2 was 0%.

In the present embodiment, means for cutting each layer of the multilayer substrate P1 is different. Specifically, the formation of the cutting line (groove) in the PET layer and the adhesive layer is performed by irradiating the first laser beam LA1. The cutting lines corresponding to the three sides other than the side extending in the X direction of the connection portion d1 are formed on the PI layer L1 by the scribe wheel SW. Further, formation of a cutting line corresponding to a side extending in the X direction of the connection portion d1 on the PI layer L1 is performed by irradiating the second laser beam LA2.
Thereby, the cutting line can be efficiently formed by the method of forming the cutting line most suitable for the PET layer and the PI layer.

2. Other Embodiments One embodiment of the present invention has been described above, but the present invention is not limited to the above embodiment, and various modifications can be made without departing from the gist of the invention. In particular, a plurality of embodiments and modifications described in this specification can be arbitrarily combined as needed.
The device formed in the PI layer L1 is not limited to the OLED layer d. Even when another flexible device is formed in the PI layer L1, the above-described method for cutting out the substrate small piece SP1 can be used.

In the above description, the multilayer substrate P1 has three layers (the PI layer L1, the first PET layer L2, and the second PET layer L3). However, the multilayer substrate P1 has two layers and a substrate having four or more layers. However, the above cutting method can be applied.
The shape of the multilayer substrate P1 and / or the substrate piece SP1 is not particularly limited.

  The configuration of the cutting device 5 and / or the peeling device 7 is not limited to the configuration described in the above embodiment. For example, the mechanical drive system 55 of the cutting device 5 may have a mechanism for rotating the processing table 55B and the moving device 55C.

The moving device 55C is not limited to linearly moving the multilayer substrate P1 in one direction, but may be movable in any horizontal direction. In this case, the moving device 55C may be capable of moving the multilayer substrate P1 in both the X direction and the Y direction without rotating the multilayer substrate P1.
Accordingly, the first cutting line forming means 51 and the second cutting line forming means 53 can be scanned in both the X direction and the Y direction of the multilayer substrate P1 only by the movement of the moving device 55C.

  INDUSTRIAL APPLICABILITY The present invention can be widely applied to cutting out a small piece of a substrate from a multilayer substrate.

REFERENCE SIGNS LIST 1 cutout device 3 transfer device 5 cutting device 51 first cutting line forming means 51A first laser device LA1 first laser beam 51B scribe wheel cutting device SW scribe wheel 53 second cutting line forming device LA2 second laser beam 55 mechanical drive System 55A Bed 55B Processing table 55C Moving device 57 Control unit 7 Peeling device 71 Table 73 Adhesive tape 73A Feeding bobbin 73B Winding bobbin 75 Pressure roller P1 Multilayer substrate SP1 Substrate d d OLED layer d1 Connection part L1 PI layer L2 First PET layer L3 Second PET layer L4 First adhesive layer L5 Second adhesive layer SL1 First cutting line SL2 Second cutting line SL3 Third cutting line SL4 Fourth cutting line G1 First groove G2 Second groove G3 Third groove G4 Fourth groove G5 Fifth groove PS1 First PI cutting line PS2 Second PI cutting line PS3 Third PI cutting line θ Opening angle

Claims (8)

From a multilayer substrate comprising a first PET layer, a PI layer, a second PET layer, a first adhesive layer for bonding the first PET layer to the PI layer, and a second adhesive layer for bonding the second PET layer to the PI layer, A method of cutting out a substrate piece extending in a first direction and a second direction, wherein the first PET layer is peeled off at one end in the first direction,
A first cutting line forming step of forming a plurality of first cutting lines extending along the first direction on the multilayer substrate at intervals corresponding to the width of the substrate piece in the second direction;
Forming a peeling cut line extending along the second direction and forming a peeling cut line for peeling the first PET layer from one end of the substrate piece in the first direction after the first cutting line forming step; When,
A cutting method comprising: After the first cutting line forming step, a second cutting line extending in the second direction is formed on the multi-layer substrate corresponding to a side of the substrate piece opposite to a side on which the first PET layer is peeled off. Forming a second cutting line at a location;
After the second cutting line forming step, a third cutting line extending in the second direction is formed at a position of the multilayer substrate corresponding to a side of the substrate piece on which the first PET layer is peeled. A third cutting line forming step;
The clipping method according to claim 1, further comprising: The first cutting line, the second cutting line, and the third cutting line include a groove formed in the first PET layer and the first adhesive layer, and a PI cutting line formed in the PI layer. Have
Forming a fourth groove at a position corresponding to the position where the first cutting line of the second PET layer and the second adhesive layer is formed by irradiating the first laser beam;
Forming a fifth groove at a position corresponding to the position where the second cutting line and the third cutting line of the second PET layer and the second adhesive layer are formed by the irradiation of the first laser light; ,
The clipping method according to claim 2, further comprising: The first cutting line forming step includes:
Forming a first groove in the first PET layer and the first adhesive layer at a position where the first cutting line is formed by irradiating the first laser beam;
Forming a first PI cutting line in the PI layer while passing a wheel cutting means through the first groove;
The cutting method according to claim 3, comprising: The second cutting line forming step includes:
Forming a second groove in the first PET layer and the first adhesive layer at a position where the second cutting line is formed by irradiating the first laser beam;
Forming the peeling cut line on the first PET layer and the first adhesive layer by irradiating the first laser beam;
Forming a second PI cutting line in the PI layer while passing a wheel cutting means through the second groove;
The clipping method according to claim 3, comprising: The third cutting line forming step includes:
Forming a third groove in the first PET layer and the first adhesive layer at a position where the third cutting line is formed by irradiating the first laser beam;
Irradiating a second laser beam through the third groove to form a third PI cutting line in the PI layer;
The cutting method according to any one of claims 3 to 5, comprising:   The peeling cutting line forming step includes a step of forming a groove corresponding to the peeling cutting line in the first PET layer and the first adhesive layer by irradiating a first laser beam. Cutting method described in 1. From a multilayer substrate comprising a first PET layer, a PI layer, a second PET layer, a first adhesive layer for bonding the first PET layer to the PI layer, and a second adhesive layer for bonding the second PET layer to the PI layer, A cutting device that cuts out a substrate piece that extends in a first direction and a second direction and has the first PET layer peeled off at one end in the first direction,
A plurality of first cutting lines extending along the first direction are formed on the multilayer substrate at intervals corresponding to the width of the substrate piece in the second direction, and then extend along the second direction. A cutting device, comprising: a first cutting line forming unit that forms a peeling cutting line for peeling the first PET layer from one end of the substrate piece in the first direction.

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