CN112108779A

CN112108779A - Method and apparatus for cutting multilayer substrate

Info

Publication number: CN112108779A
Application number: CN202010523634.0A
Authority: CN
Inventors: 上野勉
Original assignee: Mitsuboshi Diamond Industrial Co Ltd
Current assignee: Mitsuboshi Diamond Industrial Co Ltd
Priority date: 2019-06-21
Filing date: 2020-06-10
Publication date: 2020-12-22
Also published as: KR20200145693A; TW202102075A; JP2021000690A

Abstract

A method and apparatus for cutting a multilayer substrate, which does not adhere to molten debris of an adhesive layer on a stage. The cutting method of the multilayer substrate comprises the following steps: a first cutting step of scanning the first resin layer (1) for CO₂Laser to form a completely cut first cut portion (S1); a second cutting step of forming a second cut portion (S2) completely cut on the second resin layer (2) by moving the UV laser or the cutting wheel; and a third cutting step ofThe multi-layer substrate (W) is inverted and CO is scanned toward the third resin layer₂Laser forming a completely cut third cut portion (S3), CO in the first cutting step and the third cutting step₂The laser light is a focused beam that is focused on the processing surface of the irradiated resin layer or a side thereof, and is set to an output within the following range: the adhesive layer flows out to the opening of the cutting part without melting during processing.

Description

Method and apparatus for cutting multilayer substrate

Technical Field

The present invention relates to a method and an apparatus for cutting a multilayer substrate formed by sequentially laminating a first resin layer, a second resin layer, and a third resin layer via adhesive layers, respectively. In particular, the present invention relates to a method and apparatus for cutting a multi-layer substrate such as a flexible OLED substrate: the first resin layer and the third resin layer are formed of a polyethylene terephthalate (PET) layer, and the intermediate second resin layer is formed of a Polyimide (PI) layer.

Background

As a method for cutting a multilayer substrate, there are methods disclosed in

patent documents

1 and 2, which have been proposed by the present applicant. In the cutting method, the first resin layer and the adhesive layer are cut with a laser beam, the intermediate second resin layer is cut with a cutting wheel with a laser beam different from the above, and the third resin layer and the adhesive layer are cut with a laser beam while turning the substrate upside down.

Documents of the prior art

Patent document

Patent document 1: japanese patent laid-open publication No. 2019-5893

Patent document 2: japanese patent laid-open publication No. 2018-89702

Disclosure of Invention

Technical problem to be solved by the invention

However, according to this cutting method, when the multilayer substrate is inverted and the third resin layer is cut with the laser beam, the adhesive layer starts to melt due to the heating of the laser beam, and the adhesive layer passes through the cut portion of the second resin layer processed before and flows down to the upper surface of the stage serving as the work table, and may become chips and adhere to the upper surface of the stage. If the debris adheres, the surface of the substrate to be processed is damaged by contact with the solidified debris, and the substrate floats and cannot be precisely cut. Therefore, it is necessary to clean the debris. However, once the adhered debris cannot be easily removed, the removal work is very labor-intensive, and this hinders the continuous mass production work process.

As a solution to the problem of debris adhering to such a platform, for example, as shown in fig. 5, the following method is considered: a receiving groove 16 is processed on the stage 15 along the predetermined cutting line L of the substrate W, and debris is accumulated in the receiving groove 16. However, since the sizes of the unit articles to be cut are various and the position of the cutting line is different for each article, a dedicated platform having a receiving groove to match the cutting line must be prepared, and the replacement work is troublesome. Further, as a substrate cutting apparatus, since it is also used for cutting a single board without an adhesive layer or various substrates, there is a demand for a substrate cutting apparatus that can be used for cutting various substrates including a multilayer substrate without replacing a stage.

Accordingly, an object of the present invention is to solve the above-described problems and to provide a method and an apparatus for cutting a multilayer substrate, in which molten debris of an adhesive layer does not adhere to a stage.

Means for solving the technical problem

In order to solve the above technical problems, the present invention proposes the following technical solutions. That is, the present invention is a method for cutting a multilayer substrate in which a first resin layer, a second resin layer, and a third resin layer are sequentially laminated via adhesive layers, respectively, the method comprising the steps of:

a first cutting step of scanning CO toward the surface of the first resin layer₂Laser to form a completely cut first cut portion exposing the second resin layer; a second cutting step of forming a completely cut second cut portion on the second resin layer by running a UV laser or a cutting wheel along the first cut portion; and a third cutting step of inverting the multilayer substrate and scanning CO toward the surface of the third resin layer along the second cutting portion₂Laser to form a completely cut third cut, the CO in the first and third cutting steps₂The laser is a focused beam that focuses on the surface of the resin layer being irradiated or beside it, and is set to an output in the range of: the adhesive layer flows out to the openings of the first cut portion and the third cut portion without melting at the time of processing.

Here, it is preferable that the CO is₂The output of the laser is 6-16W, and the diameter of the irradiation point on the processed surface is 30-130 μm.

In addition, according to another aspect of the present invention, there is provided a cutting apparatus for cutting a multilayer substrate in which a first resin layer, a second resin layer, and a third resin layer are sequentially laminated via adhesive layers, wherein the cutting apparatus is characterized in thatThe cutting device comprises: a laser irradiation port for scanning CO with a focused beam on the surfaces of the first and third resin layers₂Laser-cutting the first cut portion and the third cut portion into completely divided groove shapes; a cutting unit forming a second cut portion on the second resin layer along the first cut portion; and a control unit for controlling the CO₂The laser is irradiated with an output in the following range: the adhesive layer flows out to the openings of the first cut portion and the third cut portion without melting during cutting.

Effects of the invention

According to the invention, in the presence of CO₂When the third resin layer is laser-cut, the adhesive layer does not start to melt and flow out, and therefore, the occurrence of a problem that molten debris adheres to the stage can be eliminated. In addition, due to the passage of CO₂Since the diameter of the irradiation point of the processing surface is reduced by the focused laser beam and the light energy can be concentrated in a minute processing range, the cut portion that is completely cut can be formed with the output of suppressing the heating of the peripheral portion of the cut portion. This can prevent the adhesive layer from melting and flowing out during cutting. In addition, since the irradiation spot diameter of the processed surface is small, the opening width of the cut portion can be formed narrow and the material utilization efficiency can be improved.

Drawings

Fig. 1 is a cross-sectional view showing an example of a multilayer substrate cut by the cutting method according to the present invention.

Fig. 2 is an explanatory view showing an embodiment of the cutting device according to the present invention.

Fig. 3 is a cross-sectional view showing the steps of the dicing method according to the present invention.

Fig. 4 is a table showing an example of data of a cutting experiment according to the cutting method according to the present invention.

Fig. 5 is a perspective view showing a platform provided with a groove for solving the debris problem.

Detailed Description

Hereinafter, a method and an apparatus for cutting a multilayer substrate according to the present invention will be described in detail with reference to the drawings. As shown in fig. 1, the multilayer substrate according to the present invention is a substrate W in which a first resin layer 1, a second resin layer 2, and a third resin layer 3 are sequentially laminated via adhesive layers 4 and 5, respectively. In this embodiment, the following flexible OLED substrate is used: the first resin layer 1 and the third resin layer 3 are formed of a polyethylene terephthalate (PET) layer, and the intermediate second resin layer 2 is formed of a Polyimide (PI) layer.

In the OLED substrate W, a light-emitting layer, a driving element such as a Thin Film Transistor (TFT) for controlling light emission, and an organic LED such as a wiring circuit are formed on one surface of the PI layer 2 in the middle. In the structure of fig. 1, the organic LED is formed on the lower surface side of the PI layer 2, and film-

like PET layers

1 and 3 serving as protective films are laminated on both upper and lower surfaces of the PI layer 2 via adhesive layers 4 and 5.

Fig. 2 shows the structure of a cutting apparatus for carrying out the cutting method of the present invention. The cutting device A is provided with: irradiation of CO₂A first laser irradiation port 6 for irradiating laser light and a second laser irradiation port 7 for irradiating UV laser light. The first laser irradiation port 6 irradiates the substrate W with CO transmitted from the first laser oscillator 8 via a transmission optical system including a mirror, a focus adjustment lens (preferably, an autofocus lens), and the like₂And (4) laser. The second laser irradiation port 7 irradiates the substrate W with the UV laser beam transmitted through a transmission optical system including a mirror, a focus adjustment lens, and the like from the second laser oscillator 9. The first laser irradiation port 6 and the second laser irradiation port 7 are attached to a scribing head 11, and the scribing head 11 is disposed at a position above a stage 10 serving as a work table. The scribing head 11 is assembled as follows: the head moving mechanism (not shown) can move in the horizontal X direction along a guide 12 provided on a machine frame of the apparatus. The head moving mechanism may be a known mechanism such as: the screw shaft is rotated by a motor and moved along the guide.

The stage 10 on which the substrate W is placed includes a stage moving mechanism 13 for moving the stage in the X direction and the Y direction orthogonal thereto. The platform moving mechanism 13 is, for example, a known mechanism such as: the screw shaft is rotated by a motor to move along the rail.

The cutting apparatus a further includes a control unit 14, and the control unit 14 controls the stage 10, the movement of the scribe head 11, the first laser oscillator 8, the second laser oscillator 9, and the like (including the control in the case of an autofocus lens). The control unit 14 is a computer system having a processor such as a CPU, a storage unit such as a ROM and a RAM, and various interfaces. The control unit 14 performs various control operations by executing programs stored in the storage unit.

Next, a cutting method of the present invention using the cutting apparatus a will be specifically described.

First, an OLED substrate W is placed on a stage 10 and passed through CO from a first laser irradiation port 6₂The laser cuts the PET layer 1 (first cutting step).

Specifically, CO from the first laser irradiation port is irradiated₂The laser light R1 is scanned along the lines to cut, thereby forming first cut portions S1 that completely cut (completely divide) the PET layer 1 as shown in fig. 3 a. The first cut portion S1 forms a substantially V-shaped opening portion that exposes the PI layer 2 in the middle.

At this time, CO₂The laser light uses a focused beam focused on the processing surface of the PET layer 1, and its output is set in the range of: while the PET layer 1 can be completely cut, the adhesive layer does not melt due to heating at the time of cutting and flows out into the opening of the cut portion. Specifically, the output is set to be in the range of 6 to 16W, and the diameter of the irradiation spot on the machining surface is set to be in the range of 30 to 130 μm.

Next, the intermediate PI layer 2 is cut by the UV laser from the second laser irradiation port 7 (second cutting step).

Specifically, as shown in fig. 3 (b), a UV laser beam R2 having a wavelength of 40 to 60 μm is used to scan the processing surface along the first cut portion S1, thereby forming a second cut portion S2 in the PI layer 2. Due to UV laser (if with CO)₂Laser light) has a large photon energy and excellent light absorption characteristics, and the diameter of the irradiation spot on the work surface can be made small, so that the PI layer 2 can be efficiently cut with a thin groove.Furthermore, although CO may also be used₂The second cut portion S2 is formed by laser, but UV laser is more preferable because it is excellent in that carbonization is less likely to occur.

Subsequently, the substrate W is inverted and passed through the CO from the first laser irradiation port 6₂The laser cuts completely through the PET layer 3 (third cutting step).

Specifically, as shown in fig. 3 (c), CO from the first laser irradiation port 6 is supplied₂The laser R1 is scanned along the line of the second cut S2, thereby forming a third cut S3 in the PET layer 3. CO used in this case₂The laser beam is focused on the processing surface of the PET layer, and the output thereof is set in the following range, as in the first cutting step S1 described above: the adhesive layer does not start to melt due to heating at the time of cutting and flows out to the opening of the third cut portion S3.

Therefore, the output is set to be in the range of 6 to 16W and the diameter of the irradiation point of the processed surface is set to be in the range of 30 to 130 μm, similarly to the case of the first cutting step.

CO irradiated to the PET layer in a resonance mode in which the spread of the cross-sectional intensity distribution is reduced₂The laser is oscillated and irradiated by forming a focused beam by using a focus adjusting lens, so that the diameter of an irradiation spot on the processed surface can be reduced to 30-130 μm, and the irradiation energy can be concentrated in a small range. Thus, even when the cutting part is irradiated with a relatively small laser output of 6 to 16W, the cut part can be formed in the PET layer, and the surrounding adhesive layer can be prevented from melting and flowing out during cutting. Therefore, in the third cutting step, the adhesive layer does not start to melt and flow down onto the stage when the PET layer 3 is cut, so that it is possible to prevent the molten debris from adhering to the stage. Further, since the irradiation spot diameter is small, the opening widths of the cutouts S1 and S3 can be formed narrow, and the material use efficiency can be improved.

The inventors have conducted CO-based experiments₂Cutting test of the PET layer 1 of the laser OLED substrate W. CO 2₂The laser uses a focused beam of light of wavelength 1060nm, and will addThe diameter of the irradiation spot of the work surface was set to 80 μm. In addition, a 40 μm sample was used for the thickness of the PET layer 1 of the OLED substrate W.

Fig. 4 is data showing the verification result at this time.

In the item of "separability" in the figure, the x symbol indicates that the PET layer was not completely cut, and the o and the very-excellent symbols indicate that the PET layer was completely cut. In the term "overflow of the adhesive layer", the symbol x indicates that the adhesive layer melts and flows out to the cut opening, and the symbol o and the symbol very good indicate that no flow is caused.

From the test results, it was confirmed that: the output is 8W to 14W (the irradiation energy density of the processing surface is 1.6X 10)⁹～2.7×10⁹W/m²) In this case, the adhesive layer flows out without melting and the PET layer can be cut with complete cutting.

Although the present invention has been described with reference to the exemplary embodiments, the present invention is not necessarily limited to the embodiments described above. For example, in the above embodiment, the second resin layer is cut by the UV laser, but instead, the cutting wheel may be rotated to perform cutting. In addition, the present invention can be modified and changed as appropriate within the scope of the claims to achieve the object.

Industrial applicability

The invention is suitable for cutting the following multilayer substrates such as OLED substrates and the like and a device thereof: and an OLED substrate formed by sequentially laminating the first resin layer, the second resin layer and the third resin layer through bonding layers.

Description of the reference numerals

A … cutting device; w … multilayer substrate (OLED substrate); s1 … a first cutting part; s2 … a second cutting part; s3 … a third cutting part; 1 … a first resin layer; 2 … second resin layer; 3 … a third resin layer; 4 … an adhesive layer; 5 … an adhesive layer; 6 … first laser light emitting port; 7 … second laser irradiation port.

Claims

1. A method for cutting a multilayer substrate, the multilayer substrate being formed by sequentially laminating a first resin layer, a second resin layer, and a third resin layer via adhesive layers, the method comprising:

a first cutting step of scanning CO toward the surface of the first resin layer₂Laser to form a completely cut first cut portion exposing the second resin layer;

a second cutting step of forming a completely cut second cut portion on the second resin layer by running a UV laser or a cutting wheel along the first cut portion; and

a third cutting step of inverting the multilayer substrate and scanning CO toward the surface of the third resin layer along the second cutting portion₂The laser thus forms a completely cut third cut,

CO in the first and third cutting steps₂The laser is a focused beam that focuses on the surface of the resin layer being irradiated or beside it, and is set to an output in the range of: the adhesive layer flows out to the openings of the first cut portion and the third cut portion without melting at the time of processing.

2. The method for cutting a multilayer substrate according to claim 1,

the CO is₂The output of the laser is 6-16W, and the diameter of the irradiation point on the processed surface is 30-130 μm.

3. The method of cutting a multilayer substrate according to claim 1 or 2,

the multilayer substrate is an OLED substrate, the first resin layer is formed by a PET layer, the second resin layer is formed by a PI layer, and the third resin layer is formed by a PET layer.

4. A cutting device for cutting a multilayer substrate formed by sequentially laminating a first resin layer, a second resin layer, and a third resin layer with an adhesive layer interposed therebetween, the cutting device comprising:

a laser irradiation port for scanning CO with a focused beam on the surfaces of the first and third resin layers₂Laser-cutting the first cut portion and the third cut portion into completely divided groove shapes;

a cutting unit forming a second cut portion on the second resin layer along the first cut portion; and

a control unit for controlling the CO₂The laser is irradiated with an output in the following range: the adhesive layer flows out to the openings of the first cut portion and the third cut portion without melting during cutting.