JP7150303B2 - Cutter wheel and method for cutting multilayer substrate - Google Patents

Description

The present invention relates to a method for cutting a multi-layer substrate in which a plurality of resin substrates are laminated via an adhesive, and a cutter wheel used for the cutting.

Conventionally, when cutting a multi-layer board having an adhesive inside, a laser beam is irradiated from one side to cut the board along a desired line, and the board is turned over to cut the cutting line from the other side. It was cut by irradiating a laser beam along the . At this time, since it is necessary to irradiate different types of laser light for each material of the substrate, there is a problem that the structure of the head for irradiating the laser becomes complicated and the cost becomes high. Therefore, it is conceivable to use a cutter wheel for part of the cutting process. Patent Document 1 discloses a conventional disk-shaped cutter wheel having a cutting edge on the outer circumference, and the cutting edge portion has radial polishing scratches.

JP 2012-71377 A

In the method of irradiating different types of laser beams a plurality of times for each material of the substrate, the thermal effect on the substrate is large, which may adversely affect the characteristics of the substrate. On the other hand, if the multilayer substrate is cut while rolling the cutter wheel as in Document 1, the adhesive used to adhere the resin substrates to each other remains on the inclined surface of the cutting edge of the cutter wheel. Therefore, there is a problem that the adhesive is transferred to other parts of the multilayer substrate as the cutter wheel rolls, resulting in deterioration of cutting quality. It is difficult to clean off the adhesive adhering to the cutting edge of the cutter wheel, and there has been a demand for a cutting method in which the adhesive is less likely to adhere to the cutter wheel.

SUMMARY OF THE INVENTION The present invention has been made in view of such conventional problems, and it is an object of the present invention to suppress the thermal effect of laser light irradiation when cutting a multilayer substrate. Furthermore, in order to suppress the thermal effect of laser light irradiation, when cutting a multilayer substrate using a cutter wheel, the adhesive provided between the layers of the multilayer substrate can be cut without leaking out and adhering to the cutting edge. The purpose is to

In order to solve this problem, the cutter wheel of the present invention is a disk-shaped cutter wheel having an inclined surface with a V-shaped cross section on its outer peripheral portion, wherein the cutter wheel has an apex angle of the V-shaped inclined surface. is 20 to 50°, the inclined surface has concentric polishing marks coinciding with the central axis of the cutter wheel, and the arithmetic surface roughness Ra of the inclined surface is 0.04 μm to 0.1 μm . is.

In order to solve this problem, a method for cutting a multilayer substrate of the present invention is a method for cutting a multilayer substrate in which at least two layers of resin substrates are laminated via an adhesive layer. is placed on the table with the bottom surface, the cutter wheel is rolled from the top surface until it reaches the bottom layer to form a slit along the cutting line, the multilayer substrate is turned over, and the multilayer substrate is turned so as to include the cutting line The multilayer substrate is cut by irradiating laser light to cut the bottom layer.

In order to solve this problem, the method for cutting a multilayer substrate of the present invention is a cutting method for cutting a multilayer substrate in which a first layer, a second layer and a third layer of resin substrates are laminated in order via an adhesive layer. The third layer of the multilayer substrate is placed on a table with the third layer facing downward, the first layer is irradiated with a laser beam along a cutting line of the multilayer substrate to form a groove, and the third layer is forming a slit in the second layer along the cutting line in the groove by rolling the cutter wheel until reaching , reversing the multilayer substrate, and irradiating the laser beam so as to include the cutting line The multilayer substrate is cut by cutting the third layer .

According to the present invention having such characteristics, since the cutter wheel is used in part of the cutting process, it is possible to suppress the thermal influence of the laser beam irradiation on the multilayer substrate. In addition, according to the present invention having such characteristics, a cutter wheel is used in the cutting process, and concentric polishing marks are provided on the inclined surface of the cutter wheel, so that even if the cutter wheel rolls, Adhesive does not easily adhere to the cutting edge. As a result, the adhesive is less likely to be transferred to other portions of the multilayer substrate, and the cutting quality can be improved.

FIG. 1 is a diagram showing an example of a multilayer substrate to be cut by a cutting method according to an embodiment of the present invention. FIG. 2 is a side view and a front view of the cutter wheel according to this embodiment. FIG. 3 is a perspective view of the cutter wheel according to this embodiment. FIG. 4 is a side view showing the grinding state of the cutter wheel according to this embodiment. FIG. 5 is an enlarged view showing a cutting edge portion of a cutter wheel having concentric grinding marks. FIG. 6 is a diagram showing a process of cutting a multilayer substrate using a cutter wheel according to this embodiment. FIG. 7 is a view of the cutter wheel of this embodiment after use. FIG. 8 is a view after using the cutter wheel of Example 2. FIG. FIG. 9 is a view after use of the cutter wheel of Example 3. FIG.

FIG. 1 is an enlarged cross-sectional view showing an example of a multilayer substrate to be cut by a cutting method according to an embodiment of the present invention. As shown in the figure, the multilayer substrate 10 is a flexible multilayer substrate in which three resin layers, that is, a first layer 11, a second layer 12 and a third layer 13 are laminated. The first layer 11 and the third layer 13 are PET layers, and the intermediate second layer is a polyimide layer. Adhesive layers 14 and 15 are provided between the first layer 11 and the second layer 12 and between the second layer 12 and the third layer 13 for bonding the respective layers. When cutting such a multilayer substrate 10, a _CO2 laser is used for cutting the first and third layers 11 and 13, and a cutter wheel 20 is used for cutting the second layer 12 in this embodiment.

Next, the cutter wheel 20 used for cutting the second layer 12 will be described. As shown in FIGS. 2 and 3, the cutter wheel 20 of this embodiment is disc-shaped, and has a V-shaped cross-section on the outer peripheral portion, and a cutting edge portion 21 at the tip thereof. A through hole 22 is provided in the center, along which a cutter wheel 20 is rotatably held. Here, the apex angle α of the cutting edge 21 is, for example, 20-50°, and the diameter D of the cutter wheel 20 is 5-15 mm. Here, the left and right inclined surfaces 23 and 24 of the cutter wheel 20 are concentrically ground to form a V shape. In this way, the cutter wheel 20 having concentric polishing marks left on the inclined surfaces 23 and 24 can be obtained.

FIG. 4 shows a method of grinding the cutter wheel 20 to form the inclined surfaces 23 and 24. As shown in FIG. In this method, a disk-shaped grindstone 30 is used during polishing. The whetstone 30 has a whetstone formed on its circumferential surface. The grindstone 30 is rotatable along a grindstone rotating shaft 30a. A through hole 22 of the cutter wheel 20 is held by a shaft 31 and a nut 32, and the shaft 31 is rotatable. As shown in FIG. 4, the grindstone rotating shaft 30a and the rotating shaft 32a of the cutter wheel 20 form one plane (paper surface), and the angle between the rotating shafts is set to 90°+α/2. Next, while rotating the grindstone 30 along the grindstone rotating shaft 30a at a constant speed, the cutter wheel 20 is pressed against the outer peripheral surface of the magnet 30, and the cutter wheel 20 is also rotated along its rotating shaft 32a to grind the cutter wheel 20. do. In this way, a large number of concentric grinding marks 25 are formed on the inclined surface of the cutter wheel 20 on the inclined surface 23 with the rotating shaft 32a as the center. After polishing one surface, the other inclined surface 24 is similarly polished. When the polishing is finished in this manner, as shown in the enlarged view of FIG. 5, a large number of fine polishing marks 25 parallel to the ridge line are formed on the V-shaped inclined surface. Note that FIG. 3 exaggerates the polishing marks formed on the inclined surface. The arithmetic surface roughness Ra of the inclined surfaces 23 and 24 on which the polishing marks 25 are formed is, for example, 0.04 μm to 0.1 μm. Here, fine polishing marks 25 may be formed on the entire surface of the inclined surfaces 23 and 24, but they may be formed only on the vicinity of the edge line of the cutting edge 21 that bites into the resin during use.

A cutting process for cutting a multilayer substrate using the cutter wheel 20 having such polishing marks will be described. First, as shown in FIG. 6(a), the multilayer substrate 10 is placed on the table 40 with the first layer 11 facing up, and a processing head (not shown) that can emit a CO ₂ laser is moved above it. The table 40 and the processing head are relatively movable. Then, the PET layer of the first layer 11 of the multilayer substrate 10 is irradiated with a _CO2 laser along a desired cutting line as indicated by an arrow, and the processing head and the table 40 are moved relatively to cut. In this way, as shown in FIG. 6A, the first layer 11 and the adhesive layer 14 thereunder are cut to form a groove 41. Then, as shown in FIG. Then, as shown in FIG. 6(b), the aforementioned cutter wheel 20 is inserted into the groove 41, the tip of the cutting edge 21 is aligned with a desired cutting line, and a predetermined load is applied to penetrate the adhesive layer 15. The cutter wheel 20 is rolled by pressing so as to form a slit to the inside of the third layer 13 which is the lowest layer. In this way, a slit 42 can be formed below the groove 41 to completely divide the second layer as shown in FIG. 6(b). Here, since concentric polishing marks 25 are formed on the inclined surfaces 23 and 24 of the cutter wheel 20, the adhesive existing in the adhesive layer 15 hardly adheres to the surfaces of the inclined surfaces 23 and 24. - 特許庁Furthermore, since the polishing marks 25 are formed concentrically, even if a small amount of the adhesive adheres to the inclined surfaces 23 and 24 of the cutter wheel 20, the surface of the multilayer substrate 10 is held by the polishing marks 25, and thus the surface of the multilayer substrate 10 is polished. becomes difficult to adhere to. Therefore, even if the cutter wheel 20 is rolled, the adhering adhesive is less likely to be transferred to other portions of the multilayer substrate 10 .

Next, as shown in FIG. 6(c), the multilayer substrate 10 is turned over. Furthermore, as shown in FIG. 6(d), a CO ₂ laser beam is irradiated from directly above the groove 41 in line with the cutting line. A groove 43 having a constant width is formed in the third layer 13 . By doing so, the multilayer substrate 10 can be divided because the slits 42 are already formed. In this way, the first layer 11 and the third layer 13 are cut by irradiating the CO ₂ laser beam, but since the cutter wheel 20 is used for cutting the second layer 12, a different type of laser beam is applied to the multilayer substrate 10. It is possible to suppress the thermal effect due to irradiation.

In this embodiment, the first and third layers are PET layers, and the second layer is a polyimide layer. The present invention can be applied to any substrate.

In addition, although the multilayer substrate having a three-layer structure consisting of the first to third layers is described in the present embodiment, the present invention can also be applied to a multilayer substrate in which two resin substrates are connected by a resin layer. . In this case, as shown in FIGS. 6(b) to 6(d), the multilayer substrate can be cut by first forming a slit with a cutter wheel until it reaches the bottom layer, then inverting it and irradiating it with a laser beam. . In either case, the multilayer substrate can be cut with one type of laser beam and cutter wheel.

Next, specific examples of the present invention will be described. As the cutter wheel according to Example 1, a cutter wheel having concentric polishing marks, a diameter D of 10 mm, and an edge angle α of 30° was used. Example 2 is the case of using a cutter wheel having radial polishing marks and a diameter D of 6 mm, and Example 3 is the case of using a cutter wheel having radial polishing marks and a diameter D of 10 mm. . In order to confirm the effect of the present invention, a two-layer substrate having only a polyimide layer (20 μm thick), a PET layer (100 μm thick), and an adhesive layer therebetween was used as the multilayer substrate to be cut. First, the polyimide layer was placed on the top surface and the PET layer was placed on the bottom surface on the table, and the amount of pushing was set to 0.08 mm so that the depth of the PET layer reached nearly half of the depth of the three types of cutter wheels. A slit was formed with a cutter wheel at a scanning speed of 300 mm/sec and a pressing pressure of 0.2 MPa so as to reach the PET layer.

Then, the substrate was turned over and a CO ₂ laser was irradiated along the slit-formed line to cut the PET layer.

In the cutting methods of Examples 1 to 3, a cutter wheel is used to cut the polyimide layer. As a result, compared to the case of irradiating a different type of laser light from the CO ₂ laser used for cutting the PET layer, the thermal effect on the polyimide layer and the PET layer is suppressed, and the deterioration of the substrate quality is suppressed. can be done.

Furthermore, when the cutter wheel of Example 1 was used, almost no adhesive adhered to the inclined surface as shown in FIG. No adhesion was observed. On the other hand, when the cutter wheels of Examples 2 and 3 were used, as shown in FIGS.
By making the polishing marks formed on the inclined surface of the cutter wheel concentric in this way, it is difficult for the adhesive to adhere to the cutter wheel, and the adhesive is exposed on the upper surface of the substrate and is not transferred to other parts. There is no need to put it away. Therefore, the cutter wheel of Example 1 can further improve cutting quality when cutting the multilayer substrate reliably by penetrating the cutter wheel up to the adhesive layer.

INDUSTRIAL APPLICABILITY The present invention can be effectively used when cutting a multilayer substrate having an adhesive layer as an intermediate layer using a cutter wheel.

10 multilayer substrate 11 first layer (PET layer)
12 Second layer (polyimide layer)
13 Third layer (PET layer)
Reference Signs List 14, 15 adhesive layer 20 cutter wheel 21 cutting edge 22 through hole 23, 24 inclined surface 25 polishing mark 40 table 41, 43 groove 42 slit

Claims (3)

A disk-shaped cutter wheel having an inclined surface with a V-shaped cross section on its outer peripheral portion,
In the cutter wheel, the apex angle of the V-shaped inclined surface is 20 to 50°,
The inclined surface has concentric polishing marks that match the central axis of the cutter wheel ,
A cutter wheel in which the arithmetic surface roughness Ra of the inclined surface is 0.04 μm to 0.1 μm . A cutting method for cutting a multilayer substrate in which at least two layers of resin substrates are laminated via an adhesive layer using the cutter wheel according to claim 1 ,
Place the multilayer board with the bottom layer facing down on the table,
rolling the cutter wheel from the upper surface until it reaches the bottom layer to form a slit along the cutting line;
inverting the multilayer substrate;
A method for cutting a multilayer substrate, wherein the multilayer substrate is cut by irradiating a laser beam to cut the bottom layer so as to include the cutting line. A cutting method for cutting a multilayer substrate in which a first layer, a second layer, and a third layer of resin substrates are laminated in order via an adhesive layer, using the cutter wheel according to claim 1 ,
Place the third layer of the multilayer substrate on the table with the third layer facing downward,
irradiating the first layer with a laser beam along a cutting line of the multilayer substrate to form a groove;
forming a slit in the second layer along a cutting line within the groove by rolling the cutter wheel until it reaches the third layer ;
inverting the multilayer substrate;
A method for cutting a multilayer substrate, wherein the multilayer substrate is cut by irradiating a laser beam to cut the third layer so as to include the cutting line.

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