JP2020071971A - Flexible organic el display manufacturing method - Google Patents

Abstract

To provide a flexible organic EL display manufacturing method that does not easily reduce manufacturing efficiency.SOLUTION: A flexible organic EL display manufacturing method is related to manufacturing of a multilayer laminated substrate 10 that includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated, and in which the first resin layer 11B and the second resin layer 12B are laminated so as to face each other. The manufacturing method includes a pre-processing step of performing pre-processing for breaking on at least one of the first glass layer 11A and the second glass layer 12A, and a post-cutting step of breaking the pre-processed glass layer with a gas generated by irradiating the first resin layer 11B and the second resin layer 12B with laser.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for manufacturing a flexible organic EL display.

  An organic EL (electro luminescence) display includes a light emitting device in which a light emitting layer, electrodes, and a substrate are laminated. In a flexible organic EL display, a flexible substrate is used as the substrate. In a manufacturing process of a flexible organic EL display, a resin layer is formed on a glass layer, and a light emitting layer and the like are formed on the resin layer (for example, Patent Document 1).

Republished Patent WO2011 / 030716

  A light emitting device having a new structure has been proposed. This light emitting device has a first resin layer and a second resin layer provided so as to face each other. A light emitting layer or the like is provided between the first resin layer and the second resin layer. Since the structure of the light emitting device is different from that of the conventional light emitting device, the manufacturing efficiency of the light emitting device having a new structure may be reduced.

  An object of the present invention is to provide a method for manufacturing a flexible organic EL display in which manufacturing efficiency is less likely to decrease.

A method for manufacturing a flexible organic EL display according to the present invention includes a plurality of laminated substrates in which a glass layer and a resin layer are laminated, and the plurality of laminated substrates include a first glass layer and a first resin layer laminated. A multi-layer laminated substrate including one laminated substrate and a second laminated substrate in which a second glass layer and a second resin layer are laminated, and laminated so that the first resin layer and the second resin layer face each other. A method of manufacturing a flexible organic EL display relating to the manufacturing of a multi-layered substrate, the pre-processing step of performing pre-processing for breaking the glass layer of at least one of the plurality of laminated substrates; And a subsequent cutting step of breaking the applied glass layer with a gas generated by irradiating the resin layer with a laser.
In this manufacturing method, the glass layer is cut along with the work of cutting the resin layer by the laser. The number of steps for cutting the multilayer laminated substrate is reduced, and the manufacturing efficiency is less likely to decrease.

In one example of the method for manufacturing the flexible organic EL display, in the latter cutting step, the laser output in the laser irradiation per one time with respect to the resin layer is set to be equal to or higher than a predetermined output at which gas generation at a predetermined temperature or higher is promoted. Set.
In this manufacturing method, a relatively high temperature gas is generated as the resin layer is cut by the laser, and the glass layer is appropriately broken by the gas.

In an example of the method for manufacturing the flexible organic EL display, in the preliminary processing step, the preliminary processing is performed on one of the glass layers of the plurality of laminated substrates, and the preliminary operation is performed on the other glass layer of the plurality of laminated substrates. Not processed.
In this manufacturing method, only one glass layer is broken by the gas. Compared with the case where both glass layers are broken by gas, the state of the glass layers at the time of breaking becomes stable.

In one example of the method of manufacturing the flexible organic EL display, in the latter cutting step, the resin layer is irradiated with a laser through the glass layer that is not subjected to the preliminary processing.
In this manufacturing method, the laser is irradiated to the resin layer without being affected by the processed portion of the glass layer, and the resin layer is efficiently cut or scribed.

In one example of the method for manufacturing the flexible organic EL display, in the latter cutting step, after cutting both the resin layers of the plurality of laminated substrates with a laser, the other glass layer of the plurality of laminated substrates is cut. ..
In this manufacturing method, both resin layers are cut by the laser while both resin layers are supported by the other glass layer which is not cut. The state of the resin layer at the time of cutting becomes stable.

  According to the present invention, the manufacturing efficiency of a flexible organic EL display is less likely to decrease.

Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of 1st Embodiment. The top view of the multilayer laminated substrate of FIG. The schematic diagram which shows the structure of a laser processing apparatus. The schematic diagram which shows the structure of a scribe processing apparatus. 3 is a flowchart showing a manufacturing method of the embodiment. The figure which shows the example of a preliminary processing process and a latter part cutting process. The schematic diagram which shows the structure of a laser processing apparatus. The figure which shows an example of a peeling process.

(Embodiment)
A method for manufacturing a flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary devices, mobile devices, and the like. An example of a stationary device is a personal computer and a television receiver. Examples of mobile devices are personal digital assistants, wearable computers, and notebook personal computers. Examples of mobile information terminals are smartphones, tablets, and mobile game consoles. Examples of wearable computers are head mounted displays and smart watches.

  The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are laminated, a first protective film that covers the light emitting device from one side, and a second protective film that covers the light emitting device from the other side. PET (polyethylene terephthalate) is used for the first protective film and the second protective film, respectively. One of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from the single multilayer laminated substrate 10 shown in FIG.

  The multilayer laminated substrate 10 is manufactured at an intermediate stage of manufacturing a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated. Have and. The multilayer laminated substrate 10 is configured by laminating the first laminated substrate 11 and the second laminated substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with an electronic device member such as an OLED (Organic Light Diode) or a TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B form a light emitting device.

  The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and have the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, but glass having various compositions such as glass containing an alkali metal oxide or non-alkali glass can be used. An example of glass containing an alkali metal oxide is soda lime glass. In this embodiment, non-alkali glass is used for the first glass layer 11A and the second glass layer 12A. The thickness of each of the first glass layer 11A and the second glass layer 12A is not particularly limited, but is preferably about 0.5 mm, for example. The first glass layer 11A has a first flat surface 14A on which the first resin layer 11B is formed, and a second flat surface 14B paired with the first flat surface 14A. The second glass layer 12A has a first flat surface 15A on which the second resin layer 12B is formed, and a second flat surface 15B paired with the first flat surface 15A.

  The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and have the same size. The compositions of the first resin layer 11B and the second resin layer 12B are not particularly limited, but polyimide (PI) can be used, for example. The thickness of each of the first resin layer 11B and the second resin layer 12B is not particularly limited, but is preferably in the range of 10 μm or more and 30 μm or less, for example.

FIG. 2 is a plan view of the multilayer laminated substrate 10.
A unit laminated substrate 20 is formed by cutting the multilayer laminated substrate 10 in a lattice shape along the planned cutting portions 16 and 17 indicated by broken lines in FIG. The size of the unit laminated substrate 20 in plan view corresponds to the predetermined size of the light emitting device in plan view.

  At least one of a laser processing device and a scribing device is used to cut the multilayer laminated substrate 10. FIG. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4.

  As shown in FIG. 3, the laser processing apparatus 30 includes a laser device 31 for cutting the multilayer laminated substrate 10, a mechanical drive system 32 for moving the multilayer laminated substrate 10 with respect to the laser device 31, and a laser. A first control unit 33 that controls the device 31 and the mechanical drive system 32.

The laser device 31 can process at least one of the first resin layer 11B and the second resin layer 12B and the first glass layer 11A and the second glass layer 12A in the multilayer laminated substrate 10. The laser device 31 has a laser oscillator 34 for irradiating the multilayer laminated substrate 10 with laser light, and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing device 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. Further, the transmission optical system 35 has an X-axis direction moving mechanism for moving the laser irradiation head in which the laser oscillator 34 is incorporated, for example, in the X-axis direction. The laser light emitted from the laser oscillator 34 is emitted toward the multilayer laminated substrate 10 via the transmission optical system 35.

  The mechanical drive system 32 is arranged to face the laser device 31 in the Z-axis direction. The mechanical drive system 32 includes a bed 36, a processing table 37, and a moving device 38. The multilayer laminated substrate 10 is placed on the processing table 37. The moving device 38 moves the processing table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

  The first controller 33 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may include one or more microcomputers. The first control unit 33 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31, may be provided in the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. When the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be set arbitrarily.

  As shown in FIG. 4, in the scribing apparatus 40, the scribing wheel 50 and the multilayer laminated substrate 10 are relatively moved in the X-axis direction and the Y-axis direction, whereby the multilayer laminated substrate 10 is moved in the X-axis direction and the Y-axis direction. Form a scribe line along the direction. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a transport device 42 for transporting the multilayer laminated substrate 10, and a second controller 43 for controlling the processing device 41 and the transport device 42. Equipped with.

  The transfer device 42 includes a pair of rails 44, a table 45, a linear drive device 46, a rotation device 47, and the like. In the scribing device 40 of FIG. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing device 40, and the linear drive device 46 causes the table 45 to reciprocate along the pair of rails 44, and the rotating device 47. This causes the table 45 to rotate about the central axis C. The multilayer laminated substrate 10 is placed on the table 45. An example of the linear drive device 46 has a feed screw device. The rotating device 47 has a motor that serves as a drive source.

  The processing device 41 includes a lateral drive device 48, a vertical drive device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50, and the holder unit is attached to a scribing head for holding the holder unit. The scribing head is moved in the X-axis direction by the lateral drive device 48, and is moved in the Z-axis direction by the vertical drive device 49. By moving the scribing wheel 50 in the X-axis direction, a scribe line is formed in the multilayer laminated substrate 10 along the X-axis direction.

  The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of the material forming the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented carbide, single crystal diamond, and polycrystalline diamond.

  The second control unit 43 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The second controller 43 may be provided in the processing device 41, may be provided in the transport device 42, or may be provided separately from the processing device 41 and the transport device 42. When the second control unit 43 is provided separately from the processing device 41 and the transfer device 42, the arrangement position of the second control unit 43 can be set arbitrarily.

[Method for manufacturing flexible organic EL display]
Next, details of the method for manufacturing the flexible organic EL display will be described. FIG. 5 shows an example of steps of a method for manufacturing a flexible organic EL display.

  In the method of manufacturing a flexible organic EL display, after the first laminated substrate 11 and the second laminated substrate 12 are bonded to each other to produce the multilayer laminated substrate 10, the multilayer laminated substrate 10 is cut into a predetermined size to produce the unit laminated substrate 20. .. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thereby, a flexible organic EL display is manufactured.

  As shown in FIG. 5, in the method for manufacturing a flexible organic EL display, a first step which is a step prior to the step of stacking the first laminated substrate 11 and the second laminated substrate 12, a first laminated substrate 11 and a second laminated substrate 11 The two-layer substrate 12 is divided into a subsequent step, which is a step after the step of stacking the two-layer board 12. The pre-stage process of this embodiment includes a pre-stage lamination process. The pre-stage laminating step is a step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The post-stage process includes a post-stage laminating process, a post-stage processing process, and a peeling process. The latter-stage laminating step is a step of laminating the first laminated substrate 11 and the second laminated substrate 12 to manufacture the multilayer laminated substrate 10. The post-processing step is a step of manufacturing the unit laminated substrate 20 by cutting the planned cutting portions 16 and 17 of the multilayer laminated substrate 10. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by laser lift off (LLO). The details of each step will be described below.

  In the first-stage laminating step, the first laminated substrate 11 is manufactured by forming the first resin layer 11B on the first plane 14A of the first glass layer 11A, and the second resin layer is formed on the first plane 15A of the second glass layer 12A. The second laminated substrate 12 is manufactured by forming 12B. The method for forming the first resin layer 11B on the first flat surface 14A of the first glass layer 11A and the method for forming the second resin layer 12B on the first flat surface 15A of the second glass layer 12A are respectively the resin for the glass layer. A method of applying a layer or a method of laminating a resin layer on a glass layer via an adhesive layer can be selected. As a method for fixing the resin layer to the glass layer, heat curing treatment or heating and pressure treatment by a pressing method can be selected.

  In the latter-stage laminating step, the first laminated substrate 11 not cut into a predetermined size and the second laminated substrate 12 not cut into a predetermined size are laminated. In one example, the first laminated substrate 11 and the second laminated substrate 12 are attached to each other via, for example, the adhesive layer SD. Thereby, as shown in FIG. 1, the preliminarily processed multilayer laminated substrate 10 is manufactured.

  The post-processing step includes a pre-processing step and a post-cutting step. The pre-processing step is a step in which at least one of the first glass layer 11A and the second glass layer 12A of the multilayer laminated substrate 10 is pre-processed for breaking. The preliminary processing is performed by scribing by the laser processing device 30 or the scribing device 40. As an example of the pre-processing, the scribing wheel 50 forms cracks in at least one of the first glass layer 11A and the second glass layer 12A. The second-stage cutting step includes a step of breaking the preliminarily processed glass layer with a gas generated by the laser irradiation of the first resin layer 11B and the second resin layer 12B.

  In the pre-processing step, one of the first glass layer 11A and the second glass layer 12A is pre-processed, and the other of the first glass layer 11A and the second glass layer 12A is not pre-processed. FIG. 6 shows an example in which the second glass layer 12A is preliminarily processed. As shown in FIG. 6, the pre-processing is performed on the planned cutting portion 17A of the second glass layer 12A and not on the planned cutting portion 16A of the first glass layer 11A. A crack is formed by the scribing wheel 50 in the planned cutting portion 17A.

  In the latter cutting step, at least one of the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B is cut by laser, or the planned cutting portion 16B and the second cutting portion 16B of the first resin layer 11B are cut by laser. A scribe line is formed on at least one of the cut portions 17B of the resin layer 12B. In the present embodiment, in the second-stage cutting step, the laser output in the laser irradiation per one time with respect to the first resin layer 11B and the second resin layer 12B is set to be equal to or higher than a predetermined output that promotes the generation of gas at a predetermined temperature or higher. Set. When the output is set to be equal to or higher than the predetermined output, the gas generated in the multilayer laminated substrate 10 due to the laser irradiation to the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B is preliminarily processed. The force capable of breaking the glass layer is applied to the glass layer.

  As described above, in the subsequent cutting step, the pre-processed glass layer of the first glass layer 11A and the second glass layer 12A of the multilayer laminated substrate 10 is cut into the cut portion 16B of the first resin layer 11B. A break is caused by the gas generated by the irradiation of the laser on the planned cutting portion 17B of the second resin layer 12B.

  In one example, when the pre-cut portion 17A of the second glass layer 12A is preliminarily processed, the pre-cut portion 17B of the second resin layer 12B is irradiated with a laser from the second glass layer 12A side. The planned cutting part 17A of the second glass layer 12A is broken by the gas generated when the planned cutting part 17B of the second resin layer 12B is cut by the laser. In one example, when the planned cutting portion 17A of the second glass layer 12A is preliminarily processed, the first glass layer 11A side is irradiated with laser to the planned cutting portion 16B of the first resin layer 11B to emit the first resin. After cutting the planned cutting part 16B of the layer 11B, the planned cutting part 17B of the second resin layer 12B is irradiated with laser in the same irradiation direction to cut the planned cutting part 17B of the second resin layer 12B or the second resin layer. A scribe line is formed on the planned cutting portion 17B of 12B. The gas to be cut when the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B are processed by the laser breaks the planned cutting portion 17A of the second glass layer 12A.

  In one example, when the planned cutting portion 16A of the first glass layer 11A is preliminarily processed, the laser is irradiated from the first glass layer 11A side to the planned cutting portion 16B of the first resin layer 11B. The gas to be cut when cutting the cut portion 16B of the first resin layer 11B by the laser breaks the cut portion 16A of the first glass layer 11A. In one example, when the planned cutting portion 16A of the first glass layer 11A is preliminarily processed, a laser is applied to the planned cutting portion 17B of the second resin layer 12B from the second glass layer 12A side to apply the second resin. After cutting the planned cutting portion 17B of the layer 12B, the planned cutting portion 16B of the first resin layer 11B is irradiated with a laser in the same irradiation direction to cut the planned cutting portion 16B of the first resin layer 11B or the first resin layer. A scribe line is formed on the planned cutting portion 16B of 11B. The planned cutting part 16A of the first glass layer 11A is broken by the gas generated when the planned cutting part 17B of the second resin layer 12B and the planned cutting part 16B of the first resin layer 11B are processed by the laser.

  In the latter-stage cutting step, the other of the first glass layer 11A and the second glass layer 12A which has not been preliminarily processed is cut. In one example, in the second-stage cutting step, after the scribe line is formed on the other of the first glass layer 11A and the second glass layer 12A by the laser processing device 30 or the scribing device 40, the first glass layer 11A and the second glass layer 12A are formed. Break the other along the scribe line. When the scribe line is formed on one of the first resin layer 11B and the second resin layer 12B, the first glass layer 11A and the second glass layer 12A are also broken at the time of breaking. As a result, the unit laminated substrate 20 is manufactured. In one example, in the latter cutting step, the other of the first glass layer 11A and the second glass layer 12A is cut by laser or dicing. When the scribe line is formed on one of the first resin layer 11B and the second resin layer 12B, the first resin layer 11B and the second resin layer are cut after the other of the first glass layer 11A and the second glass layer 12A is cut. Break one of 12B. As a result, the unit laminated substrate 20 is manufactured.

  In the pre-processing step and the subsequent cutting step, when the glass layer and the resin layer are each cut by laser, or when the cracks are formed in each of the glass layer and the resin layer by laser, the laser processing device 30 shown in FIG. Instead, the laser processing apparatus 30A shown in FIG. 7 is used. The laser processing device 30A is different from the laser processing device 30 in the configuration of the laser device. Hereinafter, a different configuration of the laser processing device 30A will be described.

The laser device 31A of the laser processing device 30A includes a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser and the second laser oscillator 34B is a CO ₂ laser. The laser light emitted from the first laser oscillator 34A and the laser light emitted from the second laser oscillator 34B are applied to the first laminated substrate 11 and the second laminated substrate 12 via the transmission optical system 35. The transmission optical system 35 may be provided with a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B separately.

  The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type (glass layer or resin layer) of the processing target for the first laminated substrate 11 and the second laminated substrate 12. For example, the first control unit 33 determines the processing order of the glass layer and the resin layer, which are the types of processing targets, according to a control program stored in advance, and the first laser oscillator 34A and the second laser oscillator according to the determined processing order. Select 34B.

  A laser lift-off device (not shown) is used in the peeling process. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in FIG. 8A, the first resin layer 11B and the first glass layer 11A are separated by irradiating the first resin layer 11B with a laser from the first glass layer 11A side. When peeling off the first resin layer 11B and the first glass layer 11A, the laser is applied so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 8B, the second resin layer 12B and the second glass layer 12A are separated by irradiating the second resin layer 12B with a laser from the second glass layer 12A side. When peeling off the second resin layer 12B and the second glass layer 12A, the laser is applied so as to be orthogonal to the second plane 15B of the second glass layer 12A. The order of peeling the first glass layer 11A and the second glass layer 12A can be arbitrarily changed. For example, after peeling the second resin layer 12B and the second glass layer 12A, the first resin layer 11B and the first glass layer 11A may be peeled.

  After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see FIG. 8C), the first protective film is attached so as to cover the first resin layer 11B, and the second resin The flexible organic EL display is manufactured by attaching the second protective film so as to cover the layer 12B.

The effects of this embodiment will be described.
(1) In the method for manufacturing a flexible organic EL display, the multilayer laminated substrate 10 is cut into a predetermined size in a subsequent step that is a step after the step of laminating the first laminated substrate 11 and the second laminated substrate 12. In this manufacturing method, since the first laminated substrate 11 and the second laminated substrate 12 are cut in the laminated multilayer laminated substrate 10, the laminating operation is simplified. Therefore, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

  (2) A method of manufacturing a flexible organic EL display is a pre-processing step of performing pre-processing for breaking on at least one of the first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12. And a post-cutting step of breaking the preliminarily processed glass layer with a gas generated when at least one of the first resin layer 11B and the second resin layer 12B is irradiated with laser. In this manufacturing method, the glass layer that has been preliminarily processed is cut along with the operation of cutting at least one of the first resin layer 11B and the second resin layer 12B by the laser. Therefore, the number of steps for cutting the multilayer laminated substrate 10 is reduced, and the manufacturing efficiency of the flexible organic EL display is less likely to decrease.

  (3) In the latter-stage cutting step, the laser output in the laser irradiation per time for the first resin layer 11B and the second resin layer 12B is set to a predetermined output or higher at which generation of gas at a predetermined temperature or higher is promoted. . In this manufacturing method, a relatively high temperature gas is generated when at least one of the first resin layer 11B and the second resin layer 12B is cut by the laser, and the pre-processed glass layer is appropriately broken by the gas. .

  (4) In the pre-processing step, one of the first glass layer 11A and the second glass layer 12A is pre-processed, and the other of the first glass layer 11A and the second glass layer 12A is not pre-processed. In this manufacturing method, only one of the first glass layer 11A and the second glass layer 12A is broken by the gas. Compared with the case where both the first glass layer 11A and the second glass layer 12A are broken by gas, the states of the first glass layer 11A and the second glass layer 12A at the time of breaking are stable.

  (5) In the latter-stage cutting step, the resin layer corresponding to the glass layer not subjected to the preliminary processing is irradiated with laser through the glass layer not subjected to the preliminary processing. In this manufacturing method, the laser is irradiated on the resin layer corresponding to the glass layer not subjected to the pre-processing, without being affected by the processed portion of the pre-processed glass layer, so that the resin layer is efficiently supplied. A crack is formed in the resin layer by cutting or efficiently.

  (6) In the latter cutting step, after cutting the first resin layer 11B and the second resin layer 12B with a laser, the glass layer that is not preliminarily processed is cut. In this manufacturing method, the first resin layer 11B and the second resin layer 12B are cut by laser while the first resin layer 11B and the second resin layer 12B are supported by the glass layer which is not preliminarily processed. Therefore, the states of the first resin layer 11B and the second resin layer 12B at the time of cutting are stable.

(Modification)
The above embodiment is an example of a form that the method for manufacturing a flexible organic EL display according to the present disclosure can take, and is not intended to limit the form. The method for manufacturing the flexible organic EL display according to the present disclosure may take a form different from the form exemplified in the embodiment. An example thereof is a form in which a part of the configuration of the embodiment is replaced, changed, or omitted, or a configuration in which a new configuration is added to the embodiment. In the following modified examples, the same parts as those of the embodiment are designated by the same reference numerals and the description thereof will be omitted.

  In the embodiment, instead of forming the conductive layer 13 on the first laminated substrate 11 or in addition to forming the conductive layer 13 on the first laminated substrate 11, the conductive layer on the second laminated substrate 12 is formed. 13 may be formed.

  -In the pre-processing step of the embodiment, both the first glass layer 11A and the second glass layer 12A may be pre-processed. In this case, both the first glass layer 11A and the second glass layer 12A are broken in the latter cutting step.

  In the second-stage cutting step of the embodiment, the laser output for each laser irradiation of the first resin layer 11B and the second resin layer 12B can be arbitrarily set. The laser output per irradiation of the laser to the first resin layer 11B and the second resin layer 12B may be set to be less than a predetermined output that promotes generation of a gas having a predetermined temperature or higher. In this case, it is preferable to irradiate the first resin layer 11B and the second resin layer 12B with laser a plurality of times.

  In the embodiment, when the planned cutting portion 16A of the first glass layer 11A is subjected to the preliminary processing in the preliminary processing step, the first glass layer 11A side is cut into the planned cutting portion 16B of the first resin layer 11B in the subsequent cutting step. A scribe line may be formed in the planned cutting portion 16B of the first resin layer 11B by irradiating the laser. In this case, the planned cutting portion 16A of the first glass layer 11A is broken by the gas generated when the scribe line is formed in the planned cutting portion 16B of the first resin layer 11B by the laser. Further, when the pre-processed portion 17A of the second glass layer 12A is pre-processed in the pre-processing step, a laser is irradiated from the second glass layer 12A side to the pre-cut portion 17B of the second resin layer 12B in the subsequent cutting step. By doing so, a scribe line may be formed in the planned cutting portion 17B of the second resin layer 12B. In this case, the cut portion 17A of the second glass layer 12A is broken by the gas generated when the scribe line is formed in the cut portion 17B of the second resin layer 12B by the laser.

10: multilayer laminated substrate 11: first laminated substrate 11A: first glass layer 11B: first resin layer 12: second laminated substrate 12A: second glass layer 12B: second resin layer

Claims (5)

A plurality of laminated substrates in which a glass layer and a resin layer are laminated, wherein the plurality of laminated substrates are a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a first laminated substrate. A method for manufacturing a flexible organic EL display, which comprises a second laminated substrate in which two resin layers are laminated, and a multilayer laminated substrate in which the first resin layer and the second resin layer are laminated so as to face each other. hand,
A pre-processing step of performing pre-processing for breaking on at least one of the glass layers of the plurality of laminated substrates;
A method of manufacturing a flexible organic EL display, comprising: a post-cutting step of breaking the preliminarily processed glass layer with a gas generated by irradiating the resin layer with a laser, with respect to the multilayer laminated substrate. The flexible organic EL display according to claim 1, wherein in the latter-stage cutting step, a laser output per laser irradiation of the resin layer is set to a predetermined output or higher at which generation of a gas having a predetermined temperature or higher is accelerated. Manufacturing method. The said pre-processing process WHEREIN: The said pre-processing is performed to the said glass layer of one of these laminated substrates, The said pre-processing is not performed to the said glass layer of the other of these laminated substrates. Flexible organic EL display manufacturing method. The method for manufacturing a flexible organic EL display according to claim 1, wherein in the latter-stage cutting step, the resin layer is irradiated with a laser through the glass layer that has not been subjected to the preliminary processing. The flexible organic EL display according to claim 3 or 4, wherein, in the latter-stage cutting step, after cutting both the resin layers of the plurality of laminated substrates with a laser, the other glass layer of the plurality of laminated substrates is cut. Manufacturing method.