JP2020071970A - Flexible organic el display manufacturing method - Google Patents

Abstract

To provide a flexible organic EL display manufacturing method that does not easily reduce manufacturing efficiency.SOLUTION: A flexible organic EL display manufacturing method is related to manufacturing of a multilayer laminated substrate that includes a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second laminated substrate in which a second glass layer and a second resin layer are laminated, and in which the first resin layer and the second resin layer are laminated so as to face each other. The manufacturing method includes a pre-processing step of performing pre-processing for breaking a first glass layer, a second glass layer, a first resin layer, and a second resin layer on the first glass layer, the second glass layer, the first resin layer, and the second resin layer respectively, and a post-cutting step of breaking the pre-processed multilayer laminated substrate.SELECTED DRAWING: Figure 5

Description

  The present invention relates to a method for manufacturing a flexible organic EL display.

  An organic EL (electro luminescence) display includes a light emitting device in which a light emitting layer, electrodes, and a substrate are laminated. In a flexible organic EL display, a flexible substrate is used as the substrate. In a manufacturing process of a flexible organic EL display, a resin layer is formed on a glass layer, and a light emitting layer and the like are formed on the resin layer (for example, Patent Document 1).

Republished Patent WO2011 / 030716

  A light emitting device having a new structure has been proposed. This light emitting device has a first resin layer and a second resin layer provided so as to face each other. A light emitting layer or the like is provided between the first resin layer and the second resin layer. Since the structure of the light emitting device is different from that of the conventional light emitting device, the manufacturing efficiency of the light emitting device having a new structure may be reduced.

  An object of the present invention is to provide a method for manufacturing a flexible organic EL display in which manufacturing efficiency is less likely to decrease.

A method for manufacturing a flexible organic EL display according to the present invention includes a plurality of laminated substrates in which a glass layer and a resin layer are laminated, and the plurality of laminated substrates include a first glass layer and a first resin layer laminated. A multi-layer laminated substrate including one laminated substrate and a second laminated substrate in which a second glass layer and a second resin layer are laminated, and laminated so that the first resin layer and the second resin layer face each other. A method of manufacturing a flexible organic EL display relating to the manufacturing of, wherein a pre-processing step of subjecting each of the glass layer and the resin layer to a pre-processing for breaking the glass layer and the resin layer of the multilayer laminated substrate, And a post-cutting step of breaking the multilayer laminated substrate that has been subjected to the preliminary processing.
In this manufacturing method, since the glass layer is not cut in the preceding step prior to the step of stacking the plurality of laminated substrates, workability in stacking the plurality of laminated substrates is improved, and manufacturing efficiency is less likely to decrease.

In an example of the method for manufacturing the flexible organic EL display, in the preliminary processing step, the preliminary processing is performed on the glass layer and the resin layer by different means.
In this manufacturing method, preprocessing suitable for each of the glass layer and the resin layer can be selected. Each layer is properly pre-processed to improve cutting quality.

In one example of the method for manufacturing the flexible organic EL display, the glass layer is scribed and the resin layer is cooled in the preliminary processing step.
In this manufacturing method, the resin layer can be cut by breaking. For example, as compared with the case of scribing the resin layer with a laser, the influence of heat applied to the resin layer until the resin layer is broken is small, and the quality of the resin layer is less likely to deteriorate.

In an example of the method of manufacturing the flexible organic EL display, in the pre-processing step, the glass layer is scribed by a scribing wheel and the resin layer is scribed by a laser.
In this manufacturing method, the glass layer and the resin layer can be scribed using an existing device.

In one example of the method of manufacturing the flexible organic EL display, the preliminary processing step is included in a preceding step before the step of stacking the plurality of laminated substrates.
In this manufacturing method, since a plurality of laminated substrates are preliminarily processed in a state where they are not laminated, unlike the case where the resin layer of a multilayer laminated substrate is preliminarily processed by a laser, for example, a laser is used for the preliminary processing of the resin layer. Also, the possibility that the quality of the resin layer is deteriorated due to the influence of gas is reduced.

  According to the present invention, the manufacturing efficiency of a flexible organic EL display is less likely to decrease.

Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of 1st Embodiment. The top view of the multilayer laminated substrate of FIG. The schematic diagram which shows the structure of a laser processing apparatus. The schematic diagram which shows the structure of a scribe processing apparatus. 3 is a flowchart showing a manufacturing method of the embodiment. The figure which shows the example of a preparatory process. The figure which shows the example of a latter stage lamination process. The figure which shows an example of a peeling process. The figure which shows the 1st example of the preliminary processing process regarding the manufacturing method of 2nd Embodiment. The figure which shows the 2nd example of a preparatory process. The figure which shows the pattern of the processing order of a preliminary processing process. The figure which shows the 3rd example of a preparatory process. The schematic diagram which shows the structure of a laser processing apparatus.

(First embodiment)
A method for manufacturing a flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary devices, mobile devices, and the like. An example of a stationary device is a personal computer and a television receiver. Examples of mobile devices are personal digital assistants, wearable computers, and notebook personal computers. Examples of mobile information terminals are smartphones, tablets, and mobile game consoles. Examples of wearable computers are head mounted displays and smart watches.

  The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are laminated, a first protective film that covers the light emitting device from one side, and a second protective film that covers the light emitting device from the other side. PET (polyethylene terephthalate) is used for the first protective film and the second protective film, respectively. One of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from the single multilayer laminated substrate 10 shown in FIG.

  The multilayer laminated substrate 10 is manufactured at an intermediate stage of manufacturing a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated. Have and. The multilayer laminated substrate 10 is configured by laminating the first laminated substrate 11 and the second laminated substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with an electronic device member such as an OLED (Organic Light Diode) or a TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B form a light emitting device.

  The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and have the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, but glass having various compositions such as glass containing an alkali metal oxide or non-alkali glass can be used. An example of glass containing an alkali metal oxide is soda lime glass. In this embodiment, non-alkali glass is used for the first glass layer 11A and the second glass layer 12A. The thickness of each of the first glass layer 11A and the second glass layer 12A is not particularly limited, but is preferably about 0.5 mm, for example. The first glass layer 11A has a first flat surface 14A on which the first resin layer 11B is formed, and a second flat surface 14B paired with the first flat surface 14A. The second glass layer 12A has a first flat surface 15A on which the second resin layer 12B is formed, and a second flat surface 15B paired with the first flat surface 15A.

  The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and have the same size. The compositions of the first resin layer 11B and the second resin layer 12B are not particularly limited, but polyimide (PI) can be used, for example. The thickness of each of the first resin layer 11B and the second resin layer 12B is not particularly limited, but is preferably in the range of 10 μm or more and 30 μm or less, for example.

FIG. 2 is a plan view of the multilayer laminated substrate 10.
A unit laminated substrate 20 is formed by cutting the multilayer laminated substrate 10 in a lattice shape along the planned cutting portions 16 and 17 indicated by broken lines in FIG. The size of the unit laminated substrate 20 in plan view corresponds to the predetermined size of the light emitting device in plan view.

  At least one of a laser processing device and a scribing device is used to cut the multilayer laminated substrate 10. FIG. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4.

  As shown in FIG. 3, the laser processing apparatus 30 includes a laser device 31 for cutting the multilayer laminated substrate 10, a mechanical drive system 32 for moving the multilayer laminated substrate 10 with respect to the laser device 31, and a laser. A first control unit 33 that controls the device 31 and the mechanical drive system 32.

The laser device 31 can process at least one of the first resin layer 11B and the second resin layer 12B and the first glass layer 11A and the second glass layer 12A in the multilayer laminated substrate 10. The laser device 31 has a laser oscillator 34 for irradiating the multilayer laminated substrate 10 with laser light, and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing device 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. Further, the transmission optical system 35 has an X-axis direction moving mechanism for moving the laser irradiation head in which the laser oscillator 34 is incorporated, for example, in the X-axis direction. The laser light emitted from the laser oscillator 34 is emitted toward the multilayer laminated substrate 10 via the transmission optical system 35.

  The mechanical drive system 32 is arranged to face the laser device 31 in the Z-axis direction. The mechanical drive system 32 includes a bed 36, a processing table 37, and a moving device 38. The multilayer laminated substrate 10 is placed on the processing table 37. The moving device 38 moves the processing table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

  The first controller 33 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may include one or more microcomputers. The first control unit 33 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31, may be provided in the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. When the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be set arbitrarily.

  As shown in FIG. 4, in the scribing apparatus 40, the scribing wheel 50 and the multilayer laminated substrate 10 are relatively moved in the X-axis direction and the Y-axis direction, whereby the multilayer laminated substrate 10 is moved in the X-axis direction and the Y-axis direction. Form a scribe line along the direction. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a transport device 42 for transporting the multilayer laminated substrate 10, and a second controller 43 for controlling the processing device 41 and the transport device 42. Equipped with.

  The transfer device 42 includes a pair of rails 44, a table 45, a linear drive device 46, a rotation device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribing device 40 of FIG. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing device 40, and the linear drive device 46 causes the table 45 to reciprocate along the pair of rails 44, and the rotating device 47. This causes the table 45 to rotate about the central axis C. The multilayer laminated substrate 10 is placed on the table 45. An example of the linear drive device 46 has a feed screw device. The rotating device 47 has a motor that serves as a drive source.

  The processing device 41 includes a lateral drive device 48, a vertical drive device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50. The holder unit is attached to a scribing head for holding the holder unit. The scribing head is moved in the X-axis direction by the lateral drive device 48, and is moved in the Z-axis direction by the vertical drive device 49. By moving the scribing wheel 50 in the X-axis direction, a scribe line is formed in the multilayer laminated substrate 10 along the X-axis direction.

  The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of the material forming the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented carbide, single crystal diamond, and polycrystalline diamond.

  The second control unit 43 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The second controller 43 may be provided in the processing device 41, may be provided in the transport device 42, or may be provided separately from the processing device 41 and the transport device 42. When the second control unit 43 is provided separately from the processing device 41 and the transfer device 42, the arrangement position of the second control unit 43 can be set arbitrarily.

[Method for manufacturing flexible organic EL display]
Next, details of the method for manufacturing the flexible organic EL display will be described. FIG. 5 shows an example of steps of a method for manufacturing a flexible organic EL display.

  In the method of manufacturing a flexible organic EL display, after the first laminated substrate 11 and the second laminated substrate 12 are bonded to each other to produce the multilayer laminated substrate 10, the multilayer laminated substrate 10 is cut into a predetermined size to produce the unit laminated substrate 20. .. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thereby, a flexible organic EL display is manufactured.

  As shown in FIG. 5, in the method for manufacturing a flexible organic EL display, a first step which is a step prior to the step of stacking the first laminated substrate 11 and the second laminated substrate 12, a first laminated substrate 11 and a second laminated substrate 11 The two-layer substrate 12 is divided into a subsequent step, which is a step after the step of stacking the two-layer board 12. The pre-stage process of this embodiment includes a pre-stage lamination process and a pre-processing process. The pre-stage laminating step is a step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. In the pre-processing step, pre-processing for breaking the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A of the multilayer laminated substrate 10 is performed by the first glass layer 11A, the first glass layer 11A, and the second glass layer 12A. This is a step performed on each of the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A. The post-stage process includes a post-stage stacking process, a post-stage cutting process, and a peeling process. The latter-stage laminating step is a step of laminating the first laminated substrate 11 and the second laminated substrate 12 to manufacture the multilayer laminated substrate 10. The second-stage cutting step is a step of manufacturing the unit laminated board 20 by breaking the preliminarily processed multilayer laminated board 10. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by laser lift off (LLO). The details of each step will be described below.

  In the first-stage laminating step, the first laminated substrate 11 is manufactured by forming the first resin layer 11B on the first plane 14A of the first glass layer 11A, and the second resin layer is formed on the first plane 15A of the second glass layer 12A. The second laminated substrate 12 is manufactured by forming 12B. The method for forming the first resin layer 11B on the first flat surface 14A of the first glass layer 11A and the method for forming the second resin layer 12B on the first flat surface 15A of the second glass layer 12A are respectively the resin for the glass layer. A method of applying a layer or a method of laminating a resin layer on a glass layer via an adhesive layer can be selected. As a method for fixing the resin layer to the glass layer, heat curing treatment or heating and pressure treatment by a pressing method can be selected.

  In the pre-processing step, pre-processing for breaking the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B of the multilayer laminated substrate 10 is performed by the first glass layer 11A, the first glass layer 11A, and the second glass layer 11B. It is applied to each of the two glass layers 12A, the first resin layer 11B, and the second resin layer 12B. In one example, as shown in FIG. 6, in an example of the pre-processing, cutting is planned to be cut in the first glass layer 11A of the first laminated substrate 11 where the cutting is planned to be cut 16A and the first resin layer 11B. A scribe line is formed in each of the planned cutting portions 16B. An example of the pre-processing is to form a scribe line in each of the planned cutting part 17A of the second laminated substrate 12 where the second glass layer 12A is to be cut and the planned cutting part 17B of the second resin layer 12B. To do. A laser processing device 30 or a scribing device 40 is used to form the scribe lines of the glass layer and the resin layer.

  In the preprocessing step of the present embodiment, the first glass layer 11A and the first resin layer 11B are preprocessed by different means, and the second glass layer 12A and the second resin layer 12B are different. Pre-process by means. In an example of the pre-processing step, the scribing device 40 scribes the planned cutting part 16A of the first glass layer 11A, and the laser processing device 30 scribes the planned cutting part 16B of the first resin layer 11B. The planned cutting portion 17A of the second glass layer 12A is scribed by the scribe processing device 40, and the planned cutting portion 17B of the second resin layer 12B is scribed by the laser processing device 30. Thus, in this embodiment, the glass layer and the resin layer are preliminarily processed by different means.

  In the preliminary processing step, the laser processing apparatus 30 may scribe the planned cutting portion 16A of the first glass layer 11A, and the scribing processing apparatus 40 may scribe the planned cutting portion 16B of the first resin layer 11B. In the preliminary processing step, the laser processing device 30 may scribe the planned cutting part 17A of the second glass layer 12A, and the scribing device 40 may scribe the planned cutting part 17B of the second resin layer 12B.

  In the latter-stage laminating step, the first laminated substrate 11 not cut into a predetermined size and the second laminated substrate 12 not cut into a predetermined size are laminated. In one example, the first laminated substrate 11 and the second laminated substrate 12 are attached to each other via, for example, the adhesive layer SD. As a result, as shown in FIG. 7, the pre-processed multilayer laminated substrate 10 is manufactured.

  In the latter-stage cutting step, the planned cutting portion 16A that is preliminarily processed in the first glass layer 11A, the planned cutting portion 16B that is preliminarily processed in the first resin layer 11B, and the preliminary processing is performed in the second glass layer 12A. The planned cutting portion 17A and the planned cutting portion 17B that has been preliminarily processed in the second resin layer 12B are broken. As a result, the unit laminated substrate 20 is manufactured.

  A laser lift-off device (not shown) is used in the peeling process. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in FIG. 8A, the first resin layer 11B and the first glass layer 11A are separated by irradiating the first resin layer 11B with a laser from the first glass layer 11A side. When peeling off the first resin layer 11B and the first glass layer 11A, the laser is applied so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 8B, the second resin layer 12B and the second glass layer 12A are separated by irradiating the second resin layer 12B with a laser from the second glass layer 12A side. When peeling off the second resin layer 12B and the second glass layer 12A, the laser is applied so as to be orthogonal to the second plane 15B of the second glass layer 12A. The order of peeling the first glass layer 11A and the second glass layer 12A can be arbitrarily changed. For example, after peeling the second resin layer 12B and the second glass layer 12A, the first resin layer 11B and the first glass layer 11A may be peeled.

  After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see FIG. 8C), the first protective film is attached so as to cover the first resin layer 11B, and the second resin The flexible organic EL display is manufactured by attaching the second protective film so as to cover the layer 12B.

The effects of this embodiment will be described.
(1-1) In the method of manufacturing a flexible organic EL display, the multilayer laminated substrate 10 is cut into a predetermined size in a subsequent step that is a step after the step of laminating the first laminated substrate 11 and the second laminated substrate 12. In this manufacturing method, since the first laminated substrate 11 and the second laminated substrate 12 are cut in the laminated multilayer laminated substrate 10, the laminating operation is simplified. Therefore, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

  (1-2) In the method for manufacturing a flexible organic EL display, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the preliminary processing for breaking the second resin layer 12B are performed on the first glass layer. It includes a pre-processing step performed on each of the layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B. The unit laminated substrate 20 is manufactured by breaking the preliminarily processed multilayer laminated substrate 10. According to this manufacturing method, since the first glass layer 11A and the second glass layer 12A are not cut in the former step before the latter step, the first laminated substrate 11 and the second laminated substrate 12 in the latter step are not separated from each other. Workability for stacking is improved. Therefore, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

  (1-3) In the preliminary processing step, the first glass layer 11A and the first resin layer 11B are preprocessed by different means, and the second glass layer 12A and the second resin layer 12B are different. Pre-process by means. In this manufacturing method, the pre-processing suitable for each of the first glass layer 11A and the first resin layer 11B can be selected, and the pre-processing suitable for each of the second glass layer 12A and the second resin layer 12B can be selected. The first glass layer 11A and the first resin layer 11B are appropriately pre-processed, and the second glass layer 12A and the second resin layer 12B are appropriately pre-processed, and the quality at the time of cutting is improved.

  (1-4) In the preliminary processing step, the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50, and the first resin layer 11B and the second resin layer 12B are scribed by a laser. In this manufacturing method, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B can be scribed using an existing device.

  (1-5) Since the preliminary processing is included in the preceding step before the latter laminating step, the preliminary processing is performed in the state where the first laminated substrate 11 and the second laminated substrate 12 are not laminated. Each is applied to the second laminated substrate 12. Therefore, for example, unlike the case where the first resin layer 11B and the second resin layer 12B of the multilayer laminated substrate 10 are preprocessed by the laser, the laser is used for the preprocessing of the first resin layer 11B and the second resin layer 12B. Even though the first resin layer 11B and the second resin layer 12B are irradiated with the laser, the gas generated is prevented from staying in the multilayer laminated substrate 10. Therefore, the possibility that the quality of the first resin layer 11B and the second resin layer 12B is deteriorated due to the influence of gas is reduced.

(Second embodiment)
A method of manufacturing the flexible organic EL display of the second embodiment will be described with reference to FIGS. 9 to 13. The manufacturing method of the present embodiment is different from the manufacturing method of the first embodiment in that a pre-processing step is performed as a subsequent step. In the following description, parts different from the first embodiment will be described in detail, the same components as those of the first embodiment will be denoted by the same reference numerals, and the description thereof will be omitted.

  In this embodiment, the pre-processing step is performed after the post-lamination step and before the post-cutting step. In the pre-processing step of this embodiment, any of the following first to third examples can be selected. In the first example, the first glass layer 11A and the second glass layer 12A are scribed, and the first resin layer 11B and the second resin layer 12B are cooled. In the second example, the first glass layer 11A and the second glass layer 12A are scribed, and the first resin layer 11B and the second resin layer 12B are embrittled by a laser. In the third example, the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are scribed, respectively.

The first example will be described.
In the pre-processing step for the first glass layer 11A and the second glass layer 12A, the first glass layer 11A and the second glass layer 12A are scribed by, for example, a laser or a scribing wheel 50. In one example, the scribing wheel 50 scribes each of the first glass layer 11A and the second glass layer 12A. More specifically, a scribe line is formed in each of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A by the laser or the scribing wheel 50. In one example, the scribing wheel 50 forms a scribe line in each of the planned cutting part 16A of the first glass layer 11A and the planned cutting part 17A of the second glass layer 12A.

  In the preliminary processing step for the first resin layer 11B and the second resin layer 12B, the multilayer laminated substrate 10 is cooled to a temperature at which the first resin layer 11B and the second resin layer 12B become brittle. The embrittlement of the first resin layer 11B and the second resin layer 12B means that the first resin layer 11B and the second resin layer 12B are in a breakable state. In an example, in the cooling step, the multilayer laminated substrate 10 is cooled by housing the multilayer laminated substrate 10 in a cooling tank (not shown). As indicated by the thin dots in FIG. 9, the entire first resin layer 11B and the second resin layer 12B are embrittled in the cooling step. In the cooling step, instead of accommodating the multilayer laminated substrate 10 in the cooling tank, the cooling gas is blown to the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B by the cooling device. May be. The cooling device includes, for example, a blowing unit including a nozzle capable of locally blowing a cooling gas to the multilayer laminated substrate 10, a table on which the multilayer laminated substrate 10 is mounted, and a moving mechanism capable of moving the table three-dimensionally. With. The moving mechanism makes it possible to change the relative position between the nozzle outlet and the multilayer laminated substrate 10. Further, the moving mechanism may be configured to move the nozzle three-dimensionally instead of the movement of the table or in addition to the movement of the table.

  The order of performing the pre-processing can be arbitrarily changed. In one example, after scribing the first glass layer 11A and the second glass layer 12A, the first resin layer 11B and the second resin layer 12B are cooled. In one example, after cooling the first resin layer 11B and the second resin layer 12B, the first glass layer 11A and the second glass layer 12A are scribed. In one example, after scribing one of the first glass layer 11A and the second glass layer 12A, the first resin layer 11B and the second resin layer 12B are cooled, and finally the first glass layer 11A and the second glass layer 12A are Scribe the other.

The second example will be described.
The pre-processing step for the first glass layer 11A and the second glass layer 12A is the same as the pre-processing step for the first glass layer 11A and the second glass layer 12A of the first example.

  In the pre-processing step for the first resin layer 11B and the second resin layer 12B, as shown by the thin dots in FIG. 10, a UV laser is used to cut the planned cutting portion 16B of the first resin layer 11B and the planned cutting of the second resin layer 12B. By irradiating the portions 17B respectively, the planned cutting portions 16B of the first resin layer 11B and the planned cutting portions 17B of the second resin layer 12B are each embrittled. For example, a laser processing device 30 is used to embrittle the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B with the UV laser.

  The order in which the preliminary processing is performed on the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B can be arbitrarily changed. That is, as shown in FIG. 11, when the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are preliminarily processed, the processing order is P1 to P24. There are 24 patterns. In one example, a laser is used to form scribe lines on the first resin layer 11B and the second resin layer 12B, and then a scribing wheel 50 is used to form scribe lines on the first glass layer 11A and the second glass layer 12A. The first resin layer 11B and the second resin layer 12B may be preliminarily processed in this order, or the second resin layer 12B and the first resin layer 11B may be preliminarily processed in this order. The first glass layer 11A and the second glass layer 12A may be pre-processed in this order, or the second glass layer 12A and the first glass layer 11A may be pre-processed in this order.

The third example will be described.
In the pre-processing step, as shown in FIG. 12, an example of the pre-processing is a planned cutting part 16A of the first glass layer 11A, a planned cutting part 16B of the first resin layer 11B, and a planned cutting part of the second resin layer 12B. A scribe line is formed on each of 17B and the planned cutting portion 17A of the second glass layer 12A.

  Pre-processing is performed by laser or scribe. Preliminary processing with a laser can be performed on the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A. Pre-processing by scribing can be performed on the first glass layer 11A and the second glass layer 12A. In one example, in the pre-processing step, the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50, and the first resin layer 11B and the second resin layer 12B are scribed by laser.

  Moreover, when forming a scribe line in each of the glass layer and the resin layer by a laser, the laser processing apparatus 30A shown in FIG. 13 is used instead of the laser processing apparatus 30 shown in FIG. The laser processing device 30A is different from the laser processing device 30 in the configuration of the laser device. Hereinafter, a different configuration of the laser processing device 30A will be described.

The laser device 31A of the laser processing device 30A has a first laser oscillator 34A and a second laser oscillator 34B. The first laser oscillator 34A is a UV laser and the second laser oscillator 34B is a CO ₂ laser. The laser light emitted from the first laser oscillator 34A and the laser light emitted from the second laser oscillator 34B are emitted to the multilayer laminated substrate 10 via the transmission optical system 35. The transmission optical system 35 may be provided with a transmission optical system corresponding to the first laser oscillator 34A and a transmission optical system corresponding to the second laser oscillator 34B separately.

  The first control unit 33 selects the first laser oscillator 34A and the second laser oscillator 34B according to the type (glass layer or resin layer) of the processing target for the multilayer laminated substrate 10. For example, the first control unit 33 determines the processing order of the glass layer and the resin layer, which are the types of processing targets, according to a control program stored in advance, and the first laser oscillator 34A and the second laser oscillator according to the determined processing order. Select 34B.

  In the pre-processing step of the third example, for example, pre-processing is performed on the first glass layer 11A and the second glass layer 12A and the first resin layer 11B and the second resin layer 12B by different means. In one example, in the pre-processing step, the first glass layer 11A and the second glass layer 12A are pre-processed by scribe, and the first resin layer 11B and the second resin layer 12B are pre-processed by laser. In this case, the order of performing pre-processing on the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B can be arbitrarily changed. As in the second example, the order of performing the pre-processing is as shown in FIG. 11, where the first glass layer 11A, the second glass layer 12A, the first resin layer 11B, and the second resin layer 12B are pre-processed. In the case of applying, the processing order has 24 patterns of P1 to P24.

The effects of this embodiment will be described.
(2-1) In the preliminary processing step, the first glass layer 11A and the second glass layer 12A are scribed, and the first resin layer 11B and the second resin layer 12B are cooled. In this manufacturing method, the first resin layer 11B and the second resin layer 12B are broken without forming scribe lines. For example, as compared with the case where a scribe line is formed in the first resin layer 11B and the second resin layer 12B by laser, the first resin layer 11B and the first resin layer 11B and the first resin layer 11B and the second resin layer 12B are broken before the break. The influence of heat on the second resin layer 12B is small, and the quality of the first resin layer 11B and the second resin layer 12B is less likely to deteriorate.

  (2-2) In the preliminary processing step, the first glass layer 11A and the second glass layer 12A are scribed by the scribing wheel 50, and the first resin layer 11B and the second resin layer 12B are scribed by a laser. In this manufacturing method, the first glass layer 11A, the first resin layer 11B, the second resin layer 12B, and the second glass layer 12A can be scribed using existing devices.

(Modification)
Each of the above embodiments is an example of a form that the method for manufacturing a flexible organic EL display according to the present disclosure can take, and is not intended to limit the form. The method of manufacturing the flexible organic EL display according to the present disclosure may take a form different from the form exemplified in each embodiment. An example thereof is a form in which a part of the configuration of each embodiment is replaced, changed, or omitted, or a configuration in which a new configuration is added to each embodiment. In the following modified examples, the same parts as those of the embodiments are designated by the same reference numerals, and the description thereof will be omitted.

  In the preliminary processing step of the first embodiment, at least one of the first laminated substrate 11 and the second laminated substrate 12 is subjected to the preliminary processing of the first example or the second example of the preliminary processing step of the second embodiment. May be.

  In each of the embodiments, instead of forming the conductive layer 13 on the first laminated substrate 11 or in addition to forming the conductive layer 13 on the first laminated substrate 11, the conductive layer 13 is formed on the second laminated substrate 12. Layer 13 may be formed.

  In the pre-processing step of each embodiment, the first glass layer 11A and the first resin layer 11B may be pre-processed by the same means. In an example of the pre-processing step, the scribing device 40 scribes each of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 16B of the first resin layer 11B. Further, in an example of the preliminary processing step, the laser processing device 30 scribes each of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 16B of the first resin layer 11B.

  In the preliminary processing step, the second glass layer 12A and the second resin layer 12B may be preprocessed by the same means. In an example of the pre-processing step, the scribing device 40 scribes each of the planned cutting portion 17A of the second glass layer 12A and the planned cutting portion 17B of the second resin layer 12B. Further, in an example of the preliminary processing step, the laser processing device 30 scribes each of the planned cutting portion 17A of the second glass layer 12A and the planned cutting portion 17B of the second resin layer 12B.

  When each of the first glass layer 11A and the first resin layer 11B is scribed by a laser in the preliminary processing step, it is preferable to use the laser processing apparatus 30A of FIG. 13 instead of the laser processing apparatus 30 of FIG. Further, when each of the second glass layer 12A and the second resin layer 12B is scribed by a laser, it is preferable to use the laser processing device 30A of FIG.

  In each embodiment, after bonding the first unit laminated board which is the first laminated board 11 having a predetermined size and the second laminated board 12 which has not been cut into the predetermined size, the second laminated board 12 is predetermined. The unit laminated substrate 20 may be manufactured by cutting into a size. Also, after bonding the second unit laminated board, which is the second laminated board 12 of a predetermined size, and the first laminated board 11 before being cut into a predetermined size, the first laminated board 11 is cut into a predetermined size. The unit laminated substrate 20 may be manufactured. That is, the former step includes one of a first cutting step of cutting the first laminated substrate 11 into a predetermined size and a second cutting step of cutting the second laminated substrate 12 into a predetermined size. One of the first cutting step and the second cutting step is performed after the preliminary processing step. Therefore, in the first cutting step, the first glass layer 11A and the first resin layer 11B are broken, and in the second cutting step, the second glass layer 12A and the second resin layer 12B are broken. The order of the first cutting process and the second cutting process can be arbitrarily changed. The latter step includes the other of the first cutting step of cutting the first laminated substrate 11 into a predetermined size and the second cutting step of cutting the second laminated substrate 12 into a predetermined size.

10: multilayer laminated substrate 11: first laminated substrate 11A: first glass layer 11B: first resin layer 12: second laminated substrate 12A: second glass layer 12B: second resin layer 50: scribing wheel

Claims (5)

A plurality of laminated substrates in which a glass layer and a resin layer are laminated, wherein the plurality of laminated substrates are a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a first laminated substrate. A method for manufacturing a flexible organic EL display, which comprises a second laminated substrate in which two resin layers are laminated, and a multilayer laminated substrate in which the first resin layer and the second resin layer are laminated so as to face each other. hand,
A pre-processing step of subjecting each of the glass layer and the resin layer to a pre-processing for breaking the glass layer and the resin layer of the multilayer laminated substrate;
A method of manufacturing a flexible organic EL display, which includes a post-cutting step of breaking the preliminarily processed multilayer laminated substrate. The method of manufacturing a flexible organic EL display according to claim 1, wherein in the preliminary processing step, the preliminary processing is performed on the glass layer and the resin layer by different means. The method of manufacturing a flexible organic EL display according to claim 2, wherein in the preliminary processing step, the glass layer is scribed and the resin layer is cooled. The method for manufacturing a flexible organic EL display according to claim 2, wherein in the preliminary processing step, the glass layer is scribed by a scribing wheel and the resin layer is scribed by a laser. The method for manufacturing a flexible organic EL display according to claim 1, wherein the preliminary processing step is included in a preceding step prior to the step of stacking the plurality of laminated substrates.