JP2020071969A - Flexible organic el display manufacturing method - Google Patents

Abstract

To provide a flexible organic EL display manufacturing method that does not easily reduce manufacturing efficiency.SOLUTION: A flexible organic EL display manufacturing method is related to manufacturing of a multilayer laminated substrate that includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated, and in which the first resin layer 11B and the second resin layer 12B are laminated so as to face each other. The manufacturing method includes a pre-stage step that is a step prior to a step of laminating the first laminated substrate 11 and the second laminated substrate 12. The pre-stage step includes a pre-laminating step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. In the pre-laminating step, at least one of a planned cutting portion 16A for cutting in the first glass layer 11A and a planned cutting portion 17A for cutting in the second glass layer 12A is not covered with resin.SELECTED DRAWING: Figure 6

Description

  The present invention relates to a method for manufacturing a flexible organic EL display.

  An organic EL (electro luminescence) display includes a light emitting device in which a light emitting layer, electrodes, and a substrate are laminated. In a flexible organic EL display, a flexible substrate is used as the substrate. In a manufacturing process of a flexible organic EL display, a resin layer is formed on a glass layer, and a light emitting layer and the like are formed on the resin layer (for example, Patent Document 1).

Republished Patent WO2011 / 030716

  A light emitting device having a new structure has been proposed. This light emitting device has a first resin layer and a second resin layer provided so as to face each other. A light emitting layer or the like is provided between the first resin layer and the second resin layer. Since the structure of the light emitting device is different from that of the conventional light emitting device, the manufacturing efficiency of the light emitting device having a new structure may be reduced.

  An object of the present invention is to provide a method for manufacturing a flexible organic EL display in which manufacturing efficiency is less likely to decrease.

A method for manufacturing a flexible organic EL display according to the present invention includes a plurality of laminated substrates in which a glass layer and a resin layer are laminated, and the plurality of laminated substrates include a first glass layer and a first resin layer laminated. A multi-layer laminated substrate including one laminated substrate and a second laminated substrate in which a second glass layer and a second resin layer are laminated, and laminated so that the first resin layer and the second resin layer face each other. A method of manufacturing a flexible organic EL display relating to the manufacturing of, including a pre-stage step that is a step prior to the step of laminating the plurality of laminated substrates, wherein the pre-stage step is at least one of the plurality of laminated substrates, The method includes a pre-stage laminating step of forming the resin layer on the glass layer so that a portion to be cut in the glass layer, which is to be cut, is not covered with the resin.
In this manufacturing method, it is not necessary to cut the resin layer corresponding to the planned cutting portion of at least one glass layer of the plurality of laminated substrates in the process after the process of laminating the plurality of laminated substrates (hereinafter referred to as the “post-stage process”). The number of processes required for a multilayer laminated substrate having a more complicated structure than that of the laminated substrate is reduced, and the complexity of the work is reduced.

In an example of the method for manufacturing the flexible organic EL display, in the pre-stage laminating step, a groove is formed in the planned cutting portion of the glass layer, and the resin layer is formed in the glass layer so that the groove is exposed.
For example, when the varnish that is the base of the resin layer is applied to the glass layer, the varnish of the coating device does not come into contact with the portion of the glass layer where the groove is formed, and the varnish is applied to the portion of the glass layer excluding the planned cutting portion. Is applied. The work of removing the resin layer corresponding to the part to be cut becomes unnecessary, and the complexity of the work is reduced.

In one example of the method of manufacturing the flexible organic EL display, in the pre-stage laminating step, the resin layer is formed on the glass layer, and a portion of the resin layer corresponding to the planned cutting portion of the glass layer is removed.
With this manufacturing method, it is possible to accurately form a state in which the planned cutting portion of the glass layer is not covered with the resin.

In one example of the method of manufacturing the flexible organic EL display, in the preceding laminating step, a mask is formed on the planned cutting portion of the glass layer, the resin layer is formed on the glass layer, and the mask is removed.
With this manufacturing method, it is possible to accurately form a state in which the planned cutting portion of the glass layer is not covered with the resin.

An example of the method for manufacturing the flexible organic EL display further includes a post-stage step that is a step after the step of laminating the plurality of laminated substrates, and the latter step includes a step of cutting the glass layers of the plurality of laminated substrates. Including a cutting step.
In this manufacturing method, since the glass layer is not cut in the preceding step prior to the step of laminating a plurality of laminated substrates, workability in laminating a plurality of laminated substrates is improved.

  According to the present invention, the manufacturing efficiency of a flexible organic EL display is less likely to decrease.

Sectional drawing of the multilayer laminated substrate regarding the manufacturing method of embodiment. The top view of the multilayer laminated substrate of FIG. The schematic diagram which shows the structure of a laser processing apparatus. The schematic diagram which shows the structure of a scribe processing apparatus. 3 is a flowchart showing a manufacturing method of the embodiment. The figure which shows the 1st example of a front | former stage lamination process. The figure which shows the 2nd example of a front | former stage lamination process. The figure which shows the 3rd example of a front | former stage lamination process. The figure which shows the example of a latter stage lamination process. The figure which shows an example of a peeling process. Sectional drawing of the laminated substrate regarding the manufacturing method of a modification.

(Embodiment)
A method for manufacturing a flexible organic EL display will be described with reference to the drawings. Flexible organic EL displays are used in stationary devices, mobile devices, and the like. An example of a stationary device is a personal computer and a television receiver. Examples of mobile devices are personal digital assistants, wearable computers, and notebook personal computers. Examples of mobile information terminals are smartphones, tablets, and mobile game consoles. Examples of wearable computers are head mounted displays and smart watches.

  The flexible organic EL display has a light emitting device in which a light emitting layer, an electrode, and a substrate are laminated, a first protective film that covers the light emitting device from one side, and a second protective film that covers the light emitting device from the other side. PET (polyethylene terephthalate) is used for the first protective film and the second protective film, respectively. One of the first protective film and the second protective film may be omitted. In the manufacturing process of the light emitting device, a plurality of light emitting devices are manufactured from the single multilayer laminated substrate 10 shown in FIG.

  The multilayer laminated substrate 10 is manufactured at an intermediate stage of manufacturing a flexible organic EL display. The multilayer laminated substrate 10 includes a first laminated substrate 11 in which a first glass layer 11A and a first resin layer 11B are laminated, and a second laminated substrate 12 in which a second glass layer 12A and a second resin layer 12B are laminated. Have and. The multilayer laminated substrate 10 is configured by laminating the first laminated substrate 11 and the second laminated substrate 12 such that the first resin layer 11B and the second resin layer 12B face each other. The multilayer laminated substrate 10 further includes a conductive layer 13. The conductive layer 13 is formed on the first resin layer 11B of the first laminated substrate 11, for example. The conductive layer 13 is sandwiched between the first resin layer 11B and the second resin layer 12B. The conductive layer 13 is formed with an electronic device member such as an OLED (Organic Light Diode) or a TFT (Thin Film Transistor). The first resin layer 11B, the conductive layer 13, and the second resin layer 12B form a light emitting device.

  The first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are made of the same material and have the same size. The composition of the first glass layer 11A and the second glass layer 12A is not particularly limited, but glass having various compositions such as glass containing an alkali metal oxide or non-alkali glass can be used. An example of glass containing an alkali metal oxide is soda lime glass. In this embodiment, non-alkali glass is used for the first glass layer 11A and the second glass layer 12A. The thickness of each of the first glass layer 11A and the second glass layer 12A is not particularly limited, but is preferably about 0.5 mm, for example. The first glass layer 11A has a first flat surface 14A on which the first resin layer 11B is formed, and a second flat surface 14B paired with the first flat surface 14A. The second glass layer 12A has a first flat surface 15A on which the second resin layer 12B is formed, and a second flat surface 15B paired with the first flat surface 15A.

  The first resin layer 11B of the first laminated substrate 11 and the second resin layer 12B of the second laminated substrate 12 are made of the same material and have the same size. The compositions of the first resin layer 11B and the second resin layer 12B are not particularly limited, but polyimide (PI) can be used, for example. The thickness of each of the first resin layer 11B and the second resin layer 12B is not particularly limited, but is preferably in the range of 10 μm or more and 30 μm or less, for example.

FIG. 2 is a plan view of the multilayer laminated substrate 10.
A plurality of unit laminated substrates 20 are formed by cutting the multilayer laminated substrate 10 along the planned cutting portions 16 and 17 indicated by broken lines in FIG. The size of the unit laminated substrate 20 in plan view corresponds to the predetermined size of the light emitting device in plan view.

  At least one of a laser processing device and a scribing device is used to cut the multilayer laminated substrate 10. FIG. 3 is an example of the configuration of the laser processing apparatus, and FIG. 4 is an example of the configuration of the scribing apparatus. 3 and 4, the X-axis direction, the Y-axis direction, and the Z-axis direction are defined as shown in FIGS. 3 and 4. In addition, in this specification, when describing as "scribe", it indicates a scribe by a scribe processing apparatus.

  As shown in FIG. 3, the laser processing apparatus 30 includes a laser device 31 for cutting the multilayer laminated substrate 10, a mechanical drive system 32 for moving the multilayer laminated substrate 10 with respect to the laser device 31, and a laser. A first control unit 33 that controls the device 31 and the mechanical drive system 32.

The laser device 31 can process at least one of the first resin layer 11B and the second resin layer 12B and the first glass layer 11A and the second glass layer 12A in the multilayer laminated substrate 10. The laser device 31 has a laser oscillator 34 for irradiating the multilayer laminated substrate 10 with laser light, and a transmission optical system 35 for transmitting the laser light to the mechanical drive system 32. The laser oscillator 34 is, for example, a UV (Ultra Violet) laser or a CO ₂ laser. When the laser processing device 30 processes the first resin layer 11B and the second resin layer 12B, the laser oscillator 34 is a UV laser. When the laser processing device 30 processes the first glass layer 11A and the second glass layer 12A, the laser oscillator 34 is a CO ₂ laser or a UV laser. The transmission optical system 35 includes, for example, a condenser lens, a plurality of mirrors, a prism, a beam expander, and the like. Further, the transmission optical system 35 has an X-axis direction moving mechanism for moving the laser irradiation head in which the laser oscillator 34 is incorporated, for example, in the X-axis direction. The laser light emitted from the laser oscillator 34 is emitted toward the multilayer laminated substrate 10 via the transmission optical system 35.

  The mechanical drive system 32 is arranged to face the laser device 31 in the Z-axis direction. The mechanical drive system 32 includes a bed 36, a processing table 37, and a moving device 38. The multilayer laminated substrate 10 is placed on the processing table 37. The moving device 38 moves the processing table 37 in the horizontal direction (X-axis direction and Y-axis direction) with respect to the bed 36. The moving device 38 is a known mechanism having a guide rail, a moving table, a motor, and the like.

  The first controller 33 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU (Central Processing Unit) or an MPU (Micro Processing Unit). The first control unit 33 may include one or more microcomputers. The first control unit 33 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The first control unit 33 may be provided in the laser device 31, may be provided in the mechanical drive system 32, or may be provided separately from the laser device 31 and the mechanical drive system 32. When the first control unit 33 is provided separately from the laser device 31 and the mechanical drive system 32, the arrangement position of the first control unit 33 can be set arbitrarily.

  As shown in FIG. 4, in the scribing apparatus 40, the scribing wheel 50 and the multilayer laminated substrate 10 are relatively moved in the X-axis direction and the Y-axis direction, whereby the multilayer laminated substrate 10 is moved in the X-axis direction and the Y-axis direction. Form a scribe line along the direction. The scribing processing device 40 includes a processing device 41 for processing the multilayer laminated substrate 10, a transport device 42 for transporting the multilayer laminated substrate 10, and a second controller 43 for controlling the processing device 41 and the transport device 42. Equipped with.

  The transfer device 42 includes a pair of rails 44, a table 45, a linear drive device 46, a rotation device 47, and the like. The pair of rails 44 extend along the Y-axis direction. In the scribing device 40 of FIG. 4, a pair of rails 44 are arranged on the base (not shown) of the scribing device 40, and the linear drive device 46 causes the table 45 to reciprocate along the pair of rails 44, and the rotating device 47. This causes the table 45 to rotate about the central axis C. The multilayer laminated substrate 10 is placed on the table 45. An example of the linear drive device 46 has a feed screw device. The rotating device 47 has a motor that serves as a drive source.

  The processing device 41 includes a lateral drive device 48, a vertical drive device 49, a scribing wheel 50, and the like. The scribing wheel 50 is attached to a holder unit for holding the scribing wheel 50. The holder unit is attached to a scribing head for holding the holder unit. The scribing head is moved in the X-axis direction by the lateral drive device 48, and is moved in the Z-axis direction by the vertical drive device 49. By moving the scribing wheel 50 in the X-axis direction, a scribe line is formed in the multilayer laminated substrate 10 along the X-axis direction.

  The scribing wheel 50 is rotatably supported by a pin (not shown) attached to the holder unit. Examples of the material forming the scribing wheel 50 are sintered diamond (Poly Crystalline Diamond), cemented carbide, single crystal diamond, and polycrystalline diamond.

  The second control unit 43 has an arithmetic processing unit that executes a predetermined control program. The arithmetic processing unit has, for example, a CPU or MPU. The second control unit 43 may have one or more microcomputers. The second control unit 43 further includes a storage unit. The storage unit stores various control programs and information used for various control processes. The storage unit has, for example, a non-volatile memory and a volatile memory. The second controller 43 may be provided in the processing device 41, may be provided in the transport device 42, or may be provided separately from the processing device 41 and the transport device 42. When the second control unit 43 is provided separately from the processing device 41 and the transfer device 42, the arrangement position of the second control unit 43 can be set arbitrarily.

[Method for manufacturing flexible organic EL display]
Next, details of the method for manufacturing the flexible organic EL display will be described. FIG. 5 shows an example of steps of a method for manufacturing a flexible organic EL display.

  In the method of manufacturing a flexible organic EL display, after the first laminated substrate 11 and the second laminated substrate 12 are bonded to each other to produce the multilayer laminated substrate 10, the multilayer laminated substrate 10 is cut into a predetermined size to produce the unit laminated substrate 20. .. Next, the light emitting device is manufactured by removing the first glass layer 11A and the second glass layer 12A from the unit laminated substrate 20. Then, the first protective film and the second protective film are attached to the first resin layer 11B and the second resin layer 12B. Thereby, a flexible organic EL display is manufactured.

  As shown in FIG. 5, in the method for manufacturing a flexible organic EL display, a first step which is a step prior to the step of stacking the first laminated substrate 11 and the second laminated substrate 12, a first laminated substrate 11 and a second laminated substrate 11 The two-layer substrate 12 is divided into a subsequent step, which is a step after the step of stacking the two-layer board 12. The pre-stage process includes a pre-stage lamination process. The pre-stage laminating step is a step of manufacturing the first laminated substrate 11 and the second laminated substrate 12. The post-stage process includes a post-stage stacking process, a post-stage cutting process, and a peeling process. The latter-stage laminating step is a step of laminating the first laminated substrate 11 and the second laminated substrate 12 to manufacture the multilayer laminated substrate 10. In the latter-stage cutting step, the unit laminated board 20 is manufactured by cutting the multilayer laminated board 10 along the planned cutting portions 16 and 17 of the multilayer laminated board 10, that is, by cutting the multilayer laminated board 10 into a predetermined size. It is a process. The peeling step is a step of peeling the first glass layer 11A and the first resin layer 11B and peeling the second glass layer 12A and the second resin layer 12B by laser lift off (LLO). The details of each step will be described below.

  In the first-stage laminating step, the first laminated substrate 11 is manufactured by forming the first resin layer 11B on the first plane 14A of the first glass layer 11A, and the second resin layer is formed on the first plane 15A of the second glass layer 12A. The second laminated substrate 12 is manufactured by forming 12B. The method for forming the first resin layer 11B on the first flat surface 14A of the first glass layer 11A and the method for forming the second resin layer 12B on the first flat surface 15A of the second glass layer 12A are respectively the resin for the glass layer. A method of applying a layer or a method of laminating a resin layer on a glass layer via an adhesive layer can be selected. As a method for fixing the resin layer to the glass layer, heat curing treatment or heating and pressure treatment by a pressing method can be selected.

  In the first-stage laminating step, any one of the following first to third examples can be selected. The pre-stage laminating step is common to the first laminated substrate 11 and the second laminated substrate 12 in each of the first to third examples, and therefore the first laminated substrate 11 and the second laminated substrate 12 are shown in FIGS. 6 to 8. Are also attached.

  In the first example and the second example, the first glass layer 11A is provided with the first glass layer 11A so that the planned cutting portion 16 that is scheduled to be cut in the first glass layer 11A of the first laminated substrate 11 is not covered with the first resin layer 11B. 1 Resin layer 11B is formed. The second resin layer 12B is formed on the second glass layer 12A so that the planned cutting portion 17 of the second glass layer 12A of the second laminated substrate 12 that is to be cut is not covered with the second resin layer 12B.

  In the first example, as shown in FIG. 6, the groove 18 is formed in the planned cutting portion 16A of the first glass layer 11A, and the first resin layer 11B is formed in the first glass layer 11A so that the groove 18 is exposed. Form. The groove 18 is open to the first plane 14A side of the first glass layer 11A. The groove 19 is formed in the planned cutting portion 17A of the second glass layer 12A, and the second resin layer 12B is formed in the second glass layer 12A so that the groove 19 is exposed. The groove 19 is open to the first plane 15A side of the second glass layer 12A. The grooves 18 and 19 are formed by, for example, dicing. For example, in the method of applying the first resin layer 11B made of varnish to the first glass layer 11A with a roller or the like, the varnish is not applied to the grooves 18 of the first glass layer 11A. The first resin layer 11B can be formed such that the first resin layer 11B is exposed. The same applies to the method of applying the second resin layer 12B to the second glass layer 12A with a roller or the like. The groove 18 may be formed only in the planned cutting portion 16A of the first glass layer 11A, or the groove 19 may be formed only in the planned cutting portion 17A of the second glass layer 12A.

  In the second example, as shown in FIG. 7, the mask MS1 is formed on the planned cutting portion 16A of the first glass layer 11A, and the first resin layer 11B is formed on the first glass layer 11A. The mask MS1 is formed on the first plane 14A side of the first glass layer 11A. In this case, the first resin layer 11B is not formed on the planned cutting portion 16A of the first glass layer 11A by the mask MS1. After that, the mask MS1 is removed. Further, the mask MS2 is formed on the planned cutting portion 17A of the second glass layer 12A, and the second resin layer 12B is formed on the second glass layer 12A. The mask MS2 is formed on the first plane 15A side of the second glass layer 12A. In this case, the second resin layer 12B is not formed on the planned cutting portion 17A of the second glass layer 12A by the mask MS2. After that, the mask MS2 is removed. The mask MS1 may be formed only on the planned cutting portion 16A of the first glass layer 11A, or the mask MS2 may be formed only on the planned cutting portion 17A of the second glass layer 12A.

  In the third example, as shown in FIG. 8, after forming the first resin layer 11B on the first glass layer 11A, a portion of the first resin layer 11B corresponding to the planned cutting portion 16A of the first glass layer 11A. The (planned cutting portion 16B) is removed. In addition, after forming the second resin layer 12B on the second glass layer 12A, a portion (planned cutting portion 17B) corresponding to the planned cutting portion 17A of the second glass layer 12A in the second resin layer 12B is removed. The first resin layer 11B and the second resin layer 12B are removed by any of laser, break, and dicing. In addition, only one of the portion of the first resin layer 11B corresponding to the planned cutting portion 16B of the first glass layer 11A and the portion of the second resin layer 12B corresponding to the planned cutting portion 17B of the second glass layer 12B is removed. Good.

  In the latter-stage laminating step, the first laminated substrate 11 not cut into a predetermined size and the second laminated substrate 12 not cut into a predetermined size are laminated. In one example, the first laminated substrate 11 and the second laminated substrate 12 are attached to each other via, for example, the adhesive layer SD. Thereby, the multilayer laminated substrate 10 is manufactured. At least one of the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B is removed in advance from the multilayer laminated substrate 10 manufactured through the former laminating step of the present embodiment and the latter laminating step. It is composed of In one example, as shown in FIG. 9, the first laminated substrate 11 and the second laminated substrate 12 manufactured according to the second example or the third example of the former laminating step are laminated in the latter laminating step to form a multilayer laminated board. 10 are manufactured. The multilayer laminated substrate 10 of FIG. 9 is configured in a state where the planned cutting portion 16B of the first resin layer 11B and the planned cutting portion 17B of the second resin layer 12B are removed.

  In the latter-stage cutting step, the first glass layer 11A of the first laminated substrate 11 and the second glass layer 12A of the second laminated substrate 12 are each cut. More specifically, in the latter-stage cutting step, the unit laminated substrate 20 is manufactured by cutting the planned cutting part 16A of the first glass layer 11A and the planned cutting part 17A of the second glass layer 12A. In the latter-stage cutting step, the planned cutting part 16A of the first glass layer 11A may be cut by laser or dicing, or the planned cutting part 16A of the first glass layer 11A may be scribed by a laser or a scribing wheel 50 and then broken. May be cut. In the latter-stage cutting step, the planned cutting part 17A of the second glass layer 12A may be cut by laser or dicing, or the planned cutting part 17A of the second glass layer 12A may be scribed by a laser or a scribing wheel 50 and then broken. May be cut. The order of cutting the first glass layer 11A and the second glass layer 12A can be set arbitrarily.

  A laser lift-off device (not shown) is used in the peeling process. In this embodiment, a UV laser is used as the laser of the laser lift-off device. As shown in FIG. 10A, the first resin layer 11B and the first glass layer 11A are separated by irradiating the first resin layer 11B with a laser from the first glass layer 11A side. When peeling off the first resin layer 11B and the first glass layer 11A, the laser is applied so as to be orthogonal to the second plane 14B of the first glass layer 11A. Next, as shown in FIG. 10B, the second resin layer 12B and the second glass layer 12A are separated by irradiating the second resin layer 12B with a laser from the second glass layer 12A side. When peeling off the second resin layer 12B and the second glass layer 12A, the laser is applied so as to be orthogonal to the second plane 15B of the second glass layer 12A. The order of peeling the first glass layer 11A and the second glass layer 12A can be arbitrarily changed. For example, after peeling the second resin layer 12B and the second glass layer 12A, the first resin layer 11B and the first glass layer 11A may be peeled.

  After the first glass layer 11A and the second glass layer 12A are removed from the multilayer laminated substrate 10 (see FIG. 10C), the first protective film is attached so as to cover the first resin layer 11B, and the second resin The flexible organic EL display is manufactured by attaching the second protective film so as to cover the layer 12B.

The effects of this embodiment will be described.
(1) In the method for manufacturing a flexible organic EL display, the multilayer laminated substrate 10 is cut into a predetermined size in a subsequent step that is a step after the step of laminating the first laminated substrate 11 and the second laminated substrate 12. In this manufacturing method, since the first laminated substrate 11 and the second laminated substrate 12 are cut in the laminated multilayer laminated substrate 10, the laminating operation is simplified. Therefore, the manufacturing efficiency of the flexible organic EL display is unlikely to decrease.

  (2) The first resin layer 11B and the second resin layer 12B are formed so that at least one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A is not covered with the resin in the preceding laminating step. Form. In this manufacturing method, it is not necessary to cut at least one of the planned cutting part 16B of the first resin layer 11B and the planned cutting part 17B of the second resin layer 12B in the subsequent step. The number of processes required for the multilayer laminated substrate 10 having a more complicated structure than the first laminated substrate 11 and the second laminated substrate 12 is reduced, and the complexity of the work is eased.

  In addition, when the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A are not covered with the resin, in the subsequent cutting step, for example, the first resin layer 11B and the second resin layer 11B are cut by a laser. Do not cut layer 12B. Since gas generation due to laser irradiation to the first resin layer 11B and the second resin layer 12B is avoided, it is possible to prevent deterioration of the quality of the first resin layer 11B and the second resin layer 12B due to the gas. When one of the planned cutting part 16A of the first glass layer 11A and the planned cutting part 17A of the second glass layer 12A is not covered with the resin in the first-stage laminating step, the planned cutting part 16B of the first resin layer 11B and the second resin A space is formed between one of the planned cutting portions 17B of the layer 12B and a glass layer corresponding to one of the first resin layer 11B and the second resin layer 12B. In the latter cutting step, for example, when the other of the first resin layer 11B and the second resin layer 12B is cut by a laser, the gas accompanying the laser irradiation of the other of the first resin layer 11B and the second resin layer 12B stays in the space. Therefore, the possibility that the quality of the first resin layer 11B and the second resin layer 12B is deteriorated due to the gas is reduced.

  (3) Grooves 18 and 19 are formed in the first glass layer 11A and the second glass layer 12A in the first-stage laminating step, and the first resin layer 11B is formed in the first glass layer 11A so that the groove 18 is exposed. A second resin layer 12B is formed on the second glass layer 12A so that 19 is exposed. For example, when the varnish that is the base of the first resin layer 11B and the second resin layer 12B is applied to the first glass layer 11A and the second glass layer 12A, the varnish of the application device is applied to the portions where the grooves 18 and 19 are formed. However, the varnish is applied to the portions of the first glass layer 11A other than the planned cutting portion 16A and the second glass layer 12A other than the planned cutting portion 17A. The work of removing the first resin layer 11B and the second resin layer 12B corresponding to the planned cutting portions 16A and 17A becomes unnecessary, and the complexity of the work is reduced. In addition, when the groove 18 is formed in the first glass layer 11A and the groove 19 is not formed in the second glass layer 12A, the work of removing the first resin layer 11B corresponding to the planned cutting portion 16A becomes unnecessary, and the multilayer stacking is performed. The complexity of the work of processing the substrate 10 is alleviated. When the groove 19 is formed in the second glass layer 12A and the groove 18 is not formed in the first glass layer 11A, the work of removing the second resin layer 12B corresponding to the planned cutting portion 17A becomes unnecessary, and the multilayer laminated substrate 10 The complexity of the processing work is reduced.

  (4) In the pre-stage laminating step, the mask MS1 is formed on the planned cutting portion 16A of the first glass layer 11A, the first resin layer 11B is formed on the first glass layer 11A, and the mask MS1 is removed. The mask MS2 is formed on the planned cutting portion 17A of the second glass layer 12A, the second resin layer 12B is formed on the second glass layer 12A, and the mask MS2 is removed. With this manufacturing method, it is possible to accurately form a state in which the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A are not covered with the resin. If the mask MS1 is formed on the planned cutting portion 16A of the first glass layer 11A and the mask MS2 is not formed on the planned cutting portion 17A of the second glass layer 12A, the planned cutting portion 16A of the first glass layer 11A is made of resin. The state not covered with can be accurately formed. When the mask MS2 is formed on the planned cutting portion 17A of the second glass layer 12A and the mask MS1 is not formed on the planned cutting portion 16A of the first glass layer 11A, the planned cutting portion 17A of the second glass layer 12A is covered with the resin. It is possible to accurately form a state that is not performed.

  (5) In the first-stage laminating step, the first resin layer 11B is formed on the first glass layer 11A, the second resin layer 12B is formed on the second glass layer 12A, and the planned cutting portion 16B of the first resin layer 11B and the second resin layer 12B are formed. At least one of the planned cutting portions 17B of the resin layer 12B is removed. With this manufacturing method, it is possible to accurately form a state in which at least one of the planned cutting portion 16A of the first glass layer 11A and the planned cutting portion 17A of the second glass layer 12A is not covered with the resin. When the planned cutting part 16B of the first resin layer 11B is removed and the planned cutting part 17B of the second resin layer 12B is not removed, the planned cutting part 16A of the first glass layer 11A is not covered with the resin. Can be accurately formed. When the planned cutting part 17B of the second resin layer 12B is removed and the planned cutting part 16B of the first resin layer 11B is not removed, the state where the planned cutting part 17A of the second glass layer 12A is not covered with the resin is accurate. Can be formed into

(Modification)
The above embodiment is an example of a form that the method for manufacturing a flexible organic EL display according to the present disclosure can take, and is not intended to limit the form. The method for manufacturing the flexible organic EL display according to the present disclosure may take a form different from the form exemplified in the embodiment. An example thereof is a form in which a part of the configuration of the embodiment is replaced, changed, or omitted, or a configuration in which a new configuration is added to the embodiment. In the following modified examples, the same parts as those of the embodiment are designated by the same reference numerals and the description thereof will be omitted.

  In the embodiment, the laminated substrate 60 may be manufactured instead of the multilayer laminated substrate 10. As shown in FIG. 11, the laminated substrate 60 is configured by laminating a glass layer 61 and a resin layer 62. The glass layer 61 has a first flat surface 63A on which the resin layer 62 is formed and a second flat surface 63B paired with the first flat surface 63A. The laminated substrate 60 further includes a conductive layer 65. The conductive layer 65 is the same as the conductive layer 13 of the embodiment. The resin layer 62 and the conductive layer 65 form a light emitting device. The composition of the glass layer 61 is, for example, the same as the composition of the first glass layer 11A or the second glass layer 12A of the embodiment. The composition of the resin layer 62 is, for example, the same as the composition of the first resin layer 11B or the second resin layer 12B of the embodiment.

  The manufacturing method of the flexible organic EL display includes a laminating step, a cutting step, and a peeling step. The laminating step is a step of manufacturing the laminated substrate 60 by laminating the resin layer 62 on the glass layer 61. The manufacturing of the laminated substrate 60 in the laminating step is similar to the manufacturing of the first laminated substrate 11 in the pre-stage laminating step of the embodiment. That is, the portion to be cut 64B of the resin layer 62 of the laminated substrate 60 manufactured in the laminating step is not covered with the resin. The cutting step is a step of cutting out a unit laminated substrate having a predetermined size from the laminated substrate 60. In the cutting step, the planned cutting part 64A of the glass layer 61 may be cut by laser or dicing, or after the planned cutting part 64A of the glass layer 61 is scribed by the laser or the scribing wheel 50, it may be broken and cut. Good. The peeling step is a step of peeling the resin layer 62 and the glass layer 61 of the unit laminated substrate by laser lift-off. After the peeling step, the first protective film is attached so as to cover one side in the thickness direction T of the resin layer 62, and the second protective film is attached so as to cover the other side in the thickness direction T of the resin layer 62. A flexible organic EL display is manufactured.

  In the embodiment, instead of forming the conductive layer 13 on the first laminated substrate 11 or in addition to forming the conductive layer 13 on the first laminated substrate 11, the conductive layer on the second laminated substrate 12 is formed. 13 may be formed.

  In the embodiment, the unit laminated substrate 20 is manufactured by bonding the first unit laminated substrate which is the first laminated substrate 11 having the predetermined size and the second unit laminated substrate which is the second laminated substrate 12 having the predetermined size. Good. That is, the pre-stage process includes a first cutting process for cutting the first laminated substrate 11 into a predetermined size and a second cutting process for cutting the second laminated substrate 12 into a predetermined size. The 1st cutting process and the 2nd cutting process are implemented after the preceding paragraph lamination process. Therefore, in the first cutting step, only the first glass layer 11A is cut, and in the second cutting step, only the second glass layer 12A is cut. In the first cutting step, the planned cutting part 16A of the first glass layer 11A may be cut by laser or dicing, or the planned cutting part 16A of the first glass layer 11A may be scribed by a laser or a scribing wheel 50 and then broken. May be cut. In the second cutting step, the planned cutting part 17A of the second glass layer 12A may be cut by laser or dicing, or the planned cutting part 17A of the second glass layer 12A may be scribed by a laser or a scribing wheel 50 and then broken. May be cut. The order of the first cutting process and the second cutting process can be arbitrarily changed. In the latter-stage laminating step, the first unit laminated substrate and the second unit laminated substrate are laminated.

  In the embodiment, after bonding the first unit laminated board, which is the first laminated board 11 having a predetermined size, and the second laminated board 12 which has not been cut into a predetermined size, the second laminated board 12 has a predetermined size. The unit laminated substrate 20 may be manufactured by cutting into pieces. Also, after bonding the second unit laminated board, which is the second laminated board 12 of a predetermined size, and the first laminated board 11 before being cut into a predetermined size, the first laminated board 11 is cut into a predetermined size. The unit laminated substrate 20 may be manufactured. That is, the former step includes one of a first cutting step of cutting the first laminated substrate 11 into a predetermined size and a second cutting step of cutting the second laminated substrate 12 into a predetermined size. One of the first cutting step and the second cutting step is performed after the pre-stage stacking step. The latter step includes the other of the first cutting step of cutting the first laminated substrate 11 into a predetermined size and the second cutting step of cutting the second laminated substrate 12 into a predetermined size. The method of cutting the first glass layer 11A by the first cutting step and the method of cutting the second glass layer 12A by the second cutting step are the same as the first cutting step and the second cutting step of the above modification.

10: multilayer laminated substrate 11: first laminated substrate 11A: first glass layer 11B: first resin layer 12: second laminated substrate 12A: second glass layer 12B: second resin layer 16: planned cutting portion 16A: planned cutting Part 16B: Planned cutting part 17: Planned cutting part 17A: Planned cutting part 17B: Planned cutting part 18: Groove 19: Groove 60: Laminated substrate 61: Glass layer 62: Resin layer 64A: Planned cutting part 64B: Planned cutting part MS1 , MS2: Mask

Claims (5)

A plurality of laminated substrates in which a glass layer and a resin layer are laminated, wherein the plurality of laminated substrates are a first laminated substrate in which a first glass layer and a first resin layer are laminated, and a second glass layer and a first laminated substrate. A method for manufacturing a flexible organic EL display, which comprises a second laminated substrate in which two resin layers are laminated, and a multilayer laminated substrate in which the first resin layer and the second resin layer are laminated so as to face each other. hand,
Including a preceding step which is a step prior to the step of stacking the plurality of laminated substrates,
The pre-stage step includes a pre-stage lamination step of forming the resin layer on the glass layer so that a portion of the glass layer, which is to be cut, is not covered with resin on at least one of the plurality of laminated substrates. Method for manufacturing organic EL display. The method for manufacturing a flexible organic EL display according to claim 1, wherein in the pre-stage laminating step, a groove is formed in the portion to be cut of the glass layer, and the resin layer is formed in the glass layer so that the groove is exposed. .. The method for manufacturing a flexible organic EL display according to claim 1, wherein in the pre-stage laminating step, the resin layer is formed on the glass layer, and a portion of the resin layer corresponding to the planned cut portion of the glass layer is removed. The method of manufacturing a flexible organic EL display according to claim 1, wherein in the pre-stage laminating step, a mask is formed on the planned cutting portion of the glass layer, the resin layer is formed on the glass layer, and the mask is removed. The method further includes a subsequent step that is a step after the step of stacking the plurality of laminated substrates
The method of manufacturing a flexible organic EL display according to claim 1, wherein the subsequent step includes a subsequent cutting step of cutting the glass layers of the plurality of laminated substrates.