TW202042999A - Forming mold, resin forming device, and manufacturing method of resin forming products for improving forming accuracy and reducing power consumption - Google Patents

Abstract

The present invention provides a forming mold, a resin forming device, and a manufacturing method of resin forming products for improving forming accuracy and reducing power consumption. For this purpose, the forming mold of the present invention comprises: a forming mold body M having an upper mold UM and a lower mold LM; a mold cavity member CA disposed between the upper mold UM and the lower mold LM and having a mold cavity MC to be supplied with resin materials; a heater H disposed in the mold cavity member CA; and, a floating mechanism 5 for keeping the mold cavity member CA being separated from the forming mold body M.

Description

Molding die, resin molding device, and manufacturing method of resin molded product

The present invention relates to a molding die, a resin molding device, and a method for manufacturing a resin molded product.

Workpieces such as a substrate with a chip or a wafer with a substrate omitted are generally used as electronic parts through resin sealing. Heretofore, as a resin molding apparatus for sealing a workpiece with resin, a resin molding apparatus equipped with a press mechanism for compression molding has been known.

The press mechanism of Patent Document 1 has a forming die composed of an upper die and a lower die. A heater is built in the forming die, and the heater is used to heat the forming die to harden the thermosetting resin on the surface of the workpiece. And resin molding. The lower mold has a base, a cavity piece fixed on the base, and a movable holder that becomes the side wall of the cavity piece, and a heater is built in the base and the holder.

[Prior Technical Literature] (Patent Document) Patent Document 1: Japanese Patent Application Publication No. 2017-94619

[The problem to be solved by the invention] However, in the press mechanism described in Patent Document 1, even if heaters are built in the bases of the upper mold and the lower mold, and the holder, heat is diffused (dissipated) toward the forming mold with a large heat capacity. As a result, the farther away from the heater, the lower the temperature, and the difference in expansion caused by the temperature difference between the molding die and the workpiece causes deformation, and the resin thickness of the resin molded product is likely to vary. In particular, with the thinning of resin molded products, when the thickness of the molded resin becomes 0.1mm or less, even if the tolerance is set to ±10%, it is difficult for the previous press mechanism to cope with the resin seal with a deviation of 0.01mm or less. .

Also, for example, when the heating temperature of the forming mold is set to 175°C, in order to maintain the required temperature tolerance of the mold surface at ±3°C, after the heater is turned on, it does not take a day to reach a thermally stable state. Unable to start production. As a result, a large amount of electric power is consumed for heating the forming mold, and the power consumption will increase further along with the enlargement of the forming mold.

Therefore, a molding die, a resin molding apparatus, and a method of manufacturing a resin molded product are desired that can improve molding accuracy and reduce power consumption.

[Technical means to solve the problem] With regard to the characteristic structure of the forming mold of the present invention, it is provided with: a forming mold body having an upper mold and a lower mold; a cavity member which is arranged between the upper mold and the lower mold and has a resin material to be supplied The cavity; a heater, which is provided in the cavity member; and, a floating mechanism, which can maintain the cavity member in a separated state relative to the molding die body.

A characteristic configuration of the resin molding apparatus of the present invention includes the molding die and a mold clamping mechanism for clamping the molding die.

The characteristic structure of the method for manufacturing a resin molded product of the present invention includes: a supply step of supplying a molded object and a resin material to the molding die; and a heating step of removing the cavity member from the molding die body In the separated state, power is supplied to the heater to heat the resin material; and, the forming step includes clamping the forming mold and bringing the cavity member and the forming mold body into contact during a part of the heating step , To implement resin molding.

[Effects of the invention] According to the present invention, it is possible to provide a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product, which can improve molding accuracy and reduce power consumption.

Hereinafter, the molding die, the resin molding apparatus, and the manufacturing method of the resin molded product of the present invention will be described based on the drawings. However, it is not limited to the following embodiments, and various changes can be made without departing from the spirit thereof.

[Device Configuration] Molded objects such as a substrate with a chip mounted or a wafer with a substrate omitted are used as electronic parts by sealing them with resin. As the resin sealing technology, there are compression molding methods (compression molding) or transfer molding methods. Among them, the compression molding method can correspond to the thinning of resin molded products (electronic parts) and is excellent in productivity. As one of the methods of resin-sealing a molded object based on this compression molding method, there is a method of manufacturing a resin molded product, in which a liquid or powdered resin is supplied to a release film and then released The mold film is placed on the molding die of the press mechanism, and the molded object is then immersed in the resin on the release film to perform resin molding, thereby manufacturing a resin molded product.

In the conventional press mechanism, since the heater is built in the forming die, the heat diffuses (dissipates heat) toward the forming die with a large heat capacity. As a result, the farther away from the heater, the lower the temperature, and the difference in expansion caused by the temperature difference between the molding die and the molded object causes deformation, and the resin thickness of the resin molded product is likely to vary. In particular, with the thinning of resin molded products, when the thickness of the molded resin becomes 0.1mm or less, even if the tolerance is set to ±10%, it is difficult for the previous press mechanism to cope with the resin seal with a deviation of 0.01mm or less. . Also, for example, when the heating temperature of the forming mold is set to 175°C, in order to maintain the required temperature tolerance of the mold surface at ±3°C, after the heater is turned on, it does not take a day to reach a thermally stable state. Unable to start production. As a result, a large amount of electric power is consumed for heating the forming mold, and the power consumption will increase further along with the enlargement of the forming mold.

Therefore, in this embodiment, a molding die C, a resin molding apparatus D, and a method of manufacturing a resin molded product are provided, which can improve molding accuracy and reduce power consumption. Hereinafter, the substrate S on which the semiconductor wafer is mounted is described as an example of the molding object. In the description, the direction of gravity is set to downward and the direction opposite to the direction of gravity is set to upward. In addition, the Z direction shown in Fig. 1 is the vertical direction, and the front side of the paper is upward.

Fig. 1 is a schematic diagram showing a resin molding apparatus D. The resin molding apparatus D in this embodiment includes a release film supply mechanism 1, a resin supply module 2, a compression molding module 3, a conveyance mechanism 4, and a control unit 6. The compression molding module 3 includes a molding die C, which uses a liquid resin or a powder or granular resin (an example of a resin material, the following uses "liquid resin" as a representative for description) to mount a semiconductor chip-mounted substrate S To be sealed with resin. The control unit 6, as software for controlling the operation of the resin molding device D, is composed of programs memorized in hardware such as HDD (Hard Disk Drive) or memory, and is composed of a computer's CPU (central processing unit) , Center Processing Unit) to implement. That is, the control unit 6 controls the operations of the release film supply mechanism 1, the resin supply module 2, the compression molding module 3, and the transport mechanism 4.

In addition, the liquid resin includes not only a resin that is liquid at normal temperature (room temperature), but also a molten resin that melts a solid resin into a liquid by heating. The resin that becomes liquid at room temperature may be a thermoplastic resin or a thermosetting resin. A thermosetting resin is a resin that is liquid at room temperature. When heated, its viscosity decreases; when heated further, it polymerizes and hardens to become a hardened resin. The liquid resin in this embodiment is preferably a thermosetting resin with a high viscosity that does not flow rapidly at room temperature.

The release film supply mechanism 1 is installed in the compression molding die set 3 so as to be liftable, and can supply (adhere to) the surface of the cavity member CA mentioned later. The details of the release film supply mechanism 1 will be described later.

The resin supply module 2 includes a resin material supply mechanism 21, a resin loader 22, and a vacuum mechanism 23.

The resin material supply mechanism 21 supplies liquid resin into the cavity MC of the cavity member CA. The resin material supply mechanism 21 is supported by the rail R, and is moved back and forth in the X direction by the resin loader 22. The resin material supply mechanism 21 is configured as a dispenser, and is integrated with a discharge mechanism 21a, a syringe 21b, and a nozzle 21c. The discharge mechanism 21a discharges the liquid resin stored in the syringe 21b from the nozzle 21c. The discharge mechanism 21a has a plunger (not shown) that is linearly moved by the driving force of a servo motor (not shown), etc.; the plunger is moved forward in the syringe 21b to cause the liquid resin to flow from the nozzle 21c spit out. In the resin material supply mechanism 21 in this embodiment, the discharge mechanism 21a, the syringe 21b, and the nozzle 21c are configured to be detachable from each other. For example, the liquid resin can be preliminarily stored and stored in a plurality of syringes 21b, and different capacities can be selected. The syringe 21b is used.

In addition, the resin material supply mechanism 21 is configured to reciprocate on a vertical plane (YZ plane) or a horizontal plane (XY plane) by the resin loader 22. Thereby, the resin material supply mechanism 21 becomes possible to uniformly supply the liquid resin to the surface of the release film F supplied to the cavity member CA.

The resin loader 22 locks the resin material supply mechanism 21. Furthermore, the resin loader 22 transfers the resin material supply mechanism 21 to the compression molding die set 3, and moves the resin material supply mechanism 21 so that the nozzle 21c is located on the cavity member CA. The vacuuming mechanism 23 in the compression molding die set 3, just before closing the molding die C, forcibly sucks and discharges air from the cavity MC. Thereby, the air remaining in the cavity MC or the bubbles contained in the liquid resin are discharged to the outside of the molding die C.

The compression molding module 3 resin-seales the substrate Sa before resin sealing to form a resin-sealed completed substrate Sb (resin molded product). This compression molding module 3 can be provided in plural (three in this embodiment), and each compression molding module 3 can be installed or removed independently. The compression molding module 3 is detailed later.

The conveying mechanism 4 conveys the pre-resin-sealed substrate Sa (molded object) on which the semiconductor wafer is assembled before the resin sealing, and conveys the resin-sealed substrate Sb (resin molded product) after the resin seal. The transport mechanism 4 includes a substrate loader 41 and a robot arm 42. The substrate loader 41 can mount the substrate S thereon. The substrate S is the substrate Sa before resin sealing or the substrate Sb after resin sealing. The substrate loader 41 can move on the rail R between the transport mechanism 4 and the compression molding module 3. A plurality of semiconductor wafers are mounted on the substrate Sa before resin sealing. In the resin-sealed substrate Sb, the semiconductor wafer is sealed by a resin (sealing resin) formed by curing a liquid resin. The robot arm 42 can reverse the front and back of the resin-sealed pre-substrate Sa taken out from the first accommodating portion 43, thereby turning the wafer assembly side downward and placing it on the substrate loader 41, and sealing the resin-sealed substrate Sb It is taken out from the substrate loader 41 and the front and back are reversed, whereby the sealing resin side (wafer package side) is directed upward and placed in the second housing portion 44.

Hereinafter, the compression molding die set 3 having the release film supply mechanism 1 will be described in detail. As shown in Figure 2, the release film supply mechanism 1 has: a delivery mechanism 13 that transports the release film F before use wound on a reel between the upper mold UM and the lower mold LM (closely In other words, it is between a pair of cavity members CA); and, the winding mechanism 14, which winds the used release film F that has been used for resin molding on a reel. Between the delivery mechanism 13 and the cavity member CA, a delivery roller 15 is provided for applying tension to the release film F before use that has been delivered from the delivery mechanism 13. Between the cavity member CA and the winding mechanism 14, a winding roller 16 is provided to apply tension to the used release film F that has been transported between the upper mold UM and the cavity member CA. The control unit 6 controls the torque (rotation speed) of a motor (not shown) provided on the delivery mechanism 13 and the torque (rotation speed) of a motor (not shown) provided on the winding mechanism 14. Thereby, the release film F can be conveyed from the delivery mechanism 13 while applying moderate tension to the advancing direction (-Y direction) of the release film F.

As shown in Fig. 3, the compression molding module 3 has a tie bar 32 standing upright at the four corners of the lower fixed plate 31, and a rectangular upper fixed plate is provided near the upper end of the tie bar 32 33. A rectangular movable platform 34 is provided between the lower fixed disk 31 and the upper fixed disk 33. The movable platform 34 is provided with holes at four corners for the connecting rod 32 to pass through and can move up and down along the connecting rod 32. The lower fixed plate 31 is provided with a device for moving the movable platform 34 up and down, that is, a mold clamping mechanism 35. The mold clamping mechanism 35 is capable of performing mold clamping (mold closing) of the forming mold C by moving the movable platform 34 upward, and opening the mold C by moving the movable platform 34 downward (mold opening) . The drive source of the mold clamping mechanism 35 is not particularly limited, and, for example, an electric motor such as a servo motor can be used.

The forming mold C includes a forming mold body M having an upper mold UM and a lower mold LM. The upper mold UM and the lower mold LM are formed by using metal molds or the like arranged to face each other. The lower mold LM is formed using a base LMa and a convex portion LMb protruding from the base LMa in the direction of the upper mold UM. In the present embodiment, the surface of the upper mold UM and/or the lower mold LM opposed to the cavity member CA is preferably processed with fine unevenness. Thereby, the contact area of the cavity member CA and the molding die main body M mentioned later can be reduced. In addition, the surface of the upper cavity member CA1 and/or the lower cavity member CA2 facing the molding die main body M may be processed with fine unevenness.

The molding die C in this embodiment further includes a cavity member CA, a sheet-like heater H, and a floating mechanism 5. The forming mold body M is provided with a locking mechanism B (only shown in the upper mold UM, not shown in the lower mold LM). The locking mechanism B is composed of bolts and the like for locking the cavity member CA , To support the cavity member CA so as to be movable relative to the forming mold body M. This cavity member CA is arranged between the upper mold UM and the lower mold LM, and has a cavity MC to be supplied (accommodated) with liquid resin. The cavity member CA is constituted by an upper cavity member CA1 supported on the upper mold UM and an upper and lower cavity member CA2 supported on the lower mold LM. The upper cavity member CA1 is provided with a substrate arranging portion (not shown) for locking the substrate S to lock the resin-sealed front substrate Sa and the resin-sealed substrate Sb to the upper cavity member CA1. The sealed substrate Sb is formed by resin-sealing a semiconductor wafer or the like mounted on the substrate Sa before resin sealing in the cavity MC. In addition, the sheet heater H has an upper heater H1 arranged on the surface of the upper cavity member CA1 on the cavity MC side, and an upper heater H1 arranged on the surface of the lower cavity member CA2 on the cavity MC side Lower side heater H2. The floating mechanism 5 holds the cavity member CA in a separated state from the molding die main body M.

The cavity member CA is formed of ceramic or porous metal, and the heat capacity of the ceramic or porous metal is smaller than the heat capacity of the metal mold or the like constituting the main body M of the forming mold. Ceramics are composed of a sintered body that is cured by heat treatment of an inorganic substance. Porous metal is made of porous metal with many small pores. The upper cavity member CA1 arranged to face the upper mold UM is formed in a flat plate shape on the surface (the surface opposite to the surface facing the upper mold UM, the surface on the cavity MC side) , The upper heater H1 is provided by vapor deposition or the like. The lower cavity member CA2 has a flat bottom wall 51 facing the lower mold LM and a rectangular side wall 52 surrounding the bottom wall 51. There is a slight gap between the bottom wall 51 and the side wall 52, and the bottom wall 51 and the side wall 52 are separated and configured to be movable independently of each other. On the surface of the bottom wall 51 (the surface opposite to the surface facing the lower mold LM, the surface on the cavity MC side), a lower heater H2 is provided by vapor deposition or the like. The inner groove 52a of the side wall 52 formed by the position of the cavity MC is also provided with a lower heater H2 by vapor deposition or the like.

In the inner space surrounded by the bottom wall 51 and the side wall 52 in the lower cavity member CA2, a cavity MC to be filled (supply) with liquid resin is formed. In addition, on the surface of the lower cavity member CA2 facing the cavity MC, the release film F sucked by a suction mechanism (not shown) is fixed.

The heater H is formed by sandwiching a metal heating element with a pair of insulating films. The heating element is a heating resistor made of stainless steel or nickel alloy into a film. The DC power supply is electrically connected to the heating element via a wire. The insulating film is an insulator made of polyimide, silicon, ceramic, etc., into a film shape. By bringing the film heater H directly into contact with the release film F, the liquid resin can be quickly heated through the release film F. In addition, a temperature sensor (not shown) is provided in the heater H or the cavity member CA; the control unit 6 controls the amount of power supplied to the heater H based on the measured value of the temperature sensor.

The floating mechanism 5 is built-in and supported in the main body M of the forming mold. This floating mechanism 5 has a support pin 53 (an example of a support member) for supporting the cavity member CA, and a spring 54 (an example of an energizing member) that energizes the support pin 53 toward the cavity member CA. The support pin 53 is made of resin or the like, and has a pin-shaped member 53A and a support stand 53B. The heat capacity of the resin is smaller than the heat capacity of the metal mold or the like constituting the mold body M. The supporting pin 53 has an end of the pin-shaped member 53A abutting against the back surface of the cavity member CA (the surface facing the molding die body M), and the back surface of the supporting stand 53B abutting against the spring 54. The support pins 53 have: a plurality of upper support pins 53a, which are individually inserted into a plurality of upper holes UMa formed on the surface of the upper mold UM; and, a plurality of lower support pins 53b, which are individually inserted into the lower mold A plurality of lower holes LMb1 formed on the surface of the convex portion LMb of the LM.

The spring 54 is constituted by a plurality of compression coil springs, etc., which individually energize the support pin 53 and the side wall 52 of the lower cavity member CA2. This spring 54 has: an upper spring 54a which energizes the upper support pin 53a toward the upper cavity member CA1; and a lower spring 54b which energizes the lower support pin 53b toward the bottom wall 51 of the lower cavity member CA2 ; And, the side wall spring 54c, which energizes the side wall 52 of the lower cavity member CA2 toward the upper mold UM. The upper spring 54a is housed in the upper mold UM, the lower spring 54b is housed in the lower mold LM, and the side wall spring 54c is locked to the base LMa of the lower mold LM. In addition, the energizing member is not limited to a compression coil spring, and it may be constituted by an elastic member such as rubber or resin, and the cavity member CA may be separated from the mold main body M by air pressure or gas pressure.

According to this configuration, the release film F is heated by the lower heater H2 of the lower cavity member CA2 to heat the liquid resin in the cavity MC. In addition, the substrate S on which the semiconductor wafer has been assembled is heated by the upper heater H1 of the upper cavity member CA1.

[Method of manufacturing resin molded product] The method of manufacturing a resin molded product will be explained using Figs. 1 to 4.

First, as shown in Fig. 1, the front and back sides of the resin-sealed front substrate Sa taken out from the first accommodating portion 43 by the robot arm 42 are reversed so that the wafer package side faces downward and is placed on the substrate loader 41. Then, the transport mechanism 4 transports the pre-resin sealing substrate Sa on which the semiconductor wafer has been assembled before resin sealing to the compression molding module 3, and locks the pre-resin sealing substrate Sa to the upper heater of the upper cavity member CA1 The surface of H1 (the supply step in Fig. 4, also refer to Fig. 3).

Next, as shown in Figure 2, the release film supply mechanism 1 transfers and places the release film F on the surface of the lower cavity member CA2, and sucks the release film F to the lower side by the suction mechanism The concave mold surface of the cavity member CA2. Then, the resin loader 22 transfers the resin material supply mechanism 21 from the resin supply module 2 to the compression molding module 3, and uses the resin loader 22 to place one side on the vertical plane (YZ plane) or the horizontal plane (XY plane) While moving back and forth, the liquid resin is supplied to the release film F from the nozzle 21c (the supply step in Fig. 4, also refer to Fig. 1). Next, as shown in Fig. 4, power is supplied to the upper heater H1 so that the measurement value of the temperature sensor becomes a predetermined value to heat the resin-sealed front substrate Sa locked on the upper cavity member CA1. Then, power is supplied to the lower heater H2 to heat and flow the liquid resin on the release film F (heating step). At this time, the upper cavity member CA1 and the lower cavity member CA2 are separated from the upper mold UM and the lower mold LM by the floating mechanism 5, so that heat diffusion (radiation) toward the forming mold body M is suppressed. That is to say, the heat insulation effect of the air existing between the cavity member CA and the forming mold body M prevents the heat of the heater H from escaping and retains heat, and the heater H directly contacts the liquid. Since the liquid resin in the cavity MC can be quickly heated. Furthermore, the air is forcibly sucked and discharged from the cavity MC by the vacuum mechanism 23 (refer to FIG. 1). In this way, the mold cavity MC is decompressed and heated, thereby preventing air from being mixed into the liquid resin when the mold clamping is performed next, and preventing voids from being generated in the resin-sealed substrate Sb.

Next, the movable platform 34 is moved upward by the mold clamping mechanism 35, and the lower mold LM is relatively moved in the direction of the upper mold UM, thereby performing mold clamping of the forming mold C (the forming step in Fig. 4, closing Model steps, also refer to Figure 3). At this time, first, the outer peripheral portion of the substrate Sa before resin sealing abuts against the side wall 52 of the lower cavity member CA2, so the side wall spring 54c is compressed and the side wall 52 is lowered, whereby the cavity MC surrounded by the side wall 52 becomes Sealed state. Then, the surface of the substrate Sa before resin sealing is immersed in the liquid resin of the cavity MC, and receives the reaction force of the pressure acting on the liquid resin due to the clamping, so that the upper cavity member CA1 is pushed upward. While pressing, the lower cavity member CA2 is pressed downward. As a result, the upper spring 54a and the lower spring 54b are compressed, and the upper cavity member CA1 and the lower cavity member CA2 approach the forming mold main body M.

Next, by further increasing the clamping force of the mold clamping mechanism 35, mold clamping is performed in a state where the cavity member CA is brought into contact with the molding mold main body M (the molding step and the pressurizing step in FIG. 4). At this time, if the surfaces on the cavity MC side of the upper mold UM and the lower mold LM have a small uneven shape, the contact area becomes smaller, and the heat conduction from the cavity member CA toward the forming mold body M when the mold is closed Becomes difficult. As a result, there is no need to increase the amount of power supplied to the heater H in consideration of a large amount of heat dissipation, and thus it is possible to save power consumption. In this state, the cavity member CA is further heated by the heater H to harden the liquid resin in the cavity MC to resin-sealed the substrate Sa before resin sealing to form a resin-sealed completed substrate Sb (resin Molded product).

Then, it takes a predetermined time to maintain the clamping state (the state where the cavity member CA is clamped by the force of the spring 54) (the molding step and the holding step in Fig. 4) until the resin sealing is completed, and the substrate Sb becomes mold-releasable status. At this time, the cavity member CA is separated from the molding die body M by the floating mechanism 5. If the cavity member CA is separated from the molding die body M during the period from the completion of mold clamping until the resin-sealed substrate Sb becomes a state that can be released from the molding die C, it is possible to suppress the heat of the cavity member CA toward the molding die. The body M conducts. With this maintaining step, it is possible to prevent undercure or overcure which may cause poor resin molding.

Next, the mold C is opened by moving the movable platform 34 downward, and the resin-sealed substrate Sb after the release film F has been peeled off by the substrate loader 41 is stored in the second receiving portion 44 (also refer to Figure 1). The power supply to the heater H is stopped immediately after the mold is opened or just after the mold is opened. Then, in a cutting mechanism not shown, the substrate S on which a plurality of semiconductor wafers have been mounted is cut, and the substrate S on which one semiconductor wafer has been mounted is used as a unit to manufacture a plurality of electronic components.

In this way, the heater H is not built in the molding die body M, but the sheet-like heater H is provided on the surface (surface) of the cavity member CA on the cavity MC side. The cavity member CA It can be separated from the forming mold body M by the floating mechanism 5. That is, since the cavity member CA separated from the forming mold body M with a large heat capacity is used for heating, the heat dissipation through the forming mold body M is suppressed. As a result, it is possible to uniformly heat the cavity member CA (the resin material filled in the cavity MC) and the substrate S, and it is possible to prevent variations in the resin thickness of the resin-sealed substrate Sb. In addition, since the sheet-like heater H is arranged on the surface of the cavity member CA on the cavity MC side, the resin material can be quickly heated while ensuring the cavity MC. As a result, as in the case where the heater H is built in the molding die main body M, the diffusion (radiation) of heat toward the molding die main body M is suppressed, so that power consumption can be reduced.

In addition, during most of the heating step (including the molding step), the heater H is energized and the liquid resin is heated while the cavity member CA is separated from the molding die body M, so the self-molding die body M is heated. Diffusion (heat dissipation) can be suppressed, so power consumption can be reduced. Furthermore, the heated liquid resin is clamped during a part of the heating step. Therefore, the contact time between the molding die main body M and the cavity member CA can be minimized, and the amount of contact between the molding die main body M and the cavity member CA can be minimized. Heat dissipation.

In addition, since the cavity member CA is formed of ceramic or porous metal with a small heat capacity, it becomes difficult to dissipate heat to the cavity member CA, and the liquid resin can be heated quickly, thereby reducing power consumption. In addition, if the heater H is formed by sandwiching a metal heating element with a pair of insulating films, the surface of the release film F can be heated uniformly, so that the variation in the resin thickness of the resin-sealed substrate Sb can be suppressed. If the heater H is arranged inside the side wall 52 in addition to the inside of the bottom wall 51 of the lower cavity member CA2, the resin material can be heated evenly.

[Other implementation forms] Hereinafter, for ease of understanding, the same terms and symbols are used to describe the same members as in the above-mentioned embodiment.

>1> In the above embodiment, the heater H is arranged on the surface of the cavity member CA as an example, but the heater H may be built in the cavity member CA. Furthermore, in the above-mentioned embodiment, the heater H is arranged inside the bottom wall 51 and the side wall 52 of the lower cavity member CA2, but the heater H may be arranged only on the bottom wall 51 of the lower cavity member CA2. .

>2> In the above embodiment, the sheet heater H formed by sandwiching a metal heating element with a pair of insulating films is provided on the surface of the cavity member CA by vapor deposition or the like as an example Although it demonstrates, you may fix the heater H of the sheet shape produced in advance to the surface of the cavity member CA by adhesion etc.

>3> In the above-mentioned embodiment, the liquid resin is supplied to the release film F in the resin supply module 2 as an example, but it may be in a state of being closed by a shutter mechanism. , After the resin holding plate supplied with the powder and granular resin is transferred to the release film F, the shutter mechanism is opened to supply the powder and granular resin to the release film F.

>4> In the above-mentioned embodiment, the resin material is supplied to the release film F inside the compression molding module 3, but a release film supply module may be provided instead of the compression molding module 3. At this time, in the release film supply module, the resin material supply mechanism 21 may be used to supply the resin material to the release film F, and the release film F supplied with the resin material may be transferred to the compression molding die On the lower cavity member CA2 of group 3.

>5> A weight sensor may be provided at the bottom of the lower cavity member CA2 to measure the weight of the liquid resin filled in the cavity MC while controlling the resin supply amount in the resin material supply mechanism 21. Thereby, the resin supply accuracy of the resin material supply mechanism 21 can be improved, and the defect that the resin filled into the cavity MC is insufficient can also be eliminated.

>6> In the above embodiment, the resin material is supplied to the cavity MC in a state where the heater H has been powered, but the heater H may be powered after the resin material is supplied to the cavity MC. In addition, the power supply time (heating time) of the heater H, the pressurization time of the mold clamping mechanism 35, the curing time after mold clamping, the decompression time of the vacuum mechanism 23, etc., preferably correspond to the molding of the molded object State to optimize.

>7> In the above-mentioned embodiment, the description is made using a face-down (face down) compression method, but it is also possible to use a face-up (face up) compression method to compress a molded object such as the substrate S , As a supply object to which resin is supplied in the resin material supply mechanism 21. In addition, the release film F may be omitted, and the lower cavity member CA2 may be used as an object to be supplied with resin in the resin material supply mechanism 21.

[Outline of the above embodiment] Hereinafter, the outline of the manufacturing method of the molding die C, the resin molding apparatus D, and the resin molded product described in the above embodiment will be described.

(1) The characteristic structure of the forming mold C is to include: a forming mold body M, which has an upper mold UM and a lower mold LM; a cavity member CA, which is arranged between the upper mold UM and the lower mold LM and has requirements The cavity MC supplied with the resin material; the heater H, which is provided in the cavity member CA; and the floating mechanism 5, which can maintain the cavity member CA in a separated state from the molding die body M.

In this configuration, the heater H is not built in the molding die body M, but the heater H is provided in the cavity member CA, which can be formed from the mold body M by the floating mechanism 5. Separate. That is, since the cavity member CA separated from the forming mold body M with a large heat capacity is used for heating, the heat dissipation to the forming mold body M is suppressed. As a result, the cavity member CA (the resin material filled in the cavity MC) and the molded object can be uniformly heated, and variations in the resin thickness of the resin molded product can be prevented. In addition, as in the case where the heater H is built in the molding die main body M, the diffusion (radiation) of heat from the molding die main body M is suppressed, so that power consumption can be reduced.

(2) The heater H may be composed of a sheet-like member arranged on the surface of the cavity member CA on the cavity MC side.

With this configuration, if the heater H is formed of a sheet member arranged on the surface of the cavity member CA on the cavity MC side, the resin material can be quickly heated while ensuring the cavity MC, and the resin can be prevented The deviation of the resin thickness of the molded product. In addition, since the heater H is arranged on the surface on the side of the cavity MC, the resin material filled in the cavity MC can be directly heated by the heater H, so there is no need to heat the cavity member CA itself to the desired level. Temperature, and can reduce power consumption.

(3) The cavity member CA includes a bottom wall 51 facing the lower mold LM and a side wall 52 surrounding the bottom wall 51; the heater H may also be arranged on the bottom wall 51 and the side wall 52.

With this configuration, if the heater H is arranged on the side wall 52 in addition to the bottom wall 51, the resin material can be heated uniformly.

(4) The heater H may be formed by sandwiching a metal heating element with a pair of insulating films.

According to this configuration, if the heater H is formed by sandwiching a metal heating element by a pair of insulating films, the surface of the film can be heated uniformly, so that the variation in the resin thickness of the resin molded product can be suppressed.

(5) The cavity member CA may also be formed of a material having a smaller heat capacity than the molding die body M.

With this configuration, if the cavity member CA is formed of a material having a smaller heat capacity than the molding die body M, heat dissipation to the cavity member CA becomes difficult, the liquid resin can be quickly heated, and power consumption can be reduced.

(6) The aforementioned material may also be ceramic or porous metal.

According to this configuration, if the cavity member CA is made of ceramic or porous metal, it can be sintered and thus has excellent productivity.

(7) The floating mechanism 5 may also be supported by the molding die body M, and has a support pin 53 (support member) for supporting the cavity member CA, and a support pin 53 for energizing the cavity member CA Spring 54 (energizing member).

With this structure, if the floating mechanism 5 is formed by the support pin 53 and the spring 54, the structure is simple. In addition, when the upper mold UM and the lower mold LM are used to close the mold, the energizing force of the spring 54 also acts as a clamping pressure, which is efficient.

(8) At least any one of the surfaces of the molding die main body M and the cavity member CA facing each other may be formed in an uneven shape.

With this configuration, if the concave and convex shapes are formed on either of the facing surfaces of the molding die main body M and the cavity member CA, the contact area between the cavity member CA and the molding die main body M can be reduced. The heat conduction (radiation) of the molding die body M becomes difficult. As a result, power consumption can be reduced.

(9) A characteristic configuration of the resin molding apparatus D includes the molding die C described in any one of (1) to (8) above, and a mold clamping mechanism 35 for clamping the molding die C.

In this configuration, since the mold C is used for mold clamping, it is possible to improve molding accuracy and reduce power consumption.

(10) The method of manufacturing a resin molded product is a method of manufacturing a resin molded product using the resin molding apparatus D of (9) above, and is characterized by including a supply step of combining the substrate S (molded object) and the resin material Is supplied to the aforementioned forming mold C; a heating step, which supplies power to the heater H in a state where the cavity member CA is separated from the forming mold body M to heat the resin material; and, the forming step is part of the heating step During the period, the molding die C is closed and the cavity member CA is brought into contact with the molding die body M to perform resin molding of the substrate S (molding object).

In this method, power is supplied to the heater H in a state where the cavity member CA is separated from the molding die main body M to heat the resin material. Therefore, the diffusion (heat dissipation) of the heat toward the molding die main body M is suppressed, so that Reduce power consumption. Furthermore, since the mold is closed during a part of the heating step, the contact time between the molding die body M and the cavity member CA can be minimized, and the heat dissipation through the molding die body M can be minimized.

(11) In the above-mentioned method of manufacturing a resin molded product, in the molding step, after the cavity member CA is brought into contact with the molding die body M, the floating mechanism 5 keeps the cavity member CA separated from the molding die body M In the state, resin molding of the substrate S (molding object) is performed. In other words, the cavity member CA may be separated from the molding die main body M, and the floating mechanism 5 may hold the pair of cavity members CA.

In this method, the cavity member CA is separated from the mold main body M from the end of mold clamping until the resin molded product is released from the mold C. Therefore, heat dissipation via the mold main body M can be suppressed.

(12) In the method for manufacturing the above-mentioned resin molded product, the cavity MC may be decompressed in the heating step.

In this method, the mold cavity MC is decompressed and heated, thereby preventing air from being mixed into the resin material during mold clamping, and preventing porosity in the resin molded product

In addition, the configurations disclosed in the above embodiments (including other embodiments, the same hereinafter) can be applied and combined with the configurations disclosed in other embodiments as long as no contradiction occurs. In addition, the embodiment disclosed in this specification is an example, and the embodiment of the present invention is not limited to this, and can be appropriately changed without departing from the purpose of the present invention.

[Industrial availability] The present invention can be used in a resin material supply device, a resin molding device, and a method of manufacturing a resin molded product.

1: Release film supply mechanism 2: Resin supply module 3: Compression molding module 4: Transport mechanism 5: Floating mechanism 6: Control Department 13: Sending organization 14: Winding mechanism 15: delivery roller 16: winding roller 21: Resin material supply mechanism 21a: Discharge mechanism 21b: Syringe 21c: nozzle 22: Resin Loader 23: Vacuum mechanism 31: Lower fixed plate 32: connecting rod 33: Upper fixed plate 34: movable platform 35: clamping mechanism 41: substrate loader 42: Robot arm 43: First Containment Department 44: Second Containment Department 51: bottom wall 52: side wall 52a: medial groove 53: Support pin (support member) 53A: Pin-like member 53B: Support Desk 53a: Support pin on the upper side 53b: Lower support pin 54: Spring (energizing member) 54a: upper spring 54b: Lower spring 54c: side wall spring C: Forming mold CA: cavity components CA1: Upper cavity component CA2: Lower cavity component D: Resin molding device M: Mold body MC: Mold cavity UM: Upper mold UMa: upper hole LM: Lower mold LMa: Abutment LMb: convex part LMb1: Lower hole S: substrate Sa: Resin sealed front substrate Sb: Resin sealed substrate F: Release film B: card blocking mechanism H: heater H1: Upper heater H2: Lower heater R: Orbit

Figure 1 is a schematic diagram showing a resin molding apparatus. Figure 2 is a schematic diagram showing the release film supply mechanism. Figure 3 is a schematic diagram showing the compression molding module. Fig. 4 is a schematic diagram showing a method of manufacturing a resin molded product.

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3: Compression molding module

5: Floating mechanism

31: Lower fixed plate

32: connecting rod

33: Upper fixed plate

34: movable platform

35: clamping mechanism

51: bottom wall

52: side wall

52a: medial groove

53: Support pin (support member)

53A: Pin-like member

53B: Support Desk

53a: Support pin on the upper side

53b: Lower support pin

54: Spring (energizing member)

54a: upper spring

54b: Lower spring

54c: side wall spring

C: Forming mold

CA: cavity components

CA1: Upper cavity component

CA2: Lower cavity component

M: Mold body

MC: Mold cavity

UM: Upper mold

UMa: upper hole

LM: Lower mold

LMa: Abutment

LMb: convex part

LMb1: Lower hole

S: substrate

Sa: Resin sealed front substrate

F: Release film

B: card blocking mechanism

H: heater

H1: Upper heater

H2: Lower heater

Claims (12)

A forming mold with: A forming mold body, which has an upper mold and a lower mold; A cavity member, which is arranged between the upper mold and the lower mold, and has a cavity to be supplied with resin material; A heater, which is provided in the aforementioned mold cavity member; and, A floating mechanism can keep the cavity member in a separated state from the main body of the forming mold. The molding die according to claim 1, wherein the heater is composed of a sheet-shaped member arranged on a surface of the cavity member on the cavity side. The forming mold according to claim 2, wherein the cavity member includes a bottom wall facing the lower mold and a side wall surrounding the bottom wall; The heater is arranged on the bottom wall and the side wall. The molding die according to claim 2 or 3, wherein the sheet member is formed by sandwiching a metal heating element with a pair of insulating films. The molding die according to any one of claims 1 to 4, wherein the cavity member is formed of a material having a smaller heat capacity than the molding die body. The forming die according to claim 5, wherein the aforementioned material is ceramic or porous metal. The forming mold according to any one of claims 1 to 6, wherein the floating mechanism is supported by the forming mold body, and has a supporting member for supporting the cavity member, and the supporting member The energizing member facing the aforementioned cavity member. The molding die according to any one of claims 1 to 7, wherein at least any one of the surfaces of the molding die body and the cavity member facing each other is formed in a concave and convex shape. A resin molding apparatus including: the molding die according to any one of claims 1 to 8, and a mold clamping mechanism for clamping the molding die. A method of manufacturing a resin molded product is a method of manufacturing a resin molded product using the resin molding device described in claim 9, comprising: A supply step of supplying the molded object and the resin material to the aforementioned molding die; A heating step of supplying power to the heater to heat the resin material in a state where the cavity member is separated from the molding die body; and, The molding step includes clamping the molding die and bringing the cavity member and the molding die body into contact during a part of the heating step to perform resin molding of the molding object. The method of manufacturing a resin molded article according to claim 10, wherein in the molding step, after the cavity member is brought into contact with the molding die body, the floating mechanism is used to hold the cavity member from the The molding die body is separated, and the resin molding of the molding object is performed. The method of manufacturing a resin molded article according to claim 10 or 11, wherein in the heating step, the cavity is decompressed.

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