TW202042921A - 加工系統以及檢查系統 - Google Patents

加工系統以及檢查系統 Download PDF

Info

Publication number
TW202042921A
TW202042921A TW109112522A TW109112522A TW202042921A TW 202042921 A TW202042921 A TW 202042921A TW 109112522 A TW109112522 A TW 109112522A TW 109112522 A TW109112522 A TW 109112522A TW 202042921 A TW202042921 A TW 202042921A
Authority
TW
Taiwan
Prior art keywords
processing
area
light
processing system
coating film
Prior art date
Application number
TW109112522A
Other languages
English (en)
Chinese (zh)
Inventor
佐藤真路
Original Assignee
日商尼康股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商尼康股份有限公司 filed Critical 日商尼康股份有限公司
Publication of TW202042921A publication Critical patent/TW202042921A/zh

Links

Images

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/0006Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03Observing, e.g. monitoring, the workpiece
    • B23K26/032Observing, e.g. monitoring, the workpiece using optical means
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/082Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/60Preliminary treatment
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K31/00Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00
    • B23K31/12Processes relevant to this subclass, specially adapted for particular articles or purposes, but not covered by any single one of main groups B23K1/00 - B23K28/00 relating to investigating the properties, e.g. the weldability, of materials
    • B23K31/125Weld quality monitoring
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/17Systems in which incident light is modified in accordance with the properties of the material investigated
    • G01N21/47Scattering, i.e. diffuse reflection
    • G01N21/4788Diffraction
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/006Vehicles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/34Coated articles ; Surface treated articles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00Materials to be soldered, welded or cut
    • B23K2103/30Organic materials
    • B23K2103/42Plastics other than composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Optics & Photonics (AREA)
  • Mechanical Engineering (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Pathology (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Quality & Reliability (AREA)
  • Laser Beam Processing (AREA)
  • Coating Apparatus (AREA)
  • Electroluminescent Light Sources (AREA)
  • Length Measuring Devices By Optical Means (AREA)
TW109112522A 2019-04-24 2020-04-14 加工系統以及檢查系統 TW202042921A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/JP2019/017402 WO2020217338A1 (ja) 2019-04-24 2019-04-24 加工システム及び検査システム
WOPCT/JP2019/017402 2019-04-24

Publications (1)

Publication Number Publication Date
TW202042921A true TW202042921A (zh) 2020-12-01

Family

ID=72941091

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109112522A TW202042921A (zh) 2019-04-24 2020-04-14 加工系統以及檢查系統

Country Status (5)

Country Link
US (2) US20220196569A1 (https=)
EP (1) EP3960365B1 (https=)
JP (3) JP7363894B2 (https=)
TW (1) TW202042921A (https=)
WO (1) WO2020217338A1 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021106400A1 (ja) * 2019-11-27 2021-06-03 Jfeスチール株式会社 溶接検査装置
WO2022225470A1 (en) * 2021-04-23 2022-10-27 Scg Packaging Public Company Limited A device for testing the liquid absorption of a material and the process thereof
CN117529386A (zh) * 2021-06-29 2024-02-06 株式会社尼康 用于大规模光学制造的方法
WO2023127152A1 (ja) * 2021-12-28 2023-07-06 株式会社ニコン 光学装置および検査方法

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63130289A (ja) * 1986-11-19 1988-06-02 Kawasaki Steel Corp ロ−ルの粗面化方法及びその装置
GB2226970B (en) 1989-01-11 1992-10-21 British Aerospace Methods of manufacture and surface treatment using laser radiation
DE19636458C1 (de) * 1996-09-07 1998-04-02 Schweistechnische Lehr Und Ver Manuell zu positionierende und zu betätigende Einrichtung zum Laserstrahlschweißen
JP2000292125A (ja) * 1999-04-02 2000-10-20 Amada Co Ltd ワークにおける加工可能範囲の検出方法
CN1397089A (zh) * 2000-02-15 2003-02-12 松下电器产业株式会社 非单晶薄膜、带非单晶薄膜的衬底、其制造方法及其制造装置、以及其检查方法及其检查装置、以及利用该非单晶薄膜的薄膜晶体管、薄膜晶体管阵列及图像显示装置
JP3891872B2 (ja) * 2002-04-04 2007-03-14 株式会社ミツトヨ 微小周期構造評価装置及び微小周期構造評価方法
JP2005030822A (ja) * 2003-07-09 2005-02-03 Hitachi Ltd 膜計測方法及びその装置
JP2005169397A (ja) * 2003-12-05 2005-06-30 Seiko Epson Corp レーザ照射装置、液滴吐出装置、レーザ照射方法、液滴吐出方法及び位置制御装置
JP5202026B2 (ja) * 2008-02-25 2013-06-05 三菱電機株式会社 レーザスクライブ装置
RU2506188C2 (ru) * 2008-08-05 2014-02-10 Алкоа Инк. Металлические листы и пластины с текстурированными поверхностями, уменьшающими трение, и способы их изготовления
US8260030B2 (en) * 2009-03-30 2012-09-04 Koh Young Technology Inc. Inspection method
JP5854025B2 (ja) * 2013-11-13 2016-02-09 トヨタ自動車株式会社 回転ロール表面の異物検知および清浄方法と異物検知および清浄装置
US10258982B2 (en) 2014-04-23 2019-04-16 Japan Science And Technology Agency Combined-blade open flow path device and joined body thereof
JP6451370B2 (ja) * 2015-02-09 2019-01-16 オムロン株式会社 接合構造体の製造方法
US10569365B2 (en) * 2015-11-23 2020-02-25 The Boeing Company Method for preparing a fluid flow surface
JP6685777B2 (ja) * 2016-03-09 2020-04-22 三菱重工業株式会社 部材の検査装置及び部材の補修方法
KR101893823B1 (ko) * 2016-10-04 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판의 왜곡 보상 방법
DE102017206968B4 (de) * 2017-04-26 2019-10-10 4Jet Microtech Gmbh & Co. Kg Verfahren und Vorrichtung zum Herstellen von Riblets

Also Published As

Publication number Publication date
EP3960365A1 (en) 2022-03-02
JP2023175909A (ja) 2023-12-12
EP3960365A4 (en) 2023-02-01
US20250251351A1 (en) 2025-08-07
JP7363894B2 (ja) 2023-10-18
JPWO2020217338A1 (https=) 2020-10-29
US20220196569A1 (en) 2022-06-23
EP3960365B1 (en) 2025-11-05
WO2020217338A1 (ja) 2020-10-29
JP2025164838A (ja) 2025-10-30

Similar Documents

Publication Publication Date Title
TW202042921A (zh) 加工系統以及檢查系統
JP7626415B2 (ja) 加工装置、及び、移動体の製造方法
US20250162073A1 (en) Processing apparatus, and manufacturing method of movable body
JP7298681B2 (ja) 加工システム、加工方法、ロボットシステム、接続装置及びエンドエフェクタ装置
US12383981B2 (en) Processing apparatus, and manufacturing method of movable body
JP2022179630A (ja) 加工装置、塗料、加工方法、及び、移動体の製造方法
US20240424601A1 (en) Processing apparatus, and manufacturing method of movable body
JP2022185115A (ja) 加工装置、加工システム、及び、移動体の製造方法
US12539561B2 (en) Processing apparatus, processing method and processing system
US20250121457A1 (en) Processing apparatus, and manufacturing method of movable body
TW202042947A (zh) 加工方法與加工裝置
EP4414119A1 (en) Processing system
JP7298764B2 (ja) 加工装置、及び、移動体の製造方法
JP7586231B2 (ja) 加工装置、及び、移動体の製造方法