TW202033953A - Inspection apparatus and inspection method - Google Patents

Inspection apparatus and inspection method Download PDF

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TW202033953A
TW202033953A TW108142117A TW108142117A TW202033953A TW 202033953 A TW202033953 A TW 202033953A TW 108142117 A TW108142117 A TW 108142117A TW 108142117 A TW108142117 A TW 108142117A TW 202033953 A TW202033953 A TW 202033953A
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inspection
printed circuit
aforementioned
circuit board
specific area
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塩見順一
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日商斯庫林集團股份有限公司
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/89—Investigating the presence of flaws or contamination in moving material, e.g. running paper or textiles
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/8851—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8887—Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges based on image processing techniques
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G01N2021/95615—Inspecting patterns on the surface of objects using a comparative method with stored comparision signal
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's

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Abstract

The invention provides a technique in which, in the case where the printed substrate to be inspected by a printed substrate inspection device is a mirror substrate, it is not necessary to rely on a through hole provided by the substrate to inform the operator of the direction error of the printed substrate. The invention provides an inspection device 1, which comprises a control section 10, a first photography unit 32, a second photography unit 52, and an inspection processing unit 70. The control section 10 prepares the first inspection image D1 and the second inspection image D2 according to the design data of the printed substrate 9. The first photography unit 32 and the second photography unit 52 obtain the first photographic image P1 and the second photographic image P2 of the printed substrate 9. The inspection processing unit 70 compares the first inspection image D1, the second inspection image D2, the first photographic image P1 and the second photographic image P2 so as to inspect the defects in the printed substrate 9. The inspection processing unit 70 performs a different output when a defect is detected in other regions in the event that a defect is detected in the non-rotationally symmetrical specific region. In this way, the operator can be informed of the direction error of the mirror substrate.

Description

檢查裝置以及檢查方法Inspection device and inspection method

本發明係有關於一種用以進行印刷基板(printed circuit)的缺陷檢查之檢查裝置以及檢查方法。The present invention relates to an inspection device and an inspection method for defect inspection of a printed circuit.

以往，於印刷基板的製造工序中，於配線圖案(wiring pattern)的形成、電子零件的安裝結束後，使用檢查裝置進行印刷基板的缺陷檢查。該種檢查裝置係例如一邊將印刷基板以水平姿勢搬送一邊攝影印刷基板的上表面。然後，對照比較所得的攝影圖像與根據設計資料的檢查用圖像，將兩個圖像的差分大之處作為缺陷檢測。Conventionally, in the manufacturing process of a printed circuit board, after the formation of a wiring pattern and the mounting of electronic parts are completed, an inspection device is used to inspect the printed circuit board for defects. For example, this type of inspection device photographs the upper surface of the printed circuit board while conveying the printed circuit board in a horizontal position. Then, the photographic image obtained by the comparison is compared with the inspection image based on the design data, and the large difference between the two images is detected as a defect.

關於進行基板的缺陷檢查之以往的檢查裝置係於例如專利文獻1有記載。 [先前技術文獻] [專利文獻]A conventional inspection apparatus that performs defect inspection of a substrate is described in Patent Document 1, for example. [Prior Technical Literature] [Patent Literature]

[專利文獻1]日本特開2000-187053號公報。[Patent Document 1] JP 2000-187053 A.

[發明所欲解決之課題][The problem to be solved by the invention]

印刷基板的檢查工序中，存在有檢查除了一部分的特定區域以外180°旋轉對稱的所謂「鏡(mirror)基板」的情形。因為鏡基板的大部分為180°旋轉對稱，故在裝設(set)於檢查裝置時會有將印刷基板的方向弄錯180°的情形。另外，於鏡基板的情形中，即使在印刷基板的方向弄錯180°的狀態下檢查，特定區域以外的大部分仍會被判定為正常。因此，存在有未發現方向弄錯180°的狀態地通過檢查工序之虞。In the inspection process of a printed circuit board, there are cases where a so-called "mirror substrate" that is 180° rotationally symmetrical except for a part of a specific area is inspected. Since most of the mirror substrate is 180° rotationally symmetrical, the direction of the printed substrate may be misaligned by 180° when it is set in the inspection device. In addition, in the case of a mirror substrate, even if the printed circuit board is inspected in a state where the direction of the printed circuit board is misaligned by 180°, most of the areas outside the specific area will still be judged as normal. Therefore, there is a possibility of passing the inspection process without seeing a 180° misdirection.

針對該點，於專利文獻1記載有藉由於基板的貫通孔扣合導引銷(guide pin)而判定供給至檢查裝置的基板的方向是否正確的技術。然而，專利文獻1的方法在鏡基板為將貫通孔亦包含在180°旋轉對象內的情形中並不適用。In response to this point, Patent Document 1 describes a technique for judging whether the direction of the substrate supplied to the inspection device is correct by engaging a guide pin with a through hole of the substrate. However, the method of Patent Document 1 is not applicable when the mirror substrate includes the through hole in the 180° rotation object.

本發明係有鑑於上述事情而研發，目的為提供一種技術，於印刷基板的檢查裝置中，於被檢查的印刷基板為鏡基板的情形中，不需依賴於基板設置的貫通孔仍可告知作業員印刷基板的方向錯誤。 [用以解決課題之手段]The present invention is developed in view of the above matters, and aims to provide a technology for the inspection device of printed circuit boards, in the case that the printed circuit board to be inspected is a mirror substrate, the operation can be notified without relying on the through holes provided on the board The direction of the printed circuit board is wrong. [Means to solve the problem]

本發明的第一方案為：一種檢查裝置，係用以進行印刷基板的缺陷檢查，且具有：預備(prepare)部，係根據前述印刷基板的設計資料準備檢查用圖像；搬送機構，係搬送前述印刷基板；攝影部，係攝影被前述搬送機構所搬送的前述印刷基板，取得前述印刷基板的圖像；以及檢查處理部，係比較由前述攝影部所取得的攝影圖像與前述檢查用圖像，藉此檢測前述印刷基板的缺陷；前述預備部係在當前述印刷基板為除了一部分的特定區域以外成為180°旋轉對稱的鏡基板的情形中指定前述特定區域；前述檢查處理部係在於前述特定區域中檢測到缺陷的情形中進行與在其他區域中檢測到缺陷時不同的輸出。The first aspect of the present invention is: an inspection device for defect inspection of a printed circuit board, and has: a prepare section, which prepares an image for inspection based on the design data of the aforementioned printed circuit board; and a transport mechanism, which transports The printed circuit board; a photographing unit which photographs the printed circuit board conveyed by the conveying mechanism and obtains an image of the printed circuit board; and an inspection processing unit which compares the photographed image obtained by the photographing unit with the inspection image Image, to detect defects of the printed circuit board; the preparation section designates the specific area when the printed circuit board is a mirror substrate with 180° rotational symmetry except for a part of the specific area; the inspection processing section is located in the foregoing When a defect is detected in a specific area, output is different from that when a defect is detected in another area.

本發明的第二方案為：如第一方案的檢查裝置，其中前述檢查處理部係因應檢查結果將前述印刷基板分類為：第一群組，係沒有檢測到缺陷；第二群組，係檢測到的缺陷為預先設定的容許範圍內；以及第三群組，係檢測到的缺陷超過前述容許範圍；於在前述特定區域中檢測到缺陷的情形中係必定將前述印刷基板分類至前述第三群組。The second aspect of the present invention is: the inspection device as in the first aspect, wherein the inspection processing unit classifies the printed circuit boards into the first group, which means no defects are detected, according to the inspection result; the second group, which means inspection The detected defects are within the preset allowable range; and the third group, the detected defects exceed the aforementioned allowable range; in the case where the defect is detected in the aforementioned specific area, the aforementioned printed circuit board must be classified into the aforementioned third group Group.

本發明的第三方案為：如第一方案或第二方案的檢查裝置，其中前述預備部係依循來自作業員的指示輸入指定前述特定區域。The third aspect of the present invention is: the inspection device of the first aspect or the second aspect, wherein the preparation part specifies the specific area according to an instruction input from an operator.

本發明的第四方案為：如第一方案或第二方案的檢查裝置，其中前述預備部係根據前述設計資料或前述檢查用圖像自動地挑出且指定前述特定區域。A fourth aspect of the present invention is the inspection device of the first aspect or the second aspect, wherein the preparation part is automatically selected and designated the specific area based on the design data or the inspection image.

本發明的第五方案為：如第四方案的檢查裝置，其中前述鏡基板係具有180°旋轉時除了前述特定區域以外一致的至少兩個檢查區域；前述預備部係將前述檢查用圖像所包含的前述兩個檢查區域的任一方180°旋轉，比較前述兩個檢查區域，將互相不同的部分指定為前述特定區域。The fifth aspect of the present invention is: the inspection device according to the fourth aspect, wherein the mirror substrate has at least two inspection areas that coincide with each other except the specific area when rotated by 180°; the preparation part is the inspection image Either one of the two inspection areas included is rotated by 180°, the two inspection areas are compared, and the parts that are different from each other are designated as the specific areas.

本發明的第六方案為：如第一方案至第五方案中任一方案之檢查裝置，其中前述檢查處理部係區別且辨識：前述印刷基板的配線圖案以及電子零件的缺陷與印刷於前述印刷基板的上表面的絲圖案(silk pattern)的缺陷；在於前述特定區域中檢測到前述絲圖案的缺陷的情形中係進行與在其他區域中檢測到前述絲圖案的缺陷的情形不同的輸出。The sixth aspect of the present invention is: the inspection device according to any one of the first to fifth aspects, wherein the inspection processing section distinguishes and recognizes: the wiring pattern of the printed circuit board and the defects of the electronic parts are printed on the printed circuit board Defects of the silk pattern on the upper surface of the substrate; in the case where the defect of the silk pattern is detected in the aforementioned specific area, output is different from the case where the defect of the aforementioned silk pattern is detected in other areas.

本發明的第七方案為：如第一方案至第六方案中任一方案之檢查裝置，其中前述檢查處理部係在前述特定區域中檢測到缺陷的情形中進行警報動作。The seventh aspect of the present invention is the inspection device according to any one of the first to sixth aspects, wherein the inspection processing unit performs an alarm operation when a defect is detected in the specific area.

本發明的第八方案為：如第一方案至第七方案中任一方案之檢查裝置，其中進一步具備：控制部，係對前述搬送機構進行動作控制；前述控制部係在於前述特定區域中檢測到缺陷的前述印刷基板連續了預定片數的情形中停止前述搬送機構的動作。An eighth aspect of the present invention is: the inspection device according to any one of the first to seventh aspects, which further includes: a control unit that controls the operation of the transport mechanism; and the control unit detects in the specific area When the defective printed circuit board continues by a predetermined number of sheets, the operation of the transport mechanism is stopped.

本發明的第九方案為一種檢查方法，係用以進行印刷基板的缺陷檢查，且具有：工序a)，係根據前述印刷基板的設計資料準備檢查用圖像；工序b)，係一邊搬送前述印刷基板一邊攝影前述印刷基板且取得前述印刷基板的圖像；以及工序c)，係比較由前述工序b)所取得的攝影圖像與前述檢查用圖像，藉此檢測前述印刷基板的缺陷；前述工序a)中，在當前述印刷基板為除了一部分的特定區域以外成為180°旋轉對稱的鏡基板的情形中指定前述特定區域；前述工序c)中，在於前述特定區域中檢測到缺陷的情形中進行與在其他區域中檢測到缺陷時不同的輸出。The ninth aspect of the present invention is an inspection method for inspecting the defects of the printed circuit board, and has: step a), preparing an inspection image based on the design data of the aforementioned printed circuit board; step b), transporting the aforementioned The printed circuit board photographs the printed circuit board and obtains an image of the printed circuit board; and step c) compares the photographed image obtained in the step b) with the inspection image to detect defects of the printed circuit board; In the foregoing step a), when the printed circuit board is a mirror substrate that becomes 180° rotationally symmetrical except for a part of the specific area, the foregoing specific area is designated; in the foregoing step c), when a defect is detected in the foregoing specific area The output is different from when defects are detected in other areas.

本發明的第十方案為：如第九方案的檢查方法，其中前述工序c)中，因應檢查結果將前述印刷基板分類為：第一群組，係沒有檢測到缺陷；第二群組，係檢測到的缺陷為預先設定的容許範圍內；以及第三群組，係檢測到的缺陷超過前述容許範圍；於在前述特定區域中檢測到缺陷的情形中係必定將前述印刷基板分類至前述第三群組。The tenth aspect of the present invention is: the inspection method of the ninth aspect, wherein in the foregoing step c), the foregoing printed circuit boards are classified into: the first group, which has no defects detected; the second group, which is based on the inspection result The detected defects are within the preset allowable range; and the third group is that the detected defects exceed the aforementioned allowable range; in the case of detecting defects in the aforementioned specific area, the aforementioned printed circuit board must be classified into the aforementioned first Three groups.

本發明的第十一方案為：如第九方案或第十方案的檢查方法，其中前述工序a)中，作業員係指定前述特定區域。The eleventh aspect of the present invention is the inspection method of the ninth aspect or the tenth aspect, wherein in the aforementioned step a), the operator designates the aforementioned specific area.

本發明的第十二方案為：如第九方案或第十方案的檢查方法，其中前述工序a)中，準備前述檢查用圖像的電腦係根據前述設計資料或前述檢查用圖像自動地挑出且指定前述特定區域。The twelfth aspect of the present invention is the inspection method according to the ninth aspect or the tenth aspect, wherein in the step a), the computer that prepares the inspection image is automatically selected based on the design data or the inspection image. Out and specify the aforementioned specific area.

本發明的第十三方案為：如第十二方案的檢查方法，其中前述鏡基板係具有180°旋轉時除了前述特定區域以外一致的至少兩個檢查區域；前述工序a)中，前述電腦係使前述檢查用圖像所包含的前述兩個檢查區域的任一方180°旋轉，比較前述兩個檢查區域，將互相不同的部分指定為前述特定區域。The thirteenth aspect of the present invention is: the inspection method according to the twelfth aspect, wherein the aforementioned mirror substrate has at least two inspection areas that coincide with each other except the aforementioned specific area when rotated by 180°; in the aforementioned step a), the aforementioned computer system Rotate either one of the two inspection areas included in the inspection image by 180°, compare the two inspection areas, and designate parts that are different from each other as the specific area.

本發明的第十四方案為：如第九方案至第十三方案的任一方案之檢查方法，其中前述工序c)中，區別且辨識：前述印刷基板的配線圖案以及電子零件的缺陷、與印刷於前述印刷基板的上表面的絲圖案的缺陷；在於前述特定區域中檢測到前述絲圖案的缺陷的情形中係進行與在其他區域中檢測到前述絲圖案的缺陷的情形不同的輸出。The fourteenth aspect of the present invention is the inspection method of any one of the ninth aspect to the thirteenth aspect, wherein in the foregoing step c), distinguish and identify: the wiring pattern of the printed circuit board and the defects of the electronic parts, and Defects of the silk pattern printed on the upper surface of the printed substrate; when the defect of the silk pattern is detected in the specific area, output is different from the case where the defect of the silk pattern is detected in other areas.

本發明的第十五方案為：如第九方案至第十四方案的任一方案之檢查方法，其中前述工序c)中，在前述特定區域中檢測到缺陷的情形中進行警報動作。The fifteenth aspect of the present invention is the inspection method of any one of the ninth aspect to the fourteenth aspect, wherein in the step c), an alarm action is performed when a defect is detected in the specific area.

本發明的第十六方案為：如第九方案至第十五方案的任一方案之檢查方法，其中在於前述特定區域中檢測到缺陷的前述印刷基板連續了預定片數的情形中停止前述印刷基板的搬送。 [發明功效]The sixteenth aspect of the present invention is the inspection method of any one of the ninth aspect to the fifteenth aspect, wherein the printing is stopped when the printed circuit board on which the defect is detected in the specific area continues for a predetermined number of sheets Transfer of substrates. [Invention Effect]

依據本發明的第一方案至第八方案，在弄錯鏡基板的方向裝設的情形中，檢査處理部係進行與通常不同的輸出。藉此，可以告知作業員鏡基板的方向錯誤。According to the first to eighth aspects of the present invention, when the mirror substrate is installed in the wrong direction, the inspection processing section performs output different from usual. This can inform the operator that the direction of the mirror substrate is wrong.

依據本發明的第九方案至第十六方案，在弄錯鏡基板的方向裝設的情形中，於工序c)中進行與通常不同的輸出。藉此，可以告知作業員鏡基板的方向錯誤。According to the ninth aspect to the sixteenth aspect of the present invention, in the case where the mirror substrate is installed in the wrong direction, the output is different from usual in step c). This can inform the operator that the direction of the mirror substrate is wrong.

以下，針對本發明的適合的實施形態參照圖式進行說明。Hereinafter, suitable embodiments of the present invention will be described with reference to the drawings.

[1.針對印刷基板] 首先，針對在後述的檢查裝置1中被檢查的印刷基板9說明。[1. For printed circuit boards] First, the printed circuit board 9 inspected in the inspection apparatus 1 described later will be described.

圖1為顯示印刷基板9的一例之圖。如圖1所示，印刷基板9係具有：底板(base plate)91；配線圖案92，形成於底板91的上表面以及下表面；以及複數個電子零件93。底板91係由玻璃環氧、酚醛紙(paper phenol)等的絕緣材料所形成。配線圖案92係將底板91上的銅箔藉由光微影(photolithographic)蝕刻而形成。複數個電子零件93係藉由焊接而連接在底板91上的配線圖案92。另外，於底板91的上表面以及下表面印刷有顯示配線圖案92的編號、電子零件93的種類等之資訊的絲圖案94。FIG. 1 is a diagram showing an example of a printed circuit board 9. As shown in FIG. 1, the printed circuit board 9 has: a base plate 91; wiring patterns 92 formed on the upper and lower surfaces of the base plate 91; and a plurality of electronic components 93. The bottom plate 91 is formed of insulating materials such as glass epoxy and paper phenol. The wiring pattern 92 is formed by photolithographic etching of the copper foil on the bottom plate 91. The plurality of electronic components 93 are wiring patterns 92 connected to the bottom plate 91 by soldering. In addition, a silk pattern 94 that displays information such as the serial number of the wiring pattern 92 and the type of electronic component 93 is printed on the upper surface and the lower surface of the base plate 91.

圖1的印刷基板9係除了一小部分的特定區域95以外為180°旋轉對稱(亦稱二次對稱)。亦即，印刷基板9係在被180°旋轉時，除了特定區域95以外的圖案為一致。這樣的180°旋轉對稱的印刷基板9被稱為「鏡基板」。The printed substrate 9 of FIG. 1 is 180° rotationally symmetrical (also called quadratic symmetry) except for a small part of the specific area 95. That is, when the printed circuit board 9 is rotated by 180°, the patterns except for the specific area 95 are consistent. Such a 180° rotationally symmetric printed circuit board 9 is called a "mirror substrate".

圖1之例中，於印刷基板9的上表面存在有兩個矩形的檢查區域96A、96B。兩個檢查區域96A、96B係以印刷基板9的中央為界而鄰接配置。包含於這些檢查區域96A、96B的圖案係除了特定區域95以外一致。但是，檢查區域96A與檢查區域96B係以互相180°旋轉的姿勢配置。亦即，若將圖1的印刷基板9予以180°旋轉，則在旋轉前與旋轉後兩個檢查區域96A、96B係除了特定區域95以外一致。In the example of FIG. 1, there are two rectangular inspection areas 96A and 96B on the upper surface of the printed circuit board 9. The two inspection areas 96A and 96B are arranged adjacently with the center of the printed circuit board 9 as a boundary. The patterns included in these inspection areas 96A and 96B are identical except for the specific area 95. However, the inspection area 96A and the inspection area 96B are arranged in a posture rotated 180° with each other. That is, if the printed circuit board 9 of FIG. 1 is rotated by 180°, the two inspection areas 96A and 96B before and after the rotation coincide with the exception of the specific area 95.

[2.檢查裝置的構成] 接下來，針對本發明的一實施形態之檢查裝置1說明。[2. Composition of inspection device] Next, the inspection apparatus 1 according to an embodiment of the present invention will be described.

圖2係顯示檢查裝置1的構成之圖。該檢查裝置1係下述裝置：在印刷基板9的製造工序中，於配線圖案92的形成、絲圖案94的印刷以及電子零件93的安裝結束後且在該印刷基板9出貨前，進行印刷基板9的缺陷檢查(外觀檢查)。如圖2所示，本實施形態的檢查裝置1係具有控制部10、基板投入部20、第一搬送機構31、第一攝影部32、第一缺陷檢測部33、反轉機構40、第二搬送機構51、第二攝影部52、第二缺陷檢測部53以及基板排出部60。FIG. 2 is a diagram showing the structure of the inspection device 1. The inspection device 1 is an apparatus: in the manufacturing process of the printed circuit board 9, the printing is performed after the formation of the wiring pattern 92, the printing of the silk pattern 94, and the mounting of the electronic component 93 and before the shipment of the printed circuit board 9 Defect inspection (visual inspection) of the substrate 9. As shown in FIG. 2, the inspection device 1 of this embodiment has a control unit 10, a substrate input unit 20, a first transport mechanism 31, a first imaging unit 32, a first defect detection unit 33, a reversing mechanism 40, and a second The transport mechanism 51, the second imaging unit 52, the second defect detection unit 53, and the substrate discharge unit 60.

控制部10係用以對基板投入部20、第一搬送機構31、反轉機構40、第二搬送機構51以及基板排出部60進行動作控制之手段。控制部10係例如由具有RAM(Random Access Memory；隨機存取記憶體)等的記憶體以及CPU(Central Processing Unit；中央處理單元)等的處理器且依循電腦程式而動作的電腦所構成。控制部10係經由馬達控制器11而與上述的基板投入部20、第一搬送機構31、反轉機構40、第二搬送機構51以及基板排出部6電性連接。控制部10係依循電腦程式而往馬達控制器11發送控制信號。藉此，馬達控制器11係使組入了基板投入部20、第一搬送機構31、反轉機構40、第二搬送機構51以及基板排出部60之各部的馬達動作。結果，實現了控制部10內的印刷基板9的搬送動作。The control section 10 is a means for controlling the operations of the substrate input section 20, the first transport mechanism 31, the reversing mechanism 40, the second transport mechanism 51, and the substrate discharge section 60. The control unit 10 is composed of, for example, a computer that has a memory such as RAM (Random Access Memory) and a processor such as a CPU (Central Processing Unit) and operates in accordance with a computer program. The control unit 10 is electrically connected to the above-mentioned substrate input unit 20, the first transport mechanism 31, the reversing mechanism 40, the second transport mechanism 51, and the substrate discharge unit 6 via the motor controller 11. The control unit 10 sends control signals to the motor controller 11 according to a computer program. Thereby, the motor controller 11 operates the motors that incorporate the substrate input section 20, the first conveying mechanism 31, the reversing mechanism 40, the second conveying mechanism 51, and the substrate discharge section 60. As a result, the conveying operation of the printed circuit board 9 in the control unit 10 is realized.

本實施形態中，該控制部10係具有作為根據印刷基板9的設計資料而準備檢查用圖像的「預備部」的功能。控制部10係從經由網路連接的伺服器接收印刷基板9的設計資料。然後，將所獲得的設計資料變換為適合第一缺陷檢測部33以及第二缺陷檢測部53之檢測處理的檢查用圖像。本實施形態的控制部10係製作用於印刷基板9的第一面之檢查的第一檢查用圖像D1以及用於印刷基板9的第二面之檢查的第二檢查用圖像D2。然後，控制部10係將第一檢查用圖像D1往第一缺陷檢測部33發送，將第二檢查用圖像D2往第二缺陷檢測部53發送。In the present embodiment, the control unit 10 has a function as a “preparation unit” that prepares an inspection image based on the design data of the printed circuit board 9. The control unit 10 receives design data of the printed circuit board 9 from a server connected via a network. Then, the obtained design data is converted into an inspection image suitable for the detection processing of the first defect detection unit 33 and the second defect detection unit 53. The control unit 10 of the present embodiment creates a first inspection image D1 for inspection of the first surface of the printed circuit board 9 and a second inspection image D2 for inspection of the second surface of the printed circuit board 9. Then, the control unit 10 sends the first inspection image D1 to the first defect detection unit 33 and the second inspection image D2 to the second defect detection unit 53.

這樣，本實施形態中，進行印刷基板9的搬送控制的控制部10之電腦亦發揮作為準備第一檢查用圖像D1以及第二檢查用圖像D2之預備部的功能。但是，進行印刷基板9的搬送控制的電腦與作為預備部而發揮功能的電腦亦可分別設置。In this way, in this embodiment, the computer of the control unit 10 that controls the transport of the printed circuit board 9 also functions as a preparation unit for preparing the first inspection image D1 and the second inspection image D2. However, a computer that controls the transportation of the printed circuit board 9 and a computer that functions as a standby unit may be installed separately.

基板投入部20係用以將應檢查的印刷基板9送入裝置內之部位。基板投入部20係位於檢查裝置1中的印刷基板9的搬送路徑的最上游側。負責印刷基板9的檢查工序的作業員係例如手工地將檢查前的複數片印刷基板9一併往基板投入部20裝設。此時，印刷基板9係以第一面成為上側的姿勢配置。但是，往基板投入部20的印刷基板9的投入係亦可由機器人進行。The board input portion 20 is used to feed the printed board 9 to be inspected into a location in the device. The board input portion 20 is located on the most upstream side of the conveying path of the printed board 9 in the inspection device 1. The operator in charge of the inspection process of the printed circuit board 9 manually installs a plurality of printed circuit boards 9 before the inspection to the circuit board input section 20, for example. At this time, the printed circuit board 9 is arranged in a posture in which the first surface becomes the upper side. However, the input system of the printed circuit board 9 to the board input section 20 may be performed by a robot.

第一搬送機構31係下述機構：從基板投入部20將印刷基板9逐片取出，且將各印刷基板9往搬送路徑下游側搬送。第一搬送機構31係將印刷基板9以第一面朝向上側的姿勢水平地搬送。第一搬送機構31係例如將印刷基板9載置於複數個輥(roller)上，藉由使複數個輥旋轉而搬送印刷基板9。但是，第一搬送機構31亦可為用以藉由滾珠螺桿的旋轉使載置了印刷基板9的台(stage)水平移動之機構。另外，第一搬送機構31亦可為用以藉由線性馬達使載置了印刷基板9的台水平移動之機構。The first transport mechanism 31 is a mechanism that takes out the printed circuit boards 9 one by one from the board input section 20 and transports each printed circuit board 9 to the downstream side of the transport path. The first conveyance mechanism 31 conveys the printed circuit board 9 horizontally with the first surface facing upward. The first transport mechanism 31 places the printed circuit board 9 on a plurality of rollers, for example, and transports the printed circuit board 9 by rotating the plurality of rollers. However, the first transport mechanism 31 may also be a mechanism for horizontally moving the stage on which the printed circuit board 9 is placed by the rotation of the ball screw. In addition, the first transport mechanism 31 may be a mechanism for horizontally moving the stage on which the printed circuit board 9 is placed by a linear motor.

第一攝影部32係用以攝影藉由第一搬送機構31而搬送的印刷基板9的上表面之機構。於第一攝影部32係例如使用線感測器(line sensor)。線感測器係具有在對於印刷基板9的搬送方向正交且水平的方向(以下，亦稱為「寬度方向」)排列的複數個受光元件。第一攝影部32係藉由將通過下方的印刷基板9連續地攝影而取得印刷基板9的第一面的圖像(以下，亦稱為「第一攝影圖像P1」)作為數位資料。另外，第一攝影部32係將所獲得的第一攝影圖像P1往第一缺陷檢測部33發送。The first photographing section 32 is a mechanism for photographing the upper surface of the printed circuit board 9 conveyed by the first conveying mechanism 31. For the first imaging unit 32, for example, a line sensor is used. The line sensor has a plurality of light-receiving elements arranged in a horizontal direction (hereinafter, also referred to as a "width direction") orthogonal to the conveyance direction of the printed circuit board 9. The first photographing unit 32 acquires an image of the first surface of the printed circuit board 9 (hereinafter, also referred to as "first photographed image P1") as digital data by continuously photographing the printed circuit board 9 below it. In addition, the first imaging unit 32 sends the obtained first imaging image P1 to the first defect detection unit 33.

第一缺陷檢測部33係檢查印刷基板9的第一面中有無缺陷的處理部。第一缺陷檢測部33係例如由具有RAM等的記憶體以及CPU等的處理器且依循電腦程式而動作的電腦所構成。第一缺陷檢測部33係將由控制部10所製作的第一檢查用圖像D1與由第一攝影部32所取得的第一攝影圖像P1比較。然後，將第一攝影圖像P1的像素值相對於第一檢查用圖像D1不同達至一定值以上的部分作為缺陷檢測。另外，第一缺陷檢測部33係將顯示印刷基板9的第一面之檢查結果的第一檢查結果R1往控制部10發送。The first defect detection unit 33 is a processing unit that inspects the first surface of the printed circuit board 9 for defects. The first defect detection unit 33 is constituted by, for example, a computer that has a memory such as RAM and a processor such as a CPU and operates in accordance with a computer program. The first defect detection unit 33 compares the first inspection image D1 produced by the control unit 10 with the first photographed image P1 acquired by the first photographing unit 32. Then, the part where the pixel value of the first photographed image P1 is different from the first inspection image D1 by a certain value or more is detected as a defect. In addition, the first defect detection unit 33 sends the first inspection result R1 showing the inspection result of the first surface of the printed circuit board 9 to the control unit 10.

反轉機構40係用以在第一搬送機構31與第二搬送機構51之間使印刷基板9的正反反轉之機構。反轉機構40從第一搬送機構31接受第一面的檢查已結束的印刷基板9。然後，反轉機構40係以於水平方向延伸的軸作為中心而使印刷基板9旋轉180°。藉此，將印刷基板9的姿勢從第一面朝向上側的姿勢往第二面朝向上側的姿勢反轉。之後，反轉機構40係將反轉後的印刷基板9往第二搬送機構51傳遞。The reversing mechanism 40 is a mechanism for reversing the front and back of the printed circuit board 9 between the first conveying mechanism 31 and the second conveying mechanism 51. The reversing mechanism 40 receives the printed circuit board 9 whose inspection of the first surface has been completed from the first conveying mechanism 31. Then, the reversing mechanism 40 rotates the printed circuit board 9 by 180° with the axis extending in the horizontal direction as the center. Thereby, the posture of the printed circuit board 9 is reversed from the posture of the first surface to the upper side to the posture of the second surface to the upper side. After that, the reversing mechanism 40 transfers the reversed printed circuit board 9 to the second conveying mechanism 51.

第二搬送機構51係用以將從反轉機構40接受的印刷基板9往搬送路徑的更下游側搬送之機構。第二搬送機構51係將印刷基板9以第二面朝向上側的姿勢水平地搬送。第二搬送機構51係例如將印刷基板9載置於複數個輥上，使複數個輥旋轉，藉此搬送印刷基板9。但是，第二搬送機構51亦可為用以藉由滾珠螺桿的旋轉使載置了印刷基板9的台水平移動之機構。另外，第二搬送機構51亦可為用以藉由線性馬達使載置了印刷基板9的台水平移動之機構。The second transport mechanism 51 is a mechanism for transporting the printed circuit board 9 received from the reversing mechanism 40 to the downstream side of the transport path. The second transport mechanism 51 transports the printed circuit board 9 horizontally with the second surface facing upward. For example, the second conveyance mechanism 51 places the printed circuit board 9 on a plurality of rollers and rotates the plurality of rollers, thereby conveying the printed circuit board 9. However, the second conveyance mechanism 51 may be a mechanism for horizontally moving the stage on which the printed circuit board 9 is placed by the rotation of a ball screw. In addition, the second transport mechanism 51 may be a mechanism for horizontally moving the stage on which the printed circuit board 9 is placed by a linear motor.

第二攝影部52係用以攝影藉由第二搬送機構51而搬送的印刷基板9的上表面之機構。於第二攝影部52係例如使用線感測器。線感測器係具有在印刷基板9的寬度方向排列的複數個受光元件。第二攝影部52係藉由將通過下方的印刷基板9連續地攝影而取得印刷基板9的第二面的圖像(以下，亦稱為「第二攝影圖像P2」)作為數位資料。另外，第二攝影部52係將所獲得的第二攝影圖像P2往第二缺陷檢測部53發送。The second photographing unit 52 is a mechanism for photographing the upper surface of the printed circuit board 9 conveyed by the second conveying mechanism 51. For the second photographing unit 52, for example, a line sensor is used. The line sensor has a plurality of light receiving elements arranged in the width direction of the printed circuit board 9. The second photographing unit 52 acquires an image of the second surface of the printed circuit board 9 (hereinafter also referred to as "second photographed image P2") as digital data by continuously photographing the printed circuit board 9 below it. In addition, the second photographing unit 52 sends the obtained second photographed image P2 to the second defect detection unit 53.

第二缺陷檢測部53係用以檢查印刷基板9的第二面中有無缺陷之處理部。第二缺陷檢測部53係例如由具有RAM等的記憶體以及CPU等的處理器且依循電腦程式而動作的電腦所構成。第二缺陷檢測部53係將由控制部10所製作的第二檢查用圖像D2與由第二攝影部52所取得的第二攝影圖像P2比較。然後，將第二攝影圖像P2的像素值相對於第二檢查用圖像D2不同達至一定值以上的部分作為缺陷檢測。另外，第二缺陷檢測部53係將顯示印刷基板9的第二面之檢查結果的第二檢查結果R2往控制部10發送。The second defect detection unit 53 is a processing unit for inspecting the second surface of the printed circuit board 9 for defects. The second defect detection unit 53 is constituted by, for example, a computer that has a memory such as RAM and a processor such as a CPU and operates in accordance with a computer program. The second defect detection unit 53 compares the second inspection image D2 created by the control unit 10 with the second captured image P2 acquired by the second imaging unit 52. Then, the part where the pixel value of the second photographed image P2 differs from the second inspection image D2 by a certain value or more is detected as a defect. In addition, the second defect detection unit 53 sends the second inspection result R2 showing the inspection result of the second surface of the printed circuit board 9 to the control unit 10.

控制部10接收了第一檢查結果R1以及第二檢查結果R2後，分析這些檢查結果，判定各印刷基板9否是良好。亦即，本實施形態中，第一缺陷檢測部33、第二缺陷檢測部53以及控制部10係作為整體而構成進行印刷基板9之檢查處理的檢查處理部70。檢查處理部70係可由如本實施形態般地可互相通信地連接的複數個電腦所構成，或亦可由單一個電腦所構成。After receiving the first inspection result R1 and the second inspection result R2, the control unit 10 analyzes these inspection results and determines whether each printed circuit board 9 is good. That is, in this embodiment, the first defect detection unit 33, the second defect detection unit 53, and the control unit 10 constitute an inspection processing unit 70 that performs inspection processing of the printed circuit board 9 as a whole. The inspection processing unit 70 may be constituted by a plurality of computers that are communicably connected to each other as in the present embodiment, or may be constituted by a single computer.

基板排出部60係用以因應檢查結果將第二面的檢查已結束的印刷基板9往三個收納部(第一收納部61、第二收納部62、第三收納部63)排出之機構。基板排出部60以及三個收納部(第一收納部61、第二收納部62、第三收納部63)係位於檢查裝置1中的印刷基板9的搬送路徑的最下游側。基板排出部60係藉由例如一邊保持印刷基板9一邊移動的機器人而實現。基板排出部60係將從第二搬送機構51接受的印刷基板9依循來自控制部10的指令而往第一收納部61、第二收納部62或第三收納部63分配而收納。The substrate ejection unit 60 is a mechanism for ejecting the printed circuit board 9 whose inspection of the second side has been completed to the three storage portions (first storage portion 61, second storage portion 62, and third storage portion 63) in accordance with the inspection result. The substrate discharge section 60 and the three storage sections (the first storage section 61, the second storage section 62, and the third storage section 63) are located on the most downstream side of the transport path of the printed circuit board 9 in the inspection device 1. The substrate discharge unit 60 is realized by, for example, a robot that moves while holding the printed circuit board 9. The substrate discharge unit 60 distributes the printed circuit boards 9 received from the second transport mechanism 51 to the first storage unit 61, the second storage unit 62, or the third storage unit 63 in accordance with an instruction from the control unit 10 and stores them.

第一收納部61為用以將良品的印刷基板9收納之部分。於第一檢查結果R1以及第二檢查結果R2中，當沒有檢測到成為問題的缺陷時，則該印刷基板9被往第一收納部61收納。第二收納部62係用以收納需要由作業員進行的缺陷的目視確認的印刷基板9之部分。當包含於第一檢查結果R1以及第二檢查結果R2的缺陷的數量為預先設定的容許範圍內時，則該印刷基板9被往第二收納部62收納。第三收納部63係用以收納不良品或收納需要由作業員進行的特別的檢證的印刷基板9之部分。當包含於第一檢查結果R1以及第二檢查結果R2的缺陷的數量為超過預先設定的容許範圍時或發生了後述的第一警報資訊A1、第二警報資訊A2時，則該印刷基板9被往第三收納部63收納。The first storage portion 61 is a portion for storing good printed circuit boards 9. In the first inspection result R1 and the second inspection result R2, when a defect that becomes a problem is not detected, the printed circuit board 9 is stored in the first storage section 61. The second storage portion 62 is a portion for storing the printed circuit board 9 that requires visual confirmation of defects by an operator. When the number of defects included in the first inspection result R1 and the second inspection result R2 is within the predetermined allowable range, the printed circuit board 9 is stored in the second storage section 62. The third storage portion 63 is a part for storing defective products or storing printed circuit boards 9 that require special inspection by an operator. When the number of defects included in the first inspection result R1 and the second inspection result R2 exceeds the preset allowable range or the first alarm information A1 and the second alarm information A2 described later occur, the printed circuit board 9 is Store in the third storage section 63.

[3.鏡基板的檢查處理] 接下來，對於在上述檢查裝置1中進行屬於鏡基板的印刷基板9的缺陷檢查時的處理進行說明。圖3係顯示對於鏡基板的檢查處理的流程之流程圖。[3. Inspection processing of mirror substrate] Next, a description will be given of processing when performing defect inspection of the printed circuit board 9 that is a mirror substrate in the inspection device 1 described above. FIG. 3 is a flowchart showing the flow of inspection processing for the mirror substrate.

如圖3所示，於進行印刷基板9的檢查時，首先，於控制部10中準備檢查用圖像(步驟S1)。具體而言，作業員對於控制部10的電腦進行預定的操作。藉此，首先，控制部10係從伺服器下載成為檢查對象的印刷基板9的設計資料。然後，根據所取得的設計資料製作：第一檢查用圖像D1，係屬於第一面的檢查用圖像；以及第二檢查用圖像D2，係屬於第二面的檢查用圖像。As shown in FIG. 3, when the printed circuit board 9 is inspected, first, an image for inspection is prepared in the control unit 10 (step S1). Specifically, the operator performs a predetermined operation on the computer of the control unit 10. In this way, first, the control unit 10 downloads the design data of the printed circuit board 9 to be inspected from the server. Then, based on the acquired design data, the first inspection image D1 is an inspection image belonging to the first surface; and the second inspection image D2 is an inspection image belonging to the second surface.

在檢查對象的印刷基板9為鏡基板的情形中，第一檢查用圖像D1以及第二檢查用圖像D2係各自除了一部分的特定區域95以外成為旋轉對稱。該情形中，控制部10係對於這些第一檢查用圖像D1以及第二檢查用圖像D2各自指定特定區域95(步驟S2)。本實施形態中，控制部10係根據第一檢查用圖像D1以及第二檢查用圖像D2將特定區域95自動地挑出且指定。When the printed circuit board 9 to be inspected is a mirror substrate, the first inspection image D1 and the second inspection image D2 are rotationally symmetrical except for a part of the specific area 95. In this case, the control unit 10 designates a specific area 95 for each of the first inspection image D1 and the second inspection image D2 (step S2). In this embodiment, the control unit 10 automatically picks out and designates the specific area 95 based on the first inspection image D1 and the second inspection image D2.

圖4係概念性地顯示對於具有圖1的布局(layout)的印刷基板9的第一檢查用圖像D1指定特定區域95時的處理之一例之圖。如圖4所示，於指定特定區域95時，首先，使包含於第一檢查用圖像D1的兩個檢查區域96A、96B的任一方(圖4之例中為檢查區域96B)180°旋轉。然後，如圖4的中段的圖所示，比較旋轉後的一方的檢查區域96B與另一方的檢查區域96A，將互相不同的部分指定為特定區域95。之後，如圖4的下段的圖所示，將一方的檢查區域96B恢復成原來的姿勢。這樣一來，控制部10的電腦可根據第一檢查用圖像D1自動地指定特定區域95。FIG. 4 is a diagram conceptually showing an example of processing when the specific area 95 is designated for the first inspection image D1 of the printed circuit board 9 having the layout of FIG. 1. As shown in FIG. 4, when specifying the specific area 95, first, one of the two inspection areas 96A and 96B (in the example of FIG. 4, the inspection area 96B) included in the first inspection image D1 is rotated by 180° . Then, as shown in the middle diagram of FIG. 4, the inspection area 96B of one of the rotations and the inspection area 96A of the other are compared, and the parts different from each other are designated as the specific area 95. After that, as shown in the lower part of FIG. 4, one inspection area 96B is restored to its original posture. In this way, the computer of the control unit 10 can automatically designate the specific area 95 based on the first inspection image D1.

另外，控制部10係用與上述同樣的程序亦對於第二檢查用圖像D2指定特定區域95。In addition, the control unit 10 also designates the specific area 95 for the second inspection image D2 using the same program as described above.

之後，控制部10係將已準備的第一檢查用圖像D1與特定區域95之資訊一起往第一缺陷檢測部33發送。另外，控制部10係將已準備的第二檢查用圖像D2與特定區域95之資訊一起往第二缺陷檢測部53發送。After that, the control unit 10 sends the prepared first inspection image D1 to the first defect detection unit 33 together with the information of the specific area 95. In addition, the control unit 10 sends the prepared second inspection image D2 together with the information of the specific area 95 to the second defect detection unit 53.

接下來，作業員係於基板投入部20裝設複數片印刷基板9(步驟S3)。本實施形態中，複數片印刷基板9係皆為鏡基板。各印刷基板9係根據上述的設計資料而製造。若印刷基板9往基板投入部20的裝設結束，則作業員係對於控制部10輸入動作開始的指示。藉此，開始檢查裝置1內的印刷基板9的搬送(步驟S4)。Next, the operator installs a plurality of printed circuit boards 9 on the circuit board insertion portion 20 (step S3). In this embodiment, the plurality of printed circuit boards 9 are all mirror substrates. Each printed circuit board 9 is manufactured based on the above-mentioned design data. When the installation of the printed circuit board 9 to the board input unit 20 is completed, the operator system inputs an instruction to start the operation to the control unit 10. Thereby, the conveyance of the printed circuit board 9 in the inspection apparatus 1 is started (step S4).

第一搬送機構31係從基板投入部20將印刷基板9逐片取出。然後，將各印刷基板9以第一面朝向上側的姿勢往搬送路徑的下游側依序搬送。之後，第一攝影部32係攝影通過下方的印刷基板9的上表面(步驟S5)。藉此，取得屬於印刷基板9的第一面的圖像的第一攝影圖像P1。所得的第一攝影圖像P1係被從第一攝影部32往第一缺陷檢測部33發送。The first transport mechanism 31 takes out the printed circuit boards 9 one by one from the board input section 20. Then, each printed circuit board 9 is sequentially transported to the downstream side of the transport path with the first surface facing upward. After that, the first photographing unit 32 photographs the upper surface of the printed circuit board 9 passing below (step S5). Thereby, the first photographic image P1 belonging to the image of the first surface of the printed circuit board 9 is acquired. The obtained first photographic image P1 is sent from the first photographing unit 32 to the first defect detection unit 33.

若第一缺陷檢測部33從第一攝影部32接收第一攝影圖像P1，則根據該第一攝影圖像P1進行該印刷基板9的第一面的檢查(步驟S6)。具體而言，第一缺陷檢測部33係比較從控制部10接收的第一檢查用圖像D1與從第一攝影部32接收的第一攝影圖像P1。然後，將第一攝影圖像P1的像素值相對於第一檢查用圖像D1不同達至一定值以上的部分作為缺陷檢測。之後，第一缺陷檢測部33係將屬於印刷基板9的第一面的檢查結果的第一檢查結果R1往控制部10發送。If the first defect detection unit 33 receives the first photographed image P1 from the first photographing unit 32, it will inspect the first surface of the printed circuit board 9 based on the first photographed image P1 (step S6). Specifically, the first defect detection unit 33 compares the first inspection image D1 received from the control unit 10 with the first captured image P1 received from the first imaging unit 32. Then, the part where the pixel value of the first photographed image P1 is different from the first inspection image D1 by a certain value or more is detected as a defect. After that, the first defect detection unit 33 transmits the first inspection result R1 belonging to the inspection result of the first surface of the printed circuit board 9 to the control unit 10.

此時，第一缺陷檢測部33係將於第一面的特定區域95中未檢測到缺陷的情形與於第一面的特定區域95中檢測到缺陷的情形區別而辨識。然後，於第一面的特定區域95中檢測到缺陷的情形，第一缺陷檢測部33係於第一檢查結果R1包含特有之資訊(以下，亦稱為「第一警報資訊A1」)並往控制部10輸出。另一方面，於第一面的特定區域95中未檢測到缺陷的情形，第一缺陷檢測部33係不於第一檢查結果R1包含第一警報資訊A1地將第一檢查結果R1往控制部10輸出。At this time, the first defect detection unit 33 distinguishes a situation where no defect is detected in the specific area 95 of the first surface and a situation where a defect is detected in the specific area 95 of the first surface. Then, when a defect is detected in the specific area 95 of the first surface, the first defect detection unit 33 includes unique information (hereinafter, also referred to as "first alarm information A1") in the first inspection result R1 and sends it to The control unit 10 outputs. On the other hand, when no defect is detected in the specific area 95 of the first surface, the first defect detection unit 33 does not include the first alarm information A1 in the first inspection result R1 and sends the first inspection result R1 to the control unit 10 output.

接下來，通過第一攝影部32之下方的印刷基板9係被從第一搬送機構31往反轉機構40移交。然後，反轉機構40係使印刷基板9的正反反轉(步驟S7)。藉此，印刷基板9的姿勢係從第一面朝向上側的姿勢變更為第二面朝向上側的姿勢。之後，反轉機構40係將反轉後的印刷基板9交給第二搬送機構51。Next, the printed circuit board 9 passing under the first imaging unit 32 is transferred from the first transport mechanism 31 to the reversing mechanism 40. Then, the reversing mechanism 40 reverses the front and back of the printed circuit board 9 (step S7). Thereby, the posture of the printed circuit board 9 is changed from the posture in which the first surface faces upward to the posture in which the second surface faces upward. After that, the reversing mechanism 40 delivers the reversed printed circuit board 9 to the second transport mechanism 51.

接下來，第二搬送機構51係將從反轉機構40接受的印刷基板9以第二面朝向上側的姿勢往搬送路徑的下游側搬送。然後，第二攝影部52係攝影通過下方的印刷基板9的上表面(步驟S8)。藉此，取得第二攝影圖像P2，第二攝影圖像P2係屬於印刷基板9的第二面的圖像。所得的第二攝影圖像P2係從第二攝影部52往第二缺陷檢測部53發送。Next, the second conveyance mechanism 51 conveys the printed circuit board 9 received from the reversing mechanism 40 to the downstream side of the conveyance path with the second surface facing upward. Then, the second photographing unit 52 photographs the upper surface of the printed circuit board 9 passing below (step S8). In this way, the second photographic image P2 is obtained, which is an image belonging to the second surface of the printed circuit board 9. The obtained second photographic image P2 is sent from the second photographing unit 52 to the second defect detection unit 53.

若第二缺陷檢測部53從第二攝影部52接收第二攝影圖像P2，則根據該第二攝影圖像P2進行該印刷基板9的第二面的檢查(步驟S9)。具體而言，第二缺陷檢測部53係將從控制部10接收的第二檢查用圖像D2與從第二攝影部52接收的第二攝影圖像P2比較。然後，將第二攝影圖像P2的像素值相對於第二檢查用圖像D2不同達至一定值以上的部分作為缺陷檢測。之後，第二缺陷檢測部53係將屬於印刷基板9的第二面的檢查結果的第二檢查結果R2往控制部10發送。If the second defect detection unit 53 receives the second photographed image P2 from the second photographing unit 52, the second surface of the printed circuit board 9 is inspected based on the second photographed image P2 (step S9). Specifically, the second defect detection unit 53 compares the second inspection image D2 received from the control unit 10 with the second captured image P2 received from the second imaging unit 52. Then, the part where the pixel value of the second photographed image P2 differs from the second inspection image D2 by a certain value or more is detected as a defect. After that, the second defect detection unit 53 transmits the second inspection result R2 belonging to the inspection result of the second surface of the printed circuit board 9 to the control unit 10.

此時，第二缺陷檢測部53係將於第二面的特定區域95中未檢測到缺陷的情形與於第二面的特定區域95中檢測到缺陷的情形區別而辨識。然後，於第二面的特定區域95中檢測到缺陷的情形，第二缺陷檢測部53係於第二檢查結果R2包含特有之資訊(以下，亦稱為「第二警報資訊A2」)並往控制部10輸出。另一方面，於第二面的特定區域95中未檢測到缺陷的情形，第二缺陷檢測部53係不於第二檢查結果R2包含第二警報資訊A2地將第二檢查結果R2往控制部10輸出。At this time, the second defect detection unit 53 distinguishes a situation where no defect is detected in the specific area 95 of the second surface and a situation where a defect is detected in the specific area 95 of the second surface. Then, when a defect is detected in the specific area 95 on the second surface, the second defect detection unit 53 includes unique information (hereinafter, also referred to as "second alarm information A2") in the second inspection result R2 and sends it to The control unit 10 outputs. On the other hand, when no defect is detected in the specific area 95 of the second surface, the second defect detection unit 53 does not include the second alarm information A2 in the second inspection result R2 and sends the second inspection result R2 to the control unit 10 output.

於基板投入部20中，即使作業員將印刷基板9的方向弄錯180°地裝設，但由於在鏡基板的情形中為180°旋轉對稱，故在第一面以及第二面的大部分仍不會檢測到缺陷。但是，由於特定區域95並非180°旋轉對稱，故會因方向的錯誤而在第一檢查用圖像D1與第二檢查用圖像D2之間發生不一致。因此，可將該不一致作為缺陷而檢測。如此，在特定區域95中檢測到缺陷時所賦予的第一警報資訊A1、第二警報資訊A2係成為表示存在有印刷基板9的方向以180°錯誤裝設的可能性的資訊。In the substrate input section 20, even if the operator installs the printed circuit board 9 in a wrong direction by 180°, in the case of a mirror substrate, it is 180° rotationally symmetrical, so it is on most of the first and second surfaces Still no defects will be detected. However, since the specific area 95 is not 180° rotationally symmetrical, a misalignment may occur between the first inspection image D1 and the second inspection image D2 due to a wrong direction. Therefore, the inconsistency can be detected as a defect. In this way, the first alarm information A1 and the second alarm information A2 given when a defect is detected in the specific area 95 become information indicating that there is a possibility that the printed circuit board 9 may be installed incorrectly in the direction of 180°.

若控制部10接收第一檢查結果R1以及第二檢查結果R2，則因應這些檢查結果將印刷基板9分類為三個群組G1、G2、G3(步驟S10)。If the control unit 10 receives the first inspection result R1 and the second inspection result R2, it will classify the printed circuit board 9 into three groups G1, G2, G3 in accordance with these inspection results (step S10).

圖5係顯示步驟S10的分類處理之一例之流程圖。如圖5所示，首先，控制部10係確認第一檢查結果R1中有無第一警報資訊A1以及第二檢查結果R2中有無第二警報資訊A2(步驟S101)。然後，在第一檢查結果R1以及第二檢查結果R2的至少任一方含有第一警報資訊A1、第二警報資訊A2時(步驟S101：是)，將該印刷基板9分類至第三群組G3(步驟S106)。亦即，控制部10係在於第一面以及第二面的至少任一方的特定區域95中檢測到缺陷時，必定將該印刷基板9分類至第三群組G3。Fig. 5 is a flowchart showing an example of the classification processing in step S10. As shown in FIG. 5, first, the control unit 10 confirms the presence or absence of the first alarm information A1 in the first inspection result R1 and the presence or absence of the second alarm information A2 in the second inspection result R2 (step S101). Then, when at least one of the first inspection result R1 and the second inspection result R2 contains the first alarm information A1 and the second alarm information A2 (step S101: Yes), the printed circuit board 9 is classified into the third group G3 (Step S106). That is, when a defect is detected in the specific area 95 of at least one of the first surface and the second surface, the control unit 10 must classify the printed circuit board 9 into the third group G3.

另一方面，於第一檢查結果R1以及第二檢查結果R2的任一者皆未含有第一警報資訊A1、第二警報資訊A2時(步驟S101：否)，接下來，控制部10係確認第一檢查結果R1以及第二檢查結果R2之各自的缺陷檢測數量(步驟S102)。然後，於第一檢查結果R1以及第二檢查結果R2的任一者中皆沒有檢測到缺陷時(步驟S102：無檢測到缺陷)，將該印刷基板9分類至第一群組G1(步驟S104)。另外，於第一檢查結果R1以及第二檢查結果R2的至少一方中有檢測到缺陷且該缺陷的數量為預先設定的容許範圍內時(步驟S102：容許範圍內)，將該印刷基板9分類至第二群組G2(步驟S105)。另外，於第一檢查結果R1以及第二檢查結果R2的至少一方中檢測到超過預先設定的容許範圍的缺陷時(步驟S102：超過容許範圍)，將該印刷基板9分類至第三群組G3(步驟S106)。On the other hand, when neither of the first inspection result R1 and the second inspection result R2 contains the first alarm information A1 and the second alarm information A2 (step S101: No), then the control unit 10 confirms The number of defects detected in each of the first inspection result R1 and the second inspection result R2 (step S102). Then, when no defect is detected in any of the first inspection result R1 and the second inspection result R2 (step S102: no defect detected), the printed circuit board 9 is classified into the first group G1 (step S104 ). In addition, when a defect is detected in at least one of the first inspection result R1 and the second inspection result R2 and the number of the defects is within the preset allowable range (step S102: within the allowable range), the printed circuit board 9 is classified Go to the second group G2 (step S105). In addition, when a defect exceeding a predetermined allowable range is detected in at least one of the first inspection result R1 and the second inspection result R2 (step S102: exceeding the allowable range), the printed circuit board 9 is classified into the third group G3 (Step S106).

另外，如上所述，於第一檢查結果R1以及第二檢查結果R2的至少任一方含有第一警報資訊A1、第二警報資訊A2時，存在有印刷基板9的方向180°錯誤地裝設的可能性。因此，如圖5所示，於第一檢查結果R1以及第二檢查結果R2的至少任一方含有第一警報資訊A1、第二警報資訊A2時(步驟S101：是)，控制部10係進行警報動作(步驟S103)。藉此，告知作業員存在有印刷基板9的方向被180°錯誤地裝設的可能性。警報動作係藉由於例如連接至控制部10的顯示器(display)表示預定的圖像或訊息而進行。但是，警報動作亦可為燈的亮燈、蜂鳴器的鳴動、往特定之資訊終端的訊息之發送等。In addition, as described above, when at least one of the first inspection result R1 and the second inspection result R2 contains the first alarm information A1 and the second alarm information A2, the printed circuit board 9 may be installed incorrectly in the direction of 180° possibility. Therefore, as shown in FIG. 5, when at least one of the first inspection result R1 and the second inspection result R2 contains the first alarm information A1 and the second alarm information A2 (step S101: Yes), the control unit 10 issues an alarm Action (step S103). This informs the operator that there is a possibility that the direction of the printed circuit board 9 may be installed incorrectly by 180°. The alarm action is performed by, for example, a display connected to the control unit 10 displaying a predetermined image or message. However, the alarm action may also be the lighting of a lamp, the beeping of a buzzer, and the sending of a message to a specific information terminal.

之後，控制部10係因應步驟S10的分類結果使基板排出部60動作。藉此，將印刷基板9分配至三個收納部(第一收納部61、第二收納部62、第三收納部63)排出(步驟S11)。具體而言，基板排出部60係將被分類至第一群組G1的印刷基板9往第一收納部61收納。另外，基板排出部60係將被分類至第二群組G2的印刷基板9往第二收納部62收納。另外，基板排出部60係將被分類至第三群組G3的印刷基板9往第三收納部63收納。After that, the control unit 10 operates the substrate discharge unit 60 in response to the classification result of step S10. Thereby, the printed circuit board 9 is distributed to three storage parts (the first storage part 61, the second storage part 62, and the third storage part 63) and discharged (step S11). Specifically, the substrate discharge section 60 stores the printed circuit boards 9 classified into the first group G1 in the first storage section 61. In addition, the substrate discharge section 60 stores the printed circuit boards 9 classified into the second group G2 in the second storage section 62. In addition, the substrate discharge unit 60 stores the printed circuit boards 9 classified into the third group G3 in the third storage unit 63.

於控制部10進行上述的警報動作時，作業員係確認於第三收納部63所收納的印刷基板9的方向是否180°錯誤。然後，於印刷基板9的方向錯誤的情形中，作業員係將該印刷基板9以正確的方向於基板投入部20重新裝設。之後，檢查裝置1係重新執行該印刷基板9的缺陷檢查。When the control unit 10 performs the above-mentioned alarm operation, the operator confirms whether the direction of the printed circuit board 9 stored in the third storage unit 63 is 180° wrong. Then, when the direction of the printed circuit board 9 is wrong, the operator reinstalls the printed circuit board 9 in the board insertion portion 20 in the correct direction. After that, the inspection device 1 re-executes the defect inspection of the printed circuit board 9.

如以上所述，本實施形態的檢查裝置1中，檢查處理部70係在於鏡基板的特定區域95中檢測到缺陷的情形中，進行與在其他區域中的缺陷檢測不同的輸出。亦即，在屬於鏡基板的印刷基板9的方向弄錯180°地裝設的情形中，檢查處理部70係進行與通常不同的輸出。藉此，可以告知作業員印刷基板9的方向錯誤。As described above, in the inspection apparatus 1 of the present embodiment, the inspection processing unit 70 performs an output different from defect detection in other areas when a defect is detected in the specific area 95 of the mirror substrate. That is, in the case where the printed circuit board 9 belonging to the mirror substrate is installed in a wrong direction by 180°, the inspection processing unit 70 performs an output different from usual. Thereby, the operator can be notified that the direction of the printed circuit board 9 is wrong.

[4.變形例] 以上，雖說明了本發明的一實施形態，但本發明不被限定於上述實施形態。[4. Modifications] Although one embodiment of the present invention has been described above, the present invention is not limited to the above-mentioned embodiment.

[4-1.第一變形例] 上述實施形態中，進行鏡基板的檢查時，控制部10係將檢查區域96A、96B中的特定區域95根據第一檢查用圖像D1以及第二檢查用圖像D2挑出且指定。然而，亦可為控制部10係根據鏡基板的設計資料指定特定區域95。另外，上述實施形態中，控制部10係將特定區域95自動地挑出且指定。然而，亦可為特定區域95係由作業員指定。亦即，亦可為控制部10係依循來自作業員的指示輸入指定特定區域95。[4-1. The first modification] In the above embodiment, when inspecting the mirror substrate, the control unit 10 selects and designates the specific area 95 of the inspection areas 96A and 96B based on the first inspection image D1 and the second inspection image D2. However, it is also possible to specify the specific area 95 for the control unit 10 based on the design data of the mirror substrate. In addition, in the above-described embodiment, the control unit 10 automatically selects and designates the specific area 95. However, the specific area 95 may be designated by the operator. That is, the specific area 95 may be designated for the control unit 10 to follow the instruction input from the operator.

[4-2.第二變形例] 另外，上述實施形態中，在第一缺陷檢測部33以及第二缺陷檢測部53係於特定區域95中檢測到缺陷的情形中，必定會輸出第一警報資訊A1、第二警報資訊A2。然而，亦可為第一缺陷檢測部33以及第二缺陷檢測部53係區別配線圖案92以及電子零件93的缺陷與絲圖案94的缺陷而辨識。然後，亦可為只有在特定區域95中檢測到絲圖案94的缺陷的情形才會輸出第一警報資訊A1、第二警報資訊A2。[4-2. Second modification] In addition, in the above-described embodiment, when the first defect detection unit 33 and the second defect detection unit 53 detect defects in the specific area 95, the first alarm information A1 and the second alarm information A2 are always output. However, the first defect detection unit 33 and the second defect detection unit 53 may distinguish between the defects of the wiring pattern 92 and the electronic component 93 and the defects of the wire pattern 94. Then, it is also possible to output the first alarm information A1 and the second alarm information A2 only when a defect of the silk pattern 94 is detected in the specific area 95.

亦即，亦可為檢查處理部70在特定區域95中檢測到絲圖案94的缺陷的情形中，進行與在其他區域中檢測到絲圖案94的缺陷的情形不同的輸出。這樣一來，如圖1所示，在特定區域95的非旋轉對稱的圖案為絲圖案94的情形中，可更精度良好地檢測印刷基板9的裝設的方向錯誤。That is, when the inspection processing unit 70 detects the defect of the silk pattern 94 in the specific area 95, it may perform output different from the case where the defect of the silk pattern 94 is detected in other areas. In this way, as shown in FIG. 1, in the case where the non-rotationally symmetrical pattern of the specific region 95 is the silk pattern 94, it is possible to more accurately detect the mounting direction error of the printed circuit board 9.

[4-3.第三變形例] 上述實施形態中，第一缺陷檢測部33、第二缺陷檢測部53判定於特定區域95中是否發生缺陷。然後，從第一缺陷檢測部33、第二缺陷檢測部53往控制部10發送表示特定區域95中檢測到缺陷的第一警報資訊A1、第二警報資訊A2。然而，亦可為第一缺陷檢測部33、第二缺陷檢測部53不判斷特定區域95中有無檢測到缺陷地將第一檢查結果R1、第二檢查結果R2往控制部10發送。該情形中，只要控制部10根據所接收的第一檢查結果R1、第二檢查結果R2判定特定區域95中有無檢測到缺陷即可。[4-3. Third modification] In the above embodiment, the first defect detection unit 33 and the second defect detection unit 53 determine whether or not a defect occurs in the specific area 95. Then, from the first defect detection unit 33 and the second defect detection unit 53 to the control unit 10, first alarm information A1 and second alarm information A2 indicating that a defect is detected in the specific area 95 are sent. However, the first defect detection unit 33 and the second defect detection unit 53 may send the first inspection result R1 and the second inspection result R2 to the control unit 10 without determining whether a defect is detected in the specific area 95. In this case, the control unit 10 only needs to determine whether a defect is detected in the specific area 95 based on the received first inspection result R1 and second inspection result R2.

[4-4.第四變形例] 於基板投入部20一併裝設的複數片印刷基板9的方向全部錯誤時，將成為對於全部的印刷基板9於特定區域95中檢測到缺陷。該情形中，若等到這些印刷基板9的檢查全部結束才重新檢查則時間損失大。因此，亦可為控制部10係在於特定區域95中檢測到缺陷的印刷基板9連續預定片數的情形中，進行警告動作並且將第一搬送機構31、反轉機構40、第二搬送機構51以及基板排出部60的動作停止。[4-4. Fourth modification] When the directions of the plurality of printed circuit boards 9 collectively installed in the substrate input portion 20 are all wrong, it will be that defects are detected in the specific area 95 for all the printed circuit boards 9. In this case, if the inspections of these printed circuit boards 9 are all finished before re-inspection, time loss is large. Therefore, the control unit 10 may perform a warning operation and set the first conveying mechanism 31, the reversing mechanism 40, and the second conveying mechanism 51 to the predetermined number of consecutive printed circuit boards 9 whose defects are detected in the specific area 95. And the operation of the substrate discharge unit 60 is stopped.

這樣一來，作業員可在一併裝設的複數片印刷基板9之檢查全部結束前即得知印刷基板9的方向錯誤。如此，即可在該時間點開始作業的重置，而可減低時間的損失。In this way, the operator can know that the direction of the printed circuit board 9 is wrong before the inspection of the plurality of printed circuit boards 9 installed together is completed. In this way, the job reset can be started at this point in time, and the time loss can be reduced.

[4-5.其他的變形例] 上述的圖1之例中，屬於鏡基板的印刷基板9係具有除了特定區域95以外的圖案一致的兩個檢查區域96A、96B。然而，本發明中的鏡基板不限於具有這樣的兩個檢查區域。包含於鏡基板的檢查區域的數量亦可為一個、四個或六個等。[4-5. Other modified examples] In the example of FIG. 1 mentioned above, the printed circuit board 9 which is a mirror board|substrate has two inspection areas 96A and 96B in which the pattern except the specific area 95 is the same. However, the mirror substrate in the present invention is not limited to having such two inspection areas. The number of inspection areas included in the mirror substrate may also be one, four, or six.

另外，上述實施形態的檢查裝置1係檢查印刷基板9的第一面以及第二面的兩方。然而，本發明的檢查裝置亦可為只檢查印刷基板的第一面以及第二面的任一方。In addition, the inspection apparatus 1 of the above-mentioned embodiment inspects both the first surface and the second surface of the printed circuit board 9. However, the inspection device of the present invention may inspect only either the first surface and the second surface of the printed circuit board.

另外，於上述實施形態、變形例登場的各要件在不產生矛盾的範圍內可適當地組合。In addition, the various requirements appearing in the above-mentioned embodiments and modified examples can be appropriately combined within a range that does not cause any contradiction.

1:檢查裝置 9:印刷基板 10:控制部 11:馬達控制器 20:基板投入部 31:第一搬送機構 32:第一攝影部 33:第一缺陷檢測部 40:反轉機構 51:第二搬送機構 52:第二攝影部 53:第二缺陷檢測部 60:基板排出部 61:第一收納部 62:第二收納部 63:第三收納部 70:檢查處理部 91:底板 92:配線圖案 93:電子零件 94:絲圖案 95:特定區域 96A,96B:檢查區域 D1:第一檢查用圖像 D2:第二檢查用圖像 P1:第一攝影圖像 P2:第二攝影圖像 R1:第一檢查結果 R2:第二檢查結果1: Inspection device 9: Printed substrate 10: Control Department 11: Motor controller 20: Board input department 31: The first transfer mechanism 32: The first photography department 33: The first defect detection department 40: Reversal mechanism 51: The second conveying mechanism 52: The second photography department 53: The second defect detection department 60: Board discharge section 61: The first storage section 62: The second storage section 63: The third storage section 70: Inspection and Processing Department 91: bottom plate 92: Wiring pattern 93: Electronic parts 94: Silk pattern 95: specific area 96A, 96B: Inspection area D1: Image for the first inspection D2: Image for second inspection P1: The first photographic image P2: Second photographic image R1: First inspection result R2: Second inspection result

[圖1]係顯示印刷基板的一例之圖。 [圖2]係顯示檢查裝置的構成之圖。 [圖3]係顯示對於鏡基板的檢查處理的流程之流程圖。 [圖4]係概念性地顯示指定特定區域時的處理的一例之圖。 [圖5]係顯示分類處理的流程之流程圖。[Fig. 1] A diagram showing an example of a printed circuit board. [Figure 2] is a diagram showing the structure of the inspection device. [Fig. 3] is a flowchart showing the flow of inspection processing for the mirror substrate. Fig. 4 is a diagram conceptually showing an example of processing when specifying a specific area. [Figure 5] is a flowchart showing the flow of classification processing.

1:檢查裝置 1: Inspection device

9:印刷基板 9: Printed substrate

10:控制部 10: Control Department

11:馬達控制器 11: Motor controller

20:基板投入部 20: Board input department

31:第一搬送機構 31: The first transfer mechanism

32:第一攝影部 32: The first photography department

33:第一缺陷檢測部 33: The first defect detection department

40:反轉機構 40: Reversal mechanism

51:第二搬送機構 51: The second conveying mechanism

52:第二攝影部 52: The second photography department

53:第二缺陷檢測部 53: The second defect detection department

60:基板排出部 60: Board discharge section

61:第一收納部 61: The first storage section

62:第二收納部 62: The second storage section

63:第三收納部 63: The third storage section

70:檢查處理部 70: Inspection and Processing Department

D1:第一檢查用圖像 D1: Image for the first inspection

D2:第二檢查用圖像 D2: Image for second inspection

P1:第一攝影圖像 P1: The first photographic image

P2:第二攝影圖像 P2: Second photographic image

R1:第一檢查結果 R1: First inspection result

R2:第二檢查結果 R2: Second inspection result

Claims (16)

一種檢查裝置，係用以進行印刷基板的缺陷檢查，且具有： 預備部，係根據前述印刷基板的設計資料準備檢查用圖像； 搬送機構，係搬送前述印刷基板； 攝影部，係攝影被前述搬送機構所搬送的前述印刷基板，取得前述印刷基板的圖像；以及 檢查處理部，係比較由前述攝影部所取得的攝影圖像與前述檢查用圖像，藉此檢測前述印刷基板的缺陷； 前述預備部係在當前述印刷基板為除了一部分的特定區域以外成為180°旋轉對稱的鏡基板的情形中指定前述特定區域； 前述檢查處理部係在於前述特定區域中檢測到缺陷的情形中進行與在其他區域中檢測到缺陷時不同的輸出。An inspection device for defect inspection of printed circuit boards and has: The preparation part is to prepare inspection images based on the design data of the aforementioned printed circuit board; The transport mechanism is to transport the aforementioned printed circuit board; The photographing section photographs the printed circuit board conveyed by the conveying mechanism, and obtains an image of the printed circuit board; and The inspection processing unit compares the photographic image obtained by the photographing unit with the inspection image, thereby detecting defects of the printed circuit board; The aforementioned preparation portion specifies the aforementioned specific area when the aforementioned printed substrate is a mirror substrate that becomes 180° rotationally symmetrical except for a part of the specific area; The aforementioned inspection processing unit is configured to perform different output when a defect is detected in the aforementioned specific area than when a defect is detected in other areas. 如請求項1所記載之檢查裝置，其中前述檢查處理部係因應檢查結果將前述印刷基板分類為： 第一群組，係沒有檢測到缺陷； 第二群組，係檢測到的缺陷為預先設定的容許範圍內；以及 第三群組，係檢測到的缺陷超過前述容許範圍； 於在前述特定區域中檢測到缺陷的情形中係必定將前述印刷基板分類至前述第三群組。The inspection device described in claim 1, wherein the inspection processing unit classifies the printed circuit board into: In the first group, no defects were detected; In the second group, the detected defects are within the preset allowable range; and The third group is that the detected defects exceed the aforementioned allowable range; In the case where a defect is detected in the aforementioned specific area, the aforementioned printed circuit board must be classified into the aforementioned third group. 如請求項1或請求項2所記載之檢查裝置，其中前述預備部係依循來自作業員的指示輸入指定前述特定區域。For the inspection device described in claim 1 or claim 2, wherein the aforementioned preparation part specifies the aforementioned specific area according to the instruction input from the operator. 如請求項1或請求項2所記載之檢查裝置，其中前述預備部係根據前述設計資料或前述檢查用圖像自動地挑出且指定前述特定區域。The inspection device described in claim 1 or claim 2, wherein the preparation part is automatically selected and designated the specific area based on the design data or the inspection image. 如請求項4所記載之檢查裝置，其中前述鏡基板係具有180°旋轉時除了前述特定區域以外一致的至少兩個檢查區域； 前述預備部係將前述檢查用圖像所包含的前述兩個檢查區域的任一方180°旋轉，比較前述兩個檢查區域，將互相不同的部分指定為前述特定區域。The inspection device according to claim 4, wherein the mirror substrate has at least two inspection areas that are identical when rotated by 180° except for the specific area; The preparation section rotates either one of the two inspection areas included in the inspection image by 180°, compares the two inspection areas, and designates parts that are different from each other as the specific area. 如請求項1或請求項2所記載之檢查裝置，其中前述檢查處理部係區別且辨識：前述印刷基板的配線圖案以及電子零件的缺陷與印刷於前述印刷基板的上表面的絲圖案的缺陷； 在於前述特定區域中檢測到前述絲圖案的缺陷的情形中係進行與在其他區域中檢測到前述絲圖案的缺陷的情形不同的輸出。The inspection device described in claim 1 or claim 2, wherein the inspection processing section distinguishes and recognizes: the defects of the wiring patterns and electronic parts of the printed circuit board and the defects of the silk pattern printed on the upper surface of the printed circuit board; In the case where the defect of the aforementioned silk pattern is detected in the aforementioned specific area, output is different from the case where the defect of the aforementioned silk pattern is detected in other areas. 如請求項1或請求項2所記載之檢查裝置，其中前述檢查處理部係在前述特定區域中檢測到缺陷的情形中進行警報動作。The inspection device described in claim 1 or claim 2, wherein the inspection processing unit performs an alarm operation when a defect is detected in the specific area. 如請求項1或請求項2所記載之檢查裝置，其中進一步具備： 控制部，係對前述搬送機構進行動作控制； 前述控制部係在於前述特定區域中檢測到缺陷的前述印刷基板連續了預定片數的情形中停止前述搬送機構的動作。For example, the inspection device described in claim 1 or claim 2, which further includes: The control part controls the movement of the aforementioned conveying mechanism; The control unit stops the operation of the conveying mechanism when the printed circuit board for which the defect is detected in the specific area continues by a predetermined number of sheets. 一種檢查方法，係用以進行印刷基板的缺陷檢查，且具有： 工序a)，係根據前述印刷基板的設計資料準備檢查用圖像； 工序b)，係一邊搬送前述印刷基板一邊攝影前述印刷基板且取得前述印刷基板的圖像；以及 工序c)，係比較由前述工序b)所取得的攝影圖像與前述檢查用圖像，藉此檢測前述印刷基板的缺陷； 前述工序a)中，在當前述印刷基板為除了一部分的特定區域以外成為180°旋轉對稱的鏡基板的情形中指定前述特定區域； 前述工序c)中，在於前述特定區域中檢測到缺陷的情形中進行與在其他區域中檢測到缺陷時不同的輸出。An inspection method for defect inspection of printed circuit boards, and has: Step a) is to prepare an inspection image based on the design data of the aforementioned printed circuit board; Step b), photographing the printed board while conveying the printed board and acquiring an image of the printed board; and Step c) compares the photographic image obtained in the step b) with the inspection image, thereby detecting defects of the printed circuit board; In the foregoing step a), when the printed substrate is a mirror substrate that becomes 180° rotationally symmetrical except for a part of the specific area, the specific area is designated; In the aforementioned step c), when a defect is detected in the aforementioned specific area, a different output is performed from when a defect is detected in another area. 如請求項9所記載之檢查方法，其中前述工序c)中，因應檢查結果將前述印刷基板分類為： 第一群組，係沒有檢測到缺陷； 第二群組，係檢測到的缺陷為預先設定的容許範圍內；以及 第三群組，係檢測到的缺陷超過前述容許範圍； 於在前述特定區域中檢測到缺陷的情形中係必定將前述印刷基板分類至前述第三群組。Such as the inspection method described in claim 9, wherein in the aforementioned step c), the aforementioned printed circuit boards are classified into: In the first group, no defects were detected; In the second group, the detected defects are within the preset allowable range; and The third group is that the detected defects exceed the aforementioned allowable range; In the case where a defect is detected in the aforementioned specific area, the aforementioned printed circuit board must be classified into the aforementioned third group. 如請求項9或請求項10所記載之檢查方法，其中前述工序a)中，作業員係指定前述特定區域。In the inspection method described in claim 9 or claim 10, in the aforementioned step a), the operator designates the aforementioned specific area. 如請求項9或請求項10所記載之檢查方法，其中前述工序a)中，準備前述檢查用圖像的電腦係根據前述設計資料或前述檢查用圖像自動地挑出且指定前述特定區域。According to the inspection method described in claim 9 or claim 10, in the step a), the computer that prepares the inspection image automatically selects and specifies the specific area based on the design data or the inspection image. 如請求項12所記載之檢查方法，其中前述鏡基板係具有180°旋轉時除了前述特定區域以外一致的至少兩個檢查區域； 前述工序a)中，前述電腦係使前述檢查用圖像所包含的前述兩個檢查區域的任一方180°旋轉，比較前述兩個檢查區域，將互相不同的部分指定為前述特定區域。The inspection method described in claim 12, wherein the aforementioned mirror substrate has at least two inspection areas that are identical when rotated at 180° except for the aforementioned specific area; In the step a), the computer system rotates either one of the two inspection areas included in the inspection image by 180°, compares the two inspection areas, and designates parts that are different from each other as the specific area. 如請求項9或請求項10所記載之檢查方法，其中前述工序c)中，區別且辨識：前述印刷基板的配線圖案以及電子零件的缺陷、與印刷於前述印刷基板的上表面的絲圖案的缺陷； 在於前述特定區域中檢測到前述絲圖案的缺陷的情形中係進行與在其他區域中檢測到前述絲圖案的缺陷的情形不同的輸出。In the inspection method described in claim 9 or claim 10, in the step c), the difference and recognition: the wiring pattern of the printed circuit board and the defects of the electronic parts, and the silk pattern printed on the upper surface of the printed circuit board defect; In the case where the defect of the aforementioned silk pattern is detected in the aforementioned specific area, output is different from the case where the defect of the aforementioned silk pattern is detected in other areas. 如請求項9或請求項10所記載之檢查方法，其中前述工序c)中，在前述特定區域中檢測到缺陷的情形中進行警報動作。In the inspection method described in claim 9 or claim 10, in the aforementioned step c), an alarm action is performed when a defect is detected in the aforementioned specific area. 如請求項9或請求項10所記載之檢查方法，其中在於前述特定區域中檢測到缺陷的前述印刷基板連續了預定片數的情形中停止前述印刷基板的搬送。The inspection method described in claim 9 or claim 10, wherein the conveyance of the printed circuit board is stopped when the printed circuit board with a defect detected in the specific area continues a predetermined number of sheets.
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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113406110A (en) * 2021-05-20 2021-09-17 广州市花都联华包装材料有限公司 Printing quality detection method, device, equipment and computer medium
CN113466261B (en) * 2021-07-26 2023-04-07 鸿安（福建）机械有限公司 PCB board automatic checkout device
CN117031052B (en) * 2023-10-09 2024-01-09 广州市普理司科技有限公司 Single printed matter front and back vision detection control system

Family Cites Families (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6123951A (en) * 1984-07-11 1986-02-01 Ibiden Co Ltd Detecting method of automatic inspection of outward shape of circuit
JPH0231490A (en) * 1988-07-20 1990-02-01 Sony Corp Printed-circuit board aggregate
JPH04125453A (en) * 1990-09-17 1992-04-24 Fujitsu Ltd Pattern inspection apparatus
JP3368644B2 (en) * 1993-02-03 2003-01-20 松下電器産業株式会社 Wiring pattern inspection apparatus and method
JPH0832225A (en) * 1994-07-12 1996-02-02 Fujitsu Ltd Mounting method for double side mounting printed board
JP3811968B2 (en) * 1995-05-26 2006-08-23 松下電工株式会社 Lighting device
JP2942171B2 (en) * 1995-06-09 1999-08-30 大日本スクリーン製造株式会社 Printed circuit board pattern inspection equipment
JPH10135699A (en) * 1996-10-31 1998-05-22 Elna Co Ltd Device and method for detecting positional deviation of circuit board at inspecting time
JP4755673B2 (en) * 1997-09-24 2011-08-24 オリンパス株式会社 Board inspection equipment
JP2000097671A (en) * 1998-09-28 2000-04-07 Olympus Optical Co Ltd Visual inspection method and system for printed board
JP2000187053A (en) 1998-12-22 2000-07-04 Ricoh Microelectronics Co Ltd Substrate inspecting system
JP4125453B2 (en) 1999-09-17 2008-07-30 本田技研工業株式会社 Torsion beam suspension
JP2002076569A (en) * 2000-08-30 2002-03-15 Dainippon Screen Mfg Co Ltd Inspection device for printed board
JP2003209163A (en) * 2002-01-17 2003-07-25 Nef:Kk Semiconductor device manufacturing method and manufacturing system
JP2006005187A (en) * 2004-06-18 2006-01-05 Hitachi Ltd Identifer printing method of printed-circuit board
JP4654022B2 (en) 2004-12-24 2011-03-16 株式会社サキコーポレーション Substrate visual inspection device
JP2007057505A (en) * 2005-08-26 2007-03-08 Dainippon Screen Mfg Co Ltd Method and device for inspecting printed board, and manufacturing method of printed board
JP4970852B2 (en) * 2006-06-06 2012-07-11 株式会社メガトレード Visual inspection device
JP4205139B2 (en) * 2007-05-29 2009-01-07 株式会社メガトレード Appearance inspection method in appearance inspection apparatus
JP4883636B2 (en) * 2007-09-24 2012-02-22 富士機械製造株式会社 Electronic component orientation inspection apparatus, electronic component orientation inspection method, and electronic component placement machine
CN101566733A (en) * 2008-04-23 2009-10-28 深超光电（深圳）有限公司 Directivity inspecting method and directivity inspecting device applied to liquid crystal panel
JP2011149756A (en) * 2010-01-20 2011-08-04 Hitachi High-Technologies Corp Processing operation device, acf attached condition inspection method, or display substrate module assembly line
JP2013101017A (en) * 2011-11-08 2013-05-23 Nidec-Read Corp Substrate inspection device
JP5826707B2 (en) * 2012-05-31 2015-12-02 株式会社Ｓｃｒｅｅｎホールディングス Substrate inspection apparatus and substrate inspection method
JP2014135425A (en) 2013-01-11 2014-07-24 Djtech Co Ltd Quality control system of printed circuit board
CN103278946B (en) * 2013-05-09 2016-12-28 深圳市华星光电技术有限公司 The detection method of right side and back side of polarizing plate
KR101669992B1 (en) * 2015-02-17 2016-10-27 기가비스주식회사 apparatus for inspecting both sides of substrate
CA2977041A1 (en) 2015-03-27 2016-10-06 Nippon Steel & Sumitomo Metal Corporation Computer implemented blank manufacturing method and press forming method
KR101759496B1 (en) * 2015-08-20 2017-07-19 충북대학교 산학협력단 System and Method for Classification of PCB fault and Type of Fault

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