JPH10227622A - Inspection method of lead and lead inspecting instrument - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inspection method of leads and a lead inspecting apparatus which enable inspection at a stage immediately before shipment as well. SOLUTION: An IC inspecting apparatus 1 is constituted of a camera 15 provided above a conveying path of a pallet 2 where an IC4 is housed, first and second mirrors 16 and 17 and an image processor connected to the camera 15. An image of a right lead 14 is projected as right perspective image 18 onto the camera 15 through the first mirror 16 and an image of a left lead 13 is projected as left perspective image 19 onto the camera through the second mirror 17. Images 18, 19 and 21 contained in an image data from the camera 15 are processed by an image processor to perform an inspection of the leads 13 and 14 based on a relationship of length between the corresponding leads 13 and 14.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead inspection method and a lead inspection apparatus for inspecting ups and downs (coplanarity) of each lead in an electronic component having leads such as a gull wing type.

[0002]

2. Description of the Related Art Conventionally, in a gull-wing type lead extending laterally from an IC, an IC lead inspection apparatus 81 shown in FIG. 5 has been used to inspect the ups and downs (coplanarity) of each lead.

The IC lead inspection apparatus 81 is provided on both sides of a stage 83 on which an IC 82 as an electronic component is mounted, and extends from one side 84 and the other side 85 of the IC 82. The leads 86 and 87 are connected to the IC
A pair of mirrors 88 and 89 projected from the side of 82 and the images of the leads 86 and 87 of the one side edge 84 and the other side edge 85 projected on both mirrors 88 and 89 are displayed on the stage 83.
And a camera 90 for taking an image from below.

An image obtained by the camera 90 is sent to an image processing device (not shown) and processed by the image processing device. Each of the leads 86 extending from the one side edge 84 and other Each lead 87 extending from the side edge 85
Were inspected to see if they were arranged on a straight line, that is, whether the individual leads 86 and 87 had ups and downs.

[0005]

However, in the IC lead inspection apparatus 81, it is determined whether or not each of the leads 86 extending from the one side edge 84 and each of the leads 87 extending from the other side edge 85 have ups and downs. When inspecting
An image of each lead 86, 87 obtained from the side of C82 is required. Therefore, the mirrors 88 and 89 are connected to the IC 8
2 and the IC 82 is stored in a pallet or in a tape immediately before shipping, and one side edge 84 and the other side edge 8 of the IC 82
If the mirrors 88 and 89 cannot be arranged in the vicinity of 5,
Ups and downs of the leads 86 and 87 could not be inspected.

SUMMARY OF THE INVENTION The present invention has been made in view of such a conventional problem, and has as its object to provide a lead inspection method and a lead inspection apparatus capable of performing an inspection even immediately before shipment. It is assumed that.

[0007]

According to the present invention, there is provided a method for inspecting a lead, comprising: a plurality of leads extending from one side edge of an electronic component; An inspection method for a lead such as a gull-wing type, wherein a flat image obtained from above the electronic component and a perspective image obtained from obliquely above the extending direction of the lead correspond to leads in both images. Each lead is inspected based on the length relationship.

That is, if the lengths of the leads obtained in the plane image are the same and the lengths of the leads obtained in the perspective image are changed, the length change It is recognized that the lead for which is confirmed is shifted vertically from the arrangement position of the other leads. Further, in the lead in which the change in the length is confirmed, based on a comparison between the length of the lead and the length of another lead, it is determined whether the lead is shifted up or down, that is, whether the lead is floating or sinking. It is confirmed.

Specifically, when the perspective image is an image obtained from the other side edge opposite to the one side edge, a plurality of leads obtained in the planar image have the same length, and If the lead whose change in length has been confirmed in the perspective image is longer than the other leads, it is confirmed that this lead is floating above the other leads. If the lead whose length has been changed in the perspective image is shorter than the other leads, it is confirmed that this lead is sunk below the other leads.

[0010] The perspective image is an image obtained from the other side edge of the electronic component facing the one side edge.

That is, since the perspective image is obtained from the other side edge opposite to the one side edge, the electronic component is accommodated in the concave portion, and the upright wall rising on one side edge side of the electronic component is formed by the first wall. The perspective image can be obtained without being affected by the upright wall, even if it is present near the side edge.

According to the lead inspection apparatus of the present invention, in the lead inspection apparatus of the gull wing type, a plurality of leads extending from one side edge of the electronic component extend in an extending direction. Image capturing means for capturing a planar image of the electronic component from above the component, and projecting means for projecting the lead extending from the one side edge to the image capturing means as a perspective image obtained obliquely from above the extending direction of the lead. And an inspection means for inspecting each lead based on a relationship between the lengths of the leads corresponding to each other in the two-dimensional image and the perspective image taken by the imaging means.

That is, both a planar image obtained from above the electronic component and a perspective image of the lead obtained obliquely from above via the projection means are imaged by the imaging means. Then, the inspection of each of the flat image and the perspective image taken by the imaging means is performed by the inspection means based on the relationship between the lengths of the leads corresponding to each other in the two images. For this reason, when the length of the plurality of leads obtained in the planar image is the same, and there is a change in the length of each lead obtained in the oblique image, a change in the length was confirmed. It is recognized that the lead is vertically displaced from the arrangement position of the other leads. Further, in the lead in which the change in the length is confirmed, based on a comparison between the length of the lead and the length of another lead, it is determined whether the lead is shifted up or down, that is, whether the lead is floating or sinking. It is confirmed.

The perspective image is an image obtained from the other side edge of the electronic component facing the one side edge.

That is, since the perspective image is obtained from the other side edge opposite to the one side edge, the electronic component is accommodated in the concave portion, and the upright wall rising on one side edge side of the electronic component is formed by the upright wall. The perspective image can be obtained without being affected by the upright wall, even if it is present near the side edge.

[0016]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. FIG. 1 shows an IC according to the present embodiment.
FIG. 2 is a schematic diagram showing the lead inspection device 1, showing a state in which a lead of an IC 4 as an electronic component housed in a recess 3 of a pallet 2 is being inspected.

The IC lead inspection apparatus 1 includes a plurality of left and right gull-wing-type leads 13 extending from a left edge 11 of the IC 4 and a right edge 12 opposed to the left edge 11, and extending in the extending direction. 14, a pair of first and second cameras 15 and 16 serving as image pickup means provided above a conveyance path through which the pallet 2 is conveyed, and a projection means provided within an image pickup range of the camera 15. The first and second mirrors 16 and 17 are provided. The first mirror 16 is provided at an upper portion on the left edge side of the IC 4 and is inclined.
An image from the tip of the right lead 14 extending from 2 to the right edge of the IC 4 is obtained from obliquely above and to the left of the IC 4, and is arranged to be projected to the left of the camera 15 as a right perspective image 18. . Also, the second mirror 17
Is provided at an upper portion on the right side edge 12 of the IC 4 so as to be inclined. Obtained from above and left perspective image 19
And is arranged so as to project rightward of the camera 15.

As a result, as shown in FIG. 2, the camera 15 moves the plane image 21 obtained from directly above the IC 4 at the center of the image pickup screen 23 and the first mirror 16
The right perspective image 18 obtained through the second mirror 17 is projected to the right of the plane image 21, and the right perspective image 18 obtained through the second mirror 17 is projected to the right of the plane image 21. The flat image 21 is configured to display a printing portion 22 of characters and marks printed on the surface of the IC 14.

Further, an image processing device (not shown) as inspection means is connected to the camera 15 so that image data obtained by the camera 15 is sent to the image processing device. It is configured. Then, the image processing apparatus performs the processing for each of the images 1 included in the image data.
8, 19 and 21 and the corresponding leads 13a, 13b,..., 14a, 14b,.
... on the basis of the length relationship, each lead 13a, 13
, 14a, 14b,... are inspected.

The specific operation of the present embodiment according to the above configuration will be described in accordance with the processing procedure performed by the image processing apparatus.

That is, when image data is sent from the camera 15, the inspection processing shown in FIG. 3 is called from the main routine. Then, in step S1,
The plane image 21 and the left and right perspective images 18 and 1 shown in FIG.
9, each of the leads 13a, 13b,.
, 14a,..., 14a, 14b,..., 14a, 14b,.
Approximate straight lines 31 to 34 are assumed in the images 18, 19, and 21 while performing a straight line approximation connecting the tips of (S2).

Then, the approximate straight line 3 in the plane image 21
1, 32, the respective leads 13a, 13b,.
a, 14b,... and the approximate straight lines 33, 34 in the perspective images 18, 19, the respective leads 13a, 13b,.
, 14a, 14b,... Are compared with the corresponding leads. Specifically, the leads 13a of the planar image 21 and the leads 13a of the left perspective image 19, The lead 14a of the image 21 and the lead 14a of the right perspective image 18 are sequentially compared to determine whether the difference between the plane length and the left or right perspective length is outside the allowable error range (S3). At this time, if it is within the allowable error range, it is determined that there is no abnormality (S4), and the process returns to the main routine. If it is outside the allowable error range, the process proceeds to step S5. In step S5, it is determined whether the left or right perspective length is longer than the plane length. If the length is longer, for example, the right perspective length of the lead 14e of the right perspective image 18 is
e, the lead 14e
Is determined to be floating upward (S6), and the process returns to the main routine. When the left or right perspective length is shorter than the plane length, for example, the lead 1 of the left perspective image 18 may be used.
The left oblique length at 3 g is the lead 13 g of the flat image 21.
When the length is shorter than the plane length of
It is determined that it is sinking downward (S7), and the process returns to the main routine.

As described above, the planar image 2 is viewed from above the IC 4.
1 and the first and second mirrors 16 and 17 projecting left and right perspective images 18 and 19 obtained from obliquely above the IC 4 to the camera 15, the ups and downs (coplanarity) at the leads 13 and 14 of the IC 4. ), The IC must be placed on the stage and a mirror must be placed close to the side of the IC to obtain an image of the lead extending from the IC from the side of the IC. As in the case of the conventional device that could not be inspected, the IC is housed in the recess of the pallet, and no image can be obtained from the side of the IC even if a mirror is arranged on the side of the IC, or Can be inspected for leads 13 and 14 extending from IC 4 even in a state immediately before shipment, in which a mirror is placed close to the side of the IC and a mirror cannot be arranged. .

In order to obtain a planar image 21 from above the IC 4, the camera 15 simultaneously inspects the printed portion 22 composed of characters and marks printed on the upper surface of the IC 4 and inspects the package for scratches and cracks. be able to. further,
Since the plane image 21, the right perspective image 18 and the left perspective image 19 can be simultaneously obtained by one image pickup by the camera 15, the plane image 21 and the left and right perspective images 18 and 19 are Inspection can be speeded up as compared with the case where imaging is performed separately.

The left and right perspective images 18 and 19 are
As shown in FIG. 1, since the leads 13 and 14 are obtained from the opposite side edges of the extending IC 4, each side edge of the IC 4 is stored in the recess 3 of the pallet 2. Even when the upright walls 41 and 42 are close to the 11 and 12 sides, the two oblique images 18 and 19 can be reliably obtained without being affected by the upright walls 41 and 42. Therefore, the IC 4 is suitable for inspection in the state immediately before shipment accommodated in the concave portion 3 of the pallet 2, and also can inspect the bending of the leads 13 and 14 generated when the IC 4 is accommodated in the pallet 2.

In this embodiment, the inspection of the leads 13 and 14 of the IC 4 has been described as an example. However, the present invention may be used for the inspection of leads of other electronic components. Also,
In the present embodiment, the projection means for obtaining the left and right perspective images 18 and 19 is constituted by the first and second mirrors 16 and 17, but may be constituted by a prism, for example. .

Further, in the present embodiment, the first
The case where the inspection of the IC 4 in which the leads 13 and 14 extend from both side edges using the second mirrors 16 and 17 has been described, but the inspection is performed at right angles to the first and second mirrors 16 and 17. By further providing third and fourth mirrors, as shown in FIG.
, 51,..., 52,.

[0028]

As described above, according to the lead inspection method of the present invention, the length of a plurality of leads obtained in a planar image is the same and each lead obtained in a perspective image is obtained. When there is a change in the length, it can be recognized that the lead whose length has been changed is shifted vertically from the arrangement position of the other leads, and the change in length has been confirmed. Based on a comparison between the length of the lead and the length of another lead, it is possible to confirm whether the lead is shifted up or down, that is, whether it is floating or sinking. As described above, unlike the conventional method in which the inspection cannot be performed unless the image of the lead extending from the electronic component is obtained from the side of the electronic component, the image obtained from above and obliquely above the electronic component is different from the conventional method. Inspection can be performed, so even if an image from the side of the electronic component cannot be obtained in a state immediately before shipment where the electronic component is stored on a pallet or stored on tape, Inspection of the extended lead can be performed. In addition, at the time of inspection, since a planar image is obtained from above the electronic component, inspection of characters and marks printed on the upper surface of the electronic component, and inspection of the package for scratches and cracks can be performed at the same time.

Then, the oblique image is obtained from the other side of the electronic component facing the one side of the electronic component from which the lead extends, so that the electronic component is accommodated in the recessed portion. Even when there is an upright wall near the side edge, the above-described perspective image can be reliably obtained without being affected by the upright wall. Therefore, it can be a lead inspection method suitable for inspection at a stage immediately before shipment in which the electronic component is accommodated in the recess of the pallet.

Also, in the lead inspection apparatus of the present invention, both the two-dimensional image obtained from above the electronic component and the perspective image of the lead of the electronic component obtained from obliquely above via the projection means are combined with one another. Inspection of each lead based on the relationship between the lengths of the leads corresponding to each other in these two images, that is, the specific lead is vertically displaced from the arrangement position of the other leads. , And whether the lead is floating or sinking can be confirmed by the inspection means. Therefore, in order to mount the electronic component on the stage and obtain an image of the lead extending from the electronic component from the side of the electronic component, the inspection must be performed unless a mirror is arranged close to the side of the electronic component. Unlike the conventional device that could not be performed, the inspection can be performed by an imaging unit that captures a planar image from above the electronic component and a projection unit that projects a perspective image obtained from obliquely above to the imaging unit. When an electronic component is stored in a pallet and an image from the side of the electronic component cannot be obtained even if a mirror is arranged on the side of the electronic component, or the electronic component is stored in a tape and the side of the electronic component is Even in a state immediately before shipment where a mirror cannot be arranged close to the electronic component, it is possible to inspect the lead extended from the electronic component. Further, since the imaging means obtains a planar image from above the electronic component, it is possible to simultaneously inspect characters and marks printed on the upper surface of the electronic component and inspect the package for scratches and cracks. Furthermore, since the plane image and the perspective image can be obtained by a single imaging by the imaging means, compared to the case where the plane image and the perspective image are divided and captured twice, Inspection can be speeded up.

The oblique image is obtained from the other side edge of the electronic component facing the one side edge of the electronic component from which the lead extends, so that the electronic component is accommodated in the recessed portion. Even when the upright wall is present close to the side edge, the perspective image can be reliably obtained without being affected by the upright wall. Therefore, the electronic component can be a lead inspection device suitable for the inspection immediately before shipment, which is accommodated in the recess of the pallet.

[0032]

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an embodiment of the present invention.

FIG. 2 is a diagram showing an imaging screen obtained by a camera in the embodiment.

FIG. 3 is a flowchart showing an operation of the embodiment.

FIG. 4 is a diagram illustrating an imaging screen according to another embodiment.

FIG. 5 is a schematic view showing a conventional IC lead inspection apparatus.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 IC lead inspection device (lead inspection device) 2 pallet 3 concave portion 4 IC (electronic component) 11 left edge 12 right edge 13 left lead 14 right lead 15 camera (imaging means) 16 first mirror (projection means) 17 second Mirror (projection means) 18 Right perspective view 19 Left perspective view 21 Plane image 23 Imaging screen

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 23/50 G06F 15/62 405A

Claims (4)

[Claims] 1. A method of inspecting a lead in which a plurality of leads extending from one side edge of an electronic component extend in an extending direction, wherein: a planar image obtained from above the electronic component; A lead inspection method characterized by inspecting each lead in a perspective image obtained obliquely from above in the direction in which the lead extends, based on the relationship between the lengths of the corresponding leads in both images. 2. The lead inspection method according to claim 1, wherein the perspective image is an image obtained from the other side edge of the electronic component facing the one side edge. 3. A lead inspection apparatus in which a plurality of leads extending from one side edge of an electronic component extend in an extending direction, wherein a planar image of the electronic component is taken from above the electronic component. Imaging means, projection means for projecting the lead extending from the one side edge to the imaging means as a perspective image obtained from obliquely above the extending direction of the lead, and the planar image taken by the imaging means. A lead inspecting device for inspecting each lead based on a relationship between the lengths of the leads corresponding to each other in the perspective image. 4. The lead inspection apparatus according to claim 3, wherein the perspective image is an image obtained from the other side edge of the electronic component facing the one side edge.