TW202028448A - Detergent composition for removing flux residues - Google Patents

Abstract

One embodiment of the present disclosure provides a detergent composition for removing flux residues which ensures a stable liquid state and has excellent flux removal performance and tin removal performance. One embodiment of the present disclosure pertains to: a detergent composition for removing flux residues which contains a solvent (component A), an amine (component B) having a polarity term ([delta]p) of the Hansen solubility parameter of 7.8 or less, and a diphosphonic acid (component C) represented by formula (VI); or a detergent composition for removing flux residues which is obtained by mixing the component A, the component B, and the component C.

Description

Cleaner composition for removing flux residue

The present invention relates to a cleaning agent composition for removing flux residues, a cleaning method using the cleaning agent composition, and a manufacturing method of electronic parts.

In recent years, regarding the mounting of electronic components on printed wiring boards or ceramic substrates, from the viewpoints of low power consumption and high-speed processing, the miniaturization of components has narrowed the gap that should be cleaned when cleaning with solder flux. In terms of environmental safety, lead-free solders have been used, and rosin-based fluxes have been used along with this.

For example, International Publication No. 2011/027673 (Patent Document 1) discloses a cleaner for removing lead-free solder water-soluble flux containing 5 to 100 parts by weight of a glycol ether compound with respect to 100 parts by weight of water. International Publication No. 2005/021700 (Patent Document 2) discloses the following cleaning agent for removing solder flux, which is characterized in that when the content of the glycol compound is less than 1% by weight relative to the total amount, benzyl The content of the alcohol is set in the range of 70 to 99.9% by weight and the content of the amino alcohol is set in the range of 0.1 to 30% by weight. When the content of the diol compound is 1 to 40% by weight, the content of benzyl alcohol The range is 15 to 99% by weight, and the content of the amino alcohol is 0.1 to 30% by weight. Japanese Patent Laid-Open No. 2004-2688 (Patent Document 3) discloses an aqueous detergent composition containing an organic solvent, 5 to 30% by weight of glycerol ether having an alkyl or alkenyl group having 4 to 12 carbon atoms, It is made of more than 5% by weight of water and used for precision parts such as metal parts, electronic parts, semiconductor parts, and liquid crystal display panels. Japanese Patent Laid-Open No. 2018-21093 (Patent Document 4) discloses the following cleaning composition for a screen: it contains an amine or its salt with a solubility of less than 10 g for 100 g of water at 25°C, Solvents with a solubility of 0.02 g or more and less than 10 g in 100 g of water, and water, and the amine is at least one selected from the group consisting of primary amines, secondary amines, and tertiary amines with 6 to 26 carbon atoms.

上述式(VI)中，X為碳數1以上6以下之伸烷基或羥基伸烷基。In one aspect, the present invention relates to a cleaning composition for removing flux residues, which contains a solvent (component A), an amine (component B) whose polarity term (δp) of the Hansen solubility parameter is 7.8 or less, and The bisphosphonic acid (component C) represented by the following formula (VI) may be obtained by blending component A, component B, and component C. [化1]

In the above formula (VI), X is an alkylene group or hydroxyalkylene group having a carbon number of 1 or more and 6 or less.

In one aspect, the present invention relates to a cleaning method, which includes the step of using the cleaning agent composition of the present invention to clean an object to be cleaned with flux residue.

In one aspect, the present invention relates to a method of manufacturing an electronic component, which includes the steps of: mounting at least one component selected from the group consisting of semiconductor chips, chip-type capacitors, and circuit substrates by soldering using flux At least one of the steps on the circuit board and the step of forming solder bumps for connecting the above-mentioned components on the circuit board; and the cleaning method of the present invention is used to select from the circuit boards equipped with the above-mentioned components and those formed with The step of cleaning at least one of the circuit substrates of the solder bumps.

In recent years, due to the miniaturization of semiconductor package substrates, the solder bumps have been miniaturized or the gap between the solder bumps and the parts to be connected has narrowed. In addition, due to the miniaturization of solder bumps or the narrowing of the gap between the solder bumps and the parts to be connected, the cleaning agent composition disclosed in the above-mentioned patent documents has insufficient removability of flux residues (flux removal properties) and poor cleaning performance. It can be said to be sufficient. Furthermore, the cleaning agent composition is also required to improve the removability (tin removability) of tin oxide or tin salt generated during reflow. In addition, the detergent composition is required to ensure a stable liquid state without separation.

Therefore, the present invention provides a cleaning composition for removing flux residues that ensures a stable liquid state and is excellent in flux removability and tin removability, a cleaning method using the cleaning composition, and a manufacturing method of electronic parts.

According to the present invention, it is possible to provide a cleaning composition for removing flux residues that ensures a stable liquid state and is excellent in flux removability and tin removability.

The present invention is based on the following knowledge: by using a detergent composition containing a specific solvent (component A), a specific amine (component B), and a specific bisphosphonic acid (component C), or formulating component A, component B and The cleaning agent composition composed of component C ensures a stable liquid state, and the flux removability and tin removability are improved compared to the previous ones.

That is, the present invention in one or more embodiments relates to an amine containing a solvent (component A), the polarity term (δp) of the Hansen solubility parameter is 7.8 or less (component B) and the formula (VI) A cleaning composition for removing flux residues of bisphosphonic acid (component C), or a cleaning composition for removing flux residues obtained by blending component A, component B, and component C (hereinafter, these are also collectively referred to as It is the "cleansing composition of the present invention"). According to the present invention, in one or more embodiments, the flux residue can be efficiently removed. Furthermore, according to the present invention, in one or more embodiments, tin oxide or tin salt generated during reflow can be efficiently removed. Furthermore, according to the present invention, in one or more embodiments, a cleaner composition for removing flux residues with high stability and uniform transparency can be obtained.

Although the details of the mechanism of action of the effect of the detergent composition of the present invention are unclear, it is estimated as follows. That is, in the detergent composition of the present invention, the component A (solvent) penetrates into the flux and the flux residue that is degraded by reflow, etc., so that the viscosity decreases and becomes easy to flow, and the component B (amine) functions , And the flux and flux residues are decomposed or hydrophilized to make them easily soluble in the detergent composition. In addition, it is presumed that the flux and flux residues are more soluble in water in the flushing step after cleaning with component B (amine), which can improve the flux removal of flushing, thereby reducing cleaning and flushing. The residual flux residue afterwards. Furthermore, if component B and component C in the detergent composition of the present invention form a salt, the salt of component B (amine) and component C (diphosphonic acid), which has a higher affinity for tin, acts on the The tin oxide or tin salt generated and attached to the flux residue or the cleaned object makes it easy to dissolve in the cleaning agent composition. In addition, it is estimated that the salt of component B and component C increases the solubility of tin oxide or tin salt in water in the rinsing step after cleaning, thereby improving the removal of tin and reducing the tin oxide or tin oxide after cleaning and rinsing. The remnants of tin salt. Furthermore, regarding the salt of component B and component C, it is estimated that by making the polarity term (δp) of the Hansen solubility parameter of component B (amine) 7.8 or less, the salt of component C (bisphosphonic acid) can be dissolved in Component A (solvent) to obtain a uniform and stable detergent composition. However, the present invention may be interpreted without being limited to this mechanism.

The term "flux" in the present invention refers to a rosin-based flux containing rosin or rosin derivatives used for soldering or not containing oxides that interfere with the connection of metals such as electrodes or wiring and solder metals to promote the connection For the water-soluble flux of rosin, etc., the "welding" in the present invention includes reflow welding and flow welding. The "solder flux" in the present invention refers to a mixture of solder and flux. In the present invention, the "flux residue" refers to the residue of self-service flux remaining on the substrate after the solder bumps are formed with flux and/or the substrate after soldering with flux. For example, if other components (for example, semiconductor chips, chip capacitors, other circuit substrates, etc.) are stacked and mounted on a circuit board, a space (gap) is formed between the circuit board and the other components. The flux used for the above mounting will also remain in the gap in the form of flux residue after soldering by reflow or the like. In the present invention, the "cleaning agent composition for removing flux residues" refers to a cleaning agent composition used to remove solder bumps formed by using flux or solder flux and/or flux residues after soldering. In terms of the manifestation of the significant effect of the cleaning agent composition of the present invention, the solder is preferably a lead (Pb)-free solder containing tin.

In the present invention, the so-called Hansen solubility parameter (hereinafter also referred to as "HSP") is the value used to predict the solubility of substances published by Charles M. Hansen in 1967, and is based on the "intermolecular The parameter of the viewpoint that two substances with similar interaction are easy to dissolve each other. HSP includes the following 3 parameters (unit: MPa ^0.5 ). δd: Energy based on the dispersion force between molecules δp: Energy based on the dipole interaction between molecules δh: Energy based on the hydrogen bond between molecules The chemical industry March 2010 issue (Chemical Industry Corporation), etc. has a detailed description, By using the computer software "HSPiP: Hansen Solubility Parameters in Practice", etc., the Hansen solubility parameters of various substances can be obtained.

[Component A: Solvent] In one or more embodiments of the detergent composition of the present invention, component A is preferably selected from compounds represented by the following formula (I) and the following formulae from the viewpoint of improving flux removability At least one solvent of the compound represented by (II) and the compound represented by the following formula (III).

R ¹ -O-(AO) _n -R ² (I)

In the above formula (I), R ¹ is a phenyl group or an alkyl group having 1 to 8 carbon atoms, R ² is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and AO is an ethylene oxide group or propylene oxide. Base, n is the number of added moles of AO and is an integer from 1 to 3.

In the above formula (I), R ¹ is a phenyl group or an alkyl group having 1 or more and 8 carbon atoms. From the viewpoint of improving the flux removal property, it is preferably a phenyl group or an alkyl group having 4 or more and 6 carbon atoms. More preferably, it is an alkyl group having 4 to 6 carbon atoms. R ² is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms. From the same viewpoint, it is preferably a hydrogen atom or an alkyl group having 2 to 4 carbon atoms, and more preferably a hydrogen atom or n-butyl group. AO is an ethylene oxide group or a propylene oxide group, and from the same viewpoint, an ethylene oxide group is preferable. n is an integer of 1 or more and 3 or less, and from the same viewpoint, 1 or 2 is preferable, and 2 is more preferable.

The compound represented by the above formula (I) includes, for example, monophenyl ethers such as ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, and triethylene glycol monophenyl ether; those having a carbon number of 1 to 8 Alkyl glycol monoalkyl ethers, diethylene glycol monoalkyl ethers, triethylene glycol monoalkyl ethers and other monoalkyl ethers; alkyl groups with carbon numbers 1 to 8 and carbon numbers from 1 to 4 Dialkyl ethers such as ethylene glycol dialkyl ether, diethylene glycol dialkyl ether, and triethylene glycol dialkyl ether of the following alkyl groups; those with a phenyl group and an alkyl group with 1 to 4 carbon atoms Phenyl alkyl ethers such as ethylene glycol phenyl alkyl ether, diethylene glycol phenyl alkyl ether, and triethylene glycol phenyl alkyl ether. The compound represented by the above formula (I) is preferably selected from the group consisting of ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, from the viewpoint of improving flux removability. Ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, ethylene glycol At least one of dibutyl ether, diethylene glycol dibutyl ether and triethylene glycol dibutyl ether, more preferably selected from diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol mono At least one of phenyl ether, dipropylene glycol monobutyl ether and diethylene glycol dibutyl ether, and more preferably selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether and diethylene glycol dibutyl ether At least one.

R ³ -CH ₂ OH (II)

In the above formula (II), R ³ represents a phenyl group, a benzyl group, a cyclohexyl group, a furyl group, a tetrahydrofuryl group, a furyl methyl group, or a tetrahydrofuryl methyl group. From the viewpoint of improving the flux removability, a phenyl group, Cyclohexyl or tetrahydrofuranyl, more preferably phenyl or tetrahydrofuranyl.

Examples of the compound represented by the formula (II) include benzyl alcohol, phenethyl alcohol, cyclohexane methanol, furan methanol, and tetrahydrofuran methanol. The compound represented by the above formula (II) is preferably at least one selected from benzyl alcohol, furanmethanol, and tetrahydrofuranmethanol, and more preferably selected from benzyl alcohol and tetrahydrofuranmethanol, from the viewpoint of improving flux removability At least one of them.

[化2]

In the above formula (III), R ⁴ , R ⁵ , R ⁶ , and R ⁷ are each independently a hydrogen atom, a hydrocarbon group with a carbon number of 1 to 8 or a hydroxyalkyl group or a hydroxyl group with a carbon number of 1 to 3, which increases the flux From the viewpoint of removability, it is preferable that any one of R ⁴ , R ⁵ , R ⁶ , and R ⁷ is a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 1 to 6 carbon atoms, and still more preferable Any of methyl, ethyl, and vinyl.

As the compound represented by the above formula (III), for example, 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2- Pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone, 3-hydroxypropyl-2-pyrrolidone, 4 -Hydroxy-2-pyrrolidone, 4-phenyl-2-pyrrolidone and 5-methyl-2-pyrrolidone, etc. The compound represented by the above formula (III) is preferably selected from the group consisting of 2-pyrrolidone, 1-methyl-2-pyrrolidone, and 1-ethyl-2 from the viewpoint of improving flux removability. -Pyrrolidone, 1-vinyl-2-pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone and 5 -At least one of methyl-2-pyrrolidone, more preferably selected from 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone and 1-vinyl-2-pyrrolidine At least one of the ketones is more preferably 1-methyl-2-pyrrolidone.

Component A may also be a combination of one type, two types, or a combination of two or more types. When component A is a combination of two types, as component A, for example, a combination of a compound represented by formula (I) and a compound represented by formula (II) can be cited.

As component A, it is preferably selected from the group consisting of diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, benzyl alcohol, tetrahydrofuran methanol, and 1- At least one of methyl-2-pyrrolidone, more preferably at least one selected from the group consisting of diethylene glycol monobutyl ether, benzyl alcohol, tetrahydrofuran methanol, and 1-methyl-2-pyrrolidone.

The content of Component A in the detergent composition of the present invention is preferably 70% by mass or more, more preferably 75% by mass or more, and still more preferably 78% by mass or more, from the viewpoint of improving flux removability, and , Preferably 99.5% by mass or less, more preferably 95% by mass or less, and still more preferably 90% by mass or less. More specifically, the content of Component A in the detergent composition of the present invention is preferably 70% by mass or more and 99.5% by mass or less, more preferably 75% by mass or more and 95% by mass or less, and more preferably 78% by mass or more 90% by mass or less. When component A is a combination of two or more types, the content of component A refers to the total content of these.

[Component B: Amine] The component B in the detergent composition of the present invention is an amine whose polarity term (δp) of the Hansen solubility parameter is 7.8 or less. As the amine (component B) having a δp of 7.8 or less, one or a plurality of embodiments includes an amine represented by the following formula (IV) or (V). Component B may be one type, a combination of two types, or a combination of two or more types.

[化3]

In the above formula (IV), R ⁸ is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, phenyl, benzyl, hydroxyethyl or hydroxypropyl, and R ⁹ and R ¹⁰ are each independently a carbon number of 1 or more and 6 The following is alkyl, hydroxyethyl or hydroxypropyl. From the viewpoints of improving flux removability and improving tin removability, R ^{8 is} preferably a hydrogen atom, an alkyl group having 2 to 6 carbon atoms, a phenyl group or a benzyl group.

The polarity term (δp) as the Hansen solubility parameter is 7.8 or less and the amines represented by the above formula (IV) include alkanolamines such as dibutylmonoethanolamine, butyldiethanolamine, and diisopropanolamine; Aromatic amines such as methylbenzylamine. As a specific example of the amine represented by the above formula (IV), it is preferably selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine, and diisopropanol from the viewpoint of improving flux removability and improving tin removability At least one of amine and dimethylbenzylamine, more preferably at least one selected from dibutylmonoethanolamine, butyldiethanolamine and dimethylbenzylamine.

[化4]

In the above formula (V), R ¹¹ is an alkyl group having 1 to 4 carbon atoms, and R ¹² is a hydrogen atom or a methyl group. From the viewpoints of improving flux removability and improving tin removability, R ^{11 is} preferably methyl or isobutyl, and R ^{12 is} preferably methyl.

The polarity term (δp) as the Hansen solubility parameter is 7.8 or less and the amines represented by the above formula (V) include imidazoles such as 1,2-dimethylimidazole and 1-isobutyl-2-methylimidazole class. As a specific example of the amine represented by the above formula (V), it is preferably selected from the group consisting of 1,2-dimethylimidazole and 1-isobutyl from the viewpoint of improving flux removability and improving tin removability. At least one of 2-methylimidazole, more preferably 1,2-dimethylimidazole.

The polarity term (δp) of the Hansen solubility parameter of component B is 7.8 or less. From the viewpoints of improving flux removal and improving stability, it is preferably 7.7 or less, more preferably 6 or less, and still more preferably 5 or less And, from the viewpoint of improving flux removal properties, it is preferably 1 or more. More specifically, the polarity term (δp) of the Hansen solubility parameter of component B is preferably 1 or more and 7.7 or less, more preferably 1 or more and 6 or less, and still more preferably 1 or more and 5 or less.

As component B, from the viewpoint of improving stability, it is preferably selected from dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethylbenzylamine, 1,2-dimethylimidazole And at least one of 1-isobutyl-2-methylimidazole, more preferably at least one selected from dibutylmonoethanolamine, dimethylbenzylamine and 1-isobutyl-2-methylimidazole , More preferably at least one selected from dibutyl monoethanolamine and dimethylbenzylamine. As component B, it is preferably selected from the group consisting of dibutylmonoethanolamine, butyldiethanolamine, diisopropanolamine, dimethylbenzylamine, 1,2- At least one of dimethylimidazole and 1-isobutyl-2-methylimidazole, more preferably selected from dibutylmonoethanolamine, dimethylbenzylamine, 1,2-dimethylimidazole and 1- At least one of isobutyl-2-methylimidazole is more preferably 1,2-dimethylimidazole.

The content of component B in the detergent composition of the present invention is preferably 0.2% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.4, from the viewpoint of improving flux removability and improving tin removability % By mass or more, more preferably 0.5% by mass or more, and from the same point of view, it is preferably 15% by mass or less, more preferably 10% by mass or less, still more preferably 5 mass% or less, and still more preferably It is 3% by mass or less. More specifically, the content of component B in the detergent composition of the present invention is preferably 0.2% by mass or more and 15% by mass or less, more preferably 0.3% by mass or more and 10% by mass or less, and still more preferably 0.4% by mass or more 5 mass% or less, more preferably 0.5 mass% or more and 3 mass% or less. When component B is a combination of two or more types, the content of component B refers to the total content of these.

In the detergent composition of the present invention, the mass ratio (A/B) of component A to component B is preferably 5 or more, more preferably 8 or more, and still more preferably 10 or more from the viewpoint of improving tin removability And, from the same viewpoint, it is preferably 60 or less, more preferably 45 or less, and still more preferably 20 or less. More specifically, the mass ratio (A/B) is preferably 5 or more and 60 or less, more preferably 8 or more and 45 or less, and still more preferably 10 or more and 20 or less.

[Component C: Bisphosphonic acid (component C)] Component C in the detergent composition of the present invention is bisphosphonic acid represented by the following formula (VI). Component C may be one type, a combination of two types, or a combination of two or more types.

[化5]

In the above formula (VI), X is an alkylene group or hydroxyalkylene group having a carbon number of 1 or more and 6 or less. From the viewpoint of improving tin removability, X is preferably a hydroxyalkylene group. In addition, from the viewpoint of improving the flux removability, the carbon number of X is preferably 1 or more and 4 or less, and more preferably 1 or more and 2 or less.

As a specific example of component C, for example, from the viewpoint of improving flux removability, it is preferably selected from 1-hydroxyethylene-1,1-diphosphonic acid, methylene diphosphonic acid, 1,2- Among ethylene diphosphonic acid, 1,3-propylene diphosphonic acid, 1,4-butylene diphosphonic acid, 1,5-pentylene diphosphonic acid and 1,6-hexylene diphosphonic acid At least one diphosphonic acid, more preferably at least one diphosphonic acid selected from 1-hydroxyethylene-1,1-diphosphonic acid and methylene diphosphonic acid, and more preferably 1-hydroxyethylene Group-1,1-diphosphonic acid.

The content of Component C in the detergent composition of the present invention is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and even more preferably 0.5 from the viewpoints of improving flux removability and improving tin removability Mass% or more, and from the viewpoints of improving flux removability and improving stability, it is preferably 3% by mass or less, more preferably 2% by mass or less, still more preferably 1.5% by mass or less, and still more preferably 1% by mass or less. More specifically, the content of component C is preferably 0.1% by mass to 3% by mass, more preferably 0.3% by mass to 2% by mass, still more preferably 0.3% by mass to 1.5% by mass, and still more preferably 0.5% by mass to 1% by mass. When the component C is a combination of two or more kinds, the content of the component C refers to the total content of these.

In the detergent composition of the present invention, it is believed that the salt of component B and component C will participate in the removal of flux and tin, and it is speculated that the molar ratio B/C of component B and component C becomes a factor of the removability. The molar ratio B/C of Component B and Component C in the detergent composition of the present invention is preferably 4 or more, more preferably 4.5 or more from the viewpoint of improving flux removability and tin removability. It is preferably 4.8 or more, still more preferably 7 or more, still more preferably 10 or more, and more preferably 40 or less, more preferably 30 or less, still more preferably 25 or less, still more preferably 22 or less, still more preferably Below 18. More specifically, the molar ratio B/C is preferably 4 or more and 40 or less, more preferably 4.5 or more and 30 or less, still more preferably 4.8 or more and 25 or less, still more preferably 7 or more and 22 or less, and still more preferably 10 Above 18 and below.

In the cleaning composition of the present invention, from the viewpoints of improving flux removability and improving tin removability, it is preferable that at least a part of component B forms a salt with component C during cleaning, and at least a part of component B does not Forms salt with ingredient C. That is, in one or more embodiments, the cleansing composition of the present invention contains the salt of component B and component C during cleaning, and contains component B that does not form a salt with component C. The content of the salt of component B and component C in the detergent composition of the present invention is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, from the viewpoint of improving flux removability and improving tin removability. It is more preferably 0.7% by mass or more, more preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less. More specifically, the content of the salt of component B and component C is preferably 0.1% by mass to 10% by mass, more preferably 0.3% by mass to 5% by mass, and still more preferably 0.7% by mass to 3% by mass. .

[Ingredient D: Water] The cleanser composition of the present invention may further contain water (component D) in one or more embodiments. As the component D, ion exchange water, RO (reverse osmosis) water, distilled water, pure water, ultrapure water, etc. can be used. The content of component D in the detergent composition of the present invention is preferably 1% by mass or more, more preferably 5% by mass or more, and still more preferably 8% by mass or more from the viewpoint of reducing the ignition point. From the viewpoints of improving flux removability and improving stability, it is preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass or less. More specifically, the content of Component D in the detergent composition of the present invention is preferably 1% by mass or more and 20% by mass or less, more preferably 5% by mass or more and 15% by mass or less, and more preferably 8% by mass or more 10% by mass or less.

When the detergent composition of the present invention contains component D, from the viewpoint of improving stability, the component A contained in the detergent composition of the present invention is preferably a combination of diethylene glycol monobutyl ether and the Component A other than diethylene glycol monobutyl ether.

[Other ingredients] In addition to the above-mentioned components A to D, the detergent composition of the present invention may be further formulated or contain other components as needed. The content of other components in the detergent composition of the present invention is preferably 0 mass% or more and 10 mass% or less, more preferably 0 mass% or more and 8 mass% or less, and still more preferably 0 mass% or more and 5 mass% or less, Furthermore, it is more preferable that it is 0 mass% or more and 2 mass% or less.

As other components in the detergent composition of the present invention, from the viewpoint of improving stability, for example, a surfactant (component E) can be cited. As component E, from the same viewpoint, for example, polyoxyalkylene alkyl ether, polyoxyalkylene alkylamine, glycerin fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester, Nonionic surfactants such as alkyl glucoside and alkyl glycerol ether are more preferably polyoxyalkylene alkyl ether and alkyl glycerol ether. As a specific example of component E, polyoxyethylene decyl ether, 2-ethylhexyl glyceryl ether, etc. are mentioned. From the viewpoint of improving stability, the content of component E in the detergent composition of the present invention is preferably 0.5% by mass or more, more preferably 0.8% by mass or more, and preferably 5% by mass or less, more preferably It is 3% by mass or less, and more preferably 2% by mass or less. More specifically, the content of Component E in the detergent composition of the present invention is preferably 0.5% by mass or more and 5% by mass or less, more preferably 0.5% by mass or more and 3% by mass or less, and still more preferably 0.8% by mass or more 2% by mass or less.

As other ingredients, the detergent composition of the present invention can be appropriately formulated as needed or contain hydroxyethylaminoacetic acid and hydroxyethyliminodiacetic acid commonly used in detergents within a range that does not impair the effects of the present invention. , Ethylenediaminetetraacetic acid and other amino carboxylates with chelating power, benzotriazole and other rust inhibitors, thickeners, dispersants, basic substances other than component B, polymer compounds, cosolvents, Preservatives, bactericides, antibacterial agents, defoamers, antioxidants.

[Manufacturing method of detergent composition] The cleansing composition of the present invention can be produced by, for example, blending component A, component B, component C, and optionally the aforementioned component D and other components by a known method. In one or more embodiments, the cleansing composition of the present invention can be prepared by blending at least component A, component B, and component C. Therefore, in one aspect, the present invention relates to a method of manufacturing a detergent composition including at least the steps of blending component A, component B, and component C (hereinafter, also referred to as "the manufacturing method of the detergent composition of the present invention" "). In the manufacturing method of the detergent composition of the present invention, the component B and the component C may be separately formulated, or may be formulated as a salt of the component B and the component C. In the manufacturing method of the detergent composition of the present invention, in one or more embodiments, the component A, the above-mentioned component D and other components may be formulated after the component B and the component C are formulated. The "preparation" in the present invention includes mixing component A, component B, component C, and optionally component D and other components simultaneously or in any order. In the manufacturing method of the detergent composition of the present invention, the blending amount of each component can be the same as the content of each component of the detergent composition of the present invention.

In the present invention, the "content of each component in the detergent composition" refers to the content of the above-mentioned components at the time of cleaning, that is, at the point in time when the detergent composition is used for cleaning.

The detergent composition of the present invention can also be manufactured and stored in the form of a concentrate from the viewpoint of addition operation, storage and transportation. As the dilution ratio of the concentrate of the detergent composition of the present invention, for example, 3 times or more and 30 times or less can be cited. The concentrate of the detergent composition of the present invention can be used in such a way that component A, component B, component C, and optionally formulated component D and other components become the above content (that is, the content during cleaning). Component D) is diluted and used.

[PH value of detergent composition] The cleaning agent composition of the present invention is preferably alkaline in terms of improving the removability of flux residues, for example, a pH value of 8 or more and a pH value of 14 or less. The pH value can be adjusted by appropriately blending the following as needed, namely: inorganic acids such as nitric acid and sulfuric acid; organic acids such as hydroxycarboxylic acids, polycarboxylic acids, amino polycarboxylic acids, and amino acids; and These metal salts or ammonium salts, ammonia, sodium hydroxide, potassium hydroxide, amines and other alkaline substances other than component B.

[Object to be cleaned] The cleaning agent composition of the present invention is used for cleaning objects to be cleaned with flux residues. As an object to be cleaned with flux residue, for example, an object to be cleaned with reflowed solder can be cited. As a specific example of the object to be cleaned, for example, electronic parts and their manufacturing intermediates can be cited, specifically, soldered electronic parts and manufacturing intermediates thereof can be cited, and more specifically, include: electronic parts with parts soldered with solder And its manufacturing intermediates, electronic parts with parts connected via solder and their manufacturing intermediates, electronic parts containing flux residues in the gaps between soldered parts and their manufacturing intermediates, between parts connected via solder Electronic parts and manufacturing intermediates containing flux residue in the gap. The above-mentioned manufacturing intermediate is the intermediate manufacturing in the manufacturing steps of electronic parts including semiconductor packages or semiconductor devices. For example, it includes mounting at least selected from the group consisting of semiconductor chips, chip capacitors, and circuit substrates by soldering using flux A circuit substrate of a component, and/or a circuit substrate formed with solder bumps for soldering the above components. The so-called gap in the object to be cleaned refers to, for example, the space formed between the circuit board and the parts (semiconductor chip, chip capacitor, circuit board, etc.) soldered and mounted on the circuit board, and is the height (the distance between the parts) For example, it is a space of 5 to 500 μm, 10 to 250 μm, or 20 to 100 μm. The width and depth of the gap depend on the size or spacing of the mounted parts or electrodes (welding pads) on the circuit board.

[Cleaning method] In one aspect, the present invention relates to a cleaning method for removing flux residues (hereinafter, also referred to as "the present invention"), which includes contacting an object to be cleaned with flux residues with the cleaning agent composition of the present invention. The cleaning method"). In one or more embodiments, the cleaning method of the present invention includes the step of using the cleaning agent composition of the present invention to clean the object to be cleaned with flux residue. As a method of contacting the cleaning agent composition of the present invention with the object to be cleaned, or a method of cleaning the object to be cleaned using the cleaning agent composition of the present invention, for example, a method of contacting in the bath of an ultrasonic cleaning device can be cited , The method of spraying the detergent composition into a spray and contacting it (spraying method), etc. The detergent composition of the present invention can be directly used for cleaning without dilution. The cleaning method of the present invention preferably includes a step of rinsing with water and drying after contacting the object to be cleaned with the detergent composition. According to the cleaning method of the present invention, the flux residue remaining in the gap of the welded parts can be cleaned efficiently. The solder is preferably lead-free (Pb) solder in terms of the obvious effect of the cleaning performance and the permeability into the narrow gap of the cleaning method of the present invention. Furthermore, from the same point of view, the cleaning method of the present invention is preferably used for the use of International Publication No. 2006/025224, Japanese Patent Publication No. 6-75796, Japanese Patent Application Publication No. 2014-144473, and Japanese Patent Electronic components connected with flux described in JP 2004-230426, JP 2013-188761, JP 2013-173184, etc. In the cleaning method of the present invention, in terms of easily exerting the cleaning power of the detergent composition of the present invention, it is preferable to irradiate ultrasonic waves when the detergent composition of the present invention is in contact with the object to be cleaned, more preferably the super The sound wave is relatively strong. From the same viewpoint, the frequency of the ultrasonic wave is preferably 26 to 72 Hz, 80 to 1500 W, and more preferably 36 to 72 Hz, and 80 to 1500 W.

[Method of manufacturing electronic parts] In one aspect, the present invention relates to a method of manufacturing electronic components (hereinafter, also referred to as "the manufacturing method of electronic components of the present invention"), which includes the following steps: selected from semiconductor chips, chip capacitors and At least one of the steps of mounting at least one component in the circuit board on the circuit board by soldering using flux and the step of forming solder bumps for connecting the above-mentioned components on the circuit board; and by this The cleaning method of the invention is a step of cleaning at least one selected from a circuit board on which the above-mentioned components are mounted and a circuit board on which the solder bumps are formed. The soldering using flux is, for example, a lead-free solder, which may be a reflow method or a flow soldering method. Electronic parts include semiconductor packages without semiconductor chips, semiconductor packages with semiconductor chips, and semiconductor devices. The manufacturing method of the electronic component of the present invention reduces the flux residue remaining in the gap of the soldered component or the periphery of the solder bump by performing the cleaning method of the present invention, thereby suppressing the residue caused by the flux residue There is a short circuit between the electrodes or poor connection, so it is possible to manufacture electronic parts with higher reliability. Furthermore, by performing the cleaning method of the present invention, the cleaning of the flux residue remaining in the gap of the soldered parts, etc. becomes easy, so the cleaning time can be shortened, and the manufacturing efficiency of electronic parts can be improved.

[Set] In one aspect, the present invention relates to a kit used in the cleaning method of the present invention and/or the manufacturing method of the electronic component of the present invention (hereinafter, also referred to as "the kit of the present invention"). The kit of the present invention is used in one or more embodiments to manufacture the kit of the detergent composition of the present invention.

As an embodiment of the kit of the present invention, a solution containing the above-mentioned component A (first solution), and a solution containing component B and component C (second solution) in an immiscible state can be mentioned, and used When mixing the first liquid and the second liquid set (two-component detergent composition). The said 1st liquid and the said 2nd liquid may contain the said component D and other components as needed, respectively. At least one of the above-mentioned first liquid and second liquid may contain part or all of component D (water) in one or more embodiments. In one or more embodiments, after mixing the above-mentioned first liquid and second liquid, it may be diluted with component D (water) as necessary.

上述式(VI)中，X為碳數1以上6以下之伸烷基或羥基伸烷基。The present invention further relates to one or more of the following embodiments. <1> A cleaning composition for removing flux residues, which contains a solvent (component A), an amine (component B) whose polarity term (δp) of the Hansen solubility parameter is 7.8 or less, and the following formula (VI The bisphosphonic acid (component C) represented by ), or component A, component B, and component C. [化6]

In the above formula (VI), X is an alkylene group or hydroxyalkylene group having a carbon number of 1 or more and 6 or less.

上述式(III)中，R⁴ 、R⁵ 、R⁶ 、R⁷ 分別獨立為氫原子、碳數1以上8以下之烴基、碳數1以上3以下之羥烷基或羥基。 ＜3＞如＜2＞之清潔劑組合物，其中上述式(I)中，R¹ 為苯基或碳數1以上8以下之烷基，較佳為苯基或碳數4以上6以下之烷基，更佳為碳數4以上6以下之烷基。 ＜4＞如＜2＞或＜3＞之清潔劑組合物，其中上述式(I)中，R² 為氫原子或碳數1以上4以下之烷基，較佳為氫原子或碳數2以上4以下之烷基，更佳為氫原子或正丁基。 ＜5＞如＜2＞至＜4＞中任一項之清潔劑組合物，其中上述式(I)中，AO為環氧乙烷基或環氧丙烷基，較佳為環氧乙烷基。 ＜6＞如＜2＞至＜5＞中任一項之清潔劑組合物，其中上述式(I)中，n為1以上3以下之整數，較佳為1或2，更佳為2。 ＜7＞如＜2＞至＜6＞中任一項之清潔劑組合物，其中上述式(II)中，R³ 為苯基、苄基、環己基、呋喃基、四氫呋喃基、呋喃甲基或四氫呋喃甲基，較佳為苯基、環己基或四氫呋喃基，更佳為苯基或四氫呋喃基。 ＜8＞如＜2＞至＜7＞中任一項之清潔劑組合物，其中上述式(III)中，R⁴ 、R⁵ 、R⁶ 、R⁷ 分別獨立為氫原子、碳數1以上8以下之烴基、碳數1以上3以下之羥烷基或羥基，較佳為R⁴ 、R⁵ 、R⁶ 、R⁷ 之任一者為碳數1以上8以下之烴基，更佳為碳數1以上6以下之烴基，進而較佳為甲基、乙基、乙烯基之任一者。 ＜9＞如＜2＞至＜8＞中任一項之清潔劑組合物，其中成分A為式(I)所表示之化合物與式(II)所表示之化合物之組合。 ＜10＞如＜1＞至＜8＞中任一項之清潔劑組合物，其中成分A較佳為選自二乙二醇單丁醚、二丙二醇單丁醚、二乙二醇二丁醚、苄醇、四氫呋喃甲醇及1-甲基-2-吡咯啶酮中之至少一種，更佳為選自二乙二醇單丁醚、苄醇、四氫呋喃甲醇及1-甲基-2-吡咯啶酮中之至少一種。 ＜11＞如＜1＞至＜10＞中任一項之清潔劑組合物，其中成分A之含量較佳為70質量%以上，更佳為75質量%以上，進而較佳為78質量%以上。 ＜12＞如＜1＞至＜11＞中任一項之清潔劑組合物，其中成分A之含量較佳為99.5質量%以下，更佳為95質量%以下，進而較佳為90質量%以下。 ＜13＞如＜1＞至＜12＞中任一項之清潔劑組合物，其中成分A之含量較佳為70質量%以上99.5質量%以下，更佳為75質量%以上95質量%以下，進而較佳為78質量%以上90質量%以下。 ＜14＞如＜1＞至＜13＞中任一項之清潔劑組合物，其中胺(成分B)為下述式(IV)或(V)所表示之胺。 [化8]

上述式(IV)中，R⁸ 為氫原子、碳數1以上6以下之烷基、苯基、苄基、羥乙基或羥丙基，R⁹ 及R¹⁰ 分別獨立為碳數1以上6以下之烷基、羥乙基或羥丙基。 [化9]

上述式(V)中，R¹¹ 為碳數1以上4以下之烷基，R¹² 為氫原子或甲基。 ＜15＞如＜1＞至＜14＞中任一項之清潔劑組合物，其中成分B較佳為選自二丁基單乙醇胺、丁基二乙醇胺、二異丙醇胺、二甲基苄基胺、1,2-二甲基咪唑及1-異丁基-2-甲基咪唑中之至少一種，更佳為選自二丁基單乙醇胺、二甲基苄基胺及1-異丁基-2-甲基咪唑中之至少一種，進而較佳為選自二丁基單乙醇胺及二甲基苄基胺中之至少一種。 ＜16＞如＜1＞至＜15＞中任一項之清潔劑組合物，其中成分B之含量較佳為0.2質量%以上，更佳為0.3質量%以上，進而較佳為0.4質量%以上，進而更佳為0.5質量%以上。 ＜17＞如＜1＞至＜16＞中任一項之清潔劑組合物，其中成分B之含量較佳為15質量%以下，更佳為10質量%以下，進而較佳為5質量%以下，進而更佳為3質量%以下。 ＜18＞如＜1＞至＜17＞中任一項之清潔劑組合物，其中成分B之含量較佳為0.2質量%以上15質量%以下，更佳為0.3質量%以上10質量%以下，進而較佳為0.4質量%以上5質量%以下，進而更佳為0.5質量%以上3質量%以下。 ＜19＞如＜1＞至＜18＞中任一項之清潔劑組合物，其中成分A與成分B之質量比(A/B)較佳為5以上，更佳為8以上，進而較佳為10以上。 ＜20＞如＜1＞至＜19＞中任一項之清潔劑組合物，其中成分A與成分B之質量比(A/B)較佳為60以下，更佳為45以下，進而較佳為20以下。 ＜21＞如＜1＞至＜20＞中任一項之清潔劑組合物，其中成分A與成分B之質量比(A/B)較佳為5以上60以下，更佳為8以上45以下，進而較佳為10以上20以下。 ＜22＞如＜1＞至＜21＞中任一項之清潔劑組合物，其中上述式(VI)中，X為碳數1以上6以下之伸烷基或羥基伸烷基，較佳為羥基伸烷基。 ＜23＞如＜1＞至＜22＞中任一項之清潔劑組合物，其中上述式(VI)中，X之碳數較佳為1以上4以下，更佳為1以上2以下。 ＜24＞如＜1＞至＜23＞中任一項之清潔劑組合物，其中成分C較佳為選自1-羥基亞乙基-1,1-二膦酸、亞甲基二膦酸、1,2-伸乙基二膦酸、1,3-伸丙基二膦酸、1,4-伸丁基二膦酸、1,5-伸戊基二膦酸及1,6-伸己基二膦酸中之至少一種二膦酸，更佳為選自1-羥基亞乙基-1,1-二膦酸及亞甲基二膦酸中之至少一種二膦酸，進而較佳為1-羥基亞乙基-1,1-二膦酸。 ＜25＞如＜1＞至＜24＞中任一項之清潔劑組合物，成分C之含量較佳為0.1質量%以上，更佳為0.3質量%以上，進而較佳為0.5質量%以上。 ＜26＞如＜1＞至＜25＞中任一項之清潔劑組合物，其中成分C之含量較佳為3質量%以下，更佳為2質量%以下，進而較佳為1.5質量%以下，進而更佳為1質量%以下。 ＜27＞如＜1＞至＜26＞中任一項之清潔劑組合物，其中成分C之含量較佳為0.1質量%以上3質量%以下，更佳為0.3質量%以上2質量%以下，進而較佳為0.3質量%以上1.5質量%以下，進而更佳為0.5質量%以上1質量%以下。 ＜28＞如＜1＞至＜27＞中任一項之清潔劑組合物，其中成分A之含量為70質量%以上99.5質量%以下，成分B之含量為0.2質量%以上15質量%以下，成分C之含量為0.1質量%以上3質量%以下。 ＜29＞如＜1＞至＜28＞中任一項之清潔劑組合物，其中成分B與成分C之莫耳比B/C較佳為4以上，更佳為4.5以上，進而較佳為4.8以上，進而更佳為7以上，進一步更佳為10以上。 ＜30＞如＜1＞至＜29＞中任一項之清潔劑組合物，其中成分B與成分C之莫耳比B/C較佳為40以下，更佳為30以下，進而較佳為25以下，進而更佳為22以下，進一步更佳為18以下。 ＜31＞如＜1＞至＜30＞中任一項之清潔劑組合物，其中成分B與成分C之莫耳比B/C較佳為4以上40以下，更佳為4.5以上30以下，進而較佳為4.8以上25以下，進而更佳為7以上22以下，進一步更佳為10以上18以下。 ＜32＞如＜1＞至＜31＞中任一項之清潔劑組合物，其中成分B之至少一部分與成分C形成鹽，且成分B之至少一部分未與成分C形成鹽。 ＜33＞如＜32＞之清潔劑組合物，其中成分B與成分C之鹽之含量較佳為0.1質量%以上，更佳為0.3質量%以上，進而較佳為0.7質量%以上。 ＜34＞如＜32＞或＜33＞之清潔劑組合物，其中成分B與成分C之鹽之含量較佳為10質量%以下，更佳為5質量%以下，進而較佳為3質量%以下。 ＜35＞如＜32＞至＜34＞中任一項之清潔劑組合物，其中成分B與成分C之鹽之含量較佳為0.1質量%以上10量%以下，更佳為0.3質量%以上5質量%以下，進而較佳為0.7質量%以上3質量%以下。 ＜36＞如＜1＞至＜35＞中任一項之清潔劑組合物，其進而含有水(成分D)。 ＜37＞如＜36＞之清潔劑組合物，其中成分D之含量較佳為1質量%以上，更佳為5質量%以上，進而較佳為8質量%以上。 ＜38＞如＜36＞或＜37＞之清潔劑組合物，其中成分D之含量較佳為20質量%以下，更佳為15質量%以下，進而較佳為10質量%以下。 ＜39＞如＜36＞至＜38＞中任一項之清潔劑組合物，其中成分D之含量較佳為1質量%以上20質量%以下，更佳為5質量%以上15質量%以下，進而較佳為8質量%以上10質量%以下。 ＜40＞如＜1＞至＜39＞中任一項之清潔劑組合物，其進而含有界面活性劑(成分E)。 ＜41＞如＜1＞至＜40＞中任一項之清潔劑組合物，其進而含有選自具有螯合力之化合物、苯并三唑等防銹劑、增黏劑、分散劑、成分B以外之鹼性物質、高分子化合物、助溶劑、防腐劑、殺菌劑、抗菌劑、消泡劑、及抗氧化劑中之至少一種。 ＜42＞一種清潔方法，其包括利用如＜1＞至＜41＞中任一項之清潔劑組合物對具有助焊劑殘餘物之被清潔物進行清潔之步驟。 ＜43＞如＜42＞之清潔方法，其中被清潔物為焊接電子零件之製造中間物。 ＜44＞一種電子零件之製造方法，其包括如下步驟：選自將選自半導體晶片、晶片型電容器及電路基板中之至少一種零件藉由使用助焊劑之焊接而搭載於電路基板上之步驟以及將用於連接上述零件等之焊料凸塊形成於電路基板上之步驟中的至少一個步驟；及藉由如＜42＞或＜43＞之清潔方法對選自搭載有上述零件之電路基板及形成有上述焊料凸塊之電路基板中之至少一種進行清潔之步驟。 [實施例]<2> The detergent composition as in <1>, wherein the solvent (component A) is selected from the compound represented by the following formula (I), the compound represented by the following formula (II) and the following formula (III) At least one solvent in the represented compound. R ¹ -O-(AO) _n -R ² (I) In the above formula (I), R ¹ is a phenyl group or an alkyl group with a carbon number of 1 to 8 and R ² is a hydrogen atom or a carbon number of 1 to 4 The alkyl group, AO is an ethylene oxide group or a propylene oxide group, n is the number of AO added moles and is an integer of 1 to 3. R ³ -CH ₂ OH (II) In the above formula (II), R ³ is phenyl, benzyl, cyclohexyl, furanyl, tetrahydrofuranyl, furyl methyl or tetrahydrofuryl methyl. [化7]

In the above formula (III), R ⁴ , R ⁵ , R ⁶ , and R ⁷ are each independently a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group. <3> The detergent composition as in <2>, wherein in the above formula (I), R ¹ is a phenyl group or an alkyl group having 1 to 8 carbon atoms, preferably a phenyl group or a carbon number of 4 to 6 The alkyl group is more preferably an alkyl group having 4 to 6 carbon atoms. <4> A detergent composition such as <2> or <3>, wherein in the above formula (I), R ² is a hydrogen atom or an alkyl group with 1 to 4 carbon atoms, preferably a hydrogen atom or 2 carbon atoms The alkyl group of 4 or less is more preferably a hydrogen atom or an n-butyl group. <5> The detergent composition according to any one of <2> to <4>, wherein in the above formula (I), AO is an ethylene oxide group or a propylene oxide group, preferably an ethylene oxide group . <6> The detergent composition of any one of <2> to <5>, wherein in the above formula (I), n is an integer of 1 or more and 3 or less, preferably 1 or 2, and more preferably 2. <7> The detergent composition according to any one of <2> to <6>, wherein in the above formula (II), R ³ is phenyl, benzyl, cyclohexyl, furanyl, tetrahydrofuranyl, furanmethyl Or tetrahydrofuryl methyl, preferably phenyl, cyclohexyl or tetrahydrofuryl, more preferably phenyl or tetrahydrofuryl. <8> The detergent composition according to any one of <2> to <7>, wherein in the above formula (III), R ⁴ , R ⁵ , R ⁶ , and R ⁷ are each independently a hydrogen atom with a carbon number of 1 or more A hydrocarbon group of 8 or less, a hydroxyalkyl group or a hydroxy group having a carbon number of 1 to 3, preferably any of R ⁴ , R ⁵ , R ⁶ , and R ⁷ is a hydrocarbon group of 1 to 8 carbons, more preferably carbon The hydrocarbon group having a number of 1 to 6 is more preferably any of a methyl group, an ethyl group, and a vinyl group. <9> The detergent composition according to any one of <2> to <8>, wherein component A is a combination of a compound represented by formula (I) and a compound represented by formula (II). <10> The detergent composition of any one of <1> to <8>, wherein component A is preferably selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, and diethylene glycol dibutyl ether At least one of, benzyl alcohol, tetrahydrofuran methanol and 1-methyl-2-pyrrolidone, more preferably selected from diethylene glycol monobutyl ether, benzyl alcohol, tetrahydrofuran methanol and 1-methyl-2-pyrrolidine At least one of ketones. <11> The detergent composition of any one of <1> to <10>, wherein the content of component A is preferably 70% by mass or more, more preferably 75% by mass or more, and still more preferably 78% by mass or more . <12> The detergent composition of any one of <1> to <11>, wherein the content of component A is preferably 99.5% by mass or less, more preferably 95% by mass or less, and even more preferably 90% by mass or less . <13> The detergent composition of any one of <1> to <12>, wherein the content of Component A is preferably 70% by mass to 99.5% by mass, more preferably 75% by mass to 95% by mass, More preferably, it is 78% by mass or more and 90% by mass or less. <14> The detergent composition according to any one of <1> to <13>, wherein the amine (component B) is an amine represented by the following formula (IV) or (V). [化8]

In the above formula (IV), R ⁸ is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, phenyl, benzyl, hydroxyethyl or hydroxypropyl, and R ⁹ and R ¹⁰ are each independently a carbon number of 1 or more and 6 The following is alkyl, hydroxyethyl or hydroxypropyl. [化9]

In the above formula (V), R ¹¹ is an alkyl group having 1 to 4 carbon atoms, and R ¹² is a hydrogen atom or a methyl group. <15> The detergent composition according to any one of <1> to <14>, wherein component B is preferably selected from dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethyl benzyl At least one of amine, 1,2-dimethylimidazole and 1-isobutyl-2-methylimidazole, more preferably selected from dibutylmonoethanolamine, dimethylbenzylamine and 1-isobutyl At least one selected from the group consisting of 2-methylimidazole, and more preferably at least one selected from dibutylmonoethanolamine and dimethylbenzylamine. <16> The detergent composition of any one of <1> to <15>, wherein the content of component B is preferably 0.2% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.4% by mass or more , And more preferably 0.5% by mass or more. <17> The detergent composition according to any one of <1> to <16>, wherein the content of component B is preferably 15% by mass or less, more preferably 10% by mass or less, and still more preferably 5% by mass or less , And more preferably 3% by mass or less. <18> The detergent composition of any one of <1> to <17>, wherein the content of component B is preferably 0.2% by mass to 15% by mass, more preferably 0.3% by mass to 10% by mass, It is more preferably 0.4% by mass or more and 5% by mass or less, and still more preferably 0.5% by mass or more and 3% by mass or less. <19> The detergent composition of any one of <1> to <18>, wherein the mass ratio (A/B) of component A to component B is preferably 5 or more, more preferably 8 or more, and more preferably Is 10 or more. <20> The detergent composition of any one of <1> to <19>, wherein the mass ratio (A/B) of component A to component B is preferably 60 or less, more preferably 45 or less, and more preferably Below 20. <21> The detergent composition of any one of <1> to <20>, wherein the mass ratio (A/B) of component A to component B is preferably 5 or more and 60 or less, more preferably 8 or more and 45 or less , More preferably 10 or more and 20 or less. <22> The detergent composition according to any one of <1> to <21>, wherein in the above formula (VI), X is an alkylene or hydroxyalkylene having 1 to 6 carbon atoms, preferably Hydroxy alkylene. <23> The detergent composition of any one of <1> to <22>, wherein in the above formula (VI), the carbon number of X is preferably 1 or more and 4 or less, more preferably 1 or more and 2 or less. <24> The detergent composition of any one of <1> to <23>, wherein component C is preferably selected from 1-hydroxyethylene-1,1-diphosphonic acid, methylene diphosphonic acid , 1,2-Ethylene diphosphonic acid, 1,3-Ethylene diphosphonic acid, 1,4-Ethylene diphosphonic acid, 1,5-Ethylene diphosphonic acid and 1,6-Ethylene diphosphonic acid At least one diphosphonic acid among hexyl diphosphonic acids, more preferably at least one diphosphonic acid selected from 1-hydroxyethylene-1,1-diphosphonic acid and methylene diphosphonic acid, and more preferably 1-Hydroxyethylene-1,1-diphosphonic acid. <25> In the detergent composition of any one of <1> to <24>, the content of Component C is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more. <26> The detergent composition of any one of <1> to <25>, wherein the content of component C is preferably 3% by mass or less, more preferably 2% by mass or less, and even more preferably 1.5% by mass or less , And more preferably 1% by mass or less. <27> The detergent composition of any one of <1> to <26>, wherein the content of component C is preferably 0.1% by mass to 3% by mass, more preferably 0.3% by mass to 2% by mass, It is more preferably 0.3% by mass or more and 1.5% by mass or less, and still more preferably 0.5% by mass or more and 1% by mass or less. <28> The detergent composition according to any one of <1> to <27>, wherein the content of component A is 70% by mass to 99.5% by mass, and the content of component B is 0.2% by mass to 15% by mass, The content of component C is 0.1% by mass to 3% by mass. <29> The detergent composition of any one of <1> to <28>, wherein the molar ratio B/C of component B and component C is preferably 4 or more, more preferably 4.5 or more, and more preferably It is 4.8 or more, more preferably 7 or more, and still more preferably 10 or more. <30> The detergent composition of any one of <1> to <29>, wherein the molar ratio B/C of component B and component C is preferably 40 or less, more preferably 30 or less, and more preferably It is 25 or less, more preferably 22 or less, and still more preferably 18 or less. <31> The detergent composition of any one of <1> to <30>, wherein the molar ratio B/C of component B and component C is preferably 4 or more and 40 or less, more preferably 4.5 or more and 30 or less, It is more preferably 4.8 or more and 25 or less, still more preferably 7 or more and 22 or less, and still more preferably 10 or more and 18 or less. <32> The detergent composition according to any one of <1> to <31>, wherein at least a part of component B and component C form a salt, and at least a part of component B does not form a salt with component C. <33> The detergent composition as in <32>, wherein the content of the salt of component B and component C is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and even more preferably 0.7% by mass or more. <34> The detergent composition of <32> or <33>, wherein the content of the salt of component B and component C is preferably 10% by mass or less, more preferably 5% by mass or less, and more preferably 3% by mass the following. <35> The detergent composition of any one of <32> to <34>, wherein the content of the salt of component B and component C is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.3% by mass or more 5 mass% or less, more preferably 0.7 mass% or more and 3 mass% or less. <36> The detergent composition of any one of <1> to <35>, which further contains water (component D). <37> The detergent composition as in <36>, wherein the content of component D is preferably 1% by mass or more, more preferably 5% by mass or more, and still more preferably 8% by mass or more. <38> The detergent composition as in <36> or <37>, wherein the content of component D is preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass or less. <39> The detergent composition of any one of <36> to <38>, wherein the content of component D is preferably 1% by mass to 20% by mass, more preferably 5% by mass to 15% by mass, More preferably, it is 8 mass% or more and 10 mass% or less. <40> The detergent composition of any one of <1> to <39>, which further contains a surfactant (component E). <41> The detergent composition of any one of <1> to <40>, which further contains a compound selected from chelating power, rust inhibitors such as benzotriazole, thickener, dispersant, and component B At least one of other alkaline substances, polymer compounds, cosolvents, preservatives, bactericides, antibacterial agents, defoamers, and antioxidants. <42> A cleaning method, which includes the step of using the cleaning agent composition of any one of <1> to <41> to clean the object to be cleaned with flux residue. <43> The cleaning method as in <42>, wherein the object to be cleaned is a manufacturing intermediate for welding electronic parts. <44> A method of manufacturing electronic components, comprising the steps of: mounting at least one component selected from the group consisting of semiconductor chips, chip capacitors, and circuit substrates on the circuit substrate by soldering using flux; and At least one of the steps of forming solder bumps for connecting the above-mentioned parts on a circuit board; and forming a circuit board selected from the above-mentioned parts by a cleaning method such as <42> or <43> The step of cleaning at least one of the circuit substrates with the above-mentioned solder bumps. [Example]

Hereinafter, the present invention will be described in detail with examples, but the present invention is not limited by these examples.

1. Preparation of detergent composition (Examples 1-18, Comparative Examples 1-10) In a 100 mL glass beaker, the ingredients were blended so as to be the composition described in Table 2 below, and mixed under the following conditions to prepare the detergent combinations of Examples 1-18 and Comparative Examples 1-10 Things. Unless otherwise specified, the numerical value of each component in Table 2 means the content (mass %) in the prepared detergent composition. ＜Mixed conditions＞ Liquid temperature: 25℃ Stirrer: Magnetic stirrer (50 mm rotor) Speed: 300 rpm Stirring time: 10 minutes

The following are used as components of the detergent composition. (Ingredient A) A1: Tetrahydrofuran methanol [manufactured by Fujifilm Wako Pure Chemical Co., Ltd.] A2: Diethylene glycol monobutyl ether [manufactured by Japan Emulsifier Co., Ltd., diethylene glycol butyl ether (BDG)] A3: Dipropylene glycol monobutyl ether [manufactured by Japan Emulsifier Co., Ltd., dipropylene glycol butyl ether (BFDG)] A4: Diethylene glycol dibutyl ether [manufactured by Japan Emulsifier Co., Ltd., diethylene glycol dibutyl ether (DBDG)] A5: 1-Methyl-2-pyrrolidone [manufactured by Fujifilm Wako Pure Chemical Co., Ltd.] A6: Benzyl alcohol [manufactured by Lanxess Co., Ltd.] (Ingredient B) B1: N,N-Dibutylmonoethanolamine [manufactured by Japan Emulsifier Co., Ltd., amino alcohol 2B] B2: N,N-dimethylbenzylamine [manufactured by Kao Co., Ltd., Kaolizer No.20] B3: 1,2-Dimethylimidazole [manufactured by Tokyo Chemical Industry Co., Ltd.] B4: 1-isobutyl-2-methylimidazole [manufactured by Kao Co., Ltd., Kaolizer No.120] B5: Diisopropanolamine [manufactured by Mitsui Fine Chemicals Co., Ltd., diisopropanolamine (DIPA)] B6: N-n-butyldiethanolamine [manufactured by Japan Emulsifier Co., Ltd., amino alcohol MBD] (Non-component B) B7: Triethanolamine [manufactured by Nippon Shokubai Co., Ltd.] B8: Methyldiethanolamine [manufactured by Japan Emulsifier Co., Ltd., amino alcohol MDA] B9: 2-Ethyl-4-methylimidazole [manufactured by Fuji Photo Film Wako Pure Chemical Co., Ltd.] B10: 2-Methylimidazole [manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.] B11: Monoethanolamine [manufactured by Nippon Shokubai Co., Ltd.] (Ingredient C) C1: 1-hydroxyethylene-1,1-diphosphonic acid [manufactured by Italmatch Japan Co., Ltd., Dequest 2010, solid content 60% by mass] C2: Methylene bisphosphonic acid [manufactured by Fujifilm Wako Pure Chemical Industries, Ltd.] (Ingredient D) Water [Pure water less than 1 μS/cm produced by G-10DSTSET, a pure water device manufactured by Organo Co., Ltd.] (Ingredient E) E1: Polyoxyethylene decyl ether [manufactured by BASF, Lutensol XL40, an average 4 mol adduct of Gibuterol ethylene oxide with carbon number 10] E2: 2-Ethylhexyl glyceryl ether (manufactured by the following manufacturing method) 130 g of 2-ethylhexanol and 2.84 g of boron trifluoride ether complex were cooled to 0°C while stirring. While keeping the temperature at 0°C, 138.8 g of epichlorohydrin was dropped over 1 hour. After the dropping, the remaining alcohol was distilled off at 100°C under reduced pressure (13～26 Pa). The reaction mixture was cooled to 50°C, 125 g of 48% sodium hydroxide aqueous solution was dropped over 1 hour while maintaining 50°C, and after stirring for 3 hours, 200 mL of water was added to separate the layers. After removing the water layer, it was washed twice with 100 mL of water to obtain 208 g of crude 2-ethylhexyl glycidyl ether. 208 g of the crude 2-ethylhexyl glycidyl ether, 104.8 g of water, 5.82 g of lauric acid, and 18.5 g of potassium hydroxide were added to the autoclave and stirred at 140° C. for 5 hours. After dehydration at 100°C under reduced pressure (6.67 kPa), 9.7 g of lauric acid and 2.72 g of potassium hydroxide were added, and reacted at 160°C for 15 hours, and then vacuum distillation (53～67 Pa, 120～ 123° C.) was refined to obtain 110.2 g of 2-ethylhexyl glyceryl ether. (Other ingredients) Benzotriazole [manufactured by Tokyo Chemical Industry Co., Ltd., 1,2,3-benzotriazole]

[Physical properties of amine (component B, non-component B)] Table 1 shows the polarity term (δp) of the Hansen solubility parameter of the amine (component B, non-component B) used in the preparation of the detergent composition. The polarity term (δp) is calculated using the computer software "HSPiP: Hansen Solubility Parameters in Practice". [Table 1] Table 1 Polar term of Hansen solubility parameter δp (MPa ^0.5 ) Ingredient B B1 Dibutyl monoethanolamine 4.2 B2 Dimethylbenzylamine 2.9 B3 1,2-Dimethylimidazole 7.6 B4 1-isobutyl-2-methylimidazole 5.6 B5 Diisopropanolamine 7.7 B6 Butyl Diethanolamine 7.0 Non-ingredient B B7 Triethanolamine 10.2 B8 Methyldiethanolamine 8.3 B9 2-ethyl-4-methylimidazole 7.9 B10 2-methylimidazole 10.6 B11 Monoethanolamine 10.3

2. Evaluation of detergent composition [Liquid state of detergent composition] Visually observe the liquid state of the cleansing composition after preparation at 25°C. The uniformly transparent ones were designated as A, and the separated and unevenly transparent ones were designated as B. The results are shown in Table 2. A can be judged as a stable liquid state is ensured, and B can be judged as an unstable liquid state.

[Evaluation of cleanliness] The cleansing properties were tested and evaluated using the prepared detergent compositions of Examples 1-18 and Comparative Examples 1-10.

＜Test board＞ On the copper wiring printed circuit board (10 mm×15 mm), use a screen to coat the following solder paste. The test substrate was produced by reflowing at 250°C in a nitrogen atmosphere.

＜The composition of flux＞ Fully hydrogenated rosin (manufactured by Eastman Chemical Company, Foral AX-E) 58.0% by mass N,N'-Diphenylguanidine hydrobromide (manufactured by Wako Chemical Co., Ltd.) 0.5% by mass Adipic acid (manufactured by Wako Pure Chemical Industry Co., Ltd.) 0.5% by mass Hydrogenated castor oil (manufactured by Feng Guo Oil Co., Ltd.) 6.0% by mass Hexyldiol (manufactured by Japan Emulsifier Co., Ltd.) 35.0% by mass

<The manufacturing method of flux> The flux of the above composition is obtained by adding and dissolving the remaining other components in the hexyl glycol of the solvent.

＜Method of manufacturing solder paste＞ 11.0 g of the above-mentioned flux and 89.0 g of solder powder [manufactured by Senju Metal Industry Co., Ltd., M705 (Sn/Ag/Cu=96.5/3/0.5)] were kneaded for 1 hour to prepare.

＜Cleaning test＞ The cleaning test is carried out in the following order. First, prepare the ultrasonic cleaning tank, the first washing tank, and the second washing tank under the following conditions. The ultrasonic cleaning tank sets the frequency to 40 kHz and the output to 200 W. It is obtained by adding 100 g of each detergent composition to a 50 mL glass beaker, putting it in the ultrasonic cleaning layer and heating it to 60°C. The first washing tank and the second washing tank are obtained by the following method: prepare two 100 mL glass beakers with a 50 mm rotor and add 100 g of pure water respectively, put them in the warm bath, and stir at 100 rpm. Heat to 40°C on one side. Secondly, the test substrate was held with tweezers and inserted into the above-mentioned ultrasonic cleaning tank for immersion for 1 minute. Then, the test substrate was held with tweezers and inserted into the first washing tank, and while stirring at 100 rpm, the substrate was immersed for 1 minute. Furthermore, while holding the test substrate with tweezers and inserting it into the second rinse tank, it was immersed for 1 minute while stirring at 100 rpm. Finally, the test substrate was flushed with nitrogen and dried.

<Evaluation of cleanliness (flux removal)> After cleaning, observe the test substrate with a desktop microscope Miniscope TM3030 (manufactured by Hitachi High-Tech Co., Ltd.) to visually confirm the presence or absence of residual flux residue on any 9-point solder bumps, and count the residual flux residues The number of solder bumps of the object. The results are shown in Table 2. Furthermore, the test substrate was observed with an optical microscope VHX-2000 (manufactured by KEYENCE Co., Ltd.) to visually confirm the presence or absence of flux residues remaining near the solder bumps, and count the solders with flux residues remaining near the solder bumps The number of bumps. The results are shown in Table 2.

＜Evaluation of cleanliness (tin removal)＞ In order to confirm the cleanliness of tin oxide generated near the solder bumps during reflow, the following methods were used to evaluate the solubility of tin oxide and the inhibition of re-precipitation after dissolution. In a 50 mL glass beaker, 20 g of the detergent composition was added, and 1 g of tin (IV) oxide was added, and stirred with a stirring bar at 25° C. for 3 hours. After that, the supernatant liquid obtained by precipitating undissolved tin (IV) oxide by centrifugal separation was diluted twice with 1-methyl-2-pyrrolidone to obtain a measurement liquid. ICP (Inductively Coupled Plasma, Inductively Coupled Plasma) luminescence spectrometer (manufactured by Agilent, Agilent 5110 ICP-OES) was used to measure the Sn concentration in the measurement solution, and calculate the amount of Sn dissolved in the detergent composition (ppm) ). The results are shown in Table 2.

＜Evaluation of cleanliness (solubility of rosinic acid)＞ In order to confirm the affinity of the flux, use the following method to evaluate the solubility of rosinic acid used as a component of the flux. Add 100 g of the detergent composition and 1 g of rosinic acid to a 50 mL glass beaker, use an ultrasonic cleaning tank, set the frequency to 40 kHz and set the output to 200 W, and perform ultrasonic waves at 25°C for 1 hour deal with. When the rosinic acid is dissolved, add 1 g of rosinic acid and perform the same operation. This operation is repeated until the pinoresinic acid becomes undissolved, thereby estimating the solubility. The higher the solubility, the better the rosin-based flux removability can be evaluated. From the viewpoint of the removability of rosin-based flux, it can be evaluated that the solubility is preferably 40% by mass or more, more preferably 50% by mass or more, still more preferably 55% by mass or more, and still more preferably 60% by mass or more. [Evaluation criteria] A: The solubility is 60% by mass or more B: The solubility is 50% by mass or more and less than 60% by mass C: The solubility is more than 40% by mass and less than 50% by mass D: The solubility is less than 40% by mass

[Table 2] Table 2 Example Detergent composition ingredient 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 Ingredient A A1 Tetrahydrofuran methanol 85.50 45.00 45.00 45.00 45.00 45.00 45.00 45.00 88.50 80.50 A2 Diethylene glycol monobutyl ether 85.50 40.50 40.50 40.50 40.50 40.50 40.50 40.50 40.50 40.50 40.50 2.50 2.50 84.70 A3 Dipropylene glycol monobutyl ether 45.00 A4 Diethylene glycol dibutyl ether 45.00 46.50 A5 1-methyl-2-pyrrolidone 85.50 A6 Benzyl alcohol 77.20 77.20 Ingredient B B1 N,N-Dibutylmonoethanolamine 5.00 5.00 5.00 5.00 5.00 5.00 5.00 2.00 10.00 2.00 5.00 5.00 B2 N,N-Dimethylbenzylamine 5.00 5.00 B3 1,2-Dimethylimidazole 5.00 B4 1-isobutyl-2-methylimidazole 5.00 B5 Diisopropanolamine 5.00 B6 N-Butyl Diethanolamine 5.00 Non-ingredient B B10 2-methylimidazole 1.00 Ingredient C C1 1-hydroxyethylene-1,1-diphosphonic acid 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.30 0.50 0.50 0.50 C2 Methylene bisphosphonic acid 0.50 Ingredient D water 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 9.00 8.88 8.80 8.80 8.80 Ingredient E E1 Polyoxyethylene decyl ether 1.82 E2 2-ethylhexyl glyceryl ether 5.00 5.00 other Benzotriazole 1.00 1.00 Mass ratio [component A/component B] 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 17.1 44.3 8.1 43.5 15.9 15.9 16.9 Mo Er ratio [component B/component C] 11.9 11.9 11.9 11.9 11.9 11.9 15.2 21.4 14.9 15.5 12.8 10.2 4.8 23.8 7.9 11.9 15.2 11.9 Evaluation Liquid state Appearance (25℃) A A A A A A A A A A A A A A A A A A Flux removal On solder bump (pcs) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Near the solder bump (a) 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Tin removability SnO ₂ solubility (Sn ppm) 1.52 1.37 1.55 1.37 1.71 1.31 2.00 1.40 1.33 1.26 1.65 1.00 1.10 1.06 1.14 1.25 1.50 1.64 Pinoleic acid solubility Solubility (mass%) 55 50 50 65 80 55 55 60 50 45 45 55 40 65 60 50 50 55 Evaluation B B B A A B B A B C C B C A A B B B Comparative example Detergent composition ingredient 1 2 3 4 5 6 7 8 9 10 Ingredient A A1 Tetrahydrofuran methanol 85.50 85.50 85.50 85.50 85.50 45.00 45.00 45.00 45.00 A2 Diethylene glycol monobutyl ether 40.50 40.50 40.50 40.50 Ingredient B B1 N,N-Dibutylmonoethanolamine 5.00 5.00 Non-ingredient B B7 Triethanolamine 5.00 5.00 B8 Methyldiethanolamine 5.00 B9 2-ethyl-4-ethylimidazole 5.00 B10 2-methylimidazole 5.00 B11 Monoethanolamine 5.00 Ingredient C C1 1-hydroxyethylene-1,1-diphosphonic acid 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 0.50 Ingredient D water 94.50 14.00 9.50 9.00 9.00 9.00 14.00 9.00 9.00 9.00 Mass ratio [component A/component B] - - 17.1 - - - - - - - Evaluation Liquid state Appearance (25℃) A A A A A A A B B B Flux removal On solder bump (pcs) 9 9 9 4 9 9 9 0 0 0 Near the solder bump (a) 9 9 9 0 9 9 9 0 0 0 Tin removability SnO ₂ solubility (Sn ppm) 0.65 0.78 0.12 0.79 0.65 0.74 0.80 0.70 0.66 1.10

As shown in Table 2 above, the detergent compositions of Examples 1 to 18, compared with Comparative Examples 1 to 10 in which at least one of components A to C are not blended, ensure a stable liquid state, and have flux removability and tin Excellent removability. Furthermore, the solubility of the rosinic acid of the detergent compositions of Examples 1-9, 12, 14-18 is as high as 50% by mass or more, and it can be seen that the rosin-based flux is superior in removability compared with Examples 10-11 and 13. . Industrial availability

By using the cleaning agent composition of the present invention, the cleaning of flux residues can be performed well. Therefore, for example, the cleaning steps of the flux residues in the manufacturing process of electronic parts can be shortened and the electronic parts manufactured can be shortened. Improved performance and reliability can improve the productivity of semiconductor devices.

Claims (15)

A cleaning agent composition for removing flux residues, which contains: a solvent (component A); an amine with a polarity term (δp) of Hansen solubility parameter of 7.8 or less (component B); and represented by the following formula (VI) Bisphosphonic acid (component C); [化1]

In the above formula (VI), X is an alkylene group or hydroxyalkylene group having a carbon number of 1 or more and 6 or less. A cleaning composition for removing flux residues, which is formulated with a solvent (component A), an amine (component B) whose polarity term (δp) of the Hansen solubility parameter is 7.8 or less, and represented by the following formula (VI) Bisphosphonic acid (component C), [Chemical 2]

In the above formula (VI), X is an alkylene group or hydroxyalkylene group having a carbon number of 1 or more and 6 or less. The detergent composition of claim 1 or 2, wherein the molar ratio B/C of component B to component C is 4 or more and 40 or less. Such as the detergent composition of claim 1 or 2, wherein the content of component A is 70% by mass or more and 99.5% by mass or less, The content of component B is 0.2% by mass to 15% by mass, The content of component C is 0.1% by mass to 3% by mass. The detergent composition of claim 1 or 2, wherein the solvent (component A) is selected from a compound represented by the following formula (I), a compound represented by the following formula (II), and a compound represented by the following formula (III) At least one solvent in the compound represented, R ¹ -O-(AO) _n -R ² (I) In the above formula (I), R ¹ is a phenyl group or an alkyl group with 1 to 8 carbon atoms, and R ² is A hydrogen atom or an alkyl group with a carbon number of 1 to 4, AO is an ethylene oxide group or a propylene oxide group, n is the number of added moles of AO and an integer of 1 to 3, R ³ -CH ₂ OH (II) In the above formula (II), R ³ is phenyl, benzyl, cyclohexyl, furanyl, tetrahydrofuranyl, furyl methyl or tetrahydrofuryl methyl, [化3]

In the above formula (III), R ⁴ , R ⁵ , R ⁶ , and R ⁷ are each independently a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group. The detergent composition of claim 1 or 2, wherein the amine (component B) is an amine represented by the following formula (IV) or (V), [化4]

In the above formula (IV), R ⁸ is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, phenyl, benzyl, hydroxyethyl or hydroxypropyl, and R ⁹ and R ¹⁰ are each independently a carbon number of 1 or more and 6 The following alkyl, hydroxyethyl or hydroxypropyl, [Chemical 5]

In the above formula (V), R ¹¹ is an alkyl group having 1 to 4 carbon atoms, and R ¹² is a hydrogen atom or a methyl group. The detergent composition of claim 1 or 2, which further contains water (ingredient D). The detergent composition of claim 7, wherein the content of component D is 20% by mass or less. The detergent composition of claim 7, wherein the content of component D is 1% by mass or more. The detergent composition of claim 1 or 2, wherein the mass ratio (A/B) of component A to component B is 5 or more and 60 or less. The detergent composition of claim 1 or 2, wherein component B is selected from dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethylbenzylamine, 1,2-dimethylimidazole And at least one of 1-isobutyl-2-methylimidazole. A cleaning method comprising the step of using the cleaning agent composition as claimed in any one of claims 1 to 11 to clean an object to be cleaned with flux residue. Such as the cleaning method of claim 12, wherein the object to be cleaned is a manufacturing intermediate for welding electronic parts. A method of manufacturing electronic components, comprising the steps of: mounting at least one component selected from the group consisting of semiconductor chips, chip-type capacitors and circuit substrates on the circuit substrate by soldering using flux, and using At least one of the steps of forming solder bumps for connecting the above-mentioned components on the circuit board; and, by a cleaning method such as claim 12 or 13, selecting from the circuit boards equipped with the above-mentioned components and the above-mentioned solder bumps At least one of the circuit substrates is cleaned. A use of the cleaning agent composition according to any one of claims 1 to 11, which is used as a flux cleaning agent for cleaning objects with flux residues.