CN113165093B - Cleaning agent composition for removing scaling powder residue - Google Patents
Cleaning agent composition for removing scaling powder residue Download PDFInfo
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- CN113165093B CN113165093B CN201980080694.5A CN201980080694A CN113165093B CN 113165093 B CN113165093 B CN 113165093B CN 201980080694 A CN201980080694 A CN 201980080694A CN 113165093 B CN113165093 B CN 113165093B
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- 239000012459 cleaning agent Substances 0.000 title claims abstract description 131
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- 239000002253 acid Substances 0.000 claims abstract description 23
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- 238000004140 cleaning Methods 0.000 claims description 61
- 238000000034 method Methods 0.000 claims description 47
- 125000004432 carbon atom Chemical group C* 0.000 claims description 46
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- PUVMVPFLXCHEOY-UHFFFAOYSA-N 3-phosphonopropylphosphonic acid Chemical compound OP(O)(=O)CCCP(O)(O)=O PUVMVPFLXCHEOY-UHFFFAOYSA-N 0.000 claims description 3
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- 230000032798 delamination Effects 0.000 description 1
- 150000001983 dialkylethers Chemical class 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000004993 emission spectroscopy Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000009969 flowable effect Effects 0.000 description 1
- 229930182478 glucoside Natural products 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 229940051250 hexylene glycol Drugs 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 230000005764 inhibitory process Effects 0.000 description 1
- 239000013067 intermediate product Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 125000003884 phenylalkyl group Chemical group 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000001376 precipitating effect Effects 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000008213 purified water Substances 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- 238000001226 reprecipitation Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000009210 therapy by ultrasound Methods 0.000 description 1
- 229910021642 ultra pure water Inorganic materials 0.000 description 1
- 239000012498 ultrapure water Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/28—Heterocyclic compounds containing nitrogen in the ring
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0014—Brazing of honeycomb sandwich structures
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/26—Organic compounds containing nitrogen
- C11D3/30—Amines; Substituted amines ; Quaternized amines
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/16—Organic compounds
- C11D3/36—Organic compounds containing phosphorus
- C11D3/361—Phosphonates, phosphinates or phosphonites
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D3/00—Other compounding ingredients of detergent compositions covered in group C11D1/00
- C11D3/43—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/32—Organic compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/22—Organic compounds
- C11D7/36—Organic compounds containing phosphorus
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5013—Organic solvents containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D7/00—Compositions of detergents based essentially on non-surface-active compounds
- C11D7/50—Solvents
- C11D7/5004—Organic solvents
- C11D7/5022—Organic solvents containing oxygen
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- C—CHEMISTRY; METALLURGY
- C11—ANIMAL OR VEGETABLE OILS, FATS, FATTY SUBSTANCES OR WAXES; FATTY ACIDS THEREFROM; DETERGENTS; CANDLES
- C11D—DETERGENT COMPOSITIONS; USE OF SINGLE SUBSTANCES AS DETERGENTS; SOAP OR SOAP-MAKING; RESIN SOAPS; RECOVERY OF GLYCEROL
- C11D2111/00—Cleaning compositions characterised by the objects to be cleaned; Cleaning compositions characterised by non-standard cleaning or washing processes
- C11D2111/10—Objects to be cleaned
- C11D2111/14—Hard surfaces
- C11D2111/22—Electronic devices, e.g. PCBs or semiconductors
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Oil, Petroleum & Natural Gas (AREA)
- Wood Science & Technology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Emergency Medicine (AREA)
- Detergent Compositions (AREA)
- Cleaning By Liquid Or Steam (AREA)
Abstract
The present disclosure provides a cleaning agent composition for removing flux residue, which ensures a stable liquid state and is excellent in flux removing property and tin removing property. The present disclosure relates in one mode to: a cleaning agent composition for removing a flux residue, which comprises a solvent (component A), an amine (component B) having a Hansen solubility parameter with a polar term (δp) of 7.8 or less, and a bisphosphonic acid (component C) represented by the following formula (VI); or a cleaning agent composition for removing a flux residue, which comprises component A, component B and component C.
Description
Technical Field
The present disclosure relates to a cleaning agent composition for removing flux residue, a cleaning method using the cleaning agent composition, and a method for manufacturing an electronic component.
Background
In recent years, in mounting electronic components on printed wiring boards and ceramic substrates, the components have been miniaturized from the viewpoints of low power consumption and high-speed processing, and the gaps to be cleaned in cleaning of solder fluxes have been narrowed. In addition, lead-free solders have been used in terms of environmental safety, and rosin-based fluxes have been used in association with this.
For example, international publication No. 2011/027673 (patent document 1) discloses a cleaning agent for removing a lead-free solder water-soluble flux, which contains 5 to 100 parts by weight of a glycol ether compound per 100 parts by weight of water.
International publication No. 2005/021700 (patent document 2) discloses a cleaning agent for removing solder flux, which is characterized in that: when the content of the diol compound is less than 1 wt%, the content of the benzyl alcohol is in the range of 70 to 99.9 wt% and the content of the amino alcohol is in the range of 0.1 to 30 wt%, and when the content of the diol compound is 1 to 40 wt%, the content of the benzyl alcohol is in the range of 15 to 99 wt% and the content of the amino alcohol is in the range of 0.1 to 30 wt%.
JP-A2004-2688 (patent document 3) discloses an aqueous cleaning composition which contains an organic solvent, 5 to 30% by weight of a glyceryl ether having an alkyl or alkenyl group having 4 to 12 carbon atoms, and 5% by weight or more of water and is used for precision parts such as metal parts, electronic parts, semiconductor parts and liquid crystal display panels.
Japanese patent application laid-open No. 2018-21093 (patent document 4) discloses a cleaning agent composition for screen printing: contains 100g of water at 25 ℃ of an amine or a salt thereof having a solubility of less than 10g, 100g of water at 25 ℃ of a solvent having a solubility of 0.02g or more and less than 10g, and water, wherein the amine is at least one selected from primary amine, secondary amine and tertiary amine having 6 to 26 carbon atoms.
Disclosure of Invention
The present disclosure relates to a cleaning agent composition for removing a flux residue, which contains a solvent (component a), an amine (component B) having a hansen solubility parameter with a polar term (δp) of 7.8 or less, and a bisphosphonic acid (component C) represented by the following formula (VI), or a cleaning agent composition for removing a flux residue, which is obtained by blending component a, component B, and component C.
[ chemical formula 1]
In the formula (VI), X is an alkylene group or a hydroxyalkylene group having 1 to 6 carbon atoms.
The present disclosure relates to a cleaning method including a step of cleaning an object to be cleaned having flux residue by using a cleaning agent composition of the present disclosure.
The present disclosure relates to a method for manufacturing an electronic component, including: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by the cleaning method of the present disclosure.
Detailed Description
In recent years, due to miniaturization of semiconductor package substrates, solder bumps have been miniaturized, and gaps between the solder bumps and members to be connected have been narrowed. Further, since solder bumps are miniaturized and gaps between the solder bumps and members to be connected are narrowed, the cleaning agent composition disclosed in the above patent document is insufficient in the removal property of the flux residue (flux removal property), and is said to be insufficient in the cleaning property. Further, the cleaning agent composition is also required to have improved removability (tin removability) of tin oxide and tin salt generated during reflow soldering. In addition, a stable liquid state which can be ensured not to separate is demanded for the detergent composition.
Accordingly, the present disclosure provides a cleaning agent composition for removing flux residue, which ensures a stable liquid state and is excellent in flux removability and tin removability, a cleaning method using the same, and a method for manufacturing an electronic component.
According to the present disclosure, a cleaning agent composition for removing flux residue, which ensures a stable liquid state and is excellent in flux removing property and tin removing property, can be provided.
The present disclosure is based on the following recognition: the use of a cleaning composition containing a specific solvent (component A), a specific amine (component B) and a specific bisphosphonic acid (component C) or a cleaning composition comprising component A, component B and component C ensures a stable liquid state and improves the flux removability and tin removability as compared with the conventional cleaning compositions.
That is, the present disclosure relates in one or more embodiments to a cleaning agent composition for removing a flux residue, which contains a solvent (component a), an amine (component B) having a hansen solubility parameter with a polarity term (δp) of 7.8 or less, and a bisphosphonic acid (component C) represented by the above formula (VI), or a cleaning agent composition for removing a flux residue, which is obtained by mixing component a, component B, and component C (hereinafter, they are also collectively referred to as "cleaning agent composition of the present disclosure"). According to the present disclosure, in one or more embodiments, flux residue can be efficiently removed. In addition, according to the present disclosure, in one or more embodiments, tin oxide and tin salts generated during reflow can be removed efficiently. Further, according to the present disclosure, in one or more embodiments, a highly stable, uniform and transparent cleaning agent composition for removing flux residue can be obtained.
The action mechanism of the effect of the detergent composition of the present disclosure is not known in detail, but is presumed as follows.
That is, in the cleaning agent composition of the present disclosure, the component a (solvent) penetrates the flux and the flux residue deteriorated by reflow or the like to reduce the viscosity so as to be easily flowable, and the component B (amine) acts to decompose or hydrophilize the flux and the flux residue so as to be easily dissolved in the cleaning agent composition.
In addition, it is presumed that the component B (amine) improves the solubility in water in the rinsing step after the cleaning of the flux and the flux residue, and thus the removability of the flux by the rinsing can be improved, and the residual flux residue after the cleaning and the rinsing can be reduced.
Further, when the component B and the component C in the cleaning agent composition of the present disclosure form a salt, the salt of the component B (amine) and the component C (bisphosphonic acid) having a high affinity with tin acts on tin oxide and tin salt which are generated by reflow soldering and adhere to the flux residue and the object to be cleaned, and thus the tin oxide and tin salt are easily dissolved in the cleaning agent composition. Further, it is presumed that the solubility of tin oxide and tin salt in water in the washing step after washing is increased by the salts of the component B and the component C, so that the tin removability is improved, and the remaining tin oxide and tin salt after washing and washing can be reduced.
Further, regarding the salts of the component B and the component C, it is presumed that by setting the polarity term (δp) of the hansen solubility parameter of the component B (amine) to 7.8 or less, the salt with the component C (bisphosphonic acid) can be dissolved in the component a (solvent), and a uniform and stable detergent composition can be obtained.
However, the present disclosure may also be construed without being limited to this mechanism.
The term "flux" as used in the present disclosure means a rosin-based flux containing rosin or rosin derivatives used in soldering, a water-soluble flux containing no rosin, or the like for removing oxides that interfere with the connection of metals such as electrodes and wirings to solder metals to promote the connection, and the term "soldering" as used in the present disclosure includes soldering by reflow soldering and flow soldering. In the present disclosure, "solder flux" refers to a mixture of solder and flux. In the present disclosure, "flux residue" refers to a residue derived from flux that remains on a substrate after a solder bump is formed using flux and/or a substrate after soldering using flux. For example, when other components (for example, a semiconductor chip, a chip capacitor, and other circuit boards) are stacked and mounted on a circuit board, a space (gap) is formed between the circuit board and the other components. The flux used for the mounting also remains in the gap as a flux residue after soldering by reflow soldering or the like. The term "cleaning agent composition for removing flux residue" as used in the present disclosure means a cleaning agent composition for removing flux residue after forming solder bumps and/or soldering using a flux or solder flux. In terms of exhibiting a remarkable effect of cleaning property based on the cleaning agent composition of the present disclosure, the solder is preferably a tin-containing lead-free (Pb) solder.
In the present disclosure, the hansen solubility parameter (Hansen solubility parameter) (hereinafter also referred to as "HSP") is a value published in 1967 by Charles m.hansen for predicting the solubility of a substance, and is based on "a molecule"Parameters from the point of view that 2 substances with similar interactions are easily dissolved in each other. HSP contains 3 parameters (unit: MPa) 0.5 )。
δd: energy based on intermolecular dispersion forces
δp: energy based on intermolecular dipole interactions
δh: energy based on intermolecular hydrogen bonding
The chemical industry, month 3 (chemical industry company) and the like, has been described in detail by using computer software "hsppi: hansen Solubility Parameters in Practice ", etc., the hansen solubility parameters of various substances can be obtained.
[ component A: solvents ]
In one or more embodiments, the component a in the cleaning agent composition of the present disclosure is preferably at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II), and a compound represented by the following formula (III) from the viewpoint of improving the flux removability.
R 1 -O-(AO) n -R 2 (I)
In the above formula (I), R 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is an integer of 1 to 3 inclusive in terms of the number of addition moles of AO.
In the above formula (I), R 1 The phenyl group or the alkyl group having 1 to 8 carbon atoms is preferably a phenyl group or an alkyl group having 4 to 6 carbon atoms, more preferably an alkyl group having 4 to 6 carbon atoms, from the viewpoint of improving the flux removability. R is R 2 The hydrogen atom or the alkyl group having 1 to 4 carbon atoms is preferably a hydrogen atom or an alkyl group having 2 to 4 carbon atoms, and more preferably a hydrogen atom or an n-butyl group, from the same viewpoint. AO is an ethylene oxide group or a propylene oxide group, and from the same viewpoint, an ethylene oxide group is preferable. n is an integer of 1 to 3, preferably 1 or 2, more preferably 2, from the same viewpoint.
Examples of the compound represented by the formula (I) include: monophenyl ether such as ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, triethylene glycol monophenyl ether, and the like; monoalkyl ethers such as ethylene glycol monoalkyl ether, diethylene glycol monoalkyl ether and triethylene glycol monoalkyl ether having an alkyl group having 1 to 8 carbon atoms; dialkyl ethers such as ethylene glycol dialkyl ethers, diethylene glycol dialkyl ethers, and triethylene glycol dialkyl ethers having an alkyl group having 1 to 8 carbon atoms and an alkyl group having 1 to 4 carbon atoms; phenyl alkyl ethers such as ethylene glycol phenyl alkyl ether, diethylene glycol phenyl alkyl ether and triethylene glycol phenyl alkyl ether having a phenyl group and an alkyl group having 1 to 4 carbon atoms. The compound represented by the above formula (I) is preferably at least one selected from ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, ethylene glycol monohexyl ether, diethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monophenyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, tripropylene glycol monobutyl ether, ethylene glycol dibutyl ether, diethylene glycol dibutyl ether and triethylene glycol dibutyl ether, more preferably at least one selected from diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monophenyl ether, dipropylene glycol monobutyl ether and diethylene glycol dibutyl ether, and still more preferably at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether and diethylene glycol dibutyl ether, from the viewpoint of improving the flux removal property.
R 3 -CH 2 OH(II)
In the above formula (II), R 3 Phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuryl, furfuryl or tetrahydrofurfuryl is preferred, and phenyl, cyclohexyl or tetrahydrofurfuryl is more preferred, from the viewpoint of improving the flux removability.
Examples of the compound represented by the formula (II) include: benzyl alcohol, phenethyl alcohol, cyclohexane methanol, furfuryl alcohol and tetrahydrofurfuryl alcohol. The compound represented by the above formula (II) is preferably at least one selected from the group consisting of benzyl alcohol, furfuryl alcohol and tetrahydrofurfuryl alcohol, and more preferably at least one selected from the group consisting of benzyl alcohol and tetrahydrofurfuryl alcohol, from the viewpoint of improving the flux removability.
[ chemical formula 2]
In the above formula (III), R 4 、R 5 、R 6 、R 7 Each independently is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms or a hydroxyl group, R is preferable from the viewpoint of improving the flux removability 4 、R 5 、R 6 、R 7 Any one of the hydrocarbon groups is a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 1 to 6 carbon atoms, still more preferably any one of a methyl group, an ethyl group and a vinyl group.
Examples of the compound represented by the formula (III) include: 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2-pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone, 3-hydroxypropyl-2-pyrrolidone, 4-hydroxy-2-pyrrolidone, 4-phenyl-2-pyrrolidone, 5-methyl-2-pyrrolidone, and the like. The compound represented by the above formula (III) is preferably at least one selected from the group consisting of 2-pyrrolidone, 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone, 1-vinyl-2-pyrrolidone, 1-phenyl-2-pyrrolidone, 1-cyclohexyl-2-pyrrolidone, 1-octyl-2-pyrrolidone and 5-methyl-2-pyrrolidone, more preferably at least one selected from the group consisting of 1-methyl-2-pyrrolidone, 1-ethyl-2-pyrrolidone and 1-vinyl-2-pyrrolidone, and even more preferably 1-methyl-2-pyrrolidone, from the viewpoint of improving the flux removal property.
The component A may be 1 kind, 2 kinds or more than 2 kinds. When the component a is a combination of 2 kinds, examples of the component a include a combination of a compound represented by the formula (I) and a compound represented by the formula (II).
The component a is preferably at least one selected from the group consisting of diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, benzyl alcohol, tetrahydrofurfuryl alcohol and 1-methyl-2-pyrrolidone, and more preferably at least one selected from the group consisting of diethylene glycol monobutyl ether, benzyl alcohol, tetrahydrofurfuryl alcohol and 1-methyl-2-pyrrolidone, from the viewpoint of improving the flux removability.
The content of the component a in the cleaning agent composition of the present disclosure is preferably 70 mass% or more, more preferably 75 mass% or more, further preferably 78 mass% or more, and is preferably 99.5 mass% or less, more preferably 95 mass% or less, further preferably 90 mass% or less, from the viewpoint of improving the flux removability. More specifically, the content of the component a in the cleaning agent composition of the present disclosure is preferably 70% by mass or more and 99.5% by mass or less, more preferably 75% by mass or more and 95% by mass or less, and still more preferably 78% by mass or more and 90% by mass or less. When the component a is a combination of 2 or more, the content of the component a means the total content thereof.
[ component B: amines ]
Component B in the cleaning agent composition of the present disclosure is an amine having a hansen solubility parameter with a polar term (δp) of 7.8 or less. As the amine (component B) having δp of 7.8 or less, an amine represented by the following formula (IV) or (V) may be mentioned in one or more embodiments. The component B may be 1 kind, 2 kinds or more than 2 kinds.
[ chemical formula 3]
In the above formula (IV), R 8 Is hydrogen atom, alkyl group with carbon number of more than 1 and less than 6, phenyl group, benzyl group, hydroxyethyl group or hydroxypropyl group, R 9 R is R 10 Each independently represents an alkyl group having 1 to 6 carbon atoms, a hydroxyethyl group or a hydroxypropyl group. From the viewpoint of improving the flux removability and tin removability, R 8 Preferably a hydrogen atom, an alkyl group having 2 to 6 carbon atoms, a phenyl group or a benzyl group.
Examples of the amine represented by the above formula (IV) having a polarity term (δp) of the hansen solubility parameter of 7.8 or less include: alkanolamines such as dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, and the like; and aromatic amines such as dimethylbenzylamine. Specific examples of the amine represented by the above formula (IV) include at least one selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine and dimethylbenzyl amine, and more preferably at least one selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine and dimethylbenzyl amine, from the viewpoint of improving the flux removability and tin removability.
[ chemical formula 4]
In the above formula (V), R 11 Is alkyl of 1 to 4 carbon atoms, R 12 Is a hydrogen atom or a methyl group. From the viewpoint of improving the flux removability and tin removability, R 11 Preferably methyl or isobutyl, R 12 Preferably methyl.
The amine represented by the above formula (V) having a polarity term (δp) of the hansen solubility parameter of 7.8 or less may be exemplified by: imidazoles such as 1, 2-dimethylimidazole and 1-isobutyl-2-methylimidazole. Specific examples of the amine represented by the formula (V) are preferably at least one selected from 1, 2-dimethylimidazole and 1-isobutyl-2-methylimidazole, and more preferably 1, 2-dimethylimidazole, from the viewpoints of improving the flux removability and improving the tin removability.
The polarity term (δp) of the hansen solubility parameter of the component B is 7.8 or less, preferably 7.7 or less, more preferably 6 or less, further preferably 5 or less from the viewpoint of improving the flux removability and the stability, and preferably 1 or more from the viewpoint of improving the flux removability. More specifically, the polarity term (δp) of the hansen solubility parameter of the component B is preferably 1 or more and 7.7 or less, more preferably 1 or more and 6 or less, and still more preferably 1 or more and 5 or less.
The component B is preferably at least one selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethylbenzylamine, 1, 2-dimethylimidazole and 1-isobutyl-2-methylimidazole, more preferably at least one selected from the group consisting of dibutyl monoethanolamine, dimethylbenzylamine and 1-isobutyl-2-methylimidazole, and still more preferably at least one selected from the group consisting of dibutyl monoethanolamine and dimethylbenzylamine, from the viewpoint of improving stability. The component B is preferably at least one selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethylbenzyl amine, 1, 2-dimethyl imidazole and 1-isobutyl-2-methylimidazole, more preferably at least one selected from the group consisting of dibutyl monoethanolamine, dimethylbenzyl amine, 1, 2-dimethyl imidazole and 1-isobutyl-2-methylimidazole, and still more preferably 1, 2-dimethyl imidazole, from the viewpoint of improving the removability of the rosin-based flux.
The content of component B in the cleaning agent composition of the present disclosure is preferably 0.2 mass% or more, more preferably 0.3 mass% or more, still more preferably 0.4 mass% or more, still more preferably 0.5 mass% or more, from the viewpoint of improving the flux removability and improving the tin removability, and is preferably 15 mass% or less, more preferably 10 mass% or less, still more preferably 5 mass% or less, still more preferably 3 mass% or less, from the viewpoint of the same. More specifically, the content of component B in the cleaning agent composition of the present disclosure is preferably 0.2% by mass or more and 15% by mass or less, more preferably 0.3% by mass or more and 10% by mass or less, still more preferably 0.4% by mass or more and 5% by mass or less, and still more preferably 0.5% by mass or more and 3% by mass or less. When the component B is a combination of 2 or more, the content of the component B means the total content thereof.
In the cleaning agent composition of the present disclosure, the mass ratio (a/B) of the component a to the component B is preferably 5 or more, more preferably 8 or more, further preferably 10 or more from the viewpoint of improving the tin removing property, and is preferably 60 or less, more preferably 45 or less, further preferably 20 or less from the same viewpoint. More specifically, the mass ratio (a/B) is preferably 5 or more and 60 or less, more preferably 8 or more and 45 or less, and still more preferably 10 or more and 20 or less.
[ component C: bisphosphonic acids (component C)
Component C in the cleaning agent composition of the present disclosure is a bisphosphonic acid represented by the following formula (VI). The component C may be 1,2 or more than 2.
[ chemical formula 5]
In the formula (VI), X is an alkylene group or a hydroxyalkylene group having 1 to 6 carbon atoms. X is preferably a hydroxyalkylene group from the viewpoint of improving the tin removing property. In addition, from the viewpoint of improving the flux removability, the carbon number of X is preferably 1 to 4, more preferably 1 to 2.
Specific examples of the component C include, for example, at least one type of bisphosphonic acid selected from the group consisting of 1-hydroxyethylidene-1, 1-bisphosphonic acid, methylenebisphosphonic acid, 1, 2-ethylenebisphosphonic acid, 1, 3-propylenebisphosphonic acid, 1, 4-butylenebisphosphonic acid, 1, 5-pentylidenediphosphonic acid and 1, 6-hexylenebisphosphonic acid, more preferably at least one type of bisphosphonic acid selected from the group consisting of 1-hydroxyethylidene-1, 1-bisphosphonic acid and methylenebisphosphonic acid, and still more preferably 1-hydroxyethylidene-1, 1-bisphosphonic acid.
The content of component C in the cleaning agent composition of the present disclosure is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, further preferably 0.5% by mass or more, in terms of improving the flux removability and improving the tin removability, and is preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1.5% by mass or less, further preferably 1% by mass or less, in terms of improving the flux removability and improving the stability. More specifically, the content of the component C is preferably 0.1% by mass or more and 3% by mass or less, more preferably 0.3% by mass or more and 2% by mass or less, still more preferably 0.3% by mass or more and 1.5% by mass or less, and still more preferably 0.5% by mass or more and 1% by mass or less. When the component C is a combination of 2 or more, the content of the component C means the total content thereof.
In the cleaning agent composition of the present disclosure, it is considered that the salts of the component B and the component C participate in the removal of the flux and tin, and the molar ratio B/C of the component B and the component C is presumed to be a factor of their removability. The molar ratio B/C of the component B to the component C in the cleaning agent composition of the present disclosure is preferably 4 or more, more preferably 4.5 or more, more preferably 4.8 or more, more preferably 7 or more, more preferably 10 or more, and is preferably 40 or less, more preferably 30 or less, more preferably 25 or less, more preferably 22 or less, more preferably 18 or less, from the viewpoint of improving the flux removability and tin removability. More specifically, the molar ratio B/C is preferably 4 or more and 40 or less, more preferably 4.5 or more and 30 or less, still more preferably 4.8 or more and 25 or less, still more preferably 7 or more and 22 or less, still more preferably 10 or more and 18 or less.
In the cleaning agent composition of the present disclosure, from the viewpoints of improving the flux removability and improving the tin removability, it is preferable that at least a part of component B forms a salt with component C and at least a part of component B does not form a salt with component C at the time of cleaning. That is, the cleaning agent composition of the present disclosure, in one or more embodiments, contains a salt of component B with component C at the time of cleaning, and contains component B that does not form a salt with component C. The content of the salt of the component B and the component C in the cleaning agent composition of the present disclosure is preferably 0.1 mass% or more, more preferably 0.3 mass% or more, further preferably 0.7 mass% or more, and is preferably 10 mass% or less, more preferably 5 mass% or less, further preferably 3 mass% or less, from the viewpoint of improving the flux removability and improving the tin removability. More specifically, the content of the salt of the component B and the component C is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.3% by mass or more and 5% by mass or less, and still more preferably 0.7% by mass or more and 3% by mass or less.
[ component D: water ]
In one or more embodiments, the cleaning agent compositions of the present disclosure may further comprise water (component D). As the component D, ion-exchanged water, RO water, distilled water, pure water, ultrapure water, or the like can be used. The content of component D in the cleaning agent composition of the present disclosure is preferably 1% by mass or more, more preferably 5% by mass or more, further preferably 8% by mass or more from the viewpoint of reducing the ignition point, and is preferably 20% by mass or less, more preferably 15% by mass or less, further preferably 10% by mass or less from the viewpoint of improving the flux removability and improving the stability. More specifically, the content of component D in the cleaning agent composition of the present disclosure is preferably 1% by mass or more and 20% by mass or less, more preferably 5% by mass or more and 15% by mass or less, and still more preferably 8% by mass or more and 10% by mass or less.
In the case where the cleaning agent composition of the present disclosure contains the component D, it is preferable to use diethylene glycol monobutyl ether in combination with other components a than the diethylene glycol monobutyl ether in the component a contained in the cleaning agent composition of the present disclosure from the viewpoint of improving stability.
[ other Components ]
The cleaning agent composition of the present disclosure may contain other components in addition to the components a to D described above, if necessary. The content of the other components in the cleaning agent composition of the present disclosure is preferably 0% by mass or more and 10% by mass or less, more preferably 0% by mass or more and 8% by mass or less, still more preferably 0% by mass or more and 5% by mass or less, and still more preferably 0% by mass or more and 2% by mass or less.
As other components in the detergent composition of the present disclosure, for example, surfactants (component E) are exemplified from the viewpoint of improving stability. From the same viewpoint, the component E is preferably a nonionic surfactant such as polyoxyalkylene alkyl ether, polyoxyalkylene alkyl amine, glycerin fatty acid ester, sorbitan fatty acid ester, sucrose fatty acid ester, alkyl glucoside, or alkyl glycerin ether, and more preferably polyoxyalkylene alkyl ether or alkyl glycerin ether. Specific examples of component E include polyoxyethylene decyl ether and 2-ethylhexyl glyceryl ether. The content of component E in the cleaning agent composition of the present disclosure is preferably 0.5 mass% or more, more preferably 0.8 mass% or more, and is preferably 5 mass% or less, more preferably 3 mass% or less, and further preferably 2 mass% or less, from the viewpoint of improving stability. More specifically, the content of the component E in the cleaning agent composition of the present disclosure is preferably 0.5% by mass or more and 5% by mass or less, more preferably 0.5% by mass or more and 3% by mass or less, and still more preferably 0.8% by mass or more and 2% by mass or less.
As further other components, the cleaning agent composition of the present disclosure may be blended as necessary or contain a compound having chelating force such as hydroxyethylaminoacetic acid, hydroxyethyiiminodiacetic acid, ethylenediamine tetraacetic acid or other aminocarboxylate used in a general cleaning agent, an antirust agent such as benzotriazole, a thickener, a dispersant, an alkaline substance other than component B, a polymer compound, a solubilizer, a preservative, a bactericide, an antibacterial agent, an antifoaming agent, an antioxidant, and the like, as long as the effects of the present disclosure are not impaired.
[ method for producing cleaning agent composition ]
The cleaning agent composition of the present disclosure can be produced, for example, by blending component a, component B, component C, and, if necessary, component D and other components by a known method. In one or more embodiments, the cleaning agent composition of the present disclosure may be formulated to contain at least component a, component B, and component C. Accordingly, the present disclosure relates to a method for producing a cleaning agent composition (hereinafter, also referred to as "a method for producing a cleaning agent composition of the present disclosure"), which includes a step of blending at least component a, component B, and component C. In the method for producing the cleaning agent composition of the present disclosure, component B and component C may be blended separately or as a salt of component B and component C. In one or more embodiments, the method of manufacturing the detergent composition of the present disclosure may include mixing the component a, and if necessary, the component D and other components described above, after mixing the component B and the component C. In the present disclosure, "blending" includes mixing the component a, the component B, the component C, and the component D and other components as needed simultaneously or in any order. In the method for producing the cleaning agent composition of the present disclosure, the amount of each component may be the same as the content of each component in the cleaning agent composition of the present disclosure.
In the present disclosure, the "content of each component in the cleaning agent composition" refers to the content of each component at the time of cleaning, that is, at the time of using the cleaning agent composition for cleaning.
The cleaning agent composition of the present disclosure can be produced and stored in the form of a concentrate from the viewpoint of the addition operation, storage and transportation. The dilution ratio of the concentrate of the cleaning agent composition of the present disclosure may be, for example, 3 to 30 times. The concentrate of the cleaning agent composition of the present disclosure can be diluted with water (component D) at the time of use so that the above-described content (i.e., the content at the time of cleaning) is obtained by the component a, the component B, the component C, and the component D and other components blended as needed.
[ pH value of detergent composition ]
The cleaning agent composition of the present disclosure is preferably alkaline in terms of improving the removability of the flux residue, and for example, preferably has a pH of 8 or more and a pH of 14 or less. The pH can be adjusted by appropriately blending the following components in the required amounts as required: inorganic acids such as nitric acid and sulfuric acid; organic acids such as hydroxycarboxylic acids, polycarboxylic acids, aminopolycarboxylic acids, and amino acids; and alkaline substances other than component B, such as metal salts or ammonium salts thereof, ammonia, sodium hydroxide, potassium hydroxide, and amines.
[ object to be cleaned ]
The cleaning agent composition disclosed by the invention is used for cleaning objects to be cleaned with scaling powder residues. Examples of the object to be cleaned having flux residue include objects to be cleaned having reflowed solder. Specific examples of the object to be cleaned include, for example, electronic components and manufacturing intermediates thereof, specifically, soldering electronic components and manufacturing intermediates thereof, and more specifically, soldering electronic components and manufacturing intermediates thereof, and the like, and the specific examples thereof include: an electronic component in which components are soldered with solder and a manufacturing intermediate thereof, an electronic component in which components are connected via solder and a manufacturing intermediate thereof, an electronic component in which flux residues are contained in gaps between soldered components and a manufacturing intermediate thereof, an electronic component in which flux residues are contained in gaps between components connected via solder and a manufacturing intermediate thereof, and the like. The manufacturing intermediate is an intermediate product in a manufacturing process of an electronic component including a semiconductor package and a semiconductor device, and includes, for example, a circuit board on which at least one member selected from a semiconductor chip, a chip capacitor, and a circuit board is mounted by soldering using a flux, and/or a circuit board on which solder bumps for solder-connecting the members are formed. The clearance of the object to be cleaned is, for example, a space having a height (distance between components) of 5 to 500 μm, 10 to 250 μm, or 20 to 100 μm in a space formed between the circuit board and a component (semiconductor chip, chip capacitor, circuit board, or the like) mounted on the circuit board by soldering. The width and depth of the gap depend on the size and spacing of the mounted component and the electrode (pad) on the circuit board.
[ cleaning method ]
The present disclosure relates in one embodiment to a cleaning method for removing flux residue (hereinafter, also referred to as "the cleaning method of the present disclosure"), which includes contacting an object to be cleaned having flux residue with a cleaning agent composition of the present disclosure. In one or more embodiments, the cleaning method of the present disclosure includes a step of cleaning an object to be cleaned having flux residue with the cleaning agent composition of the present disclosure. Examples of the method of bringing the cleaning agent composition of the present disclosure into contact with an object to be cleaned or the method of cleaning an object to be cleaned using the cleaning agent composition of the present disclosure include a method of bringing the cleaning agent composition into contact with the object to be cleaned in a bath of an ultrasonic cleaning apparatus, a method of spraying the cleaning agent composition in a spray form and bringing the cleaning agent composition into contact with the object to be cleaned (a spray method), and the like. The cleaning agent composition of the present disclosure can be used directly for cleaning without dilution. The cleaning method of the present disclosure preferably includes a step of washing with water and drying after contacting the object to be cleaned with the cleaning agent composition. According to the cleaning method of the present disclosure, the flux residue remaining in the gap of the welded component can be efficiently cleaned. The solder is preferably a lead-free (Pb) solder in terms of exhibiting a remarkable effect of cleaning property and penetration into a narrow gap based on the cleaning method of the present disclosure. Further, from the same viewpoint, the cleaning method of the present disclosure is preferably used for electronic parts which are solder-connected using a flux described in International publication No. 2006/025224, japanese patent application laid-open No. 6-75796, japanese patent application laid-open No. 2014-144473, japanese patent application laid-open No. 2004-230426, japanese patent application laid-open No. 2013-188761, japanese patent application laid-open No. 2013-173184, and the like. In the cleaning method of the present disclosure, in order to easily exert the cleaning power of the cleaning agent composition of the present disclosure, it is preferable to irradiate ultrasonic waves when the cleaning agent composition of the present disclosure is in contact with an object to be cleaned, and it is more preferable that the ultrasonic waves are strong. The frequency of the ultrasonic wave is preferably 26 to 72Hz, 80 to 1500W, more preferably 36 to 72Hz, and 80 to 1500W, from the same point of view.
[ method for manufacturing electronic component ]
The present disclosure relates to a method for manufacturing an electronic component (hereinafter, also referred to as "method for manufacturing an electronic component of the present disclosure"), including the steps of: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by the cleaning method of the present disclosure. Soldering using a flux is performed by, for example, lead-free solder, and may be reflow soldering or flow soldering. The electronic component includes a semiconductor package on which the semiconductor chip is not mounted, a semiconductor package on which the semiconductor chip is mounted, and a semiconductor device. By performing the cleaning method of the present disclosure, the method of manufacturing an electronic component of the present disclosure reduces flux residue remaining in the gaps of the soldered components, the periphery of the solder bumps, and the like, and suppresses short-circuiting between electrodes and adhesion failure caused by the flux residue, thereby manufacturing an electronic component of high reliability. Further, by performing the cleaning method of the present disclosure, the cleaning of the flux residue remaining in the gap or the like of the soldered component is facilitated, and therefore the cleaning time can be shortened, and the manufacturing efficiency of the electronic component can be improved.
[ set ]
The present disclosure relates in one embodiment to a kit (hereinafter, also referred to as "kit of the present disclosure") for use in the cleaning method of the present disclosure and/or the manufacturing method of the electronic component of the present disclosure. The kits of the present disclosure are, in one or more embodiments, kits for making the cleaning agent compositions of the present disclosure.
As an embodiment of the kit of the present disclosure, there is a kit (two-part type cleaning agent composition) comprising a solution containing the above-mentioned component a (solution 1) and a solution containing the components B and C (solution 2) in an immiscible state, wherein the solution 1 and the solution 2 are mixed at the time of use. The above-mentioned component D and other components may be contained in the above-mentioned liquid 1 and liquid 2, respectively, if necessary. At least one of the above-mentioned solutions 1 and 2 may contain a part or all of the component D (water) in one or more embodiments. In one or more embodiments, the above-described liquid 1 and liquid 2 may be mixed and then diluted with the component D (water) as needed.
The present disclosure is also directed to one or more of the following embodiments.
< 1 > a cleaning agent composition for removing flux residue, comprising:
a solvent (component A),
Amine (component B) having Hansen solubility parameter with polarity term (δp) of 7.8 or less
A bisphosphonic acid (component C) represented by the following formula (VI),
or component A, component B and component C.
[ chemical formula 6]
In the formula (VI), X is an alkylene group or a hydroxyalkylene group having 1 to 6 carbon atoms.
The cleaning agent composition according to < 2 > to < 1 >, wherein the solvent (component A) is at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II), and a compound represented by the following formula (III).
R 1 -O-(AO) n -R 2 (I)
In the above formula (I), R 1 Is phenyl or alkyl with more than or equal to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an ethylene oxide group or a propylene oxide group, and n is an integer of 1 to 3 inclusive in terms of the number of addition moles of AO.
R 3 -CH 2 OH(II)
In the above formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl, furfuryl or tetrahydrofurfuryl.
[ chemical formula 7]
/>
In the above formula (III), R 4 、R 5 、R 6 、R 7 Each independently represents a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms, or a hydroxyl group.
< 3 > the cleaning agent composition according to < 2 >, wherein R in the above formula (I) 1 The alkyl group is preferably a phenyl group or an alkyl group having 1 to 8 carbon atoms, more preferably a phenyl group or an alkyl group having 4 to 6 carbon atoms, and still more preferably an alkyl group having 4 to 6 carbon atoms.
< 4 > the cleaning agent composition according to < 2 > or < 3 >, wherein, in the above formula (I), R 2 The alkyl group is preferably a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, more preferably a hydrogen atom or an alkyl group having 2 to 4 carbon atoms, and still more preferably a hydrogen atom or an n-butyl group.
< 5 > the detergent composition according to any one of < 2 > to < 4 >, wherein in the above formula (I), AO is an oxirane group or an oxetanyl group, preferably an oxirane group.
The cleaning agent composition according to any one of < 2 > to < 5 >, wherein n in the above formula (I) is an integer of 1 to 3, preferably 1 or 2, more preferably 2.
< 7 > according to any one of < 2 > to < 6-The cleaning agent composition comprises R in the formula (II) 3 Phenyl, benzyl, cyclohexyl, furyl, tetrahydrofurfuryl, furfuryl or tetrahydrofurfuryl, preferably phenyl, cyclohexyl or tetrahydrofurfuryl, more preferably phenyl or tetrahydrofurfuryl.
< 8 > the cleaning agent composition according to any one of < 2 > to < 7 >, wherein, in the above formula (III), R 4 、R 5 、R 6 、R 7 Each independently is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms or a hydroxyl group, preferably R 4 、R 5 、R 6 、R 7 Any one of the hydrocarbon groups is a hydrocarbon group having 1 to 8 carbon atoms, more preferably a hydrocarbon group having 1 to 6 carbon atoms, still more preferably any one of a methyl group, an ethyl group and a vinyl group.
The cleaning agent composition according to any one of < 9 > to < 2 > to < 8 >, wherein component A is a combination of a compound represented by formula (I) and a compound represented by formula (II).
The cleaning agent composition according to any one of < 10 > to < 1 > to < 8 >, wherein component A is preferably at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, benzyl alcohol, tetrahydrofurfuryl alcohol and 1-methyl-2-pyrrolidone, more preferably at least one selected from diethylene glycol monobutyl ether, benzyl alcohol, tetrahydrofurfuryl alcohol and 1-methyl-2-pyrrolidone.
The detergent composition according to any one of < 1 > to < 10 > wherein the content of component A is preferably 70% by mass or more, more preferably 75% by mass or more, still more preferably 78% by mass or more.
The detergent composition according to any one of < 1 > to < 11 >, wherein the content of component A is preferably 99.5% by mass or less, more preferably 95% by mass or less, and further preferably 90% by mass or less.
The detergent composition according to any one of < 1 > to < 12 >, wherein the content of component A is preferably 70% by mass or more and 99.5% by mass or less, more preferably 75% by mass or more and 95% by mass or less, still more preferably 78% by mass or more and 90% by mass or less.
The cleaning agent composition according to any one of < 1 > to < 13 >, wherein the amine (component B) is an amine represented by the following formula (IV) or (V).
[ chemical formula 8]
/>
In the above formula (IV), R 8 Is hydrogen atom, alkyl group with carbon number of more than 1 and less than 6, phenyl group, benzyl group, hydroxyethyl group or hydroxypropyl group, R 9 R is R 10 Each independently represents an alkyl group having 1 to 6 carbon atoms, a hydroxyethyl group or a hydroxypropyl group.
[ chemical formula 9]
In the above formula (V), R 11 Is alkyl of 1 to 4 carbon atoms, R 12 Is a hydrogen atom or a methyl group.
The cleaning agent composition according to any one of < 15 > to < 1 > to < 14 >, wherein component B is preferably at least one selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethylbenzylamine, 1, 2-dimethylimidazole and 1-isobutyl-2-methylimidazole, more preferably at least one selected from the group consisting of dibutyl monoethanolamine, dimethylbenzylamine and 1-isobutyl-2-methylimidazole, and still more preferably at least one selected from the group consisting of dibutyl monoethanolamine and dimethylbenzylamine.
The detergent composition according to any one of < 1 > to < 15 >, wherein the content of component B is preferably 0.2% by mass or more, more preferably 0.3% by mass or more, still more preferably 0.4% by mass or more, still more preferably 0.5% by mass or more.
The detergent composition according to any one of < 17 > to < 1 > to < 16 >, wherein the content of component B is preferably 15% by mass or less, more preferably 10% by mass or less, further preferably 5% by mass or less, still further preferably 3% by mass or less.
The detergent composition according to any one of < 18 > to < 1 > to < 17 >, wherein the content of component B is preferably 0.2% by mass or more and 15% by mass or less, more preferably 0.3% by mass or more and 10% by mass or less, still more preferably 0.4% by mass or more and 5% by mass or less, still more preferably 0.5% by mass or more and 3% by mass or less.
The detergent composition according to any one of < 1 > to < 18 >, wherein the mass ratio (A/B) of the component A to the component B is preferably 5 or more, more preferably 8 or more, still more preferably 10 or more.
The detergent composition according to any one of < 1 > to < 19 >, wherein the mass ratio (A/B) of the component A to the component B is preferably 60 or less, more preferably 45 or less, still more preferably 20 or less.
The detergent composition according to any one of < 21 > to < 1 > to < 20 >, wherein the mass ratio (A/B) of the component A to the component B is preferably 5 or more and 60 or less, more preferably 8 or more and 45 or less, still more preferably 10 or more and 20 or less.
The cleaning agent composition according to any one of < 1 > to < 21 >, wherein X in the formula (VI) is an alkylene group having 1 to 6 carbon atoms or a hydroxyalkylene group, preferably a hydroxyalkylene group.
The cleaning agent composition according to any one of < 1 > to < 22 >, wherein in the formula (VI), the carbon number of X is preferably 1 to 4, more preferably 1 to 2.
< 24 > the cleaning agent composition according to any one of < 1 > to < 23 >, wherein component C is preferably at least one bisphosphonic acid selected from the group consisting of 1-hydroxyethylidene-1, 1-bisphosphonic acid, methylenebisphosphonic acid, 1, 2-ethylenebisphosphonic acid, 1, 3-propylenebisphosphonic acid, 1, 4-butylenebisphosphonic acid, 1, 5-pentylidenediphosphonic acid and 1, 6-hexylenebisphosphonic acid, more preferably at least one bisphosphonic acid selected from the group consisting of 1-hydroxyethylidene-1, 1-bisphosphonic acid and methylenebisphosphonic acid, further preferably 1-hydroxyethylidene-1, 1-bisphosphonic acid.
The content of component C in the detergent composition according to any one of < 1 > to < 24 > is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, and still more preferably 0.5% by mass or more.
The detergent composition according to any one of < 26 > to < 1 > to < 25 >, wherein the content of component C is preferably 3% by mass or less, more preferably 2% by mass or less, further preferably 1.5% by mass or less, still further preferably 1% by mass or less.
The detergent composition according to any one of < 1 > to < 26 > wherein the content of component C is preferably 0.1% by mass or more and 3% by mass or less, more preferably 0.3% by mass or more and 2% by mass or less, still more preferably 0.3% by mass or more and 1.5% by mass or less, still more preferably 0.5% by mass or more and 1% by mass or less.
The cleaning agent composition according to any one of < 1 > to < 27 > wherein the content of component A is 70 mass% or more and 99.5 mass% or less, the content of component B is 0.2 mass% or more and 15 mass% or less, and the content of component C is 0.1 mass% or more and 3 mass% or less.
The detergent composition according to any one of < 1 > to < 28 >, wherein the molar ratio B/C of component B to component C is preferably 4 or more, more preferably 4.5 or more, still more preferably 4.8 or more, still more preferably 7 or more, still more preferably 10 or more.
The detergent composition according to any one of < 30 > to < 1 > to < 29 >, wherein the molar ratio B/C of component B to component C is preferably 40 or less, more preferably 30 or less, further preferably 25 or less, further preferably 22 or less, further more preferably 18 or less.
The detergent composition according to any one of < 31 > to < 1 > to < 30 >, wherein the molar ratio B/C of the component B to the component C is preferably 4 or more and 40 or less, more preferably 4.5 or more and 30 or less, still more preferably 4.8 or more and 25 or less, still more preferably 7 or more and 22 or less, still more preferably 10 or more and 18 or less.
The cleaning agent composition according to any one of < 1 > to < 31 > wherein at least a part of component B forms a salt with component C and at least a part of component B does not form a salt with component C.
The detergent composition according to the above-mentioned formula < 33 > and < 32 > wherein the salt content of component B and component C is preferably 0.1% by mass or more, more preferably 0.3% by mass or more, still more preferably 0.7% by mass or more.
The content of the salt of the component B and the component C is preferably 10% by mass or less, more preferably 5% by mass or less, and still more preferably 3% by mass or less.
The detergent composition according to any one of < 32 > to < 34 > wherein the content of the salt of component B and component C is preferably 0.1% by mass or more and 10% by mass or less, more preferably 0.3% by mass or more and 5% by mass or less, still more preferably 0.7% by mass or more and 3% by mass or less.
< 36 > the cleaning agent composition according to any one of < 1 > to < 35 >, further comprising water (component D).
The detergent composition according to < 37 > and < 36 > wherein the content of component D is preferably 1% by mass or more, more preferably 5% by mass or more, still more preferably 8% by mass or more.
The content of component D in the detergent composition according to < 38 > to < 36 > or < 37 > is preferably 20% by mass or less, more preferably 15% by mass or less, and still more preferably 10% by mass or less.
The detergent composition according to any one of < 39 > to < 36 > to < 38 >, wherein the content of component D is preferably 1% by mass or more and 20% by mass or less, more preferably 5% by mass or more and 15% by mass or less, and still more preferably 8% by mass or more and 10% by mass or less.
< 40 > the cleaning agent composition according to any one of < 1 > to < 39 >, further comprising a surfactant (component E).
The detergent composition according to any one of < 1 > to < 40 >, further comprising at least one member selected from the group consisting of a chelating compound, a rust inhibitor such as benzotriazole, a thickener, a dispersant, an alkaline substance other than component B, a polymer compound, a solubilizing agent, a preservative, a bactericide, an antibacterial agent, an antifoaming agent, and an antioxidant.
A cleaning method comprising the step of cleaning an object to be cleaned having flux residue with the cleaning agent composition according to any one of < 1 > to < 41 >.
The cleaning method according to < 43 > and < 42 >, wherein the object to be cleaned is an intermediate for manufacturing the electronic component.
< 44 > a method for manufacturing an electronic component, comprising the steps of: at least one step selected from the group consisting of a step of mounting at least one member selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the member on the circuit board; and a step of cleaning at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed by the cleaning method described in < 42 > or < 43 >.
Examples
Hereinafter, the present disclosure will be specifically described with reference to examples, but the present disclosure is not limited to these examples.
1. Preparation of detergent compositions (examples 1 to 18 and comparative examples 1 to 10)
The cleaning agent compositions of examples 1 to 18 and comparative examples 1 to 10 were prepared by mixing the components in a 100mL glass beaker so as to have the compositions shown in table 2 below and mixing the components under the following conditions. The numerical values of the respective components in table 2 indicate the contents (% by mass) in the prepared detergent composition unless otherwise specified.
< mixing Condition >
Liquid temperature: 25 DEG C
A stirrer: magnetic stirrer (50 mm rotor)
Rotational speed: 300rpm
Stirring time: for 10 minutes
The following substances were used as components of the cleaning agent composition.
(component A)
A1: tetrahydrofurfuryl alcohol (Fuji film and light purity chemical Co., ltd.)
A2: diethylene glycol monobutyl ether (manufactured by Japanese emulsifier Co., ltd., diethylene glycol butyl ether (BDG))
A3: dipropylene glycol monobutyl ether (dipropylene glycol butyl ether (BFDG) manufactured by Japanese emulsifier Co., ltd.)
A4: diethylene glycol dibutyl ether (DBDG) manufactured by Japanese emulsifier Co., ltd.)
A5: 1-methyl-2-pyrrolidone (Fuji film and light purity chemical Co., ltd.)
A6: benzyl alcohol (Lanxess Co., ltd.)
(component B)
B1: n, N-Dibutylmonoethanolamine (manufactured by Japanese emulsifier Co., ltd., amino alcohol 2B)
B2: n, N-dimethylbenzylamine (Kaolizer No.20, manufactured by Kaolizer Co., ltd.)
B3:1, 2-dimethylimidazole (Tokyo chemical industry Co., ltd.)
B4: 1-isobutyl-2-methylimidazole (Kaolizer No.120, manufactured by Kaolizer Co., ltd.)
B5: diisopropanolamine (DIPA) manufactured by Sanjing Fine chemistry Co., ltd.)
B6: N-N-butyl diethanolamine (manufactured by Japanese emulsifier Co., ltd., amino alcohol MBD)
(non-component B)
B7: triethanolamine (manufactured by Japanese catalyst Co., ltd.)
B8: methyl diethanolamine (manufactured by Japanese emulsifier Co., ltd., amino alcohol MDA)
B9: 2-ethyl-4-methylimidazole (Fuji film and light purity chemical Co., ltd.)
B10: 2-methylimidazole (Fuji film and light purity chemical Co., ltd.)
B11: monoethanolamine (manufactured by Japanese catalyst Co., ltd.)
(component C)
C1: 1-hydroxyethylidene-1, 1-diphosphonic acid [ Italmatch Japan Co., ltd., dequest 2010, 60% by mass solids ]
C2: methylene diphosphonic acid (Fuji film and light purity chemical Co., ltd.)
(component D)
Water [ purified water of 1. Mu.S/cm or less manufactured by pure water apparatus G-10DSTSET manufactured by Organo Co., ltd ]
(component E)
E1: polyoxyethylene decyl ether [ average 4 mol adduct of C10 Guerbet alcohol ethylene oxide, manufactured by BASF corporation, lutensol XL40 ]
E2: 2-ethylhexyl glyceryl ether (produced by the following production method)
130g of 2-ethylhexanol and 2.84g of boron trifluoride etherate were cooled to 0℃with stirring. 138.8g of epichlorohydrin was added dropwise over 1 hour while keeping the temperature at 0 ℃. After the completion of the dropwise addition, the remaining alcohol was distilled off under reduced pressure (13 to 26 Pa) and at 100 ℃. The reaction mixture was cooled to 50℃and 125g of 48% aqueous sodium hydroxide solution was added dropwise over 1 hour while maintaining the temperature at 50℃and stirred for 3 hours, followed by addition of 200mL of water and delamination. After removing the aqueous layer, the mixture was washed with 100mL of water 2 times to obtain 208g of crude 2-ethylhexyl glycidyl ether. The crude 2-ethylhexyl glycidyl ether (208 g), water (104.8 g), lauric acid (5.82 g) and potassium hydroxide (18.5 g) were charged into an autoclave, and stirred at 140℃for 5 hours. After dehydration under reduced pressure (6.67 kPa) and at 100 ℃, 9.7g of lauric acid and 2.72g of potassium hydroxide were added, the mixture was reacted at 160℃for 15 hours, and then purified by distillation under reduced pressure (53 to 67Pa,120 to 123 ℃) to obtain 110.2g of 2-ethylhexyl glycerol ether.
(other Components)
Benzotriazole [ 1,2, 3-benzotriazole manufactured by Tokyo chemical industry Co., ltd.)
[ physical Properties of amine (component B, non-component B) ]
The polarity term (δp) of hansen solubility parameters of amines (component B, non-component B) used in the preparation of the detergent composition is shown in table 1. The polarity term (δp) uses computer software "hsPIP: hansen Solubility Parameters in Practice ".
TABLE 1
2. Evaluation of detergent composition
[ liquid State of detergent composition ]
The liquid state of the prepared detergent composition was visually observed at 25 ℃. The results are shown in Table 2, where A is the uniformly transparent component, B is the non-uniformly transparent component separated. A can be determined to ensure a stable liquid state, and B can be determined to be unstable.
[ evaluation of detergency ]
The cleaning properties were tested and evaluated using the cleaning agent compositions of examples 1 to 18 and comparative examples 1 to 10.
Test substrate
On a copper wiring printed board (10 mm. Times.15 mm), the following solder paste was applied using a screen. The test substrate was fabricated by reflow soldering at 250 ℃ under nitrogen atmosphere.
Composition of flux
58.0% by mass of fully hydrogenated rosin (Foral AX-E manufactured by Eastman Chemical Co., ltd.)
N, N' -diphenylguanidine hydrobromide (manufactured by Kagaku Co., ltd., photochemistry Co., ltd.) 0.5% by mass
Adipic acid (manufactured by Wako pure chemical industries, ltd.) 0.5% by mass
Hydrogenated castor oil (manufactured by Fengguo oil Co., ltd.) 6.0% by mass
Hexyl glycol (Japanese text, section コ, manufactured by Nippon emulsifier Co., ltd.) 35.0 mass%
Method for producing flux
The flux having the above composition is obtained by adding and dissolving the remaining other components in the hexylene glycol of the solvent.
Method for producing solder paste
11.0g of the flux was kneaded with 89.0g of a solder powder [ Qianzhi Metal industry Co., ltd., M705 (Sn/Ag/Cu=96.5/3/0.5) ] for 1 hour.
< cleaning test >)
The cleaning test was performed as follows.
First, an ultrasonic cleaning tank, a 1 st flushing tank, and a 2 nd flushing tank were prepared under the following conditions. The ultrasonic cleaning tank set the frequency to 40kHz and the output to 200W. 100g of each cleaning agent composition was added to a 50mL glass beaker, and the mixture was placed in an ultrasonic cleaning layer and heated to 60 ℃. The 1 st flushing tank and the 2 nd flushing tank are obtained by the following modes: two 100mL glass beakers with one 50mm rotor added thereto were prepared, and 100g of pure water was added to each, and the beakers were placed in a warm bath, and heated to 40℃while stirring at 100 rpm.
Then, the test substrate was held by tweezers, and inserted into the ultrasonic cleaning tank, and immersed for 1 minute. Then, the test substrate was held by tweezers and inserted into the 1 st rinse tank, followed by immersing for 1 minute while stirring at a rotation speed of 100 rpm.
Further, the test substrate was held by tweezers and inserted into the 2 nd rinse tank, and immersed for 1 minute while stirring at a rotation speed of 100 rpm.
Finally, the test substrate was dried by nitrogen purging.
Evaluation of washability (flux removability) >
After cleaning, the test substrate was observed with a microscope Miniscope (TM) 3030 (Hitachi Ltd.) to visually confirm the presence or absence of flux residue remaining on any 9 solder bumps, and the number of solder bumps in which flux residue was remaining was counted. The results are shown in Table 2.
Further, the test substrate was observed by an optical microscope VHX-2000 (manufactured by KEYENCE corporation), and the presence or absence of flux residue remaining in the vicinity of the solder bump was visually confirmed, to count the number of solder bumps in which flux residue remained in the vicinity of the solder bump. The results are shown in Table 2.
Evaluation of washability (tin removal Property)
In order to confirm the cleaning property of tin oxide generated near the solder bump during reflow, the solubility of tin oxide and the re-precipitation inhibition property after dissolution were evaluated by the following methods.
20g of the cleaning agent composition was added to a 50mL glass beaker, and 1g of tin (IV) oxide was added thereto, followed by stirring with a stirrer at 25℃for 3 hours. Thereafter, the supernatant obtained by precipitating undissolved tin (IV) oxide by centrifugation was diluted 2-fold with 1-methyl-2-pyrrolidone to obtain a measurement solution. The Sn concentration in the measurement solution was measured by an ICP emission spectrometry device (Agilent 5110ICP-OES, manufactured by Agilent corporation), and the amount of Sn dissolved in the cleaning agent composition (ppm) was calculated. The results are shown in Table 2.
Evaluation of washability (abietic acid solubility) >
In order to confirm the affinity of the flux, the solubility of rosin acid used as a component of the flux was evaluated by the following method.
100g of the detergent composition and 1g of abietic acid were added to a 50mL glass beaker, and ultrasonic treatment was performed at 25℃for 1 hour using an ultrasonic cleaning tank under conditions of a frequency of 40kHz and an output of 200W. 1g of rosin acid was further added in the case of dissolution of rosin acid, and the same procedure was carried out. This operation was repeated until the rosin acid was not dissolved, whereby the solubility was estimated. The higher the solubility, the more excellent the removability of the rosin-based flux can be evaluated. From the viewpoint of the removability of the rosin-based flux, the solubility can be evaluated as preferably 40 mass% or more, more preferably 50 mass% or more, still more preferably 55 mass% or more, and still more preferably 60 mass% or more.
[ evaluation criterion ]
A: solubility of 60 mass% or more
B: solubility of 50 mass% or more and less than 60 mass%
C: the solubility is 40 mass% or more and less than 50 mass%
D: solubility less than 40 mass%
TABLE 2
As shown in table 2, the cleaning agent compositions of examples 1 to 18 ensure a stable liquid state and are excellent in flux removability and tin removability, as compared with comparative examples 1 to 10 in which at least one of the components a to C was not blended. Further, the detergent compositions of examples 1 to 9, 12 and 14 to 18 were found to have a rosin acid solubility of 50 mass% or higher, and the rosin-based flux remover was superior to that of examples 10 to 11 and 13.
Industrial applicability
By using the cleaning agent composition of the present disclosure, it is possible to satisfactorily clean the flux residue, and thus, for example, shortening of the cleaning process of the flux residue in the manufacturing process of the electronic component and improvement of the performance/reliability of the manufactured electronic component become possible, and productivity of the semiconductor device can be improved.
Claims (25)
1. A cleaning agent composition for removing flux residue, comprising:
a component A which is at least one solvent selected from the group consisting of a compound represented by the following formula (I), a compound represented by the following formula (II) and a compound represented by the following formula (III);
An amine having a hansen solubility parameter with a polarity term δp of 7.8 or less, component B;
component C is a bisphosphonic acid represented by the following formula (VI); a kind of electronic device with high-pressure air-conditioning system
The water is the component D and is used for preparing the water,
the content of component D is 1 to 20 mass%,
R 1 -O-(AO) n -R 2 (I)
in the formula (I), R 1 Is phenyl groupOr an alkyl group having 1 to 8 carbon atoms, R 2 Is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, AO is an oxirane group or an oxetane group, n is an addition mole number of AO and is an integer of 1 to 3,
R 3 -CH 2 OH(II)
in the formula (II), R 3 Is phenyl, benzyl, cyclohexyl, furyl, tetrahydrofuranyl, furfuryl or tetrahydrofurfuryl,
in the formula (III), R 4 、R 5 、R 6 、R 7 Each independently is a hydrogen atom, a hydrocarbon group having 1 to 8 carbon atoms, a hydroxyalkyl group having 1 to 3 carbon atoms or a hydroxyl group,
in the formula (VI), X is an alkylene group or a hydroxyalkylene group having 1 to 6 carbon atoms.
2. The cleaning agent composition according to claim 1, wherein a molar ratio B/C of the component B to the component C is 4 or more and 40 or less.
3. The cleaning agent composition according to claim 1 or 2, wherein a molar ratio B/C of the component B to the component C is 4.8 or more and 25 or less.
4. The cleaning agent composition according to claim 1 or 2, wherein the content of component A is 70% by mass or more and 99.5% by mass or less,
The content of component B is 0.2 mass% or more and 15 mass% or less,
the content of component C is 0.1% by mass or more and 3% by mass or less.
5. The cleaning agent composition according to claim 1 or 2, wherein the content of the component a is 75% by mass or more and 95% by mass or less.
6. The cleaning agent composition according to claim 1 or 2, wherein the content of the component B is 0.3 mass% or more and 10 mass% or less.
7. The cleaning agent composition according to claim 1 or 2, wherein the content of the component C is 0.3 mass% or more and 2 mass% or less.
8. The cleaning agent composition according to claim 1 or 2, wherein the amine component B is an amine represented by the following formula (IV) or (V),
in the formula (IV), R 8 Is hydrogen atom, alkyl group with carbon number of more than 1 and less than 6, phenyl group, benzyl group, hydroxyethyl group or hydroxypropyl group, R 9 R is R 10 Each independently represents an alkyl group having 1 to 6 carbon atoms, a hydroxyethyl group or a hydroxypropyl group,
in the formula (V), R 11 Is alkyl of 1 to 4 carbon atoms, R 12 Is a hydrogen atom or a methyl group.
9. The cleaning agent composition according to claim 1 or 2, wherein the content of the component D is 5% by mass or more and 15% by mass or less.
10. The cleaning agent composition according to claim 1 or 2, wherein component a is a combination of diethylene glycol monobutyl ether and other components a than the diethylene glycol monobutyl ether.
11. The cleaning agent composition according to claim 1 or 2, wherein a mass ratio a/B of the component a to the component B is 5 or more and 60 or less.
12. The cleaning agent composition according to claim 1 or 2, wherein a mass ratio a/B of the component a to the component B is 8 or more and 45 or less.
13. The cleaning agent composition according to claim 1 or 2, wherein the polarity term δp of hansen solubility parameter of component B is 1 or more and 7.7 or less.
14. The cleaning agent composition according to claim 1 or 2, wherein component B is at least one selected from the group consisting of dibutyl monoethanolamine, butyl diethanolamine, diisopropanolamine, dimethylbenzylamine, 1, 2-dimethylimidazole and 1-isobutyl-2-methylimidazole.
15. The cleaning agent composition according to claim 1 or 2, wherein the component a is at least one selected from diethylene glycol monobutyl ether, dipropylene glycol monobutyl ether, diethylene glycol dibutyl ether, benzyl alcohol, tetrahydrofurfuryl alcohol and 1-methyl-2-pyrrolidone.
16. The cleaning agent composition according to claim 1 or 2, wherein component C is at least one selected from the group consisting of 1-hydroxyethylidene-1, 1-diphosphonic acid, methylenediphosphonic acid, 1, 2-ethylenediphosphonic acid, 1, 3-propylenediphosphonic acid, 1, 4-butylenediphosphonic acid, 1, 5-pentylidenediphosphonic acid, and 1, 6-hexylenediphosphonic acid.
17. The cleaning agent composition according to claim 1 or 2, wherein the content of the components other than the components a to D is 0% by mass or more and 10% by mass or less.
18. A cleaning method comprising the step of cleaning an object to be cleaned having flux residue with the cleaning agent composition according to any one of claims 1 to 17.
19. The cleaning method according to claim 18, wherein the object to be cleaned is an intermediate in manufacturing the soldered electronic parts.
20. The cleaning method according to claim 18 or 19, wherein the object to be cleaned has reflowed solder.
21. The cleaning method according to claim 18 or 19, wherein the flux is a rosin-based flux.
22. The cleaning method according to claim 18 or 19, wherein the object to be cleaned is cleaned with the cleaning agent composition by a method of contact in a bath of an ultrasonic cleaning apparatus or a method of contact by spraying the cleaning agent composition.
23. The cleaning method according to claim 18 or 19, comprising a step of washing with water and drying after contacting the object to be cleaned with the cleaning agent composition.
24. A method of manufacturing an electronic component, comprising:
At least one process selected from the group consisting of: a step of mounting at least one component selected from the group consisting of a semiconductor chip, a chip-type capacitor, and a circuit board on the circuit board by soldering using a flux, and a step of forming a solder bump for connecting the component on the circuit board; and
the cleaning method according to any one of claims 18 to 23, wherein at least one selected from the group consisting of a circuit board on which the component is mounted and a circuit board on which the solder bump is formed is cleaned.
25. Use of the cleaning agent composition according to any one of claims 1 to 17 as a flux cleaning agent for an object to be cleaned having flux residues.
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| JP2018228148 | 2018-12-05 | ||
| JP2018-228148 | 2018-12-05 | ||
| PCT/JP2019/047462 WO2020116524A1 (en) | 2018-12-05 | 2019-12-04 | Detergent composition for removing flux residues |
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| JP7006826B1 (en) | 2021-07-27 | 2022-01-24 | 荒川化学工業株式会社 | Detergent composition for lead-free solder flux, cleaning method for lead-free solder flux |
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| TW202028448A (en) | 2020-08-01 |
| CN113165093A (en) | 2021-07-23 |
| TWI825237B (en) | 2023-12-11 |
| JPWO2020116524A1 (en) | 2021-11-11 |
| WO2020116524A1 (en) | 2020-06-11 |
| KR20210099579A (en) | 2021-08-12 |
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