KR20110124980A - Cleaning agent composition for removing solder flux - Google Patents

Abstract

PURPOSE: A cleaning agent composition is provided to ensure excellent removal power of soldering flux residues and to prevent the corrosion of metals such as tin, lead, silver and alloy thereof. CONSTITUTION: A cleaning agent composition for removing solder flux comprises 0.05-10 weight% of an organic amine compound, 1-40 weight% of xylene, and 50-98.95 weight% of a glycol ether-based compound. The organic amine compound is a compound of chemical formula 1, a compound of chemical formula 2 or a mixture thereof. In chemical formula 1, R1 and R2 are respectively hydrogen, acetyl group, or C1-6 linear or branched alkyl group or alkanol group; R3 is a C1-6 linear or branched alkyl group or alkoxy group or C2-6 linear or branched alkene group; and n is 0 or 1.

Description

Cleaner composition for solder flux removal {CLEANING AGENT COMPOSITION FOR REMOVING SOLDER FLUX}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux removal detergent composition used in a soldering process in a flip chip packaging process in a semiconductor manufacturing process.

Flip chip packaging processes are widely used for the manufacture of small, lightweight electronic products. Flip chip packaging processes play an important role in reducing the size and packaging density of electronic components.

In general, a flip chip packaging process includes electrically bonding a semiconductor chip obtained in the previous process to a circuit board by soldering. Typically, a semiconductor chip is electrically coupled to a circuit board by solder bumps formed thereon.

The solder bumps are formed by reflowing the solder paste applied to the circuit board.

Solder pastes include solder powder and flux. The flux serves to improve the printability of the solder paste, reduce the oxide on the surface of the solder or the circuit board being soldered, and increase the wettability and spreadability of the solder.

Such fluxes are generally base resins such as rosin or derivatives thereof; Active agents such as organic acids and halides; And solvents and the like.

Since the flux may adversely affect the reliability and storage stability of the solder joint when remaining, a process for cleaning thereof is necessary after the soldering process.

Conventionally, fluorine-based or chlorine-based solvents, hydrocarbon-based or alcohol-based solvents, water and the like have been used as flux cleaners. However, fluorine-based and chlorine-based solvents have environmental problems and toxicity to the human body, hydrocarbon-based and alcohol-based solvents have toxicity and flammability problems, water is insufficient cleaning ability is no longer used.

Recently, through the Republic of Korea Patent Publication No. 2008-114718, Republic of Korea Patent Registration No. 805014 and Republic of Korea Patent Registration No. 907568, a number of technologies that have excellent flux cleaning power, but no problems of environmental pollution and toxicity have been proposed, but still solder There is a limit that flux residues and the like present on the bump surface are not completely removed.

It is an object of the present invention to provide a cleaning composition having excellent removal ability of solder flux residues.

It is another object of the present invention to provide a cleaning composition useful for preventing corrosion of metals such as tin, lead, silver, and alloys thereof used in a circuit board.

1. 0.05 to 10 weight percent organic amine compound; 1 to 40% by weight of xylene; And 50 to 98.95% by weight of a glycol ether-based compound.

2. According to the above 1, the organic amine compound is a compound of formula 1, a compound of formula 2 or a mixture thereof solder flux removal cleaning composition:

(Wherein R ₁ and R ₂ are each a hydrogen atom, an acetyl group, or a straight or branched chain alkyl or alkanol group having 1 to 6 carbon atoms; R ₃ is a straight or branched chain alkyl group having 1 to 6 carbon atoms) Or an alkoxy group or a straight or branched chain alkene group having 2 to 6 carbon atoms; n is 0 or 1),

(Wherein R ₄ , R ₅ , R ₆ and R ₇ each represent a hydrogen atom or a straight or branched chain alkyl group having 1 to 6 carbon atoms or a straight or branched chain alken group having 2 to 6 carbon atoms).

3. In the above 2, R ₃ is a straight-chain or branched chain alkyl group having 1 to 6 carbon atoms, the solder flux removal cleaning composition.

4. In the above 3, the compound of Formula 1 is mono-, di- or tri-ethanolamine; Mono-, di- or tri-propanolamine; Mono-, di- or tri-isopropanolamine; Butanolamine; Butyl monoethanolamine; Ethyl diethanolamine; N-methylaminoethanol; N-acetylethanolamine; Hydroxylamine; Cleaner composition for solder flux removal of at least one selected from the group consisting of tert-methylhydroxylamine and tert-butylhydroxylamine.

5. In the above 2, R ₄ , R ₅ , R ₆ and R ₇ is a solder flux removal cleaning composition, each of which is a linear alkyl group having 1 to 6 carbon atoms.

6. In the above 5, the compound of Formula 2 is tetramethylammonium hydroxide; Tetraethylmethylammonium hydroxide; Tetrapropylammonium hydroxide; And tetrabutylammonium hydroxide. The cleaning composition for solder flux removal of at least one member selected from the group consisting of tetrabutylammonium hydroxide.

7. according to the above 1, 2 to 10% by weight of an organic amine compound; 1 to 15% by weight of xylene; And 75 to 97% by weight of a glycol ether-based compound.

8. In the above 1, the glycol ether-based compound is mono-, di- or tri-ethylene glycol monomethyl ether; Mono-, di- or tri-ethylene glycol monoethyl ether; Mono-, di- or tri- ethylene glycol monobutyl ether; And at least one member selected from the group consisting of mono-, di- or tri-propylene glycol monomethyl ether.

The cleaning composition of the present invention completely removes various types of flux residues, such as those present in the form of residues on the surface of the solder bumps, those in the areas where the bumps are in contact with the circuit board, heat-modified fluxes, and ionic fluxes. can do.

In addition, the cleaning composition of the present invention is useful for preventing corrosion of metals such as tin, tin alloys, lead, lead alloys, silver and silver alloys used in circuit boards by cleanly removing various types of flux residues as described above.

The cleaning composition of the present invention allows the solder to be maintained for a long time by cleanly removing various types of flux residues as above.

The cleaning composition of the present invention does not degrade the adhesive force between the solder bumps and the circuit board, thereby contributing to the improvement of durability of the semiconductor component.

The cleaning composition of the present invention not only conforms to environmental regulations of the world, but also has an advantage of not being significantly harmful to a human body when preparing and using the cleaning composition.

1 is a SEM image of the solder bump surface before and after the cleaning composition (FIG. 1A) and after the treatment (FIG. 1B) of the cleaning composition according to one embodiment of the present invention.
Figure 2 is a SEM image of the solder bump surface after treating the cleaning composition according to a comparative example of the present invention.

The present invention includes organic amine compounds, xylenes and glycol ether-based compounds in a certain amount, so that the flux present in the form of residues on the surface of the solder bumps, the flux present in the contact portion of the bumps and the circuit board, the heat-modified flux, ionic form The present invention relates to a cleaning flux composition for removing solder flux, which can completely remove various flux residues such as flux, and is useful for preventing metal corrosion such as tin, lead, silver, or alloys thereof used in a circuit board.

Hereinafter, the present invention will be described in detail.

Detergent composition of the present invention is 0.05 to 10% by weight of the organic amine compound; 1 to 40% by weight of xylene; And 50 to 98.95% by weight of a glycol ether compound.

The organic amine compound serves to break the carbon bond of the organic matter contained in the flux. The basic part of the organic amine compound causes an acid-base reaction with the acidic rosin which is the main component of the flux, thereby weakening the adhesive strength of the flux.

The organic amine compound of the present invention may be a compound of formula 1, a compound of formula 2 or a mixture thereof:

[Formula 1]

(Wherein R ₁ and R ₂ are each a hydrogen atom, an acetyl group, or a straight or branched chain alkyl or alkanol group having 1 to 6 carbon atoms; R ₃ is a straight or branched chain alkyl group having 1 to 6 carbon atoms) Or an alkoxy group or a straight or branched chain alkene group having 2 to 6 carbon atoms; n is 0 or 1),

[Formula 2]

(Wherein R ₄ , R ₅ , R ₆ and R ₇ each represent a hydrogen atom or a straight or branched chain alkyl group having 1 to 6 carbon atoms or a straight or branched chain alken group having 2 to 6 carbon atoms).

The compound of formula (2) is superior to the solubility in the glycol ether-based compound described later than the compound of formula (1). Therefore, when the compound of formula 2 is used as the organic amine compound of the present invention (when the compound of formula 2 is used alone and the compound of formula 2 is mixed with the compound of formula 1), it is advantageous to achieve the effects of the present application. Do. This is because the compound of formula (2) is in salt form, so that it is more easily dissolved than the compound of formula (1), and can generate a larger amount of base ions (OH ⁻ ), thereby causing a more active acid-base reaction.

When using the compound of General formula (1), the compound whose R <_3> is a C1-C6 linear or branched alkyl group is preferable. Such compounds include mono-, di- or tri-ethanolamine; Mono-, di- or tri-propanolamine; Mono-, di- or tri-isopropanolamine; Butanolamine; Butyl monoethanolamine; Ethyl diethanolamine; N-methylaminoethanol; N-acetylethanolamine; Hydroxylamine and tert-methylhydroxylamine; At least one selected from the group consisting of tert-butylhydroxylamine is included.

In addition, when using the compound of General formula (2), the compound whose R <_4> , R <_5> , R <_6> and R <_7> are C1-C6 linear alkyl groups, respectively is preferable. Such compounds include tetramethylammonium hydroxide; Tetraethylmethylammonium hydroxide; Tetrapropylammonium hydroxide; And at least one selected from the group consisting of tetrabutylammonium hydroxide, of which tetramethylammonium hydroxide is particularly preferred.

The organic amine compound may be included in the amount of 0.05 to 10% by weight based on the total composition content, preferably 2 to 10% by weight. If the content of the organic amine compound is less than 0.05% by weight, the reactivity with the acidic substances contained in the flux, etc. may be insufficient, and the cleaning effect may be insufficient. If the content of the organic amine compound is greater than 10% by weight, the activity of the base is excessively increased, resulting in tin, tin Metal corrosion, such as alloys, lead, lead alloys, silver and silver alloys, may occur as well as the removed flux components may be reattached.

Xylene dissolves the rosin which is the main component of the flux well so that the flux can be easily removed, and the flux penetrates well at the interface between the solder component and the flux so that the flux can be easily separated and removed.

Xylene may be included 1 to 40% by weight based on the total composition content. Flux removal ability is excellent as it is included in a large amount within the range that does not affect the role of other essential ingredients, but it is preferable to include 1 to 15% by weight in consideration of environmental regulations or human health and economics, 5 to 10 It is more preferably included by weight.

If the content of xylene is less than 1% by weight, the flux removal force may be insufficient, and if it is more than 40% by weight, the adhesive and plastic parts used in the manufacturing process of the circuit board may be swelled or dissolved.

The glycol ether-based compound of the present invention allows the flux to dissolve well and prevents the various metals constituting the circuit board from corroding well. In addition, the activity of the amine ions derived from the organic amine compound is controlled to prevent metal corrosion by the amine. It also serves to improve the solubility of the flux in water to prevent reattachment of the flux removed by the detergent composition when water is used in the rinse process.

As the glycol ether-based compound, those conventionally used in the art to which the present invention pertains may be used without limitation, but are mono-, di- or tri-ethylene glycol monomethyl ether; Mono-, di- or tri-ethylene glycol monoethyl ether; Mono-, di- or tri-, ethylene glycol monobutyl ether; And one or more selected from the group consisting of mono-, di- or tri-propylene glycol monomethyl ether can be preferably used. Among the above compounds, propylene glycol monomethyl ether is more preferable.

The glycol ether-based compound may be included in an amount of 50 to 98.95% by weight, and 75 to 97% by weight, based on the total composition content in consideration of the content of other essential ingredients. If it is out of the above range, the removal force of various types of flux residues may be lowered or corrosion of various metals used in the circuit board may occur.

The detergent composition of the present invention can be prepared according to a conventional method, and the method of using the detergent composition of the present invention is also not limited to the specific one.

As a method of removing the flux of the solder using the cleaning composition of the present invention, for example, a method of directly depositing a circuit board containing the flux in the cleaning composition or an aqueous solution thereof, or cleaning the cleaning composition or an aqueous solution thereof in the circuit board containing the flux There may be a method of spraying, a method of brushing the circuit board containing the flux after contacting the cleaning composition or an aqueous solution thereof, and in addition, a conventional shower method, paddle method, bubble method, ultrasonic method and the like can be considered. Of course, a plurality of the above methods may be used in combination.

The conditions for use (temperature, time, etc.) of the cleaning composition of the present invention are not particularly limited, and may be appropriately selected depending on the content, concentration and type of flux to be removed. For example, the semiconductor flip chip packaging process may be performed at 20 to 80 ° C. for 1 to 30 minutes.

After the cleaning composition of the present invention is used, a rinsing process of further cleaning with water or an alcoholic solvent may be performed as necessary.

Fluxes that can be removed with the compositions of the present invention include, but are not limited to, those containing rosin based compositions and which must include certain components.

Flux also includes those formed on printed circuit boards, ceramic wiring boards, semiconductor devices, semiconductor device mounting boards, bumped TAB tapes, bumpless TAB tapes, semiconductor device mounted TAB tapes, leadframes, capacitors and resistors.

Hereinafter, preferred examples are provided to aid the understanding of the present invention, but these examples are merely illustrative of the present invention and are not intended to limit the scope of the appended claims. It is apparent to those skilled in the art that various changes and modifications can be made to the present invention, and such modifications and changes belong to the appended claims.

Examples and Comparative Examples

The components of Table 1 were mixed and stirred to prepare solder flux removal agents of Example 1-18 and Comparative Example 1-8, respectively.

Category (% by weight) Organoamine compounds Xylene Glycol ether compounds MEA MIPA TMAH G1 G2 G3 Example 1 2 - - 5 93 - - Example 2 5 - - 10 - 85 - Example 3 8 - - 5 - 87 Example 4 - 2 - 10 88 - - Example 5 - 5 - 5 - 90 - Example 6 - 8 - 10 - - 82 Example 7 - - 2 5 93 - - Example 8 - - 4 5 - 91 - Example 9 - - 4 5 - - 91 Example 10 - - 6 10 - 84 - Example 11 - - 6 10 84 - - Example 12 - - 8 20 - 72 - Example 13 - - 8 5 - 87 - Example 14 - - 8 10 - - 82 Example 15 2 5 - 10 83 - - Example 16 2 - 5 10 83 - - Example 17 - 2 5 5 88 - - Example 18 - 4 5 10 - 81 - Comparative Example 1 - - - 15 - 85 - Comparative Example 2 - - - 35 - 65 - Comparative Example 3 - - 12 5 - 83 - Comparative Example 4 - - 12 10 - - 78 Comparative Example 5 - - 5 45 - 50 - Comparative Example 6 2 - - - - 98 - Comparative Example 7 - - - 100 - - - Comparative Example 8 - - 100 - - - - In organic amine compounds, MEA represents monoethanolamine, MIPA represents monoisopropanolamine, and TMAH represents tetramethylammonium hydroxide, respectively.
In the glycol ether compound, G1 represents diethylene glycol monomethyl ether, G2 represents propylene glycol monomethyl ether, and G3 represents tripropylene glycol monomethyl ether, respectively.

Test Example

The flux composition (Indium, SC 5R) was applied onto the solder substrate and heat treated at 250 ° C. to reflow the solder. Solder bumps were formed on the substrate and flux residues were present on the bumps as determined by a 20-fold microscope (see FIG. 1A).

The substrate was cleaned with the cleaning composition of Examples 1-18 and Comparative Examples 1-8. The cleaning was performed twice. First, the substrate was immersed in the cleaning composition according to the above Examples and Comparative Examples for 5 minutes, and then the substrate was taken out and sprayed with the cleaning solution for 3 minutes using a spray equipment. The temperature of the cleaning liquid at the time of spray cleaning was 70 ° C., and the pressure of the spray was 0.3 PMa.

After two washing processes, a rinse process using water was performed.

Take a SEM photograph of the solder substrate after the rinsing process and based on the photograph, (1) the flux removal force on the bumps, (2) the flux removal force on the area where the bump and the circuit board contact, and (3) the corrosion resistance of the solder according to the following criteria: Evaluated. The results are shown in Table 2 below.

(1) flux removal on bumps

◎: flux is completely removed

○: excellent flux removed

×: flux remains

(2) Flux removal force at the part where bump and circuit board are in contact

◎: flux is completely removed

○: excellent flux removed

×: flux remains

(3) Corrosion of Solder

◎: Pit corrosion does not occur at all

○: Pit corrosion hardly occurs

×: Pit corrosion occurs

division Flux removal Corrosiveness of Solder Bump phase Where the bump and the substrate are in contact Example 1 ○ ○ ○ Example 2 ○ ○ ○ Example 3 ○ ○ ○ Example 4 ○ ○ ○ Example 5 ○ ○ ○ Example 6 ○ ○ ○ Example 7 ◎ ◎ ○ Example 8 ◎ ◎ ◎ Example 9 ◎ ◎ ○ Example 10 ◎ ◎ ◎ Example 11 ◎ ◎ ○ Example 12 ◎ ◎ ○ Example 13 ◎ ◎ ◎ Example 14 ◎ ◎ ○ Example 15 ○ ○ ○ Example 16 ◎ ◎ ◎ Example 17 ◎ ◎ ◎ Example 18 ◎ ◎ ◎ Comparative Example 1 ○ × ○ Comparative Example 2 ○ × ○ Comparative Example 3 ○ ◎ × Comparative Example 4 ○ ◎ × Comparative Example 5 ○ ○ × Comparative Example 6 ○ × × Comparative Example 7 ○ × × Comparative Example 8 × × ×

As shown in the above table, Example 1-18 containing a certain amount of organic amine compound, xylene and glycol ether-based compound according to the present invention showed an overall excellent flux removal ability compared to Comparative Example 1-8 and corrosion of solder The prevention was also excellent. In particular, the flux removal force at the part where the bump and the substrate contacted was excellent.

Among the examples, TMAH, a compound of Formula 2, was used as the organic amine compound. For example, in the case of cleaning with the cleaning solution of Example 8, as shown in the SEM photograph of FIG. Flux residues such as flux, heat-modified flux and ionic flux flux) and solder corrosion are very good.

For reference, in the case of washing with the cleaning liquid of Comparative Example 2, it is confirmed that a large amount of flux residue is present on the bump surface and its surroundings as shown in FIG.

Claims (8)

0.05 to 10 weight percent organic amine compound; 1 to 40% by weight of xylene; And 50 to 98.95% by weight of a glycol ether-based compound.
The cleaning composition of claim 1, wherein the organic amine compound is a compound of Formula 1, a compound of Formula 2, or a mixture thereof:
[Formula 1]

(Wherein R ₁ and R ₂ are each a hydrogen atom, an acetyl group, or a straight or branched chain alkyl or alkanol group having 1 to 6 carbon atoms; R ₃ is a straight or branched chain alkyl group having 1 to 6 carbon atoms) Or an alkoxy group or a straight or branched chain alkene group having 2 to 6 carbon atoms; n is 0 or 1),
(2)

(Wherein R ₄ , R ₅ , R ₆ and R ₇ each represent a hydrogen atom or a straight or branched chain alkyl group having 1 to 6 carbon atoms or a straight or branched chain alken group having 2 to 6 carbon atoms).
The cleaning composition for solder flux removal according to claim 2, wherein R ₃ is a linear or branched alkyl group having 1 to 6 carbon atoms.
The compound of claim 3, wherein the compound of formula 1 is mono-, di- or tri-ethanolamine; Mono-, di- or tri-propanolamine; Mono-, di- or tri-isopropanolamine; Butanolamine; Butyl monoethanolamine; Ethyl diethanolamine; N-methylaminoethanol; N-acetylethanolamine; Hydroxylamine; Cleaner composition for solder flux removal of at least one member selected from the group consisting of tert-methylhydroxylamine and tert-butylhydroxylamine.
The cleaning composition for solder flux removal according to claim 2, wherein R ₄ , R ₅ , R ₆ and R ₇ are each a linear alkyl group having 1 to 6 carbon atoms.
The compound of claim 5, wherein the compound of formula 2 is selected from the group consisting of tetramethylammonium hydroxide; Tetraethylmethylammonium hydroxide; Tetrapropylammonium hydroxide; And tetrabutylammonium hydroxide. The cleaning composition for solder flux removal of at least one member selected from the group consisting of tetrabutylammonium hydroxide.
The method according to claim 1, 2 to 10% by weight of the organic amine compound; 1 to 15% by weight of xylene; And 75 to 97% by weight of a glycol ether-based compound.
The method of claim 1, wherein the glycol ether compounds are mono-, di- or tri-ethylene glycol monomethyl ether; Mono-, di- or tri-ethylene glycol monoethyl ether; Mono-, di- or tri- ethylene glycol monobutyl ether; And at least one member selected from the group consisting of mono-, di- or tri-propylene glycol monomethyl ether.

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