KR20110137131A - Cleaning agent composition for removing solder flux - Google Patents

Abstract

PURPOSE: A cleaning composition for removing soldering flux is provided to prevent the corrosion of a highly accurate metal wire necessary to miniaturized process. CONSTITUTION: A cleaning composition for removing soldering flux contains 0.05-10wt% of organic amine compound, 1-40wt% of xylene, 35-98.85wt% of ketone based compound, and 0.1-15wt% of anticorrosive agent. The ketone based compound is selected from the group consisting of methyl ethyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, methyl butyl ketone, methyl n-amylketone, methylcyclopentenolon, ethyl cyclopanthenolon, 4-methylcyclohexanone, 2,3-pentanedione, 2,4-pentanedione, 2,5-hexanedione, and 2,3-butanedione.

Description

Cleaner composition for solder flux removal {CLEANING AGENT COMPOSITION FOR REMOVING SOLDER FLUX}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flux removal detergent composition used in a soldering process in a flip chip packaging process in a semiconductor manufacturing process.

Flip chip packaging processes are widely used for the manufacture of small, lightweight electronic products. Flip chip packaging processes play an important role in reducing the size and packaging density of electronic components.

In general, a flip chip packaging process includes electrically bonding a semiconductor chip obtained in the previous process to a circuit board by soldering. Typically, a semiconductor chip is electrically coupled to a circuit board by solder bumps formed thereon.

The solder bumps are formed by reflowing the solder paste applied to the circuit board.

Solder pastes include solder powder and flux. The flux serves to improve the printability of the solder paste, reduce the oxide on the surface of the solder or the circuit board being soldered, and increase the wettability and spreadability of the solder.

Such fluxes are generally base resins such as rosin or derivatives thereof; Active agents such as organic acids and halides; And solvents and the like.

Since the flux may adversely affect the reliability and storage stability of the solder joint when remaining, a process for cleaning thereof is necessary after the soldering process.

Conventionally, fluorine-based or chlorine-based solvents, hydrocarbon-based or alcohol-based solvents, water and the like have been used as flux cleaners. However, fluorine-based and chlorine-based solvents have environmental problems and toxicity to the human body, hydrocarbon-based and alcohol-based solvents have toxicity and flammability problems, water is insufficient cleaning ability is no longer used.

Recently, Korean Patent Publication No. 2008-114718, Republic of Korea Patent Registration No. 805014, and Republic of Korea Patent Registration No. 907568 have been proposed a number of technologies that have excellent flux cleaning power, but there is no problem of environmental pollution and toxicity, but solder bump Flux residues, etc. present on the surface are not completely removed, and the metal used for the circuit board is corroded.

It is an object of the present invention to provide a cleaning composition having excellent removal ability of solder flux residues.

It is another object of the present invention to provide a cleaning composition useful for preventing corrosion of metals such as tin, lead, silver, aluminum, and alloys thereof (including wiring) used in circuit boards.

1. 0.05 to 10 weight percent organic amine compound; 1 to 40% by weight of xylene; Ketone compound 35 to 98.85% by weight; And 0.1 to 15% by weight of a corrosion inhibitor.

2. According to the above 1, the organic amine compound is a compound of formula 1, a compound of formula 2 or a mixture thereof solder flux removal cleaning composition:

(Wherein R ₁ and R ₂ are each a hydrogen atom, an acetyl group, or a straight or branched chain alkyl or alkanol group having 1 to 6 carbon atoms; R ₃ is a straight or branched chain alkyl group having 1 to 6 carbon atoms) Or an alkoxy group or a straight or branched chain alkene group having 2 to 6 carbon atoms; n is 0 or 1),

(Wherein R ₄ , R ₅ , R ₆ and R ₇ each represent a hydrogen atom or a straight or branched chain alkyl group having 1 to 6 carbon atoms or a straight or branched chain alken group having 2 to 6 carbon atoms).

3. In the above 2, R ₃ is a straight-chain or branched chain alkyl group having 1 to 6 carbon atoms, the solder flux removal cleaning composition.

4. In the above 3, the compound of Formula 1 is mono-, di- or tri-ethanolamine; Mono-, di- or tri-propanolamine; Mono-, di- or tri-isopropanolamine; Butanolamine; Butyl monoethanolamine; Ethyl diethanolamine; N-methylaminoethanol; N-acetylethanolamine; Hydroxylamine; Cleaner composition for solder flux removal of at least one selected from the group consisting of tert-methylhydroxylamine and tert-butylhydroxylamine.

5. In the above 2, R ₄ , R ₅ , R ₆ and R ₇ is a solder flux removal cleaning composition, each of which is a linear alkyl group having 1 to 6 carbon atoms.

6. In the above 5, the compound of Formula 2 is tetramethylammonium hydroxide; Tetraethylmethylammonium hydroxide; Tetrapropylammonium hydroxide; And tetrabutylammonium hydroxide. The cleaning composition for solder flux removal of at least one member selected from the group consisting of tetrabutylammonium hydroxide.

7. according to the above 1, 2 to 10% by weight of an organic amine compound; 1 to 15% by weight of xylene; 65 to 96.5 weight% of a ketone compound; And 0.5 to 10% by weight of a corrosion inhibitor.

8. In the above 1, the ketone compound is methyl ethyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, methyl butyl ketone, methyl n- amyl ketone, methylcyclopentenolone, ethylcyclopentenolone, 4-methylcyclohexane Cleaner composition for solder flux removal of at least one selected from the group consisting of on, 2,3-pentanedione, 2,4-pentanedione, 2,5-hexanedione and 2,3-butanedione.

9. In the above 1, wherein the corrosion inhibitor is at least one member selected from the group consisting of an organic compound having an azole group, an aromatic hydroxy compound, a sugar alcohol compound and a sulfur-containing compound having a mercapto group.

10. In the above 9, the corrosion inhibitor is benzotriazole, tolytriazole, 4-methylimidazole, 5-hydroxymethyl-4-methylimidazole, 3-aminodiazole, catechol, lesosi Knol, quinoline, sorbitol, mannitol, threazole, xylitol, dithiodiglycerol, bis (2,3-dihydroxypropylthio) ethylene, 2-mercaptoethanol, 3-mercapto-1-propanol, thioglycerol, Cleaning composition for solder flux removal of at least one selected from the group consisting of thioglycolic acid, thioacetic acid and thiosalicylic acid.

The cleaning composition of the present invention can be used to prepare various types of flux residues, for example, flux present in the form of residues on the surface of solder bumps, flux present in the contact area between bumps and circuit boards, thermally modified fluxes, and ionic fluxes. It can be removed completely.

The cleaning composition of the present invention is useful for preventing corrosion of metal wiring such as aluminum or aluminum alloy formed on the circuit board as well as tin, lead, silver and alloys thereof used in the circuit board by including each component in an appropriate amount. In particular, it is particularly useful for preventing corrosion of high-precision metal wiring, which requires refinement.

In addition, the cleaning composition of the present invention is useful for preventing corrosion of metals such as tin, tin alloys, lead, lead alloys, silver and silver alloys used in circuit boards by cleanly removing various types of flux residues as described above.

The cleaning composition of the present invention allows the solder to be maintained for a long time by cleanly removing various types of flux residues as above.

The cleaning composition of the present invention does not inhibit the adhesion between the solder bumps and the circuit board, thereby contributing to the improvement of durability of the semiconductor component.

The cleaning composition of the present invention not only conforms to environmental regulations of the world, but also has an advantage of not being significantly harmful to a human body when preparing and using the cleaning composition.

1 is a SEM image of the solder bump surface before and after the cleaning composition (FIG. 1A) and after the treatment (FIG. 1B) of the cleaning composition according to one embodiment of the present invention.
Figure 2 is a SEM image of the solder bump surface after treating the cleaning composition according to a comparative example of the present invention.

The present invention includes organic amine compounds, xylenes, ketone-based compounds and corrosion inhibitors in a predetermined amount, so that the flux present in the form of residues on the surface of the solder bumps, the flux present at the contact portion of the bumps and the circuit board, the heat-modified flux, Solder flux removal cleaner that can completely remove various flux residues such as ionic fluxes and to prevent corrosion of metals such as tin, lead, silver, aluminum, and alloys thereof (including wiring) used in circuit boards. It relates to a composition.

Hereinafter, the present invention will be described in detail.

Detergent composition of the present invention is 0.05 to 10% by weight of the organic amine compound; 1 to 40% by weight of xylene; Ketone compound 35 to 98.85% by weight; And 0.1-15% by weight of corrosion inhibitor.

The organic amine compound serves to break the carbon bond of the organic matter contained in the flux. The basic part of the organic amine compound causes an acid-base reaction with the acidic rosin which is the main component of the flux, thereby weakening the adhesive strength of the flux.

The organic amine compound of the present invention may be a compound of formula 1, a compound of formula 2 or a mixture thereof:

[Formula 1]

(Wherein R ₁ and R ₂ are each a hydrogen atom, an acetyl group, or a straight or branched chain alkyl or alkanol group having 1 to 6 carbon atoms; R ₃ is a straight or branched chain alkyl group having 1 to 6 carbon atoms) Or an alkoxy group or a straight or branched chain alkene group having 2 to 6 carbon atoms; n is 0 or 1),

[Formula 2]

(Wherein R ₄ , R ₅ , R ₆ and R ₇ each represent a hydrogen atom or a straight or branched chain alkyl group having 1 to 6 carbon atoms or a straight or branched chain alken group having 2 to 6 carbon atoms).

The compound of formula (2) is superior to the solubility in the glycol ether-based compound described later than the compound of formula (1). Therefore, when the compound of formula 2 is used as the organic amine compound of the present invention (when the compound of formula 2 is used alone and the compound of formula 2 is mixed with the compound of formula 1), it is advantageous to achieve the effects of the present application. Do. This is because the compound of formula (2) is in salt form, so that it is more easily dissolved than the compound of formula (1), and can generate a larger amount of base ions (OH ⁻ ), thereby causing a more active acid-base reaction.

When using the compound of General formula (1), the compound whose R <_3> is a C1-C6 linear or branched alkyl group is preferable. Such compounds include mono-, di- or tri-ethanolamine; Mono-, di- or tri-propanolamine; Mono-, di- or tri-isopropanolamine; Butanolamine; Butyl monoethanolamine; Ethyl diethanolamine; N-methylaminoethanol; N-acetylethanolamine; Hydroxylamine and tert-methylhydroxylamine; At least one selected from the group consisting of tert-butylhydroxylamine is included.

In addition, when using the compound of General formula (2), the compound whose R <_4> , R <_5> , R <_6> and R <_7> are C1-C6 linear alkyl groups, respectively is preferable. Such compounds include tetramethylammonium hydroxide; Tetraethylmethylammonium hydroxide; Tetrapropylammonium hydroxide; And at least one selected from the group consisting of tetrabutylammonium hydroxide, of which tetramethylammonium hydroxide is particularly preferred.

The organic amine compound may be included in the amount of 0.05 to 10% by weight based on the total composition content, preferably 2 to 10% by weight. If the content of the organic amine compound is less than 0.05% by weight, the reactivity with the acidic substances contained in the flux, etc. may be insufficient, and the cleaning effect may be insufficient. If the content of the organic amine compound is greater than 10% by weight, the activity of the base is excessively increased, resulting in tin, tin Metal corrosion, such as alloys, lead, lead alloys, silver, silver alloys, aluminum and aluminum alloys, may occur as well as the removed flux components may be reattached.

Xylene dissolves the rosin which is the main component of the flux well so that the flux can be easily removed, and the flux penetrates well at the interface between the solder component and the flux so that the flux can be easily separated and removed.

Xylene may be included 1 to 40% by weight based on the total composition content. Flux removal ability is excellent as it is included in a large amount within the range that does not affect the role of other essential ingredients, but it is preferable to include 1 to 15% by weight in consideration of environmental regulations or human health and economics, 5 to 10 It is more preferably included by weight.

If the content of xylene is less than 1% by weight, the flux removal force may be insufficient, and if it is more than 40% by weight, the adhesive and plastic parts used in the manufacturing process of the circuit board may be swelled or dissolved.

Ketone-based compounds allow the flux to dissolve well and prevent the corrosion of various metals constituting the circuit board. In addition, the activity of the amine ions derived from the organic amine compound is controlled to prevent metal corrosion by the amine.

As the ketone-based compound, those conventionally used in the field of the present invention may be used without limitation, but methyl ethyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, methyl butyl ketone, methyl n-amyl ketone, methyl cyclopentenone, Preferably at least one selected from the group consisting of ethylcyclopentenolone, 4-methylcyclohexanone, 2,3-pentanedione, 2,4-pentanedione, 2,5-hexanedione and 2,3-butanedione Can be used. Of these compounds, methyl n-amyl ketone is more preferred.

The ketone compound may be included in an amount of 35 to 98.85% by weight and 65 to 96.5% by weight based on the total composition content in consideration of the content of other essential ingredients. If it is out of the above range, the removal force of various types of flux residues may be lowered or corrosion of various metals used in the circuit board may occur.

The corrosion inhibitor of the present invention prevents corrosion of metals (tin, lead and silver) used in the circuit board, and in particular, serves to prevent corrosion of metal wiring such as aluminum formed on the circuit board. Corrosion of metal wires, such as aluminum, reduces the wire width, reducing the amount of current, or breaking the wires, which can degrade circuit performance.

Preservatives may be used at least one selected from the group consisting of organic compounds having azole groups, aromatic hydroxy compounds, sugar alcohol compounds and sulfur-containing compounds having mercapto groups. Specifically, an organic compound having an azole group such as benzotriazole, tolytriazole, 4-methylimidazole, 5-hydroxymethyl-4-methylimidazole and 3-aminodiazole; Aromatic hydroxy compounds such as catechol, resorcinol and quinoline; Sugar alcohol compounds such as sorbitol, mannitol, threazole and xylitol; Dithiodiglycerol [S (CH ₂ CH (OH) CH ₂ (OH) ₂ ], bis (2,3-dihydroxypropylthio) ethylene [CH ₂ CH ₂ (SCH ₂ CH (OH) CH ₂ (OH)) ₂ ], 2-mercaptoethanol [HSCH ₂ CH ₂ (OH)], 3-mercapto-1-propanol [HSCH ₂ CH ₂ CH ₂ OH], thioglycerol [HSCH ₂ CH (OH) CH ₂ (OH) ], A sulfur-containing compound having a mercapto group such as thioglycolic acid [HSCH ₂ CO ₂ H], thioacetic acid and thiosalicylic acid can be used.

Considering the activity of the component on the content, it is preferable to use aromatic hydroxy compounds such as catechol, resorcinol and quinoline.

As the corrosion inhibitor is contained in a large amount within the range that does not affect the role of other essential components, the corrosion resistance of the metal is excellent, but considering the solubility, it is preferable to include 0.1 to 15% by weight, and includes 0.1 to 10% by weight. It is more preferable. However, depending on the types of corrosion inhibitors and physical properties such as solubility, the optimum content of each corrosion inhibitor may be slightly different within the above range. For example, since the solubility of the sugar alcohol compound and the aromatic hydroxy compound is superior to the organic compound having an azole group, the anticorrosive effect is better when the same content is used.

When the content of the corrosion inhibitor included in the composition of the present invention is less than 0.1% by weight, the corrosion protection effect of the metal wiring such as aluminum or aluminum alloy is insignificant, and when it exceeds 15% by weight, the corrosion inhibitor is precipitated to form a circuit board. Can be contaminated.

The detergent composition of the present invention can be prepared according to a conventional method, and the method of using the detergent composition of the present invention is also not limited to the specific one.

As a method of removing the flux of the solder using the cleaning composition of the present invention, for example, a method of directly depositing a circuit board containing the flux in the cleaning composition or an aqueous solution thereof, or cleaning the cleaning composition or an aqueous solution thereof in the circuit board containing the flux There may be a method of spraying, a method of brushing the circuit board containing the flux after contacting the cleaning composition or an aqueous solution thereof, and in addition, a conventional shower method, paddle method, bubble method, ultrasonic method and the like can be considered. Of course, a plurality of the above methods may be used in combination.

The conditions for use (temperature, time, etc.) of the cleaning composition of the present invention are not particularly limited, and may be appropriately selected depending on the content, concentration and type of flux to be removed. For example, the semiconductor flip chip packaging process may be performed at 20 to 80 ° C. for 1 to 30 minutes.

After the cleaning composition of the present invention is used, a rinsing process of further cleaning with water or an alcoholic solvent may be performed as necessary.

Fluxes that can be removed with the compositions of the present invention include, but are not limited to, those containing rosin based compositions and which must include certain components.

Flux also includes those formed on printed circuit boards, ceramic wiring boards, semiconductor devices, semiconductor device mounting boards, bumped TAB tapes, bumpless TAB tapes, semiconductor device mounted TAB tapes, leadframes, capacitors and resistors.

Hereinafter, preferred examples are provided to aid the understanding of the present invention, but these examples are merely illustrative of the present invention and are not intended to limit the scope of the appended claims. It is apparent to those skilled in the art that various changes and modifications can be made to the present invention, and such modifications and changes belong to the appended claims.

Examples and Comparative Examples

The components of Table 1 were mixed and stirred to prepare solder flux removal compositions of Examples 1-20 and Comparative Examples 1-8, respectively.

division
(weight%) Organoamine compounds Xylene Ketone compounds Corrosion inhibitor MEA MIPA TMAH K1 K2 K3 P1 P2 P3 P4 Example 1 2 - - 5 90 - - 3 - - - Example 2 5 - - 10 - 80 - - 5 - - Example 3 8 - - 5 - - 82 - - 5 - Example 4 5 - - 10 - 80 - - - - 5 Example 5 - 2 - 10 87.5 - - 0.5 - - - Example 6 - 5 - 5 - 83 - - 7 - - Example 7 - 8 - 10 - - 77 - - 5 - Example 8 - 5 - 5 - 80 - - - - 10 Example 9 - - 2 5 88 - - 5 - - - Example 10 - - 4 5 - 86 - - - 5 - Example 11 - - 4 5 - - 86 - - - 5 Example 12 - - 6 10 - 77 - - - 7 - Example 13 - - 6 10 79 - - 5 - - - Example 14 - - 8 20 - 65 - - 7 - - Example 15 - - 8 5 - 80 - - 7 - - Example 16 - - 8 10 - - 77 - 5 - - Example 17 2 5 - 10 80 - - 3 - - - Example 18 2 - 5 10 80 - - 3 - - - Example 19 - 2 5 5 85 - - 3 - - - Example 20 - 4 5 10 - 78 - - 3 - - Comparative Example 1 - - - 15 - 80 - - - 5 - Comparative Example 2 - - - 35 - 60 - - - 5 - Comparative Example 3 - - 12 5 - 80 - 3 - - - Comparative Example 4 - - 12 10 - - 75 3 - - - Comparative Example 5 2 - - - - 95 - 3 - - - Comparative Example 6 - - 5 10 - 65 - - - 20 - Comparative Example 7 - - - 100 - - - - - - - Comparative Example 8 - - 100 - - - - - - - - In organic amine compounds, MEA represents monoethanolamine, MIPA represents monoisopropanolamine, and TMAH represents tetramethylammonium hydroxide (based on solid content, 20% aqueous solution).
In ketone compounds, K 1 represents methyl isobutyl ketone, K 2 represents methyl n-amyl ketone, and K 3 represents 2,5-hexanedione.
In the corrosion inhibitors, P1 represents benzotriazole, P2 represents sorbitol, P3 represents catechol, and P4 represents thioglycerol.

Test Example

The flux composition (Indium, SC 5R) was applied onto the solder substrate and heat treated at 250 ° C. to reflow the solder. Solder bumps were formed on the substrate and flux residues were present on the bumps as determined by a 20-fold microscope (see FIG. 1A).

The substrate was cleaned with the cleaning composition of Examples 1-20 and Comparative Examples 1-8. The cleaning was performed twice. First, the substrate was immersed in the cleaning composition according to the above Examples and Comparative Examples for 5 minutes, and then the substrate was taken out and sprayed with the cleaning solution for 3 minutes using a spray equipment. The temperature of the cleaning liquid at the time of spray cleaning was 70 ° C., and the pressure of the spray was 0.3 PMa.

After two washing processes, a rinse process using water was performed.

Take a SEM photograph of the solder substrate after the rinsing process and based on the photograph, (1) the flux removal force on the bumps, (2) the flux removal force on the area where the bump and the circuit board contact, and (3) the corrosion resistance of the solder according to the following criteria: (4) The aluminum corrosiveness was measured by using an Al bare substrate with a 4-point probe to measure the etching rate of aluminum. (5) The solubility of the composition was based on the observer's eyes after sufficiently stirring the composition. It was evaluated according to whether or not there is a float. The results are shown in Table 2 below.

(1) flux removal on bumps

◎: flux is completely removed

○: excellent flux removed

×: flux remains

(2) Flux removal force at the part where bump and circuit board are in contact

◎: flux is completely removed

○: excellent flux removed

×: flux remains

(3) Corrosion of Solder

◎: Pit corrosion does not occur at all

○: Pit corrosion hardly occurs

×: Pit corrosion occurs

(4) corrosiveness of aluminum

◎: less than 50 μs / min

○: 50 Hz / min or more 100 Hz / min or less

×: 100 kPa / min or more

(5) solubility of the composition

○: no float

×: suspended solids

division Flux removal Corrosiveness of Solder Corrosive of Aluminum Solubility Bump phase Where the bump and the substrate are in contact Example 1 ○ ○ ○ ○ ○ Example 2 ◎ ○ ○ ○ ○ Example 3 ○ ○ ○ ◎ ○ Example 4 ○ ○ ○ ○ ○ Example 5 ○ ○ ○ ○ ○ Example 6 ◎ ○ ○ ○ ○ Example 7 ○ ○ ○ ◎ ○ Example 8 ○ ○ ○ ◎ ○ Example 9 ◎ ◎ ○ ○ ○ Example 10 ◎ ◎ ◎ ◎ ○ Example 11 ◎ ◎ ○ ○ ○ Example 12 ◎ ◎ ◎ ◎ ○ Example 13 ◎ ◎ ○ ○ ○ Example 14 ◎ ◎ ○ ○ ○ Example 15 ◎ ◎ ◎ ○ ○ Example 16 ◎ ◎ ○ ○ ○ Example 17 ○ ○ ○ ○ ○ Example 18 ◎ ○ ◎ ○ ○ Example 19 ◎ ◎ ◎ ○ ○ Example 20 ◎ ◎ ◎ ○ ○ Comparative Example 1 ○ × ○ ◎ ○ Comparative Example 2 ○ × ○ ◎ ○ Comparative Example 3 ○ ◎ × × ○ Comparative Example 4 ○ ◎ × × ○ Comparative Example 5 ○ × ○ ○ ○ Comparative Example 6 ○ ○ ◎ ◎ × Comparative Example 7 ○ × × × ○ Comparative Example 8 × × × × ○

As shown in the table, Example 1-20 containing a certain amount of the organic amine compound, xylene, glycol ether-based compound and the corrosion inhibitor according to the present invention showed an overall excellent flux removal ability compared to Comparative Example 1-8 The corrosion resistance of the solder and aluminum was also excellent. In particular, the flux removal force at the part where the bump and the substrate contacted was excellent.

Among the examples, an example using TMAH, which is a compound of Formula 2, as an organic amine compound was better. For example, in the case of cleaning with the cleaning solution of Example 10, as shown in the SEM photograph of FIG. Flux residues such as flux, heat-modified flux and ionic flux flux) and solder corrosion are very good. In addition, when catechol, an aromatic hydroxy compound, was used as a corrosion inhibitor, corrosion resistance of aluminum was very excellent.

For reference, in the case of washing with the cleaning liquid of Comparative Example 2, it is confirmed that a large amount of flux residue is present on the bump surface and its surroundings as shown in FIG.

Claims (10)

0.05 to 10 weight percent organic amine compound; 1 to 40% by weight of xylene; Ketone compound 35 to 98.85% by weight; And 0.1 to 15% by weight of a corrosion inhibitor.
The cleaning composition of claim 1, wherein the organic amine compound is a compound of Formula 1, a compound of Formula 2, or a mixture thereof:
[Formula 1]

(Wherein R ₁ and R ₂ are each a hydrogen atom, an acetyl group, or a straight or branched chain alkyl or alkanol group having 1 to 6 carbon atoms; R ₃ is a straight or branched chain alkyl group having 1 to 6 carbon atoms) Or an alkoxy group or a straight or branched chain alkene group having 2 to 6 carbon atoms; n is 0 or 1),
(2)

(Wherein R ₄ , R ₅ , R ₆ and R ₇ each represent a hydrogen atom or a straight or branched chain alkyl group having 1 to 6 carbon atoms or a straight or branched chain alken group having 2 to 6 carbon atoms).
The cleaning composition for solder flux removal according to claim 2, wherein R ₃ is a linear or branched alkyl group having 1 to 6 carbon atoms.
The compound of claim 3, wherein the compound of formula 1 is mono-, di- or tri-ethanolamine; Mono-, di- or tri-propanolamine; Mono-, di- or tri-isopropanolamine; Butanolamine; Butyl monoethanolamine; Ethyl diethanolamine; N-methylaminoethanol; N-acetylethanolamine; Hydroxylamine; Cleaner composition for solder flux removal of at least one member selected from the group consisting of tert-methylhydroxylamine and tert-butylhydroxylamine.
The cleaning composition for solder flux removal according to claim 2, wherein R ₄ , R ₅ , R ₆ and R ₇ are each a linear alkyl group having 1 to 6 carbon atoms.
The compound of claim 5, wherein the compound of formula 2 is selected from the group consisting of tetramethylammonium hydroxide; Tetraethylmethylammonium hydroxide; Tetrapropylammonium hydroxide; And tetrabutylammonium hydroxide. The cleaning composition for solder flux removal of at least one member selected from the group consisting of tetrabutylammonium hydroxide.
The method according to claim 1, 2 to 10% by weight of the organic amine compound; 1 to 15% by weight of xylene; 65 to 96.5 weight% of a ketone compound; And 0.5 to 10% by weight of a corrosion inhibitor.
The method of claim 1, wherein the ketone compound is methyl ethyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, methyl butyl ketone, methyl n- amyl ketone, methylcyclopentenone, ethylcyclopentenolone, 4-methylcyclohexanone, Cleaner composition for solder flux removal of at least one selected from the group consisting of 2,3-pentanedione, 2,4-pentanedione, 2,5-hexanedione and 2,3-butanedione.
The cleaning composition for solder flux removal according to claim 1, wherein the corrosion inhibitor is at least one selected from the group consisting of an azole group-containing organic compound, an aromatic hydroxy compound, a sugar alcohol compound, and a mercapto group-containing sulfur compound.
The method of claim 9, wherein the corrosion inhibitor is benzotriazole, tolytriazole, 4-methylimidazole, 5-hydroxymethyl-4-methylimidazole, 3-aminodiazole, catechol, resorcinol, Quinoline, sorbitol, mannitol, threazole, xylitol, dithiodiglycerol, bis (2,3-dihydroxypropylthio) ethylene, 2-mercaptoethanol, 3-mercapto-1-propanol, thioglycerol, thioglycol Cleaning composition for solder flux removal of at least one selected from the group consisting of acid, thioacetic acid and thiosalicylic acid.

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