JP5152816B2 - Cleaning method - Google Patents

Description

The present invention relates to a method for cleaning an object to be cleaned, and more particularly, to a method for cleaning an object to be cleaned using a dual-purpose cleaning agent capable of simultaneously cleaning a solder flux and a dry film resist.

Conventionally, glycol compounds have been frequently used as a main component as flux cleaning agents and coating film peeling cleaning agents used in the field of electronic materials, but cleaning agents mainly containing monoalcohol solvents are also known.
For example, a cleaning composition capable of cleaning a water-insoluble polymer such as a protective coating has been proposed (for example, Patent Document 1). More specifically, an acrylic polymer protective coating film as a rust preventive material, (A) 5 to 95 parts by weight of specific amines, and (B) 0.2 to 50 parts by weight of benzyl alcohol and the like. (C) The method of wash | cleaning using the detergent composition comprised from 0.1-80 weight part of specific surfactant was proposed.

In addition, a cleaning agent that is safe to handle, can wash various solid contaminants such as flux, and can be rinsed with water has been proposed (for example, Patent Document 2). More specifically, (A) benzyl alcohol is 50 to 70% by weight, (B) a specific water-soluble glycol ether is 20 to 40% by weight, and (C) a specific surfactant is 1 to 20% by weight. (D) The industrial cleaning agent comprised from 5 to 20 weight% of water is proposed.
Furthermore, a cleaning agent that has excellent removability such as rosin flux, is hardly deteriorated, and has excellent wastewater treatment properties has been proposed (for example, Patent Document 3). More specifically, there has been proposed a cleaning agent comprising (A) 70% by weight or more of benzyl alcohol or 2-phenylethyl alcohol and (B) 0.01 to 30% by weight of a specific surfactant. Yes.

On the other hand, a flip chip mounting method with improved workability has been proposed (for example, Patent Document 4). More specifically, after forming the solder resist at a predetermined position of the flip chip mounting area of the circuit board, after performing the reflow process and soldering the IC chip, the solder resist is removed simultaneously with the cleaning of the flux, Further, a flip chip mounting method for applying a resin coating process has been proposed.
JP-A-63-69897 JP 2000-8080 A Japanese Patent Laid-Open No. 3-140486 JP-A-5-326630

However, all of the cleaning agents proposed in Patent Documents 1 to 3 are not sufficient for cleaning the solder flux, and it is difficult to clean the dry film resist at the same time.
More specifically, the cleaning composition disclosed in Patent Document 1 has a small amount of benzyl alcohol added, and as a cleaning agent for solder flux and dry film resist, the cleaning property is insufficient. There was a problem that white residue was likely to remain on the top. On the other hand, since a relatively large amount of amines is added, there has been a problem that the substrate, which is the object to be cleaned, is easily affected. Furthermore, since a predetermined amount of surfactant has to be added, there is also a problem that the surfactant tends to remain on the substrate surface in the rinsing step, and the dielectric characteristics are likely to deteriorate.
Moreover, since the cleaning agent proposed in Patent Document 2 uses benzyl alcohol, a specific water-soluble glycol ether, and a specific surfactant as main components, it is a solder flux and a dry film resist cleaning agent. As a result, there has been a problem that each of the cleaning properties is similarly insufficient, or when an alcohol solvent is used, the rinsing property in the rinsing process is low.
Furthermore, since the cleaning method for electronic components proposed in Patent Document 3 uses benzyl alcohol and a surfactant as main components, the cleaning properties of solder flux and dry film resist are not clean. There was a problem that it was sufficient or the rinsing property in the rinsing process using an alcohol solvent was low.

  On the other hand, the flip chip mounting method proposed in Patent Document 4 does not specifically disclose any cleaning agent for removing the solder resist simultaneously with the flux cleaning, and can be carried out as it is. The problem of not being able to be seen was seen.

Therefore, the inventors of the present invention have intensively studied, and as a result, by using a specific alcohol solvent, an amino alcohol as an amine compound , water, and a glycol compound in combination at a predetermined ratio, solder flux and The inventors have found that a dry film resist can be simultaneously cleaned and completed the present invention.
That is, the present invention aims to provide a method for cleaning an object to be cleaned using a dual-purpose cleaning agent that is optimal for simultaneous cleaning of a solder flux and a dry film resist and has excellent cleaning properties and rinsing characteristics. Yes.

According to the present invention, a method for cleaning an object to be cleaned using a dual-purpose cleaning agent capable of simultaneously cleaning a solder flux and a dry film resist,
The amount of benzyl alcohol added is within a range of 5 to 94% by weight , the amino alcohol as an amine compound is within a range of 1 to 50% by weight, and water is 3 to 90% by weight with respect to the total amount. A step of preparing a dual-use cleaning agent having a value within the range of
Using dual wash cleaning agent, a step of simultaneously cleaning the披cleaning product solder flux and a dry film resist is attached at a temperature range of 10 to 80 ° C.,
The washing | cleaning method of the washing | cleaning thing characterized by including is provided, and the problem mentioned above can be solved.
That is, according to the cleaning method of the cleaning object of the present invention, the solder flux and the dry film resist are obtained by using a predetermined dual-purpose cleaning agent containing a predetermined amount of benzyl alcohol, amino alcohol , and water. When performing simultaneous cleaning, each of them exhibits excellent detergency and also exhibits excellent rinsing characteristics in rinsing using an alcohol solvent in the next step.
Note that the simultaneous cleaning of the solder flux and the dry film resist means that the time until the solder flux cleaning is completed is T1, and the time until the dry film resist cleaning is T2 is the same cleaning liquid. The index represented by T1 / T2 × 100 is preferably in the range of 10 to 800%, more preferably in the range of 20 to 500%, and in the range of 30 to 300%. Further preferred.

In carrying out the method for cleaning an object to be cleaned according to the present invention, the amphoteric cleaning agent further contains a glycol compound, and the addition amount of the glycol compound is within the range of 1 to 30% by weight based on the total amount. It is preferable to set the value of.
By including a predetermined amount of glycol compound in this way, it is possible to easily adjust the solubility parameter of the cleaning agent, and to exhibit excellent detergency, rinse characteristics and stability for various solder fluxes, respectively. Can do. Furthermore, by adding such a glycol compound, it is possible to further reduce the dielectric loss on the surface of the substrate as an object to be cleaned, and to easily ensure a predetermined electrical insulation.

In carrying out the method for cleaning an object to be cleaned of the present invention, the amphoteric cleaning agent further contains a surfactant, and the added amount of the surfactant is 1 to 30% by weight based on the total amount. A value within the range is preferable.
By including a predetermined amount of the surfactant as described above, it becomes easy to emulsify even at room temperature, and it becomes easy to visually determine the change in blending and deterioration of the cleaning liquid. Further, by emulsifying the cleaning agent for both, depending on the type of the flux or the dry film resist, the cleaning property can be further improved.

In carrying out the method for cleaning an object to be cleaned of the present invention, it is preferable to set the electric conductivity of the cleaning agent for both to a value within the range of 1 to 250 μS / cm.
By limiting the electric conductivity to a predetermined range as described above, it becomes possible to quantitatively manage the cleaning of the soldering flux and the resist material, and stable cleaning properties can be exhibited for each. Further, by limiting the electric conductivity to a predetermined range, it is possible to accurately determine the degree of deterioration of the cleaning agent.

Moreover, when implementing the washing | cleaning method of the to-be-washed | cleaned material of this invention, it is preferable that a detergent for both uses is an emulsion state at room temperature (25 degreeC).
Thus, it becomes easy to judge the mixing | blending change and deterioration of a washing | cleaning liquid visually by using an emulsion at room temperature (25 degreeC). Further, by emulsifying the cleaning agent for both, depending on the type of the flux or the dry film resist, the cleaning property can be further improved.

Further, in carrying out the method for cleaning an object to be cleaned of the present invention, the method further includes a rinsing step for rinsing the object to be cleaned with an alcohol solvent or water as a rinsing liquid after the step of cleaning the object to be cleaned. Is preferred.
In this way, by using a predetermined dual-purpose cleaning agent and rinsing the object to be cleaned with an alcohol solvent, when the solder flux and the resist material are simultaneously cleaned, excellent cleaning properties are shown for each. In addition, excellent rinsing characteristics can be exhibited in the rinsing treatment using an alcohol solvent.

In carrying out the method for cleaning an object to be cleaned according to the present invention, it is preferable to use a lead-free solder flux or refractory solder flux mainly composed of rosin as a solder flux as an object to be cleaned.
Thus, by setting the kind of solder flux as a predetermined thing, while the outstanding wettability etc. are obtained, it can wash and remove easily and in a short time.

[First embodiment]
The first reference embodiment is a dual-use cleaning agent capable of simultaneously cleaning a solder flux and a dry film resist, wherein the amount of benzyl alcohol added is 5 to 94% by weight based on the total amount. It is a dual-use cleaning agent having a value within the range, a value within the range of 1 to 50% by weight of amino alcohol as the amine compound , and a value within the range of 3 to 90% by weight of water.
That is, even if benzyl alcohol is used alone, it is difficult to simultaneously wash the solder flux and the resist material adhering to the polyimide base material. However, by adding a predetermined amount of amino alcohol and water to benzyl alcohol, each synergistic effect is exhibited, and solder flux and dry film resist are simultaneously cleaned without deteriorating rinse characteristics. can do.
Therefore, as an example, the liquid state in the three-component dual-use cleaning agent at room temperature (25 ° C.) in FIG. As can be understood from the figure and the liquid state diagram of the three-component system cleaning agent at 60 ° C. in FIG. 2, it is characterized by being easily emulsified depending on the blending ratio and the environmental temperature.
Furthermore, as an example, the liquid state in the three-component dual-use cleaning agent at room temperature (25 ° C.) in FIG. 3 is the case where 5 wt% of an oleyl alcohol ethylene oxide 6 mol adduct is added to the dual-use cleaning agent. As can be understood from the figure and the liquid state diagram of the three-component dual-use cleaning agent at 60 ° C. in FIG. 4, it is characterized by being easily emulsified depending on the blending ratio and the environmental temperature.
Hereinafter, the components and the like of the dual-purpose cleaning agent will be specifically described.

1. Benzyl alcohol The amount of benzyl alcohol added is a value within a range of 5 to 94% by weight based on the total amount.
The reason for this is that when the amount of benzyl alcohol added is less than 5% by weight, the synergistic effect of the amino alcohol , water, and glycol compound as the amine compound is not exhibited, and the solder flux and resist material are sufficient. This is because it becomes difficult to clean. On the other hand, if the amount of benzyl alcohol added exceeds 94% by weight, the cleaning performance with respect to the soldering flux and the resist material may be decreased, or the rinse characteristics may be decreased.
Therefore, the amount of benzyl alcohol added is more preferably set to a value within the range of 50 to 90% by weight, and further preferably set to a value within the range of 60 to 85% by weight with respect to the total amount.
In addition, in FIG. 5, the influence of the addition amount of benzyl alcohol in a dual-purpose cleaning agent is shown. As can be easily understood from FIG. 5, the synergistic effect with other blending components is exhibited by setting the value within the range of the predetermined amount with respect to the total amount, and the solder flux and the resist material. , Can exhibit a predetermined detergency.

2. Amino alcohol as amine compound (1)
The type of amino alcohol as the amine compound is not particularly limited. For example, diethanolamine, triethanolamine, monoisopropanolamine, diisopropanolamine, triisopropanolamine, N-methylmonoethanolamine, N-ethylmonoethanol Amine, N-butylmonoethanolamine, N-methyldiethanolamine, N-ethyldiethanolamine, N-butyldiethanolamine, N-cyclohexyldiethanolamine, N, N-dimethylmonoethanolamine, N, N-diethylmonoethanolamine, N, N -Dibutylmonoethanolamine, aminomethylpropanol, aminoethylpropanediol, aminomethylpropanediol, aminobutanol, etc. It includes a combination of the above.
Further, among these aminoalcohols, diethanolamine, triethanolamine, N- methyldiethanolamine, and N- cyclohexyl diethanol amine is not only a low cost, requiring only the addition of relatively small amounts, than to exhibit excellent co cleanability More preferred amino alcohols .

It is also preferable to select the type of amino alcohol as the amine compound from the boiling point. That is, it is preferable to select an amino alcohol having a boiling point of 120 to 400 ° C.
The reason for this is that when the boiling point of the amino alcohol is less than 120 ° C., the flammability becomes high, and it becomes difficult to handle the obtained solder flux removing cleaning agent or excessively lower the cleaning temperature. This is because there is a case where it is not possible. On the other hand, when the boiling point of the amino alcohol exceeds 400 ° C., the simultaneous cleaning performance with respect to the soldering flux and the resist material may be deteriorated.
Therefore, it is more preferable to select an amino alcohol having a boiling point of 180 to 370 ° C.

(2) Addition amount Further, the addition amount of the amino alcohol as the amine compound is set to a value in the range of 1 to 50% by weight with respect to the total amount.
The reason for this is that when the amount of amino alcohol added is less than 1% by weight, the synergistic effect of benzyl alcohol, water, and glycol compound is not exerted, and the cleaning performance for solder flux and resist materials is improved. It is because it falls. Moreover, it is because the rinse characteristic in the rinse process using the alcohol solvent in the next process may fall when the addition amount of amino alcohol becomes a value less than 1 weight%.
On the other hand, if the amount of amino alcohol added exceeds 50% by weight, the cleaning effect on the solder flux and resist material may be reduced, or the substrate of the electronic component that is the adherend of the object to be cleaned may be affected. This is because there are cases.
Therefore, the addition amount of amino alcohol is more preferably set to a value within the range of 5 to 30% by weight and further preferably set to a value within the range of 10 to 20% by weight with respect to the total amount.

In addition, in FIG. 6, the influence of the addition amount of the amino alcohol as an amine compound in a dual-use cleaning agent is shown. As can be easily understood from FIG. 6, by making the value within the range of the predetermined amount with respect to the total amount, a synergistic effect with other compounding components is exhibited, and the solder flux and resist material are reduced. , Can exhibit a predetermined detergency.

3. Water Further, the amount of water added is a value within the range of 3 to 90% by weight with respect to the total amount.
This is because when the amount of water added is less than 3% by weight, the cleaning effect on the resist material may be significantly reduced. That is, the synergistic effect of benzyl alcohol, amino alcohol as an amine compound , water, and glycol compound is not exhibited, and the detergency of the resist material is lowered. On the other hand, if the amount of water added exceeds 90% by weight, the cleaning effect on the solder flux may be significantly reduced.
Therefore, the amount of water added is more preferably set to a value within the range of 5 to 50% by weight, and more preferably set to a value within the range of 10 to 30% by weight with respect to the total amount.

  FIG. 7 shows the influence of the amount of water added in the dual-use cleaning agent. As can be easily understood from FIG. 7, by making the amount of water added to a value within a predetermined range with respect to the total amount, a synergistic effect with other blending components is exhibited, and the solder flux and resist The material can exhibit a predetermined detergency.

4). Glycol compound (1) type It is also preferable to add a predetermined amount of glycol compound in the amphoteric detergent. And as a kind of glycol compound, it is preferable that it is a compound represented, for example by the following general formula (1) or the following general formula (2) and (3).
The reason for this is that by adding such a glycol compound, the solder flux and the resist material can be simultaneously cleaned by the synergistic effect of benzyl alcohol, amino alcohol as the amine compound , and water. .

(In the general formula (1), R ¹ is an alkyl group having 1 to 8 carbon atoms, the number of repetitions n is a natural number of 1-3.)

(In general formula (2), R ² is an alkyl group having 1 to 6 carbon atoms, and R ³ is hydrogen or a methyl group.)

(In General Formula (3), R ⁴ is an alkyl group having 1 to 3 carbon atoms, R ⁵ is hydrogen or a methyl group, and R ⁶ is an alkyl group having 1 to 2 carbon atoms.)

  Specifically, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monooctyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene Glycol monopropyl ether, triethylene glycol monobutyl ether, triethylene glycol monohexyl ether, triethylene glycol monooctyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol Butyl ether, propylene glycol monohexyl ether, propylene glycol monooctyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monohexyl ether, dipropylene glycol Monooctyl ether, tripropylene glycol monomethyl ether, tripropylene glycol monoethyl ether, tripropylene glycol monopropyl ether, tripropylene glycol monobutyl ether, tripropylene glycol monohexyl ether, tripropylene glycol monooctyl ether, diethylene glycol dimethyl ether Diethylene glycol diethyl ether, diethylene glycol dipropyl ether, diethylene glycol dibutyl ether, diethylene glycol dihexyl ether, diethylene glycol dioctyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dipropyl ether, triethylene glycol dibutyl ether, triethylene glycol dihexyl ether , Triethylene glycol dioctyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, propylene glycol dipropyl ether, propylene glycol dibutyl ether, propylene glycol dihexyl ether, propylene glycol dioctyl Ether, dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol dipropyl ether, dipropylene glycol dibutyl ether, dipropylene glycol dihexyl ether, dipropylene glycol dioctyl ether, tripropylene glycol dimethyl ether, tripropylene glycol diethyl ether, tripropylene glycol One kind or a combination of two or more kinds of propylene glycol dipropyl ether, tripropylene glycol dibutyl ether, tripropylene glycol dihexyl ether, tripropylene glycol dioctyl ether, etc. may be mentioned.

(2) Addition amount The addition amount of the glycol compound is set such that the addition amount of the glycol compound is within a range of 1 to 30% by weight with respect to the total amount.
The reason for this is that when the added amount of the glycol compound is less than 1% by weight, the synergistic effect of benzyl alcohol, amino alcohol as the amine compound , and water is not exhibited, and the soldering flux or resist material is not affected. This is because the cleaning effect may be significantly reduced. On the other hand, when the amount of the glycol compound added is 30% by weight or more, the cleaning effect on the soldering flux or the like may be significantly reduced.
Therefore, the amount of glycol compound added is more preferably set to a value within the range of 2% by weight to 20% by weight relative to the total amount, and is set to a value within the range of 3% by weight to 15% by weight. Further preferred.
In addition, in FIG. 8, the influence of the addition amount of the glycol compound in a dual-purpose cleaning agent is shown. As can be easily understood from FIG. 8, a synergistic effect with other blending components is exhibited by setting the amount of glycol compound added to a value within a predetermined range (1 to 30% by weight) with respect to the total amount. Thus, predetermined detergency can be exhibited for the solder flux and the resist material.

5. Solubility parameter Moreover, it is preferable to make the solubility parameter of the detergent for both uses into the value within the range of 12-20.
The reason for this is that if the solubility parameter exceeds this range, the cleaning effect on the lead-free solder flux, the high melting point solder flux, or the like may be significantly reduced.
Therefore, it is more preferable to set the solubility parameter of the amphibious cleaning agent to a value within the range of 12 to 16 with respect to the total amount.

6). Electrical conductivity It is also preferable to set the electrical conductivity (room temperature) of the amphibious cleaning agent to a value in the range of 1 to 250 μS / cm.
The reason for this is that when the electric conductivity is less than 1 μS / cm, the cleaning effect on the lead-free solder flux, the high melting point solder flux, or the like may be significantly reduced. On the other hand, if the electrical conductivity exceeds 250 μS / cm, the substrate of the electronic component that is the adherend of the object to be cleaned may be affected.
Therefore, it is more preferable that the electric conductivity of the amphibious cleaning agent is set to a value within the range of 3 to 160 μS / cm, and further preferably set to a value within the range of 5 to 50 μS / cm.

7). Objects to be cleaned and flux As for the types of objects to be cleaned, not only soldered electronic parts and products, but also parts that are affected by flux even if not soldered can be suitably used. Accordingly, the type of the object to be cleaned is not particularly limited, but for example, a printed circuit board, a ceramic wiring board, a semiconductor element (including semiconductor parts such as BGA, CSP, PGA, and LGA), and a semiconductor element mounted. Specific examples include a substrate, a TAB tape with bumps, a TAB tape without bumps, a TAB tape with semiconductor elements, a lead frame, a capacitor, and a resistor.
In these soldered electronic parts and products, the type of solder flux used is not particularly limited. For example, lead-free solder flux, high melting point solder flux, or no-clean solder flux. Preferably, these solder fluxes are usually based on rosin, and include organic acid salts, glycidyl ether compounds, oxyacids, carboxylic acids (including dicarboxylic acids), anilides and thermosetting resins (e.g. This is because at least one compound of epoxy resin or thermosetting acrylic resin) is often added. Therefore, the dual-use cleaning agent of the present invention can exhibit excellent cleaning properties selectively with respect to these solder fluxes as well as normal solder fluxes.
In addition, because of its good solubility in benzyl alcohol and amino alcohol as an amine compound, a compound in which a part or all of rosin is hydrogenated is used as a direct target when washing solder flux. It is also preferable.
Furthermore, even if it is a non-cleaning solder flux, when it is desired to obtain higher electric corrosion resistance, it can be a direct object at the time of cleaning.

The type of high melting point solder, lead-free solder, or no-clean solder to which a flux that is a direct object is added is not particularly limited. For example, Sn-Ag, Sn-Ag Typical examples include -Cu system, Sn-Cu system, Sn-Zn system, Sn-Bi system, and Pb-Sn system.
In addition, the type of resist material used in soldered electronic parts and products is not particularly limited. For example, acrylic resin, novolac resin, resole resin, epoxy resin, silicone resin, etc. are the main components. The solder bump thick film resist material can be used as an object.
In order to effectively exert a synergistic effect of benzyl alcohol as a dual-purpose cleaning agent , amino alcohol as an amine compound , glycol compound, and water on an object, it is contained in a resist material. The amount of the amide compound added is preferably 10% by weight or less, more preferably 5% by weight or less based on the total amount.

8). Dry film resist The dry film resist used for the object to be cleaned is not particularly limited as long as it is a material that functions as a solder resist. Specifically, the dry film resist is as follows. Preferably there is.
That is, in the case of a positive-type photosensitive dry film, a resist composition that is decomposed by light irradiation is coated on a support film such as a release paper and heat-cured. The film may be provided with a photosensitive or non-photosensitive adhesive layer.
On the other hand, as a negative photosensitive composition, a conventionally known resist composition containing a photocurable resin, a photoreaction initiator and, if necessary, a photosensitizing dye is applied to a support film such as a release paper, What was heat-hardened can be used.
Moreover, in order to comprise a negative photosensitive composition, a photocurable resin is a photocurable resin which has a photosensitive group which can be bridge | crosslinked by light irradiation.
In addition, as thickness of a dry film resist, it is preferable that it is a value within the range of 5-300 micrometers, and it is more preferable that it is a value within the range of 10-200 micrometers.

[Second Embodiment]
The second embodiment is a method of cleaning an object to be cleaned using a dual-purpose cleaning agent capable of simultaneously cleaning a solder flux and a dry film resist, and adding benzyl alcohol to the total amount A dual-use cleaning agent in which the amount is 5 to 94% by weight , the amino alcohol as the amine compound is 1 to 50% by weight, and the water is 3 to 90% by weight. The process of preparing
Cleaning the object to be cleaned to which the solder flux and the dry film resist are adhered in a temperature range of 10 to 80 ° C., using the detergent for both purposes. This is a cleaning method.
Hereinafter, the cleaning method using the amphoteric cleaning agent will be specifically described for each step.

1. Adjustment process Prior to washing the object to be cleaned, add benzyl alcohol as the main component , amino alcohol as the amine compound , water, or glycol compound while weighing each in the container, and mix them uniformly. It is preferable to provide a step of adjusting the amphibious cleaner.
The contents of the dual-use cleaning agent are the same as in the first embodiment, but at this stage, at least one of the viscosity, dielectric loss, acid value, electrical conductivity, etc. of the dual-use cleaning agent is measured, It is preferable to confirm that it has uniform characteristics by limiting to a predetermined range.

2. Cleaning step This is a step of cleaning the soldered electronic parts and products using the adjusted amphoteric cleaner, and simultaneously cleaning and removing the solder flux and resist material adhering to them.
Here, as shown in FIG. 9, a cleaning tank 12 including an ultrasonic transducer 29 for ultrasonic cleaning, a circulation path 22, a liquid feed pump 24, a rinse tank 14, a drying tank 16, It is preferable that it is the washing | cleaning apparatus 10 provided with.
More specifically, the cleaning tank 12 includes a container (cleaning liquid) 20 for the object to be cleaned 23, an ultrasonic vibrator 29, a cleaning liquid stirring device (not shown), a heater 19 with a thermostat, and a cleaning liquid. It is preferable that the object to be cleaned 23 is efficiently cleaned by applying ultrasonic vibration to the cleaning liquid 21 which is constituted by a circulation path 22 for circulating the gas 21 and is stirred and circulated. Next, in the rinsing tank 14, the cleaning liquid 21 simultaneously cleaned with the solder flux and the resist material is removed from the object to be cleaned 23, and in the drying tank 16, the rinsing liquid 15 and the like are evaporated and completely removed. preferable.
In addition, it is preferable to wash | clean on 10 to 90 degreeC and the conditions for 0.5 to 30 minutes in washing | cleaning the to-be-washed | cleaned object.
This is because if a predetermined cleaning effect can be obtained under such conditions, deterioration of the solder flux removing cleaning agent can be effectively prevented.

3. Rinsing process This is the process of further rinsing the cleaned electronic parts and products. Here, it is preferable to use an alcohol solvent as the rinse liquid. The reason for this is that, compared with water, it can be dried at an early stage, and benzyl alcohol and amino alcohol as an amine compound can be sufficiently removed.
More specifically, as alcohol solvents, methyl alcohol, ethyl alcohol, propyl alcohol, isopropyl alcohol, butyl alcohol, isobutyl alcohol, t-butyl alcohol, s-butyl alcohol, amyl alcohol, 1-methoxy-2- It is preferable to use one kind of alcohol such as propanol or two or more kinds of alcohols.
Moreover, it is preferable to use an alcohol solvent to which a predetermined amount of water is added to these alcohols, and more specifically, water is added so as to be 40 to 70% by weight with respect to the total amount. It is preferable to use an alcohol solvent.

Further, as the rinsing conditions, it is more preferable that the rinsing treatment is carried out in two stages in a range of 10 to 40 ° C. and 1 to 30 minutes. This is because the residue of benzyl alcohol or amino alcohol as an amine compound is also reduced.
In addition, after a rinse process, it is more preferable to dry with hot air on the conditions of 40-100 degreeC and 1 to 30 minutes, for example.

  Hereinafter, the present invention will be described in detail with reference to examples. Needless to say, the scope of the present invention is not limited to the following description.

[Example 1]
1. Preparation and evaluation of cleaning agent (1) Evaluation of cleaning property First, a dry film resist (film thickness 70 μm, acrylic) was applied to the surface of a silicon wafer, and an opening of φ150 μm was formed on the silicon wafer electrode by exposure and development processing. . The formed opening was printed and filled with Eco Solder M705-GRN360-K2-V (Senju Metal Industries Co., Ltd. solder paste) using a squeegee, reflowed in a hot plate with a cover at 250 ° C., and tested. It was a piece.
It was immersed in a 300 ml beaker containing 200 g of a cleaning agent maintained at a temperature of 60 ° C., and washed while being stirred using a magnetic stirrer. After washing for a predetermined time, the test piece is taken out from the beaker, immersed in another beaker containing 200 g of an aqueous solution of 55% by weight of industrial ethanol as a rinsing solution, and stirred for 10 minutes using a magnetic stirrer. A rinse operation was performed. After the rinsing operation was performed twice in total, the test piece was dried for 10 minutes using an oven maintained at 80 ° C. Subsequently, the dried test piece was observed using a stereomicroscope (magnification 40 times), and the detergency was evaluated according to the following criteria.

(1) -1 Resist cleaning performance A: No residue after cleaning for 5 minutes.
○: No residue after washing for 10 minutes.
Δ: A little residue remains after washing for 10 minutes.
X: A large amount of residue remains after washing for 10 minutes.

(1) -2 Flux cleaning performance A: No residue after cleaning for 3 minutes.
○: No residue after washing for 5 minutes.
Δ: A little residue remains after washing for 5 minutes.
X: A large amount of residue remains after washing for 5 minutes.

(2) Solder Corrosion Eco Solder M705-GRN360-K2-V (Senju Metal Industry Co., Ltd. solder paste) is printed on a predetermined portion of the glass epoxy substrate using a metal mask, and a hot press with a cover at 250 ° C. -The test piece was reflowed in
It was immersed in a 300 ml beaker containing 200 g of a cleaning agent maintained at a temperature of 60 ° C. and washed while being stirred using a magnetic stirrer. After washing for a predetermined time, the test piece is taken out from the beaker, immersed in another beaker containing 200 g of an aqueous solution of 55% by weight of industrial ethanol as a rinsing solution, and stirred for 10 minutes using a magnetic stirrer. A rinse operation was performed. After the rinsing operation was performed twice in total, the test piece was dried for 10 minutes using an oven maintained at 80 ° C. Subsequently, the dried test piece was observed using a stereomicroscope (magnification 40), and solder corrosivity was evaluated in light of the following criteria.
A: No corrosion due to solder after cleaning for 60 minutes.
○: No corrosion due to solder after 30 minutes of cleaning.
Δ: Solder corrosion is slightly observed after 30 minutes of cleaning.
X: A large amount of corrosion is observed after washing for 30 minutes.

(3) pH
The cleaning agent having the composition of Example 1 shown in Table 1 was prepared, and the pH of the aqueous solution diluted 100 times with distilled water was adjusted to 25 ° C. using a pH meter M-8 (manufactured by Horiba, Ltd.). The measurement was performed under the following conditions.

[Examples 2 to 7]
In Examples 2 to 7, as shown in Table 1, except that benzyl alcohol, water, and a cleaning agent in which the mixing ratio of amino alcohol as an amine compound and the type of amino alcohol were changed were prepared, In the same manner as in Example 1, the cleaning property, solder corrosion property, and pH were measured and evaluated.

[Comparative Examples 1-4]
In Comparative Examples 1 to 4, as shown in Table 1, the blending ratio of benzyl alcohol, amino alcohol as an amine compound , glycol compound, and water is changed outside the scope of the present invention, or as an amine compound. The cleaning property, solder corrosion property, and pH were measured and evaluated in the same manner as in Example 1 except that a cleaning agent having the composition shown in Table 1 was prepared without using amino alcohol .
As a result, in Comparative Example 1, benzyl alcohol and amino alcohol are used together. However, since the amount of benzyl alcohol used is too small, the electrical conductivity is relatively high, but the resist cleaning time is long. The problem was seen.
In Comparative Example 2, benzyl alcohol and amino alcohol are used in combination, but since water is not used, the value of electrical conductivity is low, but the resist cleaning time is similarly long. It was seen.
Moreover, in the comparative example 3, the benzyl alcohol was not used at all and the problem that flux washability was scarce was seen.
Further, in Comparative Example 4, there was a problem that amino alcohol was not used at all, the value of electric conductivity was low, the resist cleaning time was long, and the flux cleaning property was lacking.

According to the cleaning method using the amphoteric cleaning agent of the present invention, a predetermined amount of benzyl alcohol, an amino alcohol as an amine compound , and water are contained in a predetermined ratio so that a solder flux and a resist material are obtained. In the case of simultaneous washing, it is possible to show excellent rinsing characteristics with respect to each, and also in rinsing using an alcohol solvent in the next step.
Therefore, soldering flux and resist materials can be easily and sufficiently short on electrical components such as in-vehicle boards that require high reliability and high frequency circuit boards that require high circuit characteristics. It can be removed in time.

FIG. 2 is a liquid state diagram of a ternary dual-use cleaning agent at room temperature (25 ° C.) (Part 1). FIG. 3 is a liquid state diagram in a three-component dual-use cleaning agent at 60 ° C. (No. 1). FIG. 2 is a liquid state diagram of a ternary dual-use cleaning agent at room temperature (25 ° C.) (part 2). FIG. 2 is a liquid state diagram in a three-component dual-use cleaning agent at 60 ° C. (No. 2). It is a figure provided in order to demonstrate the influence of the addition amount of benzyl alcohol in a dual-use cleaning agent. It is a figure provided in order to demonstrate the influence of the addition amount of the amino alcohol as an amine compound in a dual-use cleaning agent. It is a figure provided in order to demonstrate the influence of the addition amount of the water in a dual-use cleaning agent. It is a figure provided in order to demonstrate the influence of the addition amount of the glycol compound in a dual-use cleaning agent. It is a figure provided in order to demonstrate a washing | cleaning apparatus.

10: Cleaning device 12: Cleaning tank 14: Rinse tank 15: Rinse liquid 16: Drying tank 21: Cleaning liquid 22: Circulation path 28: Filter

Claims (8)

A method for cleaning an object to be cleaned using a dual-purpose cleaning agent capable of simultaneously cleaning a solder flux and a dry film resist,
The amount of benzyl alcohol added is within a range of 5 to 94% by weight , the amino alcohol as an amine compound is within a range of 1 to 50% by weight, and water is 3 to 90% by weight with respect to the total amount. A step of preparing a dual-use cleaning agent having a value within the range of
A step of simultaneously cleaning the object to be cleaned, to which the solder flux and the dry film resist are adhered, in a temperature range of 10 to 80 ° C., using the dual-use cleaning agent;
A method for cleaning an object to be cleaned. The amphoteric detergent further contains a glycol compound, and the addition amount of the glycol compound is set to a value within a range of 1 to 30% by weight with respect to the total amount. Cleaning method of the object to be cleaned. The amphibious cleaning agent further contains a surfactant, and the addition amount of the surfactant is set to a value within a range of 1 to 30% by weight with respect to the total amount. 3. A method for cleaning an object to be cleaned according to 2 . The method for cleaning an object to be cleaned according to any one of claims 1 to 3, wherein the electric conductivity of the dual-purpose cleaning agent is set to a value within a range of 1 to 250 µS / cm . The said washing | cleaning agent for both uses is an emulsion state in room temperature (25 degreeC), The washing | cleaning method of the to- be-cleaned object as described in any one of Claims 1-4 characterized by the above-mentioned . 6. The method according to claim 1 , further comprising a rinsing step for rinsing the object to be cleaned with an alcohol solvent or water as a rinsing liquid after the step of cleaning the object to be cleaned. The washing | cleaning method of the to-be-washed object of description. The object to be cleaned according to any one of claims 1 to 6, wherein a lead-free solder flux or a high-melting-point solder flux mainly composed of rosin is used as the solder flux as the solder flux. How to wash things. The method for cleaning an object to be cleaned according to any one of claims 1 to 7, wherein a solubility parameter of the amphoteric cleaning agent is set to a value within a range of 12 to 20.

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