TW202027993A - 保護膜形成用複合片、以及半導體晶片之製造方法 - Google Patents

保護膜形成用複合片、以及半導體晶片之製造方法 Download PDF

Info

Publication number
TW202027993A
TW202027993A TW108144085A TW108144085A TW202027993A TW 202027993 A TW202027993 A TW 202027993A TW 108144085 A TW108144085 A TW 108144085A TW 108144085 A TW108144085 A TW 108144085A TW 202027993 A TW202027993 A TW 202027993A
Authority
TW
Taiwan
Prior art keywords
protective film
forming
film
composite sheet
aforementioned
Prior art date
Application number
TW108144085A
Other languages
English (en)
Chinese (zh)
Inventor
小橋力也
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW202027993A publication Critical patent/TW202027993A/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/025—Electric or magnetic properties
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68377—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support with parts of the auxiliary support remaining in the finished device

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Dicing (AREA)
  • Adhesive Tapes (AREA)
TW108144085A 2018-12-05 2019-12-03 保護膜形成用複合片、以及半導體晶片之製造方法 TW202027993A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-228525 2018-12-05
JP2018228525 2018-12-05

Publications (1)

Publication Number Publication Date
TW202027993A true TW202027993A (zh) 2020-08-01

Family

ID=70973776

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108144085A TW202027993A (zh) 2018-12-05 2019-12-03 保護膜形成用複合片、以及半導體晶片之製造方法

Country Status (5)

Country Link
JP (1) JPWO2020116284A1 (fr)
KR (1) KR20210098995A (fr)
CN (1) CN113169126A (fr)
TW (1) TW202027993A (fr)
WO (1) WO2020116284A1 (fr)

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008280520A (ja) * 2007-04-11 2008-11-20 Furukawa Electric Co Ltd:The 半導体固定用粘着テープ
JP5686436B2 (ja) * 2011-03-31 2015-03-18 リンテック株式会社 粘着剤組成物及び粘着シート
JP5865044B2 (ja) * 2011-12-07 2016-02-17 リンテック株式会社 保護膜形成層付ダイシングシートおよびチップの製造方法
JP6077922B2 (ja) 2012-12-10 2017-02-08 日東電工株式会社 ダイシングテープ一体型接着シート、ダイシングテープ一体型接着シートを用いた半導体装置の製造方法、及び、半導体装置
SG11201807452UA (en) * 2016-03-04 2018-09-27 Lintec Corp Protective film-forming composite sheet
CN108884244B (zh) * 2016-04-28 2022-01-11 琳得科株式会社 保护膜形成用膜及保护膜形成用复合片
KR102259854B1 (ko) * 2016-07-26 2021-06-01 미쓰이 가가쿠 토세로 가부시키가이샤 반도체 장치의 제조 방법

Also Published As

Publication number Publication date
WO2020116284A1 (fr) 2020-06-11
KR20210098995A (ko) 2021-08-11
CN113169126A (zh) 2021-07-23
JPWO2020116284A1 (ja) 2021-10-21

Similar Documents

Publication Publication Date Title
JP6298226B1 (ja) 保護膜形成用複合シート
TWI733870B (zh) 保護膜形成用複合片
TW202028321A (zh) 熱硬化性保護膜形成用膜、保護膜形成用複合片、以及晶片之製造方法
TWI774672B (zh) 附有保護膜的半導體晶片的製造方法以及半導體裝置的製造方法
TWI743361B (zh) 樹脂膜形成用膜以及樹脂膜形成用複合片
TW202106502A (zh) 保護膜形成用複合片
TWI822915B (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
TWI764885B (zh) 保護膜形成用複合片
TW202025264A (zh) 保護膜形成用膜、保護膜形成用複合片、檢查方法以及辨識方法
TW201731996A (zh) 保護膜形成用複合片
TWI826601B (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
TWI822917B (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
TWI835938B (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
TWI721158B (zh) 保護膜形成用膜及保護膜形成用複合片
TW202027993A (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
JP7495355B2 (ja) 保護膜形成用複合シート、及び半導体チップの製造方法
TWI837233B (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
TW202031475A (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
JP7497297B2 (ja) 保護膜形成用複合シート、及び半導体チップの製造方法
TW202038319A (zh) 保護膜形成用複合片、以及半導體晶片之製造方法
TWI770021B (zh) 保護膜形成用複合片
TW202129777A (zh) 保護膜形成用複合片
TW202339960A (zh) 保護膜形成膜、保護膜形成用複合片、套件、以及保護膜形成膜之使用