TW202004083A - Lighting appliance which can suppress an occurrence of weak light emission from a light emitting device when a base on which the light emitting device is arranged is grounded - Google Patents
Lighting appliance which can suppress an occurrence of weak light emission from a light emitting device when a base on which the light emitting device is arranged is grounded Download PDFInfo
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Abstract
Description
本發明有關一種照明器具,特別是具有LED(Light Emitting Diode,發光二極體)元件等之發光元件的照明器具。The present invention relates to a lighting appliance, particularly a lighting appliance having a light emitting element such as an LED (Light Emitting Diode) element.
LED元件由於體積小且效率高,再加上使用壽命長,故使用作各種產品之光源。例如,各種以LED元件為光源之照明裝置(LED照明)已實用化。LED components are used as light sources for various products due to their small size, high efficiency, and long service life. For example, various lighting devices (LED lighting) using LED elements as light sources have been put into practical use.
就LED照明而言,已知有取代燈泡形螢光燈或白熾燈泡之燈泡形LED燈(LED燈泡)、或是設置於頂棚之吸頂燈或下照燈等照明器具。With regard to LED lighting, there are known light bulb-shaped LED lamps (LED bulbs) that replace bulb-shaped fluorescent lamps or incandescent bulbs, or ceiling-mounted ceiling lamps or downlights.
例如,具有LED元件之吸頂燈包含:金屬製器具本體,作為基座用;光源模組,配置於器具本體;透光外罩,以覆蓋住光源模組之方式裝設於器具本體;及電源電路,產生用以使光源模組發光之電力。光源模組具有:光源基板,形成有配線;及複數之LED元件,嵌裝在光源基板。 [先前技術文獻]For example, a ceiling lamp with LED elements includes: a metal appliance body used as a base; a light source module, which is arranged on the appliance body; a light-transmitting cover, which is installed on the appliance body in such a manner as to cover the light source module; and a power supply circuit , To generate power to make the light source module emit light. The light source module has: a light source substrate with wiring formed; and a plurality of LED elements embedded in the light source substrate. [Prior Technical Literature]
[專利文獻1]日本特開2012‐243479號公報[Patent Document 1] Japanese Unexamined Patent Publication No. 2012-243479
[發明欲解決之課題][Problem to be solved by invention]
在吸頂燈等之照明器具設置於頂棚等營造建材時,配置有光源模組之器具本體有時會接地連接。此時,在光源模組和器具本體兩者之間,有時會因為市售電電源之交流電壓與對地電壓的合成電壓而產生雜散電容。具體而言,形成在具有光源模組之光源基板的配線、和接地連接的器具本體兩者之間會產生雜散電容。When a lighting fixture such as a ceiling lamp is installed on a building material such as a ceiling, the body of the fixture equipped with a light source module may be grounded. At this time, stray capacitance may be generated between the light source module and the appliance body due to the combined voltage of the AC voltage of the commercially available electric power supply and the ground voltage. Specifically, stray capacitance is generated between the wiring formed on the light source substrate having the light source module and the appliance body connected to the ground.
此時,有時會將供給至電源線的市售電電源之50/60Hz的交流電壓、與對地電壓兩者之疊加電壓施加到光源模組與器具本體兩者之間,而在光源模組產生漏電流。其結果,即使藉由遙控器之控制使得吸頂燈熄滅,而停止從電源電路供給電力至光源模組,仍然會有因為上述雜散電容而產生於光源模組之漏電流流到LED元件以致LED元件微弱發光的情形。因此,即便認為已熄滅了吸頂燈,有時仍然會變成光源模組(LED元件)微弱發光而稍微點亮之狀態。At this time, the superimposed voltage of the 50/60 Hz AC voltage supplied to the power supply line of the commercial power supply and the ground voltage may be applied between the light source module and the appliance body. The group generates leakage current. As a result, even if the ceiling lamp is turned off by the control of the remote control and the power supply from the power supply circuit to the light source module is stopped, the leakage current generated by the light source module due to the above stray capacitance will still flow to the LED element so that the LED The case where the element glows faintly. Therefore, even if it is considered that the ceiling lamp has been extinguished, the light source module (LED element) may be weakly lit and slightly lit.
以往,為了抑制此種LED元件之微弱發光,有人提出一種將和LED元件並列連接之電容器嵌裝在光源模組的方法(專利文獻1)。藉由此方法,即使在接地連接的器具本體與光源模組兩者之間產生雜散電容而產生了漏電流,由於可使得漏電流往電容器這一邊流通,因此仍然可避免漏電流流到LED元件那一邊。藉此,可抑制LED元件微弱發光。In the past, in order to suppress the faint light emission of such an LED element, a method of embedding a capacitor connected in parallel with the LED element in a light source module has been proposed (Patent Document 1). By this method, even if stray capacitance is generated between the grounded appliance body and the light source module to generate a leakage current, since the leakage current can flow to the capacitor side, the leakage current can still be prevented from flowing to the LED The component side. With this, weak emission of the LED element can be suppressed.
然而,專利文獻1所揭示之技術,即便是器具本體未接地連接之情形,也會在光源模組嵌裝微弱發光對策用電容器。亦即,在器具本體未接地連接之情形,微弱發光對策用電容器便沒有用處,而導致光源模組存在餘贅設計。因此,吾人可思考:只有在器具本體採用接地連接之規格的情形,才搭載嵌裝了微弱發光對策用電容器之光源模組。然而,由於會因為器具本體是否接地連接更改光源模組,故產生照明器具之組裝作業變得繁雜等課題。另外,在光源模組嵌裝微弱發光對策用電容器之方法中,必須依照明器具之每個種類或每個發送地逐一更改光源模組,更導致光源模組之通用化難以達成。However, the technology disclosed in
例如,在欲將以器具本體未接地連接為前提的日本國內市場規格之照明器具推廣至器具本體接地連接的海外市場時,以往為了抑制照明器具於該海外市場被設置時發生光源模組(LED元件)微弱發光之情形,有必要設計已施加微弱發光對策的海外市場規格之光源模組。因此,日本國內市場規格之照明器具與海外市場規格之照明器具兩者無法使用共通的光源模組,而無法達成光源模組之通用化。For example, when a lighting appliance of the Japanese domestic market that is premised on the premise that the appliance body is not connected to the ground is to be extended to an overseas market where the appliance body is connected to the ground, in the past, in order to suppress the occurrence of the light source module (LED Components) In the case of weak light emission, it is necessary to design light source modules of overseas market specifications that have imposed weak light emission measures. Therefore, the common light source module cannot be used for both the domestic market-specification lighting fixtures and the overseas market-specification lighting fixtures, and the generalization of the light source module cannot be achieved.
本發明係為了解決此種問題而完成,其目的為:提供一種照明器具,即使對於光源模組等之發光裝置未施加微弱發光對策,仍然可在配置有發光裝置之基座進行接地連接時抑制發光裝置出現微弱發光之情況。 [解決課題之手段]The present invention has been completed to solve this problem, and its object is to provide a lighting fixture that can be suppressed even when a light emitting device such as a light source module is not subjected to weak light emission countermeasures when the base of the light emitting device is grounded The light-emitting device is weakly emitting light. [Means to solve the problem]
為了達成上述目的,依本發明的照明器具之一態樣為一種照明器具,其裝設於被安裝部,包含基座、以及配置於該基座之發光裝置,在該照明器具被裝設於該被安裝部時,該基座進行接地連接,並且該發光裝置與該基座彼此隔開。 [發明之效果]In order to achieve the above object, one aspect of the lighting fixture according to the present invention is a lighting fixture, which is installed on a mounted portion, includes a base, and a light-emitting device disposed on the base, where the lighting fixture is installed on When the part is to be mounted, the base is grounded, and the light emitting device and the base are separated from each other. [Effect of invention]
依本發明,即便對於發光裝置未施加微弱發光對策,仍可在配置有發光裝置之基座進行接地連接時抑制發光裝置產生微弱發光。According to the present invention, even if no countermeasure against weak light emission is applied to the light emitting device, it is possible to suppress the weak light emission of the light emitting device when the base on which the light emitting device is disposed is grounded.
以下,針對本發明之實施態樣,一面參照圖式一面進行說明。以下說明之實施態樣任一者均是顯示本發明之一具體例者。因此,在以下之實施態樣所示的數值、形狀、材料、構成要素、構成要素之配置位置及連接態樣等只是一例,並非旨在限定本發明。因此,以下實施態樣中之構成要素當中,未記載於顯示本發明最上位概念之獨立請求項的構成要素,係作為任意之構成要素來進行說明。Hereinafter, the embodiment of the present invention will be described with reference to the drawings. Any of the embodiments described below is a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection aspects of the constituent elements shown in the following embodiments are only examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, the constituent elements that are not described in the independent claim that shows the most general concept of the present invention are described as arbitrary constituent elements.
又,各圖式為示意圖,並不絕對是嚴密地圖示而得者。在各圖式中,對於實質上相同之構成標註同一符號,而省略重複之說明或加以簡略化。In addition, each drawing is a schematic diagram, and it is not necessarily a strict illustration. In each drawing, the substantially same configuration is denoted by the same symbol, and repeated description is omitted or simplified.
又,在本說明書及圖式中,X軸、Y軸及Z軸表示三維垂直座標系之三個軸,並且在本實施態樣中,以Z軸方向為鉛直方向,以和Z軸垂直之方向(和XY平面平行之方向)為水平方向。X軸與Y軸互相垂直,且任一者皆是和Z軸垂直的軸。另外,以Z軸方向之正方向為鉛直下方。In this specification and drawings, the X-axis, Y-axis, and Z-axis represent three axes of the three-dimensional vertical coordinate system. In this embodiment, the Z-axis direction is the vertical direction, and the Z-axis is perpendicular to the Z-axis. The direction (the direction parallel to the XY plane) is the horizontal direction. The X axis and the Y axis are perpendicular to each other, and either of them is an axis perpendicular to the Z axis. In addition, the positive direction of the Z-axis direction is vertically downward.
(實施態樣)
接著,針對依實施態樣的照明器具1之構成,使用圖1~圖4進行說明。圖1係依實施態樣的照明器具1之外觀圖。圖2係同照明器具1之分解立體圖。圖3係將同照明器具1設置於頂棚2時之半剖面圖。圖4係同照明器具1之部分放大剖面圖。又,圖3及圖4僅圖示了照明器具1之剖面部分。(Implementation)
Next, the configuration of the
圖1所示之照明器具1裝設於住宅或店舖等建築物中之營造建材等被安裝部。本實施態樣之照明器具1為吸頂燈,且如圖3所示,設置於作為被安裝部之頂棚2。具體而言,照明器具1係藉由裝設於頂棚2上所設之懸掛式吸頂燈座主體2a以設置於頂棚2。懸掛式吸頂燈座主體2a係用以供電至照明器具1之供電部,在例如頂棚2之內側藉由電線等而電性連接於市售電電源(系統電源)。照明器具1藉由裝設在懸掛式吸頂燈座主體2a,可接收來自於市售電電源之電力。The
如圖1~圖4所示,本實施態樣之照明器具1包含器具本體10、光源模組20、絕緣片30、光源蓋體40、透光外罩50及電源電路60。As shown in FIGS. 1 to 4, the
以下,針對依本實施態樣的照明器具1之各構成構件,使用圖1及圖2進行詳細的說明。Hereinafter, each component of the
[器具本體(基座)]
器具本體10為基座之一例,如圖1~圖3所示,其支撐著光源模組20、絕緣片30、光源蓋體40及透光外罩50。在本實施態樣中,器具本體10構成了照明器具1之外圍構件。器具本體10由板金製成,且藉由對於例如鋼板或鋁板等之板金進行壓製加工以成形為預定形狀。[Apparatus body (base)]
The
器具本體10之一部分具有往底側(鉛直下方)突出之突出部11。突出部11係支撐住光源模組20及絕緣片30之支撐部。因此,突出部11之底側面為用以配置光源模組20及絕緣片30之配置面11a。具體而言,在突出部11之配置面11a配置絕緣片30,在絕緣片30之底面側一面則配置光源模組20之基板21。突出部11係藉由壓製加工而成形為剖面形狀呈大致梯形。至於突出部11之俯視形狀,就配置面11a觀之係具有一定寬度的圓環狀(環狀)。A part of the
另外,在器具本體10之中央部形成有開口部12。如圖3所示,在開口部12,藉由圓筒狀之支撐構件70而裝設著轉接器80。轉接器80係和懸掛式吸頂燈座主體2a電性及機械性連接之懸掛式吸頂燈座用連接構件。圖3雖然未圖示轉接器80之詳細構造,但是在轉接器80設有用以勾卡在懸掛式吸頂燈座主體2a之一對孔口以取得電氣接點的一對L字形夾扣。In addition, an
在將照明器具1設置於頂棚2時,先將轉接器80裝設在懸掛式吸頂燈座主體2a,然後以使得固定於器具本體10之開口部12的支撐構件70被裝設在轉接器80之方式,將器具本體10朝向頂棚2之側往上推。藉此,使得支撐構件70與轉接器80兩者卡止,而將照明器具1固定於頂棚2,並且懸掛式吸頂燈座主體2a與照明器具1兩者電性及機械性連接。如上述,對於懸掛式吸頂燈座主體2a從市售電電源等之外部電源供給交流電力。因此,藉由在懸掛式吸頂燈座主體2a裝設轉接器80,以對於轉接器80供給交流電力。When the
又,於本實施態樣中,在照明器具1被裝設於被安裝部時,器具本體10以接地連接之方式構成。於本實施態樣中,在照明器具1被設置於頂棚2之後,器具本體10接地連接(亦即接地),而金屬製之器具本體10為接地電位。In addition, in the present embodiment, when the
具體而言,器具本體10係藉由裝設於轉接器80而經由轉接器80接地連接。例如,在懸掛式吸頂燈座主體2a設有接地電位之電線(接地線)的情形,器具本體10係藉由安裝於懸掛式吸頂燈座主體2a所裝設有之轉接器80而經由轉接器80接地連接。又,器具本體10之接地連接方法並不限於此。例如,器具本體10在不經由轉接器80之情況下接地連接亦可。此時,先將照明器具1設置於頂棚2之後,再藉由將器具本體10另外接地連接之作業,以使器具本體10接地連接亦可。Specifically, the
[光源模組(發光裝置)]
光源模組20為發光裝置之一例。光源模組20為照明器具1之光源,發出例如白色光作為主要照明光。如圖3及圖4所示,光源模組20被支撐於器具本體10。具體而言,光源模組20隔著絕緣片30而配置於器具本體10之突出部11。[Light source module (light emitting device)]
The
如圖2~圖4所示,光源模組20包含基板21、及配置於基板21之一個以上的發光元件22。在本實施態樣中,發光元件22由LED構成。因此,光源模組20為LED模組。As shown in FIGS. 2 to 4, the
基板21係供光源亦即發光元件22配置之光源基板。具體而言,如圖3及圖4所示,基板21包含:第一面21a,供發光元件22嵌裝;第二面21b,位於和第一面21a相反之側。如圖2所示,本實施態樣之基板21由並列成圓環狀且各自形成圓弧狀之四片基板構成,但為了方便說明,將此等四片基板之集合體視為一片之基板21來作說明。又,構成基板21的基板之片數不限於四片,亦可為兩片、三片或五片以上。另外,基板21不限於由複數之基板所構成者,為在中央部具有貫通孔之一片圓環狀基板亦可。The
基板21係用於嵌裝發光元件22之嵌裝基板。例如,基板21為預定形狀之形成有配線的印刷配線板。配線為例如由銅或銀等之金屬薄膜構成的金屬配線。基板21之基材可採用:由絕緣性樹脂材料構成之樹脂基板、由表面經過樹脂被覆且由金屬材料構成之金屬基底基板、陶瓷材料之燒結體亦即陶瓷基板、或是由玻璃材料構成之玻璃基板等。在本實施態樣中,基板21使用基材由樹脂基板構成之絕緣基板。舉例而言,基板21由玻璃環氧基板(CEM-3、FR-4等)構成。基板21之厚度為例如0.5mm~2mm(在本實施態樣中為1mm),但不限於此。The
又,在基板21之表面,除了與發光元件22等嵌裝零件進行焊料接合的部分(連接盤部)之外,以覆蓋住金屬配線之方式被覆有白色光阻膜等之絕緣被膜亦可。基板21不限於剛性基板,亦可為撓性基板。基板21可以是僅在一面形成有配線之單面基板,亦可為在兩面形成有配線之雙面基板。In addition, the surface of the
在基板21嵌裝有作為外部連接端子之連接器。在連接器插入了從電源電路60所導出之引線。藉此,將由電源電路60所產生之直流電力經由形成於基板21之配線而供給至發光元件22,以使發光元件22發光。A connector as an external connection terminal is embedded in the
發光元件22嵌裝在基板21之第一面21a。於本實施態樣中,複數之發光元件22以包圍基板21之開口部的方式形成複數之環狀排列而嵌裝在基板21。The
各發光元件22為例如個別封裝起來之表面安裝(SMD,Surface Mount Device)型的LED元件,包含:封裝體(容器),以白色樹脂製成且具有凹部;LED晶片,初步安裝在封裝體之凹部的底面;及密封構件,封裝入封裝體之凹部內。密封構件由例如矽氧樹脂等之透光性樹脂材料構成。密封構件為含有螢光體等之波長變換材料的含螢光體樹脂亦可。Each light-emitting
LED晶片為以預定之直流電力進行發光的半導體發光元件之一例,並為發出單色可見光之裸晶片。LED晶片為例如只要通電即發出藍色光之藍色LED晶片。此時,為了得到白色光,密封構件含有以來自藍色LED晶片之藍色光為激勵光而進行螢光發射的YAG(釔・鋁・石榴石)等之黃色螢光體。The LED chip is an example of a semiconductor light-emitting element that emits light with a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when powered on. At this time, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium·aluminum·garnet) that emits fluorescence using blue light from the blue LED chip as excitation light.
如上述,本實施態樣中之發光元件22係由藍色LED晶片與黃色螢光體所構成之B-Y型白色LED光源。具體而言,黃色螢光體吸收由藍色LED晶片所發出之藍色光的一部分而被激發並且發出黃色光,此黃色光與未被黃色螢光體吸收之藍色光彼此混合而成為白色光。又,除了黃色螢光體之外,密封構件含有紅色螢光體或綠色螢光體亦可。As described above, the light-emitting
又,光源模組20可採用全部之發光元件22之發光顏色相同的單色型,採用可將照明器具1之主要照明光加以調色的調色型亦可。採用調色型之光源模組20時,複數之發光元件22包含色溫等發光顏色不同的複數種之發光元件22。此時,例如複數之發光元件22由發出高色溫(例如自然白色)之光的第一發光元件、及發出低色溫(例如白熾燈色)之光的第二發光元件構成亦可。又,複數之發光元件22之連接態樣(串聯連接、並列連接、以及串聯連接與並列連接組合而成之連接等)並無特別限定。In addition, the
如此構成之光源模組20配置於器具本體10,但是如圖3及圖4所示,光源模組20與器具本體10彼此隔開。亦即,光源模組20與器具本體10兩者並未接觸,乃是間隔一定距離而配置。具體而言,光源模組20之基板21與器具本體10彼此隔開,並且基板21與器具本體10兩者間隔一定距離而配置。The
於本實施態樣中,在光源模組20與器具本體10兩者之間插入了絕緣片30。亦即,藉由在光源模組20與器具本體10兩者之間插入絕緣片30作為間隔件,以使光源模組20與器具本體10兩者形成隔開之狀態。In this embodiment, the insulating
光源模組20之基板21隔著絕緣片30而載置於器具本體10之突出部11。具體而言,基板21在其第二面21b位於器具本體10之側的狀態下,隔著絕緣片30而載置於器具本體10之突出部11。亦即,基板21以第二面21b朝向頂棚側且第一面21a朝向底側之方式配置於突出部11。The
如上述,載置於器具本體10之光源模組20係固定於器具本體10。具體而言,藉由將螺釘插入至光源蓋體40、絕緣片30和基板21各自設有之螺孔,而將該螺釘鎖入至器具本體10之螺孔,可將光源模組20固定於器具本體10。具體而言,光源模組20(基板21)與絕緣片30兩者係在受到光源蓋體40與器具本體10之突出部11兩者夾持的狀態下,利用螺釘一齊鎖緊以固定於器具本體10。As described above, the
[絕緣片]
如圖3及圖4所示,在光源模組20與器具本體10兩者之間配置有絕緣片30。藉此,可使得光源模組20與器具本體10兩者隔開。具體而言,絕緣片30係受到光源模組20與器具本體10兩者夾持,並且光源模組20與器具本體10兩者隔開恰如絕緣片30之厚度的距離。[Insulation sheet]
As shown in FIGS. 3 and 4, an insulating
在本實施態樣中,絕緣片30插入於光源模組20之基板21與器具本體10兩者之間。亦即,藉由絕緣片30使得基板21與器具本體10兩者隔開。具體而言,絕緣片30被光源模組之基板21與器具本體10兩者所夾持。更具體而言,絕緣片30配置於器具本體10的突出部11之配置面11a,且絕緣片30之一個面(頂棚2之側的面)和器具本體10的突出部11之配置面11a進行面接觸,絕緣片30之另一個面(底側之面)和光源模組20的基板21之第二面21b進行面接觸。In this embodiment, the insulating
絕緣片30係由絕緣材料構成之薄片構件。例如,絕緣片30係由絕緣樹脂材料所構成之樹脂薄片。在本實施態樣中,絕緣片30採用由聚對苯二甲酸乙二酯(PET)等之聚酯所構成的較薄之樹脂薄膜。絕緣片30之厚度在5mm以下,較佳在1mm以下,更佳在0.5mm以下。又,絕緣片30之厚度並不限於此。The insulating
[光源蓋體]
如圖2~圖4所示,光源蓋體40為覆蓋住配置於基板21之發光元件22的罩蓋構件。光源蓋體40為具有透光性之透光蓋體,讓從發光元件22所射出之光透射出來。亦即,從發光元件22所射出之光係射入至光源蓋體40而經由光源蓋體40透射出來。藉由配置光源蓋體40,可保護發光元件22也避免使用者觸碰到基板21之充電部。[Light source cover]
As shown in FIGS. 2 to 4, the light source cover 40 is a cover member that covers the
在本實施態樣中,光源蓋體40具有對於從發光元件22射出之光的光分布加以控制的光分布控制功能。具體而言,光源蓋體40為具有透鏡功能之透鏡蓋體,包含和複數之發光元件22各者對應的透鏡部41。亦即,複數之透鏡部41係以和複數之發光元件22一對一對應之方式形成,各透鏡部41具有使得從對應之發光元件22射出之光的光分布角放大之功能。透鏡部41以和複數之發光元件22之排列對應的方式遍佈於光源蓋體40之整體而形成。In the present embodiment, the light source cover 40 has a light distribution control function for controlling the light distribution of the light emitted from the
光源蓋體40可採用透光性之樹脂材料來形成。例如,光源蓋體40之材質為丙烯酸(PMMA)、聚碳酸酯(PC)、聚對苯二甲酸乙二酯(PET)等。又,本實施態樣中之光源蓋體40呈透明,不具有光擴散性(光散射性),但光源蓋體40具有光擴散性亦可。The light source cover 40 can be formed using a light-transmitting resin material. For example, the material of the light source cover 40 is acrylic (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), or the like. In addition, in the present embodiment, the light source cover 40 is transparent and does not have light diffusivity (light scattering), but the light source cover 40 may have light diffusivity.
光源蓋體40形成包圍器具本體10之開口部12的形狀。光源蓋體40以覆蓋住排列成環狀的複數之發光元件22的方式形成環狀。在本實施態樣中,光源蓋體40之俯視形狀為圓環狀。以此方式構成之光源蓋體40係如上述般,藉由螺釘固定於器具本體10。The light source cover 40 is shaped to surround the
[透光外罩]
如圖1~圖3所示,透光外罩50為覆蓋住光源模組20之罩蓋構件。在本實施態樣中,透光外罩50也覆蓋:覆蓋住絕緣片30且覆蓋住光源模組20之光源蓋體40。[Translucent cover]
As shown in FIGS. 1 to 3, the
又,透光外罩50為構成照明器具1之外圍構件的外圍蓋體。透光外罩50為覆蓋住器具本體10之整體的燈球。透光外罩50以可任意裝卸之方式裝設在器具本體10。In addition, the light-transmitting
透光外罩50為具有透光性之透光構件,讓從光源模組20射出而透射過光源蓋體40之光透射出來。亦即,射入至透光外罩50之內面的光係透射過透光外罩50而往透光外罩50之外部萃取出來。The light-transmitting
透光外罩50可採用透光性之樹脂材料來形成。例如,透光外罩50之材質為丙烯酸、聚碳酸酯、聚對苯二甲酸乙二酯或聚氯乙烯等。The light-transmitting
又,透光外罩50具有光擴散性。藉由使透光外罩50具有光擴散性,由於可使得射入至透光外罩50之來自光源蓋體40的光得以擴散(散射),因此可將光從透光外罩50之整體均勻地萃取至外部。In addition, the light-transmitting
此時,例如藉由將透光外罩50設計成乳白色,可使得透光外罩50具有光擴散性。具體而言,藉由採用令光擴散粒子分散開來之樹脂材料構成透光外罩50,可使得透光外罩50具有光擴散性。又,藉由在透光外罩50之內面或外面形成乳白色之光擴散膜以使得透光外罩50具有光擴散性亦可。或者,藉由在透明的透光外罩50之表面形成複數之光擴散點或複數之微小凹凸(表面紋理)以使其具有光擴散性亦可。又,藉由對乳白色之透光外罩50進一步形成複數之光擴散點或複數之微小凹凸以使其具有光擴散性亦可。At this time, for example, by designing the light-transmitting
透光外罩50之形狀為按照器具本體10之形狀的形狀,在本實施態樣中為圓形穹狀。又,在器具本體10呈方形時,透光外罩50之形狀為矩形穹狀亦可。The shape of the light-transmitting
[電源電路]
電源電路60係產生用以點亮光源模組20之電力的電源裝置。電源電路60和裝設於懸掛式吸頂燈座主體2a之轉接器80電性連接,藉由懸掛式吸頂燈座主體2a及轉接器80對於電源電路60供給來自市售電電源等之外部電源的交流電力。如圖3所示,例如轉接器80與電源電路60兩者利用引線等進行電性連接,被供給至轉接器80之交流電力經由引線等再供給至電源電路60。[Power Circuit]
The
電源電路60將被供給至電源電路60之交流電力轉換成直流電力而供給至光源模組20。因為供給直流電力至光源模組20,故光源模組20(發光元件22)發光。在本實施態樣中,電源電路60對於光源模組20之點亮(全亮)及熄滅進行控制。又,電源電路60進行光源模組20之調光或調色亦可。The
電源電路60包含例如電路基板(電源基板)、以及嵌裝在電路基板的複數之電路元件。電路基板為預定形狀之形成有金屬配線的印刷配線板。複數之電路元件為例如電解電容器或陶瓷電容器等之電容元件、電阻器等之電阻元件、整流電路元件、線圈元件、抗流線圈(抗流變壓器)、雜訊濾波器、二極體元件或積體電路元件等之半導體元件等。電源電路60例如構成了定電流電路,但是藉由定電壓電路與電阻對於輸出至發光元件22之電流加以限制亦可。The
以此方式構成之電源電路60收納於器具本體10的突出部11之頂棚側所設有的凹部。如圖2所示,電源電路60係藉由裝設在器具本體10之電路蓋體61予以覆蓋。The
[作用效果等]
接著,針對本實施態樣之照明器具1的作用效果進行說明。[Effects, etc.]
Next, the function and effect of the
本實施態樣之照明器具1係在其被裝設於頂棚2等之被安裝部時,器具本體10進行接地連接。此時,倘若不存在絕緣片30而光源模組20與器具本體10兩者接觸,將如上所述,在光源模組20與器具本體10兩者之間會因為市售電電源之交流電壓與對地電壓的合成電壓而產生雜散電容,有漏電流流到光源模組20以致光源模組20微弱發光之虞。In the
相對於此,本實施態樣之照明器具1中之光源模組20與器具本體10兩者隔開。具體而言,係光源模組20之基板21與器具本體10兩者隔開。On the other hand, the
藉此,由於可抑制光源模組20與器具本體10兩者之間產生雜散電容,因此可抑制在光源模組20產生漏電流。因此,即便是器具本體10接地連接之情形,仍可抑制光源模組20微弱發光。As a result, stray capacitance between the
特別是,本實施態樣之照明器具1係即使對於光源模組20本身未施加微弱發光對策,也可在器具本體10進行接地連接時抑制光源模組20微弱發光。藉此由於不需要另外準備施加了微弱發光對策的光源模組20,亦即在光源模組20嵌裝和發光元件22並列連接之電容器等,因此可輕易地達到光源模組20之通用化。In particular, the
又,本實施態樣之照明器具1係藉由在光源模組20的基板21與器具本體10兩者之間配置絕緣片30,以使得基板21與器具本體10兩者隔開。In addition, in the
藉此,可輕易地使基板21與器具本體10兩者隔開。又,藉由在基板21與器具本體10兩者之間夾入厚度一定的絕緣片30,可使得插入有絕緣片30的基板21與器具本體10兩者之間的區域以一定間隔隔開來。Thereby, both the
而且,絕緣片30可簡單地配置在器具本體10或取下。亦即,可將絕緣片30簡單地裝卸。藉此,可因應器具本體10是否接地連接而簡單地抑制光源模組20微弱發光。亦即,一方面在器具本體10進行接地連接時,如本實施態樣般地在光源模組20與器具本體10兩者之間將絕緣片30插入即可,另一方面在器具本體10未進行接地連接時,不使用絕緣片30而使得光源模組20與器具本體10兩者接觸來構成照明器具即可。如上述,藉由形成利用絕緣片30使基板21與器具本體10兩者隔開之構造,即便不施予在光源模組20嵌裝電容器等之微弱發光對策,仍可在使用於器具本體10接地連接之情形時簡單地抑制光源模組20微弱發光。In addition, the insulating
又,插入於光源模組20與器具本體10兩者之間的絕緣片30之厚度(薄片厚度)越厚,越能夠抑制雜散電容之產生,也越能夠減小光源模組20微弱發光之等級(微弱發光等級)。然而,如圖5所示,當絕緣片30之厚度超過1mm時,微弱發光等級幾乎沒有變小,抑制光源模組20微弱發光之效果到了極限。In addition, the thicker the thickness (thickness of the sheet) of the insulating
又,雖然越加大絕緣片30之厚度,越能夠抑制光源模組20微弱發光,但是就另一方面而言,如圖5所示,隨著絕緣片30之厚度變厚,絕緣片30之熱阻變大。亦即,當加大絕緣片30之厚度時,光源模組20產生之熱將變得不易傳導到器具本體10,此時光源模組20有在點亮時因為本身產生之熱而光輸出下降之虞。Moreover, although the thickness of the insulating
基於上述分析,絕緣片30之厚度建議設在1mm以下。因此,依絕緣片30之厚度而定之光源模組20的基板21與器具本體10兩者之間隔距離建議設在1mm以下。Based on the above analysis, the thickness of the insulating
特別是,絕緣片30之厚度建議設在0.5mm以下。亦即,依絕緣片30之厚度而定之光源模組20的基板21與器具本體10兩者之間隔距離建議設在0.5mm以下。藉此,可抑制光源模組20微弱發光之同時,也有效地抑制絕緣片30之熱阻變大。亦即,可兼顧光源模組20之微弱發光的抑制、與光源模組20之散熱性下降的抑制兩者。In particular, the thickness of the insulating
(變形例) 以上依據本發明實施態樣對於依本發明之照明器具進行了說明,但本發明不限於上述實施態樣。(Modification) The lighting apparatus according to the present invention has been described above according to the embodiment of the present invention, but the present invention is not limited to the above embodiment.
例如,上述實施態樣係在光源模組20與器具本體10兩者之間插入一片絕緣片30,但不限於此。例如,在光源模組20與器具本體10兩者之間重複插入複數片絕緣片30亦可。For example, in the above embodiment, an insulating
在上述實施態樣中,絕緣片30為一體型構件但不限於此。例如,絕緣片30分割成複數部分亦可。此時,複數之絕緣片30可遍佈於光源模組20與器具本體10兩者之間的整個區域,亦可離散地配置於光源模組20與器具本體10兩者之間。In the above-described embodiment, the insulating
於上述實施態樣中,藉由在光源模組20與器具本體10兩者之間夾入絕緣片30以使得光源模組20與器具本體10兩者隔開,但不限於此。例如圖6所示,藉由在器具本體10設置突起部13以使得光源模組20與器具本體10兩者隔開亦可。另外,突起部13和器具本體10各別分開亦可。此時,突起部13發揮作為用以使光源模組20與器具本體10兩者隔開之間隔構件的功能。In the above embodiment, the insulating
又,在上述實施態樣中,藉由在光源模組20與器具本體10兩者之間僅插入絕緣片30,以使光源模組20與器具本體10兩者隔開,但不限於此。例如,藉由在光源模組20與器具本體10兩者之間重複配置絕緣片30與間隔構件,以使光源模組20與器具本體10兩者隔開亦可。In addition, in the above-described embodiment, only the insulating
在上述實施態樣中,器具本體10以板金製成,但不限於此。例如,器具本體10以壓鑄法製成亦可。又,器具本體10只要以可接地連接之方式具有導電性,便不限於金屬製。In the above embodiment, the
在上述實施態樣中,光源模組20與電源電路60兩者各別分開而構成,但不限於此,光源模組20與電源電路60兩者一體構成亦可。此時,只要在基板21嵌裝發光元件22也嵌裝構成電源電路60之電路元件即可。亦即,使用電源一體型之光源模組亦可。In the above-described embodiment, the
又,在上述實施態樣中,發光元件22為SMD型LED元件,但不限於此。例如亦可為:採用LED晶片(裸晶片)本身作為發光元件22而將此LED晶片直接嵌裝(初步安裝)在基板21上而成的COB(Chip On Board,晶片直接安裝)型光源模組。此時,嵌裝在基板21上的複數之LED晶片,可利用密封構件整批密封起來,亦可個別地密封起來。又,此密封構件如上述般含有黃色螢光體等之波長變換材料亦可。In the above-described embodiment, the light-emitting
在上述實施態樣中,發光元件22設計為藉由藍色LED晶片與黃色螢光體發出白色光之B-Y型白色LED光源,但不限於此。例如,使用含有紅色螢光體及綠色螢光體之含螢光體樹脂,而藉由令其與藍色LED晶片互相組合以發出白色光亦可。又,為了提高演色性,除了黃色螢光體之外進一步混合紅色螢光體或綠色螢光體亦無妨。另外,可使用發出藍色以外之顏色的LED晶片,又例如使用會發射出相較於藍色LED晶片所發出藍色光具有較短波長之紫外線的紫外線LED晶片,並藉由主要被紫外線激發而發出藍色光、紅色光及綠色光之藍色螢光體、綠色螢光體及紅色螢光體來發出白色光亦可。In the above embodiment, the light-emitting
在上述實施態樣中,例示了LED作為發光元件22之光源,但是採用雷射二極體等之半導體發光元件、有機EL(Electro Luminescence)或無機EL等之其他固體發光元件亦可。In the above-described embodiment, LEDs are exemplified as the light source of the light-emitting
又,在上述實施態樣中,例示了吸頂燈作為照明器具1,但不限於此。例如,照明器具1只要具有在被設置於作為被安裝部之預定處時接地連接的器具本體,則亦可為吸頂燈以外之照明器具。例如,照明器具1為下照燈等亦可。In addition, in the above-described embodiment, the ceiling lamp is exemplified as the
另外,將所屬技術領域具有通常知識者就上述實施態樣思及之各種變形加以實施而得到的態樣、或者在不脫離本發明之技術思想的範圍內藉由任意組合上述實施態樣中之構成要素及功能而完成的態樣,亦包含在本發明中。In addition, those who have ordinary knowledge in the technical field of the invention can implement various modifications of the above-mentioned embodiment, or can arbitrarily combine any of the above-mentioned embodiments without departing from the technical idea of the present invention. Aspects completed by constituent elements and functions are also included in the present invention.
1‧‧‧照明器具
2‧‧‧頂棚(被安裝部)
2a‧‧‧懸掛式吸頂燈座主體
10‧‧‧器具本體(基座)
11‧‧‧突出部
11a‧‧‧配置面
12‧‧‧開口部
13‧‧‧突起部
20‧‧‧光源模組(發光裝置)
21‧‧‧基板
21a‧‧‧第一面
21b‧‧‧第二面
22‧‧‧發光元件
30‧‧‧絕緣片
40‧‧‧光源蓋體
41‧‧‧透鏡部
50‧‧‧透光外罩
60‧‧‧電源電路
61‧‧‧電路蓋體
70‧‧‧支撐構件
80‧‧‧轉接器1‧‧‧
【圖1】係依實施態樣的照明器具之外觀圖。 【圖2】係依實施態樣的照明器具之分解立體圖。 【圖3】係將依實施態樣的照明器具設置在頂棚時之半剖面圖。 【圖4】係依實施態樣的照明器具之部分放大剖面圖。 【圖5】係顯示依實施態樣的照明器具當中之絕緣片的薄片厚度與微弱發光等級及熱阻彼此之關係的圖式。 【圖6】係依變形例的照明器具之部分放大剖面圖。[Figure 1] This is an external view of the lighting appliance according to the implementation. [Figure 2] is an exploded perspective view of a lighting fixture according to an implementation aspect. [FIG. 3] It is a half cross-sectional view when the lighting fixture according to the embodiment is installed on the ceiling. [Fig. 4] is a partially enlarged cross-sectional view of a lighting fixture according to an implementation aspect. Fig. 5 is a diagram showing the relationship between the thickness of the insulating sheet and the weak light emission level and the thermal resistance in the lighting fixture according to the implementation. [Fig. 6] A partially enlarged cross-sectional view of a lighting fixture according to a modification.
1‧‧‧照明器具 1‧‧‧Lighting appliances
2‧‧‧頂棚(被安裝部) 2‧‧‧ Ceiling (installed part)
2a‧‧‧懸掛式吸頂燈座主體 2a‧‧‧Suspended ceiling lamp holder main body
10‧‧‧器具本體(基座) 10‧‧‧Appliance body (base)
11‧‧‧突出部 11‧‧‧Projection
11a‧‧‧配置面 11a‧‧‧Configuration surface
12‧‧‧開口部 12‧‧‧Opening
20‧‧‧光源模組(發光裝置) 20‧‧‧Light source module (lighting device)
21‧‧‧基板 21‧‧‧ substrate
21a‧‧‧第一面 21a‧‧‧The first side
21b‧‧‧第二面 21b‧‧‧Second side
22‧‧‧發光元件 22‧‧‧Lighting element
30‧‧‧絕緣片 30‧‧‧Insulation sheet
40‧‧‧光源蓋體 40‧‧‧Light source cover
50‧‧‧透光外罩 50‧‧‧Transparent cover
60‧‧‧電源電路 60‧‧‧Power circuit
70‧‧‧支撐構件 70‧‧‧Supporting member
80‧‧‧轉接器 80‧‧‧Adapter
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JP2018106438A JP2019212452A (en) | 2018-06-01 | 2018-06-01 | Lighting device |
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TW202004083A true TW202004083A (en) | 2020-01-16 |
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JP4456191B2 (en) * | 1998-12-08 | 2010-04-28 | 東芝ライテック株式会社 | Hook sealing body, hook sealing cap, lighting fixture mounting device and lighting device |
JP2009194008A (en) * | 2008-02-12 | 2009-08-27 | Koizumi Lighting Technology Corp | Light-emitting diode module, lighting system, and wiring pattern setting method of light-emitting diode module |
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