TWI774937B - Lighting units and lighting fixtures - Google Patents

Lighting units and lighting fixtures Download PDF

Info

Publication number
TWI774937B
TWI774937B TW108107949A TW108107949A TWI774937B TW I774937 B TWI774937 B TW I774937B TW 108107949 A TW108107949 A TW 108107949A TW 108107949 A TW108107949 A TW 108107949A TW I774937 B TWI774937 B TW I774937B
Authority
TW
Taiwan
Prior art keywords
light
circuit
opening
mounting substrate
cover
Prior art date
Application number
TW108107949A
Other languages
Chinese (zh)
Other versions
TW201938951A (en
Inventor
杉浦友博
仁保勝義
古川高司
櫻田貴久
Original Assignee
日商松下知識產權經營股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商松下知識產權經營股份有限公司 filed Critical 日商松下知識產權經營股份有限公司
Publication of TW201938951A publication Critical patent/TW201938951A/en
Application granted granted Critical
Publication of TWI774937B publication Critical patent/TWI774937B/en

Links

Images

Abstract

本發明提供一種照明單元及照明器具,其即使使用單面基板作為安裝基板,並將附引線的發聲元件安裝於安裝基板之與安裝有發光元件的面為相反側的面,亦可得到期望音量。本發明的照明單元具備:器具本體10(基台);安裝基板210,配置於器具本體10,為於第1面210a形成配線的單面基板;1個以上的發光元件220,安裝於安裝基板210的第1面210a;複數之電路元件230,安裝於安裝基板210,構成產生用以使發光元件220發光的電力的電源電路;及發聲元件240,安裝於安裝基板210的第2面210b;器具本體10具有隔著既定間隔與安裝基板210對向的對向部12a,安裝基板210具有形成在與對向部12a對向的位置的第1開口部211。The present invention provides a lighting unit and a lighting fixture capable of obtaining a desired sound volume even when a single-sided substrate is used as a mounting substrate, and a sounding element with leads is mounted on the surface of the mounting substrate opposite to the surface on which the light-emitting element is mounted. . The lighting unit of the present invention includes: a device body 10 (base); a mounting substrate 210 arranged on the device body 10 and is a single-sided substrate on which wiring is formed on the first surface 210a; and one or more light-emitting elements 220 mounted on the mounting substrate The first surface 210a of 210; a plurality of circuit elements 230 are mounted on the mounting substrate 210 to constitute a power supply circuit for generating electric power for causing the light-emitting elements 220 to emit light; and the sound-emitting element 240 is mounted on the second surface 210b of the mounting substrate 210; The instrument body 10 has an opposing portion 12a facing the mounting board 210 at a predetermined interval, and the mounting board 210 has a first opening 211 formed at a position opposing the opposing portion 12a.

Description

照明單元及照明器具Lighting units and lighting fixtures

本發明係關於具有LED(Light Emitting Diode:發光二極體)元件等發光元件的照明單元、及具備此照明單元的照明器具。The present invention relates to a lighting unit including a light-emitting element such as an LED (Light Emitting Diode) element, and a lighting fixture including the lighting unit.

作為具有LED元件的照明器具,以設置於天花板的吸頂燈為人所知。具有LED元件的吸頂燈,例如具備:器具本體;安裝基板,固定於器具本體;LED元件,安裝於安裝基板;複數之電路元件,構成產生用以使LED元件點亮的電力的電源電路;及透光蓋,覆蓋LED元件。As a lighting fixture having an LED element, a ceiling lamp installed on a ceiling is known. A ceiling lamp having LED elements, for example, includes: an appliance body; a mounting substrate fixed to the appliance body; LED elements mounted on the mounting substrate; a plurality of circuit elements constituting a power supply circuit for generating electric power for lighting the LED elements; and Light-transmitting cover, covering the LED components.

以往,作為此種照明器,以設有發聲元件的吸頂燈為人所知,該發聲元件係例如為了以聲音通知使用者已收到來自遙控器的信號、或以聲音通知使用者已到了所設定的起床時刻,而發出蜂鳴音等電子音(例如專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, as such a luminaire, a ceiling lamp provided with a sound-emitting element is known, for example, to notify the user by sound that a signal from the remote control has been received, or to notify the user by sound that the user has arrived at a location. At the set wake-up time, an electronic sound such as a buzzer sound is emitted (for example, Patent Document 1). [Prior Art Literature] [Patent Literature]

[專利文獻1]日本特開2015-207380號公報[Patent Document 1] Japanese Patent Laid-Open No. 2015-207380

[發明欲解決之問題][Problems to be Solved by Invention]

於吸頂燈等的照明器具中,吾人評估將構成電源電路的複數之電路元件與發光元件安裝於同一安裝基板。In lighting fixtures such as ceiling lamps, we evaluate that a plurality of circuit elements and light-emitting elements constituting a power supply circuit are mounted on the same mounting substrate.

於將發聲元件(蜂鳴器等)安裝於安裝有電路元件及發光元件的安裝基板時,藉由使用於雙面形成有配線的雙面基板作為安裝基板,能以發聲元件的元件本體位於發光元件的安裝面側的方式,將發聲元件安裝於安裝基板。藉此,因可將發聲元件安裝在與發光元件的光射出側為同一方向,故可使發聲元件朝向地板面。藉此,容易滿足作為照明器具的期望音量基準(例如45dB以上)。When mounting a sounding element (buzzer, etc.) on a mounting board on which circuit elements and light-emitting elements are mounted, by using a double-sided board on which wiring is formed on both sides as a mounting board, the element body of the sounding element can be placed on the light-emitting element. In the method on the mounting surface side of the element, the sound emitting element is mounted on the mounting board. Thereby, since the sound-emitting element can be mounted in the same direction as the light emitting side of the light-emitting element, the sound-emitting element can be directed toward the floor surface. Thereby, it becomes easy to satisfy the desired volume standard (for example, 45 dB or more) as a lighting fixture.

然而,於使用僅於單面形成配線的單面基板作為安裝基板的情形時,於安裝發光元件的面,需有配線。於此情形時,若使用具有插穿至安裝基板的貫穿孔的引線的附引線型組件(引線組件)作為發聲元件,則附引線型發聲元件必須安裝於安裝基板之與發光元件的安裝面為相反側的面。亦即,發聲元件係安裝於安裝基板的天花板側的面。結果,可能有無法確保期望音量且無法滿足作為照明器具的期望音量基準的疑慮。However, when a single-sided substrate in which wiring is formed only on one side is used as a mounting substrate, wiring is required on the surface on which the light-emitting element is mounted. In this case, if a lead type component (lead component) having a lead wire inserted into a through-hole of the mounting substrate is used as the sound-emitting element, the lead-attached sound-emitting component must be mounted on the mounting substrate and the mounting surface of the light-emitting element. opposite side. That is, the sound-emitting element is mounted on the ceiling-side surface of the mounting board. As a result, there is a possibility that the desired volume cannot be secured and the standard of the desired volume as a lighting fixture cannot be satisfied.

因此,雖然有考慮使用表面安裝型發聲元件來取代非附引線的發聲元件,而與發光元件安裝於同一面,但表面安裝型發聲元件相較於附引線的發聲元件,其費用高2~3倍。Therefore, although it has been considered to replace the non-leaded sounding element with a surface-mounted sounding element and mount it on the same surface as the light-emitting element, the cost of the surface-mounted sounding element is 2-3 higher than that of the leaded sounding element. times.

本發明係用以解決如此問題而成,本發明的目的在於提供一種照明單元及照明器具,其即使使用單面基板作為安裝基板,並將附引線的發聲元件安裝於安裝基板之與安裝有發光元件的面為相反側的面,亦可得到期望音量。 [解決問題之方法]The present invention is made to solve such a problem, and an object of the present invention is to provide a lighting unit and a lighting fixture, which even use a single-sided substrate as a mounting substrate, and mount a sound-emitting element with leads on the mounting substrate and mount a light-emitting element on the mounting substrate. Even if the surface of the element is the surface on the opposite side, the desired volume can be obtained. [How to solve the problem]

為了達成上述目的,本發明的照明單元的一態樣,其具備:基台;安裝基板,配置於該基台,係於第1面形成配線的單面基板;1個以上的發光元件,安裝於該安裝基板的該第1面;複數之電路元件,安裝於該安裝基板,構成產生用以使該發光元件發光的電力的電源電路;及發聲元件,安裝在與該安裝基板的該第1面背向的第2面;該基台具有隔著既定間隔與該安裝基板對向的對向部,該安裝基板具有形成在與該對向部對向的位置的開口部。In order to achieve the above-mentioned object, an aspect of the lighting unit of the present invention includes: a base; a mounting board arranged on the base, and a single-sided board on which wiring is formed on a first surface; and one or more light-emitting elements on which to mount on the first surface of the mounting board; a plurality of circuit elements mounted on the mounting board and constituting a power supply circuit for generating electric power for causing the light-emitting element to emit light; and a sound-emitting element mounted on the first surface of the mounting board A second surface facing away; the base has an opposing portion facing the mounting substrate with a predetermined interval therebetween, and the mounting substrate has an opening formed at a position facing the opposing portion.

又,本發明的照明器具的一態樣,其具備:上述照明單元;及透光蓋,覆蓋該照明單元。 [發明效果]Another aspect of the lighting fixture of the present invention includes: the lighting unit described above; and a light-transmitting cover that covers the lighting unit. [Inventive effect]

依據本發明,即使將附引線的發聲元件安裝於單面基板的安裝基板之與安裝有發光元件的面為相反側的面,亦可得到期望音量。According to the present invention, a desired sound volume can be obtained even when the leaded sound emitting element is mounted on the surface of the mounting substrate of the single-sided substrate that is opposite to the surface on which the light-emitting element is mounted.

以下,參考圖式說明本發明的實施形態。以下說明的實施形態,皆為顯示本發明的一具體例。因此,以下實施形態所示數值、形狀、材料、構成要件、構成要件的配置位置及連接形態等,僅為一例,其用意非用以限定本發明。因此,針對以下實施形態中之構成要件中,未記載於表示最上位概念的獨立請求項的構成要件,係作為任意的構成元件而加以說明。Hereinafter, embodiments of the present invention will be described with reference to the drawings. The embodiments described below are all specific examples showing the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connection forms of constituent elements shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, the constituent elements not described in the independent claims representing the highest-level concept are explained as arbitrary constituent elements.

又,各圖係示意圖,不盡然為嚴謹圖示。各圖中,對於實質上相同的構成附加相同符號,而省略或簡略重複說明。In addition, each figure is a schematic diagram, and it is not necessarily a strict illustration. In each figure, the same reference numerals are attached to substantially the same configuration, and the description thereof will be omitted or abbreviated.

又,於本說明書及圖式中,X軸、Y軸及Z軸係表示三維垂直座標系的三軸,於本實施形態中,將Z軸方向設為鉛直方向,將垂直於Z軸的方向(平行於XY平面的方向)設為水平方向。X軸及Y軸相互垂直,且皆為垂直於Z軸的軸。又,將Z軸方向的正方向設為鉛直下方。In this specification and the drawings, the X-axis, Y-axis, and Z-axis systems represent three axes of a three-dimensional vertical coordinate system. In this embodiment, the Z-axis direction is the vertical direction, and the direction perpendicular to the Z-axis is (The direction parallel to the XY plane) is set as the horizontal direction. The X axis and the Y axis are perpendicular to each other, and both are axes perpendicular to the Z axis. In addition, let the positive direction of the Z-axis direction be vertically downward.

(實施形態) 使用圖1及圖2,說明實施形態的照明器具1的整體構成。圖1係實施形態的照明器具1的剖面圖。圖2係同照明器具1的分解立體圖。又,於圖1及圖2中,紙面上方係地板面(未圖示)的方向。亦即,圖1及圖2中,照明器具1係以與一般使用時為上下顛倒的姿勢顯示。又,圖2中,省略將構件彼此鎖固的螺絲。(Embodiment) The overall configuration of the lighting fixture 1 according to the embodiment will be described with reference to FIGS. 1 and 2 . FIG. 1 is a cross-sectional view of the lighting fixture 1 according to the embodiment. FIG. 2 is an exploded perspective view of the same lighting fixture 1 . In addition, in FIG. 1 and FIG. 2, the upper part of the paper surface corresponds to the direction of the floor surface (not shown). That is, in FIGS. 1 and 2 , the lighting fixture 1 is displayed in an upside-down posture from that in general use. In addition, in FIG. 2, the screw which fixes a member mutually is abbreviate|omitted.

照明器具1設置於住宅等建物的營造建材。本實施形態之照明器具1,係設置於天花板的吸頂燈。具體而言,照明器具1藉由安裝於設於天花板的懸掛式吸頂燈座主體而設置於天花板。懸掛式吸頂燈座主體於天花板的裡側經由電線等與商用電源電性連接。照明器具1藉由安裝於懸掛式吸頂燈座主體而可獲得來自商用電源的電力。The lighting fixture 1 is installed in construction materials of buildings such as houses. The lighting fixture 1 of the present embodiment is a ceiling lamp installed on the ceiling. Specifically, the lighting fixture 1 is installed on the ceiling by being attached to the main body of the suspended ceiling lamp socket installed on the ceiling. The main body of the suspended ceiling lamp socket is electrically connected to a commercial power supply via a wire or the like on the inner side of the ceiling. The lighting fixture 1 can obtain electric power from a commercial power source by being attached to the main body of the suspended ceiling socket.

如圖1及圖2所示,照明器具1具備:器具本體10;光源模組20;電路蓋30;光源蓋40;及透光蓋50。又,圖2所示,器具本體10與光源模組20,以器具本體10作為基台而構成照明單元2。As shown in FIGS. 1 and 2 , the lighting fixture 1 includes: a fixture body 10 ; a light source module 20 ; a circuit cover 30 ; a light source cover 40 ; Furthermore, as shown in FIG. 2 , the fixture body 10 and the light source module 20 constitute the lighting unit 2 using the fixture body 10 as a base.

以下,使用圖1及圖2,詳細說明本實施形態的照明器具1的各構成組件。Hereinafter, each constituent element of the lighting fixture 1 of the present embodiment will be described in detail with reference to FIGS. 1 and 2 .

[器具本體(基台)] 如圖1及圖2所示,器具本體10,係支撐光源模組20、透光蓋50、電路蓋30及光源蓋40的基台。本實施形態中,器具本體10構成照明器具1的外圍構件。[appliance body (base)] As shown in FIG. 1 and FIG. 2 , the apparatus body 10 is a base supporting the light source module 20 , the light transmission cover 50 , the circuit cover 30 and the light source cover 40 . In the present embodiment, the fixture body 10 constitutes a peripheral member of the lighting fixture 1 .

器具本體10係板金製,藉由對例如鋁板或鋼板等板金進行壓製加工而成型為既定形狀。器具本體10的配置有光源模組20之側的面,亦即第1面10a,係器具本體10的內面。為了提高第1面10a的反射性以提升光萃取效率,亦可於第1面10a塗上白色塗料或鍍上反射性金屬材料。又,與第1面10a為相反側的面亦即第2面10b,係器具本體10的外面,暴露於外部空氣。亦即,第2面10b可用作為散熱面。The appliance body 10 is made of sheet metal, and is formed into a predetermined shape by pressing sheet metal such as an aluminum plate or a steel plate. The surface of the device body 10 on the side where the light source module 20 is arranged, that is, the first surface 10 a, is the inner surface of the device body 10 . In order to improve the reflectivity of the first surface 10a to improve the light extraction efficiency, the first surface 10a can also be coated with a white paint or a reflective metal material. In addition, the second surface 10b, which is the surface on the opposite side to the first surface 10a, is the outer surface of the device body 10 and is exposed to the outside air. That is, the second surface 10b can be used as a heat dissipation surface.

器具本體10具有部分往地板面側突出之突出部11。突出部11係支撐光源模組20的支撐部。具體而言,突出部11支撐光源模組20的安裝基板210,突出部11的第1面10a成為用以配置安裝基板210的基板配置面。The appliance body 10 has a protruding portion 11 partially protruding toward the floor surface side. The protruding portion 11 is a supporting portion for supporting the light source module 20 . Specifically, the protruding portion 11 supports the mounting substrate 210 of the light source module 20 , and the first surface 10 a of the protruding portion 11 serves as a substrate arrangement surface on which the mounting substrate 210 is arranged.

突出部11藉由壓製加工而成型為剖面形狀成大致梯形。又,突出部11的俯視形狀,係具有一定寛度作為基板配置面的圓環狀。The protruding portion 11 is formed into a substantially trapezoidal cross-sectional shape by press working. In addition, the plan view shape of the protruding portion 11 is an annular shape having a certain width as a substrate arrangement surface.

又,藉由於器具本體10形成突出部11,而於形成於器具本體10中央部的開口部13的周邊,形成凹部12。具體而言,凹部12以圍住開口部13的方式,形成為圓環狀。凹部12的底部,成為與光源模組20的安裝基板210對向的對向部12a。對向部12a形成為與安裝基板210隔著既定間隔。如此,器具本體10具有與安裝基板210隔著既定間隔並與安裝基板210對向之對向部12a。藉此,於安裝基板210與對向部12a(凹部12的底部)之間,形成空間區。Further, by forming the protruding portion 11 in the device body 10 , the recessed portion 12 is formed around the opening portion 13 formed in the central portion of the device body 10 . Specifically, the recessed portion 12 is formed in an annular shape so as to surround the opening portion 13 . The bottom of the concave portion 12 is the opposite portion 12 a facing the mounting substrate 210 of the light source module 20 . The opposing portion 12a is formed to be spaced apart from the mounting board 210 by a predetermined distance. In this way, the device main body 10 has the opposing portion 12 a facing the mounting substrate 210 with a predetermined interval therebetween. Thereby, a space area is formed between the mounting substrate 210 and the opposing portion 12a (the bottom of the recessed portion 12).

於器具本體10的開口部13,設置具有圓筒狀的筒狀部之筒狀構件60。又,於筒狀構件60的內側,設有支撐構件70。支撐構件70係用為將器具本體10裝接於轉接器(未圖示)的轉接器導件,具有可與轉接器嵌合的構造。支撐構件70與轉接器可自由拆裝。轉接器與懸掛式吸頂燈座主體電性及機械性連接。具體而言,為了勾掛於懸掛式吸頂燈座主體的孔,轉接器設有L字型配件。A cylindrical member 60 having a cylindrical cylindrical portion is provided in the opening portion 13 of the instrument body 10 . Moreover, inside the cylindrical member 60, the support member 70 is provided. The support member 70 is used as an adapter guide for attaching the appliance body 10 to an adapter (not shown), and has a structure that can be fitted with the adapter. The support member 70 and the adapter are freely detachable. The adapter is electrically and mechanically connected with the main body of the suspended ceiling lamp holder. Specifically, in order to be hooked to the hole of the main body of the hanging ceiling lamp socket, the adapter is provided with an L-shaped fitting.

於將照明器具1設置於天花板時,使用者將轉接器安裝於懸掛式吸頂燈座主體。其後,將器具本體10壓往天花板側,以使設於器具本體10的開口部13的支撐構件70裝接於轉接器。藉此,支撐構件70與轉接器卡扣,使得照明器具1固定於天花板,並使懸掛式吸頂燈座主體與照明器具1電性及機械性連接。When installing the lighting fixture 1 on the ceiling, the user installs the adapter on the main body of the suspended ceiling lamp socket. After that, the appliance body 10 is pressed to the ceiling side so that the support member 70 provided in the opening portion 13 of the appliance body 10 is attached to the adapter. In this way, the support member 70 is locked with the adapter, so that the lighting fixture 1 is fixed to the ceiling, and the main body of the suspended ceiling lamp socket and the lighting fixture 1 are electrically and mechanically connected.

又,於器具本體10,設有複數個螺絲孔。螺絲螺合於螺絲孔。光源模組20、電路蓋30及光源蓋40,藉由利用此螺絲一併鎖緊而安裝於器具本體10。Moreover, the apparatus main body 10 is provided with a plurality of screw holes. The screw is screwed into the screw hole. The light source module 20 , the circuit cover 30 and the light source cover 40 are mounted on the apparatus body 10 by being locked together with the screw.

[光源模組] 光源模組20係照明器具1的光源,例如發出白色光。如圖1所示,光源模組20由器具本體10所支撐。具體而言,光源模組20係載置於器具本體10的突出部11。[Light source module] The light source module 20 is a light source of the lighting fixture 1, and emits white light, for example. As shown in FIG. 1 , the light source module 20 is supported by the appliance body 10 . Specifically, the light source module 20 is placed on the protruding portion 11 of the device body 10 .

在此,參考圖1及圖2,使用圖3A、圖3B、圖4及圖5,說明光源模組20的詳細構成。圖3A係從天花板側所見之實施形態的光源模組20的立體圖。圖3B係從地板側所見之實施形態的同光源模組20的立體圖。圖4係同光源模組20的俯視圖。圖5係實施形態的照明器具1的半剖面圖。Here, the detailed structure of the light source module 20 will be described with reference to FIGS. 1 and 2 , and FIGS. 3A , 3B, 4 and 5 . FIG. 3A is a perspective view of the light source module 20 of the embodiment seen from the ceiling side. FIG. 3B is a perspective view of the same light source module 20 of the embodiment seen from the floor side. FIG. 4 is a top view of the same light source module 20 . FIG. 5 is a half cross-sectional view of the lighting fixture 1 according to the embodiment.

如圖3A、圖3B及圖4所示,光源模組20具有:安裝基板210;1個以上的發光元件220;複數之電路元件230;及發聲元件240。本實施形態中,發光元件220係複數。As shown in FIGS. 3A , 3B and 4 , the light source module 20 includes: a mounting substrate 210 ; one or more light-emitting elements 220 ; a plurality of circuit elements 230 ; In this embodiment, the light-emitting element 220 is a complex number.

光源模組20係電源一體型的發光模組,發光元件220與電路元件230皆安裝於安裝基板210。本實施形態中,於安裝基板210,亦安裝發聲元件240。亦即,安裝基板210係發光元件220、電路元件230、發聲元件240共用的共用基板,發光元件220、電路元件230及發聲元件240,安裝於同一安裝基板210。The light source module 20 is a power-integrated light-emitting module, and the light-emitting element 220 and the circuit element 230 are both mounted on the mounting substrate 210 . In this embodiment, the sound-emitting element 240 is also mounted on the mounting board 210 . That is, the mounting board 210 is a common board shared by the light-emitting element 220 , the circuit element 230 , and the sound-emitting element 240 , and the light-emitting element 220 , the circuit element 230 , and the sound-emitting element 240 are mounted on the same mounting board 210 .

安裝基板210係印刷配線基板,該印刷配線基板以由絕緣性樹脂材料所構成的樹脂基板、由表面以樹脂覆膜而成之金屬材料所成的金屬基底基板、作為陶瓷材料之燒結體的陶瓷基板、或由玻璃材料所成的玻璃基板等作為基材,於安裝基板210的表面,形成配線。配線例如為由銅或銀等金屬薄膜所成之金屬配線。又,亦可於安裝基板210的表面,以除了連接盤部(焊接部)外覆蓋金屬配線的方式,覆蓋白色光阻膜等絕緣覆膜。又,安裝基板210不限於硬性基板,亦可為可撓性基板。The mounting board 210 is a printed wiring board, and the printed wiring board is composed of a resin substrate made of an insulating resin material, a metal base substrate made of a metal material whose surface is coated with a resin film, and a ceramic as a sintered body of a ceramic material. A substrate, a glass substrate made of a glass material, or the like is used as a base material, and wirings are formed on the surface of the mounting substrate 210 . The wiring is, for example, a metal wiring formed of a metal thin film such as copper or silver. In addition, the surface of the mounting substrate 210 may be covered with an insulating film such as a white photoresist film so as to cover the metal wiring except for the land portion (soldering portion). In addition, the mounting substrate 210 is not limited to a rigid substrate, and may be a flexible substrate.

安裝基板210,係僅於一側的面形成配線之單面基板。具體而言,安裝基板210具有第1面210a、及與第1面210a背向的第2面210b,本實施形態的安裝基板210,係金屬配線以既定形狀的圖案形成於第1面210a之單面基板。因此,安裝基板210的第1面210a成為焊接面。The mounting substrate 210 is a single-sided substrate in which wiring is formed only on one surface. Specifically, the mounting board 210 has a first surface 210a and a second surface 210b facing away from the first surface 210a. In the mounting board 210 of the present embodiment, metal wirings are formed on the first surface 210a in a predetermined shape pattern. Single-sided substrate. Therefore, the first surface 210a of the mounting board 210 becomes a soldering surface.

安裝於安裝基板210的複數之發光元件220與複數之電路元件230,藉由形成於安裝基板210的金屬配線而電性連接。又,複數之發光元件220彼此及複數之電路元件230彼此亦藉由金屬配線而電性連接。又,安裝基板210雖為單面基板而非雙面基板,但亦可依所需,於作為單面基板的安裝基板210追加形成具有配線功能的導電構件。The plurality of light-emitting elements 220 and the plurality of circuit elements 230 mounted on the mounting substrate 210 are electrically connected by metal wirings formed on the mounting substrate 210 . In addition, the plurality of light-emitting elements 220 and the plurality of circuit elements 230 are also electrically connected by metal wiring. In addition, although the mounting substrate 210 is a single-sided substrate rather than a double-sided substrate, a conductive member having a wiring function may be additionally formed on the mounting substrate 210 serving as a single-sided substrate as required.

如圖3A、圖3B及圖4所示,安裝基板210具有:發光區EA,係安裝有發光元件220的區域;及電路區CA,係安裝有電路元件230的區域。本實施形態中,發光區EA係安裝基板210的外周區,電路區CA係安裝基板210的內周區。亦即,發光區EA係位於電路區CA外側的環狀區。反之,電路區CA係位於發光區EA內側的環狀區。As shown in FIGS. 3A , 3B and 4 , the mounting substrate 210 includes a light emitting area EA, which is an area where the light emitting element 220 is mounted, and a circuit area CA, where the circuit element 230 is mounted. In this embodiment, the light emitting area EA is the outer peripheral area of the mounting substrate 210 , and the circuit area CA is the inner peripheral area of the mounting substrate 210 . That is, the light emitting area EA is an annular area located outside the circuit area CA. On the contrary, the circuit area CA is an annular area located inside the light emitting area EA.

又,如圖1及圖5所示,安裝基板210配置於器具本體10。具體而言,安裝基板210以第2面210b接觸於器具本體10的狀態,配置於器具本體10的突出部11。亦即,安裝基板210以第2面210b為天花板側而第1面210a為地板側的狀態,配置於器具本體10。Moreover, as shown in FIGS. 1 and 5 , the mounting board 210 is arranged on the instrument body 10 . Specifically, the mounting board 210 is arranged on the protruding portion 11 of the instrument body 10 in a state where the second surface 210 b is in contact with the instrument body 10 . That is, the mounting board 210 is arranged on the apparatus main body 10 in a state in which the second surface 210b is on the ceiling side and the first surface 210a is on the floor side.

又,安裝基板210,以安裝基板210的一部分從器具本體10的突出部11往開口部13側突出的狀態,載置於器具本體10的突出部11。因此,安裝基板210的一部分,與器具本體10的凹部12對向。具體而言,從安裝基板210的突出部11突出的部分,與器具本體10的凹部12的底部(對向部12a)對向。於本實施形態中,安裝基板210中之電路區CA的部分從突出部11溢出。因此,安裝基板210的電路區CA的部分,與器具本體10的凹部12的底部(對向部12a)對向。Further, the mounting board 210 is placed on the protruding portion 11 of the appliance body 10 in a state where a part of the mounting substrate 210 protrudes from the protruding portion 11 of the appliance body 10 toward the opening portion 13 . Therefore, a part of the mounting board 210 faces the recessed portion 12 of the instrument body 10 . Specifically, the portion protruding from the protruding portion 11 of the mounting board 210 faces the bottom portion (the opposing portion 12 a ) of the recessed portion 12 of the instrument body 10 . In the present embodiment, the portion of the circuit area CA in the mounting substrate 210 overflows from the protruding portion 11 . Therefore, the portion of the circuit area CA of the mounting board 210 faces the bottom portion (opposing portion 12 a ) of the recessed portion 12 of the device body 10 .

安裝基板210具有第1開口部211及第2開口部212。第1開口部211及第2開口部212,皆為貫穿安裝基板210的貫穿孔。The mounting board 210 has a first opening 211 and a second opening 212 . Both the first opening portion 211 and the second opening portion 212 are through holes penetrating through the mounting substrate 210 .

如圖5所示,第1開口部211形成在與器具本體10的對向部12a對向的位置。亦即,第1開口部211與器具本體10的凹部12對向。第1開口部211於光源模組20(安裝基板210)配置於器具本體10的狀態下,亦為開口狀態。亦即,於光源模組20配置於器具本體10的狀態下,第1開口部211內並未插入任何構件,第1面210a側的空氣與第2面210b側的空氣為可經由第1開口部211往來的狀態。如圖3A、圖3B及圖4所示,第1開口部211存在於安裝基板210的電路區CA。亦即,第1開口部211並非形成於發光區EA,而是形成於電路區CA。As shown in FIG. 5 , the first opening portion 211 is formed at a position facing the opposing portion 12 a of the instrument body 10 . That is, the first opening portion 211 faces the recessed portion 12 of the instrument body 10 . The first opening portion 211 is also in an opening state in a state where the light source module 20 (the mounting substrate 210 ) is arranged on the device body 10 . That is, in the state where the light source module 20 is disposed on the device body 10, no member is inserted into the first opening 211, and the air on the side of the first surface 210a and the air on the side of the second surface 210b can pass through the first opening Section 211 is the status of correspondence. As shown in FIGS. 3A , 3B and 4 , the first opening portion 211 exists in the circuit area CA of the mounting board 210 . That is, the first opening portion 211 is not formed in the light emitting area EA, but is formed in the circuit area CA.

又,於安裝基板210,亦形成螺絲孔,以作為第1開口部211及第2開口部212以外的貫穿孔,但第1開口部211與螺絲孔不同。具體而言,第1開口部211的開口面積,大於形成於安裝基板210的螺絲孔的開口面積。第1開口部211的開口面積,例如以約20mm2 以上為佳,約100mm2 以上較佳,200mm2 以上更佳。Moreover, the mounting board 210 is also formed with screw holes as through holes other than the first opening 211 and the second opening 212, but the first opening 211 is different from the screw holes. Specifically, the opening area of the first opening portion 211 is larger than the opening area of the screw hole formed in the mounting board 210 . The opening area of the first opening portion 211 is preferably, for example, about 20 mm 2 or more, preferably about 100 mm 2 or more, and more preferably about 200 mm 2 or more.

第1開口部211的俯視形狀無特別限定,可為矩形或圓形等。例如,第1開口部211的俯視形狀為矩形時,第1開口部211的大小,例如為橫15mm×縱20mm。又,第1開口部211的俯視形狀為圓形時,第1開口部211的大小,以φ5mm以上為佳。The plan view shape of the first opening portion 211 is not particularly limited, and may be a rectangle, a circle, or the like. For example, when the planar shape of the first opening 211 is a rectangle, the size of the first opening 211 is, for example, 15 mm in width×20 mm in length. In addition, when the planar shape of the first opening portion 211 is circular, the size of the first opening portion 211 is preferably φ5 mm or more.

如圖3A、圖3B及圖4所示,第2開口部212形成於安裝基板210的中央部。因此,安裝基板210的俯視形狀為環狀。本實施形態中,第2開口部212的俯視形狀為圓形。如圖1所示,安裝基板210的第2開口部212的中心,與器具本體10的圓形的開口部13的中心一致。因此,安裝基板210以圍住器具本體10的開口部13的方式,配置於器具本體10。As shown in FIGS. 3A , 3B and 4 , the second opening portion 212 is formed in the center portion of the mounting board 210 . Therefore, the plan view shape of the mounting substrate 210 is annular. In the present embodiment, the plan view shape of the second opening portion 212 is circular. As shown in FIG. 1 , the center of the second opening 212 of the mounting board 210 is aligned with the center of the circular opening 13 of the instrument body 10 . Therefore, the mounting board 210 is arranged on the device body 10 so as to surround the opening portion 13 of the device body 10 .

複數之發光元件220,安裝於安裝基板210的第1面210a。亦即,發光元件220安裝於形成有配線的第1面210a。本實施形態中,複數之發光元件220於發光區EA中,以圍住第2開口部212的方式,成2列排列成環狀。The plurality of light-emitting elements 220 are mounted on the first surface 210 a of the mounting substrate 210 . That is, the light-emitting element 220 is mounted on the first surface 210a on which the wiring is formed. In this embodiment, the plurality of light-emitting elements 220 are arranged in a ring shape in two rows in the light-emitting area EA so as to surround the second opening 212 .

各發光元件220例如為個別封裝化的表面安裝(SMD:Surface Mount Device)型LED元件,具備:白色樹脂製封裝體(容器),具有凹部;LED晶片,一次安裝於封裝體的凹部底面;及密封構件,封入至封裝體的凹部內。密封構件由例如矽酮樹脂等透光性樹脂材料所構成。密封構件亦可為含有螢光體等波長轉換材料的含螢光體樹脂。Each light-emitting element 220 is, for example, an individually packaged surface mount device (SMD: Surface Mount Device) type LED element, and includes: a white resin package (container) having a concave portion; an LED chip mounted on the bottom surface of the concave portion of the package at one time; and The sealing member is enclosed in the concave portion of the package. The sealing member is made of a translucent resin material such as silicone resin. The sealing member may be a phosphor-containing resin containing a wavelength conversion material such as a phosphor.

LED晶片為利用既定直流電力發光之半導體發光元件的一例,為發出單色可見光的裸晶片。LED晶片例如為通電則發藍色光的藍色LED晶片。此情形時,為了獲得白色光,使於密封構件含有以來自藍色LED晶片的藍色光作為激發光而螢光發光的YAG(釔‧鋁‧石榴石)等黄色螢光體。An LED chip is an example of a semiconductor light-emitting element that emits light using a predetermined DC power, and is a bare chip that emits monochromatic visible light. The LED chip is, for example, a blue LED chip that emits blue light when energized. In this case, in order to obtain white light, the sealing member contains a yellow phosphor such as YAG (yttrium-aluminum-garnet) that emits fluorescently by using blue light from the blue LED wafer as excitation light.

如此,本實施形態的發光元件220,係藉由藍色LED晶片及黄色螢光體所構成的B-Y類型的白色LED光源。具體而言,黄色螢光體吸收藍色LED晶片所發出的藍色光的一部分而被激發並放出黄色光,此黄色光與未被黄色螢光體所吸收的藍色光相混而成為白色光。又,密封構件中,除了黄色螢光體以外,亦可含有紅色螢光體或綠色螢光體。In this way, the light-emitting element 220 of the present embodiment is a B-Y type white LED light source composed of a blue LED chip and a yellow phosphor. Specifically, the yellow phosphor absorbs part of the blue light emitted by the blue LED chip, is excited and emits yellow light, and the yellow light is mixed with the blue light not absorbed by the yellow phosphor to become white light. In addition, the sealing member may contain a red phosphor or a green phosphor in addition to the yellow phosphor.

又,光源模組20可為全部發光元件220的光色相同的單色類型,亦可為照明器具1的照明光可調色的調色類型。於調色類型的光源模組20的情形時,複數之發光元件220中,含有色溫等的發光色相異之複數種發光元件220。此情形時,例如,複數之發光元件220可由發出高色溫(例如白晝色)的光之第1發光元件及發出低色溫(例如燈泡色)的光之第2發光元件所構成。又,複數之發光元件220的連接態樣(串聯連接、並聯連接及串聯連接和並聯連接的組合連接等)並無特別限定。In addition, the light source module 20 may be a monochromatic type in which the light colors of all the light-emitting elements 220 are the same, or may be a toning type in which the illumination light of the lighting fixture 1 can be toned. In the case of the light source module 20 of the color tone type, the plurality of light emitting elements 220 include a plurality of light emitting elements 220 having different emission colors such as color temperature. In this case, for example, the plurality of light-emitting elements 220 may be composed of a first light-emitting element that emits light with a high color temperature (eg, daytime color) and a second light-emitting element that emits light with a low color temperature (eg, bulb color). In addition, the connection form of the plural light-emitting elements 220 (series connection, parallel connection, and combination of series connection and parallel connection, etc.) are not particularly limited.

複數之電路元件230至少包含電源用電路元件,該電源用電路元件構成用以產生使發光元件220發光的電力之電源電路。構成電源電路的複數之電路元件230,例如將經由連接於安裝在器具本體10的支撐構件70的轉接器的引線而供給的交流電力,轉換成直流電力。由電源電路所產生的直流電力,供給至各發光元件220。藉此,各發光元件220發光。The plurality of circuit elements 230 include at least a power supply circuit element that constitutes a power supply circuit for generating electric power for causing the light-emitting element 220 to emit light. The plurality of circuit elements 230 constituting the power supply circuit, for example, convert AC power supplied via lead wires connected to the adapter attached to the support member 70 of the appliance body 10 into DC power. The DC power generated by the power supply circuit is supplied to each light-emitting element 220 . Thereby, each light-emitting element 220 emits light.

構成電源電路的複數之電路元件230(電源用電路元件),例如為電解電容器或陶瓷電容器等電容元件、電阻器等電阻元件、整流電路元件、抗流線圈、抗流變壓器、噪音濾波器、二極體、或MOSFET等開關元件或積體電路元件等半導體元件等。The plurality of circuit elements 230 (circuit elements for power supply) constituting the power supply circuit are, for example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistive elements such as resistors, rectifier circuit elements, choke coils, choke transformers, noise filters, two Polar bodies, switching elements such as MOSFETs, semiconductor elements such as integrated circuit elements, etc.

又,複數之電路元件230不僅包含電源用電路元件,亦可包含構成其他電路的電路元件。例如,複數之電路元件230可包含:於照明器具1具有人體感應器等感應器時,構成用以藉由來自人體感應器的信號而控制發光元件220發光狀態的控制電路之感測器用電路元件;亦可包含:構成用以對光源模組20的照明光予以調光或調色的調光電路或調色電路等控制電路元件;亦可包含:構成用以與遙控器或行動終端進行紅外線通訊或無線通訊的通訊電路之通訊用電路元件(通訊模組)等之其他電路元件。In addition, the plurality of circuit elements 230 may include not only circuit elements for power supply, but also circuit elements constituting other circuits. For example, the plurality of circuit elements 230 may include a sensor circuit element constituting a control circuit for controlling the light-emitting state of the light-emitting element 220 by a signal from the human body sensor when the lighting fixture 1 has a sensor such as a human body sensor ; may also include: constitute a control circuit element such as a dimming circuit or a color-adjusting circuit for dimming or toning the illumination light of the light source module 20; may also include: constitute an infrared ray with a remote control or a mobile terminal Other circuit components such as communication circuit components (communication modules) of communication circuits of communication or wireless communication.

複數之電路元件230包含對安裝基板210的安裝態樣不同之第1電路元件231及第2電路元件232。The plurality of circuit elements 230 include a first circuit element 231 and a second circuit element 232 having different mounting patterns on the mounting substrate 210 .

第1電路元件231係表面安裝型的電路組件(SMD:Surface Mount Device),藉由焊接而安裝於安裝基板210的表面。本實施形態中,第1電路元件231安裝於形成有安裝基板210的配線之第1面210a。The first circuit element 231 is a surface mount type circuit module (SMD: Surface Mount Device), and is mounted on the surface of the mounting board 210 by soldering. In the present embodiment, the first circuit element 231 is mounted on the first surface 210a on which the wiring of the mounting substrate 210 is formed.

第2電路元件232係具有元件本體及從元件本體拉出的一對引線之附引線型電路組件(引線組件)。因此,第2電路元件232藉由使引線插穿至形成於安裝基板210的貫穿孔而安裝(通孔安裝)。本實施形態之安裝基板210,因係於第1面210a形成配線的單面基板,故第2電路元件232安裝於安裝基板210的第2面210b。例如,第2電路元件232藉由使引線從第2面210b插穿至形成在與安裝基板210的配線重疊的位置之貫穿孔,且使引線的前端部焊接於第1面210a側,而與第1面210a的配線連接。亦即,第2電路元件232的元件本體位於第2面210b側,而插穿安裝基板210的貫穿孔的引線的前端部焊接於第1面210a。又,作為引線組件的第2電路元件232,係徑向引線組件或軸向引線組件。The second circuit element 232 is a lead type circuit component (lead component) having an element body and a pair of leads drawn from the element body. Therefore, the second circuit element 232 is mounted by inserting the leads into the through holes formed in the mounting substrate 210 (through-hole mounting). The mounting board 210 of the present embodiment is a single-sided board in which wirings are formed on the first surface 210 a, so the second circuit element 232 is mounted on the second surface 210 b of the mounting board 210 . For example, the second circuit element 232 is connected to the first surface 210a by inserting the lead from the second surface 210b to a through hole formed at a position overlapping the wiring of the mounting board 210, and soldering the tip of the lead to the first surface 210a side. Wiring connection on the first surface 210a. That is, the element body of the second circuit element 232 is located on the side of the second surface 210b, and the leading ends of the leads inserted through the through holes of the mounting substrate 210 are soldered to the first surface 210a. In addition, the second circuit element 232 as a lead set is a radial lead set or an axial lead set.

又,複數之電路元件230包含對俯視安裝基板210時的安裝基板210的投影面積為100mm2 以上的大型電路元件。大型電路元件係作為引線組件的第2電路元件232。因此,大型電路元件安裝於安裝基板210的第2面210b。如此的大型電路元件,例舉如具有抗流變壓器或抗流線圈等線圈的線圈組件或電解電容器等。In addition, the plurality of circuit elements 230 include large circuit elements having a projected area of 100 mm 2 or more with respect to the mounting substrate 210 in a plan view. The large circuit element is the second circuit element 232 as the lead assembly. Therefore, the large circuit element is mounted on the second surface 210 b of the mounting board 210 . Such a large circuit element includes, for example, a coil assembly having a coil such as a choke transformer or a choke coil, an electrolytic capacitor, and the like.

於安裝基板210的第2面210b,安裝有發出電子音的發聲元件240。發聲元件240於讓使用者知道照明器具1以遙控器等操作、或讓使用者知道已到所設定的起床時刻等的時候,發出通報音。例如,於使用者藉由操作遙控器進行照明器具1的點滅或調光控制、或進行各種設定之際,藉由使用者的遙控器操作,於照明器具1接收到紅外線信號或無線信號等信號時,發聲元件240發出聲音。又,於到了已設定的起床時刻時,發聲元件240發出聲音。發聲元件240為例如發出「嗶嗶」等蜂鳴音的電子蜂鳴器。On the second surface 210b of the mounting board 210, a sounding element 240 that emits electronic sounds is mounted. The sounding element 240 emits a notification sound when the user knows that the lighting fixture 1 is operated by a remote control or the like, or when the user knows that the set wake-up time has come. For example, when the user operates the remote controller to turn on and off the lighting fixture 1, control the dimming, or perform various settings, the lighting fixture 1 receives an infrared signal or a wireless signal by operating the user's remote controller. When the signal is received, the sound-emitting element 240 emits a sound. Moreover, when the set wake-up time is reached, the sound-emitting element 240 emits a sound. The sounding element 240 is, for example, an electronic buzzer that emits a beep sound such as "beep beep".

發聲元件240與第2電路元件232相同,係具有元件本體與一對引線的附引線型發聲元件。本實施形態中,發聲元件為徑向引線組件。Like the second circuit element 232, the sounding element 240 is a lead-type sounding element having an element body and a pair of lead wires. In this embodiment, the sound generating element is a radial lead assembly.

發聲元件240可安裝於第1開口部211的附近。此情形時,發聲元件240與第1開口部211間的距離,以30mm以內為佳,10mm以內更佳,5mm以內又更佳。又,從發聲元件240對照明器具1外部所發出的音量若超出既定基準,則發聲元件240與第1開口部211的距離,亦可超過30mm。The sound-emitting element 240 can be attached to the vicinity of the first opening 211 . In this case, the distance between the sounding element 240 and the first opening 211 is preferably within 30 mm, more preferably within 10 mm, and even more preferably within 5 mm. In addition, if the sound volume emitted from the sound generating element 240 to the outside of the lighting fixture 1 exceeds a predetermined standard, the distance between the sound generating element 240 and the first opening 211 may exceed 30 mm.

本實施形態中,發聲元件240存在於安裝基板210的電路區CA。亦即,發聲元件240安裝於安裝基板210的第2面210b中的電路區CA。此情形時,於發聲元件240的周邊,最好不要安裝大型電路元件。亦即,發聲元件240宜形成於大型電路元件230的安裝數目為少的稀疏區。In the present embodiment, the sound-emitting element 240 exists in the circuit area CA of the mounting board 210 . That is, the sound-emitting element 240 is mounted on the circuit area CA on the second surface 210 b of the mounting board 210 . In this case, it is preferable not to mount large circuit elements around the sound generating element 240 . That is, the sound generating element 240 is preferably formed in a sparse area where the number of the large circuit elements 230 to be mounted is small.

又,於安裝基板210的第1面210a,安裝有電連接器250。電連接器250係外部連接端子,於電連接器250,插入連接至轉接器的引線,該轉接器裝接於器具本體10的支撐構件70。亦即,電連接器250可接收經由引線所供給的交流電力(例如商用AC100V)。電連接器250所接收的交流電力,利用由複數之電路元件230所構成的電源電路而變成直流電力。電連接器250例如為快速接線端子,藉由插入引線而與引線電性及機械連接。本實施形態中,電連接器250係具有於安裝基板210的第1面210a平行延伸的插入孔之橫插式電連接器。因此,於使電連接器250與引線接線時,從正側面將引線插入至電連接器250。In addition, the electrical connector 250 is mounted on the first surface 210a of the mounting board 210 . The electrical connector 250 is an external connection terminal. In the electrical connector 250 , a lead wire connected to an adapter is inserted, and the adapter is attached to the support member 70 of the appliance body 10 . That is, the electrical connector 250 can receive AC power (eg, commercial AC 100V) supplied through the lead wires. The AC power received by the electrical connector 250 is converted into DC power by a power supply circuit formed by a plurality of circuit elements 230 . The electrical connector 250 is, for example, a quick-connect terminal, which is electrically and mechanically connected to the lead by inserting the lead. In the present embodiment, the electrical connector 250 is a horizontal plug-in electrical connector having insertion holes extending parallel to the first surface 210 a of the mounting substrate 210 . Therefore, when connecting the electrical connector 250 to the lead wire, the lead wire is inserted into the electrical connector 250 from the front side.

如此構成的光源模組20,利用螺絲固定於器具本體10。具體而言,光源模組20載置於器具本體10的突出部11,電路蓋30藉由將螺絲插入至分別設於光源蓋40及安裝基板210的螺絲孔,並將此螺絲鎖入至器具本體10的螺絲孔而固定於器具本體10。The light source module 20 thus constructed is fixed to the device body 10 with screws. Specifically, the light source module 20 is placed on the protruding portion 11 of the device body 10 , the circuit cover 30 is inserted into the screw holes respectively provided on the light source cover 40 and the mounting substrate 210 by inserting screws, and the screws are locked into the device The screw hole of the main body 10 is fixed to the apparatus main body 10 .

[電路蓋] 如圖1及圖2所示,電路蓋30係覆蓋複數之電路元件230的蓋構件。具體而言,電路蓋30覆蓋複數之電路元件230中之安裝於安裝基板210的第1面210a的電路元件。亦即,電路蓋30覆蓋安裝於安裝基板210的第1面210a的第1電路元件231。因此,電路蓋30覆蓋安裝基板210的第1面210a(地板面側之面)的一部分。具體而言,電路蓋30於安裝基板210的第1面210a中的發光區EA及電路區CA中,僅覆蓋電路區CA。[circuit cover] As shown in FIGS. 1 and 2 , the circuit cover 30 is a cover member covering a plurality of circuit elements 230 . Specifically, the circuit cover 30 covers the circuit elements mounted on the first surface 210 a of the mounting board 210 among the plurality of circuit elements 230 . That is, the circuit cover 30 covers the first circuit element 231 mounted on the first surface 210 a of the mounting board 210 . Therefore, the circuit cover 30 covers a part of the first surface 210a (the surface on the floor surface side) of the mounting board 210 . Specifically, the circuit cover 30 covers only the circuit area CA in the light emitting area EA and the circuit area CA on the first surface 210 a of the mounting substrate 210 .

電路蓋30例如為不透光性的白色,其將從發光元件射出而碰到該電路蓋30的光予以反射並導往透光蓋50的方向,但亦可為具有透光性的透光蓋。又,本實施形態中,電路蓋30為金屬製的金屬蓋,但亦可為樹脂製的樹脂蓋。又,電路蓋30可由金屬材料或不燃性樹脂材料等具有不燃性的材料所構成。The circuit cover 30 is, for example, opaque white, which reflects the light emitted from the light-emitting element and hits the circuit cover 30 and guides it to the direction of the light-transmitting cover 50 , but it can also be light-transmitting. cover. In addition, in this embodiment, although the circuit cover 30 is a metal cover, it may be a resin cover. In addition, the circuit cover 30 may be formed of a non-flammable material such as a metal material or a non-flammable resin material.

電路蓋30係圍住器具本體10的開口部13的形狀。本實施形態中,電路蓋30的俯視形狀形成為圓環狀。又,如圖1所示,電路蓋30係以利用電路蓋30、筒狀構件60及安裝基板210形成空間區的方式構成。於此空間區內,配置電路元件230的第1電路元件231。又,電路蓋30的外側端部,由安裝基板210的第1面210a所支撐。The circuit cover 30 is shaped to surround the opening 13 of the appliance body 10 . In the present embodiment, the circuit cover 30 is formed in an annular shape in plan view. Moreover, as shown in FIG. 1, the circuit cover 30 is comprised so that a space area may be formed by the circuit cover 30, the cylindrical member 60, and the mounting board|substrate 210. As shown in FIG. In this space area, the first circuit element 231 of the circuit element 230 is arranged. In addition, the outer end portion of the circuit cover 30 is supported by the first surface 210 a of the mounting board 210 .

如圖2所示,於電路蓋30,形成缺口部30a。缺口部30a由樹脂蓋31所覆蓋。樹脂蓋31覆蓋安裝於安裝基板210的遙控接收部或夜燈等。遙控接收部接收由使用者操作的遙控器所發出的紅外線信號或無線信號。又,於樹脂蓋31覆蓋夜燈的情形時,可以使夜燈的光通過樹脂蓋31的方式,於樹脂蓋31形成開口部,或者,亦可藉由透光性樹脂材料構成樹脂蓋31。本實施形態中,因於樹脂蓋31形成開口部,故樹脂蓋31由光源蓋40的突出部所覆蓋。As shown in FIG. 2 , in the circuit cover 30, a notch portion 30a is formed. The cutout portion 30 a is covered by the resin cover 31 . The resin cover 31 covers the remote control receiver, night light, etc. mounted on the mounting board 210 . The remote control receiving unit receives infrared signals or wireless signals from a remote control operated by a user. When the resin cover 31 covers the night light, an opening may be formed in the resin cover 31 so that the light of the night light passes through the resin cover 31 , or the resin cover 31 may be made of a translucent resin material. In the present embodiment, since an opening is formed in the resin cover 31 , the resin cover 31 is covered by the protruding portion of the light source cover 40 .

如此構成的電路蓋30,利用螺絲,與光源模組20及光源蓋40一同安裝於器具本體10。本實施形態中,依電路蓋30、光源蓋40、光源模組20及器具本體10的順序配置並藉由4個螺絲一起鎖緊。The circuit cover 30 thus constructed is attached to the device body 10 together with the light source module 20 and the light source cover 40 by screws. In this embodiment, the circuit cover 30 , the light source cover 40 , the light source module 20 and the appliance body 10 are arranged in the order and locked together by four screws.

[光源蓋] 如圖1所示,光源蓋40係覆蓋配置於安裝基板210的發光元件220的蓋構件。本實施形態中,光源蓋40覆蓋安裝基板210的發光區EA。[Light source cover] As shown in FIG. 1 , the light source cover 40 is a cover member that covers the light emitting elements 220 arranged on the mounting board 210 . In this embodiment, the light source cover 40 covers the light emitting area EA of the mounting substrate 210 .

光源蓋40係具有透光性的透光蓋,使從發光元件220射出的光穿透。亦即,從發光元件220所射出的光,入射至光源蓋40並穿透光源蓋40。藉由配置光源蓋40,可保護發光元件220或令使用者不會碰觸到安裝基板210的充電部。The light source cover 40 is a light-transmitting cover that transmits light emitted from the light-emitting element 220 . That is, the light emitted from the light emitting element 220 is incident on the light source cover 40 and penetrates the light source cover 40 . By disposing the light source cover 40 , the light-emitting element 220 can be protected or the charging portion of the mounting substrate 210 can be prevented from being touched by the user.

本實施形態中,光源蓋40具有控制從發光元件220所射出光的配光之配光控制功能。具體而言,如圖1及圖2所示,光源蓋40具有分別對應複數之發光元件220之透鏡部41,複數之透鏡部41各自具有將從所對應的發光元件220射出的光的配光角予以放大之功能。透鏡部41與複數之發光元件220以一對一的方式形成。透鏡部41對應於複數之發光元件220的排列而形成於光源蓋40整體。光源蓋40的俯視形狀為環狀。如此,光源蓋40係具有透鏡功能的透鏡蓋。In the present embodiment, the light source cover 40 has a light distribution control function for controlling the light distribution of the light emitted from the light emitting element 220 . Specifically, as shown in FIGS. 1 and 2 , the light source cover 40 has lens portions 41 respectively corresponding to the plurality of light-emitting elements 220 , and the plurality of lens portions 41 each have a light distribution of light emitted from the corresponding light-emitting elements 220 . The function of magnifying the angle. The lens portion 41 and the plurality of light emitting elements 220 are formed in a one-to-one manner. The lens portion 41 is formed on the entire light source cover 40 corresponding to the arrangement of the plurality of light emitting elements 220 . The plan view shape of the light source cover 40 is annular. In this way, the light source cover 40 is a lens cover having a lens function.

光源蓋40可使用透光性的樹脂材料而形成。例如,光源蓋40的材質為丙烯酸、聚碳酸酯或聚對苯二甲酸乙二醇酯等。又,本實施形態中之光源蓋40係透明而不具光擴散性,但光源蓋40亦可具有光擴散性。The light source cover 40 can be formed using a translucent resin material. For example, the material of the light source cover 40 is acrylic, polycarbonate, polyethylene terephthalate, or the like. In addition, the light source cover 40 in this embodiment is transparent and does not have light diffusivity, but the light source cover 40 may also have light diffusivity.

光源蓋40係圍住器具本體10的開口部13的形狀。光源蓋40以覆蓋排列成環狀的複數之發光元件220的方式,形成為環狀。本實施形態中,光源蓋40的俯視形狀形成為圓環狀。The light source cover 40 is shaped to surround the opening 13 of the instrument body 10 . The light source cover 40 is formed in a ring shape so as to cover the plurality of light emitting elements 220 arranged in a ring shape. In this embodiment, the plan view shape of the light source cover 40 is formed in an annular shape.

光源蓋40以圍住電路蓋30的方式構成。亦即,於光源蓋40的開口部配置電路蓋30,而光源蓋40的外徑大於電路蓋30的外徑。The light source cover 40 is configured to surround the circuit cover 30 . That is, the circuit cover 30 is disposed at the opening of the light source cover 40 , and the outer diameter of the light source cover 40 is larger than the outer diameter of the circuit cover 30 .

又,於光源蓋40的一部分,設置往內側突出的平板狀突出部42。突出部42覆蓋塞住電路蓋30的缺口部30a的樹脂蓋31。亦即,突出部42與樹脂蓋31重疊。In addition, a part of the light source cover 40 is provided with a flat plate-like protrusion 42 that protrudes inward. The protruding portion 42 covers the resin cover 31 that plugs the cutout portion 30 a of the circuit cover 30 . That is, the protruding portion 42 overlaps with the resin cover 31 .

如此構成的光源蓋40,如上所述,藉由貫穿電路蓋30的4個螺絲而固定於器具本體10。又,光源蓋40的內側的端部,由安裝基板210的第1面210a所支撐。The light source cover 40 thus constituted is fixed to the device body 10 by four screws penetrating the circuit cover 30 as described above. In addition, the inner end of the light source cover 40 is supported by the first surface 210 a of the mounting board 210 .

[透光蓋] 透光蓋50係覆蓋照明單元2的蓋構件。亦即,透光蓋50覆蓋構成照明單元2的器具本體10及光源模組20。本實施形態中,透光蓋50亦覆蓋了覆蓋光源模組20的電路蓋30及光源蓋40。[Transparent cover] The light-transmitting cover 50 is a cover member that covers the lighting unit 2 . That is, the light-transmitting cover 50 covers the device body 10 and the light source module 20 that constitute the lighting unit 2 . In this embodiment, the transparent cover 50 also covers the circuit cover 30 and the light source cover 40 covering the light source module 20 .

又,透光蓋50係構成照明器具1的外圍構件的外圍蓋。透光蓋50係覆蓋器具本體10整體的燈罩。透光蓋50可自由拆裝地安裝於器具本體10。In addition, the light-transmitting cover 50 is an outer cover that constitutes an outer member of the lighting fixture 1 . The light-transmitting cover 50 is a lampshade covering the whole of the appliance body 10 . The light-transmitting cover 50 is detachably mounted on the appliance body 10 .

透光蓋50係具有透光性的透光構件,使從光源模組20射出並穿透光源蓋40的光穿透。亦即,入射至透光蓋50內面的光,穿透透光蓋50而往透光蓋50外部導出。The light-transmitting cover 50 is a light-transmitting member having light-transmitting properties, so that the light emitted from the light source module 20 and passing through the light source cover 40 is transmitted therethrough. That is, the light incident on the inner surface of the light-transmitting cover 50 penetrates the light-transmitting cover 50 and is led out to the outside of the light-transmitting cover 50 .

透光蓋50可使用透光性的樹脂材料而形成。例如,透光蓋50的材質可為丙烯酸(PMMA)、聚碳酸酯(PC)、聚對苯二甲酸乙二醇酯(PET)或聚氯乙烯等。The translucent cover 50 can be formed using a translucent resin material. For example, the material of the transparent cover 50 may be acrylic (PMMA), polycarbonate (PC), polyethylene terephthalate (PET), or polyvinyl chloride.

又,透光蓋50具有光擴散性。藉由使透光蓋50具有光擴散性,可使從光源蓋40入射至透光蓋50的光擴散(散射),故可從透光蓋50整體均勻地將光導出至外部。In addition, the light-transmitting cover 50 has light diffusivity. By providing the light-transmitting cover 50 with light diffusivity, the light incident from the light source cover 40 to the light-transmitting cover 50 can be diffused (scattered), so that the light can be uniformly led out from the entire light-transmitting cover 50 to the outside.

此情形時,例如,藉由將透光蓋50設成乳白色可使透光蓋50具有光擴散性。具體而言,藉由以使光擴散粒子分散的樹脂材料來構成透光蓋50,可使透光蓋50具有光擴散性。又,亦可藉由於透光蓋50的內面或外面形成乳白色的光擴散膜,而使透光蓋50具有光擴散性。或者,亦可藉由在透明的透光蓋50的表面形成複數之光擴散點或複數之微小凹凸(紋理)而使具有光擴散性。又,亦可藉由對乳白色的透光蓋50再形成複數之光擴散點或複數之微小凹凸而使具有光擴散性。In this case, for example, the light-transmitting cover 50 can have light diffusivity by making the light-transmitting cover 50 milky white. Specifically, by constituting the light-transmitting cover 50 with a resin material in which light-diffusing particles are dispersed, the light-transmitting cover 50 can have light diffusing properties. In addition, the light-transmitting cover 50 may have light diffusivity by forming a milky white light-diffusing film on the inner surface or the outer surface of the light-transmitting cover 50 . Alternatively, the surface of the transparent light-transmitting cover 50 may have light diffusing properties by forming plural light diffusing points or plural minute irregularities (textures). Moreover, the light-diffusing property may be provided by further forming a plurality of light-diffusing points or a plurality of minute irregularities on the opalescent light-transmitting cover 50 .

又,透光蓋50的形狀係跟隨器具本體10形狀的形狀,本實施形態中,係圓形穹頂狀。又,器具本體10為四方形時,透光蓋50的形狀亦可為矩形穹頂狀。In addition, the shape of the light-transmitting cover 50 follows the shape of the instrument body 10, and in this embodiment, it is a circular dome shape. In addition, when the instrument body 10 is square, the shape of the light-transmitting cover 50 may also be a rectangular dome shape.

[效果等] 其次,針對本實施形態中之照明器具1的作用效果,參考圖5,並比較圖6所示比較例的照明器具1X而進行說明。圖6係比較例的照明器具1X的半剖面圖。[Effect, etc.] Next, the effect of the lighting fixture 1 in the present embodiment will be described with reference to FIG. 5 in comparison with the lighting fixture 1X of the comparative example shown in FIG. 6 . FIG. 6 is a half cross-sectional view of the lighting fixture 1X of the comparative example.

如圖6所示,比較例的照明器具1X中,作為光源模組20X的安裝基板210X,係使用於雙面形成配線的雙面基板。因此,電路元件230不論是表面安裝型或是引線組件,皆可任意安裝於安裝基板210X的第1面210a及第2面210b中的任一面。As shown in FIG. 6 , in the lighting fixture 1X of the comparative example, as the mounting board 210X of the light source module 20X, a double-sided board for forming wiring on both sides is used. Therefore, the circuit element 230 can be arbitrarily mounted on any one of the first surface 210a and the second surface 210b of the mounting board 210X regardless of whether it is a surface mount type or a lead assembly.

例如,針對大部分的電路元件230,可以電路元件230的元件本體位在與發光元件220的安裝面亦即第1面210a為相同面側的方式,安裝於安裝基板210X。此情形時,表面安裝型的第1電路元件231,藉由焊接於安裝基板210X的第1面210a而安裝於安裝基板210X。又,作為引線組件的第2電路元件232,藉由使從第1面210a往第2面210b插穿的引線焊接於第2面210b,而安裝於安裝基板210X。For example, most of the circuit elements 230 may be mounted on the mounting board 210X so that the element body of the circuit element 230 is located on the same surface side as the first surface 210a of the light-emitting element 220, that is, the mounting surface. In this case, the surface mount type first circuit element 231 is mounted on the mounting board 210X by being soldered to the first surface 210a of the mounting board 210X. Moreover, the 2nd circuit element 232 which is a lead assembly is mounted on the mounting board 210X by soldering the lead wire inserted from the 1st surface 210a to the 2nd surface 210b to the 2nd surface 210b.

又,比較例的照明器具1X中,因使用雙面基板作為安裝基板210X,故即使是附引線型發聲元件240,亦可使發聲元件240的元件本體位在與發光元件220的安裝面亦即第1面210a為相同面側的方式,而安裝於安裝基板210X。具體而言,藉由使從第1面210a往第2面210b插穿的引線焊接於第2面210b,而可將發聲元件240安裝於安裝基板210X。In addition, in the lighting fixture 1X of the comparative example, since a double-sided substrate is used as the mounting substrate 210X, even if the lead-type sounding element 240 is used, the element body of the sounding element 240 can be positioned on the mounting surface of the light-emitting element 220, that is, The first surface 210a is mounted on the mounting board 210X so as to be on the same surface side. Specifically, the sound generating element 240 can be mounted on the mounting board 210X by soldering the lead wire inserted from the first surface 210a to the second surface 210b to the second surface 210b.

如此,比較例的照明器具1X中,因可將發聲元件240安裝在與發光元件220的光射出側為相同的方向,故可使發聲元件240與發光元件220相同地朝向地板面。藉此,發聲元件240於發出聲音時,可容易滿足作為照明器具1X的期望音量基準(例如45dB以上)。In this way, in the lighting fixture 1X of the comparative example, since the sound emitting element 240 can be mounted in the same direction as the light emitting side of the light emitting element 220, the sound emitting element 240 and the light emitting element 220 can be directed toward the floor surface. Thereby, when the sound generating element 240 emits sound, it can easily satisfy the desired volume standard (for example, 45 dB or more) as the lighting fixture 1X.

然而,於如本實施形態中的照明器具1一樣,使用單面基板作為安裝基板210時,由於安裝發光元件220的面需有配線,故於使用附引線型發聲元件240時,必須將發聲元件240安裝在與發光元件220的安裝面為相反側的面。亦即,將發聲元件240安裝於安裝基板210的天花板側的面。結果,恐怕無法確保對於發聲元件240的期望音量,且無法滿足作為照明器具的期望音量基準。However, when a single-sided substrate is used as the mounting substrate 210 as in the lighting fixture 1 of the present embodiment, wiring is required on the surface on which the light-emitting element 220 is mounted. 240 is mounted on the surface opposite to the mounting surface of the light-emitting element 220 . That is, the sound-emitting element 240 is mounted on the ceiling-side surface of the mounting board 210 . As a result, there is a fear that the desired volume for the sound emitting element 240 cannot be secured, and the desired volume reference as a lighting fixture cannot be satisfied.

因此,於本實施形態的照明器具1及照明單元2中,如圖5所示,器具本體10具有隔著既定間隔與安裝基板210對向的對向部12a,安裝基板210具有第1開口部211,該第1開口部211形成在與器具本體10的對向部12a對向的位置。Therefore, in the lighting fixture 1 and the lighting unit 2 of the present embodiment, as shown in FIG. 5 , the fixture body 10 has the facing portion 12a facing the mounting board 210 at a predetermined interval, and the mounting board 210 has the first opening portion 211 , the first opening portion 211 is formed at a position facing the opposing portion 12 a of the instrument body 10 .

藉由此構成,即使使用單面基板作為安裝基板210,並將附引線的發聲元件240安裝在與安裝有安裝基板210的發光元件220的第1面210a為相反側的第2面210b,從發聲元件240所產生的聲音,於對向部12a等反射並通過第1開口部211,而從第2面210b側往第1面210a側前進。亦即,於發聲元件240所產生的聲音,從安裝基板210的天花板面側往地板面側移動。藉此,於發聲元件240發出聲音時可確保期望音量,故可滿足作為照明器具1的期望音量基準。因此,可實現改善發聲元件240音量的高品質的照明器具1。With this configuration, even if a single-sided substrate is used as the mounting substrate 210, the leaded sound emitting element 240 is mounted on the second surface 210b opposite to the first surface 210a of the light-emitting element 220 on which the mounting substrate 210 is mounted, from The sound generated by the sounding element 240 is reflected on the opposing portion 12a and the like, passes through the first opening portion 211, and travels from the second surface 210b side to the first surface 210a side. That is, the sound generated by the sound generating element 240 moves from the ceiling surface side of the mounting board 210 to the floor surface side. Thereby, the desired volume can be ensured when the sound generating element 240 emits sound, so that the desired volume standard as the lighting fixture 1 can be satisfied. Therefore, a high-quality lighting fixture 1 in which the sound volume of the sound emitting element 240 is improved can be realized.

特別是,於本實施形態中,於形成有第1開口部211的安裝基板210的一部分的第2面210b側,形成有藉由器具本體10的凹部12與安裝基板210所圍住的空間區。藉此,於發聲元件240所產生的聲音,可通過第1開口部211而容易往第1面210a側(地板面側)移動。因此,可容易實現改善發聲元件240音量的高品質的照明器具1。In particular, in this embodiment, on the side of the second surface 210b of a part of the mounting board 210 where the first opening 211 is formed, a space area surrounded by the recess 12 of the device body 10 and the mounting board 210 is formed . Thereby, the sound generated by the sound generating element 240 can easily move to the first surface 210a side (the floor surface side) through the first opening 211 . Therefore, a high-quality lighting fixture 1 in which the sound volume of the sound emitting element 240 is improved can be easily realized.

而且,附引線的發聲元件240相較於表面安裝型的發聲元件為低成本,故可抑制照明器具1的成本增加。Furthermore, the lead-attached sound emitting element 240 is lower in cost than the surface mount type sound emitting element, so that the cost increase of the lighting fixture 1 can be suppressed.

又,於本實施形態的照明器具1及照明單元2中,發聲元件240係安裝於第1開口部211的附近。Moreover, in the lighting fixture 1 and the lighting unit 2 of this embodiment, the sound-emitting element 240 is attached to the vicinity of the 1st opening part 211.

藉由此構成,於發聲元件240所產生的聲音容易通過第1開口部211,故更加容易滿足期望音量基準。With this configuration, the sound generated by the sound generating element 240 can easily pass through the first opening 211, and thus it is easier to satisfy the desired volume standard.

又,於本實施形態的照明器具1及照明單元2中,於發聲元件240的周邊,未安裝大型電路元件230。In addition, in the lighting fixture 1 and the lighting unit 2 of the present embodiment, the large circuit element 230 is not mounted on the periphery of the sound generating element 240 .

藉由此構成,可抑制於發聲元件240所產生的聲音被大型電路元件230遮蔽。藉此,於發聲元件240所產生的聲音容易通過第1開口部211,故更容易滿足期望音量基準。With this configuration, the sound generated by the sound generating element 240 can be suppressed from being blocked by the large circuit element 230 . In this way, the sound generated by the sound generating element 240 can easily pass through the first opening 211, so that it is easier to satisfy the desired volume standard.

又,於本實施形態的照明器具1及照明單元2中,更具有配置於該開口部附近的橫插式電連接器250。Moreover, in the lighting fixture 1 and the lighting unit 2 of this embodiment, the horizontal insertion type electrical connector 250 arrange|positioned in the vicinity of this opening part is further provided.

藉由此構成,即使是橫插式電連接器250,亦可容易將引線插入至電連接器250。例如,作業員將引線插入至電連接器250時,因可將拿著引線的使用者的手指的一部分(關節部等)放入至第1開口部211,故可抑制例如因手指碰到安裝基板210表面使安裝基板210成為阻礙而不易將引線插入至電連接器250的情形,可容易將引線插入至電連接器250。因此,第1開口部211的開口面積,宜為人的手指的一部分(關節部等)可放入左右的大小。With this configuration, even in the horizontal plug-in electrical connector 250 , the lead wires can be easily inserted into the electrical connector 250 . For example, when the operator inserts the lead wire into the electrical connector 250, since a part of the user's finger (joint part, etc.) holding the lead wire can be inserted into the first opening 211, it is possible to prevent, for example, the finger touching the installation. When the surface of the substrate 210 obstructs the mounting substrate 210 and it is difficult to insert the lead wire into the electrical connector 250 , the lead wire can be easily inserted into the electrical connector 250 . Therefore, the opening area of the first opening portion 211 is preferably a size in which a part of a human finger (joint portion, etc.) can be inserted into the left and right sides.

又,本實施形態的照明器具1,更具備:電路蓋30,覆蓋複數之電路元件230中之安裝於安裝基板210的第1面210a的電路元件230。Moreover, the lighting fixture 1 of this embodiment is further provided with the circuit cover 30 which covers the circuit element 230 mounted on the 1st surface 210a of the mounting board 210 among the circuit elements 230 of the plurality.

本實施形態中,如圖5所示,複數之電路元件230中,於安裝基板210的第1面210a安裝表面安裝型的第1電路元件231,而於安裝基板210的第2面210b安裝附引線的第2電路元件232。亦即,於配置有電路蓋30的第1面210a,安裝高度較低的電路元件230,而於第2面210b,安裝高度較高的電路元件230。藉此,如圖5所示,針對本實施形態的照明器具1的電路蓋30,與圖6所示的比較例的照明器具1X的電路蓋30X相比,可降低高度。藉此,於本實施形態的照明器具1中,可抑制發光元件220的光被電路蓋30所遮蔽。In the present embodiment, as shown in FIG. 5 , among the plurality of circuit elements 230 , the surface mount type first circuit elements 231 are mounted on the first surface 210 a of the mounting board 210 , and the circuit elements 231 of the surface mount type are mounted on the second surface 210 b of the mounting board 210 . The second circuit element 232 of the lead. That is, the circuit element 230 with a lower height is mounted on the first surface 210a on which the circuit cover 30 is arranged, and the circuit element 230 with a higher height is mounted on the second surface 210b. As a result, as shown in FIG. 5 , the circuit cover 30 of the lighting fixture 1 of the present embodiment can be reduced in height compared to the circuit cover 30X of the lighting fixture 1X of the comparative example shown in FIG. 6 . Thereby, in the lighting fixture 1 of this embodiment, the light of the light emitting element 220 can be suppressed from being blocked by the circuit cover 30 .

又,於本實施形態的照明器具1中,於電路蓋30形成缺口部30a,缺口部30a以樹脂蓋31所覆蓋。Moreover, in the lighting fixture 1 of this embodiment, the notch part 30a is formed in the circuit cover 30, and the notch part 30a is covered with the resin cover 31. As shown in FIG.

藉由此構成,即使安裝基板210的第1開口部211由電路蓋30所覆蓋,因發聲元件240所產生的聲音,不易從缺口部30a與樹脂蓋31的間隙洩出,故可滿足期望音量基準。With this configuration, even if the first opening 211 of the mounting board 210 is covered by the circuit cover 30, the sound generated by the sound generating element 240 is not easily leaked from the gap between the notch 30a and the resin cover 31, so that the desired volume can be satisfied. benchmark.

(變形例) 以上,針對本發明的照明器具,依據實施形態進行說明,但本發明不限於上述實施形態。(Variation) As mentioned above, although the lighting fixture of this invention was demonstrated based on embodiment, this invention is not limited to the said embodiment.

例如,上述實施形態中,發聲元件240所產生的聲音所通過的第1開口部211,於安裝基板210僅形成1個,但不限於此。亦即,亦可於安裝基板210形成複數個第1開口部211。藉此,因可使於發聲元件240所產生的聲音,更容易從安裝基板210的第2面210b側往第1面210a側移動,故可更容易滿足期望音量基準。For example, in the above-described embodiment, only one first opening 211 through which the sound generated by the sound emitting element 240 passes is formed on the mounting board 210 , but the present invention is not limited to this. That is, a plurality of first openings 211 may be formed in the mounting substrate 210 . Accordingly, since the sound generated by the sound generating element 240 can be more easily moved from the second surface 210b side to the first surface 210a side of the mounting board 210, it is easier to satisfy the desired volume standard.

又,上述實施形態中,基台的一例係以器具本體10為例,但不限於此。例如,基台亦可為鋁壓鑄製或高熱傳導樹脂製的散熱座等。In addition, in the above-mentioned embodiment, an example of a base is the apparatus main body 10 as an example, but it is not limited to this. For example, the base may be made of aluminum die casting or a heat sink made of high thermal conductivity resin.

又,上述實施形態中,光源模組20係由1個安裝基板210所構成,但不限於此。例如,亦可藉由排列複數個安裝有發光元件220的圓弧狀基板,而構成1個圓環狀的光源模組。In addition, in the above-mentioned embodiment, the light source module 20 is constituted by one mounting board 210, but it is not limited to this. For example, one annular light source module may be formed by arranging a plurality of arc-shaped substrates on which the light-emitting elements 220 are mounted.

又,上述實施形態中,發光元件220係SMD類型的LED元件,但不限於此。例如,亦可為使用LED晶片(裸晶片)本身作為發光元件220再將此LED晶片直接安裝(1次安裝)於基板上之COB(Chip On Board:晶片直接封裝)類型的光源模組。此情形時,安裝於基板上的複數個LED晶片,可藉由密封構件總括密封,亦可個別密封。又,此密封構件亦可如上所述含有黄色螢光體等波長轉換材料。In addition, in the above-described embodiment, the light-emitting element 220 is an SMD type LED element, but it is not limited to this. For example, it can also be a COB (Chip On Board) type light source module in which the LED chip (bare chip) itself is used as the light emitting element 220 and the LED chip is directly mounted (once mounted) on the substrate. In this case, the plurality of LED chips mounted on the substrate may be collectively sealed by the sealing member, or may be individually sealed. Moreover, this sealing member may contain wavelength conversion materials, such as a yellow fluorescent substance, as mentioned above.

又,上述實施形態中,發光元件220係為藉由藍色LED晶片與黄色螢光體而放出白色光的B-Y類型的白色LED光源,但不限於此。例如,可使用含有紅色螢光體及綠色螢光體的含螢光體樹脂,藉由將該含螢光體樹脂與藍色LED晶片組合而放出白色光。又,為了提高演色性,亦可除了黄色螢光體外,再混入紅色螢光體或綠色螢光體。又,亦可使用發出藍色以外顏色的LED晶片,例如,使用放出波長較藍色LED晶片所放出的藍色光為短的紫外線之紫外線LED晶片,藉由主要由紫外線所激發而放出藍色光、紅色光及綠色光之藍色螢光體、綠色螢光體及紅色螢光體而放出白色光。Furthermore, in the above-described embodiment, the light-emitting element 220 is a B-Y type white LED light source that emits white light by using a blue LED chip and a yellow phosphor, but it is not limited to this. For example, a phosphor-containing resin containing a red phosphor and a green phosphor can be used, and white light can be emitted by combining the phosphor-containing resin with a blue LED chip. Furthermore, in order to improve the color rendering properties, in addition to the yellow phosphor, a red phosphor or a green phosphor may be mixed. In addition, LED chips that emit colors other than blue can also be used. For example, an ultraviolet LED chip that emits ultraviolet rays with a wavelength shorter than that of blue light emitted by blue LED chips can be used to emit blue light by being mainly excited by ultraviolet rays. The blue phosphor, green phosphor and red phosphor of red light and green light emit white light.

又,上述實施形態中,發光元件220的光源係以LED為例,但亦可使用如半導體雷射等半導體發光元件、有機EL(Electro Luminescence)或無機EL等之其他固體發光元件。In the above-mentioned embodiment, the light source of the light-emitting element 220 is an LED, but other solid-state light-emitting elements such as semiconductor lasers, organic EL (Electro Luminescence), or inorganic EL can also be used.

又,上述實施形態中,作為遙控接收部以外的功能部,亦可於內部設置檢測照明器具周邊的明亮度之明亮感測器、以紅外線檢測人體之人體感應器、或拍攝周邊影像之影像感測器。Furthermore, in the above-described embodiment, as a functional unit other than the remote control receiving unit, a brightness sensor for detecting the brightness around the lighting fixture, a human body sensor for detecting a human body by infrared rays, or an image sensor for capturing images of the surrounding area may be provided inside. tester.

又,上述實施形態中,照明器具1亦可於內部設置以有線或無線方式輸出照明器具1所接收的聲音之擴音器。此情形時,例如,可控制擴音器,使與光源模組20的點亮同步從擴音器輸出聲音。In addition, in the above-described embodiment, the lighting fixture 1 may be provided with a speaker inside which outputs the sound received by the lighting fixture 1 in a wired or wireless manner. In this case, for example, the loudspeaker can be controlled to output sound from the loudspeaker in synchronization with the lighting of the light source module 20 .

此外,對於上述實施形態施加所屬技術領域中具通常知識者所思及之各種變形而獲得的形態、或於不脫離本發明意旨的範圍任意組合上述實施形態的構成要素及功能而實現的形態,亦包含於本發明。In addition, the above-described embodiments may be obtained by applying various modifications that can be considered by those skilled in the art, or by arbitrarily combining the constituent elements and functions of the above-described embodiments within the scope of not departing from the spirit of the present invention. Also included in the present invention.

1、1X‧‧‧照明器具 2‧‧‧照明單元 10‧‧‧器具本體(基台) 10a‧‧‧第1面 10b‧‧‧第2面 11‧‧‧突出部 12‧‧‧凹部 12a‧‧‧對向部 13‧‧‧開口部 20、20X‧‧‧光源模組 210、210X‧‧‧安裝基板 210a‧‧‧第1面 210b‧‧‧第2面 211‧‧‧第1開口部 212‧‧‧第2開口部 220‧‧‧發光元件 230‧‧‧電路元件 231‧‧‧第1電路元件 232‧‧‧第2電路元件 240‧‧‧發聲元件 250‧‧‧電連接器 30、30X‧‧‧電路蓋 30a‧‧‧缺口部 31‧‧‧樹脂蓋 40‧‧‧光源蓋 41‧‧‧透鏡部 42‧‧‧突出部 50‧‧‧透光蓋 60‧‧‧筒狀構件 70‧‧‧支撐構件 CA‧‧‧電路區 EA‧‧‧發光區1. 1X‧‧‧Lighting 2‧‧‧Lighting unit 10‧‧‧Apparatus body (abutment) 10a‧‧‧Side 1 10b‧‧‧Side 2 11‧‧‧Protrusion 12‧‧‧Recess 12a‧‧‧Opposite part 13‧‧‧Opening 20, 20X‧‧‧Light source module 210, 210X‧‧‧ mounting board 210a‧‧‧Side 1 210b‧‧‧Side 2 211‧‧‧First opening 212‧‧‧Second opening 220‧‧‧Light-emitting element 230‧‧‧Circuit Components 231‧‧‧The first circuit element 232‧‧‧Second circuit element 240‧‧‧Sound components 250‧‧‧Electrical Connector 30, 30X‧‧‧circuit cover 30a‧‧‧Notch 31‧‧‧Resin cover 40‧‧‧Light source cover 41‧‧‧Lens 42‧‧‧Projection 50‧‧‧Translucent cover 60‧‧‧cylindrical member 70‧‧‧Support member CA‧‧‧circuit area EA‧‧‧Light-emitting area

【圖1】實施形態的照明器具的剖面圖。 【圖2】實施形態的照明器具的分解立體圖。 【圖3A】從天花板側所見之實施形態的光源模組的立體圖。 【圖3B】從地板側所見之實施形態的光源模組的立體圖。 【圖4】實施形態的光源模組的俯視圖。 【圖5】實施形態的照明器具的半剖面圖。 【圖6】比較例的照明器具的半剖面圖。Fig. 1 is a cross-sectional view of the lighting fixture of the embodiment. [ Fig. 2 ] An exploded perspective view of the lighting fixture according to the embodiment. 3A is a perspective view of the light source module of the embodiment seen from the ceiling side. 3B is a perspective view of the light source module of the embodiment seen from the floor side. FIG. 4 is a plan view of the light source module of the embodiment. [ Fig. 5 ] A half cross-sectional view of the lighting fixture of the embodiment. [ Fig. 6 ] A half cross-sectional view of a lighting fixture of a comparative example.

1‧‧‧照明器具 1‧‧‧Lighting

10‧‧‧器具本體(基台) 10‧‧‧Apparatus body (abutment)

11‧‧‧突出部 11‧‧‧Protrusion

12‧‧‧凹部 12‧‧‧Recess

12a‧‧‧對向部 12a‧‧‧Opposite part

20‧‧‧光源模組 20‧‧‧Light source module

210‧‧‧安裝基板 210‧‧‧Mounting board

210a‧‧‧第1面 210a‧‧‧Side 1

210b‧‧‧第2面 210b‧‧‧Side 2

211‧‧‧第1開口部 211‧‧‧First opening

220‧‧‧發光元件 220‧‧‧Light-emitting element

230‧‧‧電路元件 230‧‧‧Circuit Components

231‧‧‧第1電路元件 231‧‧‧The first circuit element

232‧‧‧第2電路元件 232‧‧‧Second circuit element

240‧‧‧發聲元件 240‧‧‧Sound components

30‧‧‧電路蓋 30‧‧‧Circuit cover

40‧‧‧光源蓋 40‧‧‧Light source cover

50‧‧‧透光蓋 50‧‧‧Translucent cover

Claims (9)

一種照明單元,包含:基台;安裝基板,安裝於該基台,係為在其第1面形成配線的單面基板;1個以上的發光元件,安裝於該安裝基板的該第1面;複數之電路元件,安裝於該安裝基板,構成產生用以使該發光元件發光的電力之電源電路;及發聲元件,安裝在與該安裝基板的該第1面背向的第2面;該基台具有隔著既定間隔與該安裝基板對向的對向部,該安裝基板具有:形成在與該對向部對向的位置之第1開口部、及形成於該安裝基板的中央部之第2開口部;於該安裝基板安裝在該基台的狀態下,該第1開口部內並未插入任何構件;該第2開口部之中心,與該基台之開口部的中心一致;該發光元件有複數個,複數之該發光元件以圍住該第2開口部的方式排列;該照明單元,更包含:橫插式電連接器,配置於該第1開口部的附近。 A lighting unit, comprising: a base; a mounting substrate mounted on the base, which is a single-sided substrate on which wiring is formed on a first surface; one or more light-emitting elements mounted on the first surface of the mounting substrate; A plurality of circuit elements are mounted on the mounting substrate to constitute a power supply circuit for generating electric power for causing the light-emitting element to emit light; and sound-emitting elements are mounted on a second surface opposite to the first surface of the mounting substrate; the base The stage has an opposing portion facing the mounting board at a predetermined interval, and the mounting board has a first opening formed at a position facing the opposing portion, and a first opening formed in a central portion of the mounting board 2 openings; when the mounting substrate is mounted on the base, no member is inserted into the first opening; the center of the second opening is consistent with the center of the opening of the base; the light-emitting element There are a plurality of the light-emitting elements arranged in a manner to surround the second opening; the lighting unit further includes: a horizontal plug-in electrical connector disposed near the first opening. 如申請專利範圍第1項之照明單元,其中,該發聲元件係安裝於該第1開口部的附近。 The lighting unit of claim 1, wherein the sound-emitting element is installed near the first opening. 如申請專利範圍第1或2項之照明單元,其中, 該複數之電路元件包含對於俯視時的該安裝基板的投影面積為100mm2以上的大型電路元件,於該發聲元件的周邊,未安裝該大型電路元件。 The lighting unit according to claim 1 or 2, wherein the plurality of circuit elements include large circuit elements with a projected area of 100 mm 2 or more on the mounting substrate in plan view, and the sound-emitting element is not mounted around the sound-emitting element. Large circuit components. 如申請專利範圍第1或2項之照明單元,其中,於該安裝基板,形成螺絲孔,以作為該第1開口部及該第2開口部以外的貫穿孔。 The lighting unit according to claim 1 or 2, wherein screw holes are formed on the mounting substrate as through holes other than the first opening and the second opening. 如申請專利範圍第4項之照明單元,其中,該第1開口部的開口面積,大於該螺絲孔的開口面積。 The lighting unit of claim 4, wherein the opening area of the first opening is larger than the opening area of the screw hole. 一種照明器具,更包含:如申請專利範圍第1~5項中之任一項所記載的照明單元;及透光蓋,覆蓋該照明單元。 A lighting fixture further comprising: the lighting unit as described in any one of items 1 to 5 in the scope of the patent application; and a light-transmitting cover covering the lighting unit. 如申請專利範圍第6項之照明器具,更包含:電路蓋,覆蓋著該複數之電路元件中之安裝於該安裝基板的該第1面之電路元件。 The lighting apparatus of claim 6 of the scope of the application further comprises: a circuit cover covering the circuit element mounted on the first surface of the mounting substrate among the plurality of circuit elements. 如申請專利範圍第7項之照明器具,其中,於該電路蓋,形成缺口部,該缺口部係由樹脂蓋所覆蓋。 The lighting fixture according to claim 7, wherein a notch is formed in the circuit cover, and the notch is covered by a resin cover. 如申請專利範圍第6~8中任一項之照明器具,其中,該照明器具,係設置於天花板的吸頂燈,安裝著該發聲元件之該安裝基板的該第2面係天花板側的面。 The lighting fixture according to any one of claims 6 to 8, wherein the lighting fixture is a ceiling lamp installed on a ceiling, and the second surface of the mounting substrate to which the sound-emitting element is mounted is a ceiling-side surface.
TW108107949A 2018-03-14 2019-03-11 Lighting units and lighting fixtures TWI774937B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-046302 2018-03-14
JP2018046302A JP6964236B2 (en) 2018-03-14 2018-03-14 Lighting unit and lighting equipment

Publications (2)

Publication Number Publication Date
TW201938951A TW201938951A (en) 2019-10-01
TWI774937B true TWI774937B (en) 2022-08-21

Family

ID=67996319

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108107949A TWI774937B (en) 2018-03-14 2019-03-11 Lighting units and lighting fixtures

Country Status (2)

Country Link
JP (1) JP6964236B2 (en)
TW (1) TWI774937B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2021174710A (en) * 2020-04-27 2021-11-01 パナソニックIpマネジメント株式会社 Lighting fixture

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202133871U (en) * 2011-04-29 2012-02-01 重庆欧凯电器有限公司 Household electrical appliance timer turn button with photo-acoustic indication
TWM524426U (en) * 2014-11-27 2016-06-21 Panasonic Ip Man Co Ltd Lighting fixture

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007003630A (en) * 2005-06-21 2007-01-11 Denso Corp Display device
JP5545083B2 (en) * 2010-07-07 2014-07-09 ソニー株式会社 Speaker device
TWM474883U (en) * 2013-12-04 2014-03-21 Lee Hsiang Yu Led lamp with audio function
JP6374770B2 (en) * 2014-11-14 2018-08-15 アイリスオーヤマ株式会社 LED lighting device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN202133871U (en) * 2011-04-29 2012-02-01 重庆欧凯电器有限公司 Household electrical appliance timer turn button with photo-acoustic indication
TWM524426U (en) * 2014-11-27 2016-06-21 Panasonic Ip Man Co Ltd Lighting fixture

Also Published As

Publication number Publication date
JP6964236B2 (en) 2021-11-10
TW201938951A (en) 2019-10-01
JP2019160592A (en) 2019-09-19

Similar Documents

Publication Publication Date Title
JP6678312B2 (en) Lighting equipment
JP2017045951A (en) LED module and luminaire having the same
JP6695058B2 (en) lighting equipment
TWI774937B (en) Lighting units and lighting fixtures
JP6775180B2 (en) Lighting device
JP6741978B2 (en) lighting equipment
JP2017050080A (en) Led module and lighting fixture including the same
JP6846635B2 (en) lighting equipment
JP6979598B2 (en) Lighting equipment and electrical equipment
JP6635251B2 (en) Lighting equipment
JP6516183B2 (en) Lighting device
JP6604594B2 (en) lighting equipment
JP6685006B2 (en) lighting equipment
TWI719279B (en) Lighting equipment
JP6604572B2 (en) lighting equipment
JP5999558B2 (en) Illumination light source and illumination device
TWI748190B (en) Lighting fixtures
JP7223995B2 (en) lighting equipment
JP2011029095A (en) Illumination fixture
CN219300688U (en) Lighting device
JP7065324B2 (en) lighting equipment
CN220817537U (en) Lighting device and lighting fixture
JP7038291B2 (en) Lighting equipment
JP2023119882A (en) Illuminating device
JP6489305B2 (en) Light emitting device, light source for illumination, and inspection method for light emitting device

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent