TWI719279B - Lighting equipment - Google Patents

Lighting equipment Download PDF

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TWI719279B
TWI719279B TW107104217A TW107104217A TWI719279B TW I719279 B TWI719279 B TW I719279B TW 107104217 A TW107104217 A TW 107104217A TW 107104217 A TW107104217 A TW 107104217A TW I719279 B TWI719279 B TW I719279B
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light
emitting
substrate
circuit
area
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TW107104217A
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TW201829956A (en
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杉浦友博
古川高司
車谷壽光
秋月徹人
仁保勝義
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日商松下知識產權經營股份有限公司
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Abstract

照明器具(100)包含有器具本體(106)、裝設於器具本體(106)之基板(11)、配置於基板(11)之主面(11a)的複數之發光元件(20)、受光部(30),該受光部(30)配置於基板(11)之主面(11a)的包含配置有複數之發光元件(20)的區域之發光部區域(13b),並可接收用以控制複數之發光元件(20)的發光狀態之光。The luminaire (100) includes a luminaire body (106), a substrate (11) installed on the luminaire body (106), a plurality of light-emitting elements (20) and a light-receiving part arranged on the main surface (11a) of the substrate (11) (30), the light-receiving part (30) is arranged on the main surface (11a) of the substrate (11), including the light-emitting part area (13b) of the area where a plurality of light-emitting elements (20) are arranged, and can receive and control the plural number The light of the light-emitting state of the light-emitting element (20).

Description

照明器具Lighting fixtures

本發明係有關於一種包含有配置於基板之複數的發光元件之照明器具。The present invention relates to a lighting fixture including a plurality of light-emitting elements arranged on a substrate.

以往,已知有一種例如配置於天花板之照明器具亦即吸頂燈。舉例而言,記載於專利文獻1之以往的吸頂燈包含有器具本體、用以將器具本體裝設於營造材之器具裝設部、支撐於器具本體之光源基板及電路基板。於光源基板安裝有複數之發光二極體(LED:Light Emitting Diode)。於電路基板安裝有構成用以使複數之LED各LED點亮的點亮電路。In the past, there has been known, for example, a ceiling lamp, which is a lighting fixture arranged on a ceiling. For example, the conventional ceiling lamp described in Patent Document 1 includes an appliance main body, an appliance installation part for installing the appliance main body on a construction material, a light source substrate and a circuit board supported on the appliance main body. A plurality of light emitting diodes (LED: Light Emitting Diode) are mounted on the light source substrate. The circuit board is mounted with a lighting circuit for lighting each LED of plural LEDs.

在此吸頂燈,於配置成環狀之光源基板的內側之區域配置有紅外線遙控信號接收部。紅外線遙控信號接收部經由配置於其前面側(照明光之射出方向側)之點亮裝置蓋的開口部,接收紅外線遙控信號(控制信號)。 [先前技術文獻] [專利文獻]In this ceiling lamp, an infrared remote control signal receiver is arranged in the area inside the light source substrate arranged in a ring shape. The infrared remote control signal receiving unit receives an infrared remote control signal (control signal) through the opening of the lighting device cover arranged on the front side (the side where the illuminating light is emitted). [Prior Technical Document] [Patent Document]

[專利文獻1]日本專利公開公報2012-146666號[Patent Document 1] Japanese Patent Publication No. 2012-146666

[發明欲解決之問題] 在具有接收用以控制動作之光(光信號)的受光部之照明器具中,一般於電源電路(亦稱為點亮電路或驅動電路等)或電源電路附近配置受光部,且於前面側配置以遮光性高之原材料(金屬等)形成的電路蓋。此時,一般如上述以往之吸頂燈般,於蓋設開口部,而可以受光部接收光信號。[Problem to be solved by the invention] In lighting fixtures that have a light-receiving part that receives light (light signal) for controlling actions, the light-receiving part is generally placed near the power circuit (also called the lighting circuit or the driving circuit, etc.) or the power circuit Part, and a circuit cover made of a material (metal, etc.) with high light-shielding properties is arranged on the front side. At this time, generally, like the above-mentioned conventional ceiling lamp, an opening is provided in the cover, and the light receiving part can receive light signals.

然而,即使於受光部之正面的位置形成有開口部時,仍有位於受光部之前方的電路蓋妨礙光信號入射至受光部之可能性。結果,例如遙控器可控制照明器具之範圍(以照明器具之位置為基準時遙控器可控制照明器具之遙控器所在範圍)較小。However, even when an opening is formed on the front side of the light-receiving portion, there is still a possibility that the circuit cover located in front of the light-receiving portion prevents the light signal from entering the light-receiving portion. As a result, for example, the range in which the remote controller can control the lighting appliance (the range where the remote controller can control the lighting appliance based on the position of the lighting appliance) is small.

本發明考慮上述以往之問題,其目的在於提供包含有接收用以控制複數之發光元件的發光狀態之光的受光部且易使光到達受光部之照明器具。 [解決問題之手段]The present invention takes the above-mentioned conventional problems into consideration, and its object is to provide a lighting fixture that includes a light-receiving portion that receives light for controlling the light-emitting state of a plurality of light-emitting elements, and that easily allows the light to reach the light-receiving portion. [Means to Solve the Problem]

本發明之一態樣的照明器具包含有器具本體、基板、複數之發光元件、及受光部,該基板裝設於該器具本體;該複數之發光元件配置於該基板之主面;該受光部配置於該基板之該主面的包含配置有該複數之發光元件的區域之發光部區域,並可接收用以控制該複數之發光元件的發光狀態之光。 [發明之功效]An aspect of the luminaire of the present invention includes an appliance body, a substrate, a plurality of light-emitting elements, and a light-receiving part. The substrate is mounted on the appliance body; the plurality of light-emitting elements are arranged on the main surface of the substrate; the light-receiving part The light-emitting portion area including the area where the plurality of light-emitting elements are arranged on the main surface of the substrate, and can receive light for controlling the light-emitting state of the plurality of light-emitting elements. [Effects of Invention]

根據本發明,可提供包含有接收用以控制複數之發光元件的發光狀態之光的受光部且易使光到達受光部之照明器具。According to the present invention, it is possible to provide a lighting fixture that includes a light-receiving portion that receives light for controlling the light-emitting state of a plurality of light-emitting elements, and can easily make the light reach the light-receiving portion.

[用以實施發明之形態] 以下,就實施形態及其變形例,一面參照圖式,一面說明。此外,以下說明之實施形態及變形例分別為顯示本發明一具體例者。因而,在以下實施形態及變形例所示之數值、形狀、材料、構成要件、構成要件之配置位置及連接形態等為一例,並非限定本發明之主旨。是故,關於以下實施形態及變形例之構成要件中未記載於顯示本發明最上位概念之獨立請求項的構成要件,以任意之構成要件來說明。[Modes for Carrying Out the Invention] Hereinafter, embodiments and their modifications will be described with reference to the drawings. In addition, the embodiment and the modified example described below each show a specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions, and connection forms of the constituent elements shown in the following embodiments and modified examples are just examples, and do not limit the gist of the present invention. Therefore, in the following embodiments and modified examples, the constituent requirements that are not described in the independent claims showing the highest concept of the present invention will be described in terms of arbitrary constituent requirements.

此外,各圖為示意圖,未必嚴密地顯示圖式。又,在各圖中,有對實質上相同之結構附上相同之符號而省略或簡略化重複之說明的情形。In addition, each figure is a schematic diagram, and the figure may not be shown strictly. In addition, in each figure, the same reference numerals are attached to substantially the same structures, and repeated descriptions may be omitted or simplified.

(實施形態) 以下,就實施形態之照明器具100作說明。(Embodiment) Hereinafter, the lighting fixture 100 of the embodiment will be described.

[照明器具之全體結構] 首先,一面參照圖1及圖2,一面就實施形態之照明器具100的全體結構作說明。圖1係實施形態之照明器具100的分解立體圖。圖2係顯示實施形態之發光模組10的結構概要之平面圖。[Entire structure of lighting fixture] First, referring to FIGS. 1 and 2, the entire structure of the lighting fixture 100 of the embodiment will be described. Fig. 1 is an exploded perspective view of a lighting fixture 100 according to the embodiment. FIG. 2 is a plan view showing the outline of the structure of the light emitting module 10 of the embodiment.

如圖1所示,本實施形態之照明器具100係裝設於例如天花板4之吸頂燈。此外,圖1之上方(Z軸正方向)相當於與天花板4對向之地板面(圖中未示)的方向。亦即,圖1之照明器具100以與平常使用時上下相反之姿勢顯示。As shown in FIG. 1, the lighting fixture 100 of this embodiment is installed in the ceiling lamp of the ceiling 4, for example. In addition, the upper side of FIG. 1 (the positive direction of the Z-axis) corresponds to the direction of the floor surface (not shown in the figure) facing the ceiling 4. That is, the lighting fixture 100 of FIG. 1 is displayed in a posture that is opposite to that of normal use.

本實施形態之照明器具100包含有器具本體106、及裝設於器具本體106之發光模組10。發光模組10具有基板11、及配置於基板11之主面11a的複數之發光元件20。在本實施形態中,於基板11之主面11a更配置有複數之電路零件80,以該等複數之電路零件80構成電源電路90。在本實施形態中,照明器具100更包含有電路蓋150、光源蓋160、照明蓋140及器具裝設部8。The lighting fixture 100 of this embodiment includes a fixture body 106 and a light-emitting module 10 installed on the fixture body 106. The light-emitting module 10 has a substrate 11 and a plurality of light-emitting elements 20 arranged on the main surface 11 a of the substrate 11. In this embodiment, a plurality of circuit components 80 are further arranged on the main surface 11 a of the substrate 11, and the power circuit 90 is constituted by the plurality of circuit components 80. In this embodiment, the lighting fixture 100 further includes a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture installation portion 8.

[器具本體] 如圖1所示,器具本體106形成圓盤狀,係使用例如鋁板或鋼板等板金製成之構件。於器具本體106配置發光模組10等之側的面例如塗佈有光反射率高之白色塗料或蒸鍍有反射性金屬材料。[Apparatus main body] As shown in FIG. 1, the apparatus main body 106 is formed in a disc shape, and is a member made of sheet metal such as aluminum plate or steel plate. The surface on the side where the light-emitting module 10 and the like are arranged on the appliance body 106 is coated with a white paint with high light reflectivity or vapor-deposited with a reflective metal material, for example.

又,如圖1所示,於器具本體106之中央部形成有圓形開口部,並形成有從該開口部之周緣延伸至發光模組10側的大約圓筒狀之支撐部126。支撐部126係以例如樹脂形成之構件,具有可與器具裝設部8嵌合之構造。Moreover, as shown in FIG. 1, a circular opening is formed in the center of the appliance body 106, and an approximately cylindrical support 126 extending from the periphery of the opening to the side of the light-emitting module 10 is formed. The supporting portion 126 is a member formed of, for example, resin, and has a structure that can be fitted with the appliance mounting portion 8.

在器具本體106,支撐部126之周圍形成有階差部136,其外側更形成有裝設面部132。又,於裝設面部132之周圍形成有周緣部131。發光模組10裝設於器具本體106時,基板11之背面接觸裝設面部132,且於階差部136內之空間收容配置於基板11之背面的電路零件80等。In the appliance body 106, a step portion 136 is formed around the support portion 126, and an installation face portion 132 is formed on the outer side thereof. In addition, a peripheral edge portion 131 is formed around the installation surface portion 132. When the light-emitting module 10 is installed on the main body 106 of the apparatus, the back surface of the substrate 11 contacts the installation surface 132, and the space in the step portion 136 accommodates the circuit components 80 arranged on the back surface of the substrate 11 and the like.

[器具裝設部] 器具裝設部8藉插入至器具本體106之支撐部126的內部,而裝設於支撐部126。又,器具裝設部8裝卸自如地裝設於設置在天花板4之天花板側裝設構件9。如此,藉將器具裝設部8裝卸自如地裝設於天花板側裝設構件9,而將器具本體106裝卸自如地裝設於天花板4。此外,於器具本體106與天花板4之間配置有用以抑制器具本體106之搖晃的緩衝構件(圖中未示)。[Apparatus Installation Part] The appliance installation part 8 is inserted into the support part 126 of the appliance body 106 to be installed in the support part 126. In addition, the appliance installation portion 8 is detachably installed on the ceiling-side installation member 9 provided on the ceiling 4. In this way, by detachably installing the appliance installation portion 8 on the ceiling-side installation member 9, the appliance main body 106 is detachably installed on the ceiling 4. In addition, a buffer member (not shown in the figure) is arranged between the appliance body 106 and the ceiling 4 to suppress the shaking of the appliance body 106.

[發光模組] 如圖1及圖2所示,發光模組10具有基板11、配置於基板11之複數的發光元件20、配置於基板11之複數的電路零件80。[Light-emitting Module] As shown in FIGS. 1 and 2, the light-emitting module 10 has a substrate 11, a plurality of light-emitting elements 20 arranged on the substrate 11, and a plurality of circuit components 80 arranged on the substrate 11.

基板11俯視時(從基板11之厚度方向觀看基板11時)之外形為角被切斷的矩形,且於中央部形成有圓形開口部12。亦即,基板11呈環狀形狀。基板11係金屬配線形成有圖形之所謂印刷基板,在本實施形態中,採用樹脂基板作為基板11。於樹脂基板之兩面設有導體圖形(金屬配線)。即,基板11係例如稱為雙面印刷基板或雙面裝設用基板的基板之一種。此種基板可舉玻璃複合基板及玻璃環氧基板等為例示。The outer shape of the substrate 11 in a plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11) is a rectangle with cut corners, and a circular opening 12 is formed in the center. That is, the substrate 11 has a ring shape. The substrate 11 is a so-called printed substrate on which patterns of metal wiring are formed. In this embodiment, a resin substrate is used as the substrate 11. Conductor patterns (metal wiring) are provided on both sides of the resin substrate. That is, the substrate 11 is a kind of substrate called a double-sided printed board or a double-sided mounting substrate, for example. Such a substrate can be exemplified by a glass composite substrate and a glass epoxy substrate.

本實施形態之複數的發光元件20各為例如LED晶片封裝化之LED元件。即,發光模組10之安裝構造係LED晶片封裝化之LED元件安裝於基板11上之SMD(Surface Mount Device:表面安裝元件)構造。Each of the plurality of light-emitting elements 20 in this embodiment is, for example, an LED element packaged in an LED chip. That is, the mounting structure of the light-emitting module 10 is an SMD (Surface Mount Device) structure in which the LED element packaged by the LED chip is mounted on the substrate 11.

具體而言,如圖2所示,於基板11之主面11a的電路區域13a外周之區域亦即發光部區域13b配置有複數之發光元件20,該等複數之發光元件20以焊料與設於主面11a之導體圖形(金屬配線)連接。亦即,複數之發光元件20以表面安裝技術安裝於基板11之主面11a的發光部區域13b。此外,在本實施形態,發光部區域13b係基板11之主面11a的電路區域13a外周之所有區域。Specifically, as shown in FIG. 2, a plurality of light-emitting elements 20 are arranged on the outer periphery of the circuit area 13a of the main surface 11a of the substrate 11, that is, the light-emitting portion area 13b, and the plurality of light-emitting elements 20 are provided with solder and The conductor pattern (metal wiring) of the main surface 11a is connected. That is, a plurality of light-emitting elements 20 are mounted on the light-emitting area 13b of the main surface 11a of the substrate 11 by the surface mounting technology. In addition, in this embodiment, the light-emitting area 13b is the entire area of the outer periphery of the circuit area 13a on the main surface 11a of the substrate 11.

如圖2所示,該等複數之發光元件20以環狀方式排列配置成包圍基板11之電路區域13a。此外,並未特別限定複數之發光元件20的電性連接態樣。舉例而言,亦可形成複數個串聯之n(n為2以上之整數)個發光元件20的群組(發光元件群),並將該等複數個發光元件群並聯。又,配置於基板11之所有發光元件20亦可串聯。再者,在本實施形態中,以複數之發光元件20構成發光模組10之發光部25。As shown in FIG. 2, the plurality of light-emitting elements 20 are arranged in a ring-shaped manner to surround the circuit area 13 a of the substrate 11. In addition, the electrical connection of the plurality of light-emitting elements 20 is not particularly limited. For example, it is also possible to form a plurality of groups of n (n is an integer greater than or equal to 2) light-emitting elements 20 in series (light-emitting element groups), and connect the plurality of light-emitting element groups in parallel. Moreover, all the light-emitting elements 20 arranged on the substrate 11 may also be connected in series. Furthermore, in this embodiment, a plurality of light-emitting elements 20 constitute the light-emitting portion 25 of the light-emitting module 10.

基板11俯視時之中央部分(開口部12之周緣部分)的區域亦即電路區域13a係配置有1個以上之電路零件80的區域。該1個以上之電路零件80係構成用於複數之發光元件20的動作(點亮、熄滅、調光率之變更等)之電路的至少一部分之零件。在本實施形態中,於電路區域13a配置有複數之電路零件80,以該等複數之電路零件80構成將發光用電力供至複數之發光元件20的電源電路90。The area of the central portion (peripheral portion of the opening 12) of the substrate 11 in a plan view, that is, the area of the circuit area 13a, is an area where one or more circuit components 80 are arranged. The one or more circuit components 80 are components that constitute at least a part of the circuit used for the operation of the plurality of light-emitting elements 20 (turning on, turning off, changing the dimming rate, etc.). In this embodiment, a plurality of circuit components 80 are arranged in the circuit area 13a, and the plurality of circuit components 80 constitute a power supply circuit 90 that supplies light-emitting power to the plurality of light-emitting elements 20.

電源電路90將經由從例如器具本體106延伸設置之電纜(圖中未示)供給的交流電力轉換成適合複數之發光元件20的發光之直流電力後供至複數之發光元件20。藉此,複數之發光元件20可發光。The power circuit 90 converts AC power supplied via a cable (not shown) extending from the appliance body 106 into DC power suitable for light emission of the plurality of light-emitting elements 20, and supplies it to the plurality of light-emitting elements 20. Thereby, the plurality of light-emitting elements 20 can emit light.

構成電源電路90之複數的電路零件80分別係例如電解電容器或陶瓷電容器等電容元件、電阻元件、線圈元件、抗流線圈(抗流變壓器)、噪音濾波器、及二極體或積體電路元件等半導體元件等。The plural circuit components 80 constituting the power supply circuit 90 are capacitive elements such as electrolytic capacitors or ceramic capacitors, resistive elements, coil elements, choke coils (chance transformers), noise filters, and diodes or integrated circuit elements, respectively. And other semiconductor components.

在此,在本實施形態,於基板11之主面11a的發光部區域13b更配置有受光部30。具體而言,如圖2所示,受光部30配置於包含在發光部區域13b之複數的發光元件20之配置範圍(發光元件範圍14)的位置。在本實施形態中,複數之發光元件20排列成2層環狀,受光部30位於此2個環狀排列之間。Here, in this embodiment, the light-receiving portion 30 is further arranged in the light-emitting portion region 13b of the main surface 11a of the substrate 11. Specifically, as shown in FIG. 2, the light-receiving part 30 is arranged at a position including the arrangement range (light-emitting element range 14) of the plurality of light-emitting elements 20 in the light-emitting part region 13 b. In this embodiment, the plurality of light-emitting elements 20 are arranged in a two-layer ring, and the light receiving portion 30 is located between the two ring-shaped arrays.

受光部30係例如接收從用以控制照明器具100之點亮及熄滅等動作的遙控器發送之紅外光的電子零件。受光部30具有發光二極體等光電轉換元件,而將所接收之紅外光轉換成電信號(控制信號),將之發送至電源電路90。電源電路90根據所接收之控制信號,進行對發光部25之電力供給的開始、停止、或供給量之調整等。受光部30及其周邊之構造的細節使用圖3及圖4後述。The light receiving unit 30 is, for example, an electronic component that receives infrared light transmitted from a remote controller for controlling operations such as turning on and off the lighting fixture 100. The light receiving unit 30 has a photoelectric conversion element such as a light emitting diode, and converts the received infrared light into an electric signal (control signal), and sends it to the power circuit 90. The power supply circuit 90 performs start, stop, adjustment of the supply amount, etc. of the power supply to the light emitting unit 25 based on the received control signal. The details of the structure of the light receiving unit 30 and its surroundings will be described later using FIGS. 3 and 4.

此外,在圖2中以鏈線呈現之電路區域13a及發光部區域13b的交界不需可目視辨認地顯示於基板11,且形狀亦不需為順著基板11之外形的形狀。舉例而言,亦可以俯視時外接於以複數之電路零件80構成的電源電路90之假想線規定電路區域13a與發光部區域13b之交界。In addition, the boundary between the circuit area 13a and the light-emitting area 13b shown as a chain line in FIG. 2 does not need to be visually identifiable on the substrate 11, and the shape does not need to follow the outer shape of the substrate 11. For example, it is also possible to define the boundary between the circuit area 13a and the light-emitting area 13b by a virtual line external to the power supply circuit 90 composed of a plurality of circuit components 80 when viewed from above.

[電路蓋] 如圖1所示,電路蓋150係配置成覆蓋配置於基板11之複數的電路零件80之構件。亦即,電路蓋150係覆蓋配置於基板11之電路區域13a的電源電路90之構件。電路蓋150在本實施形態以鐵或鋁等金屬形成,具不燃性。[Circuit Cover] As shown in FIG. 1, the circuit cover 150 is a member arranged to cover a plurality of circuit components 80 arranged on the substrate 11. That is, the circuit cover 150 is a member that covers the power supply circuit 90 disposed in the circuit area 13a of the substrate 11. The circuit cover 150 is formed of metal such as iron or aluminum in this embodiment, and is non-flammable.

又,形成電路蓋150之外側面的部分具有反射從發光部25發出之光的反射面之功能。In addition, the portion forming the outer side surface of the circuit cover 150 has a function of a reflective surface that reflects the light emitted from the light emitting portion 25.

此外,於電路蓋150之內面亦可配置例如樹脂製絕緣片。藉此,可使電路蓋150之內面靠近電路蓋150內部之電路零件80,結果,可使電路蓋150之高度(Z軸方向之寬度)小。藉此,可減低例如電路蓋150遮斷來自發光部25之照明光或朝向受光部30之紅外光的可能性。又,電路蓋150亦可不以金屬形成,而以例如難燃性樹脂形成。藉此,可謀求例如電路蓋150之小型化或輕量化。In addition, an insulating sheet made of resin, for example, may also be arranged on the inner surface of the circuit cover 150. Thereby, the inner surface of the circuit cover 150 can be made close to the circuit components 80 inside the circuit cover 150, and as a result, the height (width in the Z-axis direction) of the circuit cover 150 can be reduced. Thereby, it is possible to reduce the possibility that, for example, the circuit cover 150 blocks the illuminating light from the light-emitting portion 25 or the infrared light toward the light-receiving portion 30. In addition, the circuit cover 150 may not be formed of metal, but may be formed of, for example, a flame-retardant resin. Thereby, for example, the circuit cover 150 can be reduced in size or weight.

在本實施形態中,電路蓋150以例如圖中未示之複數的螺絲,與光源蓋160及發光模組10一同裝設於器具本體106。In this embodiment, the circuit cover 150 is installed on the appliance body 106 together with the light source cover 160 and the light-emitting module 10 using, for example, a plurality of screws not shown in the figure.

[光源蓋] 如圖1所示,光源蓋160係覆蓋發光模組10之複數的發光元件20之構件,以具有透光性(例如透明)之樹脂等形成。光源蓋160形成圈狀,以包圍電路蓋150之周圍且覆蓋配置成環狀之複數的發光元件20之狀態,固定於發光模組10之主面11a。[Light source cover] As shown in FIG. 1, the light source cover 160 is a member that covers the plurality of light emitting elements 20 of the light emitting module 10, and is formed of light-transmitting (for example, transparent) resin or the like. The light source cover 160 is formed in a ring shape and is fixed to the main surface 11a of the light emitting module 10 in a state of surrounding the circuit cover 150 and covering the plurality of light emitting elements 20 arranged in a ring shape.

又,光源蓋160具有複數之透鏡部161。複數之透鏡部161與複數之發光元件20一對一對應而設。透鏡部161可將例如來自對應之發光元件20的光之配光角擴大。即,透鏡部161具有使光發散之功能。如此,藉將透鏡部161對應各發光元件20來配置,可精密地控制例如來自複數之發光元件20各自的光之擴散。In addition, the light source cover 160 has a plurality of lens parts 161. The plural lens portions 161 are provided in one-to-one correspondence with the plural light-emitting elements 20. The lens portion 161 can expand the light distribution angle of the light from the corresponding light emitting element 20, for example. That is, the lens portion 161 has a function of diverging light. In this way, by arranging the lens portion 161 corresponding to each light-emitting element 20, it is possible to precisely control the diffusion of light from each of the plurality of light-emitting elements 20, for example.

此外,光源蓋160亦可不具有透鏡部161。光源蓋160亦可形成為例如將複數之發光元件20全部一併覆蓋之形狀及大小。In addition, the light source cover 160 may not have the lens part 161. The light source cover 160 may also be formed into a shape and size that covers all of the light-emitting elements 20, for example.

[照明蓋] 照明蓋140係覆蓋器具本體106裝設有發光模組10等之側的構件,以具透光性之樹脂形成。照明蓋140以例如乳白色之樹脂形成,可將來自各發光元件20之光擴散後射出至外部。又,照明蓋140對例如器具本體106裝卸自如地裝設。[Illumination Cover] The illumination cover 140 is a member covering the side of the appliance body 106 on which the light emitting module 10 and the like are installed, and is formed of a translucent resin. The lighting cover 140 is formed of, for example, milky white resin, and can diffuse the light from each light-emitting element 20 and emit it to the outside. In addition, the lighting cover 140 is detachably attached to the appliance body 106, for example.

[受光部之周邊的構造] 接著,就本實施形態之發光模組10具有的受光部30及其周邊的構造,使用圖3及圖4來說明。[Structure around the light-receiving part] Next, the structure of the light-receiving part 30 and its surroundings included in the light-emitting module 10 of the present embodiment will be described with reference to FIGS. 3 and 4.

圖3係顯示實施形態之發光模組10與光源蓋160的構造上之關係的立體圖。圖4係顯示實施形態之照明器具100的結構概要之截面圖。此外,圖4顯示了通過圖3所示之IV-IV線的YZ平面之照明器具100的截面之一部分。3 is a perspective view showing the structural relationship between the light emitting module 10 and the light source cover 160 of the embodiment. 4 is a cross-sectional view showing the outline of the structure of the lighting fixture 100 of the embodiment. In addition, FIG. 4 shows a part of the cross-section of the luminaire 100 in the YZ plane passing through the IV-IV line shown in FIG. 3.

在本實施形態之發光模組10中,如上述,複數之發光元件20以表面安裝技術安裝於基板11之主面11a的外周側之區域亦即發光部區域13b,於發光部區域13b更配置有受光部30。In the light-emitting module 10 of this embodiment, as described above, a plurality of light-emitting elements 20 are mounted on the outer peripheral side of the main surface 11a of the substrate 11, that is, the light-emitting area 13b, and are further arranged in the light-emitting area 13b. There is a light receiving part 30.

又,以複數之發光元件20構成的發光部25以光源蓋160覆蓋,於複數之發光元件20各自之正面(Z軸正側)配置光源蓋160具有的透鏡部161。In addition, the light emitting section 25 composed of a plurality of light emitting elements 20 is covered with a light source cover 160, and the lens section 161 of the light source cover 160 is arranged on the front surface (positive side of the Z axis) of each of the plurality of light emitting elements 20.

光源蓋160更於對應受光部30之位置具有形成收容受光部30之空間的收容部163。如圖4所示,收容部163呈覆蓋受光部30之形狀,從遙控器200發送之紅外光透過收容部163到達受光部30。The light source cover 160 further has a receiving portion 163 forming a space for receiving the light receiving portion 30 at a position corresponding to the light receiving portion 30. As shown in FIG. 4, the receiving portion 163 has a shape that covers the light receiving portion 30, and infrared light transmitted from the remote controller 200 passes through the receiving portion 163 to reach the light receiving portion 30.

又,在收容部163,對應受光部30接收光之部分亦即前端部的部分形成為比其周圍薄。藉此,可抑制受光部30接收之紅外光的損失(通過收容部163引起之損失)。又,由於可使照明光之射出方向(Z軸正方向)的收容部163之高度較低,故可抑制收容部163對從收容部163周邊之1個以上的透鏡部161射出之光的影響。In addition, in the accommodating portion 163, a portion corresponding to the tip portion of the light receiving portion 30 that receives light is formed to be thinner than the surrounding portion. Thereby, the loss of the infrared light received by the light receiving part 30 (loss caused by the receiving part 163) can be suppressed. In addition, since the height of the receiving portion 163 in the emission direction of the illuminating light (positive direction of the Z axis) can be made low, the influence of the receiving portion 163 on the light emitted from one or more lens portions 161 around the receiving portion 163 can be suppressed .

此外,在本實施形態中,受光部30以表面安裝技術安裝於基板11之主面11a。因此,如圖4所示,基板11以基板11之背面11b的受光部30背面側之區域亦接觸器具本體106之裝設面部132的狀態,裝設於裝設面部132。In addition, in the present embodiment, the light receiving unit 30 is mounted on the main surface 11a of the substrate 11 by a surface mounting technique. Therefore, as shown in FIG. 4, the substrate 11 is installed on the installation surface 132 in a state where the area on the back side of the light receiving portion 30 of the back surface 11 b of the substrate 11 is also in contact with the installation surface 132 of the appliance body 106.

如以上所說明,本實施形態之照明器具100包含有器具本體106、裝設於器具本體106之基板11、配置於基板11之主面11a的複數之發光元件20。照明器具100更包含有受光部30,該受光部30配置於基板11的主面11a之包含配置有複數之發光元件20的區域之發光部區域13b,並可接收用以控制複數之發光元件20的發光狀態之光。As described above, the lighting fixture 100 of this embodiment includes a fixture main body 106, a substrate 11 mounted on the fixture main body 106, and a plurality of light-emitting elements 20 arranged on the main surface 11a of the substrate 11. The luminaire 100 further includes a light-receiving portion 30 disposed on the main surface 11a of the substrate 11 in the light-emitting portion area 13b including the area where the plurality of light-emitting elements 20 are arranged, and can receive the light-emitting elements 20 for controlling the plurality of light-emitting elements 20 The light of the luminous state.

根據此結構,由於受光部30配置於射出照明光之發光部25(複數之發光元件20)所在之發光部區域13b,故不於前方(Z軸正方向)配置光透過性低之構件。具體而言,如圖4所示,受光部30配置於電路蓋150之外部。因此,可減低從遙控器200發送之紅外光被電路蓋150遮蔽之可能性。如此,照明器具100採用了光易到達受光部30之構造。According to this structure, since the light receiving unit 30 is arranged in the light emitting area 13b where the light emitting unit 25 (a plurality of light emitting elements 20) that emits illumination light is located, a member with low light transmittance is not arranged in the front (positive direction of the Z axis). Specifically, as shown in FIG. 4, the light receiving unit 30 is arranged outside the circuit cover 150. Therefore, the possibility that the infrared light transmitted from the remote controller 200 is shielded by the circuit cover 150 can be reduced. In this way, the luminaire 100 adopts a structure in which light can easily reach the light receiving unit 30.

又,在本實施形態中,受光部30配置於包含在發光部區域13b之複數的發光元件20之配置範圍(發光元件範圍14)的位置。In addition, in this embodiment, the light-receiving part 30 is arranged at a position including the arrangement range (light-emitting element range 14) of the plurality of light-emitting elements 20 in the light-emitting part region 13b.

藉此結構,例如受光部30更易接收來自遙控器200之紅外光。具體而言,若將受光部30配置於比起發光元件範圍14更靠近電源電路90之位置時,來自遙控器200之紅外光被電路蓋150遮蔽之可能性提高。又,發光元件範圍14係可發出來自複數之發光元件20的照明光之範圍,其設計成當於發光元件範圍14配置複數之發光元件20時,照明光照到的範圍很大之範圍。因而,從光可自大範圍入射至受光部30之觀點而言,於發光元件範圍14中配置受光部30這點有利。With this structure, for example, the light receiving unit 30 can more easily receive the infrared light from the remote controller 200. Specifically, if the light receiving unit 30 is arranged at a position closer to the power supply circuit 90 than the light emitting element range 14, the possibility that the infrared light from the remote controller 200 is blocked by the circuit cover 150 increases. In addition, the light-emitting element range 14 is a range that can emit illuminating light from a plurality of light-emitting elements 20, and is designed such that when a plurality of light-emitting elements 20 are arranged in the light-emitting element range 14, the illumination light reaches a wide range. Therefore, it is advantageous to arrange the light receiving unit 30 in the light emitting element range 14 from the viewpoint that light can enter the light receiving unit 30 from a wide range.

又,本實施形態之照明器具100包含有具透光性且具有成一體之覆蓋複數的發光元件20之部分及覆蓋受光部30之部分的光源蓋160。In addition, the lighting fixture 100 of the present embodiment includes a light source cover 160 that is translucent and has a part covering a plurality of light emitting elements 20 and a part covering the light receiving part 30 integrally.

根據此結構,可藉以例如從複數之發光元件20射出的光之擴散或複數之發光元件20的保護等為目的之光源蓋160,保護受光部30。亦即,可在不另外使用用以保護受光部30之構件下,利用光源蓋160之一部分來保護受光部30,藉此,可以例如簡易之結構,抑制受光部30之紅外光接收功能的惡化。According to this structure, the light-receiving part 30 can be protected by the light source cover 160 for the purpose of, for example, diffusion of light emitted from the plurality of light-emitting elements 20 or protection of the plurality of light-emitting elements 20. That is, without using a separate member for protecting the light receiving unit 30, a part of the light source cover 160 can be used to protect the light receiving unit 30, thereby, for example, a simple structure can suppress the deterioration of the infrared light receiving function of the light receiving unit 30 .

又,本實施形態之照明器具100包含有按照從受光部30輸出之信號運作且將發光用電力供至複數之發光元件20的電源電路90。電源電路90配置於基板11之主面11a的不同於發光部區域13b之區域亦即電路區域13a。In addition, the lighting fixture 100 of this embodiment includes a power supply circuit 90 that operates in accordance with a signal output from the light receiving unit 30 and supplies light-emitting power to the plurality of light-emitting elements 20. The power supply circuit 90 is arranged on the main surface 11a of the substrate 11, which is a region different from the light-emitting portion region 13b, that is, the circuit region 13a.

如此,由於在與發光部區域13b有所區分之區域配置電源電路90,故即使於例如基板11之主面11a配置高度較高之電路零件80時,亦可減低電源電路90(或電路蓋150)遮蔽來自複數之發光元件20的照明光及朝向受光部30之紅外光的可能性。又,由於在1片基板11配置電源電路90與發光部25,故相較於例如光源基板與電路基板為獨立分開之構件的情形,照明器具100之組裝較容易。In this way, since the power supply circuit 90 is arranged in an area separate from the light-emitting area 13b, even when the circuit components 80 with a relatively high height are arranged on the main surface 11a of the substrate 11, the power supply circuit 90 (or the circuit cover 150) can be reduced. ) The possibility of shielding the illuminating light from the plurality of light-emitting elements 20 and the infrared light toward the light receiving unit 30. In addition, since the power supply circuit 90 and the light emitting unit 25 are arranged on one substrate 11, the lighting fixture 100 is easier to assemble than when the light source substrate and the circuit substrate are separate components, for example.

又,在本實施形態中,在基板11之主面11a,發光部區域13b配置成包圍電路區域13a。In addition, in this embodiment, on the main surface 11a of the substrate 11, the light emitting region 13b is arranged so as to surround the circuit region 13a.

如此,藉於基板11之外周側配置發光部區域13b,在例如複數之發光元件20產生之熱易散發至照明器具100之外部。更詳而言之,在本實施形態中,於裝設面部132之周圍形成有周緣部131。因此,從基板11傳達至裝設面部132之熱的至少一部分傳達至其外周之周緣部131,而釋放至器具本體106之外部。此點對抑制複數之發光元件20及受光部30的惡化有利。In this way, by arranging the light emitting region 13b on the outer peripheral side of the substrate 11, the heat generated in, for example, the plurality of light emitting elements 20 is easily radiated to the outside of the lighting fixture 100. In more detail, in this embodiment, a peripheral edge portion 131 is formed around the installation surface portion 132. Therefore, at least a part of the heat transferred from the substrate 11 to the installation face 132 is transferred to the peripheral edge portion 131 of the outer periphery thereof, and is released to the outside of the appliance body 106. This point is advantageous in suppressing the deterioration of the plurality of light-emitting elements 20 and light-receiving portions 30.

又,本實施形態之照明器具100包含有覆蓋電源電路90且具遮光性之電路蓋150。In addition, the lighting fixture 100 of this embodiment includes a circuit cover 150 that covers the power supply circuit 90 and has light-shielding properties.

在此,在本實施形態,如上述,由於在基板11之發光部區域13b配置受光部30,故電路蓋150並不需要將受光部30配置於電路蓋150之內部時所需的、供受光部30接收從外部發送之紅外光的開口部。因此,可將例如電路蓋150之外面全區利用作為反射從複數之發光元件20(發光部25)發出的光之反射面。此時,在例如外觀上,可減低於位在照明器具100之中央部的電路蓋150形成暗部(光之反射無或極少之部分)的可能性。Here, in this embodiment, as described above, since the light-receiving portion 30 is arranged in the light-emitting area 13b of the substrate 11, the circuit cover 150 does not need to be used for receiving light when the light-receiving portion 30 is arranged inside the circuit cover 150. The opening portion 30 receives infrared light transmitted from the outside. Therefore, for example, the entire area of the outer surface of the circuit cover 150 can be used as a reflection surface that reflects the light emitted from the plurality of light-emitting elements 20 (light-emitting parts 25). At this time, in terms of appearance, for example, the possibility that the circuit cover 150 located at the center of the lighting fixture 100 forms a dark part (the part with no or very little reflection of light) can be reduced.

此外,照明器具100具有之受光部30的配置位置不限在上述實施形態所說明之配置位置。是故,以下,以與上述實施形態之差異為中心來說明具有受光部30之發光模組10的變形例。In addition, the arrangement position of the light receiving unit 30 included in the luminaire 100 is not limited to the arrangement position described in the above-mentioned embodiment. Therefore, in the following, a modification example of the light-emitting module 10 having the light-receiving portion 30 will be described centering on the difference from the above-mentioned embodiment.

(變形例1) 圖5係顯示實施形態之變形例1的發光模組10a之結構概要的平面圖。此外,在圖5中,裝設發光模組10a(基板11)之照明器具100的裝設面部132以虛線之圓呈現。(Modification 1) FIG. 5 is a plan view showing the outline of the configuration of a light-emitting module 10a according to Modification 1 of the embodiment. In addition, in FIG. 5, the installation surface 132 of the lighting fixture 100 on which the light-emitting module 10a (substrate 11) is installed is represented by a circle with a dotted line.

在圖5所示之發光模組10a,基板11具有俯視時從端緣突出而設且形成發光部區域13b之一部分的突出部15,受光部30配置於突出部15。In the light-emitting module 10a shown in FIG. 5, the substrate 11 has a protrusion 15 protruding from an edge in a plan view and forming a part of the light-emitting area 13b, and the light-receiving portion 30 is disposed on the protrusion 15.

根據此結構,可將例如連接於發光元件20之金屬配線與連接於受光部30之金屬配線擴大間隔配置。藉此,例如施加於發光元件20之電壓與施加於受光部30之電壓的差大時,可提高電氣安全性。According to this structure, for example, the metal wiring connected to the light emitting element 20 and the metal wiring connected to the light receiving portion 30 can be arranged with an enlarged interval. Thereby, for example, when the difference between the voltage applied to the light-emitting element 20 and the voltage applied to the light-receiving portion 30 is large, electrical safety can be improved.

此外,突出部15從基板11之直線狀端緣設成突出狀,因此,俯視時,配置於圓形裝設面部132之範圍內。亦即,即使設突出部15作為基板11之發光部區域13b的一部分時,亦可使基板11之背面11b的發光部區域13b背面側的區域全區面接觸裝設面部132。因此,在包含突出部15之發光部區域13b所產生的熱可以良好效率傳達至器具本體106。In addition, the protruding portion 15 is provided in a protruding shape from the linear end edge of the substrate 11, and therefore, is arranged within the range of the circular mounting surface portion 132 when viewed from above. That is, even when the protrusion 15 is provided as a part of the light-emitting portion region 13b of the substrate 11, the entire area on the back side of the light-emitting portion region 13b of the back surface 11b of the substrate 11 can be brought into surface contact with the mounting surface 132. Therefore, the heat generated in the light emitting region 13b including the protrusion 15 can be efficiently transferred to the appliance body 106.

(變形例2) 圖6係顯示實施形態之變形例2的發光模組10b之結構概要的平面圖。在圖6所示之發光模組10b中,於基板11之發光部區域13b形成有縫隙16,受光部30配置於縫隙16之側邊。(Modification 2) FIG. 6 is a plan view showing the outline of the structure of a light-emitting module 10b according to a modification 2 of the embodiment. In the light-emitting module 10b shown in FIG. 6, a slit 16 is formed in the light-emitting area 13b of the substrate 11, and the light-receiving part 30 is arranged on the side of the slit 16.

根據此結構,可使例如連接於發光元件20之金屬配線與連接於受光部30之金屬配線之間的沿面距離大。藉此,例如施加於發光元件20之電壓與施加於受光部30之電壓的差大時,可提高電氣安全性。又,在本變形例中,由於受光部30配置於2個縫隙16之間,故可使電氣安全性更確實化。According to this structure, for example, the creeping distance between the metal wiring connected to the light emitting element 20 and the metal wiring connected to the light receiving portion 30 can be increased. Thereby, for example, when the difference between the voltage applied to the light-emitting element 20 and the voltage applied to the light-receiving portion 30 is large, electrical safety can be improved. In addition, in this modification example, since the light receiving unit 30 is arranged between the two slits 16, the electrical safety can be more assured.

此外,縫隙16之寬度(圖6之X軸方向的寬度)例如只要適宜決定成不致在隔著縫隙16配置之2個金屬配線間產生放電即可。In addition, the width of the slit 16 (the width in the X-axis direction in FIG. 6) may be appropriately determined, for example, so as not to generate discharge between the two metal wirings arranged through the slit 16.

又,在圖6,縫隙16從基板11之端緣往基板11之中央部延伸設置,縫隙16之形狀及位置不限於此。縫隙16例如可俯視時形成彎曲狀,亦可不到達基板11之端緣。In addition, in FIG. 6, the slit 16 extends from the edge of the substrate 11 to the center of the substrate 11, and the shape and position of the slit 16 are not limited to this. For example, the slit 16 may be curved in a plan view, or may not reach the edge of the substrate 11.

又,藉於基板11之受光部30的側邊之位置設溝(未於厚度方向(Z軸方向)貫穿基板11之溝)取代縫隙16,亦可發揮安全性提高之效果。In addition, by providing grooves (not penetrating the grooves of the substrate 11 in the thickness direction (Z-axis direction)) at the positions on the sides of the light-receiving portion 30 of the substrate 11 instead of the slits 16, the effect of improving safety can also be exerted.

(其他實施形態) 以上,就本發明,依據實施形態及其變形例作了說明,本發明不限上述實施形態及各變形例。(Other Embodiments) As mentioned above, the present invention has been described based on the embodiments and modifications thereof, and the present invention is not limited to the above embodiments and modifications.

舉例而言,受光部30接收了從遙控器發送之紅外光作為用以控制複數之發光元件20的發光狀態之光。然而,照明器具100亦可具有例如拍攝照明對象空間之拍攝裝置作為受光部。此時,照明器具100亦可依據例如拍攝裝置所拍攝之圖像,判斷人是否存在於照明對象空間、或照明對象空間之亮度等,按判斷結果,控制複數之發光元件20的發光狀態(點亮、熄滅、調光率等)。又,照明器具100亦可以有線通信或無線通信,將拍攝裝置所拍攝之圖像發送至外部之機器。此時,外部之機器亦可解析所接收之圖像,將依據解析結果之控制信號發送至照明器具100。亦即,照明器具100亦可依據外部機器解析該圖像之結果,控制複數之發光元件20的發光狀態。For example, the light receiving unit 30 receives infrared light transmitted from the remote controller as light for controlling the light emitting state of the plurality of light emitting elements 20. However, the lighting fixture 100 may have, for example, a photographing device that photographs the lighting target space as the light receiving unit. At this time, the lighting fixture 100 can also determine whether a person exists in the lighting object space, or the brightness of the lighting object space, etc., based on the image captured by the camera, and control the light-emitting state (points) of the plurality of light-emitting elements 20 according to the determination result. On, off, dimming rate, etc.). In addition, the lighting fixture 100 may also be capable of wired communication or wireless communication to send the image captured by the camera to an external device. At this time, an external machine can also analyze the received image, and send a control signal based on the analysis result to the lighting fixture 100. That is, the lighting fixture 100 can also control the light-emitting state of the plurality of light-emitting elements 20 according to the result of analyzing the image by an external device.

又,舉例而言,發光模組10之基板11除了在上述實施形態所例示之玻璃複合基板及玻璃環氧基板以外,亦可採用例如由表面塗覆有樹脂之金屬材料構成的金屬基底基板。此時,例如以表面安裝技術安裝於基板11之主面11a的複數之發光元件20及複數之電路零件80的熱經由基板11以良好效率傳導至器具本體106。Furthermore, for example, the substrate 11 of the light-emitting module 10 can also be a metal base substrate made of a metal material coated with a resin in addition to the glass composite substrate and the glass epoxy substrate exemplified in the above embodiment. At this time, for example, the heat of the plurality of light-emitting elements 20 and the plurality of circuit components 80 mounted on the main surface 11a of the substrate 11 by surface mounting technology is conducted to the appliance body 106 via the substrate 11 with good efficiency.

又,基板11之外形不限例如圖2所示之外形。舉例而言,發光模組10亦可具有中央具開口部之圓環狀基板11。In addition, the outer shape of the substrate 11 is not limited to, for example, the outer shape shown in FIG. 2. For example, the light-emitting module 10 may also have an annular substrate 11 with an opening in the center.

又,器具本體106之外形亦不限圖3等所示之外形。器具本體106例如俯視時可呈矩形等多角形之外形,亦可呈由直線及曲線構成之外形。In addition, the outer shape of the appliance body 106 is not limited to the outer shape shown in FIG. 3 and the like. For example, the appliance body 106 may have a polygonal outer shape such as a rectangle when viewed from above, or may have an outer shape composed of straight lines and curves.

又,配置於基板11之1個以上的電路零件80亦可構成不同於電源電路90之種類的電路(電子電路)。舉例而言,根據從照明器具100之外部發送的信號,將複數之發光元件20進行調光控制或調色控制之控制電路亦可以該1個以上之電路零件80構成。又,電源電路90亦可包含上述控制電路。In addition, one or more circuit components 80 arranged on the substrate 11 may constitute a circuit (electronic circuit) of a different type from the power supply circuit 90. For example, according to a signal sent from the outside of the luminaire 100, a control circuit that performs dimming control or color adjustment control on a plurality of light-emitting elements 20 may also be constituted by the one or more circuit components 80. In addition, the power supply circuit 90 may include the above-mentioned control circuit.

又,將發光用電力供至發光模組10之電源電路90亦可以配置於與基板11獨立分開之基板的複數之電路零件構成。再者,電源電路90亦可配置於照明器具100之外部。舉例而言,亦可於將直流電力供至照明器具100之電源箱內收容電源電路90。此時,例如只要受光部30與電源箱內之電源電路90以信號線連接,便亦可將控制信號從受光部30發送至電源電路90。In addition, the power supply circuit 90 for supplying light-emitting power to the light-emitting module 10 may also be configured with a plurality of circuit components arranged on a substrate separate from the substrate 11. Furthermore, the power supply circuit 90 can also be arranged outside the lighting fixture 100. For example, the power circuit 90 may also be housed in a power box that supplies DC power to the lighting equipment 100. At this time, for example, as long as the light receiving unit 30 and the power circuit 90 in the power box are connected by a signal line, the control signal can also be transmitted from the light receiving unit 30 to the power circuit 90.

又,發光元件20為SMD型LED元件,但不限於此。例如發光模組10亦可為LED晶片直接安裝於基板11之COB(Chip On Board:板上晶片封裝)構造。此時,藉以含有波長轉換材之密封構件將安裝於基板11上之複數的LED晶片一併密封或個別密封,可獲得預定之色溫的照明光。In addition, the light emitting element 20 is an SMD type LED element, but it is not limited to this. For example, the light-emitting module 10 may also be a COB (Chip On Board) structure in which LED chips are directly mounted on the substrate 11. At this time, the plurality of LED chips mounted on the substrate 11 are sealed together or individually sealed by the sealing member containing the wavelength conversion material, so that illuminating light with a predetermined color temperature can be obtained.

又,在上述實施形態及變形例中,發光元件20以LED晶片封裝化之LED元件為例示。然而,亦可採用半導體雷射等半導體發光元件、或者有機EL(Electro Luminescence:電激發光)或無機EL等之EL元件等其他種類的固體發光元件作為發光元件20。In addition, in the above-mentioned embodiments and modifications, the light-emitting element 20 is an LED element packaged with an LED chip as an example. However, semiconductor light-emitting elements such as semiconductor lasers, or other types of solid-state light-emitting elements, such as organic EL (Electro Luminescence) or inorganic EL elements, can also be used as the light-emitting element 20.

此外,對上述實施形態及其變形例施行該業者想出來之各種變形而得出的形態、及藉在不脫離本發明之旨趣的範圍任意地組合各實施形態及其變形例的構成要件及功能而實現的形態亦包含在本發明內。In addition, the above-mentioned embodiment and its modification examples are subjected to various modifications conceived by the manufacturer, and the configuration requirements and functions of each embodiment and its modification examples are arbitrarily combined without departing from the scope of the present invention. The implementation form is also included in the present invention.

4‧‧‧天花板8‧‧‧器具裝設部9‧‧‧天花板側裝設構件10‧‧‧發光模組10a‧‧‧發光模組10b‧‧‧發光模組11‧‧‧基板11a‧‧‧主面11b‧‧‧背面13a‧‧‧電路區域13b‧‧‧發光部區域14‧‧‧發光元件範圍15‧‧‧突出部16‧‧‧縫隙20‧‧‧發光元件25‧‧‧發光部30‧‧‧受光部80‧‧‧電路零件90‧‧‧電源電路100‧‧‧照明器具106‧‧‧器具本體126‧‧‧支撐部131‧‧‧周緣部132‧‧‧裝設面部136‧‧‧階差部140‧‧‧照明蓋150‧‧‧電路蓋160‧‧‧光源蓋161‧‧‧透鏡部163‧‧‧收容部200‧‧‧遙控器IV-IV‧‧‧線X‧‧‧方向Y‧‧‧方向Z‧‧‧方向4‧‧‧Ceiling 8‧‧‧Appliance installation part 9‧‧‧Ceiling side installation member 10‧‧‧Light-emitting module 10a‧‧‧Light-emitting module 10b‧‧‧Light-emitting module 11‧‧‧Substrate 11a‧ ‧‧Main surface 11b‧‧‧Back surface 13a‧‧‧Circuit area 13b‧‧‧Light-emitting area 14‧‧‧Light-emitting element range 15‧‧‧Protrusion 16‧‧‧Gap 20‧‧‧Light-emitting element 25‧‧‧ Light-emitting part 30‧‧‧Light-receiving part 80‧‧‧Circuit parts 90‧‧‧Power circuit 100‧‧‧Lighting appliance 106‧‧‧Apparatus body 126‧‧‧Support part 131‧‧‧Perimeter part 132‧‧Installation Face 136‧‧‧Step part 140‧‧‧Lighting cover 150‧‧‧Circuit cover 160‧‧‧Light source cover 161‧‧‧Lens part 163‧‧‧Receiving part 200‧‧‧Remote control IV-IV‧‧‧ Line X‧‧‧Direction Y‧‧‧Direction Z‧‧‧Direction

圖1係實施形態之照明器具的分解立體圖。 圖2係顯示實施形態之發光模組的結構概要之平面圖。 圖3係顯示實施形態之發光模組與光源蓋的構造上之關係的立體圖。 圖4係顯示實施形態之照明器具的結構概要之截面圖。 圖5係顯示實施形態之變形例1的發光模組之結構概要的平面圖。 圖6係顯示實施形態之變形例2的發光模組之結構概要的平面圖。Fig. 1 is an exploded perspective view of the lighting fixture of the embodiment. Fig. 2 is a plan view showing the outline of the structure of the light emitting module of the embodiment. 3 is a perspective view showing the structural relationship between the light emitting module and the light source cover of the embodiment. Fig. 4 is a cross-sectional view showing the outline of the structure of the lighting fixture of the embodiment. Fig. 5 is a plan view showing an outline of the structure of a light emitting module according to Modification 1 of the embodiment. Fig. 6 is a plan view showing an outline of the structure of a light emitting module according to Modification 2 of the embodiment.

10‧‧‧發光模組 10‧‧‧Lighting Module

11‧‧‧基板 11‧‧‧Substrate

11a‧‧‧主面 11a‧‧‧Main side

11b‧‧‧背面 11b‧‧‧Back

13a‧‧‧電路區域 13a‧‧‧Circuit area

13b‧‧‧發光部區域 13b‧‧‧Light-emitting area

20‧‧‧發光元件 20‧‧‧Light-emitting element

25‧‧‧發光部 25‧‧‧Light-emitting part

30‧‧‧受光部 30‧‧‧Light receiving part

80‧‧‧電路零件 80‧‧‧Circuit parts

90‧‧‧電源電路 90‧‧‧Power circuit

160‧‧‧光源蓋 160‧‧‧Light source cover

161‧‧‧透鏡部 161‧‧‧Lens section

163‧‧‧收容部 163‧‧‧Containment Department

200‧‧‧遙控器 200‧‧‧Remote control

IV-IV‧‧‧線 IV-IV‧‧‧line

X‧‧‧方向 X‧‧‧direction

Y‧‧‧方向 Y‧‧‧ direction

Z‧‧‧方向 Z‧‧‧ direction

Claims (10)

一種照明器具,包含:器具本體;基板,裝設於該器具本體;複數之發光元件,配置於該基板之主面;及受光部,配置於該基板之該主面中的包含配置有該複數之發光元件的區域之發光部區域中,並可接收用以控制該複數之發光元件的發光狀態之光。 A lighting appliance includes: an appliance body; a substrate installed on the appliance body; a plurality of light-emitting elements arranged on the main surface of the substrate; and a light-receiving part arranged on the main surface of the substrate including the plurality of In the light-emitting area of the light-emitting element area, the light for controlling the light-emitting state of the plurality of light-emitting elements can be received. 如申請專利範圍第1項之照明器具,其中,該受光部配置於包含在該發光部區域中之該複數的發光元件之配置範圍的位置。 For example, the lighting fixture of the first item of the scope of patent application, wherein the light-receiving part is arranged at the position of the arrangement range of the plurality of light-emitting elements included in the light-emitting part area. 如申請專利範圍第2項之照明器具,其中,該複數之發光元件排列成雙層環狀,該受光部配置於該雙層環狀的排列之間。 For example, the luminaire of item 2 of the scope of patent application, wherein the plurality of light-emitting elements are arranged in a double-layer ring shape, and the light-receiving part is arranged between the double-layer ring-shaped arrays. 如申請專利範圍第1項至第3項中任一項之照明器具,更包含:光源蓋,具有透光性,且具有成一體之覆蓋該複數的發光元件之部分與覆蓋該受光部之部分。 For example, the lighting apparatus of any one of items 1 to 3 of the scope of the patent application further includes: a light source cover, which is translucent, and has an integrated part covering the plurality of light-emitting elements and a part covering the light-receiving part . 如申請專利範圍第4項之照明器具,其中,在該光源蓋之覆蓋該受光部的部分亦即收容部,對應於該受光部之前端部的部分形成為比其周圍薄。 For example, in the luminaire of item 4 of the scope of patent application, in the portion of the light source cover that covers the light receiving portion, that is, the receiving portion, the portion corresponding to the front end of the light receiving portion is formed to be thinner than its surroundings. 如申請專利範圍第1項至第3項中任一項之照明器具,更包含:電源電路,其按照從該受光部輸出之信號運作,並將發光用電力供至該複數之發光元件;該電源電路配置於該基板之該主面中的不同於該發光部區域之區域亦即電路區域。 For example, the lighting appliance of any one of items 1 to 3 of the scope of patent application further includes: a power supply circuit that operates according to the signal output from the light receiving part and supplies light-emitting power to the plurality of light-emitting elements; The power supply circuit is arranged in the area of the main surface of the substrate that is different from the light-emitting part area, that is, the circuit area. 如申請專利範圍第6項之照明器具,其中,在該基板之該主面,該發光部區域配置成包圍該電路區域。 For example, the luminaire of item 6 of the scope of patent application, wherein, on the main surface of the substrate, the light-emitting part area is arranged to surround the circuit area. 如申請專利範圍第6項之照明器具,更包含:電路蓋,其覆蓋該電源電路並具有遮光性。 For example, the lighting appliance of item 6 of the scope of patent application further includes: a circuit cover, which covers the power circuit and has light-shielding properties. 如申請專利範圍第1項至第3項中任一項之照明器具,其中,該基板具有突出部,該突出部係俯視時從端緣突出而設置,並形成該發光部區域之一部分,該受光部配置於該突出部。 For example, in the lighting appliance of any one of items 1 to 3 in the scope of the patent application, the substrate has a protruding portion, and the protruding portion is arranged to protrude from the end edge in a plan view, and forms a part of the light-emitting portion area. The light receiving part is arranged on the protruding part. 如申請專利範圍第1項至第3項中任一項之照明器具,其中,於該基板之該發光部區域形成有縫隙或溝,該受光部配置於該縫隙或溝之側邊。 For example, in the lighting appliance of any one of items 1 to 3 in the scope of patent application, a slit or groove is formed in the light-emitting area of the substrate, and the light-receiving part is arranged on the side of the slit or groove.
TW107104217A 2017-02-14 2018-02-07 Lighting equipment TWI719279B (en)

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JP2017-025147 2017-02-14
JP2017025147A JP6899546B2 (en) 2017-02-14 2017-02-14 lighting equipment

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JP2017022015A (en) * 2015-07-13 2017-01-26 パナソニックIpマネジメント株式会社 Lighting device and illumination apparatus using same

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