JP2018133172A - Lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a lighting device which includes a light receiving part which receives light for controlling light emitting states of multiple light emitting elements and enables the light to easily reach the light receiving part.SOLUTION: A lighting device 100 includes: a device body 106; a substrate 11 attached to the device body 106; multiple light emitting elements 20 disposed on a major surface 11a on the substrate 11; and a light receiving part 30 disposed at a light emitting part area 13b on the major surface 11a of the substrate 11 which includes an area at which the multiple light emitting elements 20 are disposed, the light receiving part 30 configured to receive light for controlling light emitting states of the multiple light emitting elements 20.SELECTED DRAWING: Figure 3

Description

  The present invention relates to a luminaire including a plurality of light emitting elements arranged on a substrate.

  2. Description of the Related Art Conventionally, for example, a ceiling light that is a lighting fixture disposed on a ceiling is known. For example, a conventional ceiling light described in Patent Document 1 includes an instrument main body, an instrument attachment portion for attaching the instrument main body to a construction material, and a light source substrate and a circuit board supported by the instrument main body. A plurality of light emitting diodes (LEDs) are mounted on the light source substrate. On the circuit board, a plurality of circuit components constituting a lighting circuit for lighting each of the plurality of LEDs are mounted.

  In this ceiling light, an infrared remote control signal receiving unit is arranged in a region inside the annular light source substrate. The infrared remote control signal receiving unit receives the infrared remote control signal (control signal) through the opening of the lighting device cover disposed on the front side (side in the illumination light emission direction).

JP 2012-146666 A

  In a luminaire having a light receiving portion that receives light (light signal) for operation control, the light receiving portion is generally disposed near a power supply circuit (also called a lighting circuit or a drive circuit) or the power supply circuit, and the front surface. On the side, a circuit cover made of a highly light-shielding material (metal or the like) is arranged. In this case, generally, like the above-described conventional ceiling light, an opening is provided in the cover so that the light signal can be received by the light receiving unit.

  However, the circuit cover positioned in front of the light receiving unit may interfere with the incidence of the optical signal to the light receiving unit even when the opening is formed in front of the light receiving unit. As a result, for example, the controllable range of the lighting fixture by the remote control (the range of the remote control capable of controlling the lighting fixture by the remote control based on the position of the lighting fixture) becomes relatively narrow.

  In view of the above-described conventional problems, the present invention provides a lighting fixture including a light receiving unit that receives light for controlling the light emission state of a plurality of light emitting elements, and easily allows light to reach the light receiving unit. The purpose is to do.

  The lighting fixture which concerns on 1 aspect of this invention is the fixture main body, the board | substrate attached to the said fixture main body, the several light emitting element arrange | positioned at the main surface of the said board | substrate, and the said plurality in the said main surface of the said board | substrate. A light receiving unit disposed in a light emitting unit region including a region in which the light emitting elements are disposed, the light receiving unit receiving light for controlling the light emission state of the plurality of light emitting elements.

  ADVANTAGE OF THE INVENTION According to this invention, it is a lighting fixture provided with the light-receiving part which receives the light for control of the light emission state of a several light emitting element, Comprising: The lighting fixture which is easy to make light arrive at a light-receiving part can be provided.

Drawing 1 is an exploded perspective view of the lighting fixture concerning an embodiment. FIG. 2 is a plan view illustrating a configuration outline of the light emitting module according to the embodiment. FIG. 3 is a perspective view showing a structural relationship between the light emitting module and the light source cover according to the embodiment. FIG. 4 is a cross-sectional view illustrating a schematic configuration of the lighting apparatus according to the embodiment. FIG. 5 is a plan view illustrating a configuration outline of a light emitting module according to Modification 1 of the embodiment. FIG. 6 is a plan view illustrating a configuration outline of a light emitting module according to Modification 2 of the embodiment.

  Embodiments and modifications thereof will be described below with reference to the drawings. Each of the embodiments and modifications described below shows a specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions of components, connection forms, and the like shown in the following embodiments and modifications are merely examples and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments and modifications, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a schematic diagram and is not necessarily shown strictly. Moreover, in each figure, the same code | symbol is attached | subjected to the substantially same structure, and the overlapping description may be abbreviate | omitted or simplified.

(Embodiment)
Hereinafter, the lighting fixture 100 which concerns on embodiment is demonstrated.

[Overall configuration of lighting equipment]
First, the whole structure of the lighting fixture 100 which concerns on embodiment is demonstrated, referring FIG.1 and FIG.2. FIG. 1 is an exploded perspective view of a lighting apparatus 100 according to an embodiment. FIG. 2 is a plan view showing a schematic configuration of the light emitting module 10 according to the embodiment.

  As shown in FIG. 1, the luminaire 100 according to the present embodiment is a ceiling light attached to the ceiling 4, for example. 1 corresponds to the direction of the floor surface (not shown) facing the ceiling 4. That is, the lighting fixture 100 in FIG. 1 is illustrated in a posture that is upside down from that during normal use.

  The lighting fixture 100 according to the present embodiment includes a fixture main body 106 and a light emitting module 10 attached to the fixture main body 106. The light emitting module 10 includes a substrate 11 and a plurality of light emitting elements 20 arranged on the main surface 11 a of the substrate 11. In the present embodiment, a plurality of circuit components 80 are further arranged on the main surface 11 a of the substrate 11, and a power supply circuit 90 is configured by the plurality of circuit components 80. In the present embodiment, the lighting fixture 100 further includes a circuit cover 150, a light source cover 160, a lighting cover 140, and a fixture mounting portion 8.

[Equipment body]
As shown in FIG. 1, the instrument body 106 is formed in a disk shape, and is a member made using, for example, a sheet metal such as an aluminum plate or a steel plate. For example, a white paint having a high light reflectance is applied or a reflective metal material is deposited on the surface of the instrument body 106 on the side where the light emitting module 10 or the like is disposed.

  As shown in FIG. 1, a circular opening is formed at the center of the instrument body 106, and a substantially cylindrical support 126 extending from the periphery of the opening toward the light emitting module 10 is formed. Has been. The support portion 126 is a member formed of, for example, resin, and has a structure that can be fitted to the instrument mounting portion 8.

  In the instrument main body 106, a stepped portion 136 is formed around the support portion 126, and an attachment surface portion 132 is further formed outside the stepped portion 136. In addition, a peripheral edge 131 is formed around the mounting surface portion 132. When the light emitting module 10 is attached to the instrument main body 106, the back surface of the substrate 11 contacts the mounting surface portion 132, and the circuit component 80 or the like disposed on the back surface of the substrate 11 is accommodated in the space in the stepped portion 136. .

[Equipment mounting part]
The instrument attachment portion 8 is attached to the support portion 126 by being inserted into the support portion 126 of the instrument main body 106. In addition, the fixture mounting portion 8 is detachably mounted on a ceiling side mounting member 9 installed on the ceiling 4. Thus, the fixture main body 106 is detachably attached to the ceiling 4 by the fixture attachment portion 8 being detachably attached to the ceiling side attachment member 9. A cushion member (not shown) for suppressing wobbling of the instrument body 106 is disposed between the instrument body 106 and the ceiling 4.

[Light emitting module]
As shown in FIGS. 1 and 2, the light emitting module 10 includes a substrate 11, a plurality of light emitting elements 20 disposed on the substrate 11, and a plurality of circuit components 80 disposed on the substrate 11.

  The substrate 11 has a rectangular shape with a corner cut off in a plan view (when the substrate 11 is viewed from the thickness direction of the substrate 11), and a circular opening 12 is formed at the center. That is, the substrate 11 has an annular shape. The substrate 11 is a so-called printed substrate on which metal wiring is patterned. In the present embodiment, a resin substrate is employed as the substrate 11. Conductive patterns (metal wiring) are provided on both surfaces of the resin base material. That is, the board 11 is a kind of board called a double-sided printed board or a double-sided mounting board, for example. Examples of such a substrate include a glass composite substrate and a glass epoxy substrate.

  Each of the plurality of light emitting elements 20 of the present embodiment is an LED element in which an LED chip is packaged, for example. That is, the mounting structure of the light emitting module 10 is an SMD (Surface Mount Device) structure in which an LED element in which an LED chip is packaged is mounted on a substrate 11.

  Specifically, as shown in FIG. 2, a plurality of light emitting elements 20 are arranged in a light emitting portion area 13 b that is an outer peripheral area of the circuit area 13 a on the main surface 11 a of the substrate 11. 20 is connected to the conductor pattern (metal wiring) provided on the main surface 11a by solder. That is, the plurality of light emitting elements 20 are surface-mounted on the light emitting portion region 13 b in the main surface 11 a of the substrate 11. In the present embodiment, the light emitting part region 13b is the entire region of the outer periphery of the circuit region 13a on the main surface 11a of the substrate 11.

  For example, as shown in FIG. 2, the plurality of light emitting elements 20 are arranged in a ring so as to surround the circuit region 13 a of the substrate 11. In addition, there is no limitation in particular in the aspect of the electrical connection of the some light emitting element 20. FIG. For example, a plurality of groups (light emitting element groups) of n (n is an integer of 2 or more) light emitting elements 20 connected in series may be formed, and the plurality of light emitting element groups may be connected in parallel. Moreover, all the light emitting elements 20 arranged on the substrate 11 may be connected in series. Further, in the present embodiment, the light emitting unit 25 in the light emitting module 10 is configured by the plurality of light emitting elements 20.

  The circuit region 13a, which is a region of the central portion (peripheral portion of the opening 12) of the substrate 11 in a plan view, is a region where one or more circuit components 80 are arranged. The one or more circuit components 80 are components that constitute at least a part of an electric circuit used for the operation (turning on, turning off, changing the dimming rate, etc.) of the plurality of light emitting elements 20. In the present embodiment, a plurality of circuit components 80 are arranged in the circuit region 13 a, and a power supply circuit 90 that supplies power for light emission to the plurality of light emitting elements 20 is configured by the plurality of circuit components 80. ing.

  The power supply circuit 90 converts, for example, AC power supplied via a cable (not shown) extending from the instrument body 106 into DC power suitable for light emission of the plurality of light emitting elements 20 and supplies the AC power. Thereby, the plurality of light emitting elements 20 emit light.

  Each of the plurality of circuit components 80 constituting the power supply circuit 90 includes, for example, a capacitive element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a coil element, a choke coil (choke transformer), a noise filter, and a diode or an integrated circuit element. And the like.

  Here, in the present embodiment, the light receiving unit 30 is further arranged in the light emitting unit region 13 b in the main surface 11 a of the substrate 11. Specifically, as shown in FIG. 2, the light receiving unit 30 is arranged at a position included in the arrangement range (the light emitting element range 14) of the plurality of light emitting elements 20 in the light emitting unit region 13 b. In the present embodiment, the plurality of light emitting elements 20 are arranged in a double ring shape, and the light receiving unit 30 is located between the two ring arrangements.

  The light receiving unit 30 is an electronic component that receives infrared light transmitted from a remote controller for controlling operations such as turning on and off the lighting fixture 100, for example. The light receiving unit 30 includes a photoelectric conversion element such as a photodiode, converts received infrared light into an electric signal (control signal), and transmits the electric signal to the power supply circuit 90. The power supply circuit 90 starts, stops, or adjusts the supply amount of power to the light emitting unit 25 according to the received control signal. Details of the light receiving unit 30 and the surrounding structure will be described later with reference to FIGS. 3 and 4.

  Note that the boundary between the circuit region 13a and the light emitting portion region 13b, which is represented by a one-dot chain line in FIG. 2, does not have to be displayed on the substrate 11 so as to be visible, and the shape also follows the outer shape of the substrate 11. It need not be in shape. For example, the boundary between the circuit region 13a and the light emitting unit region 13b may be defined by a virtual line circumscribing the power supply circuit 90 configured by a plurality of circuit components 80 in plan view.

[Circuit cover]
As shown in FIG. 1, the circuit cover 150 is a member arranged so as to cover a plurality of circuit components 80 arranged on the substrate 11. That is, the circuit cover 150 is a member that covers the power supply circuit 90 disposed in the circuit region 13 a of the substrate 11. In the present embodiment, the circuit cover 150 is made of metal such as iron or aluminum and has nonflammability.

  Further, the portion forming the outer surface of the circuit cover 150 functions as a reflecting surface that reflects the light emitted from the light emitting unit 25.

  For example, a resin insulating sheet may be disposed on the inner surface of the circuit cover 150. Thereby, the inner surface of the circuit cover 150 can be brought close to the circuit component 80 inside the circuit cover 150, and as a result, the height (width in the Z-axis direction) of the circuit cover 150 can be reduced. Thereby, for example, the possibility that the circuit cover 150 blocks the illumination light from the light emitting unit 25 or the infrared light toward the light receiving unit 30 is reduced. Further, the circuit cover 150 may be formed of, for example, a flame retardant resin instead of a metal. Thereby, for example, the circuit cover 150 can be reduced in size or weight.

  In the present embodiment, the circuit cover 150 is attached to the instrument main body 106 together with the light source cover 160 and the light emitting module 10 by, for example, a plurality of screws (not shown).

[Light source cover]
As shown in FIG. 1, the light source cover 160 is a member that covers the plurality of light emitting elements 20 of the light emitting module 10, and is formed of a light-transmitting (for example, transparent) resin or the like. The light source cover 160 is formed in a donut shape, and is fixed to the main surface 11 a of the light emitting module 10 so as to surround the circuit cover 150 and cover the plurality of light emitting elements 20 arranged in an annular shape.

  The light source cover 160 includes a plurality of lens portions 161. The plurality of lens portions 161 are provided in one-to-one correspondence with the plurality of light emitting elements 20. The lens part 161 expands the light distribution angle of the light from the corresponding light emitting element 20, for example. That is, the lens unit 161 has a function of diverging light. In this manner, by disposing the lens portions 161 corresponding to the individual light emitting elements 20, for example, the diffusion of light from each of the plurality of light emitting elements 20 can be precisely controlled.

  The light source cover 160 may not have the lens portion 161. For example, the light source cover 160 may be formed in a shape and size that collectively cover all of the plurality of light emitting elements 20.

[Lighting cover]
The illumination cover 140 is a member that covers the side of the instrument main body 106 on which the light emitting module 10 or the like is attached, and is formed of a resin having translucency. The illumination cover 140 is made of, for example, milky white resin, and can diffuse the light from each light emitting element 20 to be emitted to the outside. The illumination cover 140 is detachably attached to the instrument main body 106, for example.

[Structure around the light receiving area]
Next, the light receiving unit 30 included in the light emitting module 10 according to the present embodiment and the surrounding structure will be described with reference to FIGS.

  FIG. 3 is a perspective view showing a structural relationship between the light emitting module 10 and the light source cover 160 according to the embodiment. FIG. 4 is a cross-sectional view illustrating a schematic configuration of the lighting apparatus 100 according to the embodiment. FIG. 4 shows a part of a cross section of the luminaire 100 in the YZ plane passing through the line IV-IV shown in FIG.

  In the light emitting module 10 according to the present embodiment, as described above, the plurality of light emitting elements 20 are surface-mounted on the light emitting portion region 13b that is the outer peripheral region of the main surface 11a of the substrate 11, and the light emitting portion region 13b. Further, a light receiving unit 30 is arranged.

  In addition, the light emitting unit 25 configured by the plurality of light emitting elements 20 is covered with the light source cover 160, and a lens unit 161 included in the light source cover 160 is provided on each front surface (Z axis plus side) of the plurality of light emitting elements 20. Be placed.

  The light source cover 160 further includes a housing portion 163 that forms a space for housing the light receiving portion 30 at a position corresponding to the light receiving portion 30. As illustrated in FIG. 4, the housing portion 163 has a shape that covers the light receiving portion 30, and infrared light transmitted from the remote controller 200 passes through the housing portion 163 and reaches the light receiving portion 30.

  Moreover, in the accommodating part 163, the part corresponding to the front-end | tip part which is a part which receives light of the light-receiving part 30 is formed thinner than the circumference | surroundings. Thereby, the loss of the infrared light received by the light receiving unit 30 (loss due to passing through the housing unit 163) is suppressed. In addition, since the height of the housing portion 163 in the illumination light emission direction (Z-axis plus direction) can be made relatively low, the light emitted from one or more lens portions 161 around the housing portion 163 can be reduced. The influence of the accommodating part 163 is suppressed.

  In the present embodiment, the light receiving unit 30 is surface-mounted on the main surface 11 a of the substrate 11. Therefore, as shown in FIG. 4, the substrate 11 is attached to the attachment surface portion 132 in a state where the region on the back side of the light receiving portion 30 on the back surface 11 b of the substrate 11 is also in contact with the attachment surface portion 132 of the instrument body 106.

  As described above, the lighting fixture 100 according to the present embodiment includes the fixture main body 106, the substrate 11 attached to the fixture main body 106, and the plurality of light emitting elements 20 arranged on the main surface 11 a of the substrate 11. . The luminaire 100 is further a light receiving unit 30 arranged in a light emitting unit region 13b including a region where the plurality of light emitting elements 20 are arranged on the main surface 11a of the substrate 11, and the light emitting unit 20 is in a light emitting state. It has the light-receiving part 30 which receives the light for control.

  According to this configuration, since the light receiving unit 30 is disposed in the light emitting unit region 13b where the light emitting unit 25 (the plurality of light emitting elements 20) that emits illumination light is present, in the front (Z-axis plus direction), A member having low light transmittance is not disposed. Specifically, as shown in FIG. 4, the light receiving unit 30 is disposed outside the circuit cover 150. Therefore, the possibility that the infrared light transmitted from the remote controller 200 is blocked by the circuit cover 150 is reduced. Thus, in the lighting fixture 100, the structure where light reaches | attains the light-receiving part 30 easily is employ | adopted.

  Further, in the present embodiment, the light receiving unit 30 is arranged at a position included in the arrangement range (the light emitting element range 14) of the plurality of light emitting elements 20 in the light emitting unit region 13b.

  With this configuration, for example, the light receiving unit 30 can further easily receive infrared light from the remote controller 200. Specifically, if the light receiving unit 30 is disposed at a position closer to the power supply circuit 90 than the light emitting element range 14, the possibility that the infrared light from the remote controller 200 is shielded by the circuit cover 150 increases. The light emitting element range 14 is a range in which illumination light from a plurality of light emitting elements 20 is emitted, and when the plurality of light emitting elements 20 are arranged in the light emitting element range 14, the illumination light is designed to reach a wide range. Range. Therefore, disposing the light receiving unit 30 in the light emitting element range 14 is advantageous from the viewpoint that light can be incident on the light receiving unit 30 from a wide range.

  Moreover, the lighting fixture 100 which concerns on this Embodiment is provided with the light source cover 160 which has translucency and has the part which covers the several light emitting element 20, and the part which covers the light-receiving part 30 integrally.

  According to this configuration, for example, the light receiving unit 30 is protected by the light source cover 160 for the purpose of diffusing light emitted from the plurality of light emitting elements 20 or protecting the plurality of light emitting elements 20. That is, it is possible to protect the light receiving unit 30 by using a part of the light source cover 160 without separately using a member for protecting the light receiving unit 30, and thereby, for example, the light receiving unit 30 with a simple configuration. Degradation of the infrared light receiving function due to is suppressed.

  In addition, the lighting fixture 100 according to the present embodiment is a power supply circuit 90 that operates according to a signal output from the light receiving unit 30, and supplies power to the plurality of light emitting elements 20 for light emission. Is provided. The power supply circuit 90 is disposed in the circuit region 13 a that is a region different from the light emitting region 13 b on the main surface 11 a of the substrate 11.

  Thus, since the power supply circuit 90 is arranged in a region separated from the light emitting unit region 13b, for example, when a relatively tall circuit component 80 is arranged on the main surface 11a of the substrate 11. Even in this case, the possibility of shielding the illumination light from the plurality of light emitting elements 20 and the infrared light toward the light receiving unit 30 by the power supply circuit 90 (or the circuit cover 150) is reduced. Moreover, since the power supply circuit 90 and the light emission part 25 are arrange | positioned on the board | substrate 11 of 1 sheet, the assembly of the lighting fixture 100 is facilitated compared with the case where a light source board | substrate and a circuit board are separate bodies, for example. .

  In the present embodiment, the light emitting portion region 13b is arranged on the main surface 11a of the substrate 11 so as to surround the circuit region 13a.

  As described above, since the light emitting portion region 13b is arranged on the outer peripheral side of the substrate 11, for example, heat generated by the plurality of light emitting elements 20 easily escapes to the outside of the lighting fixture 100. More specifically, in the present embodiment, a peripheral edge 131 is formed around the mounting surface portion 132. Therefore, at least a part of the heat transmitted from the substrate 11 to the mounting surface portion 132 is transmitted to the outer peripheral edge portion 131 and released to the outside of the instrument main body 106. This is advantageous for suppressing deterioration of the plurality of light emitting elements 20 and the light receiving unit 30.

  Moreover, the lighting fixture 100 according to the present embodiment includes a circuit cover 150 that covers the power supply circuit 90 and has a light shielding property.

  Here, in the present embodiment, as described above, since the light receiving unit 30 is disposed in the light emitting unit region 13b of the substrate 11, the light receiving unit 30 is disposed in the circuit cover 150 inside the circuit cover 150. Since the light receiving unit 30 receives infrared light transmitted from the outside, which is necessary in the case, an opening is not necessary. Therefore, for example, the entire outer surface of the circuit cover 150 can be used as a reflecting surface that reflects light emitted from the plurality of light emitting elements 20 (light emitting units 25). In this case, for example, the possibility that a dark portion (a portion where light is not reflected or extremely small) is formed in the circuit cover 150 located in the center portion of the lighting fixture 100 is reduced.

  In addition, the arrangement position of the light receiving unit 30 included in the lighting fixture 100 is not limited to the arrangement position described in the above embodiment. Therefore, in the following, a modified example of the light emitting module 10 having the light receiving unit 30 will be described focusing on differences from the above embodiment.

(Modification 1)
FIG. 5 is a plan view showing a schematic configuration of the light emitting module 10a according to the first modification of the embodiment. In addition, in FIG. 5, the attachment surface part 132 of the lighting fixture 100 to which the light emitting module 10a (board | substrate 11) is attached is represented by the circle of the broken line.

  In the light emitting module 10a shown in FIG. 5, the substrate 11 is a protruding portion 15 that protrudes from the end edge in a plan view, and has a protruding portion 15 that forms a part of the light emitting portion region 13b. 30 is arranged in the protrusion 15.

  According to this configuration, for example, the metal wiring connected to the light emitting element 20 and the metal wiring connected to the light receiving unit 30 can be arranged with an increased interval. Thereby, for example, when the difference between the voltage applied to the light emitting element 20 and the voltage applied to the light receiving unit 30 is large, the electrical safety is improved.

  In addition, the protrusion part 15 is provided in the shape of protrusion from the linear edge of the board | substrate 11, Therefore, it arrange | positions in the range of the circular attachment surface part 132 in planar view. In other words, even when the protruding portion 15 is provided as a part of the light emitting portion region 13 b of the substrate 11, the entire region on the back side of the light emitting portion region 13 b on the back surface 11 b of the substrate 11 faces the mounting surface portion 132. Can be contacted. Therefore, the heat generated in the light emitting region 13 b including the protruding portion 15 is efficiently conducted to the instrument main body 106.

(Modification 2)
FIG. 6 is a plan view illustrating a configuration outline of a light emitting module 10b according to the second modification of the embodiment. In the light emitting module 10 b shown in FIG. 6, a slit 16 is formed in the light emitting part region 13 b of the substrate 11, and the light receiving part 30 is disposed on the side of the slit 16.

  According to this configuration, for example, the creeping distance between the metal wiring connected to the light emitting element 20 and the metal wiring connected to the light receiving unit 30 can be increased. Thereby, for example, when the difference between the voltage applied to the light emitting element 20 and the voltage applied to the light receiving unit 30 is large, the electrical safety is improved. In the present modification, the light receiving unit 30 is disposed between the two slits 16, so that electrical safety is further ensured.

  Note that the width of the slit 16 (the width in the X-axis direction in FIG. 6) may be determined as appropriate so that, for example, no discharge occurs between the two metal wirings arranged with the slit 16 in between.

  In FIG. 6, the slit 16 extends from the edge of the substrate 11 toward the center of the substrate 11, but the shape and position of the slit 16 are not limited to this. For example, the slit 16 may be formed in a curved shape in plan view, and may not reach the edge of the substrate 11.

  Further, providing a groove (a groove not penetrating the substrate 11 in the thickness direction (Z-axis direction)) in place of the slit 16 at a position on the side of the light receiving unit 30 of the substrate 11 can also improve the safety. Is played.

(Other embodiments)
As described above, the present invention has been described based on the embodiment and its modifications. However, the present invention is not limited to the above embodiment and each modification.

  For example, the light receiving unit 30 receives infrared light transmitted from a remote controller as light for controlling the light emission state of the plurality of light emitting elements 20. However, the lighting fixture 100 may include, for example, an imaging device that images the illumination target space as the light receiving unit. In this case, the luminaire 100 determines, for example, the presence or absence of a person in the illumination target space or the brightness of the illumination target space based on an image captured by the imaging device, and a plurality of light emitting elements according to the determination result. You may control 20 light emission states (lighting, light extinction, dimming rate, etc.). Moreover, the lighting fixture 100 may transmit the image imaged by the imaging device to an external device by wired communication or wireless communication. In this case, the external device may analyze the received image and transmit a control signal based on the analysis result to the lighting apparatus 100. That is, the luminaire 100 may control the light emission states of the plurality of light emitting elements 20 based on the analysis result of the image by an external device.

  For example, in addition to the glass composite substrate and the glass epoxy substrate exemplified in the above embodiment, for example, a metal base substrate made of a metal material with a resin-coated surface may be employed as the substrate 11 of the light emitting module 10. Good. In this case, for example, the heat of the plurality of light emitting elements 20 and the plurality of circuit components 80 that are surface-mounted on the main surface 11 a of the substrate 11 is efficiently conducted to the instrument body 106 through the substrate 11.

  Moreover, the external shape of the board | substrate 11 is not limited to the external shape shown, for example in FIG. For example, the light emitting module 10 may be provided with an annular substrate 11 having an opening at the center.

  Moreover, the external shape of the instrument main body 106 is not limited to the external shape shown in FIG. For example, the instrument body 106 may have a polygonal outer shape such as a rectangle in a plan view, or may have an outer shape composed of straight lines and curves.

  In addition, the one or more circuit components 80 arranged on the substrate 11 may constitute an electric circuit (electronic circuit) of a different type from the power supply circuit 90. For example, a control circuit that performs dimming control or toning control of the plurality of light emitting elements 20 according to a signal transmitted from the outside of the lighting fixture 100 may be configured by the one or more circuit components 80. Further, the power supply circuit 90 may include the control circuit.

  In addition, the power supply circuit 90 that supplies power for light emission to the light emitting module 10 may be configured by a plurality of circuit components arranged on a substrate separate from the substrate 11. Further, the power supply circuit 90 may be disposed outside the lighting fixture 100. For example, the power supply circuit 90 may be accommodated in a power supply box that supplies DC power to the lighting apparatus 100. Even in this case, for example, if the light receiving unit 30 and the power supply circuit 90 in the power supply box are connected by a signal line, the control signal can be transmitted from the light receiving unit 30 to the power supply circuit 90.

  Further, although the light emitting element 20 is an SMD type LED element, it is not limited to this. For example, the light emitting module 10 may have a COB (Chip On Board) structure in which an LED chip is directly mounted on the substrate 11. In this case, illumination light having a predetermined color temperature is obtained by sealing a plurality of LED chips mounted on the substrate 11 together or individually by a sealing member containing a wavelength conversion material. be able to.

  Moreover, in the said embodiment and modification, the LED element by which the LED chip was packaged as the light emitting element 20 was illustrated. However, other types of solid-state light emitting elements such as a semiconductor light emitting element such as a semiconductor laser or an EL element such as an organic EL (Electro Luminescence) or an inorganic EL may be adopted as the light emitting element 20.

  In addition, the form obtained by making various modifications conceived by those skilled in the art to the above-described embodiment and its modifications, and the components and functions in each embodiment and its modifications without departing from the spirit of the present invention Forms realized by arbitrarily combining these are also included in the present invention.

DESCRIPTION OF SYMBOLS 11 Board | substrate 11a Main surface 11b Back surface 13a Circuit area | region 13b Light emission part area | region 14 Light emitting element range 15 Protrusion part 16 Slit 20 Light emitting element 30 Light receiving part 80 Circuit component 90 Power supply circuit 100 Lighting fixture 106 Instrument body 150 Circuit cover 160 Light source cover

Claims (8)

An instrument body;
A substrate attached to the instrument body;
A plurality of light emitting elements disposed on a main surface of the substrate;
A light receiving unit disposed in a light emitting unit region including a region where the plurality of light emitting elements are disposed on the main surface of the substrate, and receives light for controlling a light emitting state of the plurality of light emitting elements. A lighting apparatus comprising a light receiving unit. The lighting device according to claim 1, wherein the light receiving unit is disposed at a position included in an arrangement range of the plurality of light emitting elements in the light emitting unit region. The lighting apparatus according to claim 1, further comprising a light source cover that has translucency and integrally includes a portion that covers the plurality of light emitting elements and a portion that covers the light receiving unit. Furthermore, a power supply circuit that operates according to a signal output from the light receiving unit, the power supply circuit supplying power for light emission to the plurality of light emitting elements,
The lighting apparatus according to claim 1, wherein the power supply circuit is disposed in a circuit region that is a region different from the light emitting region in the main surface of the substrate. The lighting fixture according to claim 4, wherein the light emitting portion region is arranged so as to surround the circuit region on the main surface of the substrate. Furthermore, the lighting fixture of Claim 4 or 5 provided with the circuit cover which has the light-shielding property which covers the said power supply circuit. The substrate is a protrusion provided to protrude from an edge in a plan view, and has a protrusion that forms a part of the light-emitting area.
The lighting device according to any one of claims 1 to 6, wherein the light receiving portion is disposed on the protruding portion. The illumination according to any one of claims 1 to 6, wherein a slit or a groove is formed in the light emitting part region of the substrate, and the light receiving part is disposed on a side of the slit or the groove. Instruments.

Images