TW202003402A - Method for producing glass film - Google Patents
Method for producing glass film Download PDFInfo
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- TW202003402A TW202003402A TW108118276A TW108118276A TW202003402A TW 202003402 A TW202003402 A TW 202003402A TW 108118276 A TW108118276 A TW 108118276A TW 108118276 A TW108118276 A TW 108118276A TW 202003402 A TW202003402 A TW 202003402A
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- glass film
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/07—Cutting armoured, multi-layered, coated or laminated, glass products
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- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
- C03B33/00—Severing cooled glass
- C03B33/09—Severing cooled glass by thermal shock
Abstract
Description
本發明是有關於一種玻璃膜的製造方法。The invention relates to a method for manufacturing a glass film.
玻璃膜例如為具有200 μm以下的厚度的薄板玻璃,通常其製造步驟中包括將玻璃膜割斷成所需尺寸的步驟。The glass film is, for example, a thin plate glass having a thickness of 200 μm or less, and the manufacturing process usually includes a step of cutting the glass film into a desired size.
作為用以將玻璃膜割斷的方法之一,有雷射割斷(例如參照專利文獻1)。該方法中,首先於玻璃膜的一端部的割斷預定線(假想存在的線)上、即割斷預定線的其中一端形成初期裂縫。其後,使藉由雷射進行加熱的加熱區域及追隨於該加熱區域的藉由冷媒進行冷卻的冷卻區域自玻璃膜的割斷預定線的一端部向另一端部依次掃描。藉此,利用因加熱區域與冷卻區域的溫度差而產生的熱應力,初期裂縫沿著割斷預定線發展,將玻璃膜割斷(通體(full body)切斷)。 [現有技術文獻] [專利文獻]As one of the methods for cutting the glass film, there is laser cutting (for example, refer to Patent Document 1). In this method, first, an initial crack is formed on a line to be cut (imaginary line) at one end of the glass film, that is, one end of the line to be cut. Thereafter, the heating area heated by the laser and the cooling area cooled by the cooling medium following the heating area are sequentially scanned from one end to the other end of the line to be cut of the glass film. Thereby, the thermal stress generated by the temperature difference between the heating area and the cooling area causes the initial crack to develop along the planned cutting line, and cuts the glass film (full body cut). [Prior Art Literature] [Patent Literature]
[專利文獻1]日本專利特開2011-144092號公報[Patent Document 1] Japanese Patent Laid-Open No. 2011-144092
[發明所欲解決之課題]
然而,如圖9所示,在對玻璃膜100進行雷射割斷時,難以於成為藉由初期裂縫的發展而形成的割斷部(割斷已完成的部分)101的終點的、割斷預定線102的另一端102a附近,確保用以同時形成加熱區域103與冷卻區域104的空間(參照鏈線所示的區域103、區域104)。其結果為有下述問題,即,如圖10所示,於割斷預定線102的另一端102a附近,無法使為了使初期裂縫發展所需的熱應力發揮作用,割斷部101於到達割斷預定線102的另一端102a之前停止,形成切割殘留部105。而且,如此於隨後將切割殘留部105折斷時,有時割斷部彎曲而偏離割斷預定線,無法獲得充分的尺寸精度。[Problems to be solved by the invention]
However, as shown in FIG. 9, when laser cutting the
本發明的課題在於以不產生切割殘留部的方式對玻璃膜沿著割斷預定線進行雷射割斷。 [解決課題之手段]An object of the present invention is to perform laser cutting of a glass film along a line to be cut so as not to cause cutting residue. [Means to solve the problem]
為了解決所述課題而創設的本發明是一種玻璃膜的製造方法,包括:割斷步驟,於藉由支持構件自背面側進行支持的玻璃膜的割斷預定線上形成初期裂縫後,藉由利用雷射的加熱及追隨於該加熱的利用冷媒的冷卻,使初期裂縫沿著割斷預定線發展,將玻璃膜割斷,所述玻璃膜的製造方法的特徵在於:於割斷步驟中,於玻璃膜的以割斷預定線為邊界的至少一個區域與支持構件之間,於除了割斷預定線的正下方以外的位置配置沿著割斷預定線延伸的支持棒,藉此於使玻璃膜的包含割斷預定線的部分自支持構件浮起的狀態下,將玻璃膜割斷。根據此種結構,即便於割斷預定線的另一端附近使初期裂縫發展的熱應力變得不充分,亦可防止形成切割殘留部的事態。The present invention created to solve the above-mentioned problems is a method of manufacturing a glass film, including a cutting step, after forming an initial crack on a planned line for cutting a glass film supported from the back side by a support member, by using a laser The heating and the cooling using the refrigerant following the heating, the initial cracks are developed along the planned cutting line, and the glass film is cut. The method of manufacturing the glass film is characterized in that: in the cutting step, the glass film is cut Between at least one region where the predetermined line is a boundary and the support member, a support rod extending along the predetermined cutting line is arranged at a position other than directly below the predetermined cutting line, thereby allowing the portion of the glass film containing the predetermined cutting line to When the support member floats, the glass film is cut. According to such a configuration, even if the thermal stress that causes the initial crack to develop in the vicinity of the other end of the planned cutting line becomes insufficient, it is possible to prevent the formation of a cutting residue.
產生此種現象的原因雖未查明,但考慮如下。即,玻璃膜的包含割斷預定線的部分成為自支持構件浮起的狀態,故而若沿著割斷預定線對玻璃膜進行雷射割斷,則以割斷預定線上的割斷部(割斷已完成的部分)為邊界的一個區域及另一區域欲分別獨立地回到更穩定的狀態(例如成為平面的狀態)。此種欲回到穩定狀態時發揮作用的力的方向及/或大小於以割斷部為邊界的一個區域與另一區域彼此不同。其結果可認為,對於割斷預定線上的未割斷部(割斷未完成的部分),與由雷射割斷所致的熱應力不同,例如撕裂力或剪切力等促進初期裂縫的發展的輔助的力發揮作用。因此可認為,即便使初期裂縫發展的熱應力變得不充分,亦由於此種輔助的力而初期裂縫的發展持續,防止切割殘留部的產生。Although the cause of this phenomenon has not been identified, it is considered as follows. That is, the portion of the glass film including the planned cutting line is in a state where it floats from the support member. Therefore, if the glass film is laser-cut along the planned cutting line, the cut portion on the planned cutting line (the part where the cutting is completed) One area and the other area that are the boundaries want to return to a more stable state (for example, a flat state) independently. The direction and/or magnitude of the force that acts when returning to a stable state is different from one area and another area bordered by the cut-off portion. As a result, it can be considered that the thermal stress caused by laser cutting is different from the uncut part (uncut part) on the planned cutting line, such as tearing force or shearing force, which assists the development of initial cracks. Force. Therefore, it is considered that even if the thermal stress for the development of the initial cracks becomes insufficient, the development of the initial cracks continues due to such an assisting force, and the occurrence of cutting residues is prevented.
所述結構中,亦可使玻璃膜的以割斷預定線為邊界的一個區域為玻璃膜的端部,藉由僅於該端部與支持構件之間配置支持棒,而於使玻璃膜的包含割斷預定線的部分於支持棒的一側自支持構件浮起的狀態下,將玻璃膜割斷。此種割斷方法於玻璃膜的端部的寬度(與割斷預定線正交的方向的尺寸)小時有效。In the above structure, an area of the glass film bordered by a predetermined cutting line may be an end of the glass film. By arranging a support rod only between the end and the support member, the glass film may be included. The portion where the predetermined line is cut is cut in a state where one side of the support rod floats from the support member. This cutting method is effective when the width of the end of the glass film (the dimension in the direction orthogonal to the line to be cut) is small.
於如此般僅於割斷預定線的單側配置支持棒時,較佳為端部於除了與支持棒的接觸部以外的位置自支持構件浮起。若如此設定,則可認為,促進初期裂縫的發展的輔助的力更強烈地作用於割斷預定線上的未割斷部。In this way, when the support rod is arranged only on one side of the cut line, it is preferable that the end portion floats from the support member at a position other than the contact portion with the support rod. If so set, it may be considered that the auxiliary force that promotes the development of the initial cracks acts more strongly on the uncut portion on the planned cutting line.
於如所述般僅於割斷預定線的單側配置支持棒時,較佳為玻璃膜的包含割斷預定線的部分具備與支持棒接觸的第一接觸部、及與支持構件接觸的第二接觸部,割斷預定線於第一接觸部與第二接觸部之間,偏向位於第一接觸部側。若如此設定,則可確認,可沿著割斷預定線更準確地實施雷射割斷。When the support rod is arranged only on one side of the planned cutting line as described above, it is preferable that the portion of the glass film including the planned cutting line includes a first contact portion that contacts the support rod and a second contact that contacts the support member The part is to cut a predetermined line between the first contact part and the second contact part, and is located on the side of the first contact part. With this setting, it can be confirmed that laser cutting can be performed more accurately along the planned cutting line.
所述結構中,亦可於玻璃膜的以割斷預定線為邊界的一個區域與支持構件之間、及玻璃膜的以割斷預定線為邊界的另一區域與支持構件之間分別配置支持棒,藉此於使玻璃膜的包含割斷預定線的部分於兩根支持棒之間自支持構件浮起的狀態下,將玻璃膜割斷。此種割斷方法於玻璃膜的以割斷預定線為邊界的一個區域及另一區域各自的寬度(與割斷預定線正交的方向的尺寸)大時有效。In the above structure, support rods may be arranged between one area of the glass film bordered by the planned cutting line and the support member, and another area of the glass film bordered by the planned cutting line and the support member, With this, the glass film is cut in a state where the portion of the glass film including the planned cutting line floats from the support member between the two support rods. This cutting method is effective when the width (the size in the direction orthogonal to the planned cutting line) of one region and the other region of the glass film bordered by the planned cutting line is large.
於如此般於割斷預定線的兩側配置支持棒時,亦可使玻璃膜的以割斷預定線為邊界的一個區域為玻璃膜的端部,端部於除了與支持棒的接觸部以外的位置自支持構件浮起。或者,亦可使端部的端緣與支持構件進行線接觸,端部的其餘部分於除了與支持棒的接觸部以外的位置自支持構件浮起。若如此設定,則可認為,促進初期裂縫的發展的輔助的力更強烈地作用於割斷預定線上的未割斷部。When the support rods are arranged on both sides of the planned cutting line in this way, an area of the glass film bordered by the planned cutting line can also be an end of the glass film, and the end is at a position other than the contact portion with the support rod The self-supporting member floats. Alternatively, the edge of the end portion may be brought into line contact with the support member, and the rest of the end portion floats from the support member at a position other than the contact portion with the support rod. If so set, it may be considered that the auxiliary force that promotes the development of the initial cracks acts more strongly on the uncut portion on the planned cutting line.
所述結構中,較佳為支持棒遍及沿著割斷預定線的方向的玻璃膜的全長而連續地配置。即,若支持棒於沿著割斷預定線的方向間斷地配置,則玻璃膜會於中途擱置於支持棒等,而玻璃膜以起伏的方式彎曲。若如此般玻璃膜以起伏的方式彎曲,則有妨礙初期裂縫沿著割斷預定線發展般的應力發揮作用之虞。相對於此,若支持棒遍及沿著割斷預定線的方向的玻璃膜的全長連續地配置,則沿著割斷預定線的方向的玻璃膜的全長由支持棒所支持。因此,可防止玻璃膜以起伏的方式彎曲的事態。因此,妨礙初期裂縫沿著割斷預定線發展般的應力不易發揮作用,容易實現沿著割斷預定線的準確的雷射割斷。In the above structure, it is preferable that the support rods are continuously arranged over the entire length of the glass film along the direction along which the line is to be cut. That is, if the support rod is placed intermittently in the direction along the line to be cut, the glass film will rest on the support rod or the like halfway, and the glass film will bend in a undulating manner. If the glass film is bent in a undulating manner in this way, there is a possibility that the stress that prevents the initial crack from developing along the planned cutting line acts. On the other hand, if the support rod is continuously arranged over the entire length of the glass film in the direction along the planned cutting line, the full length of the glass film in the direction along the planned cutting line is supported by the support rod. Therefore, it is possible to prevent the glass film from being bent in a undulating manner. Therefore, the stress that prevents the initial crack from developing along the planned cutting line is not easy to function, and it is easy to realize accurate laser cutting along the planned cutting line.
所述結構中,較佳為支持棒包含平板。若如此設定,則容易使支持棒相對於支持構件的姿勢、或玻璃膜相對於支持棒的姿勢穩定。In the above structure, it is preferable that the support rod includes a flat plate. With this setting, it is easy to stabilize the posture of the support rod with respect to the support member or the posture of the glass film with respect to the support rod.
所述結構中,較佳為玻璃膜自背面側經由隔熱片材由支持構件及支持棒所支持。若如此設定,則可藉由隔熱片材而抑制由雷射的加熱所得的熱量、或由冷媒的冷卻所得的熱量傳遞至支持構件及支持棒而散逸。因此,可充分地確保利用雷射的加熱與利用冷媒的冷卻之溫度差,可提高熱效率並且實現玻璃膜的準確的雷射割斷。此種割斷方法於玻璃膜薄時(例如厚度為200 μm以下時)特別有效。另外,自支持構件浮起的玻璃膜的包含割斷預定線的部分亦由隔熱片材所支持,故而亦有玻璃膜的姿勢更穩定的優點。 [發明的效果]In the above structure, it is preferable that the glass film is supported by the support member and the support rod through the heat insulation sheet from the back side. With this setting, the heat of the laser or the heat of the cooling of the refrigerant can be suppressed from being transferred to the support member and the support rod and dissipated by the heat insulating sheet. Therefore, the temperature difference between heating by laser and cooling by refrigerant can be sufficiently ensured, thermal efficiency can be improved, and accurate laser cutting of the glass film can be achieved. This cutting method is particularly effective when the glass film is thin (for example, when the thickness is 200 μm or less). In addition, the portion of the glass film that floats from the support member including the line to be cut is also supported by the heat insulating sheet, so there is also an advantage that the posture of the glass film is more stable. [Effect of invention]
根據本發明,能以不產生切割殘留部的方式對玻璃膜進行雷射割斷。According to the present invention, the glass film can be laser-cut so that no cutting residue is generated.
以下,參照隨附圖式對本發明的實施形態的玻璃膜的製造方法加以說明。再者,圖中的XYZ為正交座標系。X方向及Y方向為水平方向,X方向設為寬度方向。Z方向為鉛垂方向。Hereinafter, a method of manufacturing a glass film according to an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, XYZ in the figure is an orthogonal coordinate system. The X direction and the Y direction are horizontal directions, and the X direction is the width direction. The Z direction is the vertical direction.
<第一實施形態>
如圖1及圖2所示,用於第一實施形態的玻璃膜的製造方法的割斷裝置1將玻璃膜G沿著割斷預定線V進行雷射割斷,具備支持構件2、支持棒3、雷射振盪器4、冷媒噴射噴嘴5及支持台6。<First embodiment>
As shown in FIGS. 1 and 2, a
玻璃膜G為矩形形狀的單片狀。玻璃膜G的一邊的大小較佳為300 mm~3000 mm,厚度較佳為5 μm~300 μm,更佳為30 μm~200 μm。The glass film G has a single rectangular shape. The size of one side of the glass film G is preferably 300 mm to 3000 mm, and the thickness is preferably 5 μm to 300 μm, more preferably 30 μm to 200 μm.
割斷預定線V為直線狀的假想線,於與玻璃膜G的寬度方向正交的方向相向的兩邊之間橫跨。本實施形態中,割斷預定線V於玻璃膜G中,於寬度方向中央部Ga與各個寬度方向端部Gb的邊界存在共計兩條。因此,若沿著兩條割斷預定線V進行雷射割斷,則自寬度方向中央部Ga將兩側的寬度方向端部Gb分別分離。此處,寬度方向端部Gb例如因成形過程的收縮等的影響,而包含與寬度方向中央部Ga相比厚度更大的部分(亦稱為邊緣部)。當然,寬度方向端部Gb不限定於具有邊緣部的情形,亦可為與寬度方向中央部Ga實質上相同的厚度。The planned cutting line V is a straight imaginary line, and spans between the two sides facing the direction orthogonal to the width direction of the glass film G. In the present embodiment, the planned cutting line V is in the glass film G, and there are a total of two boundaries between the widthwise central portion Ga and the widthwise end portions Gb. Therefore, when laser cutting is performed along the two planned cutting lines V, the widthwise end portions Gb on both sides are separated from the widthwise central portion Ga. Here, the end portion Gb in the width direction includes a portion (also referred to as an edge portion) that is thicker than the center portion Ga in the width direction due to, for example, shrinkage during the forming process. Of course, the width-direction end Gb is not limited to the case of having an edge, and may have substantially the same thickness as the width-direction central portion Ga.
玻璃膜G經由隔熱片材T而配置於支持構件2及支持棒3上。隔熱片材T抑制藉由雷射L的照射而形成的加熱區域H的熱量或藉由冷媒W的噴射而形成的冷卻區域C的熱量向支持構件2或支持棒3傳熱而散逸。隔熱片材T較佳為導熱率低於支持構件2及支持棒3。隔熱片材T例如可使用發泡樹脂或不織布等的樹脂片材。隔熱片材T較佳為彈性片材。再者,隔熱片材T亦可不配置。The glass film G is arranged on the
支持構件2自背面側支持玻璃膜G,本實施形態中由定盤所構成。支持構件2的上表面較佳為水平的單一平面。The supporting
支持棒3自背面側支持玻璃膜G的各割斷預定線V附近,本實施形態中,由在與割斷預定線V平行的方向為長條的平板所構成。支持棒3的上表面較佳為水平的平面。The
本實施形態中,支持棒3於各割斷預定線V附近中的除了各割斷預定線V的正下方以外的位置,於寬度方向端部Gb與支持構件2之間、及寬度方向中央部Ga與支持構件2之間,與割斷預定線V平行地並列配置有兩根。割斷預定線V存在共計兩條,故而支持棒3於支持構件2上配置有共計四根。藉此,玻璃膜G的包含各割斷預定線V的部分由並列配置的兩根支持棒3抬起,並且以於該兩根支持棒3之間自支持構件2浮起的狀態而保持。再者,玻璃膜G的包含割斷預定線V的部分於兩根支持棒3之間可成為水平的平面狀,或亦可成為向上方凸出的凸曲面狀,或亦可成為向下方凸出的凹曲面狀。In the present embodiment, the
於如此般於割斷預定線V的兩側並列配置兩根支持棒3時,寬度方向端部Gb的寬度較佳為相對較大。然而,寬度方向中央部Ga的寬度設為大於寬度方向端部Gb的寬度。此處,作為寬度方向端部Gb的寬度相對較大的情形,可例示以下的值。即,於玻璃膜G的厚度為200 μm時寬度方向端部Gb的寬度為46 mm以上,於玻璃膜G的厚度為100 μm時寬度方向端部Gb的寬度為70 mm以上。再者,所述的寬度方向端部Gb的寬度是設為將玻璃膜G載置於水平的平面上而測定的值。另外,寬度方向端部Gb的寬度的較佳範圍視玻璃膜G的厚度、或者支持棒3的厚度或寬度等各條件而變動,故而不限定於例示。When the two
兩根支持棒3的間隔D1例如較佳為5 mm~50 mm(本實施形態中為15 mm)。The distance D1 between the two
支持棒3的厚度例如較佳為0.5 mm~5 mm(本實施形態中為2 mm)。各支持棒3的厚度較佳為相同。The thickness of the
支持棒3的寬度例如較佳為5 mm~30 mm(本實施形態中為10 mm)。各支持棒3的寬度較佳為相同。The width of the
支持棒3固定於支持構件2。支持棒3的固定方法可列舉利用螺桿等的緊固固定、或利用膠帶等的黏接固定等。支持棒3可相對於支持構件2而可裝卸,或亦可與支持構件2一體化。The
支持棒3的材質例如可列舉金屬或樹脂等。於支持棒3為金屬時,較佳為將支持棒3的整個背面黏接固定於支持構件2,於支持棒3為樹脂時,較佳為僅將支持棒3的長度方向的兩端部黏接固定於支持構件2。當然,支持棒3的固定方法或固定位置並無特別限定。Examples of the material of the
支持棒3遍及與割斷預定線V平行的方向的玻璃膜G的全長而連續地配置。再者,支持棒3亦可於與割斷預定線V平行的方向的玻璃膜G的全長中,間斷地配置或僅配置於一部分。此時,支持棒3較佳為至少配置於割斷預定線V的另一端(與形成有初期裂縫Sa的割斷預定線V的其中一端Va為相反側的一端)Vb的附近。The
支持構件2的支持面積(支持構件2與玻璃膜G的接觸面積)大於支持棒3的支持面積(支持棒3與玻璃膜G的接觸面積)。詳細而言,支持構件2的支持面積較佳為支持棒3的支持面積的5倍以上。藉此,玻璃膜G的大部分由支持構件2支持,故而於雷射割斷時玻璃膜G的姿勢亦穩定。The support area of the support member 2 (the contact area of the
雷射振盪器4於玻璃膜G的上方以沿著割斷預定線V可移動的狀態而配置。雷射振盪器4對割斷預定線V照射雷射L而形成加熱區域H,並且伴隨其移動而使加熱區域H於割斷預定線V上掃描。The
冷媒噴射噴嘴5與雷射振盪器4同樣地,於玻璃膜G的上方以沿著割斷預定線V可移動的狀態而配置。冷媒噴射噴嘴5對割斷預定線V的經雷射L照射的部位噴射冷媒(例如霧狀的水)W而形成冷卻區域C,並且伴隨其移動而使冷卻區域C於割斷預定線V上掃描。藉此,如圖1所示,加熱區域H及追隨於該加熱區域H的冷卻區域C自割斷預定線V的其中一端Va側向另一端Vb側依次掃描。Like the
雷射振盪器4及冷媒噴射噴嘴5於與割斷預定線V平行的方向移動的速度較佳為20 mm/s~200 mm/s的範圍內。The speed at which the
支持台6自背面側支持玻璃膜G的割斷預定線V的其中一端Va附近,且於在割斷預定線V的其中一端Va形成初期裂縫Sa時使用。支持台6由以金屬或樹脂等既定的材質形成的平板所構成。支持台6的上表面較佳為水平的平面。支持台6與支持棒3同樣地,藉由任意的固定方法而固定於支持構件2。再者,支持台6亦可不配置。The support table 6 supports the vicinity of one end Va of the planned cutting line V of the glass film G from the back side, and is used when an initial crack Sa is formed at one end Va of the planned cutting line V. The support table 6 is composed of a flat plate formed of a predetermined material such as metal or resin. The upper surface of the support table 6 is preferably a horizontal plane. The support table 6 is fixed to the
繼而,對第一實施形態的玻璃膜的製造方法進行說明。該製造方法包括使用如以上般構成的割斷裝置1的割斷步驟。再者,以下對割斷步驟中沿著於玻璃膜G的寬度方向相向的一對邊進行雷射割斷的情形進行說明,但沿著其餘一對邊亦利用同樣的方法實施雷射割斷。Next, the method of manufacturing the glass film of the first embodiment will be described. This manufacturing method includes a cutting step using the
割斷步驟中,首先如圖2所示,一方面藉由支持台6以平坦狀態支持玻璃膜G的割斷預定線V的其中一端Va附近,一方面使輪式切割機(wheel cutter)7於玻璃膜G的表面側轉動,於割斷預定線V的其中一端Va形成初期裂縫Sa。此處,使輪式切割機7轉動的方向較佳為設為沿著割斷預定線V自玻璃膜G的內側朝向端部側的方向。另外,轉動輪式切割機7的距離較佳為設為5 mm~10 mm的範圍內。再者,形成初期裂縫Sa的機構不限定於輪式切割機7,例如亦可為金剛石劃線工具(diamond scribe tool)或雷射等。另外,亦可於割斷步驟的前步驟中,於玻璃膜G的割斷預定線V的其中一端Va預先形成初期裂縫Sa。In the cutting step, first, as shown in FIG. 2, on the one hand, the support table 6 supports the glass film G in a flat state near one end Va of the planned cutting line V, and on the other hand, the
如此而形成初期裂縫Sa後,如圖3及圖4所示,以初期裂縫Sa為起點而進行沿著割斷預定線V的雷射L的照射、及追隨於該照射的冷媒W的噴射。藉此,利用因加熱區域H與冷卻區域C的溫度差而產生的熱應力,使初期裂縫Sa沿著割斷預定線V向另一端Vb發展(參照圖1)。After the initial crack Sa is formed in this way, as shown in FIGS. 3 and 4, the laser beam L along the planned cutting line V is irradiated from the initial crack Sa, and the refrigerant W following the irradiation is sprayed. By this, the initial stress Sa is developed to the other end Vb along the planned cutting line V by the thermal stress generated by the temperature difference between the heating area H and the cooling area C (see FIG. 1 ).
此時,玻璃膜G的包含割斷預定線V的部分由遍及割斷預定線V的全長而並列地配置的兩根支持棒3抬起,並且於該兩根支持棒3之間自支持構件2浮起。若以此種支持態樣對玻璃膜G進行雷射割斷,則即便於割斷預定線V的另一端Vb附近使初期裂縫Sa發展的熱應力變得不充分,亦可防止形成切割殘留部的事態。At this time, the portion of the glass film G including the planned cutting line V is lifted by the two supporting
產生此種現象的原因雖未查明,但考慮如下。即,玻璃膜G的包含割斷預定線V的部分於兩根支持棒3之間自支持構件2浮起,故而以割斷預定線V上的割斷部(割斷已完成的部分)S為邊界的寬度方向端部Gb與寬度方向中央部Ga欲分別獨立地回到更穩定的狀態(例如成為平面的狀態)。此種欲回到穩定狀態時發揮作用的力的方向及/或大小於以割斷部S為邊界的寬度方向端部Gb與寬度方向中央部Ga彼此不同。其結果可認為,對於割斷預定線V上的未割斷部(割斷未完成的部分),與由雷射割斷所致的熱應力不同,例如撕裂力或剪切力等促進初期裂縫Sa的發展的輔助的力(例如,圖4的箭頭F1所示的力)發揮作用。因此可認為,即便於割斷預定線V的另一端Vb附近使初期裂縫Sa發展的熱應力變得不充分,亦由於此種輔助的力而初期裂縫Sa的發展持續,防止切割殘留部的產生。Although the cause of this phenomenon has not been identified, it is considered as follows. That is, the portion of the glass film G including the planned cutting line V floats from the
第一實施形態的玻璃膜的製造方法於割斷步驟之前,例如包括成形步驟、緩冷卻步驟及采板步驟。另外,第一實施形態的玻璃膜的製造方法於割斷步驟之後,例如包括清洗步驟(包含乾燥步驟)、檢查步驟及捆包步驟。再者,亦可於采板步驟後實施熱處理步驟。另外,亦可於割斷步驟後實施端面加工步驟。當然亦可僅單獨實施割斷步驟。The manufacturing method of the glass film of the first embodiment includes, before the cutting step, a forming step, a slow cooling step, and a plate picking step, for example. In addition, the manufacturing method of the glass film of the first embodiment includes, after the cutting step, for example, a washing step (including a drying step), an inspection step, and a packing step. Furthermore, a heat treatment step can also be implemented after the board picking step. In addition, the end face processing step may be performed after the cutting step. Of course, it is also possible to perform the cutting step alone.
成形步驟中,藉由溢流下拉(over-flow down draw)法或浮式法等公知的方法由熔融玻璃來成形玻璃帶。In the forming step, the glass ribbon is formed from molten glass by a well-known method such as an over-flow down draw method or a float method.
緩冷卻步驟中,為了減少所成形的玻璃帶的翹曲及內部應變,而將所成形的玻璃帶緩冷卻。In the slow cooling step, in order to reduce the warpage and internal strain of the formed glass ribbon, the formed glass ribbon is slowly cooled.
於采板步驟中,將經緩冷卻的玻璃帶每隔既定的長度切斷,獲得多片玻璃膜。或者,亦可將經緩冷卻的玻璃帶暫且以卷形狀採取後,每隔既定的長度切斷而獲得多片玻璃膜。In the board collecting step, the slowly cooled glass ribbon is cut every predetermined length to obtain a plurality of glass films. Alternatively, after slowly cooling the glass ribbon in a roll shape, it may be cut at predetermined lengths to obtain a plurality of glass films.
熱處理步驟中,例如於熱處理爐中對玻璃膜進行熱處理。In the heat treatment step, for example, the glass film is heat-treated in a heat treatment furnace.
端面加工步驟中,對所述的割斷步驟中經切斷為既定尺寸的玻璃膜進行包括端面的磨削、研磨及切角(corner cut)的端面加工。In the end face processing step, the glass film cut to a predetermined size in the cutting step is subjected to end face processing including end face grinding, grinding, and corner cut.
清洗步驟中,將玻璃膜一方面以傾斜姿勢搬送一方面清洗後進行乾燥。當然,亦可對水平姿勢的玻璃膜實施清洗步驟。In the cleaning step, the glass film is transported in an inclined posture while being cleaned and dried. Of course, it is also possible to perform a washing step on the glass film in a horizontal posture.
檢查步驟中,對經清洗的玻璃膜檢查是否表面並無損傷、灰塵、污垢等,以及/或者是否並無氣泡、異物等內部缺陷。檢查是使用相機等光學檢查裝置而進行。In the inspection step, the cleaned glass film is inspected for damage, dust, dirt, etc. on the surface, and/or whether there are no internal defects such as bubbles or foreign objects. The inspection is performed using an optical inspection device such as a camera.
捆包步驟中,對檢查的結果為滿足所需品質的玻璃膜進行捆包。捆包是藉由對既定的托板(pallet)平放積層或豎放積層多片玻璃膜而進行。此時,亦可使包含襯墊紙或發泡樹脂等的保護片材介於玻璃膜的積層方向的相互之間。In the packing step, the glass film satisfying the desired quality as a result of the inspection is packed. The bundling is carried out by laying a plurality of glass films horizontally or vertically on a predetermined pallet. In this case, a protective sheet containing liner paper, foamed resin, or the like may be interposed between the layers in the layering direction of the glass film.
再者,本實施形態中,於割斷步驟中,於玻璃膜G的寬度方向端部Gb於除了支持棒3以外的位置自支持構件2浮起的狀態下實施雷射割斷,但不限定於此。例如,亦可如圖5所示,寬度方向端部Gb的端緣Gc經由隔熱片材T而與支持構件2進行線接觸,寬度方向端部Gb的其餘部分於除了經由隔熱片材T的與支持棒3的接觸部以外的位置,自支持構件2浮起。或者,亦可如圖6所示,寬度方向端部Gb的包含端緣Gc的部分經由隔熱片材T而與支持構件2進行面接觸,寬度方向端部Gb的其餘部分於除了經由隔熱片材T的與支持棒3的接觸部以外的位置,自支持構件2浮起。Furthermore, in the present embodiment, in the cutting step, the laser cutting is performed in a state where the end Gb in the width direction of the glass film G floats from the supporting
另外,本實施形態中,對沿著設於玻璃膜G的寬度方向端部Gb與寬度方向中央部Ga的邊界的割斷預定線V進行雷射割斷的情形進行了說明,但所述的利用兩根支持棒3的玻璃膜G的支持態樣亦可用於沿著設於寬度方向中央部Ga的既定位置的割斷預定線進行雷射割斷的情形。即,此種支持態樣不限定於藉由雷射割斷自寬度方向中央部Ga分離寬度方向端部Gb的情形。In addition, in the present embodiment, the case where laser cutting is performed along the planned cutting line V provided at the boundary between the width end portion Gb of the glass film G and the width direction center portion Ga is described. The supporting form of the glass film G of the
<第二實施形態> 第二實施形態的玻璃膜的製造方法與第一實施形態的玻璃膜的製造方法的不同點為割斷步驟中的玻璃膜G的支持態樣。以下,對該不同點進行說明。再者,對共同的結構標註相同符號而省略詳細說明。<Second embodiment> The manufacturing method of the glass film of the second embodiment is different from the manufacturing method of the glass film of the first embodiment in the support state of the glass film G in the cutting step. The difference will be described below. In addition, the common structure is denoted by the same symbol, and detailed description is omitted.
如圖7及圖8所示,第二實施形態的玻璃膜的製造方法所包括的割斷步驟中,支持棒3是於各割斷預定線V附近中的除了各割斷預定線V的正下方以外的位置,僅於寬度方向端部Gb與支持構件2之間,與割斷預定線V平行地配置有一根。換言之,支持棒3並未配置於寬度方向中央部Ga與支持構件2之間。割斷預定線V存在共計兩條,故而支持棒3於支持構件2上配置有共計兩根。藉此,玻璃膜G的包含各割斷預定線V的部分由一根支持棒3抬起,並且以於該一根支持棒3的一側、即寬度方向中央部Ga側自支持構件2浮起的狀態而保持。再者,玻璃膜G的包含割斷預定線V的部分於支持棒3的一側可成為傾斜的平面狀,或亦可成為向上方凸出的凸曲面狀,或亦可成為向下方凸出的凹曲面狀。另外,本實施形態中,寬度方向端部Gb總體以於除了經由隔熱片材T的與支持棒3的接觸部以外的位置,自支持構件2浮起的狀態而保持,但寬度方向端部Gb的包含端緣的部分亦可經由隔熱片材T而與支持構件2接觸(線接觸或面接觸)。As shown in FIGS. 7 and 8, in the cutting step included in the method for manufacturing a glass film of the second embodiment, the
於如此般僅於割斷預定線V的單側配置有一根支持棒3時,寬度方向端部Gb的寬度較佳為相對較小。此處,作為寬度方向端部Gb的寬度相對較小的情形,可例示以下的值。即,於玻璃膜G的厚度為200 μm時寬度方向端部Gb的寬度小於46 mm(較佳為45 mm以下),於玻璃膜G的厚度為100 μm時寬度方向端部Gb的寬度小於70 mm(較佳為50 mm以下)。再者,所述寬度方向端部Gb的寬度是設為將玻璃膜G載置於水平的平面上而測定的值。另外,寬度方向端部Gb的寬度的較佳範圍視玻璃膜G的厚度、或者支持棒3的厚度或寬度等各條件而變動,故而不限定於例示。In this way, when only one
支持棒3的厚度例如較佳為0.5 mm~5 mm(本實施形態中為2 mm)。The thickness of the
支持棒3的寬度例如較佳為5 mm~30 mm(本實施形態中為10 mm)。The width of the
玻璃膜G的包含割斷預定線V的部分具有經由隔熱片材T而與支持棒3接觸的第一接觸部P1、及經由隔熱片材T而與支持構件2接觸的第二接觸部P2。第一接觸部P1與第二接觸部P2之間的間隔D2例如較佳為30 mm~200 mm(本實施形態中為140 mm)。The portion of the glass film G including the planned cutting line V has a first contact portion P1 that contacts the
割斷預定線V較佳為於第一接觸部P1與第二接觸部P2之間,偏向位於第一接觸部P1側。換言之,較佳為第二接觸部P2與割斷預定線V之間的間隔D3大於第一接觸部P1與割斷預定線V之間的間隔D4。間隔D3較佳為間隔D4的2倍以上。The scheduled cutting line V is preferably between the first contact portion P1 and the second contact portion P2, and is biased toward the first contact portion P1 side. In other words, it is preferable that the interval D3 between the second contact portion P2 and the planned cutting line V is greater than the interval D4 between the first contact portion P1 and the planned cutting line V. The interval D3 is preferably at least twice the interval D4.
可認為,即便為如以上的僅於割斷預定線V的單側配置有一根支持棒3的支持態樣,亦與第一實施形態的割斷步驟同樣地,對於割斷預定線V上的未割斷部(割斷未完成的部分),與由雷射割斷所致的熱應力不同,例如撕裂力或剪切力等促進初期裂縫Sa的發展的輔助的力(例如,圖8的箭頭F2所示的力)發揮作用。因此,即便於割斷預定線V的另一端Vb附近使初期裂縫Sa發展的熱應力變得不充分,亦可防止形成切割殘留部的事態。尤其於割斷預定線V偏向位於第一接觸部P1側時,容易享有此種效果。It can be considered that even if a
本發明絲毫不限定於所述實施形態,可於不偏離本發明的主旨的範圍內進而以各種形態實施。The present invention is not limited to the above-mentioned embodiment at all, and can be implemented in various forms without departing from the gist of the present invention.
所述實施形態中,對支持棒為於與割斷預定線平行的方向為長條的平板的情形進行了說明,但支持棒的形狀不限定於此。支持棒只要於與割斷預定線平行的方向為長條,則例如亦可為圓柱(包含橢圓柱)、多稜柱(包含三角形或五邊形以上的多稜柱)、半圓柱(包含半橢圓柱)等。再者,關於支持台的形狀亦同樣。In the above embodiment, the case where the support rod is a flat plate that is elongated in a direction parallel to the line to cut is described, but the shape of the support rod is not limited to this. As long as the support rod is elongated in a direction parallel to the planned cutting line, it can be, for example, a cylinder (including elliptical cylinders), polygonal columns (including triangular or pentagonal polygonal columns), and semi-cylinders (including semi-elliptical cylinders) Wait. Furthermore, the shape of the support table is the same.
所述實施形態中,亦可將雷射振盪器及冷媒噴射噴嘴保持於恆定位置,使玻璃膜側與支持構件一起移動。此時,支持構件可使用移動台或帶式輸送機(belt conveyor)等。In the above embodiment, the laser oscillator and the refrigerant injection nozzle may be held at a constant position, and the glass film side may be moved together with the support member. At this time, the supporting member may use a mobile table, a belt conveyor, or the like.
所述實施形態中,對在支持構件上沿著兩條割斷預定線對玻璃膜進行雷射割斷的情形進行了說明,但亦可沿著三條以上的割斷預定線對玻璃膜進行雷射割斷,或亦可沿著一條割斷預定線對玻璃膜進行雷射割斷。In the above embodiment, the case where the glass film is laser cut along the two planned cutting lines on the support member has been described, but the glass film may also be laser cut along the three or more planned cutting lines. Alternatively, the glass film can be laser cut along a predetermined cutting line.
所述實施形態中,對僅將重疊於隔熱片材的玻璃膜進行雷射割斷的情形進行了說明,但隔熱片材亦可藉由雷射的加熱而沿著割斷預定線切斷(熔斷)。In the above-mentioned embodiment, the case where only the glass film superposed on the heat insulating sheet is laser cut is described, but the heat insulating sheet may also be cut along the line to be cut by heating of the laser ( Fuse).
1‧‧‧割斷裝置
2‧‧‧支持構件
3‧‧‧支持棒
4‧‧‧雷射振盪器
5‧‧‧冷媒噴射噴嘴
6‧‧‧支持台
7‧‧‧輪式切割機
100、G‧‧‧玻璃膜
101‧‧‧割斷部
102、V‧‧‧割斷預定線
102a、Vb‧‧‧另一端
103、H‧‧‧加熱區域
104、C‧‧‧冷卻區域
105‧‧‧切割殘留部
D1、D2、D3、D4‧‧‧間隔
F1、F2‧‧‧箭頭
Ga‧‧‧寬度方向中央部
Gb‧‧‧寬度方向端部
Gc‧‧‧端緣
L‧‧‧雷射
P1‧‧‧第一接觸部
P2‧‧‧第二接觸部
S‧‧‧割斷部
Sa‧‧‧初期裂縫
T‧‧‧隔熱片材
Va‧‧‧其中一端
W‧‧‧冷媒
X、Y、Z‧‧‧方向1‧‧‧
圖1為表示第一實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的平面圖。 圖2為圖1的A-A剖面圖,且為表示於割斷預定線的其中一端形成初期裂縫的狀況的圖。 圖3為圖1的B-B剖面圖,且為表示剛形成割斷部後的狀況(第一狀態)的一例的圖。 圖4為圖1的B-B剖面圖,且為表示剛形成割斷部後的狀況(第一狀態之後的第二狀態)的一例的圖。 圖5為表示第一實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的變形例的剖面圖。 圖6為表示第一實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的變形例的剖面圖。 圖7為表示第二實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的剖面圖,且為表示剛形成割斷部後的狀況(第一狀態)的一例的圖。 圖8為表示第二實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的剖面圖,且為表示剛形成割斷部後的狀況(第一狀態之後的第二狀態)的一例的圖。 圖9為表示現有的玻璃膜的割斷方法的平面圖。 圖10為表示現有的玻璃膜的割斷方法的平面圖。FIG. 1 is a plan view showing a cutting step included in the method for manufacturing a glass film of the first embodiment and a cutting device for performing the cutting step. FIG. 2 is a cross-sectional view taken along line A-A of FIG. 1 and is a diagram showing a state where an initial crack is formed at one end of a line to be cut. FIG. 3 is a cross-sectional view taken along line B-B in FIG. 1, and is a diagram showing an example of the state (first state) immediately after the cut portion is formed. 4 is a cross-sectional view taken along the line B-B in FIG. 1, and is a diagram showing an example of the state immediately after the cutting portion is formed (the second state after the first state). 5 is a cross-sectional view showing a modified example of a cutting step included in the method for manufacturing a glass film of the first embodiment and a cutting device for performing the cutting step. 6 is a cross-sectional view showing a modified example of a cutting step included in the method for manufacturing a glass film of the first embodiment and a cutting device for performing the cutting step. 7 is a cross-sectional view showing a cutting step included in the method for manufacturing a glass film according to the second embodiment and a cutting device for performing the cutting step, and is an example showing a state (first state) immediately after the cutting part is formed. Figure. 8 is a cross-sectional view showing a cutting step included in the method for manufacturing a glass film according to the second embodiment and a cutting device for performing the cutting step, and is a diagram showing a state immediately after the cutting part is formed (the first state after the first state). Figure of an example of two states). 9 is a plan view showing a conventional method of cutting a glass film. FIG. 10 is a plan view showing a conventional method of cutting a glass film.
1‧‧‧割斷裝置 1‧‧‧Cutting device
2‧‧‧支持構件 2‧‧‧Support component
3‧‧‧支持棒 3‧‧‧Support stick
4‧‧‧雷射振盪器 4‧‧‧Laser oscillator
5‧‧‧冷媒噴射噴嘴 5‧‧‧Refrigerant spray nozzle
D1‧‧‧間隔 D1‧‧‧Interval
G‧‧‧玻璃膜 G‧‧‧glass film
Ga‧‧‧寬度方向中央部 Ga‧‧‧ widthwise central part
Gb‧‧‧寬度方向端部 Gb‧‧‧Width end
L‧‧‧雷射 L‧‧‧Laser
S‧‧‧割斷部 S‧‧‧Cutting Department
T‧‧‧隔熱片材 T‧‧‧Insulation sheet
V‧‧‧割斷預定線 V‧‧‧cutting the scheduled line
W‧‧‧冷媒 W‧‧‧Refrigerant
X、Z‧‧‧方向 X, Z‧‧‧ direction
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