TWI809108B - Manufacturing method of glass film - Google Patents

Manufacturing method of glass film Download PDF

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TWI809108B
TWI809108B TW108117769A TW108117769A TWI809108B TW I809108 B TWI809108 B TW I809108B TW 108117769 A TW108117769 A TW 108117769A TW 108117769 A TW108117769 A TW 108117769A TW I809108 B TWI809108 B TW I809108B
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glass film
line
heat
cut
insulating sheet
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TW108117769A
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TW202003401A (en
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瀧本司
上前孝司
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日商日本電氣硝子股份有限公司
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    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock
    • C03B33/091Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/07Cutting armoured, multi-layered, coated or laminated, glass products
    • C03B33/074Glass products comprising an outer layer or surface coating of non-glass material
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03BMANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00Severing cooled glass
    • C03B33/09Severing cooled glass by thermal shock

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Thermal Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Optics & Photonics (AREA)
  • Toxicology (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Separation, Recovery Or Treatment Of Waste Materials Containing Plastics (AREA)

Abstract

本發明的玻璃膜的製造方法包括:割斷步驟,於將玻璃膜G自背面側經由隔熱片材T藉由支持構件2進行支持的狀態下,藉由利用雷射L的加熱及追隨於該加熱的利用冷媒W的冷卻,使形成於玻璃膜G的割斷預定線V上的初期裂縫Sa沿著割斷預定線V發展,將玻璃膜G割斷,且於割斷步驟中,於在玻璃膜G的包含割斷預定線V的區域、與隔熱片材T之間配置有耐熱層R的狀態下,對玻璃膜G進行雷射割斷。The manufacturing method of the glass film of the present invention includes: a cutting step, in the state where the glass film G is supported by the support member 2 through the heat insulating sheet T from the back side, by heating with the laser L and following the The heating utilizes the cooling of the refrigerant W to cause the initial crack Sa formed on the planned cutting line V of the glass film G to develop along the planned cutting line V, and the glass film G is cut. Laser cutting is performed on the glass film G in a state in which the heat-resistant layer R is arranged between the region including the line V to cut and the heat insulating sheet T. FIG.

Description

玻璃膜的製造方法Manufacturing method of glass film

本發明是有關於一種玻璃膜的製造方法。The invention relates to a method for manufacturing a glass film.

玻璃膜例如為具有200 μm以下的厚度的薄板玻璃,通常其製造步驟中包括將玻璃膜割斷成所需尺寸的步驟。The glass film is, for example, thin plate glass having a thickness of 200 μm or less, and the production steps generally include a step of cutting the glass film into desired sizes.

作為用以將玻璃膜割斷的方法之一,有雷射割斷。該方法中,首先於玻璃膜的一端部的割斷預定線(假想存在的線)上、即割斷預定線的其中一端形成初期裂縫。其後,使藉由雷射進行加熱的加熱區域及追隨於該加熱區域的藉由冷媒進行冷卻的冷卻區域自玻璃膜的割斷預定線的一端部向另一端部依次掃描。藉此,利用因加熱區域與冷卻區域的溫度差而產生的熱應力,初期裂縫沿著割斷預定線發展,將玻璃膜割斷(通體(full body)切斷)。As one of the methods for cutting the glass film, there is laser cutting. In this method, first, an initial crack is formed on a line to cut (a virtual line) at one end of the glass film, that is, one end of the line to cut. Thereafter, the heated region heated by the laser and the cooled region followed by the heated region cooled by the refrigerant are sequentially scanned from one end to the other end of the line to cut the glass film. Thereby, the glass film is cut (full body cut) by utilizing the thermal stress generated by the temperature difference between the heated region and the cooled region to develop an initial crack along the planned cutting line.

然而,玻璃膜非常薄,故而由雷射的加熱所得的熱量或由冷媒的冷卻所得的熱量容易傳導至自背面側支持玻璃膜的定盤等支持構件而散逸。其結果為,有時產生下述問題:無法充分地確保用以產生熱應力的、利用雷射的加熱與利用冷媒的冷卻之溫度差,初期裂縫未沿著割斷預定線準確地發展。However, since the glass film is very thin, the heat obtained by heating by the laser or cooling by the refrigerant is easily conducted to supporting members such as a platen that supports the glass film from the back side, and dissipated. As a result, there may be a problem that the temperature difference between the heating by the laser and the cooling by the refrigerant for generating thermal stress cannot be sufficiently ensured, and the initial cracks may not develop accurately along the planned cutting line.

因此,為了消除此種問題,例如有時如專利文獻1所揭示,玻璃膜經由隔熱片材(例如樹脂片材)而支持於支持構件。 [現有技術文獻] [專利文獻]Therefore, in order to solve such a problem, for example, as disclosed in Patent Document 1, the glass film may be supported by a supporting member via a heat insulating sheet (for example, a resin sheet). [Prior art literature] [Patent Document]

[專利文獻1]日本專利特開2011-144092號公報[Patent Document 1] Japanese Patent Laid-Open No. 2011-144092

[發明所欲解決之課題] 然而,於玻璃膜經由隔熱片材而支持於支持構件時,有時產生由利用雷射的加熱導致隔熱片材燒接於玻璃膜的新問題。若如此般隔熱片材燒接,則需要於割斷步驟之後藉由清洗等自玻璃膜將燒接的隔熱片材去除,玻璃膜的製造效率變差。另外,有時無法將隔熱片材的燒接去除,可能亦導致玻璃膜的不良。[Problem to be Solved by the Invention] However, when the glass film is supported by the supporting member via the heat insulating sheet, a new problem that the heat insulating sheet is burned to the glass film by heating by laser may arise. If the heat insulating sheet is fired in this way, it is necessary to remove the fired heat insulating sheet from the glass film by washing or the like after the cutting step, and the production efficiency of the glass film deteriorates. In addition, it may not be possible to remove the heat insulating sheet by burning, which may also cause defects in the glass film.

本發明的課題在於防止由利用雷射的加熱導致隔熱片材燒接於玻璃膜,提高玻璃膜的製造效率。 [解決課題之手段]The object of the present invention is to prevent the heat insulating sheet from being burned to the glass film by heating by laser, and to improve the production efficiency of the glass film. [Means to solve the problem]

為了解決所述課題而創設的本發明是一種玻璃膜的製造方法,其包括:割斷步驟,於將玻璃膜自背面側經由隔熱片材藉由支持構件進行支持的狀態下,藉由利用雷射的加熱及追隨於該加熱的利用冷媒的冷卻,使形成於玻璃膜的割斷預定線上的初期裂縫沿著割斷預定線發展,將玻璃膜割斷,所述玻璃膜的製造方法的特徵在於:於割斷步驟中,於在玻璃膜的包含割斷預定線的區域與隔熱片材之間配置有耐熱層的狀態下,對玻璃膜進行雷射割斷。根據此種結構,於玻璃膜的包含割斷預定線的區域、與隔熱片材之間配置有耐熱層,故而可防止由利用雷射的加熱導致隔熱片材燒接於玻璃膜。In order to solve the above-mentioned problems, the present invention is a method of manufacturing a glass film, which includes: a cutting step, in the state where the glass film is supported by a support member through a heat insulating sheet from the back side, by using a laser The heating by radiation and the cooling by the refrigerant following the heating allow the initial cracks formed on the planned cutting line of the glass film to develop along the planned cutting line to cut the glass film. The method for manufacturing the glass film is characterized in that: In the cutting step, laser cutting is performed on the glass film in a state in which the heat-resistant layer is arranged between the region including the line to cut and the heat insulating sheet of the glass film. According to such a structure, since the heat-resistant layer is disposed between the region including the line to cut on the glass film and the heat-insulating sheet, it is possible to prevent the heat-insulating sheet from being burned to the glass film by heating with a laser.

所述結構中,較佳為與割斷預定線正交的方向的耐熱層的寬度大於雷射於玻璃膜的表面的點徑。由此,雷射的照射範圍完全收容於耐熱層的形成範圍內,故而可更可靠地防止隔熱片材的燒接。In the above structure, it is preferable that the width of the heat-resistant layer in the direction perpendicular to the planned cutting line is larger than the spot diameter of the laser on the surface of the glass film. Thereby, since the irradiation range of a laser is fully accommodated in the formation range of a heat-resistant layer, the burning of a heat insulating sheet can be prevented more reliably.

所述結構中,較佳為耐熱層為紙。由此,可容易且廉價地準備耐熱層。In the above structure, it is preferable that the heat-resistant layer is paper. Thereby, a heat-resistant layer can be prepared easily and cheaply.

所述結構中,較佳為於玻璃膜的以割斷預定線為邊界的至少一個區域與支持構件之間,於除了割斷預定線的正下方以外的位置配置沿著割斷預定線延伸的支持棒,藉此於使玻璃膜的包含割斷預定線的部分自支持構件浮起的狀態下將玻璃膜割斷。由此,即便於割斷預定線的另一端附近使初期裂縫發展的熱應力變得不充分,亦可使初期裂縫的發展持續。因此,可防止於割斷預定線的另一端附近產生切割殘留部。In the above structure, preferably, between at least one region of the glass film bounded by the line to cut and the support member, a support rod extending along the line to cut is arranged at a position other than directly below the line to cut, Thereby, the glass film is cut|disconnected in the state which floated the part containing the line to cut of the glass film from a support member. Thereby, even if the thermal stress for developing the initial crack becomes insufficient near the other end of the planned cutting line, the initial crack can continue to grow. Therefore, it is possible to prevent a cutting residue from being generated near the other end of the line to cut.

此時,耐熱層較佳為配置於不與支持棒重疊的位置。玻璃膜有相對於耐熱層而容易滑動的傾向,可認為若於支持棒與玻璃膜之間配置有耐熱層,則玻璃膜的支持態樣變得不穩定。因此,較佳為如所述般設為於支持棒與玻璃膜之間未配置有耐熱層的結構。 [發明的效果]At this time, the heat-resistant layer is preferably disposed at a position not overlapping the support rod. The glass film tends to slide easily with respect to the heat-resistant layer, and it is considered that when the heat-resistant layer is arranged between the support rod and the glass film, the supported state of the glass film becomes unstable. Therefore, it is preferable to set it as the structure which does not arrange|position a heat-resistant layer between a support rod and a glass film as mentioned above. [Effect of the invention]

根據本發明,可防止由利用雷射的加熱導致隔熱片材燒接於玻璃膜,提高玻璃膜的製造效率。According to the present invention, it is possible to prevent the heat insulating sheet from being burned to the glass film by heating by laser, and to improve the production efficiency of the glass film.

以下,參照隨附圖式對本發明的實施形態的玻璃膜的製造方法加以說明。再者,圖中的XYZ為正交座標系。X方向及Y方向為水平方向,X方向設為寬度方向。Z方向為鉛垂方向。Hereinafter, a method for producing a glass film according to an embodiment of the present invention will be described with reference to the accompanying drawings. In addition, XYZ in the figure is an orthogonal coordinate system. The X direction and the Y direction are horizontal directions, and the X direction is made into a width direction. The Z direction is the vertical direction.

<第一實施形態> 如圖1及圖2所示,用於第一實施形態的玻璃膜的製造方法的割斷裝置1將玻璃膜G沿著割斷預定線V進行雷射割斷,具備支持構件2、雷射振盪器3、冷媒噴射噴嘴4及支持台5。<First Embodiment> As shown in FIGS. 1 and 2 , the cutting device 1 used in the method for manufacturing a glass film according to the first embodiment cuts the glass film G by laser along the planned cutting line V, and includes a support member 2 and a laser oscillator 3. , the refrigerant injection nozzle 4 and the support table 5 .

玻璃膜G為矩形形狀的單片狀。玻璃膜G的一邊的大小較佳為300 mm~3000 mm,厚度較佳為5 μm~300 μm,更佳為30 μm~200 μm。The glass film G is a rectangular single sheet. The size of one side of the glass film G is preferably from 300 mm to 3000 mm, and the thickness is preferably from 5 μm to 300 μm, more preferably from 30 μm to 200 μm.

割斷預定線V為直線狀的假想線,於與玻璃膜G的寬度方向正交的方向相向的兩邊之間橫跨。本實施形態中,割斷預定線V於玻璃膜G中,於寬度方向中央部Ga與各個寬度方向端部Gb的邊界存在共計兩條。因此,若沿著兩條割斷預定線V進行雷射割斷,則自寬度方向中央部Ga將兩側的寬度方向端部Gb分別分離。此處,寬度方向端部Gb例如因成形過程的收縮等的影響,而包含與寬度方向中央部Ga相比厚度更大的部分(亦稱為邊緣部)。當然,寬度方向端部Gb不限定於具有邊緣部的情形,亦可為與寬度方向中央部Ga實質上相同的厚度。The line V to be divided is a linear imaginary line that spans between both sides facing the direction perpendicular to the width direction of the glass film G. As shown in FIG. In the present embodiment, in the glass film G, a total of two lines V are present at the boundary between the central portion Ga in the width direction and the end portions Gb in the width direction. Therefore, when laser cutting is performed along the two planned cutting lines V, the width direction end parts Gb on both sides are respectively separated from the width direction central part Ga. Here, the end portion Gb in the width direction includes a thicker portion (also referred to as an edge portion) than the center portion Ga in the width direction due to, for example, shrinkage in the molding process. Of course, the width direction end part Gb is not limited to the case where it has an edge part, It may be substantially the same thickness as the width direction center part Ga.

玻璃膜G經由隔熱片材T而配置於支持構件2上。隔熱片材T抑制藉由雷射L的照射而形成的加熱區域H的熱量或藉由冷媒W的噴射而形成的冷卻區域C的熱量向支持構件2傳熱而散逸。隔熱片材T較佳為導熱率低於支持構件2。隔熱片材T例如可使用發泡樹脂或不織布等的樹脂片材。隔熱片材T較佳為彈性片材。The glass film G is arrange|positioned on the support member 2 via the heat insulating sheet T. As shown in FIG. The heat insulating sheet T suppresses the heat transfer to the support member 2 of the heat of the heating area H formed by the irradiation of the laser L or the heat of the cooling area C formed by the injection of the refrigerant W, and the dissipation thereof. The heat insulating sheet T is preferably lower in thermal conductivity than the supporting member 2 . As the heat insulating sheet T, resin sheets such as foamed resin or nonwoven fabric can be used, for example. The heat insulating sheet T is preferably an elastic sheet.

於玻璃膜G的包含割斷預定線V的區域與隔熱片材T之間,配置有耐熱層R。耐熱層R的耐熱溫度高於隔熱片材T的耐熱溫度,例如為80℃~600℃。本實施形態中,耐熱層R包含黏接於隔熱片材T的耐熱片材(耐熱帶)。耐熱片材例如亦可為玻璃纖維片材、聚醯亞胺樹脂片材、金屬片材等,於本實施形態中為紙(襯墊紙)。再者,耐熱層R亦可為藉由塗佈等而成膜於隔熱片材T上的耐熱膜(例如聚胺基甲酸酯、矽酮、碳、二氧化矽、氧化鋁、氧化鋯膜等)。耐熱層R不限於藉由黏接等而固定於隔熱片材T,亦可僅載置於隔熱片材T而不固定。The heat-resistant layer R is arrange|positioned between the area|region containing the planned cutting line V of the glass film G, and the heat insulating sheet T. The heat-resistant temperature of the heat-resistant layer R is higher than the heat-resistant temperature of the heat-insulating sheet T, for example, it is 80-600 degreeC. In the present embodiment, the heat-resistant layer R includes a heat-resistant sheet (heat-resistant belt) adhered to the heat-insulating sheet T. As shown in FIG. The heat-resistant sheet may be, for example, a glass fiber sheet, a polyimide resin sheet, a metal sheet, or the like, and is paper (liner paper) in this embodiment. Furthermore, the heat-resistant layer R may also be a heat-resistant film (such as polyurethane, silicone, carbon, silicon dioxide, alumina, zirconia, etc.) formed on the heat-insulating sheet T by coating or the like. film, etc.). The heat-resistant layer R is not limited to being fixed to the heat-insulating sheet T by adhesion or the like, and may be simply placed on the heat-insulating sheet T without being fixed.

支持構件2自背面側支持玻璃膜G,本實施形態中由定盤所構成。支持構件2的上表面較佳為水平的單一平面。The support member 2 supports the glass film G from the back side, and is constituted by a platen in this embodiment. The upper surface of the supporting member 2 is preferably a horizontal single plane.

雷射振盪器3於玻璃膜G的上方以沿著割斷預定線V可移動的狀態而配置。雷射振盪器3對割斷預定線V照射雷射L而形成加熱區域H,並且伴隨其移動而使加熱區域H於割斷預定線V上掃描。The laser oscillator 3 is disposed above the glass film G in a movable state along the line V to be cut. The laser oscillator 3 irradiates the line V to be cut with laser L to form a heated region H, and scans the heated region H on the line V to be cut along with its movement.

本實施形態中,耐熱層R的寬度D1大於雷射L於玻璃膜G的表面的點徑,例如為1 mm~30 mm。隔熱片材T與玻璃膜G的接觸面積(隔熱片材T的支持面積)大於耐熱層R與玻璃膜G的接觸面積(耐熱層R的支持面積)。詳細而言,隔熱片材T的支持面積較佳為耐熱層R的支持面積的5倍以上。藉此,玻璃膜G的大部分由隔熱片材T支持,故而抑制玻璃膜G的滑動,並且於雷射割斷時玻璃膜G的姿勢亦穩定。In this embodiment, the width D1 of the heat-resistant layer R is greater than the spot diameter of the laser L on the surface of the glass film G, for example, 1 mm˜30 mm. The contact area of the heat-insulating sheet T and the glass film G (supporting area of the heat-insulating sheet T) is larger than the contact area of the heat-resistant layer R and the glass film G (supporting area of the heat-resistant layer R). Specifically, the supporting area of the heat insulating sheet T is preferably 5 times or more the supporting area of the heat-resistant layer R. Since most of the glass film G is supported by the heat insulating sheet T by this, sliding of the glass film G is suppressed, and the attitude|position of the glass film G is also stabilized at the time of laser cutting.

冷媒噴射噴嘴4與雷射振盪器3同樣地,於玻璃膜G的上方以沿著割斷預定線V可移動的狀態而配置。冷媒噴射噴嘴4對割斷預定線V的經雷射L照射的部位噴射冷媒(例如霧狀的水)W而形成冷卻區域C,並且伴隨其移動而使冷卻區域C於割斷預定線V上掃描。藉此,如圖1所示,加熱區域H及追隨於該加熱區域H的冷卻區域C自割斷預定線V的其中一端Va側向另一端Vb側依次掃描。The refrigerant injection nozzle 4 is disposed above the glass film G in a movable state along the line V to be cut, similarly to the laser oscillator 3 . The cooling medium injection nozzle 4 sprays the cooling medium (for example, mist water) W to the part of the planned cutting line V irradiated by the laser L to form the cooling region C, and scans the cooling region C on the planned cutting line V as it moves. Thereby, as shown in FIG. 1 , the heated region H and the cooled region C following the heated region H are sequentially scanned from one end Va side to the other end Vb side of the line V to be divided.

雷射振盪器3及冷媒噴射噴嘴4於與割斷預定線V平行的方向移動的速度較佳為20 mm/s~200 mm/s的範圍內。The speed at which the laser oscillator 3 and the refrigerant injection nozzle 4 move in a direction parallel to the planned cutting line V is preferably in the range of 20 mm/s˜200 mm/s.

支持台5自背面側支持玻璃膜G的割斷預定線V的其中一端Va附近,且於在割斷預定線V的其中一端Va形成初期裂縫Sa時使用。支持台5由以金屬或樹脂等既定的材質形成的平板所構成。支持台5的上表面較佳為水平的平面。支持台5藉由利用螺桿等的緊固或利用膠帶等的黏接等任意的固定方法而固定於支持構件2。本實施形態中,隔熱片材T於使其端緣與支持台5的端緣接觸的狀態下,進行Y方向的定位。另外,於該狀態下,隔熱片材T亦以將耐熱層R配置於與割斷預定線V對應的位置的方式,以支持台5為基準而進行X方向的定位。當然,隔熱片材T以及耐熱層R亦可配置於支持台5上。此時,較佳為遍及割斷預定線V的全長而配置有耐熱層R。再者,支持台5亦可不配置。The support table 5 supports the vicinity of one end Va of the line to break V of the glass film G from the back side, and is used when an initial crack Sa is formed at one end Va of the line V to break. The support table 5 is constituted by a flat plate formed of a predetermined material such as metal or resin. The upper surface of the support table 5 is preferably a horizontal plane. The support table 5 is fixed to the support member 2 by any fixing method such as fastening with screws or adhesion with tape or the like. In the present embodiment, the heat insulating sheet T is positioned in the Y direction in a state where its edge is in contact with the edge of the support table 5 . Also in this state, the heat insulating sheet T is positioned in the X direction with the support table 5 as a reference so that the heat-resistant layer R is arranged at a position corresponding to the planned cutting line V. Of course, the heat-insulating sheet T and the heat-resistant layer R can also be arranged on the support table 5 . At this time, it is preferable that the heat-resistant layer R is arranged over the entire length of the line V to be cut. Furthermore, the supporting platform 5 may not be configured.

繼而,對第一實施形態的玻璃膜的製造方法進行說明。該製造方法包括使用如以上般構成的割斷裝置1的割斷步驟。再者,以下對割斷步驟中沿著於玻璃膜G的寬度方向相向的一對邊進行雷射割斷的情形進行說明,但沿著其餘一對邊亦利用同樣的方法實施雷射割斷。Next, the manufacturing method of the glass film of 1st Embodiment is demonstrated. This manufacturing method includes a cutting step using the cutting device 1 configured as above. In addition, the case where laser cutting is performed along a pair of sides facing the width direction of the glass film G in the cutting step is described below, but laser cutting is also performed along the other pair of sides by the same method.

割斷步驟中,首先如圖2所示,一方面藉由支持台5以平坦狀態支持玻璃膜G的割斷預定線V的其中一端Va附近,一方面使輪式切割機(wheel cutter)6於玻璃膜G的表面側轉動,於割斷預定線V的其中一端Va形成初期裂縫Sa。此處,使輪式切割機6轉動的方向較佳為設為沿著割斷預定線V自玻璃膜G的內側朝向端部側的方向。另外,轉動輪式切割機6的距離較佳為設為5 mm~10 mm的範圍內。再者,形成初期裂縫Sa的機構不限定於輪式切割機6,例如亦可為金剛石劃線工具(diamond scribe tool)或雷射等。另外,亦可於割斷步驟的前步驟中,於玻璃膜G的割斷預定線V的其中一端Va預先形成初期裂縫Sa。In the cutting step, first, as shown in FIG. 2 , on the one hand, the support table 5 supports the vicinity of one end Va of the planned cutting line V of the glass film G in a flat state; The surface side of the film G is rotated, and an initial crack Sa is formed at one end Va of the line V to be cut. Here, the direction in which the wheel cutter 6 is rotated is preferably a direction along the planned cutting line V from the inner side of the glass film G toward the end side. In addition, it is preferable to set the distance of the rotary wheel cutter 6 within the range of 5 mm - 10 mm. Furthermore, the mechanism for forming the initial crack Sa is not limited to the wheel cutter 6 , for example, a diamond scribe tool or a laser may also be used. In addition, an initial crack Sa may be formed in advance at one end Va of the planned cutting line V of the glass film G in a step preceding the cutting step.

如此而形成初期裂縫Sa後,如圖3所示,以初期裂縫Sa為起點而進行沿著割斷預定線V的雷射L的照射、及追隨於該照射的冷媒W的噴射。藉此,利用因加熱區域H與冷卻區域C的溫度差而產生的熱應力,使初期裂縫Sa沿著割斷預定線V向另一端Vb發展(參照圖1)。After the initial crack Sa is formed in this way, as shown in FIG. 3 , irradiation of the laser L along the line V along which the initial crack Sa is started, and injection of the refrigerant W following the irradiation are performed. Thereby, the initial crack Sa develops along the line to split V toward the other end Vb by utilizing the thermal stress generated by the temperature difference between the heated region H and the cooled region C (see FIG. 1 ).

此時,於玻璃膜G的包含割斷預定線V的區域、與隔熱片材T之間配置有耐熱層R,故而可防止由利用雷射L的加熱導致隔熱片材T燒接於玻璃膜G。因此,無需於割斷步驟後自玻璃膜G將燒接的隔熱片材T去除的作業,可高效率地製造玻璃膜G。另外,隔熱片材T的軟化或熔解亦得到抑制,故而可進行隔熱片材T的再利用而經濟。At this time, since the heat-resistant layer R is arranged between the region including the planned cutting line V of the glass film G and the heat-insulating sheet T, it is possible to prevent the heat-insulating sheet T from being burnt to the glass by heating with the laser L. Membrane G. Therefore, the glass film G can be manufactured efficiently without requiring the operation|work of removing the baked heat insulating sheet T from the glass film G after a cutting process. In addition, softening and melting of the heat insulating sheet T are also suppressed, so that the heat insulating sheet T can be reused economically.

第一實施形態的玻璃膜的製造方法於割斷步驟之前,例如包括成形步驟、緩冷卻步驟及采板步驟。另外,第一實施形態的玻璃膜的製造方法於割斷步驟之後,例如包括清洗步驟(包含乾燥步驟)、檢查步驟及捆包步驟。再者,亦可於采板步驟後實施熱處理步驟。另外,亦可於割斷步驟後實施端面加工步驟。當然亦可僅單獨實施割斷步驟。The method for manufacturing a glass film according to the first embodiment includes, for example, a forming step, a slow cooling step, and a sheet cutting step before the cutting step. In addition, the manufacturing method of the glass film of the first embodiment includes, for example, a washing step (including a drying step), an inspection step, and a packing step after the cutting step. Furthermore, a heat treatment step may also be implemented after the board picking step. In addition, the end surface processing step may be performed after the cutting step. Of course, it is also possible to implement only the cutting step alone.

成形步驟中,藉由溢流下拉(over-flow down draw)法或浮式法等公知的方法由熔融玻璃來成形玻璃帶。In the forming step, the glass ribbon is formed from the molten glass by a known method such as an over-flow down draw method or a float method.

緩冷卻步驟中,為了減少所成形的玻璃帶的翹曲及內部應變,而將所成形的玻璃帶緩冷卻。In the slow cooling step, the formed glass ribbon is slowly cooled in order to reduce warpage and internal strain of the formed glass ribbon.

於采板步驟中,將經緩冷卻的玻璃帶每隔既定的長度切斷,獲得多片玻璃膜。或者,亦可將經緩冷卻的玻璃帶暫且以卷形狀採取後,每隔既定的長度切斷而獲得多片玻璃膜。In the sheet picking step, the slowly cooled glass ribbon is cut at predetermined lengths to obtain a plurality of glass films. Or, after taking out the slowly cooled glass ribbon once in a roll shape, you may cut|disconnect for every predetermined length, and the glass film of several sheets may be obtained.

熱處理步驟中,例如於熱處理爐中對玻璃膜進行熱處理。In the heat treatment step, for example, the glass film is heat treated in a heat treatment furnace.

端面加工步驟中,對所述的割斷步驟中經切斷為既定尺寸的玻璃膜進行包括端面的磨削、研磨及切角(corner cut)的端面加工。In the end surface processing step, end surface processing including end surface grinding, grinding and corner cutting is performed on the glass film cut to a predetermined size in the cutting step.

清洗步驟中,將玻璃膜一方面以傾斜姿勢搬送一方面清洗後進行乾燥。當然,亦可對水平姿勢的玻璃膜實施清洗步驟。In the washing step, the glass film is transported in an inclined posture while being washed and then dried. Of course, the cleaning step can also be performed on the glass film in a horizontal position.

檢查步驟中,對經清洗的玻璃膜檢查是否表面並無損傷、灰塵、污垢等,以及/或者是否並無氣泡、異物等內部缺陷。檢查是使用相機等光學檢查裝置而進行。In the inspection step, check whether there is no damage, dust, dirt, etc. on the surface of the cleaned glass film, and/or whether there are no internal defects such as air bubbles and foreign objects. The inspection is performed using an optical inspection device such as a camera.

捆包步驟中,對檢查的結果為滿足所需品質的玻璃膜進行捆包。捆包是藉由對既定的托板(pallet)平放積層或豎放積層多片玻璃膜而進行。此時,亦可使包含襯墊紙或發泡樹脂等的保護片材介於玻璃膜的積層方向的相互之間。In the packing step, the glass films satisfying the required quality as a result of the inspection are packed. Packing is carried out by laminating multiple pieces of glass film on a predetermined pallet (pallet) horizontally or vertically. At this time, you may intervene the protective sheet containing a backing paper, a foamed resin, etc. between the lamination direction of a glass film.

<第二實施形態> 第二實施形態的玻璃膜的製造方法與第一實施形態的玻璃膜的製造方法的不同點為割斷步驟中的玻璃膜G的支持態樣。以下,對該不同點進行說明,對共同的結構標註相同符號而省略詳細說明。<Second Embodiment> The difference between the manufacturing method of the glass film of the second embodiment and the manufacturing method of the glass film of the first embodiment is the state of supporting the glass film G in the cutting step. Hereinafter, this difference will be described, and the same reference numerals will be assigned to common structures, and detailed description will be omitted.

此處,於割斷預定線V的另一端Vb附近,難以確保用以同時形成加熱區域H與冷卻區域C的空間。因此,若欲僅利用熱應力對玻璃膜G進行雷射割斷,則有於割斷預定線V的另一端Vb附近熱應力變得不充分而形成切割殘留部之虞。因此,第二實施形態的玻璃膜的製造方法所包括的割斷步驟的進一步的課題在於,防止形成此種切割殘留部。Here, in the vicinity of the other end Vb of the line V to be divided, it is difficult to secure a space for forming the heating region H and the cooling region C at the same time. Therefore, if the glass film G is to be laser cut using only the thermal stress, the thermal stress becomes insufficient near the other end Vb of the line V to be cut, and a cut remaining portion may be formed. Therefore, a further object of the cutting step included in the method of manufacturing the glass film according to the second embodiment is to prevent the formation of such cut residues.

如圖4及圖5所示,第二實施形態的玻璃膜的製造方法所包括的割斷步驟中,於支持構件2上,配置有將玻璃膜G的各割斷預定線V附近自背面側支持的支持棒7。支持棒7由在與割斷預定線V平行的方向為長條的平板所構成,其上表面較佳為水平的平面。As shown in FIG. 4 and FIG. 5 , in the cutting step included in the method of manufacturing the glass film G according to the second embodiment, on the support member 2 , a support member for supporting the vicinity of each planned cutting line V of the glass film G from the back side is arranged. Support Stick 7. The supporting rod 7 is formed of a long flat plate in a direction parallel to the planned cutting line V, and its upper surface is preferably a horizontal plane.

支持棒7於各割斷預定線V附近中的除了各割斷預定線V的正下方以外的位置,於寬度方向端部Gb與支持構件2之間、及寬度方向中央部Ga與支持構件2之間,與割斷預定線V平行地並列配置有兩根。割斷預定線V存在共計兩條,故而支持棒7是於支持構件2上配置有共計四根。藉此,玻璃膜G的包含各割斷預定線V的部分由並列配置的兩根支持棒7抬起,並且以於該兩根支持棒7之間自支持構件2浮起的狀態而保持。再者,玻璃膜G的包含割斷預定線V的部分於兩根支持棒7之間可成為水平的平面狀,或亦可成為向上方凸出的凸曲面狀,或亦可成為向下方凸出的凹曲面狀。The support rods 7 are located at positions other than directly below the respective planned cutting lines V in the vicinity of the respective planned cutting lines V, between the end portions Gb in the width direction and the supporting member 2, and between the central portion Ga in the width direction and the supporting member 2. , two parallel to the planned cutting line V are arranged. There are a total of two planned cutting lines V, so a total of four support rods 7 are arranged on the support member 2 . Thereby, the portion of the glass film G including the respective planned cutting lines V is lifted by the two support rods 7 arranged in parallel, and is held in a state of floating from the support member 2 between the two support rods 7 . Furthermore, the portion of the glass film G including the planned cutting line V may be in a horizontal planar shape between the two support rods 7, or may be in a convex curved shape protruding upward, or may be protruding downward. concave shape.

於如此般於割斷預定線V的兩側並列配置兩根支持棒7時,寬度方向端部Gb的寬度較佳為相對較大。然而,寬度方向中央部Ga的寬度設為大於寬度方向端部Gb的寬度。此處,作為寬度方向端部Gb的寬度相對較大的情形,可例示以下的值。即,於玻璃膜G的厚度為200 μm時寬度方向端部Gb的寬度為46 mm以上,於玻璃膜G的厚度為100 μm時寬度方向端部Gb的寬度為70 mm以上。再者,所述的寬度方向端部Gb的寬度是設為將玻璃膜G載置於水平的平面上而測定的值。另外,寬度方向端部Gb的寬度的較佳範圍視玻璃膜G的厚度、或者支持棒7的厚度或寬度等各條件而變動,故而不限定於例示。When the two supporting rods 7 are arranged side by side on both sides of the planned cutting line V in this way, it is preferable that the width of the end portion Gb in the width direction is relatively large. However, the width of the central portion Ga in the width direction is made larger than the width of the end portions Gb in the width direction. Here, the following values can be exemplified as the case where the width of the end portion Gb in the width direction is relatively large. That is, when the thickness of the glass film G is 200 μm, the width of the end portion Gb in the width direction is 46 mm or more, and when the thickness of the glass film G is 100 μm, the width of the end portion Gb in the width direction is 70 mm or more. In addition, the width|variety of the edge part Gb of the said width direction is made into the value measured by placing the glass film G on a horizontal plane. In addition, since the preferable range of the width of the end part Gb in the width direction varies depending on various conditions such as the thickness of the glass film G or the thickness or width of the support rod 7, it is not limited to the examples.

兩根支持棒7的間隔D2例如較佳為5 mm~50 mm(本實施形態中為15 mm)。支持棒7的厚度例如較佳為0.5 mm~5 mm(本實施形態中為2 mm)。支持棒7的寬度例如較佳為5 mm~30 mm(本實施形態中為10 mm)。各支持棒7的厚度或寬度較佳為相同。The distance D2 between the two support rods 7 is preferably, for example, 5 mm to 50 mm (15 mm in this embodiment). The thickness of the support rod 7 is preferably, for example, 0.5 mm to 5 mm (2 mm in this embodiment). The width of the support rod 7 is preferably, for example, 5 mm to 30 mm (10 mm in this embodiment). The thickness or width of each supporting rod 7 is preferably the same.

支持棒7是與支持台5同樣地藉由任意的固定方法而固定於支持構件2。支持棒7可為相對於支持構件2而可裝卸,或亦可與支持構件2一體化。The support rod 7 is fixed to the support member 2 by an arbitrary fixing method similarly to the support stand 5 . The support rod 7 may be detachable from the support member 2 or may be integrated with the support member 2 .

支持棒7的材質例如可列舉金屬或樹脂等。於支持棒7為金屬時,較佳為將支持棒7的整個背面黏接固定於支持構件2,於支持棒7為樹脂時,較佳為僅將支持棒7的長度方向的兩端部黏接固定於支持構件2。當然,支持棒7的固定方法或固定位置並無特別限定。As for the material of the support rod 7, metal, resin, etc. are mentioned, for example. When the support rod 7 is made of metal, it is preferable to bond and fix the entire back of the support rod 7 to the support member 2, and when the support rod 7 is made of resin, it is preferable to glue only the two ends of the support rod 7 in the longitudinal direction. connected to the support member 2. Of course, the fixing method or fixing position of the support rod 7 is not particularly limited.

支持棒7遍及與割斷預定線V平行的方向的玻璃膜G的全長而連續地配置。再者,支持棒7亦可於與割斷預定線V平行的方向的玻璃膜G的全長中,間斷地配置或僅配置於一部分。此時,支持棒7較佳為至少配置於割斷預定線V的另一端(與形成有初期裂縫Sa的割斷預定線V的其中一端Va為相反側的一端)Vb的附近。The supporting rods 7 are continuously arranged over the entire length of the glass film G in a direction parallel to the line V to cut. In addition, the support rod 7 may be arrange|positioned intermittently or only in a part over the whole length of the glass film G in the direction parallel to the line V to cut|disconnect. At this time, the support rod 7 is preferably disposed at least near the other end of the line V (the end opposite to one end Va of the line V formed with the initial crack Sa) Vb.

支持構件2的支持面積(支持構件2與玻璃膜G的接觸面積)大於支持棒7的支持面積(支持棒7與玻璃膜G的接觸面積)。詳細而言,支持構件2的支持面積較佳為支持棒7的支持面積的5倍以上。藉此,玻璃膜G的大部分由支持構件2支持,故而於雷射割斷時玻璃膜G的姿勢亦穩定。The support area of the support member 2 (the contact area of the support member 2 and the glass film G) is larger than the support area of the support rod 7 (the contact area of the support rod 7 and the glass film G). Specifically, the supporting area of the supporting member 2 is preferably 5 times or more the supporting area of the supporting rod 7 . Thereby, since most of the glass film G is supported by the support member 2, the attitude|position of the glass film G is also stabilized at the time of laser cutting.

耐熱層R較佳為不與支持棒7重疊。本實施形態中,以不與支持棒7重疊的方式於並列配置的兩根支持棒7之間配置有耐熱層R。不限定於本實施形態,耐熱層R亦可與支持棒7重疊。It is preferable that the heat-resistant layer R does not overlap with the support rod 7 . In this embodiment, the heat-resistant layer R is arranged between the two supporting rods 7 arranged in parallel so as not to overlap with the supporting rods 7 . Not limited to this embodiment, the heat-resistant layer R may overlap with the support rod 7.

如以上般的玻璃膜G的支持態樣中,與第一實施形態的割斷步驟同樣地,於玻璃膜G的包含割斷預定線V的區域、與隔熱片材T之間配置有耐熱層R,故而可於雷射割斷時,防止由利用雷射L的加熱導致隔熱片材T燒接於玻璃膜G。In the supporting aspect of the glass film G as described above, the heat-resistant layer R is arranged between the region including the line V to be cut of the glass film G and the heat insulating sheet T, similarly to the cutting step of the first embodiment. , Therefore, it is possible to prevent the thermal insulation sheet T from being burnt to the glass film G by heating with the laser L during laser cutting.

另外,本實施形態中,為於割斷預定線V的兩側配置有兩根支持棒7的支持態樣,故而玻璃膜G的包含割斷預定線V的部分於雷射割斷時由兩根支持棒7抬起,並且於該兩根支持棒7之間自支持構件2浮起。若以此種支持態樣對玻璃膜G進行雷射割斷,則即便於割斷預定線V的另一端Vb附近使初期裂縫Sa發展的熱應力變得不充分,亦可防止形成切割殘留部的事態。In addition, in the present embodiment, two support rods 7 are arranged on both sides of the planned division line V, so the part of the glass film G that includes the planned division line V is supported by the two support rods during laser cutting. 7 lifts up and floats from the supporting member 2 between the two supporting rods 7. If the glass film G is cut by laser in such a supporting state, even if the thermal stress for the development of the initial crack Sa becomes insufficient near the other end Vb of the planned cutting line V, it is possible to prevent the formation of the cutting residue. .

產生此種現象的原因雖未查明,但考慮如下。即,玻璃膜G的包含割斷預定線V的部分於兩根支持棒7之間自支持構件2浮起,故而以割斷預定線V上的割斷部(割斷已完成的部分)S為邊界的寬度方向端部Gb與寬度方向中央部Ga欲分別獨立地回到更穩定的狀態(例如成為平面的狀態)。此種欲回到穩定狀態時發揮作用的力的方向及/或大小於以割斷部S為邊界的寬度方向端部Gb與寬度方向中央部Ga彼此不同。其結果可認為,對於割斷預定線V上的未割斷部(割斷未完成的部分),與由雷射割斷所致的熱應力不同,例如撕裂力或剪切力等促進初期裂縫Sa的發展的輔助的力發揮作用。因此可認為,即便於割斷預定線V的另一端Vb附近使初期裂縫Sa發展的熱應力變得不充分,亦由於此種輔助的力而初期裂縫Sa的發展持續,防止切割殘留部的產生。Although the cause of this phenomenon has not been elucidated, it is considered as follows. That is, the portion of the glass film G including the line V to be cut floats from the support member 2 between the two support rods 7, so the width of the boundary between the cut portion (the portion where the cut has been completed) S on the line V is The end portions Gb in the direction and the center portion Ga in the width direction are intended to return to a more stable state (for example, a flat state) independently. The direction and/or magnitude of such a force acting when returning to a stable state are different from each other at the widthwise end Gb and the widthwise central portion Ga bordering on the cut portion S. As a result, it can be considered that the uncut portion (the portion where the cut is not completed) on the planned cut line V is different from the thermal stress caused by laser cutting, such as tearing force or shearing force, which promotes the development of the initial crack Sa. The auxiliary force plays a role. Therefore, it is considered that even if the thermal stress for developing the initial crack Sa near the other end Vb of the planned cutting line V becomes insufficient, the growth of the initial crack Sa continues due to this auxiliary force, preventing the generation of the cut residue.

此處,本實施形態中,於玻璃膜G的寬度方向端部Gb在除了支持棒7以外的位置自支持構件2浮起的狀態下實施雷射割斷,但不限定於此。例如,亦可使寬度方向端部Gb的端緣經由隔熱片材T而與支持構件2進行線接觸,寬度方向端部Gb的其餘部分於除了經由隔熱片材T的與支持棒7的接觸部以外的位置,自支持構件2浮起。另外,亦可使寬度方向端部Gb的包含端緣的部分經由隔熱片材T而與支持構件2進行面接觸,寬度方向端部Gb的其餘部分於除了經由隔熱片材T的與支持棒7的接觸部以外的位置,自支持構件2浮起。Here, in the present embodiment, laser cutting is performed in a state where the end portion Gb in the width direction of the glass film G is lifted from the support member 2 at a position other than the support rod 7 , but the present invention is not limited thereto. For example, the edge of the end portion Gb in the width direction may be in line contact with the support member 2 via the heat insulating sheet T, and the remaining portion of the end portion Gb in the width direction may be in line contact with the support rod 7 except through the heat insulating sheet T. The positions other than the contact part float from the supporting member 2 . In addition, the portion including the edge of the end portion Gb in the width direction may be brought into surface contact with the support member 2 through the heat insulating sheet T, and the remaining portion of the end portion Gb in the width direction may be in contact with the supporting member 2 except through the heat insulating sheet T. The position other than the contact portion of the rod 7 floats from the supporting member 2 .

<第三實施形態> 第三實施形態的玻璃膜的製造方法與第二實施形態的玻璃膜的製造方法的不同點為割斷步驟中的玻璃膜G的支持態樣。以下,對該不同點進行說明。再者,對共同的結構標註相同符號而省略詳細說明。<Third Embodiment> The difference between the manufacturing method of the glass film of the third embodiment and the manufacturing method of the glass film of the second embodiment is the state of supporting the glass film G in the cutting step. Hereinafter, this difference will be described. In addition, the same code|symbol is attached|subjected to the common structure, and detailed description is abbreviate|omitted.

如圖6所示,第三實施形態的玻璃膜的製造方法所包括的割斷步驟中,於各割斷預定線V附近中除了各割斷預定線V的正下方以外的位置,僅於寬度方向端部Gb與支持構件2之間,與割斷預定線V平行地配置有一根支持棒7。換言之,支持棒7並未配置於寬度方向中央部Ga與支持構件2之間。割斷預定線V存在共計兩條,故而支持棒7配置有共計兩根。藉此,玻璃膜G的包含各割斷預定線V的部分由一根支持棒7抬起,並且以於該一根支持棒7的其中一側、即寬度方向中央部Ga側自支持構件2浮起的狀態而保持。再者,玻璃膜G的包含割斷預定線V的部分於支持棒7的其中一側可成為傾斜的平面狀,或亦可成為向上方凸出的凸曲面狀,或亦可成為向下方凸出的凹曲面狀。另外,本實施形態中,寬度方向端部Gb總體以於除了經由隔熱片材T的與支持棒7的接觸部以外的位置,自支持構件2浮起的狀態而保持,但寬度方向端部Gb的包含端緣的部分亦可經由隔熱片材T而與支持構件2接觸(線接觸或面接觸)。As shown in FIG. 6, in the cutting step included in the manufacturing method of the glass film according to the third embodiment, in the vicinity of each planned cutting line V, except for the position directly below each planned cutting line V, only at the end portion in the width direction Between Gb and the support member 2, one support bar 7 is arranged parallel to the line V to be cut. In other words, the support rod 7 is not disposed between the central portion Ga in the width direction and the support member 2 . There are a total of two planned cutting lines V, so a total of two support rods 7 are arranged. Thereby, the portion of the glass film G including the lines V to be cut is lifted by one support rod 7, and floats from the support member 2 on one side of the one support rod 7, that is, on the central portion Ga side in the width direction. maintain the raised state. Furthermore, the portion of the glass film G including the planned cutting line V may be inclined on one side of the support rod 7, or may be convexly curved upward, or may be convex downward. concave shape. In addition, in this embodiment, the width direction end part Gb is hold|maintained in the state which floated from the support member 2 at the position other than the contact part with the support rod 7 of the heat insulating sheet T as a whole, but the width direction end part Gb The portion including the edge of Gb may be in contact with the support member 2 via the heat insulating sheet T (line contact or surface contact).

於如此般僅於割斷預定線V的單側配置有一根支持棒7時,寬度方向端部Gb的寬度較佳為相對較小。此處,作為寬度方向端部Gb的寬度相對較小的情形,可例示以下的值。即,於玻璃膜G的厚度為200 μm時寬度方向端部Gb的寬度小於46 mm(較佳為45 mm以下),於玻璃膜G的厚度為100 μm時寬度方向端部Gb的寬度小於70 mm(較佳為50 mm以下)。再者,所述寬度方向端部Gb的寬度是設為將玻璃膜G載置於水平的平面上而測定的值。另外,寬度方向端部Gb的寬度的較佳範圍視玻璃膜G的厚度、或者支持棒7的厚度或寬度等各條件而變動,故而不限定於例示。When one supporting rod 7 is disposed only on one side of the line V to be cut in this way, the width of the end portion Gb in the width direction is preferably relatively small. Here, the following values can be exemplified as the case where the width of the end portion Gb in the width direction is relatively small. That is, when the thickness of the glass film G is 200 μm, the width of the end portion Gb in the width direction is less than 46 mm (preferably less than 45 mm), and when the thickness of the glass film G is 100 μm, the width of the end portion Gb in the width direction is less than 70 mm. mm (preferably less than 50 mm). In addition, the width|variety of the said width direction edge part Gb is made into the value measured by placing the glass film G on a horizontal plane. In addition, since the preferable range of the width of the end part Gb in the width direction varies depending on various conditions such as the thickness of the glass film G or the thickness or width of the support rod 7, it is not limited to the examples.

支持棒7的厚度例如較佳為0.5 mm~5 mm(本實施形態中為2 mm)。支持棒7的寬度例如較佳為5 mm~30 mm(本實施形態中為10 mm)。The thickness of the support rod 7 is preferably, for example, 0.5 mm to 5 mm (2 mm in this embodiment). The width of the support rod 7 is preferably, for example, 5 mm to 30 mm (10 mm in this embodiment).

玻璃膜G的包含割斷預定線V的部分具有經由隔熱片材T而與支持棒7接觸的第一接觸部P1、及經由隔熱片材T而與支持構件2接觸的第二接觸部P2。第一接觸部P1與第二接觸部P2之間的間隔D3例如較佳為30 mm~200 mm(本實施形態中為140 mm)。A portion of the glass film G including the line V to be cut has a first contact portion P1 in contact with the support bar 7 through the heat insulating sheet T, and a second contact portion P2 in contact with the support member 2 through the heat insulating sheet T. . The distance D3 between the first contact portion P1 and the second contact portion P2 is preferably, for example, 30 mm to 200 mm (140 mm in this embodiment).

割斷預定線V較佳為於第一接觸部P1與第二接觸部P2之間,偏向位於第一接觸部P1側。換言之,較佳為第二接觸部P2與割斷預定線V之間的間隔D4大於第一接觸部P1與割斷預定線V之間的間隔D5。間隔D4較佳為間隔D5的2倍以上。The planned cutting line V is preferably located between the first contact portion P1 and the second contact portion P2 and is biased toward the first contact portion P1 side. In other words, it is preferable that the interval D4 between the second contact portion P2 and the line V is larger than the interval D5 between the first contact portion P1 and the line V. The interval D4 is preferably twice or more than the interval D5.

耐熱層R較佳為不與支持棒7重疊。本實施形態中,以不與支持棒7重疊的方式於支持棒7的其中一側、即寬度方向中央部Ga側配置有耐熱層R。不限於該實施形態,耐熱層R亦可與支持棒7重疊。It is preferable that the heat-resistant layer R does not overlap with the support rod 7 . In the present embodiment, the heat-resistant layer R is disposed on one side of the support rod 7 , that is, on the central portion Ga side in the width direction, so as not to overlap the support rod 7 . Not limited to this embodiment, the heat-resistant layer R may overlap with the support rod 7.

如以上般的玻璃膜G的支持態樣中,與第一實施形態及第二實施形態的割斷步驟同樣地,於玻璃膜G的包含割斷預定線V的區域、與隔熱片材T之間配置有耐熱層R,故而可防止由利用雷射L的加熱導致隔熱片材T燒接於玻璃膜G。In the supporting form of the glass film G as described above, similar to the cutting steps of the first embodiment and the second embodiment, between the region including the planned cutting line V of the glass film G and the heat insulating sheet T Since the heat-resistant layer R is disposed, it is possible to prevent the heat-insulating sheet T from being burned to the glass film G by heating with the laser L.

進而可認為,即便為僅於割斷預定線V的單側配置有一根支持棒7的支持態樣,亦與第二實施形態的割斷步驟同樣地,對於割斷預定線V上的未割斷部,與由雷射割斷所得的熱應力不同,例如撕裂力或剪切力等促進初期裂縫Sa的發展的輔助的力發揮作用。因此,即便於割斷預定線V的另一端Vb附近使初期裂縫Sa發展的熱應力變得不充分,亦可防止形成切割殘留部的事態。尤其於割斷預定線V偏向位於第一接觸部P1側時,容易享有此種效果。Furthermore, it can be considered that even in the supporting form in which one support rod 7 is arranged on only one side of the line V to be cut, similarly to the cutting step of the second embodiment, for the uncut portion on the line V to be cut, Depending on the thermal stress obtained by laser cutting, for example, an auxiliary force such as tearing force or shearing force acts to promote the development of the initial crack Sa. Therefore, even if the thermal stress for developing the initial crack Sa becomes insufficient in the vicinity of the other end Vb of the line V to be split, it is possible to prevent the formation of the remaining cut portion. This effect is easily enjoyed especially when the line V to be cut is deviated to the side of the first contact portion P1.

本發明絲毫不限定於所述實施形態,可於不偏離本發明的主旨的範圍內進而以各種形態實施。This invention is not limited to the said embodiment at all, It can further be implemented in various forms in the range which does not deviate from the summary of this invention.

所述的第一實施形態~第三實施形態中,亦可於將雷射振盪器及冷媒噴射噴嘴保持於恆定位置的狀態下,使玻璃膜移動。此時,支持構件可使用移動台或帶式輸送機(belt conveyor)等移動機構。另外,於如此般一方面使玻璃膜移動一方面實施雷射割斷時,玻璃膜亦可自實施溢流法或浮式法等公知的成形方法的成形部連續地供給。或者,玻璃膜亦可自將長條的玻璃膜捲繞成卷狀而成的玻璃卷連續地供給。此時,關於隔熱片材,可使用自將長條的隔熱片材捲繞成卷狀而成的片材卷連續地供給,且於其搬送路徑的中途與玻璃膜重合者。此時,耐熱層亦可預先配置於經捲繞成卷狀的隔熱片材。或者,耐熱層亦可依次黏接於自片材卷所捲出的隔熱片材等而配置。In the above-described first to third embodiments, the glass film may be moved while maintaining the laser oscillator and the refrigerant injection nozzle at constant positions. In this case, a moving mechanism such as a moving table or a belt conveyor can be used for the supporting member. In addition, when laser cutting is performed while moving the glass film in this way, the glass film can also be continuously supplied from a forming section that performs a known forming method such as an overflow method or a float method. Alternatively, the glass film may be continuously supplied from a glass roll obtained by winding a long glass film into a roll shape. At this time, as for the heat insulating sheet, what is continuously supplied from a sheet roll in which a long heat insulating sheet is wound into a roll shape, and which overlaps with the glass film in the middle of the conveyance path can be used. At this time, the heat-resistant layer may be preliminarily arranged on the heat-insulating sheet wound up into a roll. Alternatively, the heat-resistant layer may be sequentially bonded to a heat-insulating sheet or the like unwound from a sheet roll, and may be arranged.

所述的第一實施形態~第三實施形態中,對沿著設於玻璃膜的寬度方向端部與寬度方向中央部的邊界的割斷預定線進行雷射割斷的情形進行了說明,但不限定於此。例如,亦可應用於沿著設於玻璃膜的寬度方向中央部的既定位置的割斷預定線進行雷射割斷的情形。另外,割斷預定線的條數亦不限定於兩條,亦可為一條或三條以上。In the first to third embodiments described above, the case where the laser cutting is performed along the planned cutting line provided at the boundary between the end portions in the width direction and the central portion in the width direction of the glass film has been described, but the present invention is not limited to here. For example, it can also be applied to the case of performing laser cutting along a planned cutting line provided at a predetermined position in the width direction central part of the glass film. In addition, the number of planned cutting lines is not limited to two, and may be one or three or more.

所述的第二實施形態及第三實施形態中,對支持棒為於與割斷預定線平行的方向為長條的平板的情形進行了說明,但支持棒的形狀不限定於此。支持棒只要於與割斷預定線平行的方向為長條,則例如亦可為圓柱(包含橢圓柱)、多稜柱(包含三角形或五邊形以上的多稜柱)、半圓柱(包含半橢圓柱)等。再者,關於支持台的形狀亦同樣。In the above-mentioned second and third embodiments, the case where the supporting rod is an elongated flat plate in the direction parallel to the line to cut has been described, but the shape of the supporting rod is not limited to this. As long as the support rod is long in the direction parallel to the intended cutting line, it can be, for example, a cylinder (including an elliptical cylinder), a polygonal cylinder (including a triangle or a pentagonal or larger polygonal cylinder), and a half cylinder (including a half-ellipse cylinder). wait. In addition, it is the same about the shape of a support stand.

所述的第二實施形態及第三實施形態中,設為於玻璃膜的除了割斷預定線的正下方以外的位置配置有支持棒的情形,但支持棒亦可配置於玻璃膜的割斷預定線的正下方。In the second and third embodiments described above, the supporting rods are arranged at positions other than directly below the planned cutting line of the glass film, but the supporting rods may also be arranged at the planned cutting line of the glass film. directly below the .

1‧‧‧割斷裝置 2‧‧‧支持構件 3‧‧‧雷射振盪器 4‧‧‧冷媒噴射噴嘴 5‧‧‧支持台 6‧‧‧輪式切割機 7‧‧‧支持棒 C‧‧‧冷卻區域 D1‧‧‧寬度 D2、D3、D4、D5‧‧‧間隔 G‧‧‧玻璃膜 Ga‧‧‧寬度方向中央部 Gb‧‧‧寬度方向端部 H‧‧‧加熱區域 L‧‧‧雷射 P1‧‧‧第一接觸部 P2‧‧‧第二接觸部 R‧‧‧耐熱層 S‧‧‧割斷部 Sa‧‧‧初期裂縫 T‧‧‧隔熱片材 V‧‧‧割斷預定線 Va‧‧‧其中一端 Vb‧‧‧另一端 W‧‧‧冷媒 X、Y、Z‧‧‧方向 1‧‧‧Cutting device 2‧‧‧Supporting components 3‧‧‧Laser oscillator 4‧‧‧Refrigerant injection nozzle 5‧‧‧Support Desk 6‧‧‧Wheel cutting machine 7‧‧‧Support stick C‧‧‧cooling area D1‧‧‧width D2, D3, D4, D5‧‧‧interval G‧‧‧Glass film Ga‧‧‧Central part in the width direction Gb‧‧‧Width direction end H‧‧‧Heating area L‧‧‧Laser P1‧‧‧first contact part P2‧‧‧Second contact part R‧‧‧heat-resistant layer S‧‧‧cutting part Sa‧‧‧initial crack T‧‧‧Heat insulation sheet V‧‧‧cut off the scheduled line One end of Va‧‧‧ Vb‧‧‧the other end W‧‧‧refrigerant X, Y, Z‧‧‧direction

圖1為表示第一實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的平面圖。 圖2為圖1的A-A剖面圖,且為表示於割斷預定線的其中一端形成初期裂縫的狀況的圖。 圖3為圖1的B-B剖面圖,且為表示剛形成割斷部後的狀態的圖。 圖4為表示第二實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的平面圖。 圖5為圖4的E-E剖面圖,且為表示剛形成割斷部後的狀態的圖。 圖6為表示第三實施形態的玻璃膜的製造方法所包括的割斷步驟以及用以實施該割斷步驟的割斷裝置的剖面圖,且為表示剛形成割斷部後的狀態的圖。FIG. 1 is a plan view showing a cutting step included in the method for producing a glass film according to a first embodiment and a cutting device for performing the cutting step. Fig. 2 is an A-A sectional view of Fig. 1 , and is a view showing a state in which an initial crack is formed at one end of a line to cut. FIG. 3 is a cross-sectional view taken along line B-B in FIG. 1 , and is a view showing a state immediately after a cut portion is formed. 4 is a plan view showing a cutting step included in the method for producing a glass film according to a second embodiment and a cutting device for performing the cutting step. Fig. 5 is a sectional view taken along line E-E of Fig. 4 , and is a view showing a state immediately after a cut portion is formed. 6 is a cross-sectional view showing a cutting step included in the method of manufacturing a glass film according to a third embodiment and a cutting device for performing the cutting step, and is a view showing a state immediately after a cut portion is formed.

1‧‧‧割斷裝置 1‧‧‧Cutting device

2‧‧‧支持構件 2‧‧‧Supporting components

3‧‧‧雷射振盪器 3‧‧‧Laser oscillator

4‧‧‧冷媒噴射噴嘴 4‧‧‧Refrigerant injection nozzle

D1‧‧‧寬度 D1‧‧‧width

G‧‧‧玻璃膜 G‧‧‧Glass film

Ga‧‧‧寬度方向中央部 Ga‧‧‧Central part in the width direction

Gb‧‧‧寬度方向端部 Gb‧‧‧Width direction end

L‧‧‧雷射 L‧‧‧Laser

R‧‧‧耐熱層 R‧‧‧heat-resistant layer

S‧‧‧割斷部 S‧‧‧cutting part

T‧‧‧隔熱片材 T‧‧‧Heat insulation sheet

V‧‧‧割斷預定線 V‧‧‧cut off the scheduled line

W‧‧‧冷媒 W‧‧‧refrigerant

X、Z‧‧‧方向 X, Z‧‧‧direction

Claims (5)

一種玻璃膜的製造方法,包括:割斷步驟,於將玻璃膜自背面側經由隔熱片材藉由支持構件進行支持的狀態下,藉由利用雷射的加熱及追隨於所述加熱的利用冷媒的冷卻,使形成於所述玻璃膜的割斷預定線上的初期裂縫沿著所述割斷預定線發展,將所述玻璃膜割斷,所述玻璃膜的製造方法的特徵在於:於所述割斷步驟中,於在所述玻璃膜的包含所述割斷預定線的區域與所述隔熱片材之間配置有耐熱層的狀態下,對所述玻璃膜進行雷射割斷。 A method of manufacturing a glass film, comprising: a cutting step, in which the glass film is supported by a support member through a heat insulating sheet from the back side, by heating by laser and by using a refrigerant following the heating cooling, the initial cracks formed on the planned cutting line of the glass film develop along the planned cutting line, and the glass film is cut. The manufacturing method of the glass film is characterized in that: in the cutting step and performing laser cutting on the glass film in a state in which a heat-resistant layer is arranged between a region of the glass film including the line to cut and the heat insulating sheet. 如申請專利範圍第1項所述的玻璃膜的製造方法,其中與所述割斷預定線正交的方向的所述耐熱層的寬度大於所述雷射於所述玻璃膜的表面的點徑。 The method for manufacturing a glass film according to claim 1, wherein the width of the heat-resistant layer in a direction perpendicular to the planned cutting line is larger than the spot diameter of the laser on the surface of the glass film. 如申請專利範圍第1項或第2項所述的玻璃膜的製造方法,其中所述耐熱層為紙。 The method for manufacturing a glass film as described in item 1 or item 2 of the patent application, wherein the heat-resistant layer is paper. 如申請專利範圍第1項或第2項所述的玻璃膜的製造方法,其中於所述玻璃膜的以所述割斷預定線為邊界的至少一個區域與所述支持構件之間,於除了所述割斷預定線的正下方以外的位置配置沿著所述割斷預定線延伸的支持棒,藉此於使所述玻璃膜的包含所述割斷預定線的部分自所述支持構件浮起的狀態下將所述玻璃膜割斷。 The method for manufacturing a glass film according to claim 1 or 2, wherein between at least one region of the glass film bounded by the planned cutting line and the supporting member, all but the A support rod extending along the line to break is arranged at a position other than the line directly below the line to break so that a part of the glass film including the line to break is lifted from the supporting member Cut the glass membrane. 如申請專利範圍第4項所述的玻璃膜的製造方法,其中所述耐熱層配置於不與所述支持棒重疊的位置。The method for manufacturing a glass film according to claim 4, wherein the heat-resistant layer is arranged at a position not overlapping with the support rod.
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