JP2005022136A - Method and device for cutting fragile material - Google Patents

Method and device for cutting fragile material Download PDF

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Publication number
JP2005022136A
JP2005022136A JP2003187973A JP2003187973A JP2005022136A JP 2005022136 A JP2005022136 A JP 2005022136A JP 2003187973 A JP2003187973 A JP 2003187973A JP 2003187973 A JP2003187973 A JP 2003187973A JP 2005022136 A JP2005022136 A JP 2005022136A
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brittle material
cutting
continuously
locally
local
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Inventor
Satoshi Jibiki
聡 地引
Kazuya Fujino
一也 藤野
Atsuya Sugano
篤哉 菅野
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Nippon Sheet Glass Co Ltd
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Nippon Sheet Glass Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams

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  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Optics & Photonics (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cutting method for efficiently and certainly cutting a fragile material along a cutting scheduled line for a relatively short time, and a cutting device therefor. <P>SOLUTION: In the cutting method for continuously and locally heating the plate-shaped fragile material G along the cutting scheduled line L and cutting the locally heated part 3a of the fragile material G continuously and locally to cut the same, the locally heated part 3a is locally cooled while cooling the both lateral sides of the locally heated part 3a of the fragile material G continuously. The cutting device of the fragile material G is equipped with a local heating means for heating the plate-shaped fragile material G along the cutting scheduled line L continuously and locally, and a local cooling means 4 for cooling the locally heated part 3a continuously and locally and also equipped with a pair of side part cooling means 5 for continuously cooling both side parts of the locally heated part 3a of the fragile material G. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

【０００１】
【発明の属する技術分野】
本発明は、板状の脆性材料を切断予定線に沿って連続的に局部加熱した後、その脆性材料の局部加熱部分を連続的に局部冷却して前記脆性材料を切断予定線に沿って切断する脆性材料の切断方法、および、板状の脆性材料を切断予定線に沿って連続的に局部加熱する局部加熱手段と、その脆性材料の局部加熱部分を連続的に局部冷却して前記脆性材料を切断予定線に沿って切断する局部冷却手段を備えている脆性材料の切断装置に関する。
【０００２】
【従来の技術】
このような切断方法や切断装置は、例えば、板ガラスのような板状の脆性材料を切断するのに使用されるもので、従来、脆性材料の切断予定線上に切断誘発用の亀裂を形成し、その亀裂の近傍を加熱して熱応力を発生させることで亀裂を順次進行させながら、脆性材料を切断予定線に沿って切断する方法や装置が知られている（例えば、特許文献１参照）。
また、脆性材料を切断予定線に沿って連続的に局部加熱した後、その脆性材料の局部加熱部分を冷却流体のジェット流で連続的に局部冷却して切断する方法や装置も知られており（例えば、特許文献２参照）、さらに、脆性材料の局部加熱部分に冷却手段を接触させて局部冷却して切断する方法や装置も知られている（例えば、特許文献３参照）。
【０００３】
【特許文献１】
特公平３−１３０４０号公報（第１図〜第５図）
【特許文献２】
特許第３０２７７６８号公報（第１図、第４図）
【特許文献３】
特開２００２−１００５９０号公報（図１〜図６）
【０００４】
【発明が解決しようとする課題】
しかし、特許文献１に記載の従来技術では、加熱による熱応力の発生位置が、脆性材料内部における熱伝導の影響によって微妙に変動するために、熱応力の発生位置を特定するのが困難で、切断予定線に沿って確実に切断するのがむずかしい上に、脆性材料からの放熱に起因して切断に時間がかかりすぎて作業能率が悪いという欠点もある。
また、特許文献２や特許文献３に記載の従来技術では、脆性材料を局部加熱し、その局部加熱した部分を局部冷却して切断するため、切断予定線に沿っての切断は可能であるが、局部加熱と局部冷却のみに依存しての切断であるため、やはり切断に時間がかかりすぎて作業能率が悪いという欠点がある。
【０００５】
本発明は、このような従来の問題点に着目したもので、その目的は、脆性材料を比較的短時間で能率よく、しかも、切断予定線に沿って確実に切断することのできる脆性材料の切断方法と切断装置を提供することにある。
【０００６】
【課題を解決するための手段】
本発明の第１の特徴構成は、板状の脆性材料を切断予定線に沿って連続的に局部加熱した後、その脆性材料の局部加熱部分を連続的に局部冷却して前記脆性材料を切断予定線に沿って切断する脆性材料の切断方法であって、前記脆性材料の局部加熱部分の両側を連続的に側部冷却しながら、その局部加熱部分を局部冷却するところにある。
【０００７】
本発明の第１の特徴構成によれば、板状の脆性材料を切断予定線に沿って連続的に局部加熱した後、その脆性材料の局部加熱部分を連続的に局部冷却して脆性材料を切断予定線に沿って切断するに際して、脆性材料の局部加熱部分の両側を連続的に側部冷却しながら局部加熱部分を局部冷却するので、局部加熱部分には、その側部冷却によって脆性材料を局部加熱部分から互いに引き離そうとする力が作用する。
つまり、切断予定線に沿う局部加熱によって切断予定線の両側も熱伝導により加熱され、その加熱された切断予定線の両側を積極的に側部冷却するので、側部冷却部によって切断予定線の両側が収縮しようとし、その収縮力が脆性材料を局部加熱部分から互いに引き離す方向に作用して、局部加熱部分を積極的に切断する力となる。そして、その局部加熱部分を局部冷却しながら切断するので、脆性材料を比較的短時間で能率よく、しかも、切断予定線に沿って確実に切断することができるのである。
【０００８】
本発明の第２の特徴構成は、上述した脆性材料の切断方法において、前記局部加熱部分の両側を側部冷却した後、前記局部加熱部分を局部冷却するところにある。
【０００９】
本発明の第２の特徴構成によれば、上述した脆性材料の切断方法において、局部加熱部分の両側を側部冷却した後、局部加熱部分を局部冷却するので、局部加熱部分には、まず、側部冷却によって互いに引き離そうとする力が作用する。
そして、その引き離そうとする力が作用した状態で、局部加熱部分を局部冷却しながら切断するので、より一層迅速かつ確実に脆性材料を切断予定線に沿って切断することができる。
【００１０】
本発明の第３の特徴構成は、上述した脆性材料の切断方法において、前記局部加熱部分の両側を側部冷却するに際し、局部加熱部分から離れた位置から局部冷却部分に向けて近接する位置へ斜め方向に連続的に側部冷却するところにある。
【００１１】
本発明の第３の特徴構成によれば、上述した脆性材料の切断方法において、局部加熱部分の両側を側部冷却するに際し、局部加熱部分から離れた位置から局部冷却部分に向けて近接する位置へ斜め方向に連続的に側部冷却するので、局部加熱部分に対する引き離し力は、最初は小さく徐々に大きくなるように作用し、その結果、より一層合理的かつ良好に脆性材料を切断予定線に沿って切断することができる。
【００１２】
本発明の第４の特徴構成は、上述した脆性材料の切断方法において、前記脆性材料の切断予定線上に切断誘発用の亀裂を機械的に形成した後、その脆性材料を切断予定線に沿って局部加熱するところにある。
【００１３】
本発明の第４の特徴構成によれば、上述した脆性材料の切断方法において、脆性材料の切断予定線上に切断誘発用の亀裂を機械的に形成した後、その脆性材料を切断予定線に沿って局部加熱するので、機械的に形成した亀裂を足がかりとして局部加熱により亀裂が進行することになり、より一層円滑に脆性材料を切断予定線に沿って切断することができる。
【００１４】
本発明の第５の特徴構成は、板状の脆性材料を切断予定線に沿って連続的に局部加熱する局部加熱手段と、その脆性材料の局部加熱部分を連続的に局部冷却して前記脆性材料を切断予定線に沿って切断する局部冷却手段を備えている脆性材料の切断装置であって、前記脆性材料の局部加熱部分の両側を連続的に側部冷却する一対の側部冷却手段を備えているところにある。
【００１５】
本発明の第５の特徴構成によれば、板状の脆性材料を切断予定線に沿って連続的に局部加熱する局部加熱手段と、その脆性材料の局部加熱部分を連続的に局部冷却して脆性材料を切断予定線に沿って切断する局部冷却手段を備えている脆性材料の切断装置であって、脆性材料の局部加熱部分の両側を連続的に側部冷却する一対の側部冷却手段を備えているので、上述したように、局部加熱手段による局部加熱部分には、一対の側部冷却手段による側部冷却によって脆性材料を局部加熱部分から互いに引き離そうとする力が作用する。
そして、その局部加熱部分を局部冷却手段により局部冷却しながら切断することになるので、この切断装置を使用することによって脆性材料を比較的短時間で能率よく、しかも、切断予定線に沿って確実に切断することができる。
【００１６】
本発明の第６の特徴構成は、上述した脆性材料の切断装置において、前記脆性材料に対する相対移動方向の前方側に前記局部加熱手段を、後方側に前記局部冷却手段を備え、その局部加熱手段と局部冷却手段の間に前記一対の側部冷却手段を備えているところにある。
【００１７】
本発明の第６の特徴構成によれば、上述した脆性材料の切断装置において、脆性材料に対する相対移動方向の前方側に局部加熱手段を、後方側に局部冷却手段を備え、その局部加熱手段と局部冷却手段の間に一対の側部冷却手段を備えているので、局部加熱手段による局部加熱部分には、まず、一対の側部冷却手段による側部冷却によって互いに引き離そうとする力が作用し、その状態で、局部加熱部分を局部冷却手段により局部冷却しながら切断することになり、より一層迅速かつ確実に脆性材料を切断予定線に沿って切断することができる。
【００１８】
本発明の第７の特徴構成は、上述した脆性材料の切断装置において、前記一対の側部冷却手段が、前記局部加熱手段側ほど離間し局部冷却手段側ほど近接するハの字状に配置してあるところにある。
【００１９】
本発明の第７の特徴構成によれば、上述した脆性材料の切断装置において、一対の側部冷却手段が、局部加熱手段側ほど離間し局部冷却手段側ほど近接するハの字状に配置してあるので、そのハの字状に配置された一対の側部冷却手段による側部冷却によって、局部加熱部分に対する引き離し力は、最初は小さく徐々に大きくなるように作用し、より一層合理的かつ良好に脆性材料を切断予定線に沿って切断することができる。
【００２０】
本発明の第８の特徴構成は、上述した脆性材料の切断装置において、前記局部加熱手段よりも前記相対移動方向の前方側に、前記脆性材料の切断予定線上に切断誘発用の亀裂を形成する亀裂形成手段を備えているところにある。
【００２１】
本発明の第８の特徴構成によれば、上述した脆性材料の切断装置において、局部加熱手段よりも前記相対移動方向の前方側に、脆性材料の切断予定線上に切断誘発用の亀裂を形成する亀裂形成手段を備えているので、亀裂形成手段による亀裂を足がかりとして局部加熱により亀裂が進行することになり、より一層円滑に脆性材料を切断予定線に沿って切断することができる。
【００２２】
【発明の実施の形態】
本発明による脆性材料の切断方法と切断装置につき、その実施の形態を図面に基づいて説明する。
この切断方法と切断装置は、例えば、板状の脆性材料の一例である板ガラスを切断するためのもので、切断装置の装置本体１は、図１〜図３に示すように、搬送方向Ｌ１に沿って移動するステージ２上の板ガラスＧを切断するべく、板ガラスＧの切断予定線Ｌに沿って連続的に局部加熱する局部加熱手段３と、その局部加熱手段３による板ガラスＧの局部加熱部分３ａを連続的に局部冷却して板ガラスＧを切断予定線Ｌに沿って切断する局部冷却手段４を備え、さらに、板ガラスＧの局部加熱部分３ａの両側を連続的に側部冷却する一対の側部冷却手段５と、板ガラスＧの切断予定線Ｌ上に切断誘発用の亀裂を形成する亀裂形成手段６を備えて構成されている。
【００２３】
局部加熱手段３は、レーザー発振器７と、レーザービームを成形する光学ユニット８、つまり、ビームエキスパンダー８ａ、反射ミラー８ｂ、および、シリンドリカルレンズ８ｃなどからなる光学ユニット８により構成され、図３に示すように、板ガラスＧに対して切断予定線Ｌ方向に細長い楕円のような形状に合焦して局部加熱部分３ａを形成するように構成されて、光学ユニット８を構成するシリンドリカルレンズ８ｃが、装置本体１に対して上下昇降自在に構成された昇降プレート９に取り付けられている。
この局部加熱手段３の熱源となるレーザーは、切断対象となる脆性材料に吸収される波長のものであればよく、脆性材料が板ガラスＧであれば、波長１０．６μｍの炭酸ガスレーザーが最適である。
ただし、局部加熱手段３の熱源はレーザーに限るものではなく、ハロゲンランプやクセノンランプを熱源として使用することもでき、また、局部加熱部分３ａについても、必ずしも細長い楕円のような形状に限るものではない。
【００２４】
局部冷却手段４と一対の側部冷却手段５は、平面視においてＵ字状またはＶ字状に構成されたアルミ製の接触子１０により互いに一体化されて昇降プレート９に取り付けられ、スプリング１１により下方へ押圧付勢されている。その接触子１０の上面には、冷媒としての液体窒素を収納する冷媒タンク１２が載置固定され、冷媒タンク１２に循環供給される液体窒素によって接触子１０、つまり、局部冷却手段４と一対の側部冷却手段５が冷却されるように構成されている。
局部冷却手段４は、局部加熱手段３により局部加熱された後の局部加熱部分３ａを局部的に冷却するもので、図３において仮想線４ａで示す局部冷却部分を冷却するように構成されている。
それに対して、一対の側部冷却手段５は、局部冷却手段４による局部冷却に先立って、局部加熱部分３ａの両側を側部冷却するもので、局部加熱手段３側ほど離間し局部冷却手段４側ほど近接するハの字状に配設され、図３において仮想線５ａで示す側部冷却部分を冷却するように構成されている。
【００２５】
亀裂形成手段６は、局部加熱手段３による局部加熱に先立って、板ガラスＧの切断予定線Ｌ上に切断誘発用の亀裂６ａ（図４の（イ）参照）を機械的に形成するもので、超硬製カッターホイール１３とそのカッターホイール１３を上下昇降するエアシリンダ１４により構成され、そのエアシリンダ１４を介して昇降プレート９に取り付けられている。
このような構成からなる切断装置は、その装置本体１の下面に設けられたエア噴出口１５から噴出されるエアによって板ガラスＧの上面から所定距離離れた位置に浮上して維持されるように構成され、板ガラスＧに対する相対移動方向Ｌ２、つまり、板ガラスＧが停止していると仮定した場合の板ガラスＧに対する切断装置１の移動方向Ｌ２（この実施形態では、板ガラスＧの方が搬送移動しているので、板ガラスＧの搬送方向Ｌ１と逆向きになる）の前方から後方に向けて、亀裂形成手段６、局部加熱手段３、側部冷却手段５、局部冷却手段４の順に配設されている。
【００２６】
つぎに、この切断装置の作用および切断装置を使用して板ガラスＧを切断する方法について説明する。
板ガラスＧは、ステージ２上に載置されて搬送方向Ｌ１に沿って搬送され、切断装置の装置本体１は、エア噴出口１５から噴出されるエアによって、その板ガラスＧの上面から所定距離離れた位置に確実に浮上維持されるとともに、局部冷却手段４と一対の側部冷却手段５を構成する接触子１０は、常に一定の押圧力で板ガラスＧの上面に接触される。
その板ガラスＧに対して、まず、図４の（イ）に示すように、亀裂形成手段６が作用し、具体的には、エアシリンダ１４の伸長により超硬製カッターホイール１３が下降して、板ガラスＧの切断予定線Ｌ上に切断誘発用の亀裂６ａを機械的に形成し、その後、エアシリンダ１４の短縮により超硬製カッターホイール１３は上昇して上昇位置に維持される。
なお、必要な場合には、超硬製カッターホイール１３を下降した状態に維持して、切断予定線Ｌ上に切断誘発用の亀裂６ａを連続的に形成することも、また、所定時間ごとに超硬製カッターホイール１３を昇降して亀裂６ａを形成することもできる。
【００２７】
その後、局部加熱手段３が、細長い局部加熱部分３ａを形成しながら板ガラスＧを切断予定線Ｌに沿って連続的に局部加熱するので、亀裂形成手段６による亀裂６ａを足がかりとして亀裂が進行する。
その状態で、図４の（ロ）、（ハ）に示すように、側部冷却手段５が、側部冷却部分５ａを形成しながら局部加熱部分３ａの両側を連続的に側部冷却するので、その側部冷却により局部加熱部分３ａの両側が収縮して、図中矢印で示すように、その収縮力が板ガラスＧを局部加熱部分３ａから互いに引き離す方向に作用し、その後、局部冷却手段４が、局部冷却部分４ａを形成しながら局部加熱部分３ａを連続的に局部冷却するので、板ガラスＧは切断予定線Ｌに沿って確実に切断される。
しかも、側部冷却手段５による側部冷却は、局部加熱部分３ａから離れた位置から局部冷却部分４ａに向けて近接する位置へ斜め方向に連続しているので、局部加熱部分３ａに対する引き離し力は、最初は小さく徐々に大きくなるように作用し、板ガラスＧは合理的に切断される。
【００２８】
〔別実施形態〕
（１）先の実施形態では、局部冷却手段４と一対の側部冷却手段５を一体化して、全体をＵ字状またはＶ字状に構成した例を示したが、図５に示すように、局部冷却手段４と一対の側部冷却手段５を別体に構成して、その一対の側部冷却手段５を局部加熱手段３側ほど離間し局部冷却手段４側ほど近接するハの字状に配置して実施することもでき、さらに、図６に示すように、一対の側部冷却手段５を切断予定線Ｌとほぼ平行に配置し、かつ、局部冷却手段４の横側方に配置して実施することもできる。
また、局部冷却手段４と側部冷却手段５の具体例として接触子１０を示したが、局部冷却手段４と側部冷却手段５の一方あるいは両方をペルチェ素子を使用した冷却手段で構成したり、冷媒用の気体や液体を板ガラスＧの上面に直接吹き付けるようにして冷却手段を構成することもできる。
【００２９】
（２）先の実施形態では、切断装置の装置本体１に設けたエア噴出口１５からエアを噴出させることによって、装置本体１と板ガラスＧ上面との間の距離を常に一定に維持する構成を示したが、例えば、板ガラスＧ上面の上下方向における変位を検出する変位検出センサを使用し、その変位検出センサの検出結果に基づいて装置本体１を上下変位させて、装置本体１と板ガラスＧ上面との間の距離を常に一定に維持するように構成することもできる。
また、亀裂形成手段６として超硬製カッターホイール１３を使用したものを示したが、超硬製カッターホイール１３に代えて、ダイヤモンド圧子などを使用して亀裂形成手段６を構成することもできる。
さらに、切断の対象である脆性材料の一例として板ガラスＧを示したが、板ガラス以外にも、例えば、板状のセラミックスやシリコンウエーハなどのような各種の板状脆性材料を切断の対象として適用することができる。
【図面の簡単な説明】
【図１】脆性材料の切断装置を示す概略斜視図
【図２】脆性材料の切断装置を示す概略側面図
【図３】脆性材料の切断部分を示す平面図
【図４】脆性材料の切断工程を示す平面図
【図５】別の実施形態による切断装置を示す平面図
【図６】別の実施形態による切断部分を示す平面図
【符号の説明】
１ 切断装置の装置本体
３ 局部加熱手段
３ａ 局部加熱部分
４ 局部冷却手段
４ａ 局部冷却部分
５ 側部冷却手段
５ａ 側部冷却部分
６ 亀裂形成手段
６ａ 切断誘発用の亀裂
Ｇ 板状の脆性材料
Ｌ 切断予定線
Ｌ２ 相対移動方向[0001]
BACKGROUND OF THE INVENTION
In the present invention, after the plate-like brittle material is continuously locally heated along the planned cutting line, the locally heated portion of the brittle material is continuously locally cooled to cut the brittle material along the planned cutting line. Cutting method of the brittle material, local heating means for continuously heating the plate-like brittle material continuously along the planned cutting line, and the brittle material by locally cooling the locally heated portion of the brittle material The present invention relates to a brittle material cutting device provided with a local cooling means for cutting along a planned cutting line.
[0002]
[Prior art]
Such a cutting method and a cutting apparatus are used for cutting a plate-like brittle material such as plate glass, and conventionally, a crack for inducing cutting is formed on a planned cutting line of the brittle material, There is known a method and apparatus for cutting a brittle material along a planned cutting line while heating the vicinity of the crack to generate a thermal stress and sequentially progressing the crack (see, for example, Patent Document 1).
Also known is a method and apparatus in which a brittle material is continuously heated along a planned cutting line, and then the locally heated portion of the brittle material is continuously cooled locally with a jet of cooling fluid. (For example, refer patent document 2) Furthermore, the method and apparatus which make a cooling means contact the local heating part of a brittle material, and cut by local cooling are also known (for example, refer patent document 3).
[0003]
[Patent Document 1]
Japanese Examined Patent Publication No. 3-13040 (FIGS. 1 to 5)
[Patent Document 2]
Japanese Patent No. 3027768 (FIGS. 1 and 4)
[Patent Document 3]
JP 2002-100590 A (FIGS. 1 to 6)
[0004]
[Problems to be solved by the invention]
However, in the prior art described in Patent Document 1, the position where the thermal stress is generated due to heating varies slightly due to the influence of heat conduction inside the brittle material, so it is difficult to specify the position where the thermal stress occurs. In addition to being difficult to cut reliably along the planned cutting line, there is also a drawback that it takes too much time to cut due to heat radiation from the brittle material, resulting in poor work efficiency.
Further, in the conventional techniques described in Patent Document 2 and Patent Document 3, since the brittle material is locally heated and the locally heated portion is locally cooled and cut, cutting along the planned cutting line is possible. Since the cutting depends only on the local heating and the local cooling, there is a disadvantage that the cutting takes too much time and the working efficiency is poor.
[0005]
The present invention pays attention to such conventional problems, and the purpose of the present invention is to provide a brittle material that can cut a brittle material efficiently in a relatively short time and that can reliably cut along a planned cutting line. A cutting method and a cutting apparatus are provided.
[0006]
[Means for Solving the Problems]
A first characteristic configuration of the present invention is to cut a plate-like brittle material by continuously locally heating a brittle material along a planned cutting line and then locally cooling the locally heated portion of the brittle material. A method for cutting a brittle material that cuts along a predetermined line, wherein the local heating portion is locally cooled while continuously cooling both sides of the local heating portion of the brittle material.
[0007]
According to the first characteristic configuration of the present invention, after the plate-like brittle material is continuously locally heated along the planned cutting line, the locally heated portion of the brittle material is continuously locally cooled to obtain the brittle material. When cutting along the planned cutting line, the local heating part is locally cooled while continuously cooling the both sides of the local heating part of the brittle material. A force acts to pull them away from the local heating part.
That is, both sides of the planned cutting line are heated by heat conduction due to local heating along the planned cutting line, and both sides of the heated planned cutting line are actively cooled side by side. Both sides try to contract, and the contraction force acts in the direction of pulling the brittle material away from the local heating part, and becomes a force for actively cutting the local heating part. Since the locally heated portion is cut while being locally cooled, the brittle material can be efficiently cut in a relatively short time, and reliably cut along the planned cutting line.
[0008]
According to a second characteristic configuration of the present invention, in the above-described method for cutting a brittle material, both sides of the local heating portion are side-cooled and then the local heating portion is locally cooled.
[0009]
According to the second characteristic configuration of the present invention, in the above-described brittle material cutting method, after locally cooling both sides of the locally heated portion, the locally heated portion is locally cooled. The side cooling causes a force to pull away from each other.
And since the local heating portion is cut while being locally cooled in the state where the force to separate is applied, the brittle material can be cut along the planned cutting line more quickly and reliably.
[0010]
According to a third characteristic configuration of the present invention, in the above-described method for cutting a brittle material, when both sides of the local heating portion are side-cooled, a position away from the local heating portion to a position close to the local cooling portion. There is a side cooling continuously in an oblique direction.
[0011]
According to the third characteristic configuration of the present invention, in the above-described brittle material cutting method, when side cooling is performed on both sides of the local heating portion, a position that is close to the local cooling portion from a position away from the local heating portion. Since the side cooling is continuously performed in an oblique direction, the pulling force against the locally heated portion acts to be small and gradually large at the beginning, and as a result, the brittle material can be more reasonably and satisfactorily made into the planned cutting line. Can be cut along.
[0012]
According to a fourth characteristic configuration of the present invention, in the above-described method for cutting a brittle material, after a crack for inducing cutting is mechanically formed on the planned cut line of the brittle material, the brittle material is cut along the planned cut line. It is in the place of local heating.
[0013]
According to the fourth characteristic configuration of the present invention, in the above-described method for cutting a brittle material, after a crack for inducing cutting is mechanically formed on the planned cutting line of the brittle material, the brittle material is moved along the planned cutting line. Therefore, the crack progresses by the local heating using the mechanically formed crack as a foothold, and the brittle material can be cut more smoothly along the planned cutting line.
[0014]
According to a fifth feature of the present invention, there is provided a local heating means for continuously heating a plate-like brittle material continuously along a planned cutting line, and the brittle material by continuously cooling a local heating portion of the brittle material. A brittle material cutting device comprising local cooling means for cutting a material along a planned cutting line, comprising a pair of side cooling means for continuously cooling both sides of a local heating portion of the brittle material. It is in place.
[0015]
According to the fifth characteristic configuration of the present invention, the local heating means for continuously locally heating the plate-like brittle material along the planned cutting line and the local heating portion of the brittle material are continuously cooled locally. A brittle material cutting device comprising a local cooling means for cutting a brittle material along a planned cutting line, comprising a pair of side cooling means for continuously cooling both sides of a locally heated portion of the brittle material. Since it is provided, as described above, the force to pull the brittle material away from the local heating portion acts on the local heating portion by the local heating means by the side cooling by the pair of side cooling means.
Since the locally heated portion is cut while being locally cooled by the local cooling means, the brittle material can be efficiently removed in a relatively short time by using this cutting device, and reliably along the planned cutting line. Can be cut into pieces.
[0016]
According to a sixth characteristic configuration of the present invention, in the above-described brittle material cutting apparatus, the local heating means is provided on the front side in the relative movement direction with respect to the brittle material, and the local cooling means is provided on the rear side. The pair of side cooling means is provided between the local cooling means and the local cooling means.
[0017]
According to the sixth characteristic configuration of the present invention, in the brittle material cutting apparatus described above, the local heating means is provided on the front side in the relative movement direction with respect to the brittle material, and the local cooling means is provided on the rear side. Since a pair of side cooling means are provided between the local cooling means, the local heating portion by the local heating means is first subjected to a force to separate them by side cooling by the pair of side cooling means, In this state, the local heating portion is cut while being locally cooled by the local cooling means, and the brittle material can be cut along the planned cutting line more quickly and reliably.
[0018]
According to a seventh characteristic configuration of the present invention, in the above-described brittle material cutting device, the pair of side cooling means are arranged in a square shape that is separated toward the local heating means side and closer to the local cooling means side. There is.
[0019]
According to the seventh characteristic configuration of the present invention, in the brittle material cutting device described above, the pair of side cooling means are arranged in a square shape that is separated toward the local heating means side and closer to the local cooling means side. Therefore, by the side cooling by the pair of side cooling means arranged in a square shape, the pulling force against the local heating portion acts to be small and gradually large at the beginning, making it even more rational and The brittle material can be well cut along the planned cutting line.
[0020]
According to an eighth feature of the present invention, in the brittle material cutting apparatus described above, a crack for inducing cutting is formed on a planned cutting line of the brittle material on the front side in the relative movement direction with respect to the local heating means. There is a crack forming means.
[0021]
According to the eighth characteristic configuration of the present invention, in the brittle material cutting apparatus described above, a crack for inducing cutting is formed on the planned cutting line of the brittle material on the front side in the relative movement direction with respect to the local heating means. Since the crack forming means is provided, the crack progresses by local heating using the crack by the crack forming means as a foothold, and the brittle material can be cut more smoothly along the planned cutting line.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of a brittle material cutting method and cutting apparatus according to the present invention will be described with reference to the drawings.
The cutting method and the cutting device are for cutting, for example, a plate glass which is an example of a plate-like brittle material. The device body 1 of the cutting device is arranged in the conveying direction L1 as shown in FIGS. In order to cut the plate glass G on the stage 2 moving along, the local heating means 3 for locally heating continuously along the cutting line L of the plate glass G, and the local heating portion 3a of the plate glass G by the local heating means 3 Is provided with local cooling means 4 for continuously cooling the glass sheet G along the planned cutting line L, and a pair of side parts for continuously cooling both sides of the local heating portion 3a of the glass sheet G. The cooling means 5 and the crack forming means 6 for forming a crack for inducing a cutting on the planned cutting line L of the plate glass G are provided.
[0023]
The local heating means 3 includes a laser oscillator 7 and an optical unit 8 for shaping a laser beam, that is, an optical unit 8 including a beam expander 8a, a reflection mirror 8b, a cylindrical lens 8c, and the like, as shown in FIG. In addition, the cylindrical lens 8c constituting the optical unit 8 is configured to focus on the shape of an ellipse elongated in the direction of the cutting line L with respect to the plate glass G to form the local heating portion 3a. 1 is attached to an elevating plate 9 configured to be movable up and down with respect to 1.
The laser serving as the heat source of the local heating means 3 may be of a wavelength that is absorbed by the brittle material to be cut. If the brittle material is a plate glass G, a carbon dioxide laser with a wavelength of 10.6 μm is optimal. is there.
However, the heat source of the local heating means 3 is not limited to the laser, but a halogen lamp or a xenon lamp can be used as the heat source, and the local heating portion 3a is not necessarily limited to a shape like an elongated ellipse. Absent.
[0024]
The local cooling means 4 and the pair of side cooling means 5 are integrated with each other by an aluminum contact 10 configured in a U shape or a V shape in plan view, and are attached to the lifting plate 9. It is pressed downward. A refrigerant tank 12 that stores liquid nitrogen as a refrigerant is placed and fixed on the upper surface of the contact 10, and the contact 10, that is, a pair of local cooling means 4 and a pair of liquid nitrogen circulated and supplied to the refrigerant tank 12. The side cooling means 5 is configured to be cooled.
The local cooling means 4 locally cools the local heating portion 3a after being locally heated by the local heating means 3, and is configured to cool the local cooling portion indicated by a virtual line 4a in FIG. .
On the other hand, the pair of side cooling means 5 cools both sides of the local heating part 3a before the local cooling by the local cooling means 4, and is separated as far as the local heating means 3 side. It arrange | positions at the square shape which adjoins the side, and it is comprised so that the side part cooling part shown by the virtual line 5a in FIG. 3 may be cooled.
[0025]
Prior to the local heating by the local heating means 3, the crack forming means 6 mechanically forms a crack 6a for induction of cutting on the planned cutting line L of the glass sheet G (see (a) in FIG. 4). The cemented carbide cutter wheel 13 and an air cylinder 14 that moves the cutter wheel 13 up and down are attached to the lifting plate 9 via the air cylinder 14.
The cutting device having such a configuration is configured to be floated and maintained at a position away from the upper surface of the plate glass G by air ejected from an air ejection port 15 provided on the lower surface of the device body 1. The relative movement direction L2 with respect to the sheet glass G, that is, the movement direction L2 of the cutting device 1 with respect to the sheet glass G when it is assumed that the sheet glass G is stopped (in this embodiment, the sheet glass G is transported and moved). Therefore, the crack forming means 6, the local heating means 3, the side cooling means 5, and the local cooling means 4 are arranged in this order from the front to the rear of the sheet glass G in the direction opposite to the conveying direction L <b> 1.
[0026]
Next, the operation of this cutting device and a method for cutting the glass sheet G using the cutting device will be described.
The plate glass G is placed on the stage 2 and conveyed along the conveyance direction L1, and the apparatus main body 1 of the cutting device is separated from the upper surface of the plate glass G by a predetermined distance by the air ejected from the air ejection port 15. The contact 10 that constitutes the local cooling means 4 and the pair of side cooling means 5 is always brought into contact with the upper surface of the glass sheet G with a constant pressing force.
First, as shown in FIG. 4A, the crack forming means 6 acts on the glass sheet G. Specifically, the carbide cutter wheel 13 is lowered by the extension of the air cylinder 14, A crack 6a for inducing cutting is mechanically formed on the planned cutting line L of the plate glass G, and then the carbide cutter wheel 13 is raised by the shortening of the air cylinder 14 and maintained at the raised position.
If necessary, the carbide cutter wheel 13 is maintained in a lowered state, and the cutting induction crack 6a can be continuously formed on the planned cutting line L. The crack 6a can also be formed by raising and lowering the carbide cutter wheel 13.
[0027]
Thereafter, the local heating means 3 continuously heats the glass sheet G continuously along the planned cutting line L while forming the elongated local heating portion 3a, so that the crack progresses with the crack 6a by the crack forming means 6 as a foothold.
In this state, as shown in FIGS. 4B and 4C, the side cooling means 5 continuously cools both sides of the local heating portion 3a while forming the side cooling portion 5a. As a result of the side cooling, both sides of the local heating portion 3a contract, and as shown by the arrows in the figure, the contracting force acts in a direction to separate the plate glass G from the local heating portion 3a, and then the local cooling means 4 However, since the local heating portion 3a is continuously locally cooled while forming the local cooling portion 4a, the plate glass G is reliably cut along the planned cutting line L.
Moreover, since the side cooling by the side cooling means 5 is continued in an oblique direction from a position away from the local heating portion 3a to a position close to the local cooling portion 4a, the pulling force on the local heating portion 3a is At first, the glass sheet G acts to be small and gradually large, and the glass sheet G is rationally cut.
[0028]
[Another embodiment]
(1) In the previous embodiment, the local cooling means 4 and the pair of side cooling means 5 were integrated to form an overall U-shape or V-shape, but as shown in FIG. The local cooling means 4 and the pair of side cooling means 5 are configured as separate bodies, and the pair of side cooling means 5 are spaced apart toward the local heating means 3 side and close to the local cooling means 4 side. Further, as shown in FIG. 6, the pair of side cooling means 5 are arranged substantially parallel to the planned cutting line L, and are arranged laterally to the local cooling means 4. It can also be implemented.
Further, the contact 10 is shown as a specific example of the local cooling means 4 and the side cooling means 5, but one or both of the local cooling means 4 and the side cooling means 5 are constituted by cooling means using Peltier elements. The cooling means can also be configured by blowing a refrigerant gas or liquid directly on the upper surface of the plate glass G.
[0029]
(2) In the previous embodiment, a configuration in which the distance between the apparatus main body 1 and the upper surface of the glass sheet G is always kept constant by ejecting air from the air outlet 15 provided in the apparatus main body 1 of the cutting apparatus. As shown, for example, a displacement detection sensor that detects the displacement of the upper surface of the plate glass G in the vertical direction is used, and the device main body 1 is displaced up and down based on the detection result of the displacement detection sensor. It is also possible to configure so that the distance between is always kept constant.
Moreover, although what used the cemented carbide cutter wheel 13 as the crack formation means 6 was shown, it replaced with the carbide cutter wheel 13 and can also comprise the crack formation means 6 using a diamond indenter.
Furthermore, although the plate glass G is shown as an example of the brittle material to be cut, various plate-like brittle materials such as plate-shaped ceramics and silicon wafers are applied as the cut target in addition to the plate glass. be able to.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing a brittle material cutting device. FIG. 2 is a schematic side view showing a brittle material cutting device. FIG. 3 is a plan view showing a brittle material cutting portion. FIG. 5 is a plan view showing a cutting device according to another embodiment. FIG. 6 is a plan view showing a cutting part according to another embodiment.
DESCRIPTION OF SYMBOLS 1 Apparatus body 3 of cutting device Local heating means 3a Local heating part 4 Local cooling means 4a Local cooling part 5 Side cooling means 5a Side cooling part 6 Crack formation means 6a Crack for induction G Cutting plate-like brittle material L Cutting Planned line L2 Relative movement direction

Claims (8)

板状の脆性材料を切断予定線に沿って連続的に局部加熱した後、その脆性材料の局部加熱部分を連続的に局部冷却して前記脆性材料を切断予定線に沿って切断する脆性材料の切断方法であって、
前記脆性材料の局部加熱部分の両側を連続的に側部冷却しながら、その局部加熱部分を局部冷却する脆性材料の切断方法。After the plate-like brittle material is continuously heated along the planned cutting line, the locally heated portion of the brittle material is continuously locally cooled to cut the brittle material along the planned cutting line. Cutting method,
A method for cutting a brittle material, in which both sides of a locally heated portion of the brittle material are continuously cooled side by side while the locally heated portion is locally cooled. 前記局部加熱部分の両側を側部冷却した後、前記局部加熱部分を局部冷却する請求項１に記載の脆性材料の切断方法。The brittle material cutting method according to claim 1, wherein after locally cooling both sides of the locally heated portion, the locally heated portion is locally cooled. 前記局部加熱部分の両側を側部冷却するに際し、局部加熱部分から離れた位置から局部冷却部分に向けて近接する位置へ斜め方向に連続的に側部冷却する請求項２に記載の脆性材料の切断方法。3. The brittle material according to claim 2, wherein side cooling of the both sides of the local heating part is performed continuously in a diagonal direction from a position away from the local heating part to a position close to the local cooling part. Cutting method. 前記脆性材料の切断予定線上に切断誘発用の亀裂を機械的に形成した後、その脆性材料を切断予定線に沿って局部加熱する請求項１〜３のいずれか１項に記載の脆性材料の切断方法。The brittle material according to any one of claims 1 to 3, wherein a crack for inducing cutting is mechanically formed on the planned cutting line of the brittle material, and then the brittle material is locally heated along the planned cutting line. Cutting method. 板状の脆性材料を切断予定線に沿って連続的に局部加熱する局部加熱手段と、その脆性材料の局部加熱部分を連続的に局部冷却して前記脆性材料を切断予定線に沿って切断する局部冷却手段を備えている脆性材料の切断装置であって、
前記脆性材料の局部加熱部分の両側を連続的に側部冷却する一対の側部冷却手段を備えている脆性材料の切断装置。A local heating means for continuously heating a plate-like brittle material continuously along a planned cutting line, and a local heating portion of the brittle material continuously continuously cooled to cut the brittle material along the planned cutting line. A brittle material cutting device comprising a local cooling means,
An apparatus for cutting a brittle material, comprising a pair of side cooling means for continuously cooling both sides of a locally heated portion of the brittle material. 前記脆性材料に対する相対移動方向の前方側に前記局部加熱手段を、後方側に前記局部冷却手段を備え、その局部加熱手段と局部冷却手段の間に前記一対の側部冷却手段を備えている請求項５に記載の脆性材料の切断装置。The local heating means is provided on the front side in the relative movement direction with respect to the brittle material, the local cooling means is provided on the rear side, and the pair of side cooling means are provided between the local heating means and the local cooling means. Item 6. The brittle material cutting device according to Item 5. 前記一対の側部冷却手段が、前記局部加熱手段側ほど離間し局部冷却手段側ほど近接するハの字状に配置してある請求項６に記載の脆性材料の切断装置。7. The brittle material cutting device according to claim 6, wherein the pair of side cooling means are arranged in a square shape that is spaced apart closer to the local heating means and closer to the local cooling means. 前記局部加熱手段よりも前記相対移動方向の前方側に、前記脆性材料の切断予定線上に切断誘発用の亀裂を形成する亀裂形成手段を備えている請求項６または７に記載の脆性材料の切断装置。The cutting of a brittle material according to claim 6 or 7, further comprising a crack forming means for forming a crack for inducing a cutting on a planned cutting line of the brittle material on the front side in the relative movement direction with respect to the local heating means. apparatus.
JP2003187973A 2003-06-30 2003-06-30 Method and device for cutting fragile material Pending JP2005022136A (en)

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009504432A (en) * 2005-08-06 2009-02-05 イェーノプティク アウトマティジールングステヒニーク ゲゼルシャフト ミット ベシュレンクテル ハフツング A method of tearing a fragile flat member with a laser beam using a previously created trace
KR20140130339A (en) * 2013-04-30 2014-11-10 재단법인 포항산업과학연구원 Device for preventing thremal deformation to cut rack material for jackup leg
CN104227854A (en) * 2014-08-22 2014-12-24 常州凌凯特电子科技有限公司 Transistor cutting device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009504432A (en) * 2005-08-06 2009-02-05 イェーノプティク アウトマティジールングステヒニーク ゲゼルシャフト ミット ベシュレンクテル ハフツング A method of tearing a fragile flat member with a laser beam using a previously created trace
KR20140130339A (en) * 2013-04-30 2014-11-10 재단법인 포항산업과학연구원 Device for preventing thremal deformation to cut rack material for jackup leg
KR102023591B1 (en) * 2013-04-30 2019-09-20 재단법인 포항산업과학연구원 Device for preventing thremal deformation to cut rack material for jackup leg
CN104227854A (en) * 2014-08-22 2014-12-24 常州凌凯特电子科技有限公司 Transistor cutting device

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