JP2012201573A - Device and method for cutting brittle plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a device and a method for cutting a brittle plate capable of cutting a large-area brittle plate.SOLUTION: This method for cutting a brittle plate has the first step for supporting the brittle plate 2 by a support means 20, and the second step for heating locally the brittle plate 2 supported by the support means 20, moving a heating region of the brittle plate 2 to form a crack penetrating the brittle plate 2 in the plate thickness direction, and extending the crack. In the first step, the brittle plate 2 is supported by the support means 20 in the state where at least a part of the brittle plate 2 is bent and deformed so that a tensile stress works on a cutting-supposed line on the brittle plate surface 2a.

Description

  The present invention relates to a brittle plate cutting apparatus and a cutting method.

  As a cutting device for a glass plate that is a brittle plate, a device having a wheel cutter that forms a scribe line (groove line) on the surface of the glass plate and a break bar that divides the glass plate along the scribe line is known. . The scribe line is formed by rolling while pressing the wheel cutter against the surface of the glass plate.

  After the scribe line is formed, if the wheel cutter that had been cut into the glass plate is withdrawn from the glass plate, the parts that were pushed to the side by the wheel cutter will return to their original shape and collide with each other. Cracks occur.

  Therefore, in order to prevent the occurrence of horizontal cracks, in a state where the glass plate is bent downward, a scribe line is formed on the lower surface of the glass plate, and then the glass plate is further bent to divide the glass plate. The technique which performs is proposed (for example, refer patent document 1). According to this technology, it is possible to reduce the occurrence of horizontal cracks because the portion pushed sideways by the wheel cutter can be reduced from returning to its original shape.

  In recent years, in order to prevent the occurrence of horizontal cracks, a cutting apparatus for cutting a glass plate without forming a scribe line has been developed. For example, there is a cutting device that includes means for locally heating a glass plate and moving a heating region to form a crack that penetrates the glass plate in the thickness direction and extend the crack.

Japanese Patent Laid-Open No. 9-315832

  Formation of a crack that penetrates a brittle plate such as a glass plate in the thickness direction is more difficult as the brittle plate has a larger area. This is because the larger the brittle plate, the higher the rigidity of the brittle plate, and the greater the frictional force between the brittle plate and the stage that supports the brittle plate, making it difficult for the brittle plate to deform. This problem is more conspicuous in the central portion of the brittle plate than in the outer peripheral portion of the brittle plate, and the extension of the crack may stop midway.

  This invention is made | formed in view of the said subject, Comprising: It aims at providing the cutting apparatus and cutting method of a brittle board which can cut | disconnect a brittle board of a large area.

In order to solve the above object, the present invention provides:
A first step of supporting the brittle plate by the supporting means; and locally heating the brittle plate supported by the supporting means and moving the heating area of the brittle plate to move the brittle plate in the plate thickness direction. In a method for cutting a brittle plate having a second step of forming a crack that penetrates and extending the crack,
In the first step, the brittle plate is supported by the support means in a state where at least a part of the brittle plate is bent and deformed so that a tensile stress acts on a planned cutting line of the brittle plate surface. A method for cutting a brittle plate is provided.

The present invention also provides:
Forming a crack penetrating the brittle plate in the thickness direction by locally heating the brittle plate supported by the support means and moving the heating region of the brittle plate while supporting the brittle plate And a brittle plate cutting device having crack forming means for extending the cracks,
The brittle plate is characterized in that the support means supports the brittle plate in a state where at least a part of the brittle plate is bent and deformed so that a tensile stress acts on a planned cutting line on the surface of the brittle plate. A cutting device is provided.

  ADVANTAGE OF THE INVENTION According to this invention, the cutting apparatus and cutting method of a brittle board which can cut | disconnect a brittle board of a large area can be provided.

The perspective view of the cutting device in a 1st embodiment. Sectional drawing of the cutting device in 1st Embodiment Top view showing a state of cutting by the cutting device 10 Sectional drawing along the BB line of FIG. 3A Sectional drawing along CC line of FIG. 3A Sectional drawing which shows the mode of formation of the crack 8 (1) Sectional drawing which shows the mode of formation of the crack 8 (2) Sectional drawing which shows the mode of formation of the crack 8 (3) The top view which shows the mode of the cutting | disconnection by the cutting device in 2nd Embodiment. Sectional drawing along the BB line of FIG. 5A Sectional drawing along CC line of FIG. 5A The top view which shows the mode of the cutting | disconnection by the cutting device in 3rd Embodiment. Sectional drawing along the BB line of FIG. 6A Sectional drawing along CC line of FIG. 6A The top view which shows the mode of the cutting | disconnection by the cutting device in 4th Embodiment Sectional drawing along the BB line of FIG. 7A Sectional drawing along CC line of FIG. 7A The top view which shows the mode of the cutting | disconnection by the cutting device in 5th Embodiment Sectional drawing along the BB line of FIG. 8A Sectional drawing along CC line of FIG. 8A The top view which shows the mode of the cutting | disconnection by the cutting device in 6th Embodiment Sectional drawing along the BB line of FIG. 9A Sectional drawing along CC line of FIG. 9A The bottom view which shows the mode of the cutting | disconnection by the cutting device in 7th Embodiment Sectional drawing along the BB line of FIG. 10A Sectional drawing along CC line of FIG. 10A

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings. In each of the drawings, the same or corresponding components are denoted by the same or corresponding reference numerals, and description thereof will be omitted.

[First Embodiment]
FIG. 1 is a perspective view of a brittle plate cutting device according to a first embodiment. FIG. 2 is a cross-sectional view of the brittle plate cutting device in the first embodiment.

  The cutting device 10 of this embodiment is a device for cutting the glass plate 2 that is a brittle plate. The brittle plate is not limited to the glass plate 2 and may be, for example, a silicon substrate, a sapphire substrate, or a ceramic substrate.

  The glass plate 2 is formed into a flat plate shape in a natural state where no bending stress is applied. Examples of the method for forming the glass plate 2 include a float method and a fusion method.

  An initial crack serving as a starting point of cutting may be formed in advance at or near the starting point of the planned cutting line 4 on the glass plate surface 2a. However, in order to reduce the number of steps, the initial crack may be omitted.

  Here, the “scheduled cutting line” is a virtual line scheduled to be cut. The start point and the end point of the planned cutting line 4 on the glass plate surface 2a intersect the outer periphery of the glass plate surface 2a.

  Although the kind of glass of the glass plate 2 is not specifically limited, For example, it is soda-lime glass, non-alkali glass, or quartz glass.

  Although the magnitude | size of the glass plate 2 is not specifically limited, For example, when the glass plate 2 is rectangular shape, the dimension of the short side of the glass plate 2 may be 20 mm or more.

  The cutting device 10 supports the glass plate 2 and the glass plate 2 by locally heating the glass plate 2 supported by the support means 20 and moving the heating region of the glass plate 2. A crack forming means 50 for forming the crack 8 penetrating in the thickness direction and extending the crack 8 is provided. The cutting device 10 does not have means for forming a scribe line (groove line) on the glass plate surface 2a in order to suppress damage to the glass plate surface 2a.

  The support means 20 supports the glass plate 2 in a state where at least a part of the glass plate 2 is bent and deformed so that a tensile stress acts on the planned cutting line 4 of the glass plate surface 2a. The acting direction of the tensile stress is preferably an in-plane direction of the glass plate surface 2 a and a direction orthogonal to the planned cutting line 4.

  For example, as shown in FIGS. 1 and 2, the support unit 20 includes a stage 21 that sucks and supports the glass plate 2 from the back surface 2 b, and a protruding member 24 that protrudes from the support surface 21 a of the stage 21. The protruding member 24 extends along the planned cutting line 4.

  As seen from the direction orthogonal to the planar support surface 21 a of the stage 21, the protruding member 24 overlaps the entire cutting line 4 of the glass plate 2. The protruding member 24 bends and deforms the flat glass plate 2 by its own weight in a natural state. As a result, a tensile stress acts on the planned cutting line 4 on the glass plate surface 2a.

  A plurality of suction holes 23 are formed in the support surface 21 a of the stage 21. Each suction hole 23 is connected to an external negative pressure source P. The negative pressure source P is constituted by a vacuum pump or the like. When the negative pressure source P is activated, the stage 21 sucks and supports the glass plate 2 from the back surface 2b.

  From the support surface 21 a of the stage 21, a band plate-shaped projecting member 24 projects, and suction holes 23 are arranged on both the left and right sides of the projecting member 24. When the negative pressure source P is activated, the glass materials on both sides of the planned cutting line 4 are sucked into the stage 21 and fixed.

  Spaces S1 and S2 surrounded by the support surface 21a of the stage 21, the protruding member 24, and the glass plate back surface 2b are connected to the negative pressure source P through the suction holes 23. When the negative pressure source P is activated, a negative pressure (pressure lower than atmospheric pressure) is generated in the spaces S1 and S2, and the glass plate back surface 2b is bent along the support surface 21a and the protruding member 24 on both sides of the protruding member 24. Deformed.

  The crack forming means 50 forms the crack 8 penetrating the glass plate 2 in the plate thickness direction by locally heating the glass plate 2 supported by the supporting means 20 and moving the heating region of the glass plate 2. At the same time, it is a means for extending the crack 8.

  The crack forming means 50 applies the thermal stress to the glass plate 2 by locally heating the glass plate 2 to form the crack 8. The heating temperature of the glass plate 2 is set to a temperature below the annealing point. This is because when glass is heated to a temperature exceeding the annealing point, it flows in a viscous manner so as to relieve thermal stress.

  For example, as shown in FIG. 2, the crack forming means 50 has two electrodes 51 and 24 arranged on both sides (the front surface 2 a side and the back surface 2 b side) of the glass plate 2 supported by the supporting means 20. Yes. In the present embodiment, a strip-shaped protruding member 24 is used as one of the two electrodes 51 and 24.

  Therefore, the protruding member 24 has conductivity and is made of a metal such as aluminum or copper. On the other hand, the stage 21 in which the base end portion of the protruding member 24 is embedded has insulating properties, and is made of a synthetic resin such as polytetrafluoroethylene (trade name, Teflon (registered trademark)).

  The electrode 51 is electrically connected to the protruding member 24 via the circuit 53. The protruding member 24 may be grounded. The circuit 53 includes a high-frequency power source 54 that supplies AC power (AC voltage) between the electrode 51 and the protruding member 24, a frequency and duty ratio of AC power (AC voltage), a modulator 55 that modulates voltage, and the like. .

  When the high frequency power supply 54 supplies AC power between the electrode 51 and the protruding member 24, a discharge is generated in the gap formed between the electrode 51 and the glass plate surface 2a, and the glass plate surface 2a is locally heated. The In order to stabilize the discharge, the atmosphere around the electrode 51 is preferably an inert atmosphere such as a nitrogen atmosphere or an argon atmosphere.

  Further, when the high frequency power supply 54 supplies AC power between the electrode 51 and the protruding member 24, an alternating electric field is formed between the electrode 51 and the protruding member 24, and the inside of the glass plate 2 disposed in the alternating electric field. Is locally dielectrically heated.

  In this way, by supplying AC power between the projecting member 24 and the electrode 51, the glass plate 2 disposed between the projecting member 24 and the electrode 51 is locally heated.

  In order to narrow the heating range of the glass plate 2, the electrode 51 has a tapered tip toward the glass plate surface 2a. For the same reason, the projecting member 24 has a tip portion tapered toward the glass plate back surface 2b. The maximum width W of the protruding member 24 is, for example, 1 to 5 mm.

  Further, the crack forming means 50 includes a moving device 60 that moves the heating region of the glass plate 2 by moving the electrode 51 relative to the glass plate 2 supported by the supporting means 20. The moving device 60 of the present embodiment moves the electrode 51 side, but may move the support means 20 side or both sides.

  The moving device 60 includes, for example, a guide rail 62 that guides the electrode 51 in a predetermined direction, a drive source 64 that moves the electrode 51 in a predetermined direction, and the like. The moving device 60 moves the electrode 51 along the planned cutting line 4 on the glass plate surface 2a.

  Predetermined devices (for example, the negative pressure source P, the high-frequency power source 54, and the drive source 64) of the cutting device 10 are connected to a control device 70 that controls the operation of the cutting device 10 via a signal line. The control device 70 is configured as a computer including a CPU, a recording medium, and the like. The control device 70 causes the CPU to execute various programs stored in the recording medium, thereby controlling the device connected via the signal line and causing the cutting device 10 to perform various operations.

  Next, the operation (cutting method) of the cutting apparatus 10 having the above-described configuration will be described with reference to FIGS. 3A to 3C.

  FIG. 3A is a top view showing a state of cutting by the cutting device 10. 3B is a cross-sectional view taken along line BB in FIG. 3A, and FIG. 3C is a cross-sectional view taken along line CC in FIG. 3A. In FIG. 3A, illustration of the moving device 60 and the like is omitted for easy viewing of the drawing.

  First, the glass plate 2 is supported by the support means 20. Specifically, first, the glass plate 2 is placed on the planar support surface 21 a of the stage 21. Since the protruding member 24 protrudes from the support surface 21a, the flat glass plate 2 is bent and deformed by its own weight in a natural state, and tensile stress acts on the planned cutting line 4 on the glass plate surface 2a. Subsequently, the negative pressure source P is activated, and the glass materials on both sides of the planned cutting line 4 are sucked and fixed to the stage 21.

  At this time, negative pressure is generated in the spaces S1 and S2 surrounded by the support surface 21a of the stage 21, the protruding member 24, and the glass plate back surface 2b, so that the glass plate back surface 2b follows the support surface 21a and the protruding member 24. It is bent and deformed. Therefore, a strong tensile stress acts on the planned cutting line 4 on the glass plate surface 2a.

  The tensile stress acting on the planned cutting line 4 is determined by the protruding amount H (see FIG. 3B) of the protruding member 24, the pressure of the spaces S1, S2, the physical properties of the glass plate 2, and the like, for example, 30 to 300 MPa, preferably 50-150 MPa. The protruding amount H of the protruding member 24 is, for example, 0.1 to 3 mm.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 4. Subsequently, AC power is supplied between the electrode 51 and the protruding member 24, and the glass plate 2 disposed between the electrode 51 and the protruding member 24 is locally heated. As a result, a crack 8 that penetrates the glass plate 2 in the thickness direction is formed from the outer periphery of the glass plate 2.

  4A to 4C are cross-sectional views showing how the cracks 8 are formed. As shown in FIG. 4A, tensile stress is generated in the planned cutting line 4 of the glass plate surface 2a, so that cracks grow from the front surface 2a side to the back surface 2b side of the glass plate 2 as shown in FIG. 4B. To do. As shown in FIG. 4C, when the crack 8 penetrates the glass plate 2 in the plate thickness direction, the tensile stress acting on the planned cutting line 4 is released, so that the cut surfaces 2c and 2d of the glass plate 2 are V Open in a letter shape.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 4, and the crack 8 extends along the planned cutting line 4.

  By the way, since negative pressure is generated in the spaces S1 and S2 surrounded by the support surface 21a of the stage 21, the projection member 24, and the glass plate back surface 2b, the glass plate back surface 2b is formed on the support surface 21a and the projection member 24. Bending stress is acting on the glass plate 2 so that it may follow.

  This bending stress is generated on both the left and right sides of the projecting member 24 and is balanced with each other before the crack 8 is formed. However, the balance is lost after the crack 8 is formed. Therefore, after the formation of the crack 8, as shown in FIG. 3C, the cut surfaces 2c and 2d opened in a V shape are separated from each other.

  When the crack 8 reaches the end point of the planned cutting line 4, the supply of AC power is stopped. Further, the suction of the glass plate 2 by the stage 21 is stopped, and the glass plate 2 is removed from the stage 21. In this way, the glass plate 2 can be cut.

  As described above, according to the present embodiment, the bending stress acts on the planned cutting line 4 of the glass plate surface 2 by bending and deforming at least a part of the glass plate 2. At the time of formation, the cut surfaces 2c and 2d of the glass plate 2 are opened in a V shape. Therefore, the deformation | transformation at the time of the cutting | disconnection of the glass plate 2 can be assisted, and the large area glass plate 2 can be cut | disconnected.

  In addition, according to the present embodiment, as shown in FIG. 4, a negative pressure is generated in the spaces S <b> 1 and S <b> 2, so that when the crack 8 is formed, the glass plate 2 is re-deformed and opened in a V shape. 2c and 2d are separated from each other. Therefore, it is possible to prevent the corners of the cut surfaces 2c and 2d from rubbing against each other.

[Second Embodiment]
In the first embodiment, the suction holes 23 are disposed on the left and right sides of the protruding member 24, and the glass plate 2 is sucked and fixed to the stage 21 on both the left and right sides of the protruding member 24.

  On the other hand, in this embodiment, the protruding member protrudes from the edge of the support surface of the stage, and the suction hole is disposed only on one side of the protruding member.

  FIG. 5A is a top view showing a state of cutting by the cutting device in the second embodiment. 5B is a cross-sectional view taken along line BB in FIG. 5A, and FIG. 5C is a cross-sectional view taken along line CC in FIG. 5A.

  The cutting device 110 according to the present embodiment supports the glass plate 102 in a state where at least a part of the glass plate 102 is bent and deformed so that a tensile stress acts on the planned cutting line 104 of the glass plate surface 102a. 120 and crack forming means 150. The crack forming means 150 has the same configuration as that of the first embodiment except that the electrode has a protruding member 124 instead of the protruding member 24 shown in FIGS. .

  The support means 120 includes a stage 121 that sucks and supports the glass plate 102 from the back surface 102 b, and a protruding member 124 that protrudes from a side edge of the support surface 121 a of the stage 121. The protruding member 124 extends along the planned cutting line 104.

  As seen from the direction orthogonal to the planar support surface 121 a of the stage 121, the protruding member 124 overlaps the entire planned cutting line 104. The protruding member 124 bends and deforms the flat glass plate 102 by its own weight in a natural state. As a result, a tensile stress acts on the planned cutting line 104 on the glass plate surface 102a.

  A plurality of suction holes 123 are formed in the support surface 121 a of the stage 121. Each suction hole 123 is connected to an external negative pressure source P. When the negative pressure source P is activated, the stage 121 sucks and supports the glass plate 102 from the back surface 102b.

  A band plate-shaped protruding member 124 protrudes from the side edge of the support surface 121 a of the stage 121, and the suction hole 123 is disposed only on one side of the protruding member 124. When the negative pressure source P is activated, only one of the glass materials on both sides across the planned cutting line 104 is sucked and fixed to the stage 121.

  A space S3 surrounded by the support surface 121a of the stage 121, the protruding member 124, and the glass plate back surface 102b is connected to the negative pressure source P through the suction hole 123. When the negative pressure source P is activated, a negative pressure is generated in the space S3, and the glass plate back surface 102b is bent and deformed along the support surface 121a and the protruding member 124.

  The support means 120 includes a pressing member 125 that presses the end portion 102e of the glass plate 102 protruding from the stage 121 from the front surface 102a side to the back surface 102b side. Therefore, sufficient tensile stress can be applied to the planned cutting line 104 at the end 102e of the glass plate 102. The pressing member 125 extends in parallel with the planned cutting line 104.

  Next, the operation (cutting method) of the cutting apparatus 110 configured as described above will be described with reference to FIGS. 5A to 5C again.

  First, the glass plate 102 is supported by the support means 120. Specifically, first, the glass plate 102 is placed on the planar support surface 121 a of the stage 121. Since the protruding member 124 protrudes from the support surface 121a, the flat glass plate 102 is bent and deformed by its own weight in a natural state, and tensile stress acts on the planned cutting line 104 of the glass plate surface 102a. Subsequently, the negative pressure source P is activated, and the glass plate 102 is sucked and fixed to the stage 121.

  At this time, negative pressure is generated in the space S3 surrounded by the support surface 121a of the stage 121, the protruding member 124, and the glass plate back surface 102b, and the glass plate back surface 102b is bent and deformed along the support surface 121a and the protruding member 124. Is done. Therefore, a strong tensile stress acts on the planned cutting line 104 on the glass plate surface 102a.

  Moreover, since the edge part 102e which protrudes from the stage 121 of the glass plate 102 is pressed by the pressing member 125 toward the back surface 102b side from the surface 102a side, sufficient tensile stress acts on the planned cutting line 104 of the glass plate surface 102a. To do.

  The tensile stress acting on the planned cutting line 104 is determined by the protruding amount H (see FIG. 5B) of the protruding member 124, the pressure in the space S3, the pressing force applied from the pressing member 125 to the glass plate 102, the physical properties of the glass plate 102, and the like. For example, it is 25-300 MPa, Preferably it is 30-50 MPa. The protruding amount H of the protruding member 124 is, for example, 0.1 to 3 mm.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 104. Subsequently, AC power is supplied between the electrode 51 and the protruding member 124, and the glass plate 102 disposed between the electrode 51 and the protruding member 124 is locally heated. As a result, a crack 108 that penetrates the glass plate 102 in the thickness direction is formed from the outer periphery of the glass plate 102.

  When the crack 108 is formed, the tensile stress acting on the planned cutting line 104 is released, so that the cut surfaces 102c and 102d of the glass plate 102 are opened in a V shape. Therefore, also in this embodiment, similarly to the first embodiment, the deformation at the time of cutting the glass plate 102 can be supported, and the large-area glass plate 102 can be cut.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 104, and the crack 108 extends along the planned cutting line 104.

  By the way, negative pressure is generated in the space S3 surrounded by the support surface 121a of the stage 121, the protruding member 124, and the glass plate back surface 102b, so that the glass plate back surface 102b follows the support surface 121a and the protruding member 124. Bending stress is acting on the glass plate 102.

  This bending stress is balanced with the pressing force of the pressing member 125 before the crack 108 is formed, but the balance is lost after the crack 108 is formed. Therefore, after the formation of the crack 108, as shown in FIG. 5C, the cut surfaces 102c and 102d opened in a V shape are separated from each other. Therefore, also in this embodiment, it is possible to prevent the corners of the cut surfaces 102c and 102d from rubbing, as in the first embodiment.

  When the crack 108 reaches the end point of the planned cutting line 104, the supply of AC power is stopped. Further, the suction of the glass plate 102 by the stage 121 is stopped, and the glass plate 102 is removed from the stage 121. In this way, the glass plate 102 can be cut.

[Third Embodiment]
The support means 20 of the first embodiment has a protruding member 24 that protrudes from the support surface 21 a of the stage 21.

  On the other hand, the support means of this embodiment does not have a protruding member.

  FIG. 6A is a top view illustrating a state of cutting by the cutting device according to the third embodiment. 6B is a cross-sectional view taken along line BB in FIG. 6A, and FIG. 6C is a cross-sectional view taken along line CC in FIG. 6A.

  The cutting device 210 according to the present embodiment includes a support unit 220 and a crack forming unit 250.

  The support means 220 is a means for supporting the glass plate 202 in a state where at least a part of the glass plate 202 is bent and deformed so that a tensile stress acts on the planned cutting line 204 of the glass plate surface 202a.

  The support means 220 of this embodiment has a stage 221 that sucks and supports the glass plate 202 from the back surface 202b. A plurality of suction holes 223 are formed in the support surface 221 a of the stage 221. Each suction hole 223 is connected to an external negative pressure source P. When the negative pressure source P is activated, the stage 221 sucks and supports the glass plate 202 from the back surface 202b.

  Further, the support means 220 includes a pressing member 225 that presses the end portion 202e of the glass plate 202 protruding from the stage 221 from the front surface 202a side toward the back surface 202b side. Therefore, the end 202e of the glass plate 202 can be bent and deformed, and a tensile stress can be applied to the planned cutting line 204 at the end 202e.

  The pressing member 225 extends in parallel with the planned cutting line 204 on the glass plate surface 202a.

  The crack forming means 250 forms a crack 208 that penetrates the glass plate 202 in the thickness direction by locally heating the glass plate 202 supported by the support means 220 and moving the heating region of the glass plate 202. At the same time, it is a means for extending the crack 208.

  For example, as shown in FIG. 6C, the crack forming means 250 has two electrodes 51 and 252 arranged on both sides (front side and back side) of the glass plate 202 supported by the support means 220. The needle-shaped electrode 51 is electrically connected to the band plate-shaped electrode 252 through the circuit 53.

  The electrode 252 extends along the planned cutting line 204. The electrode 252 overlaps the entire planned cutting line 204 when viewed from a direction orthogonal to the planar support surface 221a of the stage 221.

  The electrode 252 is fixed to the insulating stage 221 via an insulating support member 256. The electrode 252 forms a slight gap with the glass plate back surface 202b. The electrode 252 may be grounded.

  When the high frequency power supply 54 supplies AC power (AC voltage) between the two electrodes 51 and 252, a discharge is generated in the gap between the electrode 51 and the glass plate surface 202 a, and the glass plate surface 202 a is locally heated. Is done. In addition, a discharge occurs in the gap between the electrode 252 and the glass plate back surface 202b, and the glass plate back surface 202b is locally heated. In this embodiment, since discharge occurs on both sides of the front surface 202a side and the back surface 202b side of the glass plate 202, the heating efficiency is good.

  Further, when the high frequency power supply 54 supplies AC power (AC voltage) between the two electrodes 51 and 252, an alternating electric field is formed between the two electrodes 51 and 252, and the glass disposed in the alternating electric field. The inside of the plate 202 is locally dielectrically heated.

  In this way, by supplying AC power between the two electrodes 51 and 252, the glass plate 202 disposed between the two electrodes 51 and 252 is locally heated.

  In order to narrow the heating range of the glass plate 2, the needle-shaped electrode 51 has a tapered tip portion toward the glass plate surface 202 a. For the same reason, the strip-shaped electrode 252 has a tapered tip toward the glass plate back surface 202b.

  Further, the crack forming means 250 moves at least one of the two electrodes 51, 252 (in this embodiment, the electrode 51) relative to the glass plate 2 supported by the supporting means 220, thereby making the glass A moving device 60 for moving the heating region of the plate 2 is provided.

  Next, the operation (cutting method) of the cutting apparatus 210 configured as described above will be described with reference to FIGS. 6A to 6C again.

  First, the glass plate 202 is supported by the support means 220. Specifically, first, the glass plate 202 is placed on the planar support surface 221 a of the stage 221. Subsequently, the negative pressure source P connected to the suction hole 223 formed in the support surface 221a is operated, and the glass plate 202 is sucked and fixed to the stage 221.

  Next, the pressing member 225 presses the end 202e protruding from the stage 221 of the glass plate 202 from the front surface 202a side to the back surface 202b side, and the end portion 202e is bent and deformed. As a result, a tensile stress acts on the planned cutting line 204 at the end 202e.

  The tensile stress acting on the planned cutting line 204 is determined by the pressing force applied from the pressing member 225 to the glass plate 202, the physical properties of the glass plate 202, and the like, and is, for example, 25 to 300 MPa, and preferably 30 to 50 MPa.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 204. Subsequently, AC power is supplied between the two electrodes 51 and 252 and the glass plate 202 disposed between the two electrodes 51 and 252 is locally heated. As a result, a crack 208 that penetrates the glass plate 202 in the thickness direction is formed from the outer periphery of the glass plate 202.

  When the crack 208 is formed, the tensile stress acting on the planned cutting line 204 is released, so that the cut surfaces 202c and 202d of the glass plate 202 are opened in a V shape. Therefore, also in this embodiment, similarly to the first embodiment, the deformation at the time of cutting the glass plate 202 can be supported, and the large-area glass plate 202 can be cut.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 204, and the crack 208 extends along the planned cutting line 204.

  By the way, the glass plate 202 has a restoring force to return to the original shape. This restoring force is balanced with the suction force of the stage 221 and the pressing force of the pressing member 225 before the formation of the crack 208, but the balance is lost after the formation of the crack 208.

  Therefore, at the cut portion where the crack 208 is formed, as shown in FIG. 6C, the portion of the glass plate 202 that is supported by the stage 221 and the portion of the glass plate 202 that is pressed by the pressing member 225 are Each returns to a flat plate shape. In addition, the portion of the glass plate 202 that is pressed by the pressing member 225 moves in the pressing direction. As a result, the cut surfaces 202c and 202d opened in a V shape are separated from each other. Therefore, also in this embodiment, it is possible to prevent the corners of the cut surfaces 202c and 202d from rubbing, as in the first embodiment.

  When the crack 208 reaches the end point of the planned cutting line 204, the supply of AC power is stopped. Further, the suction of the glass plate 202 by the stage 221 is stopped, and the glass plate 202 is removed from the stage 221. In this way, the glass plate 202 can be cut.

[Fourth Embodiment]
In the said 1st Embodiment, the support surface 21a of the stage 21 which adsorbs and supports the glass plate 2 from the back surface 2b was formed in planar shape.

  On the other hand, in this embodiment, the support surface of the stage that supports the glass plate from the back surface is formed in a convex curved shape.

  FIG. 7A is a plan view showing a state of cutting by the cutting device according to the fourth embodiment. 7B is a cross-sectional view taken along line BB in FIG. 7A, and FIG. 7C is a cross-sectional view taken along line CC in FIG. 7A.

  The cutting device 310 includes support means 320 and crack formation means 250. Note that the configuration of the crack forming means 250 is the same as that of the third embodiment, and a description thereof will be omitted.

  The support means 320 is a means for supporting the glass plate 302 in a state where at least a part of the glass plate 302 is bent and deformed so that a tensile stress acts on the planned cutting line 304 of the glass plate surface 302a.

  The support means 320 of the present embodiment includes a stage 321 that sucks and supports the glass plate 302 from the back surface 302b. The support surface 321a of the stage 321 is formed in an upwardly curved shape.

  A plurality of suction holes 323 are formed in the support surface 321a. Each suction hole 323 is connected to an external negative pressure source P. When the negative pressure source P is activated, the stage 321 sucks and supports the glass plate 302 from the back surface 302b.

  A groove 326 is provided at the upper end of the support surface 321a, and suction holes 323 are disposed on both the left and right sides of the groove 326. When the negative pressure source P is activated, the glass materials on both sides sandwiching the planned cutting line 304 are sucked into the stage 321 and fixed.

  A strip-shaped electrode 252 protrudes upward from the inner bottom surface of the groove portion 326. The electrode 252 extends along the planned cutting line 304. The electrode 252 overlaps the entire cutting line 304 in a top view.

  The electrode 252 is partially embedded in an insulating stage 321 and fixed. The electrode 252 forms a slight gap with the glass plate back surface 302b. The electrode 252 may be grounded.

  Next, the operation (cutting method) of the cutting apparatus 310 configured as described above will be described with reference to FIGS. 6A to 6C again.

  First, the glass plate 302 is supported by the support means 320. Specifically, first, the glass plate 302 is placed on the support surface 321 a of the stage 321. Since the support surface 321a is formed in an upwardly convex curved shape, the flat glass plate 302 is bent and deformed by its own weight in a natural state, and a tensile stress acts on the planned cutting line 304 of the glass plate surface 302a.

  Subsequently, the negative pressure source P is activated, and the glass materials on both sides sandwiching the planned cutting line 304 are sucked and fixed to the stage 321. If the curvature radius of the glass plate back surface 302b is larger than the curvature radius of the support surface 321a before the negative pressure source P is activated, the glass plate 302 is further bent and deformed by the operation of the negative pressure source P. Therefore, the tensile stress acting on the planned cutting line 304 is increased.

  The tensile stress acting on the planned cutting line 304 is determined by the curved shape of the support surface 321a, the physical properties of the glass plate 302, and the like, and is, for example, 25 to 300 MPa, and preferably 30 to 50 MPa.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 304. Subsequently, AC power is supplied between the two electrodes 51 and 252, and the glass plate 302 disposed between the two electrodes 51 and 252 is locally heated. As a result, a crack 308 that penetrates the glass plate 302 in the thickness direction is formed from the outer periphery of the glass plate 302.

  When the crack 308 is formed, the tensile stress acting on the planned cutting line 304 is released, so that the cut surfaces 302c and 302d of the glass plate 302 are opened in a V shape. Therefore, also in this embodiment, the deformation | transformation at the time of the cutting | disconnection of the glass plate 302 can be assisted similarly to 1st Embodiment, and the large area glass plate 302 can be cut | disconnected.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 304, and the crack 308 extends along the planned cutting line 304.

  By the way, the glass plate 302 has a restoring force to return to the original shape. This restoring force is balanced with the gravity acting on the left and right sides of the glass plate 302 before the crack 308 is formed, but the balance is lost after the crack 308 is formed.

  Therefore, at the cut location where the crack 308 is formed, as shown in FIG. 7C, the glass on the left side of the cut location and the glass on the right side of the cut location each return to a flat plate shape. As a result, the cut surfaces 302c and 302d opened in a V shape are separated from each other. Therefore, also in this embodiment, it is possible to prevent the corners of the cut surfaces 302c and 302d from rubbing with each other as in the first embodiment.

  When the crack 308 reaches the end point of the planned cutting line 304, the supply of AC power is stopped. Further, the suction of the glass plate 302 by the stage 321 is stopped, and the glass plate 302 is removed from the stage 321. In this way, the glass plate 302 can be cut.

[Fifth Embodiment]
In the fourth embodiment, the suction holes 323 are arranged on both sides of the groove formed on the upper end of the support surface 321a of the stage 321.

  On the other hand, in this embodiment, the suction hole is disposed only on one side of the groove portion.

  FIG. 8A is a top view showing a state of cutting by the cutting device in the fifth embodiment. 8B is a cross-sectional view taken along line BB in FIG. 8A, and FIG. 8C is a cross-sectional view taken along line CC in FIG. 8A.

  The cutting device 410 includes support means 420 and crack formation means 250. Note that the configuration of the crack forming means 250 is the same as that of the third embodiment, and a description thereof will be omitted.

  The support means 420 is a means for supporting the glass plate 402 in a state where at least a part of the glass plate 402 is bent and deformed so that a tensile stress acts on the planned cutting line 404 of the glass plate surface 402a.

  The support means 420 of this embodiment has a stage 421 that sucks and supports the glass plate 402 from the back surface 402b. The support surface 421a of the stage 421 is formed in an upwardly convex curved shape.

  A plurality of suction holes 423 are formed in the support surface 421a. Each suction hole 423 is connected to an external negative pressure source P. When the negative pressure source P is activated, the stage 421 sucks and supports the glass plate 402 from the back surface 402b.

  A groove 426 is provided at the upper end of the support surface 421a, and the suction hole 423 is disposed only on one side of the groove 426. When the negative pressure source P is activated, only one of the glass materials on both sides across the planned cutting line 404 is sucked into the stage 421 and fixed.

  A strip-shaped electrode 252 protrudes upward from the inner bottom surface of the groove portion 426. The electrode 252 extends along the planned cutting line 404. The electrode 252 overlaps the entire cutting line 404 when viewed from above.

  The electrode 252 is partially embedded and fixed in an insulating stage 421. The electrode 252 forms a slight gap with the glass plate back surface 402b. The electrode 252 may be grounded.

  Next, the operation (cutting method) of the cutting device 410 configured as described above will be described with reference to FIGS. 8A to 8C again.

  First, the glass plate 402 is supported by the support means 420. Specifically, first, the glass plate 402 is placed on the support surface 421 a of the stage 421. Since the support surface 421a is formed in an upwardly convex curved shape, the flat glass plate 402 is bent and deformed by its own weight in a natural state, and tensile stress acts on the planned cutting line 404 of the glass plate surface 402a.

  Subsequently, the negative pressure source P is activated, and only one of the glass materials on both sides across the planned cutting line 404 is sucked into the stage 421 and fixed. If the curvature radius of the glass plate back surface 402b is larger than the curvature radius of the support surface 421a before the operation of the negative pressure source P, the glass plate 402 is further bent and deformed by the operation of the negative pressure source P. Therefore, the tensile stress acting on the planned cutting line 404 is increased.

  The tensile stress acting on the planned cutting line 404 is determined by the curved shape of the support surface 421a, the physical properties of the glass plate 402, and the like, for example, 25 to 300 MPa, and preferably 30 to 50 MPa.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 404. Subsequently, AC power is supplied between the two electrodes 51, 252, and the glass plate 402 disposed between the two electrodes 51, 252 is locally heated. As a result, a crack 408 that penetrates the glass plate 402 in the thickness direction is formed from the outer periphery of the glass plate 402.

  When the crack 408 is formed, the tensile stress acting on the planned cutting line 404 is released, so that the cut surfaces 402c and 402d of the glass plate 402 open in a V shape. Therefore, also in this embodiment, the deformation | transformation at the time of the cutting | disconnection of the glass plate 402 can be assisted similarly to 1st Embodiment, and the large area glass plate 402 can be cut | disconnected.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 404, and the crack 408 extends along the planned cutting line 404.

  By the way, the glass plate 402 has a restoring force to return to the original shape. This restoring force is balanced with the gravity acting on the left and right sides of the glass plate 402 before the formation of the crack 408, but the balance is lost after the formation of the crack 408.

  Therefore, at the cut location where the crack 408 is formed, as shown in FIG. 8C, the glass on the left side of the cut location and the glass on the right side of the cut location each return to a flat plate shape. In addition, since the glass on the right side of the cut portion is not adsorbed by the support surface 421a, the glass moves obliquely downward. As a result, the cut surfaces 402c and 402d opened in a V shape are separated from each other. Therefore, also in this embodiment, it is possible to prevent the corners of the cut surfaces 402c and 402d from rubbing, as in the first embodiment.

  When the crack 408 reaches the end point of the planned cutting line 404, the supply of AC power is stopped. Further, the suction of the glass plate 402 by the stage 421 is stopped, and the glass plate 402 is removed from the stage 421. In this way, the glass plate 402 can be cut.

[Sixth Embodiment]
The cutting apparatus according to the first embodiment includes a stage 21 that sucks and supports the glass plate 2 from the back surface 2b.

  On the other hand, the cutting device of the present embodiment has a pair of support tubes that suck and support the glass plate from the back surface.

  FIG. 9A is a top view showing a state of cutting by the cutting device in the sixth embodiment. 9B is a cross-sectional view taken along line BB in FIG. 9A, and FIG. 9C is a cross-sectional view taken along line CC in FIG. 9A.

  The cutting device 510 includes support means 520 and crack formation means 250. Note that the configuration of the crack forming means 250 is the same as that of the third embodiment, and a description thereof will be omitted.

  The supporting means 520 is a means for supporting the glass plate 502 in a state where at least a part of the glass plate 502 is bent and deformed so that a tensile stress acts on the planned cutting line 504 of the glass plate surface 502a.

  The support means 520 of this embodiment includes a pair of support tubes 527 that suck and support the glass plate 502 from the back surface 502b. Each support tube 527 extends in parallel with the planned cutting line 504. The glass plate 502 is stretched over the pair of support tubes 527 and supported by the pair of support tubes 527 in a state of being convexly curved upward. Therefore, the upper end portion 502f of the glass plate 502 can be bent and deformed, and a tensile stress can be applied to the planned cutting line 504 at the upper end portion 502f.

  A plurality of suction holes 528 are formed on the outer peripheral surface 527 a of each support tube 527. Each suction hole 528 is connected to an external negative pressure source P. The negative pressure source P is constituted by a vacuum pump or the like. When the negative pressure source P is activated, the pair of support tubes 527 adsorb and support the glass plate 502 from the back surface 502b.

  The pair of support tubes 527 are connected via a support member 529, and an electrode 252 is fixed to the central portion of the support member 529. In this way, the electrode 252 is fixed to the pair of support tubes 527.

  The electrode 252 is formed in a strip shape and extends along the planned cutting line 504. The electrode 252 overlaps the entire cutting line 504 when viewed from above.

  The electrode 252 forms a slight gap with the glass plate back surface 502b. The electrode 252 may be grounded.

  Next, the operation (cutting method) of the cutting apparatus 510 configured as described above will be described with reference to FIGS. 9A to 9C again.

  Initially, the glass plate 502 is supported by the support means 520. Specifically, first, the glass plate 502 is stretched over a pair of support tubes 527, the flat glass plate 502 is bent and deformed by its own weight in a natural state, and tensile stress acts on the planned cutting line 504. To do. Subsequently, the negative pressure source P is activated, and the glass plate 502 is sucked and supported by the pair of support tubes 527.

  The tensile stress acting on the planned cutting line 504 is determined by the distance between the pair of support tubes 527, the physical properties of the glass plate 502, and the like, for example, 25 to 300 MPa, and preferably 30 to 50 MPa.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 504 on the glass plate surface 502a. Subsequently, AC power is supplied between the two electrodes 51 and 252 and the glass plate 502 disposed between the two electrodes 51 and 252 is locally heated. As a result, a crack 508 penetrating the glass plate 502 in the thickness direction is formed from the outer periphery of the glass plate 502.

  When the crack 508 is formed, the tensile stress acting on the planned cutting line 504 is released, so that the cut surfaces 502c and 502d of the glass plate 502 are opened in a V shape. Therefore, also in this embodiment, the deformation | transformation at the time of the cutting | disconnection of the glass plate 502 can be assisted similarly to 1st Embodiment, and the glass plate 502 of a large area can be cut | disconnected.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 504, and the crack 508 progresses along the planned cutting line 504.

  By the way, the glass plate 502 has a restoring force to return to the original shape. This restoring force is balanced with the gravity acting on the left and right sides of the glass plate 502 before the crack 508 is formed, but the balance is lost after the crack 508 is formed.

  Therefore, at the cut location where the crack 508 is formed, as shown in FIG. 9C, the glass on the left side of the cut location and the glass on the right side of the cut location return to a flat plate shape and are inclined obliquely downward due to gravity. Moving. As a result, the cut surfaces 502c and 502d opened in a V shape are separated from each other. Therefore, also in this embodiment, it is possible to prevent the corners of the cut surfaces 502c and 502d from rubbing, as in the first embodiment.

  When the crack 508 reaches the end point of the planned cutting line 504, the supply of AC power is stopped. Further, the suction of the glass plate 502 by the pair of support tubes 527 is stopped, and the glass plate 502 is removed from the pair of support tubes 527. In this way, the glass plate 502 can be cut.

[Seventh Embodiment]
The cutting apparatus according to the first embodiment includes a stage 21 that sucks and supports the glass plate 2 from the back surface 2b.

  On the other hand, the cutting device of this embodiment has a pair of fixing members that fix both edge portions of the glass plate.

  FIG. 10A is a bottom view showing a state of cutting by the cutting device according to the seventh embodiment. 10B is a cross-sectional view taken along line BB in FIG. 10A, and FIG. 10C is a cross-sectional view taken along line CC in FIG. 10A.

  The cutting device 610 includes support means 620 and crack formation means 250. Note that the configuration of the crack forming means 250 is the same as that of the third embodiment, and a description thereof will be omitted.

  The supporting means 620 is a means for supporting the glass plate 602 in a state where at least a part of the glass plate 602 is bent and deformed so that a tensile stress acts on the planned cutting line 604 of the glass plate surface 602a.

  The support means 620 of this embodiment includes a pair of fixing members 631 that fix both edge portions 602h of the glass plate 602. The glass plate 602 is supported by a pair of fixing members 631 in a state of being convexly curved downward. Therefore, a tensile stress can be applied to the planned cutting line 604 at the lower end of the glass plate lower surface 602a.

  The pair of fixing members 631 are connected via a support member 632, and the electrode 252 is fixed to the central portion of the support member 632. In this way, the electrode 252 is fixed to the pair of fixing members 631.

  The electrode 252 is formed in a band plate shape and extends along the planned cutting line 604. The electrode 252 overlaps the entire cutting line 604 when viewed from above.

  A slight gap is formed between the electrode 252 and the glass plate upper surface 602b. The electrode 252 may be grounded.

  Next, the operation (cutting method) of the cutting apparatus 610 configured as described above will be described with reference to FIGS. 10A to 10C again.

  Initially, the glass plate 602 is supported by the support means 620. Specifically, the pair of fixing members 631 supports the glass plate 602 in a state of being curved downward and convex in a state where both edge portions 602h of the glass plate 602 are fixed. Therefore, a tensile stress can be applied to the planned cutting line 604 at the lower end of the glass plate lower surface 602a.

  The tensile stress acting on the planned cutting line 604 is determined by the size and shape of the pair of fixing members 631, the physical properties of the glass plate 602, and the like, for example, 25 to 300 MPa, and preferably 30 to 50 MPa.

  Next, the needle-shaped electrode 51 is moved to a position facing the starting point of the planned cutting line 604. Subsequently, AC power is supplied between the two electrodes 51, 252, and the glass plate 602 disposed between the two electrodes 51, 252 is locally heated. As a result, a crack 608 that penetrates the glass plate 602 in the thickness direction is formed from the outer periphery of the glass plate 602.

  When the crack 608 is formed, the tensile stress acting on the planned cutting line 604 is released, so that the cut surfaces 602c and 602d of the glass plate 602 open in a V shape. Therefore, also in this embodiment, the deformation | transformation at the time of the cutting | disconnection of the glass plate 602 can be assisted similarly to 1st Embodiment, and the large area glass plate 602 can be cut | disconnected.

  Next, the needle-shaped electrode 51 is relatively moved along the planned cutting line 604, and the crack 608 extends along the planned cutting line 604.

  By the way, the glass plate 602 has a restoring force to return to the original shape. This restoring force is balanced with the gravity acting on the left and right sides of the glass plate 602 before the formation of the crack 608, but the balance is lost after the formation of the crack 608.

  Therefore, at the cut portion where the crack 608 is formed, as shown in FIG. 10C, the glass on the left side of the cut portion and the glass on the right side of the cut portion return to a flat plate shape and are inclined downward by gravity. Moving. As a result, the cut surfaces 602c and 602d opened in a V shape are separated from each other. Therefore, also in this embodiment, it is possible to prevent the corners of the cut surfaces 602c and 602d from rubbing each other as in the first embodiment.

  When the crack 608 reaches the end point of the planned cutting line 604, the supply of AC power is stopped and the glass plate 602 is removed from the pair of fixing members 631. In this way, the glass plate 602 can be cut.

  The first to seventh embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made to the above-described embodiments without departing from the scope of the present invention. Can be modified or replaced.

  For example, although the above glass plates 2 to 602 are formed into a flat plate shape in a natural state, they are bent and deformed so that tensile stress acts on the planned cutting lines 4 to 604 when supported by the support means. As long as it is made, it may be formed into a curved shape in a natural state.

  In addition, the electrode 51 is electrically connected to the protruding members 24 and 124 or the electrode 252 via the circuit 33. However, the electrode 51 may not be connected, and the electrode 252 may not be provided. In this case, the electrode 51 may be electrically connected to the glass plates 2 to 602 through the circuit 33, and the glass plates 2 to 602 may be grounded. In this case, an AC voltage and an AC current are supplied to the electrode 51 from the high frequency power supply 54.

  In addition, the projection member 124 and the electrode 252 are formed in a band plate shape and are fixed to the support means 120 to 620 in order to simplify the structure of the cutting devices 110 to 610. Along with the needle-shaped electrodes 51 that are formed to be opposed to each other, they may be moved relative to the support means 120 to 620. In this case, the heating region of the glass plates 102 to 602 can be narrowed, and the heating efficiency can be improved.

  In addition, the crack forming means 50 and 250 have the electrode 51 in order to locally heat the glass plate, but may have a laser light source instead of the electrode 51. As a laser light source, UV laser (wavelength: 355 nm), green laser (wavelength: 532 nm), semiconductor laser (wavelength: 808 nm, 940 nm, 975 nm), fiber laser (wavelength: 1060 to 1100 nm), YAG laser (wavelength: 1064 nm, 2080 nm, 2940 nm). In the case of a laser light source, the electrode 252 is not necessary.

  Further, the crack forming means 50 and 250 may have a cooling source for locally cooling the glass plate in order to give a temperature gradient to the glass plate. As the cooling source, for example, a nozzle that discharges a refrigerant is used. As the refrigerant, a gas such as cooling air or a liquid such as cold water is used. A combination of gas and liquid may be used.

2 Glass plate (brittle plate)
2a Glass plate surface 2b Glass plate back surface 2c Cutting surface 2d Cutting surface 4 Planned cutting line 8 Crack 10 Cutting device 20 Support means 21 Stage 21a Support surface 23 Adsorption hole 24 Projection member 50 Crack formation means 51 Electrode 125 Pressing member 252 Electrode 527 Support Tube 631 fixing member

Claims (13)

A first step of supporting the brittle plate by the supporting means; and locally heating the brittle plate supported by the supporting means and moving the heating area of the brittle plate to move the brittle plate in the plate thickness direction. In a method for cutting a brittle plate having a second step of forming a crack that penetrates and extending the crack,
In the first step, the brittle plate is supported by the support means in a state where at least a part of the brittle plate is bent and deformed so that a tensile stress acts on a planned cutting line of the brittle plate surface. A method of cutting a brittle plate characterized by the above.   The method for cutting a brittle plate according to claim 1, wherein in the second step, the cut surfaces of the brittle plate are separated from each other.   The said support means has the stage which adsorbs and supports the said brittle board from the back surface, and the projection member which protrudes from the support surface of this stage, This projection member is extended along the said cutting projected line. 2. A method for cutting a brittle plate according to 1. The protruding member protrudes from a side edge portion of the support surface of the stage,
The said support means is a cutting method of the brittle board of Claim 3 which further has a press member which presses the edge part which protrudes from the said stage of the said brittle board toward the back surface side from the surface side. A space surrounded by the support surface of the stage, the protruding member, and the back surface of the brittle plate is connected to a negative pressure source through an adsorption hole formed in the support surface of the stage,
The method for cutting a brittle plate according to claim 3 or 4, wherein in the second step, the cut surfaces of the brittle plate are separated from each other by generating a negative pressure in the space. The protruding member has conductivity, the stage has insulating properties,
In the second step,
By supplying AC power between the protruding member and an electrode electrically connected to the protruding member, the brittle plate disposed between the protruding member and the electrode is locally heated. ,
The cutting method according to any one of claims 3 to 5, wherein a heating region of the brittle plate is moved by moving the electrode relative to the brittle plate supported by the support means.   2. The cutting according to claim 1, wherein the supporting means includes a stage that sucks and supports the brittle plate from the back surface, and a pressing member that presses an end portion of the brittle plate that protrudes from the stage from the front surface side toward the back surface side. Method.   The method for cutting a brittle plate according to claim 1, wherein the support means includes a stage for supporting the brittle plate from the back surface, and the support surface of the stage is formed in a convex curved shape. The support means has a pair of support pipes for adsorbing and supporting the brittle plate from the back surface, and each support tube extends in parallel with a planned cutting line of the brittle plate back surface,
The method for cutting a brittle plate according to claim 1, wherein the brittle plate is stretched over the pair of support tubes and is supported by the pair of support tubes in a state of being convexly curved upward. The support means has a pair of fixing members that fix both edges of the brittle plate,
The method for cutting a brittle plate according to claim 1, wherein the brittle plate is supported by the pair of fixing members in a state of being convexly curved downward.   The said 2nd step WHEREIN: When a part of the said brittle board supported by the said support means returns to the original shape, the cut surfaces of the said brittle board are spaced apart from each other. The brittle board cutting method as described. In the second step,
By supplying AC power between the two electrodes arranged on both sides of the brittle plate supported by the supporting means, the brittle plate arranged between the two electrodes is locally heated,
The brittle plate according to any one of claims 7 to 11, wherein a heating region of the brittle plate is moved by moving at least one electrode relative to the brittle plate supported by the support means. Cutting method. Forming a crack penetrating the brittle plate in the thickness direction by locally heating the brittle plate supported by the support means and moving the heating area of the brittle plate while supporting the brittle plate And a brittle plate cutting device having crack forming means for extending the cracks,
The brittle plate is characterized in that the support means supports the brittle plate in a state where at least a part of the brittle plate is bent and deformed so that a tensile stress acts on a planned cutting line on the surface of the brittle plate. Cutting device.

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