TW201936016A - Printed Circuit Board with Built-In Vertical Heat Dissipation Ceramic Block, and Electrical Assembly Comprising the Board - Google Patents

Abstract

A printed circuit board with built-in vertical heat dissipation ceramic block, and an electrical assembly are disclosed. The electrical assembly includes the board and a plurality of electronic components. The printed circuit boards includes a dielectric material layer defining at least one through hole, at least one ceramic block corresponding to the through hole, at least one fixing portion for joining the ceramic block to the through hole of the dielectric material layer, a metal circuit layer provided on upper surfaces of the dielectric material layer and the ceramic block, and a high thermal conductivity layer provided on lower surfaces of the dielectric material layer and the ceramic block. The printed circuit board allows the location and size of the ceramic block to be modified according to requirements, so as to implement complicated circuit designs, achieve good effect of thermal conduction, control thermal conduction path, and reduce manufacturing cost.

Description

Built-in longitudinal heat-dissipating ceramic block printed circuit board and circuit component having the same

A printed circuit board, in particular a built-in vertical heat-dissipating ceramic block printed circuit board and a circuit component having the circuit board.

A printed circuit board (PCB) uses a copper foil substrate as the main key basic material for mounting electronic components. The copper foil substrate generally uses a dielectric material as an insulating layer and a conductor formed of copper foil. Is a conductive material layer, and the conductive material layer is arranged on the dielectric insulating layer. Among the dielectric materials, paper, bakelite, glass fiberboard, rubber, and other types of high-molecular insulation materials are mainly formed by resin impregnation. In order to facilitate the subsequent description, the insulation layer of such a copper foil substrate is referred to as a dielectric material layer in this case.

With the increasing complexity and diverse requirements of circuit design, the structure of printed circuit boards has gradually evolved from Single Layer PCB to Double Layer PCB to Multi Layer PCB. At present, multilayer printed circuit boards use multiple layers of dielectric material layers and conductive material layers to overlap to form more complex and more complex circuits. By forming through-holes in the dielectric material layer, plugs are made of conductive materials. (Plug), and then connect the wires of each layer between the multilayer boards to achieve the purpose of allowing more electronic components to be accommodated in a smaller occupied volume. Common FR-4, FR-5, FR-6, FR-7, etc. on the market are common materials for multilayer PCBs.

As electronic devices continue to be miniaturized, electronic components with specific needs are moving toward higher power. In this way, higher heat will be accompanied in a smaller space. especially The wire pitch of the wires and the wire diameter must be reduced. For example, on substrate materials such as bakelite and glass fiber, the circuit pitch can be reduced to about 50 microns (μm). The problem of high temperature, which is difficult to handle due to the accumulation of thermal energy, has become more serious.

High-power components consume large amounts of energy. On the one hand, they represent high work efficiency, but it is inevitable that a certain percentage of energy is converted into thermal energy. Furthermore, electronic technology is developing in the direction of complexity and diversification of electronic circuit design and layout. When high-power electronic components begin to be installed on printed circuit boards, it means that more energy-consuming components are designed in the same or even Working in a smaller space, this trend will create more difficult thermal issues than ever before. As the insulation layer of the copper foil substrate of the general printed circuit board is mostly a dielectric material, it is not a good conductor of heat, so that the thermal energy generated by the high heating elements is accumulated near the high power components, making the operating environment very unsatisfactory. At the same time, excessive thermal accumulation usually causes the printed circuit board to expand, but the thermal expansion coefficients between the printed circuit board and the circuit components are different, which will inevitably cause the risk of damage to the contacts due to thermal stress.

In order to improve the heat dissipation efficiency, there are currently several methods commonly used: First, the thermal energy generated by general electronic components is diffused to the air and environment around the printed circuit board through thermal convection or thermal radiation, but this type of heat dissipation efficiency is not high; Secondly, it is conducted through metal wires or heat-sinks with better thermal conductivity. Although this type of structure has better heat dissipation effect than pure dielectric material, but because the wire diameter of the metal wire is not large, the heat dissipation efficiency of this kind of path It is not high; the heat sink usually needs to be fixed to the printed circuit board through a material such as thermally conductive adhesive, but the thermal conductivity of the thermally conductive adhesive is much lower than that of metal. The thermal conductivity of the sheet will also be greatly reduced.

Another solution is to install a heat pipe, but the heat pipe takes up space and structure. It is also relatively complicated, and the manufacturing cost is greatly increased. Other solutions also include changing the material or structure of the printed circuit board, such as a metal core printed circuit board (Metal Core with aluminum (thermal conductivity 237Wm-1K-1) as the metal core). PCB, MCPCB), but due to technical factors, there is currently no multilayer board structure, which cannot cope with complex circuit designs; and it is prone to layout distortion during processing and cannot be widely adopted.

At present, the most commonly adopted solution is to use a ceramic material as the insulating material layer of the circuit substrate. The most common ceramic material is a direct bonded copper (DBC) substrate made of aluminum oxide (Al2O3). wherein the alumina in the thermal conductivity of the single crystal structure up 35Wm ^-1 K ^-1, the polycrystalline structure is 20 to 27Wm ^-1 K ^-1. Other common ceramic material substrates are: aluminum nitride (AlN), beryllium oxide (BeO), and silicon carbide (SiC). Since the above-mentioned ceramic materials with good thermal conductivity are commonly used in circuit substrates with high-power electronic components, such substrates are sometimes referred to as high-power printed circuit substrates (Power Electronic Substrates).

However, in practice, if a printed circuit board made of a ceramic material substrate is used, although the wire diameter of the circuit can be as fine as 30 micrometers (μm), it is usually fired at high temperature. During the manufacturing process, a small amount of The expansion is uneven and warped, so the precision of the substrate is not as good as that of a printed circuit board and it is not suitable for the manufacture of multilayer boards. On the other hand, the metal atoms that make up the circuit are easily diffused during high-temperature processes, so that the wire pitch must be maintained at about 80 microns (μm). . Therefore, in addition to the increased cost of using a ceramic material substrate to make a printed circuit board, the width and spacing of the wires cannot be reduced, and the accuracy of the position of the wire lines makes it impossible to miniaturize the volume of electronic devices that use the entire ceramic material substrate.

Therefore, for electronic components with high heat generation, the electronic components are usually set first On the small piece of ceramic, it is placed on the resin printed circuit board to form a stacked bed frame structure after encapsulation. This not only increases the volume of the printed circuit board, but also because the ceramic block and the thermally conductive element also need to pass through the poor thermal conductivity coefficient. Material conduction will reduce the original heat dissipation efficiency.

For example, some manufacturers have proposed using a semiconductor process to deposit a heat-dissipating material on an etched dielectric substrate to make a composite heat-dissipating substrate as shown in FIG. 1; however, because the semiconductor process machine is quite expensive, this manufacturing method is made The cost has increased accordingly, especially considering the cost sharing of photomasks in the manufacturing process, so it is not suitable for a small number of diverse products, it is quite limited in terms of manufacturing process, and it is not commonly used by general substrate manufacturers.

Therefore, on the one hand, how can we cooperate with a thinner wire diameter and a smaller wire pitch to make the circuit design more miniaturized and occupy less space; and provide better thermal conductivity, making the application of high-power electronic components feasible At the same time, it can also manufacture a small number of diverse products according to the needs of different customers, providing manufacturing flexibility, which is the purpose of this case.

An object of the present invention is to provide a built-in longitudinal heat-dissipating ceramic block printed circuit board which has good heat conduction efficiency at high power components and can provide elastic circuit design in the rest.

Another object of the present invention is to provide a printed circuit board with a built-in vertical heat-dissipating ceramic block that can be provided with heat-dissipating positions as required, and provides design flexibility, so that a small number of diverse circuit layouts become feasible.

Another object of the present invention is to provide a printed circuit board with a built-in vertical heat-dissipating ceramic block capable of more effectively designing a heat-conducting path by passing the heat-dissipating ceramic block above and below.

Another object of the present invention is to provide a space-saving built-in vertical heat sink. Porcelain block printed circuit board; heat dissipation ceramic block is embedded in the through hole on the printed circuit board, so that the lower board surface without components can be thermally connected to the heat dissipation device to improve the overall heat dissipation effect.

Still another object of the present invention is to provide a printed circuit board with a built-in vertical heat dissipation ceramic block which is more economical than a ceramic material substrate.

Yet another object of the present invention is to provide a printed circuit board with a built-in vertical heat dissipation ceramic block. By forming a metal circuit layer on the upper board surface of the heat dissipation ceramic block and the dielectric material layer of the printed circuit board, the metal circuit layer is formed synchronously. The integrated printed circuit board makes the overall structure simple and the manufacturing cost low.

Therefore, the present invention discloses a printed circuit board with a built-in vertical heat dissipation ceramic block, comprising: a dielectric material layer including a first upper plate surface and a first lower plate surface opposite to the first upper plate surface; and, the At least one through hole penetrating the first upper plate surface and the first lower plate surface is formed on the dielectric material layer; at least one heat dissipation ceramic block corresponding to the through hole is included, and includes a second upper plate surface and a second The lower surface of the heat dissipation ceramic block has a higher thermal conductivity than the dielectric material layer; at least one fixing portion that embeds the heat dissipation ceramic block in the through hole of the dielectric material layer and makes the second upper plate surface respectively Corresponding to the first upper plate surface and the second lower plate surface respectively correspond to the first lower plate surface; a metal circuit layer provided on the first upper plate surface and the second upper plate surface; and The high thermally conductive layer disposed below the first lower plate surface and the second lower plate surface, wherein the thermal conductivity of the high thermally conductive layer is higher than the heat dissipation ceramic block.

When a plurality of circuit components including high-power components are mounted on the above-mentioned built-in vertical heat-dissipating ceramic block printed circuit board, a circuit component of the present invention can be formed, including: a built-in vertical heat-dissipating ceramic block printed circuit board, including : A dielectric material layer including a first upper plate surface and a first lower plate surface opposite to the first upper plate surface, and the dielectric material layer has an upper shape At least one through hole penetrating the first upper plate surface and the first lower plate surface is formed; at least one heat dissipation ceramic block correspondingly embedded in the through hole includes a second upper plate surface and a second lower plate surface; The thermal conductivity of the heat-dissipating ceramic block is higher than that of the aforementioned dielectric material layer; at least one fixing portion which embeds and fixes the heat-dissipating ceramic block in the through-hole of the dielectric material layer, so that the second upper plate surface corresponds to the first The upper plate surface and the second lower plate surface correspond to the first lower plate surface, respectively; a metal circuit layer provided on the first upper plate surface and the second upper plate surface for providing a plurality of circuit elements, wherein The circuit element includes at least one high-power element, and the high-power element is provided at a metal circuit layer on the second upper plate surface; and one is disposed on the first lower plate surface and the second lower plate surface. A lower thermally conductive layer, wherein the thermally conductive layer has a higher thermal conductivity than the heat-dissipating ceramic block; and a plurality of circuit elements including at least one high-power element and the aforementioned high-power element Supply lines provided in the second metal layer on the circuit board surface.

The invention reduces the area of expensive ceramic materials and thereby reduces the manufacturing cost through a relatively simple manufacturing process, and has both the good thermal conductivity of ceramic materials and the advantages of a printed circuit board that allows complex circuit designs, which not only conforms to the trend of circuit miniaturization, and Provides good heat conduction for high-power circuit components, thereby ensuring the proper temperature of the operating environment; furthermore, the present invention can more effectively control the thermal energy transmission path and ensure the good operation of other electronic components. In particular, it meets a small number of diverse manufacturing needs, thereby increasing printing The use of circuit boards is flexible.

1‧‧‧Built-in vertical heat dissipation ceramic block printed circuit board

2, 2’‧‧‧Circuit Components

11, 11’‧‧‧ dielectric material layer

111、111’‧‧‧first upper surface

113、113’‧‧‧first lower surface

115‧‧‧through hole

117, 117’‧‧‧ inner edge of perforation

13, 13 ’‧‧‧ Thermal ceramic block

131、131’‧‧‧Second upper surface

133, 133’‧‧‧‧ the second lower surface

135、135’‧‧‧ Outer periphery

15, 15’‧‧‧Fixed section

17, 17’‧‧‧ metal circuit layer

19, 19’‧‧‧ High thermal conductivity layer

8’‧‧‧ cooling fins

9,9’‧‧‧High-power components

FIG. 1 is a schematic side view of a prior art, illustrating the structure of a circuit assembly and a printed circuit board.

FIG. 2 is a printed circuit board with a built-in vertical heat dissipation ceramic block and a circuit group having the same A schematic side view of the first preferred embodiment of the device, illustrating the relative position of the heat-dissipating ceramic block in the printed circuit board, and the overall structure of the circuit assembly.

FIG. 3 is a schematic perspective view of a part of FIG. 2 for explaining the internal structure and bonding method of the printed circuit board.

FIG. 4 is an exploded perspective view of FIG. 2.

FIG. 5 is a schematic side view of a circuit component according to the present invention, and is used to explain the state of an IGBT (Insulated Gate Bipolar Transistor) of the present invention.

FIG. 6 is a schematic side view of a second preferred embodiment of a printed circuit board with a built-in vertical heat-dissipating ceramic block and a circuit component provided with the circuit board according to the present invention, which is used to explain the state of the LED in the present invention.

The foregoing and other technical contents, features, and effects of the present invention will be clearly presented in the following detailed description of the preferred embodiments with reference to the drawings; in addition, in each embodiment, the same elements will be similar Labeled.

A first preferred embodiment of a printed circuit board with a built-in vertical heat-dissipating ceramic block and a circuit component having the printed circuit board according to the present invention, as shown in FIGS. 2 to 5, is a FR-4 with a length and a width of 10 cm each. Based on the multi-layered dielectric material layer 11, the dielectric material layer 11 is pre-cut with, for example, a laser, such as a through hole 115 having a length and a width of 2 cm each, and a corresponding square such as alumina (Al ₂ O ₃ ) is used. The columnar heat-dissipating ceramic block 13 is embedded in the through hole 115. However, as can be easily understood by those skilled in the art, the size of the FR-4 substrate in this embodiment can be simply replaced in a range from more than 10 cm ² to less than 3600 cm ² .

For the convenience of explanation, the surface of the dielectric material layer 11 located above the drawing is referred to as the first upper plate surface 111 and the opposite lower portion is referred to as the first lower plate surface 113 according to the direction of the drawings. The upper and lower surfaces of the block 13 are referred to as the second upper plate surface 131 and the second lower plate surface 133, respectively, and the thickness of the dielectric material layer 11 and the thickness of the heat dissipation ceramic block 13 are similar. Of course, those skilled in the art can easily understand that the above-mentioned dielectric material layer 11 is irrespective of whether FR-1 (commonly known as bakelite), FR-3, FR-6, G-10 or other epoxy resin or glass fiber prepreg substrates are used. Yes; the cutting method can also be mechanical cutting, and the like. The heat-dissipating ceramic block 13 can be selected from silicon nitride (Si ₃ N ₄ ), aluminum oxide (Al ₂ O ₃ ), silicon carbide (SiC), and beryllium oxide (BeO). Such alternatives will not hinder the implementation of this case.

The gap between the outer peripheral edge 135 of the aluminum nitride heat sink ceramic block 13 and the inner edge 117 of the perforation of the FR-4 dielectric material layer 11 is then filled with epoxy resin glue, for example. After the glue material is cured, the heat sink ceramic can be The outer peripheral edge 135 of the block is firmly combined with the inner edge 117 of the perforation, and the fixing portion 15 formed by the curing of the glue material also has greater flexibility than the heat dissipation ceramic block 13. Therefore, it is a mechanical cushioning hybrid material, so that two different materials can Different thermal expansion coefficients still provide cushioning protection. Of course, those skilled in the art can easily infer that although this example uses epoxy resin as an example, silicon substrates or other flexible plastic materials are easy to change and do not hinder the implementation of this case.

After the heat-dissipating ceramic block 13 is embedded in the through-hole 115 of the dielectric material layer 11 by the fixing portion 15, it can be polished to make the first upper plate surface 111 and the second upper plate surface 131 flush with each other to facilitate further In this example, a titanium and a copper metal seed layer are sequentially formed on the first and second upper plate surfaces by, for example, sputtering, and then the metal seed layer is thickened by electroplating to form a The copper layer is electroplated, and in order to protect the copper layer from being easily oxidized, in this example, a layer of nickel and gold is further added above the copper layer to form a metal layer of a multilayer structure. Of course, those skilled in the art can easily understand that the above-mentioned protective copper layer materials will not hinder the implementation of this case regardless of the replacement of materials such as Organic Solderability Preservatives (OSP), silver, and tin. The aforementioned metal layer undergoes a series of subsequent conventional processing procedures such as patterning, which is the gold in this example. 属 电路 层 17。 Circuit layer 17. Of course, those skilled in the art can also use, for example, common vapor deposition or other feasible methods, and use other suitable metals to form the metal circuit layer of the multilayer structure.

Since the first lower plate surface 113 and the second lower plate surface 133 are also flush with each other, and copper has a better thermal conductivity (380Wm ^-1 K ^-1 ), in this example, the first lower plate surface 113 and A copper metal layer is also formed below the second lower plate surface 133, thereby forming a high thermal conductivity layer 19 having a higher thermal conductivity than the aforementioned dielectric material layer 11. Since the high thermal conductivity layer 19 is in good thermal contact at the same time, the dielectric material layer 11 and the heat dissipation ceramic block 13 are connected, but the thermal conductivity of the heat dissipation ceramic block 13 and the high thermal conductivity layer 19 is much higher than that of the dielectric material layer 11, so the high thermal conductivity layer 19 is mainly to re-export the thermal energy from the heat-dissipating ceramic block 13 from the horizontal direction of the figure. In contrast, the general circuit elements (not shown) disposed above the dielectric material layer 11 will not be easily affected by the heat-dissipating ceramic block. The thermal energy transmitted by 13 is used to isolate the high heat emitted by the high-power element 9 from other peripheral circuit elements.

After the above-mentioned dielectric material layer 11 is set, it can be used to further install the required circuit elements. The circuit elements further include at least one high-power element 9. In this example, the high-power element 9 is described as an IGBT, and For example, surface-mount technology (SMT) is soldered and fixed to the pads above the heat-dissipating ceramic block 13, and each electrode of the IGBT is connected to the corresponding pad via a metal lead. Because IGBT has the advantages of high efficiency and fast switching speed, it is often used in electronic equipment with a large amount of work, such as air conditioners, refrigerators, stereos, and motor drivers. Therefore, when the aforementioned electronic equipment is operating, IGBT will generate a large number of The thermal energy will directly pass through the heat-dissipating ceramic block 13 of alumina (Al2O3) and be conducted down to the highly thermally conductive layer 19, and will be guided to the position of the discrete thermal ceramic block 13. Large area heat dissipation, and even an active fan and / or water cooling system (not shown) can be set at the remote end to achieve the effect of increasing heat dissipation efficiency.

Of course, those skilled in the art can also easily replace the heat dissipation fins (not shown) directly attached to the aforementioned high thermal conductivity layer 19, and during the transfer process, because they are not high-power circuit components, they are mainly installed. The position of the metal circuit layer 17 corresponding to the surrounding printed circuit board is protected by the relatively low thermal conductivity of the printed circuit board. The thermal energy emitted by the high power component 9 will not easily affect the surrounding circuit components. That is, the heat-dissipating ceramic block 13 can transfer thermal energy at a high speed in the longitudinal direction, but it does not transfer a large amount of unnecessary thermal energy to the dielectric material layer 11 and interfere with its operation. Therefore, after the high-power component 9 is mounted on the built-in longitudinal heat-dissipating ceramic block printed circuit board 1 of the present invention, the circuit component 2 constituted together can achieve the so-called thermoelectric separation effect, and all components that do not generate high heat are kept at A better low temperature working environment, and keep the advantages of complexity and miniaturization of printed circuit boards.

A second preferred embodiment of a printed circuit board with a built-in vertical heat-dissipating ceramic block and a circuit component having the circuit board according to the present invention, as shown in FIG. 6, is illustrated as a circuit component 2 ′ with a high-power component. The component 2 'is installed in a street light for an illumination light source, and the high-power element 9' in the circuit component 2 'is further exemplified as a high-power LED. The same part in this example as the first preferred embodiment is here I will not repeat them here. In this example, the dielectric material layer 11 ′ is a flexible substrate with a size of about 100 cm ² , and the size of the heat-dissipating ceramic block 13 ′ ranges from 0.01 cm ² to 25 cm ² . However, as can be easily understood by those skilled in the art, the size of the flexible substrate in this embodiment can be easily replaced within the range of 5 cm ² to 3600 cm ² under the limitation of the heat dissipation ceramic block.

In this example, the heat-dissipating ceramic block 13 'is made of aluminum nitride (AlN). After the heat-dissipating ceramic block 13' is embedded in a flexible substrate, a plurality of high-power LEDs are respectively installed at the plurality of heat-dissipating ceramic blocks 13 '. The driving circuit is disposed on the first upper plate surface 111 'of the dielectric material layer 11'. The printed circuit board is flexible because it has a flexible substrate, which can be installed in accordance with the current environmental conditions. In contrast, the heat-dissipating ceramic block 13 'can also be provided in accordance with the shape of the flexible dielectric material layer 11'. In this example, the non-minimum connecting surface that is not perpendicular to the second upper plate surface 131 ′ and the second lower plate surface 133 ′ and has a lower width and a narrow upper edge corresponds to a non-normal connection to the first upper plate surface 111. The non-minimum connecting surface of the perforated inner edge 117 'of the through hole (not shown) with the first lower plate surface 113' achieves the effect of assisting the embedding.

The fixing portion 15 'between the dielectric material layer 11' and the heat-dissipating ceramic block 13 'is a thermally conductive silicone in this example. Other materials such as graphite and phase change materials have higher thermal conductivity than the dielectric material layer 11'. Plastic materials can be easily replaced by those skilled in the art. The heat-conducting silicone adhesive of the fixing portion 15 'has the effect of assisting heat transfer. In this example, a heat-dissipating fin 8' is adhered to the high heat-conducting layer 19 'as the heat-dissipating device by the aforementioned heat-conducting silicone. Of course, the highly thermally conductive layer 19 'can also be supplemented by, for example, a screw lock to strengthen the combination with the dielectric material layer 11' and the heat-dissipating ceramic block 13 ', so that the bonding surface is less likely to generate an air gap. In addition, at the high thermal conductive layer 19 ', for example, a thermal pipe or a graphene product may be further provided to increase the heat dissipation effect.

As the circuit component 2 'of the present invention, the upper and lower flushing ceramic blocks 13' are vertically embedded in the dielectric material layer 11 ', and a metal circuit layer 17' and a high thermal conductivity layer 19 are formed on the upper and lower plate surfaces, respectively. ', Because the thermal conductivity of the high thermal conductivity layer 19' is higher than that of the aforementioned heat dissipation ceramic block 13 ', the heat generated by the high power element 9' provided at the heat dissipation ceramic block 13 'is mainly passed through the heat dissipation ceramic block 13'. The other circuit elements (not shown) disposed at the dielectric material layer 11 'carried by the high thermal conductive layer 19' are relatively less susceptible to interference from the heat generated by the high power element 9 ', thereby achieving the effect of thermoelectric separation. . And because there is no need to use a relatively expensive whole piece of ceramic material substrate, it is more economical in terms of material cost; the combination of the two is simple, which makes manufacturing convenient, and can be produced in a small amount and with flexibility in use and use; of course, the The heat-dissipating ceramic block is not limited to a columnar shape or a block shape. Even if the cross-sectional area of the heat-dissipating ceramic block is U-shaped or other shapes, it is a simple transformation, which does not prevent the implementation of this case. At the same time, when matching but not limited to a mature resin printed circuit board, the overall circuit design can not only be multilayered Therefore, it further meets the requirements of complexity and miniaturization, and does not need to use a semiconductor machine at all, so that the product cost is greatly reduced, and the above-mentioned purpose of the cost invention is effectively achieved.

However, the above are only the preferred embodiments of the present invention, and cannot be used to limit the scope of the present invention. Any simple equivalent changes and modifications made in accordance with the scope of the patent application and the content of the invention specification of the present invention should be applied. Still within the scope of the invention patent.

Claims (4)

A printed circuit board with a built-in vertical heat dissipation ceramic block includes a dielectric material layer including a first upper plate surface and a first lower plate surface opposite to the first upper plate surface, and the dielectric material layer. At least one through hole penetrating through the first upper plate surface and the first lower plate surface is formed thereon; at least one heat dissipation ceramic block correspondingly embedded in the through hole includes a second upper plate surface and a second lower plate surface, The heat dissipation ceramic block has a higher thermal conductivity than the dielectric material layer; at least one fixing portion embedding and fixing the heat dissipation ceramic block in a through hole of the dielectric material layer, so that the second upper plate surface corresponds to the first An upper plate surface and the second lower plate surface respectively correspond to the first lower plate surface; a metal circuit layer provided on the first upper plate surface and the second upper plate surface for providing a plurality of circuit elements, The circuit element includes at least one high-power element, and the high-power element is provided at the metal circuit layer on the second upper plate surface; and one is disposed on the first lower plate surface and the first High thermally conductive layer below the surface of the lower plate, wherein the high thermal conductivity of the thermally conductive layer is higher than the heat sink of the ceramic block. The printed circuit board with a built-in vertical heat dissipation ceramic block according to item 1 of the claim, wherein the area of the dielectric material layer is between 5 cm ² and 3600 cm ² ; and the area of the heat dissipation ceramic block is between 0.01 and 25 cm ² . The built-in longitudinal heat dissipation ceramic block printed circuit board according to item 1 or 2 of the scope of application right, wherein the outer periphery or / and the inner edge of the perforation are at least partly non-perpendicular to the first upper board. Surface, the first lower plate surface, the second upper plate surface, and the non-minimum connecting surface of the second lower plate surface. A circuit component includes: a printed circuit board with a built-in longitudinal heat dissipation ceramic block, comprising a layer of dielectric material, including a first upper plate surface and a first lower plate surface opposite to the first upper plate surface, and, The dielectric material layer is formed with at least one through hole penetrating through the first upper plate surface and the first lower plate surface; at least one heat dissipation ceramic block correspondingly embedded in the through hole includes a second upper plate surface and a first Two lower plate surfaces, the thermal conductivity of the heat-dissipating ceramic block is higher than the dielectric material layer; at least one fixing part that embeds the heat-dissipating ceramic block in a through hole of the dielectric material layer, and makes the second upper plate surface Respectively corresponding to the first upper plate surface and the second lower plate surface respectively correspond to the first lower plate surface; a metal circuit layer provided on the first upper plate surface and the second upper plate surface; and A high thermally conductive layer disposed below the first lower plate surface and the second lower plate surface, wherein the thermal conductivity of the high thermally conductive layer is higher than that of the heat-dissipating ceramic block; and a plurality of circuit elements including at least one high Rate element, and a system for the high-power element disposed on the metal layer of the circuit board on the second surface.