JP2017139303A - Circuit configuration and manufacturing method for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit configuration and a manufacturing method for the same that can consolidate plural electronic components while suppressing the production cost.SOLUTION: In a circuit configuration comprising a heat radiation member 1, a bus bar 2, a first circuit board 3, a second circuit board 5, and a plurality of electronic components 4A to 4D including at least one power device, the heat radiation member includes a first region R1 in which the first circuit board is mounted via the bus bar and a second region R2 in which the plurality of electronic components are mounted via the second circuit board. The second circuit board includes a metal base material layer 51, an insulating layer 52, and a metal pattern layer 53 which are arranged in this order from the heat radiation member side.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a circuit structure and a manufacturing method thereof, and more particularly to a circuit structure on which a plurality of electronic components including at least one power device are mounted.

  In a circuit structure including a power device (power semiconductor element), when power is supplied to the power device, heat is generated by an internal resistance. With the downsizing of electronic equipment, measures against generated heat are an important issue. In this regard, Patent Document 1 teaches that the power device and the heat radiating member are thermally connected via a bus bar to increase the heat radiation efficiency.

JP 2003-164040 A

  In Patent Document 1, the power device is bonded to the heat dissipation member via a bus bar. Thereby, the heat generated by the power device is transmitted to the bus bar and diffused, and then is transmitted to the heat radiating member. From the viewpoint of heat dissipation, it is desirable that the bonding area between the bus bar and the heat dissipation member is wide. Therefore, a metal plate such as a copper plate is usually used as such a bus bar. After the metal plate is cut into a desired shape, the metal plate is attached to the heat dissipation member with an adhesive, for example, and functions as a bus bar.

  By the way, when a plurality of electronic components are connected by a bus bar, the distance between the electronic components becomes long, and the inductance component increases. As a result, loss and noise increase. In order to suppress the generation of noise, a plurality of electronic components may be aggregated and the distance between the electronic components may be shortened. However, as described above, it is difficult to form a fine circuit with a bus bar formed by cutting a metal plate. Therefore, it is difficult to aggregate a plurality of electronic components in a circuit structure using a bus bar. Moreover, when trying to form a fine circuit with a bus bar, the number of metal plates increases and high processing accuracy is required, so that the production process becomes complicated and the production cost increases.

  One aspect of the present invention is a circuit structure including a heat dissipation member, a bus bar, a first circuit board, a second circuit board, and a plurality of electronic components including at least one power device, wherein the heat dissipation The member includes a first area where the first circuit board is mounted via the bus bar, and a second area where the plurality of electronic components are mounted via the second circuit board. A circuit board is related with a circuit structure object provided with the metal base material layer arrange | positioned in order from the said heat radiating member side, an insulating layer, and a metal pattern layer.

  Another aspect of the present invention includes a heat dissipation member, a bus bar, a first circuit board, a second circuit board, and a plurality of electronic components including at least one power device, and the heat dissipation member includes A manufacturing method of a circuit structure comprising: a first area where the first circuit board is mounted via a bus bar; and a second area where the plurality of electronic components are mounted via the second circuit board. Mounting the first circuit board in the first area via the bus bar, forming the second circuit board in the second area, and second in the second area. Mounting the plurality of electronic components via a circuit board, and forming the second circuit board includes: forming an insulating layer on a metal base; and a surface of the insulating layer Forming a metal pattern layer to obtain a laminate, and Cutting the lamina, and a step of obtaining the second circuit board, a method of manufacturing a circuit assembly.

  According to the present invention, it is possible to aggregate a plurality of electronic components including at least one power device while suppressing production costs.

It is the top view (a) and sectional view (b) which show the composition of the circuit composition object concerning the embodiment of the present invention. It is sectional drawing ((a)-(d)) explaining a part of manufacturing method of the circuit structure which concerns on embodiment of this invention. It is the top view (a) and sectional drawing (b) which show the structure of the conventional circuit structure.

[Description of Embodiment of the Invention]
First, the contents of the embodiment of the present invention will be listed and described.
A circuit structure according to the present invention is (1) a circuit structure including a heat dissipation member, a bus bar, a first circuit board, a second circuit board, and a plurality of electronic components including at least one power device. The heat dissipating member includes a first area where the first circuit board is mounted via the bus bar, and a second area where the plurality of electronic components are mounted via the second circuit board. The second circuit board includes a metal base material layer, an insulating layer, and a metal pattern layer arranged in order from the heat radiating member side. A bus bar is disposed in the first region, while a metal pattern is formed in the second region in which a plurality of electronic components including at least one power device (hereinafter may be simply referred to as a plurality of electronic components) are disposed. Thus, a plurality of electronic components can be aggregated while suppressing production costs.

  (2) At least one of the plurality of electronic components may be a leadless component. This is because the metal pattern layer functions as a connection terminal of each electronic component. Leadless means that the electronic component itself does not include a lead terminal.

  (3) It is preferable that the said insulating layer contains ceramics. Thereby, the heat from an electronic component can be efficiently radiated.

  (4) It is preferable that the said metal base material layer and the said metal pattern layer contain the same metal element. Thereby, since the linear expansion coefficient of a metal base material layer and a metal pattern layer becomes comparable, peeling of a metal pattern layer is suppressed.

  (5) A method of manufacturing a circuit structure according to the present invention includes a heat dissipation member, a bus bar, a first circuit board, a second circuit board, and a plurality of electronic components including at least one power device, A circuit configuration in which the heat dissipation member includes a first region where the first circuit board is mounted via the bus bar, and a second region where the plurality of electronic components are mounted via the second circuit board. A method of manufacturing a body, the step of mounting the first circuit board in the first region via the bus bar, the step of forming the second circuit substrate in the second region, and the second Mounting the plurality of electronic components in the region via the second circuit board, and forming the second circuit board includes forming an insulating layer on a metal base material; A metal pattern layer is formed on the surface of the insulating layer and laminated Obtaining a, by cutting the laminate, and a step of obtaining the second circuit board. According to this method, it is possible to obtain a circuit structure in which a plurality of electronic components are aggregated while suppressing production costs.

[Details of the embodiment of the invention]
An embodiment of the present invention will be specifically described below. In addition, this invention is not limited to the following content, but is shown by the claim, and it is intended that all the changes within the meaning and range equivalent to a claim are included.

  In the conventional circuit structure, as shown in FIGS. 3A and 3B, the plurality of electronic components 104 </ b> A to 104 </ b> D are mounted on the bus bar 102 together with the circuit board 103 via the solder 112. The bus bar 102 is bonded to the heat radiating member 101 via an adhesive layer 107. That is, since the electronic components 104 are connected to each other via the bus bar 102 having a large area, the distance between the electronic components 104 becomes long. Therefore, the wiring inductance increases, and the loss and noise increase. Further, the control unit 120 that controls the electronic component 104 and the electronic component 104 are connected by a lead wire 111. In order to connect the electronic component 104 and the lead wire 111, a lead terminal (in this case, a gate terminal) 113 is required on the electronic component 104 side. The electronic component 104 including the lead terminal 113 is expensive and tends to increase in size. Furthermore, the operation of connecting the lead terminal 113 and the lead wire 111 is very complicated. In addition, in the case of such a configuration, a circuit board with a bus bar in which the bus bar 102 and the circuit board 103 are integrated cannot be used. 3A is a top view illustrating a configuration example of a conventional circuit structure, and FIG. 3B is a cross-sectional view taken along line YY in FIG. 3A.

  The circuit structure according to the present embodiment includes a heat dissipation member, a bus bar, a circuit board, and a plurality of electronic components. The heat dissipating member is divided into a first area where the first circuit board is mounted and a second area where a plurality of electronic components are mounted via the bus bar. A plurality of first regions and second regions may be provided in the heat dissipation member. The plurality of electronic components are mounted on the second region via a second circuit board including a metal base layer, an insulating layer, and a metal pattern layer.

  By arranging the bus bar in the first region, it is possible to ensure the energization and heat dissipation. On the other hand, since the second circuit board including the metal pattern layer on which the fine circuit is formed is mounted on the second region, a plurality of electronic components can be aggregated and mounted on the second circuit board. That is, since a fine circuit is formed only in a necessary portion, the production efficiency is improved. Further, the control unit and the electronic component are connected by a lead wire that connects the metal pattern layer and the first circuit board. That is, an electronic component having no lead terminal (leadless) can be used. Therefore, the manufacturing process is simplified, the production cost is suppressed, and the area occupied by the electronic component can be reduced.

[Heat dissipation member]
The heat dissipation member plays a role of releasing heat generated by the power device to the outside of the circuit structure. The material of the heat radiating member is not particularly limited as long as it has a high thermal conductivity (for example, 20 W / m · K or more; the same applies hereinafter). For example, aluminum (Al), copper (Cu), iron (Fe ), Metals such as stainless steel, and ceramics described later. Of these, Al is preferable because it is easy to mold.

  The shape of the heat dissipating member is not particularly limited, and may be a flat plate shape or a box shape (housing) that can accommodate a circuit component. When the heat dissipating member has a flat plate shape, the circuit configuration body may be housed in a box-shaped heat sink and thermally connected to the heat sink, or may be thermally connected to the housing in which the circuit structure body is housed. It may be. Although the thickness (thickness) of a heat radiating member is not specifically limited, It is preferable that it is 3-10 mm from a heat dissipation viewpoint.

[First circuit board]
The first circuit board is a circuit member in which a predetermined circuit is formed on the board, and is electrically connected to the electronic component by, for example, a lead wire. A control unit for controlling the operation of the electronic component is mounted on the first circuit board. The first circuit board is not particularly limited, and may be a rigid board or a flexible board. Furthermore, electronic components other than the control unit can be mounted on the first circuit board via a bonding material such as solder.

  The first circuit board is mounted in the first region via the bus bar. The first circuit board and the bus bar are bonded via, for example, an adhesive layer (first adhesive layer). Alternatively, the bus bar and the first circuit board may be sequentially arranged in the first region and then screwed. Alternatively, a circuit board with a bus bar in which the bus bar and the first circuit board are integrated in advance may be used. Since the area where the first circuit board is mounted and the area where the plurality of electronic components are mounted are separated, it is possible to use a circuit board with a bus bar as described above. Another circuit board may be further laminated on the circuit board with a bus bar.

  It does not specifically limit as a 1st adhesive agent which forms a 1st contact bonding layer. The first circuit board and the bus bar need not be thermally connected. Therefore, the thermal conductivity of the first adhesive may be, for example, less than 5 W / m · K. As such a 1st adhesive agent, the thermosetting resin etc. which do not contain ceramic particles and metal particles are mentioned. Examples of the thermosetting resin include epoxy resin, polyimide, phenol resin, silicone resin, melamine resin, urea resin, alkyd resin, polyurethane, and unsaturated polyester. Although the thickness of a 1st contact bonding layer is not specifically limited, From a viewpoint of space saving, it is preferable that it is 10-300 micrometers.

[Bus bar]
The bus bar is electrically connected to the electronic component by, for example, a lead wire. The material of the bus bar is not particularly limited, and examples thereof include Cu, Al, or an alloy of Cu or Al, Sn, phosphorus (P), and iron (Fe). The thickness of the bus bar is not particularly limited. When the surface area of the bus bar is sufficiently large, the thickness may be small. The thickness of the bus bar is preferably 0.2 to 2 mm, for example, from the viewpoint of miniaturization and electrical connectivity.

  The bus bar is bonded to the first region via the second adhesive layer. From the viewpoint of heat dissipation of heat generated by the bus bar and heat dissipation of heat generated by the second circuit board, the second adhesive layer preferably has a high thermal conductivity. Such a second adhesive layer is formed of, for example, a thermosetting resin containing ceramic particles. The thickness of the second adhesive layer is not particularly limited. Especially, it is preferable that the thickness of a 2nd contact bonding layer is 10-500 micrometers from a viewpoint of ensuring insulation and space saving. The second adhesive layer is preferably a laminate of two or more thermosetting resin layers in that voids can be suppressed. In this case, at least one layer may contain ceramic particles. The type of thermosetting resin in each layer may be the same or different.

[Second circuit board]
The second circuit board includes a metal base layer, an insulating layer, and a metal pattern layer in order from the second region side. The plurality of electronic components are mounted on the second region via the second circuit board. The metal pattern layer has a fine circuit by screen printing or etching. Therefore, it becomes possible to collect and mount a plurality of electronic components in the second region. Furthermore, heat dissipation is also exhibited by the metal substrate layer.

  As a material for the metal substrate layer, a material having high thermal conductivity is preferably used. Examples of such a material include those exemplified as the material of the heat dissipation member. Especially, it is preferable that a metal base material layer contains the same metal as the metal contained in a metal pattern layer. Since the linear expansion coefficients of the metal base layer and the metal pattern layer are approximately the same, peeling of the metal pattern layer is easily suppressed when the circuit component is used. In addition, a circuit structure can be used in the temperature range of -40 degreeC-160 degreeC, for example.

  The thickness of the metal substrate layer is not particularly limited. For example, the thickness of the metal base layer is the same as the thickness of the bus bar disposed in the first region in that the electronic components mounted on the first circuit board and the second circuit board mounted on the bus bar can be easily mounted. It may be a degree. The thickness of the metal substrate layer may be, for example, 200 μm to 5 mm, or 500 μm to 2 mm.

  The insulating layer is disposed to electrically insulate the electronic component and the heat dissipation member. The insulating layer preferably has a high thermal conductivity from the viewpoint of heat dissipation. Examples of the material of the insulating layer having insulation and high thermal conductivity include ceramics and thermosetting resins containing ceramic particles (thermal conductive thermosetting resins). For example, the thermosetting resin containing ceramic particles may be formed into a sheet and then laminated on the metal substrate layer, or may be applied to the metal substrate layer in a fluid state. Among these, from the viewpoint of productivity, the insulating layer is preferably formed by laminating a thermosetting resin containing ceramic particles formed in a sheet shape on the metal base layer. In this case, the insulating layer and the metal base layer may be laminated via an adhesive layer having a high thermal conductivity (for example, an adhesive layer having the same configuration as the second adhesive layer).

  The insulating layer made of ceramics can be formed by a method of attaching ceramic particles to the surface of the metal substrate layer. Methods for adhering ceramic particles to the surface of the metal substrate layer include vapor deposition, physical vapor deposition (PVD), chemical vapor deposition (CVD), thermal spraying, cold spraying, and aerosol deposition (AD). Is mentioned. Among these, the AD method is preferably used in that a dense layer can be obtained at room temperature.

Examples of ceramics having a high thermal conductivity of 20 W / m · K or more include silicon carbide (SiC), aluminum nitride (AlN), silicon nitride (SiN), and aluminum oxide (Al ₂ O ₃ ). Of these, aluminum oxide is preferred because it is particularly excellent in thermal conductivity and electrical insulation and has high corrosion resistance.

  The metal pattern layer is a layer including a circuit in which a predetermined pattern is formed by a metal wire, and functions as a connection terminal for each electronic component. Therefore, leadless electronic components can be mounted in the second region, and the cost can be reduced. The electronic component can be connected to the bus bar by a lead wire (so-called jumper wire) through the metal pattern layer.

  It does not specifically limit as a metal element which forms a metal pattern, For example, the metal illustrated as a material of a bus bar can be illustrated similarly. The method for forming the metal pattern is not particularly limited, and may be a screen printing method or an etching method. Among these, the etching method is preferable because a fine circuit can be easily formed.

  The second circuit board (metal pattern layer) and the plurality of electronic components may be connected to each other via a connection layer. In this case, it is preferable that the connection layer also has a high thermal conductivity. Such a connection layer is formed of, for example, a thermosetting resin containing solder or conductive filler (for example, solder particles, silver particles, etc.). Especially, it is preferable that a connection layer is formed with solder from a heat dissipation and electroconductive viewpoint. The thickness of the connection layer is not particularly limited. Especially, it is preferable that the thickness of a connection layer is 10-100 micrometers from a heat dissipation viewpoint.

  An adhesion layer for enhancing adhesion between the second region and the second circuit board may be disposed between the second region and the second circuit board. In this case, the adhesion layer preferably has high thermal conductivity. Thereby, heat dissipation further improves. The adhesion layer may be used as an adhesion layer that adheres the second region and the second circuit board. In this case, the adhesion layer is formed of, for example, the material exemplified as the insulating layer. The adhesion layer is preferably a laminate of two or more thermosetting resin layers in that voids can be suppressed. In this case, it is preferable that at least one layer contains ceramic particles. The type of thermosetting resin in each layer may be the same or different. When the second circuit board is fixed to the second region by screwing, it is preferable to use grease containing ceramic particles as the adhesion layer. As the grease, silicone grease or the like is used from the viewpoint of heat resistance.

[Electronic parts]
A plurality of electronic components are mounted in the second region. The electronic component includes at least one power device, and may further include one or more electronic components (for example, various capacitors and resistors) used by being connected to the power device. A plurality of power devices may be included as electronic components. The power device is a power semiconductor element that controls power supplied from a power source and supplies the controlled power to other electronic components. The power device is controlled by a control unit mounted on the first circuit board. Electric power is supplied from a predetermined power source to other electronic components via electronic components and bus bars mounted in the second region.

  Examples of the power device include a diode, a transistor, and an integrated circuit (IC, LSI, etc.) in which these are integrated. Among these, transistors are preferably used because they have a wide application range. Typical transistors include bipolar transistors such as IGBT (Insulated Gate Bipolar Transistor), MOSFETs (metal-oxide-semiconductor field-effect transistors), and the like. These are properly used according to the magnitude of power to be handled.

  A plurality of electronic components are arranged in one second region. Electronic components collected in the same second region are connected by a metal pattern layer. Therefore, the connection distance between electronic components is shortened. Therefore, an increase in inductance component is suppressed, and an increase in loss and noise is suppressed.

  Hereinafter, the circuit structure of the present embodiment will be described with reference to FIG. FIG. 1A is a top view illustrating a configuration example of a circuit structure, and FIG. 1B is a cross-sectional view taken along line XX in FIG.

  The circuit structure 10 includes a heat radiating member 1, a bus bar 2, a first circuit board 3, a plurality of electronic components 4 (4A to 4D in the illustrated example), and a second circuit board 5. The heat dissipation member 1 is divided into a first region R1 and a second region R2, and the first region R1 is mounted with the first circuit board 3 bonded to the bus bar 2 and the bus bar 2, and the second region R2. The electronic components 4A to 4D are assembled and mounted. The number and arrangement of the electronic components 4 are not limited to this.

  The bus bar 2 is bonded to the first region R1 by the second adhesive layer 7 and insulated. The bus bar 2 and the first circuit board 3 are bonded by the first adhesive layer 6. A control unit 20 that controls the electronic component 4 and other electronic components are mounted on the first circuit board 3 via, for example, solder (none of which is shown). The electronic component mounted in the first region R1 is not limited to this.

  The electronic components 4A to 4D are mounted on the second region R2 via the second circuit board 5. The second circuit board 5 includes a metal base layer 51, an insulating layer 52, and a metal pattern layer 53 in this order from the second region R2 side. Each of the electronic components 4 </ b> A to 4 </ b> D is bonded to the metal pattern layer 53 via the connection layer 8. The adhesion layer 9 is disposed between the second region R2 and the metal base layer 51, and the second region R2 and the metal base layer 51 are in close contact.

  Each of the electronic components 4A to 4D is connected by a circuit (not shown) formed on the metal pattern layer 53. The electronic component 4 (electronic component 4C in the illustrated example) and the control unit 20 are connected by a lead wire 11 that connects the connection layer 8 and the solder 12 disposed on the first circuit board 3. The bus bar 2 and the electronic component 4 (electronic component 4D in the illustrated example) are also connected by a lead wire 13 that connects the connection layer 8 and the solder 12 disposed on the bus bar 2. That is, the electronic components arranged in different regions can be connected across the regions without performing the operation of connecting the lead terminals and the lead wires.

  As described above, the heat radiation member 1 is divided into two regions (first region R1 and second region R2), and a metal pattern layer capable of forming a fine circuit in the second region R2 on which the plurality of electronic components 4 are mounted. By arranging the second circuit board 5 having 53, it is possible to aggregate a plurality of electronic components 4 while suppressing the production cost. Moreover, heat dissipation is demonstrated by arrange | positioning the metal base material layer 51 between the metal pattern layer 53 and 2nd area | region R2. Furthermore, since a plurality of electronic components 4 can be connected to the bus bar 2 and the first circuit board 3 through the metal pattern layer 53, the leadless electronic components 4 can be used. Thereby, a manufacturing process is simplified and production cost is further suppressed.

  Such a circuit structure 10 includes, for example, the step of mounting the bus bar 2 in the first region R1, the step of forming the second circuit substrate 5, and the second region R2 via the second circuit substrate 5. And a step of mounting a plurality of electronic components 4. At this time, the step of forming the second circuit board 5 includes the step (a) of forming the insulating layer 52 on the metal base material, and forming the metal pattern layer 53 on the surface of the insulating layer 52 to form a laminate. The process (b) which obtains, and the process (c) which cut | disconnects a laminated body are provided. After the obtained second circuit board 5 is mounted on the second region R2 with the metal base layer 51 facing the second region R2, a plurality of electronic components 4 are mounted on the second circuit substrate 5. Note that either the mounting of the first circuit board 3 in the first region R1 or the mounting of the plurality of electronic components 4 in the second region R2 may be performed first or simultaneously.

  Hereinafter, with reference to FIG. 2, each step will be described in detail by taking as an example a case where the insulating layer 52 includes a continuous body of ceramic particles and the metal pattern layer 53 is formed by an etching method.

  First, an insulating layer 52 and a metal layer 530 including a continuous body of ceramic particles are formed on a metal base material (metal base layer 51) (FIG. 2A). Such an insulating layer 52 is formed by attaching ceramic particles to a predetermined position of the second region R2. Examples of the method for attaching the ceramic particles to the second region R2 include the method described above. At this time, if necessary, the insulating layer 52 can be formed at a predetermined position in the second region R2 by applying a mask to the heat radiating member 1 and then adhering ceramic particles. The metal layer 530 is formed by, for example, a method of laminating a metal foil on the insulating layer 52, a method of depositing a metal on the insulating layer 52, or the like.

  Subsequently, a part of the metal layer 530 is removed by, for example, an etching method, and a predetermined metal pattern layer 53 is formed on the surface of the insulating layer 52 (FIG. 2B). Thereby, the laminated body 50 provided with the metal base material layer 51, the insulating layer 52, and the metal pattern layer 53 is obtained. Finally, the second circuit board 5 is obtained by cutting the stacked body 50 into a predetermined shape and size (FIG. 2C).

  Subsequently, after the adhesion layer 9 is formed at a predetermined position in the second region R2, the obtained second circuit board 5 is arranged so that the metal base layer 51 faces the second region R2 (FIG. 2 (d)).

  Subsequently, the bus bar 2 is arranged in the first region R1. The bus bar 2 is disposed in the first region R1 with the second adhesive layer 7 interposed therebetween. Thereafter, the first circuit board 3 is mounted on the bus bar 2 via the first adhesive layer 6 at an arbitrary timing. At this time, you may mount the circuit board with a bus bar provided with the bus bar 2 and the 1st circuit board 3 in 1st area | region R1.

  The first adhesive layer 6 may be formed by applying a paste containing a thermosetting resin to the bus bar 2 by screen printing or a dispenser, or sticking a sheet containing the thermosetting resin to the bus bar 2. May be formed. The second adhesive layer 7 is also formed on the surface of the first region R1 by the same method as the first adhesive layer 6.

  After the second circuit board 5 and the first circuit board 3 are mounted at predetermined positions, a connection layer 8 is formed on the surface of the second circuit board 5, and each electronic component 4 is mounted. The connection layer 8 is, for example, a solder paste containing solder particles dispersed in a resin component such as rosin. The solder paste is applied to the surface of the second circuit board 5 by screen printing or the like. At this time, a connection layer (not shown) may be formed on the surface of the first circuit board 3, and the control unit 20 and other electronic components (not shown) may be mounted on the first circuit board 3. Then, the circuit structure 10 is completed by performing a reflow process. In addition, you may harden the 1st contact bonding layer 6 and the 2nd contact bonding layer 7 by heat-processing before a reflow process.

  The circuit structure of the present invention can be applied to various power supply devices because a plurality of electronic components can be integrated and mounted while suppressing production costs.

  1: heat dissipation member, 2: bus bar, 3: first circuit board, 4, 4A to 4D: electronic component, 5: second circuit board, 50: laminate, 51: metal base layer, 52: insulating layer, 53 : Metal pattern layer, 530: metal layer, 6: first adhesive layer, 7: second adhesive layer, 8: connection layer, 9: adhesion layer, 10: circuit component, 11, 13: lead wire, 12: solder , 20: control unit, 101: heat radiating member, 102: bus bar, 103: circuit board, 104, 104A to 104D: electronic components, 107: adhesive layer, 111: lead wire, 112: solder, 113: lead terminal, 120: Control unit

Claims (5)

A circuit structure comprising a heat dissipating member, a bus bar, a first circuit board, a second circuit board, and a plurality of electronic components including at least one power device,
The heat dissipation member includes a first region where the first circuit board is mounted via the bus bar, and a second region where the plurality of electronic components are mounted via the second circuit board,
A circuit configuration body, wherein the second circuit board includes a metal base layer, an insulating layer, and a metal pattern layer arranged in order from the heat radiating member side.   The circuit structure according to claim 1, wherein at least one of the plurality of electronic components is a leadless component.   The circuit structure according to claim 1, wherein the insulating layer includes ceramics.   The circuit composition object according to any one of claims 1 to 3 in which said metal substrate layer and said metal pattern layer contain the same metal element. A heat dissipating member, a bus bar, a first circuit board, a second circuit board, and a plurality of electronic components including at least one power device;
A circuit configuration in which the heat dissipation member includes a first region where the first circuit board is mounted via the bus bar, and a second region where the plurality of electronic components are mounted via the second circuit board. A method for manufacturing a body,
Mounting the first circuit board on the first region via the bus bar;
Forming the second circuit board;
Mounting the plurality of electronic components on the second region via the second circuit board,
Forming the second circuit board comprises:
Forming an insulating layer on a metal substrate;
Forming a metal pattern layer on the surface of the insulating layer to obtain a laminate;
Cutting the laminate to obtain the second circuit board.

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