JP2018113311A - Circuit structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a circuit structure which can secure insulation between a bus bar and a metal fastening member while inhibiting deterioration of strength of the circuit structure.SOLUTION: A circuit structure includes a lamination body where a heat radiation member, a bus bar, and a circuit board are laminated in a written order. The heat radiation member has a first opening which fits in a thread formed at a rod-like fastening member made of metal. The bus bar has a second opening having an opening diameter larger than the first opening and penetrating through the bus bar. The first opening and the second opening are disposed at positions corresponding to each other. The heat radiation member and the bus bar are fastened by the fastening member which fits in the first opening and is inserted into the second opening. An insulation member which covers at least part of an end surface of the second opening is disposed at the second opening of the bus bar.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a circuit structure, and in particular, to a circuit structure in which a heat dissipation member and a bus bar are fastened by a metal fastening member.

  Electronic parts such as power devices and circuit components are incorporated in the power supply apparatus. The circuit structure includes, for example, a circuit board on which a control unit for controlling the electronic component is mounted, a bus bar that supplies power to the electronic component from a predetermined power source, and heat generated by the electronic component. A heat radiating member that is discharged to the outside. The electronic component is mounted on the heat radiating member via the bus bar. Regarding the method for bonding the bus bar and the heat radiating member, as shown in FIG. 11, after the circuit board 330 and the bus bar 320 are bonded via the bonding layer 380, the bonded member has adhesiveness as shown in FIG. A method of fixing to the heat radiating member 310 by the sheet-like pasting portion 340 and the screw 360 is taught. A spacer sheet 350 is interposed between the bus bar 320 and the heat dissipation member 310. A washer 390 is interposed between the head of the screw 360 and the circuit board 330.

JP, 2015-119607, A

  The screw 360 is usually made of metal. Therefore, it is necessary to insulate the bus bar 320 and the screw 360 from each other. In patent document 1, the space | gap 370 is provided between the bus-bar 320 and the screw | thread 360, and the insulation of both is ensured. However, such a gap 370 existing inside the circuit structure 30 reduces the strength of the circuit structure 30. Furthermore, as shown in FIG. 11, when the circuit board 330 is also screwed together, the circuit board 330 may be bent due to the pressure applied at the time of screwing.

  One aspect of the present invention is a circuit structure including a laminate in which a heat dissipation member, a bus bar, and a circuit board are stacked in this order, and the heat dissipation member is formed on a metal rod-shaped fastening member. A first opening that engages with the screw thread, the bus bar having a larger opening diameter than the first opening, and a second opening penetrating the bus bar; And the second opening are arranged at corresponding positions, and the heat dissipating member and the bus bar are fitted into the first opening and inserted into the second opening. The present invention relates to a circuit structure that is fastened by a fastening member, and an insulating member that covers at least a part of an end surface of the second opening is disposed in the second opening of the bus bar.

  Another aspect of the present invention is a circuit configuration body including a stacked body in which a heat dissipation member, a bus bar, and a circuit board are stacked in this order, and the heat dissipation member is formed of a metal rod having a screw thread. The first fastening member can be inserted and has a first through hole penetrating the heat radiating member, and the bus bar has a larger opening diameter than the first through hole, and the bus bar The first opening and the second opening are arranged at corresponding positions, and the heat dissipating member and the bus bar are connected to the first opening. A first fastening member inserted into a mouth and the second opening, and a second fastening member having a fifth opening fitted to the screw thread, wherein the first of the bus bar is fastened. 2 at least a part of the end surface of the second opening. Insulating members are disposed, a circuit structure.

  According to the circuit structure of the present invention, it is possible to ensure insulation between the bus bar and the metal fastening member while suppressing a decrease in the strength of the circuit structure.

It is sectional drawing shown in the state which expand | deployed the structure of the circuit structure which concerns on one Embodiment of this invention. It is a sectional view showing typically the composition of the circuit composition object concerning one embodiment of the present invention. It is a perspective view which shows the insulating member which concerns on one Embodiment of this invention. It is a perspective view which shows the insulating member which concerns on other embodiment of this invention. It is a perspective view which shows the insulating member which concerns on other embodiment of this invention. It is sectional drawing which shows typically the structure of the circuit structure based on other embodiment of this invention. It is sectional drawing which shows typically the structure of the circuit structure based on other embodiment of this invention. It is sectional drawing which shows typically the structure of the circuit structure based on other embodiment of this invention. It is sectional drawing which shows typically the structure of the circuit structure based on other embodiment of this invention. It is sectional drawing which shows typically the structure of the circuit structure based on other embodiment of this invention. It is sectional drawing which shows typically the structure of the circuit structure based on other embodiment of this invention. It is a conceptual diagram which shows the manufacturing method of the circuit structure shown in FIG. 1 in the cross section of a circuit structure. It is sectional drawing which shows the structure of the conventional circuit structure typically.

[Description of Embodiment of the Invention]
First, the contents of the embodiment of the present invention will be listed and described.
A circuit structure according to the present invention is (1) a circuit structure including a laminated body in which a heat dissipation member, a bus bar, and a circuit board are laminated in this order, and the heat dissipation member is a metal rod-like fastening. A first opening that fits into a thread formed on the member, the bus bar having a larger opening diameter than the first opening, and a second opening penetrating the bus bar; The first opening and the second opening are arranged at corresponding positions, and the heat dissipation member and the bus bar are fitted into the first opening, and the second opening An insulating member that covers at least a part of an end surface of the second opening is disposed in the second opening of the bus bar. Thereby, insulation with a bus-bar and a metal fastening member is securable, suppressing the fall of the intensity | strength of a circuit structure.

  (2) It is preferable that the insulating member and the fastening member are not in contact with each other. Thereby, it becomes difficult to generate | occur | produce the dielectric breakdown for a space | gap (air layer) to be formed between a bus-bar and a fastening member. Furthermore, since it is difficult for external stress to be applied to the insulating member due to the gap, damage to the insulating member is suppressed, and dielectric breakdown is less likely to occur.

  (3) The circuit board is capable of inserting the fastening member and has a third opening penetrating the circuit board. The third opening includes the first opening and the second opening. The heat radiating member, the bus bar, and the circuit board are fitted into the first opening and inserted into the second opening and the third opening. The fastening member may be fastened. Even when the circuit board is fastened together with the bus bar and the heat radiating member by the fastening member, the bending of the circuit board is suppressed.

  (4) The third opening has a larger opening diameter than the first opening, and the insulating member includes at least a part of an end surface of the second opening and the third opening. It is preferable to cover at least a part of the end face. Thereby, the operation | work which arrange | positions an insulating member becomes easy.

  (5) It is preferable that the said heat radiating member and the said bus bar are closely_contact | adhered via the contact | adherence layer which has insulation. This simplifies the manufacturing process and manufacturing equipment, reduces the production cost, and improves the adhesion between the bus bar and the heat dissipation member.

  (6) The adhesion layer is a sheet-like material, and the sheet-like material has a larger opening diameter than the first opening and a fourth opening penetrating the adhesion layer, and the fourth The opening is disposed at a position corresponding to the first opening and the second opening, and the insulating member includes at least a part of the end face of the second opening and the end face of the fourth opening. It is preferable to coat at least a part of Thereby, manufacture of a circuit structure becomes easy.

  Another circuit component according to the present invention includes (7) a laminated body in which a heat radiation member, a bus bar, and a circuit board are laminated in this order, and the heat radiation member is a metal rod-shaped first member. The fastening member can be inserted, has a first through-hole penetrating the heat radiating member, and the bus bar has a larger opening diameter than the first through-hole and a second through the bus bar. The first through hole and the second opening are arranged at corresponding positions, respectively, and the heat dissipation member and the bus bar include the first through hole and the second through hole, respectively. The first fastening member inserted into the opening and the second fastening member provided with the fifth opening fitted to the screw thread, and are fastened to the second opening of the bus bar, An insulating member that covers at least a part of the end face of the second opening is disposed. It has been. Thereby, insulation with a bus-bar and a metal 1st fastening member is securable, suppressing the fall of the intensity | strength of a circuit structure. Furthermore, since the insertion direction of the first fastening member is not limited, the circuit structure can be easily manufactured.

  (8) Furthermore, a covering member that covers at least the circuit board is provided, the covering member is capable of inserting the first fastening member, and has a sixth opening that penetrates the covering member. The sixth opening is disposed at a position corresponding to the first through hole and the second opening, and the first fastening member is connected to the first through hole and the second through hole. It is preferably inserted into the opening and the sixth opening, and the laminate and the covering member are connected by the first fastening member and the second fastening member. In this case, since the fastening of the laminated body and the connection between the laminated body and the covering member can be performed in one step, the productivity of the circuit configuration body is improved.

[Details of the embodiment of the invention]
An embodiment of the present invention will be specifically described below. In addition, this invention is not limited to the following content, but is shown by the claim, and it is intended that all the changes within the meaning and range equivalent to a claim are included.

[First Embodiment]
The circuit structure according to the first embodiment will be described with reference to FIGS. 1 and 2. FIG. 1 is a cross-sectional view showing the circuit configuration in an expanded state. FIG. 2 is a cross-sectional view schematically showing the configuration of the circuit structure. In the example of illustration, the same code | symbol is attached | subjected to the member and part provided with the same function or a similar function.

  The circuit configuration body 10 according to the present embodiment includes a stacked body 100 in which a heat dissipation member 110, a bus bar 120, and a circuit board 130 are stacked in this order. The bus bar 120 and the circuit board 130 are bonded via, for example, an adhesive layer 180. The heat dissipation member 110 and the bus bar 120 are in close contact with each other via, for example, an adhesive layer 140 having insulating properties. Here, the adhesion layer 140 may not have a function of fixing the bus bar 120 to the heat dissipation member 110. This is because the heat radiating member 110 and the bus bar 120 are fastened by a fastening member (hereinafter referred to as a first fastening member 160).

  The 1st fastening member 160 is metal, for example, is provided with the rod-shaped main-body part 161 and the head 162 with a larger diameter than the rod-shaped main-body part 161 arrange | positioned at one edge part. A screw thread is formed around the rod-shaped main body 161. The heat radiating member 110 has a first opening 110 a that fits into the thread of the first fastening member 160. That is, a screw groove that fits the screw thread is formed on the opening end surface 110b of the heat radiating member 110 that forms the first opening 110a. The bus bar 120 has a larger opening diameter than the first opening 110 a and a second opening 120 a that penetrates the bus bar 120. The first opening 110a and the second opening 120a are disposed at corresponding positions, and the end of the first fastening member 160 opposite to the head 162 is connected to the second from the bus bar 120 side. The heat radiating member 110 and the bus bar 120 are fastened by being inserted into the opening 120a and fitting into the first opening 110a.

  In the present embodiment, the entire laminate 100 of the heat dissipation member 110, the bus bar 120, and the circuit board 130 is fastened by the first fastening member 160. That is, the circuit board 130 is formed with a third opening 130 a through which the first fastening member 160 can be inserted and penetrates the circuit board 130. The third opening 130a is disposed at a position corresponding to the first opening 110a and the second opening 120a, and the rod-shaped main body 161 is inserted into the second opening 120a and the third opening 130a. The laminated body 100 is fastened by being fitted into the first opening 110a. At this time, a washer 190 such as a flat washer is interposed between the head 162 of the first fastening member 160 and the circuit board 130 in order to prevent loose fastening and damage to the circuit board 130. The positions corresponding to the first opening 110a and the second opening 120a of the adhesion layer 140 are open.

  In order to insulate the bus bar 120 from the first fastening member 160, at least a part of the end surface (opening end surface 120 b) that forms the second opening 120 a of the bus bar 120 is covered with the insulating member 170. Only the opening end (corner) of the second opening 120 a may be covered with the insulating member 170. On the other hand, in order to ensure insulation, it is preferable that the insulating member 170 is continuously (without a break) arranged in the circumferential direction of the opening end surface 120b. The insulating member 170 has, for example, a ring shape as shown in FIG. 3A and is disposed so as to be fitted into the second opening 120a. That is, the insulating member 170 is disposed in order to insulate the bus bar 120 and the first fastening member 160. Thereby, the space which can be formed in the inside of the laminated body 100 decreases, and the fall of the intensity | strength of the laminated body 100 (and circuit structure 10) is suppressed.

  The outer diameter Dout of the ring-shaped insulating member 170 (hereinafter referred to as the insulating ring 170) may be substantially the same as or smaller than the diameter of the second opening 120a. The opening end surface 120b and the insulating ring 170 may be in contact with each other or may not be in contact with each other. The outer diameter Dout is preferably slightly smaller than the diameter of the second opening 120a in that the insulating ring 170 can be easily fitted into the second opening 120a.

  The inner diameter Din of the insulating ring 170 may be equal to or larger than the diameter of the rod-shaped main body portion 161 of the first fastening member 160, and the insulating ring 170 and the first rod-shaped main body portion 161 may be in contact with each other. You don't have to. Especially, it is preferable that the internal diameter Din is larger than the diameter of the rod-shaped main-body part 161, and the insulating ring 170 and the rod-shaped main-body part 161 are not contacting. As a result, the rod-shaped main body portion 161 is easily inserted into the insulating ring 170, and a slight gap (air layer) is formed between the rod-shaped main body portion 161 and the inner periphery of the insulating ring 170, resulting in dielectric breakdown. It becomes difficult to do. Further, even when a positional deviation or the like occurs in the rod-shaped main body portion 161 due to variations during parts processing or assembly, the gap hardly causes stress on the insulating ring 170. Therefore, damage to the insulating ring 170 is suppressed, and dielectric breakdown is less likely to occur.

  The thickness T of the insulating ring 170 is preferably about the same as the thickness of the bus bar 120. When the thickness T of the insulating ring 170 is larger than the thickness of the bus bar 120, when the circuit board 130 is fastened together with the heat radiating member 110 and the bus bar 120, the insulating ring 170 serves as a spacer, and the bending of the circuit board 130 is suppressed. On the other hand, when the thickness T of the insulating ring 170 is smaller than the thickness of the bus bar 120, the entire laminate 100 can be firmly fastened. The thickness T of the insulating ring 170 is preferably about ± 0.1 mm of the thickness of the bus bar 120. When the thickness T of the insulating ring 170 is larger than the thickness of the bus bar 120, a protrusion 171 as shown in FIG. 3B may be provided on one main surface of the insulating ring 170. At this time, the insulating ring 170A is fitted into the second opening 120a so that the protrusion 171 is hooked on the bus bar 120.

[Second Embodiment]
A circuit structure according to the second embodiment will be described with reference to FIG. FIG. 4 is a cross-sectional view schematically showing the configuration of the circuit structure. In the circuit structure 10 of the present embodiment, the adhesion layer 140 is a sheet-like material and has an opening diameter larger than that of the first opening 110a at a position corresponding to the first opening 110a and the second opening 120a. In addition, a fourth opening 140a penetrating the adhesion layer 140 is provided, and the insulating ring 170 covers the opening end face 120b of the second opening 120a and the end face (opening end face 140b) of the fourth opening 140a. Except for this, it is the same as the first embodiment.

  Since the sheet-like adhesion layer 140 can easily have a uniform thickness, the adhesion between the bus bar 120 and the heat dissipation member 110 can be improved. At this time, the thickness T of the insulating ring 170 is not less than the sum of the thickness of the bus bar 120 and the thickness of the adhesion layer 140, and is preferably larger than the sum. In this case, since the thickness T of the insulating ring 170 is increased, the pickup is facilitated, and the work of arranging the insulating ring 170 is facilitated.

[Third Embodiment]
A circuit structure according to the third embodiment will be described with reference to FIG. FIG. 5 is a cross-sectional view schematically showing the configuration of the circuit structure. In the circuit structure 10 of the present embodiment, the third opening 130a provided in the circuit board 130 is larger than the first opening 110a and has substantially the same opening diameter as the second opening 120a. The insulating ring 170 is the same as in the first embodiment except that the insulating ring 170 covers the opening end face 130b of the third opening 130a together with the opening end face 120b of the second opening 120a. Also in this case, since the thickness T of the insulating ring 170 is increased, the pickup is facilitated, and the work of arranging the insulating ring 170 is facilitated. When the adhesion layer 140 is a sheet-like material, as in the second embodiment, the adhesion layer 140 is provided with a fourth opening 140a having an opening diameter larger than that of the first opening 110a, and the fourth layer The opening end surface 140b of the opening 140a may also be covered with the insulating ring 170.

  In this embodiment, an insulating ring 170B as shown in FIG. 3C may be used. The insulating ring 170B includes at least an insertion portion 172 inserted into the second opening 120a and the third opening 130a, and a placement portion 173 having a larger outer diameter than the insertion portion 172. A part of the mounting portion 173 is mounted on the main surface of the circuit board 130 and can function as the washer 190. At this time, the thickness of the insertion portion 172 is equal to or greater than the sum of the thickness of the bus bar 120, the thickness of the adhesive layer 180, and the thickness of the circuit board 130, and may be larger than the sum.

[Fourth Embodiment]
A circuit structure according to the fourth embodiment will be described with reference to FIG. FIG. 6 is a cross-sectional view schematically showing the configuration of the circuit structure. The circuit structure 10 of this embodiment is the same as that of the first embodiment except that the third opening 130a provided in the circuit board 130 has a larger opening diameter than the second opening 120a. . In this case, the heat dissipation member 110 and the bus bar 120 are fastened by the first fastening member 160.

  In FIG. 6, the fourth opening 140 a is provided in the adhesion layer 140 and the opening end surface 140 b of the fourth opening 140 a is also covered with the insulating ring 170. However, the present invention is not limited to this. Also in this embodiment, an insulating ring 170B as shown in FIG. 3C may be used. However, the thickness of the insertion part 172 should just be more than the sum total of the thickness of the bus bar 120, and the thickness of the contact | adherence layer 140, and may be larger than the said sum.

[Fifth Embodiment]
A circuit structure according to the fifth embodiment will be described with reference to FIG. FIG. 7 is a cross-sectional view schematically showing the configuration of the circuit structure. In the circuit configuration body 10 of the present embodiment, the heat dissipation member 110 has a first through-hole 110c through which the first fastening member 160 can be inserted and penetrates the heat dissipation member 110. The second opening 120a has a larger opening diameter than the first through hole 110c and penetrates the bus bar 120. Further, the circuit structure 10 includes a second fastening member 150. The first through-hole 110c and the second opening 120a are arranged at corresponding positions, and the second fastening member 150 is fitted to a thread formed on the first fastening member 160. A fifth opening 150a is provided. The heat dissipation member 110 and the bus bar 120 are fastened by the first fastening member 160 and the second fastening member 150 inserted into the first through hole 110c and the second opening 120a. An insulating ring 170 that covers the opening end face 120b of the second opening 120a is disposed in the second opening 120a of the bus bar 120.

  That is, in the circuit configuration body 10 of the present embodiment, the first opening is a through-hole (the first through-hole 110c) that penetrates the heat radiating member 110, and the stacked body 100 includes the first fastening member 160 and the second fastening member. Except for being fastened by the fastening member 150, it is the same as in the first embodiment. In this case, since the insertion direction of the 1st fastening member 160 is not restrict | limited, the circuit structure 10 is easy to manufacture. In addition, when using the 2nd fastening member 150, the 1st through-hole 110c and the 1st fastening member 160 are not required until it has fitted. That is, the thread groove does not have to be formed on the opening end surface of the first through-hole 110c. In FIG. 7, the entire laminated body 100 (the heat dissipation member 110, the bus bar 120, and the circuit board 130) is fastened by the first fastening member 160 and the second fastening member 150, but is not limited thereto. For example, the laminate 100 may be configured as shown in FIG. 6 and only the heat radiating member 110 and the bus bar 120 may be fastened.

  The form of the 2nd fastening member 150 is not specifically limited as long as it has the 5th opening 150a fitted to a screw thread. For example, as shown in FIG. 7, the second fastening member 150 may be a nut. Alternatively, as shown in FIG. 8, the second fastening member 150 may be a covering member 200 that covers at least the circuit board 130. The covering member 200 is, for example, a cover that covers at least the circuit board 130 and may be a housing for housing the circuit structure 10. In this case, the covering member 200 has a recess that can contact the circuit board 130 via the washer 190 at a position corresponding to the first through hole 110c. Thereby, a space for mounting an electronic component (not shown) on the bus bar 120 is secured. FIG. 8 is a cross-sectional view schematically showing the configuration of the circuit structure.

  The fifth opening 150a may or may not penetrate through the second fastening member 150. 7 and 8 show a case where the fifth opening 150a penetrates the second fastening member 150. FIG. As a method for providing the fifth opening 150a in the covering member 200, for example, a method of welding a nut to the material of the covering member 200 (for example, a plate-like member), or after forming an opening by drilling or burring, Examples of the method include forming a screw groove on the end face of the opened opening or fitting a nut into the opening and welding.

[Sixth Embodiment]
A circuit structure according to the sixth embodiment will be described with reference to FIG. FIG. 9 is a cross-sectional view schematically showing the configuration of the circuit structure. The circuit configuration body 10 of the present embodiment includes a covering member 200, and the laminate 100 and the covering member 200 are connected by a first fastening member 160 and a second fastening member 150 that is a nut. Other than the above, this embodiment is the same as the fifth embodiment. In other words, the first fastening member 160 can be inserted into the covering member 200 at a position corresponding to the first through hole 110c and the second opening 120a, and the sixth member penetrating the covering member 200 is provided. An opening 200a is formed, and the first fastening member 160 is inserted into the sixth opening 200a together with the first through hole 110c, the second opening 120a, and the third opening 130a. In this case, the sixth opening 200a does not have to be formed with a screw groove that fits into the screw thread. Thus, even when the laminated body 100 and the covering member 200 are integrated, since the strength reduction of the circuit structure 10 is suppressed by the insulating ring 170, both can be firmly fastened.

  In FIG. 9, the first through-hole 110c is provided, the first fastening member 160 is inserted from the heat radiating member 110 side, and the laminate 100 and the covering member 200 are connected to the first fastening member 160 and the second fastening member 160. However, the present invention is not limited to this. For example, an opening that does not penetrate through the heat dissipation member 110 (first opening 110a) may be provided, and the first fastening member 160 may be inserted from the covering member 200 side to fasten the laminate 100 and the covering member 200. In this case, it is preferable that the opening end surface 110b of the first opening 110a is formed with a thread groove that fits into the thread of the first fastening member 160.

  In order to secure a space for mounting an electronic component (not shown) on the bus bar 120, the rod-shaped main body 161 of the first fastening member 160 used in the present embodiment penetrates the laminated body 100, and the above-described space is provided. It has a length that can be cut vertically. Moreover, the rod-shaped main-body part 161 is inserted in the support | pillar 210 provided with a hollow. The column 210 extends from, for example, a position corresponding to the first through hole 110 c of the covering member 200, and an end thereof abuts on the circuit board 130 via the washer 190. That is, the stacked body 100 is fastened by being sandwiched between the head 162 of the first fastening member 160 and the end of the support column 210. With such a configuration, it is possible to perform the fastening of the laminated body 100 and the connection between the laminated body 100 and the covering member 200 in one step. The strut 210 may be integrated with the covering member 200 or may be a separate body.

[Production method]
Next, a method for manufacturing the circuit structure 10 will be described with reference to FIG. FIG. 10 is a conceptual diagram showing a method for manufacturing the circuit structure 10 in a cross section of the circuit structure 10. FIG. 10 shows a method for manufacturing the circuit structure 10 shown in FIG.

  In the circuit structure 10, for example, a process of preparing a member in which a bus bar 120 having a second opening 120a and a circuit board 130 having a third opening 130a are laminated via an adhesive layer 180 (FIG. 10 ( a)), a step of fitting the insulating member (insulating ring) 170 into the second opening 120a from the bus bar 120 side (FIG. 10B), and the adhesion layer 140 from the bus bar 120 side of the laminated member. The step of forming the laminated body 100 by laminating the heat dissipating member 110 having the first opening 110a (FIG. 10C) and the first fastening member 160 are connected to the circuit board 130 of the laminated body 100. And a step of inserting into each opening from the side (FIG. 10D). A screw thread is formed around the rod-shaped main body 161 of the first fastening member 160, and a screw groove that fits the screw thread is formed on the opening end surface 110 b of the heat dissipation member 110. Therefore, the laminated body 100 is fastened by inserting the first fastening member 160 into the first opening 110a while rotating (FIG. 10E). After the laminated body 100 is fastened, various electronic components are mounted. 7, after the step of forming the laminated body 100, the first fastening member 160 is inserted into each opening from the heat radiation member 110 side of the laminated body 100 and fastened with the nut 200. Is formed.

  The first fastening member 160 is used for fastening the heat radiating member 110 and the bus bar 120. Therefore, the adhesion layer 140 only needs to be able to adhere the heat dissipation member 110 and the bus bar 120. In other words, the step of curing the adhesion layer 140 performed to fix the bus bar 120 to the heat dissipation member 110 can be omitted. For example, when the adhesion layer 140 includes a thermosetting resin, the curing process of the adhesion layer 140 refers to a heating process. Since a heating process is normally performed over 1 hour in a heating apparatus, continuous processing is difficult and it is inferior to productivity. Furthermore, in order to cure the adhesion layer 140 in a state where the heat dissipation member 110 and the bus bar 120 are in close contact with each other, it is necessary to press the laminate 100 from both main surface sides. At this time, the circuit board 130 may be damaged. Further, in order to avoid the circuit portion formed on the circuit board 130 and press the circuit board 130, a dedicated pressing jig is required, resulting in an increase in cost. In other words, since the step of curing the adhesion layer 140 can be omitted, continuous processing is possible, productivity is improved, damage to the circuit board 130 is suppressed, yield is improved, and cost can be reduced.

  In addition, when performing each said process continuously, each process is normally performed, without changing the positional relationship of the bus-bar 120 and the circuit board 130. FIG. That is, in the case of FIG. 10, each process is performed in a state where the bus bar 120 is placed on the circuit board 130, so it is difficult for the first fastening member 160 to confirm the position of the first opening 110 a. It is inserted from below (circuit board 130 side). On the other hand, when the insulating ring 170B having the mounting portion 173 as shown in FIG. 3C is used, the step of fitting the insulating ring 170 into the second opening 120a is performed on the circuit board on the bus bar 120, contrary to FIG. The operation is performed from above (circuit board 130 side) while 130 is placed. That is, the first fastening member 160 can be inserted into each opening from above, where the position of the first opening 110a can be easily confirmed. Therefore, the insertion operation of the 1st fastening member 160 becomes easy.

  At least one of the adhesive layer 180 and the adhesion layer 140 is preferably a sheet-like material. In particular, the adhesion layer 140 is preferably a sheet-like material. The adhesion layer 140 plays a role of insulating between the bus bar 120 and the heat radiating member 110 and transferring heat of the bus bar 120 to the heat radiating member 110. Therefore, it is desirable that the bus bar 120 and the heat radiating member 110 are in close contact with each other by the close contact layer 140. When the adhesion layer 140 is a sheet-like material, it is easy to make the thickness uniform, so that the adhesion between the bus bar 120 and the heat dissipation member 110 can be improved. Furthermore, since the sheet-like material can be molded into a predetermined shape in advance, the manufacturing process and the manufacturing equipment are simplified.

Hereinafter, each component of the circuit structure 10 will be described.
[Heat dissipation member]
The heat radiating member 110 plays a role of radiating heat generated by an electronic component mounted on the bus bar 120 such as a power device to the outside of the circuit structure 10. The material of the heat radiating member 110 is not particularly limited as long as it has a high thermal conductivity (for example, 20 W / m · K or more, the same applies hereinafter). For example, aluminum (Al), copper (Cu), stainless steel And metals such as ceramics. Of these, Al is preferable because it is easy to mold.

  The heat radiating member 110 includes a first opening 110a (or a first through hole 110c). The diameter of the first opening 110 a (or the first through hole 110 c) corresponds to the diameter of the rod-shaped main body 161 of the first fastening member 160. On the opening end face 110b of the first opening 110a, a screw groove that fits into a screw thread provided on the first fastening member 160 is formed. The first opening 110a may penetrate the heat radiating member 110 or may not penetrate. On the other hand, the first through hole 110c penetrates the heat radiating member 110, and the screw groove may not be formed on the opening end surface of the first through hole 110c. Although the shape which looked at the 1st opening 110a and the 1st penetration hole 110c from the normal line direction of the main surface of the thermal radiation member 110 is not specifically limited, Usually, it is circular.

  The shape of the heat radiating member 110 is not particularly limited, and may be a flat plate shape or a box shape (housing) that can accommodate the circuit component 10. When the heat dissipating member 110 has a flat plate shape, the circuit component 10 may be accommodated in a box-shaped heat sink and thermally connected to the heat sink, or may be thermally connected to the casing in which the circuit component 10 is accommodated. It may be connected to. Alternatively, fins or the like may be formed on the heat dissipation member 110, and the heat dissipation member 110 itself may be used as a heat sink. Especially, it is preferable that the thermal radiation member 110 serves as a housing from a viewpoint of space saving. The thickness (thickness) of the heat dissipation member 110 is not particularly limited, but is preferably 3 to 10 mm from the viewpoint of heat dissipation.

[Bus bar]
The bus bar 120 is a member that supplies electric power from a predetermined power source to the electronic component, and is electrically connected to the electronic component. The material of the bus bar 120 is not particularly limited, and examples thereof include Cu, Al, or an alloy of Cu or Al, tin (Sn), phosphorus (P), and iron (Fe). The thickness of the bus bar 120 is not particularly limited, and is preferably 0.2 to 2 mm from the viewpoint of miniaturization and electrical connectivity.

  The bus bar 120 includes a second opening 120 a that penetrates the bus bar 120. The opening diameter of the second opening 120a is larger than the opening diameter of the first opening 110a (or the first through hole 110c), and is 1 of the opening diameter of the first opening 110a (or the first through hole 110c). 0.5 to 2 times is preferable. The shape of the second opening 120a viewed from the normal direction of the main surface of the bus bar 120 is not particularly limited, and may be set in consideration of the outer shape of the insulating ring 170. The shape of the second opening 120a is, for example, a rectangle, a circle, an ellipse, a triangle, or the like. Among these, the shape of the second opening 120a is preferably circular in that it is easy to form and align with the insulating ring 170. When the shape of the second opening 120a is other than a circle, the opening diameter of the second opening 120a is the minimum length passing through the center of the second opening 120a. The same applies to the third opening 130a and the fourth opening 140a.

[Circuit board]
The circuit board 130 is a board on which a control unit and the like for controlling the operation of the electronic component are mounted. A predetermined circuit is formed on the circuit board 130 and is electrically connected to the electronic component. The circuit board is not particularly limited, and may be a rigid board or a flexible board.

  The circuit board 130 may be formed with a third opening 130a through which the circuit board 130 passes. In this case, the opening diameter of the third opening 130a is larger than the opening diameter of the first opening 110a (or the first through hole 110c), and may be substantially the same as the opening diameter of the second opening 120a. However, it may be larger than the opening diameter of the second opening 120a. The shape of the third opening 130a viewed from the normal direction of the main surface of the circuit board 130 is not particularly limited. The shape of the third opening 130a is, for example, a rectangle, a circle, an ellipse, a triangle, or the like. When the opening end face 130 b of the third opening 130 a is covered with the insulating ring 170, the shape of the third opening 130 a may be set in consideration of the outer shape of the insulating ring 170.

[Adhesion layer]
The adhesion layer 140 is a layer interposed between the bus bar 120 and the heat dissipation member 110 and has an insulating property. The adhesion layer 140 ensures insulation between the bus bar 120 and the heat dissipation member 110. The adhesion layer preferably has a heat dissipation property (thermal conductivity). In this case, the heat of the bus bar 120 is easily transmitted to the heat radiating member 110. On the other hand, the adhesion layer 140 is not required to have a function of fixing the bus bar 120 to the heat dissipation member 110.

The material of the adhesion layer 140 is not particularly limited as long as it has insulating properties and heat dissipation properties. When the adhesion layer 140 is a sheet-like material, examples of the material of the adhesion layer 140 having insulation and heat dissipation include elastic materials such as silicone rubber containing a thermally conductive filler such as ceramic particles. In the case where the adhesion layer 140 is formed by applying a liquid material, examples of the material of the adhesion layer 140 having insulating properties and heat dissipation include elastic materials such as an acrylic resin containing the thermal conductive filler. The adhesion layer 140 may be grease containing a heat conductive filler. As the grease, silicone grease or the like is used from the viewpoint of heat resistance. Among these, from the viewpoint of productivity, the adhesion layer 140 is preferably a sheet-like material. Examples of ceramics include silicon carbide (SiC), aluminum nitride (AlN), silicon nitride (SiN), and aluminum oxide (Al ₂ O ₃ ). Of these, aluminum oxide is preferred because it is particularly excellent in thermal conductivity and electrical insulation and has high corrosion resistance. From the viewpoint of ensuring insulation and saving space, the thickness of the adhesion layer 140 is preferably 10 to 500 μm.

[Insulating material]
The insulating ring 170 is a member that covers at least a part of the opening end surface 120 b of the bus bar 120 and ensures insulation between the bus bar 120 and the first fastening member 160. The material of the insulating ring 170 is not particularly limited as long as it has insulating properties. Among these, from the viewpoint of heat resistance, polyacetal copolymer (POM, Duracon), polybutylene terephthalate (PBT) and the like are preferable.

[Adhesive layer]
The adhesive layer 180 is a layer that is interposed between the bus bar 120 and the circuit board 130 and bonds them together. Examples of the material of the adhesive layer 180 include a thermosetting resin. Examples of the thermosetting resin include epoxy resin, polyimide, phenol resin, silicone resin, melamine resin, urea resin, alkyd resin, polyurethane, and unsaturated polyester. It is preferable that the adhesive layer 180 also includes a thermally conductive filler in that the efficiency of heat dissipation increases. Moreover, it is preferable that the contact bonding layer 180 is a laminated body of two or more thermosetting resin layers at the point which can suppress a void. At this time, the kind of thermosetting resin in each layer may be the same or different. Although the thickness of the contact bonding layer 180 is not specifically limited, From a viewpoint of space saving, it is preferable that it is 100-500 micrometers.

[Fastening member]
The first fastening member 160 is made of metal, and includes a rod-shaped main body 161 inserted into at least the first opening 110a (or the first through hole 110c) and the second opening 120a, and the rod-shaped main body 161. Is also provided with a head 162 having a large diameter. A screw thread is formed around the rod-shaped main body 161. By fitting the thread and the screw groove formed in the heat dissipation member 110 or the second fastening member 150, the heat dissipation member 110 and the bus bar 120 are fastened. Specifically, the first fastening member 160 is a screw or a bolt. The size and shape of the head 162, the height and shape of the thread, etc. are not particularly limited, and may be selected as appropriate. The length of the rod-shaped main body 161 is not particularly limited, and may be set as appropriate in consideration of the depth of each opening. The material of the first fastening member 160 is not particularly limited as long as it is a metal. Examples of the material of the first fastening member 160 include steel, stainless steel, brass, copper, phosphor bronze, aluminum, and titanium.

  The second fastening member 150 is made of, for example, metal, and has a fifth opening 150 a having a screw groove that fits into a screw thread formed around the rod-shaped main body portion 161. The form of the second fastening member 150 is not particularly limited, and may be a nut, a cover that covers at least the circuit board 130, or a housing for housing the circuit component 10. Also good. Examples of the material of the second fastening member 150 include the same metal as the material of the first fastening member 160.

[Electronic parts]
The electronic components mounted on the bus bar 120 are not particularly limited, and may be appropriately selected as necessary. Examples of the electronic component include a power device. The power device is a semiconductor that controls electric power supplied from a power source and supplies the controlled electric power to other electronic components. Examples of the power device include a diode, a transistor, and an integrated circuit (IC, LSI, etc.) in which these are integrated. Among these, transistors are preferably used because they have a wide application range. Typical transistors include bipolar transistors such as IGBT (Insulated Gate Bipolar Transistor), MOSFETs (metal-oxide-semiconductor field-effect transistors), and the like. These are properly used according to the magnitude of power to be handled.

  The circuit structure of the present invention can be applied to various electronic devices because the insulation between the bus bar and the metal fastening member is ensured and the strength of the circuit structure is prevented from lowering.

DESCRIPTION OF SYMBOLS 10: Circuit structure 100: Laminated body 110: Heat dissipation member 110a: 1st opening 110b: Opening end surface of 1st opening 110c: 1st through-hole 120: Bus bar 120a: 2nd opening 120b: 2nd opening Open end face 130: Circuit board 130a: Third opening 130b: Open end face of the third opening 140: Adhesion layer 140a: Fourth opening 140b: Open end face of the fourth opening 150: Second fastening member 150a: Fifth opening 160: first fastening member 161: rod-shaped main body 162: head 170, 170A, 170B: insulating member (insulating ring)
171: Protrusion 172: Insertion part 173: Placement part 180: Adhesive layer 190: Washer 200: Cover member 200a: Sixth opening 210: Post 30: Circuit component 310: Heat radiation member 320: Bus bar 330: Circuit board 340: Pasting part 350: Spacer sheet 360: Screw 370: Gap 380: Adhesive layer 390: Washer

Claims (8)

A heat dissipating member, a bus bar, and a circuit board are circuit components including a laminated body laminated in this order,
The heat dissipating member has a first opening for fitting with a screw thread formed on a metal rod-like fastening member;
The bus bar has a larger opening diameter than the first opening and a second opening penetrating the bus bar;
The first opening and the second opening are arranged at corresponding positions, respectively.
The heat dissipation member and the bus bar are fastened by the fastening member that fits into the first opening and is inserted into the second opening,
A circuit structure in which an insulating member that covers at least a part of an end surface of the second opening is disposed in the second opening of the bus bar.   The circuit structure according to claim 1, wherein the insulating member and the fastening member are not in contact with each other. The circuit board is capable of inserting the fastening member and has a third opening penetrating the circuit board;
The third opening is disposed at a position corresponding to the first opening and the second opening;
The heat dissipation member, the bus bar, and the circuit board are fastened by the fastening member that fits into the first opening and is inserted into the second opening and the third opening. Item 3. The circuit structure according to Item 1 or 2. The third opening has a larger opening diameter than the first opening;
4. The circuit structure according to claim 3, wherein the insulating member covers at least part of the end face of the third opening together with at least part of the end face of the second opening.   The circuit structure as described in any one of Claims 1-4 with which the said heat radiating member and the said bus-bar are contact | adhered via the contact | adherence layer which has insulation. The adhesion layer is a sheet-like material,
The sheet-like material has a larger opening diameter than the first opening, and has a fourth opening penetrating the adhesion layer,
The fourth opening is disposed at a position corresponding to the first opening and the second opening;
The circuit structure according to claim 5, wherein the insulating member covers at least a part of the end face of the fourth opening together with at least a part of the end face of the second opening. A heat dissipating member, a bus bar, and a circuit board are circuit components including a laminated body laminated in this order,
The heat dissipating member is capable of inserting a metal rod-shaped first fastening member provided with a screw thread, and has a first through-hole penetrating the heat dissipating member,
The bus bar has a larger opening diameter than the first through-hole and a second opening penetrating the bus bar;
The first through hole and the second opening are arranged at corresponding positions, respectively.
A second fastening in which the heat dissipating member and the bus bar have a first opening inserted into the first through hole and the second opening, and a fifth opening that fits into the thread. It is fastened with the member,
A circuit structure in which an insulating member that covers at least a part of an end surface of the second opening is disposed in the second opening of the bus bar. Furthermore, it comprises a covering member that covers at least the circuit board,
The covering member is capable of inserting the first fastening member and has a sixth opening penetrating the covering member;
The sixth opening is disposed at a position corresponding to the first through hole and the second opening;
The first fastening member is inserted into the first through hole, the second opening, and the sixth opening;
The circuit structure according to claim 7, wherein the laminated body and the covering member are connected by the first fastening member and the second fastening member.

Images