JP2009141101A - Radiating substrate, perpendicular multiple set substrate using the same, and these manufacturing methods - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve such a problem that a conductor layer for circuits may be peeled off from a second insulating adhesive layer when any tensile force occurs in a vibration test or the like, since the conductor layer for circuits is only fixed by the second insulating adhesive layer, radiating substrates. <P>SOLUTION: A radiating substrate 16 includes at least: a metal plate 19; a sheet-shaped heat transmission layer 18 formed on the metal plate 19; and a lead frame 17 fixed to the heat transmission layer 18. The lead frame 17, a neighborhood of a root of a connection wiring 20 composed of the lead frame 17 or the like, of the radiating substrate 16 are physically pushed to the heat transmission layer 18 and are fixed by using a resin structure 11 fixed to the metal plate 19 or the like with screws 22 or the like. Thereby, an adhesion strength of an interface section of the lead frame 17 and the heat transmission layer 18 is raised. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a heat dissipation board used in hybrid cars such as mild hybrid cars and industrial equipment, a vertical multiple board using the same, and a method of manufacturing the same.

  In recent years, hybrid cars and various industrial devices that achieve low power consumption by accumulating regenerative power during braking in an electric double layer capacitor or the like have attracted attention.

  Such a device requires a circuit module that handles a large current, such as a DCDC converter that controls a large current exceeding 100 A with high accuracy (herein, DCDC means a converter that converts a DC input into a DC output). The power semiconductors used for these must be mounted on a heat dissipation board that supports heat dissipation and large current.

  As such a heat dissipation substrate, for example, a metal base circuit substrate having a structure in which a circuit substrate is bonded to a metal plate via an insulating adhesive layer containing a metal oxide and / or a metal nitride as in Patent Document 1 is known. It has been.

  FIG. 11 is a cross-sectional view showing an example of a conventional heat dissipation board. In FIG. 11, the conductor circuit 3 is fixed on the metal plate 1 via the first insulating adhesive layer 2. Further thereon, a circuit conductor layer 6 is formed via a second insulating adhesive layer 5, and a via hole 7 (via hole is also referred to as via hole) is formed between the conductor circuit 3 and the circuit conductor layer 6. Connected). However, even if a circuit module is produced using such a conventional heat dissipation substrate, there is a limit to increasing the peel strength of the circuit conductor layer 6.

For example, when a part of the circuit conductor layer 6 is formed as an external lead terminal portion and further pulled as indicated by an arrow 9, only the adhesive force of the insulating adhesive layer 5 resists this “tensile force”. It is. As a result, it is difficult to cope with vibration resistance required for in-vehicle use (for example, an acceleration test of about 4 to 20 G is performed in the XYZ directions).
JP-A-9-139580

  In the conventional heat dissipation board 8 shown in FIG. 11, the circuit conductor layer 6 is only adhered to the surface of the second insulating adhesive layer 5, so that a large force is applied thereto via a printed board or a power cable. When applied, there is a possibility that the adhesive surface peels off.

  Therefore, in order to solve the above problems, the present invention provides a metal plate, a sheet-like heat transfer layer formed thereon, a lead frame fixed to the heat transfer layer, and a part of the lead frame. A heat dissipation board comprising a connection wiring that is bent substantially vertically from a thermal layer, and a resin structure that fixes a part or more of the connection wiring, wherein the connection wiring and a part or more of the resin structure are: It forms in the peripheral part of the said thermal radiation board | substrate, and makes it the thermal radiation board | substrate by which a part or more of the root part of the said connection wiring is pressed by the said heat transfer layer with the said resin structure.

  As described above, according to the present invention, a part of the lead frame constituting the wiring of the heat radiating substrate is bent substantially vertically from the heat transfer layer to form a connection wiring that functions as an external lead terminal portion. The wiring part and the external terminal part can be integrated.

  Further, a part or more of the base portion of the connection wiring is more firmly fixed using a resin structure. As a result, the adhesive force (physical and chemical) between the heat transfer layer and the lead frame between the root part of the connection wiring (especially the lead frame that becomes the base part of the connection wiring) and the heat transfer layer that fixes the connection wire. Etc.) and the physical fixing force by the resin structure, the mechanical strength is increased by a double effect (or synergistic effect).

  Note that some of the manufacturing steps shown in the embodiment of the present invention are performed using a molding die or the like. However, the molding die is not shown unless it is necessary for explanation. Further, the drawings are schematic views and do not show the positional relations in terms of dimensions.

(Embodiment 1)
Hereinafter, as a first embodiment of the present invention, the structure of a resin structure used for increasing the strength of a heat dissipation substrate will be described with reference to the drawings.

  FIG. 1 is a perspective view showing an example of a resin structure used for increasing the strength of a connection wiring portion of a heat dissipation board. In FIG. 1, 11 is a resin structure, 12 is a mounting hole, 13 is a wiring hole, 14 is an opening, 15a and 15b are recessed portions, 16 is a heat dissipation board, 17 is a lead frame, 18 is a heat transfer layer, and 19 is A metal plate, 20 is a connection wiring, 21 is an arrow, and 22 is a screw.

  The wiring hole 13 provided in the resin structure 11 corresponds to a portion through which the connection wiring 20 formed in the heat dissipation substrate 16 penetrates, as described later with reference to FIG.

  In FIG. 1, the connection wiring 20 is a portion obtained by bending a part of the lead frame 17 fixed to the sheet-like heat transfer layer 18 formed on the metal plate 19 substantially vertically. The bent portion becomes the connection wiring 20. The base portion of the connection wiring 20 (particularly the lead frame 17 portion fixed to the heat transfer layer 18 at the base portion of the connection wiring 20) is strengthened by the resin structure 11.

  In FIG. 1, the heat dissipation substrate 16 includes a metal plate 19, a sheet-like heat transfer layer 18 formed thereon, a lead frame 17 fixed to the heat transfer layer 18, and a part of the lead frame 17. The connecting wire 20 is formed by bending the heat transfer layer 18 and the metal plate 19 substantially vertically. The connection wiring 20 is used as a connection terminal portion of another printed circuit board or an input / output cable.

  In FIG. 1, the resin structure 11 is formed by using a physical fixing means such as a screw 22, a metal plate 19 of the heat radiating board 16, and a chassis or casing of a device for fixing the heat radiating board 16 main body (both not shown). ) Physically fixed.

  In FIG. 1, a part or more of the connection wiring 20 may have a structure that penetrates the wiring hole 13 or the like formed in the resin structure 11 as necessary. With this structure, it is possible to reinforce, prevent bending, align, etc. the connection wiring 20 bent substantially vertically. By using the resin structure 11 in this way, the position dimension of the connection wiring 20 is increased.

  Further, the connection wiring 20 is prevented from contacting each other by passing through the resin structure 11.

  1 is a portion in which a part of the resin structure 11 is recessed, and the root portion of the connection wiring 20 is selectively pressed by, for example, indenting a part of the resin structure 11. Details will be described with reference to FIG.

  The recess 15b in FIG. 1 is a part of the recess of the sheet-like heat transfer layer 18. For example, a trace of the lead wire 17 fixed so as to be embedded in the heat transfer layer 18 is removed to form the connection wiring 20. Part.

  In FIG. 1 and FIGS. 3 to 10 to be described later, the lead frame 17 embeds a part or more in the heat transfer layer 18, which increases the contact area between the heat transfer layer 18 and the lead frame 17. Increase mutual heat dissipation and adhesion. Further, by embedding a part or more, even if a thick member is used by the lead frame 17, the thickness does not appear as unevenness on the surface, so that it is easy to form a solder resist (not shown).

  The lead frame 17 is not necessarily embedded in the heat transfer layer 18. The lead frame 17 may be fixed to the surface of the sheet-like or film-like heat transfer layer 18 with an adhesive or the like. Even when the lead frame 17 is fixed only by an adhesive, it is fixed double (or synergistically) with the resin structure 11 as described in the first embodiment.

  Next, the resin structure 11 will be described with reference to FIG. FIG. 2 is a perspective view illustrating an example of the resin structure 11.

  In FIG. 2, the resin structure 11 has a square shape (a shape in which the opening portion 14 is formed in the central portion), but has a linear shape, an L shape, a U shape, or the like as necessary.

  In FIG. 2, the attachment hole 12 is formed in the peripheral portion of the resin structure 11, but does not interfere with the connection wiring 20 extending from the heat dissipation substrate 16.

  In FIG. 2, the wiring hole 13 protects the connection wiring 20 extending from the heat dissipation substrate 16.

  Next, the heat dissipation board 16 will be described with reference to FIG. FIG. 3 is a perspective view showing an example of the heat dissipation board 16. In FIG. 3, the heat dissipation substrate 16 fixes the lead frame 17 on the metal plate 19 via the sheet-like heat transfer layer 18. In FIG. 3, a part of the lead frame 17 (for example, a circuit pattern portion on which a power semiconductor or the like is mounted such as a central portion of the heat dissipation substrate 16 or a power semiconductor) is not illustrated. 3, the heat transfer layer 18 inserted under the lead frame 17 (the heat transfer layer 18 fixes and insulates the lead frame 17 between the metal plates 19 thereunder) is not shown. Are omitted in the relationship). Also, solder resist and the like are not shown.

  In FIG. 3, a part of the lead frame 17 (for example, at the peripheral edge of the heat dissipation board 16) is bent so as to be substantially perpendicular to the metal plate 19 while being substantially parallel to each other. The connection wiring 20 is used. This connection wiring 20 is mechanically fixed to the heat dissipation board 16 side by the resin structure 11 in FIG. 4 described later.

  In FIG. 3, the tip of the connection wiring 20 is sharpened in order to improve the insertability into the resin structure 11 or the like. Further, a part of the lead frame 17 is omitted by hatching (a part of the lead frame 17 is also omitted in FIG. 4 described later).

  Next, a state in which the heat dissipation substrate 16 is increased in strength by using the resin structure 11 will be described with reference to FIG. FIG. 4 is a perspective view for explaining a state in which the resin structure 11 is fixed on the heat dissipation board 16 using screws 22.

  In FIG. 4, a resin structure as shown by an arrow 21 using a screw 22 or the like to a connection wiring 20 formed by bending a part of a lead frame 17 formed on the peripheral edge of the heat dissipation board 16 from a metal plate 19 substantially vertically. 11 is fixed. As a result, the lead frame 17 (especially at the base of the connection wiring 20 or near the base. The lower half from the center of the connection wiring 20 is also a part of the base) is connected to the metal plate 19 by the screw 22 or the like (further. Is protected by the resin structure 11 fixed to the chassis or casing of the device to which the metal plate 19 is fixed), and the mechanical strength is enhanced.

  As described above, the metal plate 19, the sheet-like heat transfer layer 18 formed on the metal plate 19, the lead frame 17 fixed to the heat transfer layer 18, and a part of the lead frame 17 are transferred to the heat transfer layer 18. A heat dissipation board 16 comprising a connection wiring 20 bent substantially vertically from the resin wiring 11 and a resin structure 11 for fixing a part or more of the connection wiring 20, and one of the connection wiring 20 and the resin structure 11. The heat dissipation substrate 16 is formed on the peripheral edge of the heat dissipation substrate 16, and a portion of the base portion of the connection wiring 20 is pressed against the heat transfer layer 18 by the resin structure 11. By doing so, the connection wiring 20 portion and the like that may be peeled off by an external force or the like is protected or strengthened.

  As shown in FIG. 1 and the like, an opening 14 is formed at the center of the resin structure 11, and this is an appearance inspection of a heat-generating component (not shown) mounted on the heat dissipation board 16. To use.

  In addition, wiring holes 13 and attachment holes 12 are appropriately formed in the peripheral edge portion of the resin structure 11. A recess 15a is formed in the outer peripheral portion of the wiring hole 13 (particularly, the portion visible from the outside). By forming the recess 15a, the insertion property of the connection wiring 20 into the wiring hole 13 is improved. Even after the resin structure 11 is fixed to the heat dissipation board 16, the electrical characteristics are checked by the recess 15a. In addition, the recessed part 15a is provided as needed. Further, one side surface of the wiring hole 13 may be opened by enlarging the recessed portion 15a (or the wiring hole 13 may be formed in an elongated groove shape).

  Further, by inserting the connection wiring 20 into the wiring hole 13, even if bending or distortion or the like remains in a part of the connection wiring 20, there is an effect of correcting (or aligning) the bending or distortion of the connection wiring 20. can get. As a result, in FIG. 9 described later, the insertion property of the connection wiring 20 into the wiring hole 13 formed in the printed circuit board 24 is improved.

  Furthermore, the metal plate 19 can be made thinner and lighter because the strength can be increased by using the resin structure 11. In addition, the resin structure 11 improves the reliability with respect to the heat | fever by producing with resin with high heat resistance. The resin is used for moldability into a predetermined shape (including injection molding) and weight reduction, and the resin is cheaper in terms of workability and material cost than ceramics. .

  The resin structure 11 does not need to be made of a single resin, and the strength can be increased by combining the resin structure 11 with a metal part or the like. The resin structure 11 may be divided into a plurality of parts. Thus, a resin structure 11 composed of a plurality of parts is prepared, and these may be combined to form one resin structure 11. In this way, the resin structure 11 can be generalized.

  Furthermore, by devising how to attach the resin structure 11, in addition to the tensile strength of the lead frame 17 in the heat dissipation board 16, it is possible to increase (or reinforce) the pressing strength, the twisting strength, the vibration resistance, and the like. . In addition, the filling rate of the inorganic filler or the like in the heat transfer layer 18 is increased by the amount of this reinforcing effect, and the heat dissipation performance of the heat dissipation substrate 16 is improved.

  In addition, the structure of the pressing part by the resin structure 11 and how to attach the resin structure 11 are designed in an optimum shape according to the application.

(Embodiment 2)
Next, an example of a method for manufacturing the heat dissipation substrate 16 described in the first embodiment will be described with reference to FIGS.

  5A and 5B are cross-sectional views illustrating an example of a method for manufacturing the heat dissipation substrate 16. 5A and 5B, reference numeral 23 denotes a heat transfer resin.

  First, as shown in FIG. 5A, the heat transfer resin 23 is set on the metal plate 19, and the lead frame 17 processed into a predetermined pattern shape is further set thereon. And as shown by the arrow 21, these are integrated by heat-pressing using a metal mold | die and a press (both are not shown in figure). Then, the heat transfer resin 23 is cured to form the heat transfer layer 18.

  FIG. 5B is a cross-sectional view showing a state after the heat transfer resin 23 is cured to form the heat transfer layer 18. As shown in FIG. 5B, a part of the lead frame 17 constituting the heat dissipation substrate 16 is embedded in the heat transfer layer 18. By doing so, the contact area between the lead frame 17 and the heat transfer layer 18 is increased, and the heat of the power semiconductor (not shown) mounted on the lead frame 17 is transferred from the lead frame 17 through the heat transfer layer 18. Heat is radiated to the metal plate 19. Further, the bonding strength (or peel strength) between the lead frame 17 and the heat transfer layer 18 is increased.

  Next, as indicated by an arrow 21 in FIG. 5B, a part of the lead frame 17 is bent substantially vertically from the metal plate 19 or the like to obtain the shape of FIG.

  6A and 6B are cross-sectional views illustrating an example of a method for manufacturing the heat dissipation board 16 in which the connection wiring 20 portion is reinforced.

  In FIG. 6A, a part of the lead frame 17 embedded in the heat transfer layer 18 is caused (or peeled off) to form the connection wiring 20. Here, the portion peeled off from the heat transfer layer 18 is used as a recess 15b, so that the creeping distance between the metal plate 19 and the connection wiring 20 is increased, thereby improving the insulation.

  Next, as shown in FIG. 6B, the resin structure 11 is set on the heat dissipation substrate 16, and these are fixed using screws 22 as indicated by an arrow 21.

  As shown in FIG. 6B, by forming a recess 15a in a part of the resin structure 11 (for example, a part of the outer peripheral surface or a part of the outer peripheral surface in contact with the heat dissipation substrate 16), For example, it is easy to confirm whether the lead frame 17 has been inserted into the wiring hole 13 formed in the resin structure 11.

  Next, how the connection wiring 20 part of the heat dissipation board 16 is strengthened will be described with reference to FIGS.

  7A and 7B are cross-sectional views illustrating the strengthening of the connection wiring 20 of the heat dissipation board 16. The root includes the vicinity of the root. The vicinity of the root is 10 mm or less from the bent portion of the connection wiring 20. If the distance is 10 mm or more, the effect may not be obtained.

  FIG. 7A is a cross-sectional view illustrating a state in which the connection wiring 20 formed on the heat dissipation substrate 16 is fitted into the resin structure 11. Thereafter, as indicated by an arrow 21, the resin structure 11 is mechanically fixed to the metal plate 19 or the like of the heat dissipation board 16 using screws 22 or the like.

  FIG. 7B is a cross-sectional view illustrating a state in which the resin structure 11 is fixed on the heat dissipation substrate 16 with screws 22 or the like. In the vicinity of the base of the connection wiring 20, a “pressing force” indicated by an arrow 21 is generated by the screw 22 and the resin structure 11. As a result, even when a “tensile force” as indicated by an arrow 21 is generated in the connection wiring 20, it can be canceled by the “pressing force”. As a result, no force is transmitted to the interface portion at the base of the connection wiring 20, thereby preventing the occurrence of peeling (for example, peeling at the interface between the lead frame 17 and the heat transfer layer 18).

  Next, interface peeling at the base of the connection wiring 20 will be described with reference to FIGS. FIGS. 8A and 8B are cross-sectional views illustrating interfacial peeling at the base of the connection wiring 20 of the heat dissipation board 16 in the case where the resin structure 11 is not provided.

  FIG. 8A is a cross-sectional view illustrating a case where a “tensile force” is generated in the direction indicated by the arrow 21 in the connection wiring 20 of the heat dissipation board 16.

  FIG. 8B is a cross-sectional view illustrating a state where the connection wiring 20 is peeled off from the heat dissipation substrate 16 by “tensile force”. When a very large “tensile force” is generated in a vibration test or the like, there is a possibility of peeling at the interface between the lead frame 17 and the heat transfer layer 18 as shown in FIG.

  However, in the case of the heat dissipation board 16 of the present invention, as shown in FIG. 7B and the like, a part of the heat dissipation board 16 is fixed in advance with the resin structure 11, so that the lead frame 17, the heat transfer layer 18 and Prevent peeling of the interface.

(Embodiment 3)
Next, as Embodiment 3, members used for the heat dissipation board 16 and the like will be described.

  As the lead frame 17, it is desirable to use a member having high thermal conductivity such as copper or aluminum. The thickness of the lead frame 17 is desirably 0.2 mm or more (preferably 0.3 mm or more). When the thickness of the lead frame 17 is less than 0.2 mm, the strength of the connection wiring 20 is lowered, and there is a possibility that the lead frame 17 is bent or deformed during work.

  The thickness of the lead frame 17 is preferably 10.0 mm or less (preferably 5.0 mm or less). When the thickness of the lead frame 17 exceeds 10.0 mm, there is a possibility of affecting the fine patterning of the connection wiring 20.

  In addition, even when a thick lead frame 17 (for example, 0.2 mm or more, desirably 0.3 mm or more) is used by embedding a part or more of the lead frame 17 in the heat transfer layer 18, the thickness is radiated. Since it does not appear as a step on the surface of the substrate 16, the printability of a solder resist (not shown) on the lead frame 17 is improved.

  An arrow 21 shown in FIG. 5B indicates a state in which a part of the lead frame 17 is bent so as to be substantially perpendicular to the metal plate 19. At this time, a part of the lead frame 17 is peeled off from the heat transfer layer 18 as shown in FIG. By doing so, the creepage distance (a kind of insulation distance) between the lead frame 17 (or the connection wiring 20 constituted by the lead frame 17) and the metal plate 19 (or a housing or chassis for fixing the metal plate 19). Secure.

  Next, the heat transfer resin 23 will be described. The heat transfer resin 23 is made of, for example, a resin and a filler, whereby the thermal conductivity can be increased. And the reliability is improved by using a thermosetting resin as resin.

  Here, as the inorganic filler, for example, it has a substantially spherical shape, and its diameter is suitably 0.1 μm or more and 100 μm or less (if it is less than 0.1 μm, it becomes difficult to disperse in the resin. 18 becomes thick and affects the thermal diffusivity). In this embodiment, the inorganic filler is a mixture of two types of alumina having an average particle diameter of 3 μm and an average particle diameter of 12 μm. By using alumina having two kinds of large and small particle diameters, it is possible to fill the gaps between the large particle diameters of alumina with small particle diameters, so that alumina can be filled at a high concentration to nearly 90% by weight. As a result, the heat conductivity of these heat transfer layers 18 is about 5 W / (m · K).

  The inorganic filler is at least one selected from the group consisting of alumina, magnesium oxide, boron nitride, silicon oxide, silicon carbide, silicon nitride, and aluminum nitride, zinc oxide, silica, titanium oxide, tin oxide, and zircon silicate. It is desirable from the viewpoint of thermal conductivity and cost.

  In addition, when using a thermosetting resin, what contains at least 1 type of thermosetting resin chosen from the group of an epoxy resin, a phenol resin, cyanate resin, a polyimide resin, an aramid resin, and PEEK resin is desirable. This is because these resins are excellent in heat resistance and electrical insulation.

  On the other hand, in order to further improve the heat dissipation of the heat transfer layer 18, it is necessary to increase the content of the inorganic filler. As a result, the content of the thermosetting resin in the heat transfer layer 18 may be reduced. is there. And when the content rate of the thermosetting resin in the heat-transfer layer 18 is reduced, the adhesive force between the heat-transfer layer 18 and the lead frame 17 may fall. As a result, there is a possibility that the interface between the heat transfer layer 18 and the lead frame 17 in the heat dissipation substrate 16 may be peeled off.

  In such a case, as shown in FIGS. 7A and 7B, the lead frame 17 (especially, the connection wiring between the lead frame 17 and the heat transfer layer 18 near the root of the connection wiring 20) is formed by the resin structure 11. By adopting a structure that is physically pressed against the heat transfer layer 18 side, the physical strength of the portion can be increased, and peeling at the interface between the heat transfer layer 18 and the lead frame 17 in the heat dissipation substrate 16 can be prevented.

(Embodiment 4)
Next, as a fourth embodiment, a state in which a vertical multiple substrate is formed by combining a printed circuit board with the heat dissipation substrate described in the first embodiment will be described.

  FIG. 9 is a perspective view for explaining how the printed circuit board is fixed on the heat dissipation substrate 16 reinforced with the resin structure 11. In FIG. 9, 24 is a printed circuit board, 25 is a general electronic component, and 26 is a vertical multiple circuit board.

  In FIG. 9, the connection wiring 20 formed on the heat dissipation substrate 16 protects the base and the periphery thereof with the resin structure 11. Then, the resin structure 11 is firmly fixed to the metal plate 19 and the casing under the screws 22 and the like. Then, as shown by the arrow 21, the wiring hole 13 formed in the printed circuit board 24 is set in the connection wiring 20 to obtain a vertical multiple substrate 26.

  Thus, the metal plate 19, the sheet-like heat transfer layer 18 formed thereon, the lead frame 17 fixed to the heat transfer layer 18, and a part of the lead frame 17 are substantially perpendicular to the heat transfer layer 18. A connection wiring 20 formed by bending, a resin structure 11 that fixes a part or more of the connection wiring 20, a heat dissipation board 16 portion, and a printed circuit board 24 portion. At least a part of the connecting wire 20 is pressed against the heat transfer layer 18 by the resin structure 11 and the tip of the connection wiring 20 (the tip is the portion above the center of the connection wiring 20. A vertical multiple substrate 26 in which a part or more of the portion below the center portion is a portion constituting the base of the connection wiring 20 is connected to the printed circuit board 24 portion is formed.

  In order to handle a large current exceeding 100 A, such as a power transistor and a power semiconductor, a power element that generates heat is fixed to the heat dissipation substrate 16 side. Further, the general electronic component 25 that controls the power element or the like and does not generate heat is fixed to the printed circuit board 24 side. Then, the heat dissipation board 16 and the printed board 24 are connected in a multiple state in a vertical direction (or vertical direction). Then, this vertical connection is made by the connection wiring 20 formed by bending the lead frame 17, which is the wiring pattern of the heat dissipation board 16, substantially vertically, thereby shortening the length of wiring between the circuits (also called the line length). Therefore, the noise resistance of the completed circuit is improved. This is because the connection wiring 20 or the like is less likely to become an antenna that picks up external noise because the line length is shortened.

  Next, the manner in which the strength of the vertical multiple substrate 26 is increased using the resin structure 11 will be described with reference to FIG.

  FIG. 10 is a cross-sectional view for explaining a mechanism for increasing the strength of the vertical multiple substrate 26 using the resin structure 11. In FIG. 10, reference numeral 27 denotes solder, which connects a through hole or the like formed in the printed circuit board 24 and the connection wiring 20.

  The printed board 24 may be a multilayer printed board 24, and the wiring hole 13 may be a through hole (including through hole plating). In FIG. 10, copper foil patterns, through holes, and the like formed on the surface layer and inner layer of the printed circuit board 24 are not shown.

  When the wiring hole 13 of the printed circuit board 24 is connected to the connection wiring 20 inserted therein by the solder 27, the extra solder 27 may hang down or flow downward. In such a case, the flow of the solder 27 can be controlled and visually inspected by forming a gap between the printed circuit board 24 and the resin structure 11 as shown in FIG.

  FIG. 10A illustrates a state in which the resin structure 11 is fixed to the heat dissipation board 16 together with the printed circuit board 24 with the screws 22. As shown in FIG. 10 (A), the printed circuit board 24 is also directly fixed to the chassis of a device for fixing the metal plate 19 or the metal plate 19 with screws 22 or the like (for example, called a fool hole or the like in the metal plate 19). In addition, a fool hole is one of the machine terms also called a clearance hole, and a through bolt includes a hole for inserting an embedded bolt or the like), thereby increasing the mounting strength of the printed circuit board 24. . Further, the screws 22 can increase the strength of the connection wiring 20 as well as the printed circuit board 24. As a result, even if the “tensile force” indicated by the arrow 21 is generated in the connection wiring 20, the connection wiring 20 is canceled by the “pressing force” indicated by the arrow 21.

  FIG. 10B is a cross-sectional view illustrating a case where the printed circuit board 24 is separated from the resin structure 11. In FIG. 10B, the printed circuit board 24 is fixed using the connection wiring 20 of the heat dissipation board 16 partially reinforced with the resin structure 11. By doing so, even if a “tensile force” is generated on the printed circuit board 24 side, the “pressing force” by the screw 22 or the like presses the resin structure 11 on the heat radiating substrate 16 side. Counteract.

  The heat of the power semiconductor or the like spreads through the lead frame 17 (or the lead frame 17 as a kind of heat spreader) and spreads to the heat radiating metal plate 19 through the heat transfer layer 18 having excellent thermal conductivity. As a result, the heat generated by the power semiconductor or the like is difficult to be transmitted to the printed circuit board 24, so that the thermal influence on the general electronic component 25 mounted on the printed circuit board 24 is suppressed.

  In addition, the connection wiring 20 can be positioned with high accuracy using the resin structure 11, and the connectivity of the plurality of connection wirings 20 to the printed circuit board 24 is improved.

  It should be noted that the attachment position of the screw 22 may be an optimum position according to the size and shape of the circuit module. In addition, the strength and vibration resistance are improved by designing the mounting position of the screw 22 and the shape of the resin structure 11 to optimum values according to various components mounted on the multiple vertical boards.

  The fixing method of the resin structure 11 is not limited to the screw 22 but may be a structure formed on a part of the resin structure 11 (for example, a claw structure, a hook structure, a wedge structure, etc.). Needless to say.

  In addition, although the power semiconductor etc. which were mounted in the thermal radiation board | substrate 16 can be visually inspected by forming the opening part 14 in the center part etc. of the resin structure 11, it is necessary to form the opening part 14 in the resin structure 11 necessarily. There is no.

  In addition, by using the resin structure 11 (further fixing the resin structure 11 with screws 22 or the like, the entire heat dissipation board 16 is structurally a kind of ramen structure (ramen means a frame in German)) Since the resin structure 11 can be easily replaced, it is easy to replace, maintain, replace, etc. Increase sex.

  As described above, the metal plate 19, the sheet-like heat transfer layer 18 formed thereon, the lead frame 17 fixed to the heat transfer layer 18, and a part of the lead frame 17 are combined with the heat transfer layer. 18 is a heat dissipation board 16 including a connection wiring 20 bent substantially vertically from 18 and a resin structure 11 that fixes a part or more of the connection wiring 20, and includes the connection wiring 20 and the resin structure 11. A part or more is formed in the peripheral part of the heat dissipation board 16, and a part of the base part of the connection wiring 20 is pressed against the heat transfer layer 18 by the resin structure 11. By providing the above, it is possible to provide the heat dissipation substrate 16 that can cope with severe conditions such as in-vehicle use.

  A metal plate 19, a lead frame 17 fixed thereon using a sheet-like heat transfer layer 18, a connection wiring 20 formed by bending a part of the lead frame 17 from the heat transfer layer 18 substantially vertically, A heat dissipation board 16 comprising a resin structure 11 for fixing a part or more of the connection wiring 20, wherein the connection wiring 20 and the resin structure 11 are formed on two or more sides of the heat dissipation board 16. In addition, by making a part or more of the base portion of the connection wiring 20 the heat dissipation substrate 16 pressed against the heat transfer layer 18 by the resin structure 11, the resin structure 11 itself has high strength. Provided is a heat dissipating board 16 that can handle severe conditions such as in-vehicle use.

  A metal plate 19, a sheet-like heat transfer layer 18 formed thereon, a lead frame 17 fixed to the heat transfer layer 18, and a part of the lead frame 17 are bent substantially vertically from the heat transfer layer 18. Connecting wiring 20 and a resin structure 11 that fixes a part or more of the connecting wiring 20, a heat dissipation substrate 16 portion, and a printed circuit board 24 portion. Part or more is pressed against the heat transfer layer 18 by the resin structure 11 and part or more of the tip of the connection wiring 20 is a vertical multiple substrate 26 connected to the printed circuit board 24 part. As a result, the heat dissipation board 16 and the printed board 24 can be brought close to each other while suppressing the thermal influence, so that the power supply module and the circuit module can be reduced in size and increased in strength.

  A metal plate 19, a lead frame 17 fixed thereon using a sheet-like heat transfer layer 18, a connection wiring 20 formed by bending a part of the lead frame 17 from the heat transfer layer 18 substantially vertically, The resin structure 11 for fixing a part or more of the connection wiring 20, and a heat dissipation board 16 portion, and a printed board 24 portion fixed so as to be substantially parallel to the heat dissipation substrate 16 portion, A part or more of the root part of the connection wiring 20 is pressed against the heat transfer layer 18 by the resin structure 11, and a part or more of the tip part of the connection wiring 20 is connected to the printed circuit board 24. By using the multiple substrate 26, it is possible to reduce the size and strength of the power supply module, the circuit module, and the like.

  A step of fixing the lead frame 17 on the metal plate 19 using the sheet-like heat transfer layer 18 and a step of bending a part of the lead frame 17 substantially vertically from the heat transfer layer 18 to form the connection wiring 20. And a step of pressing a part of the root portion of the lead frame 17 against the heat transfer layer 18 side using the resin structure 11; a step of fixing the resin structure 11 to the metal plate 19; The heat dissipation substrate 16 having high mechanical strength can be stably manufactured by the method for manufacturing the heat dissipation substrate 16 having the above.

  A step of fixing the lead frame 17 on the metal plate 19 using the sheet-like heat transfer layer 18 and a step of bending a part of the lead frame 17 substantially vertically from the heat transfer layer 18 to form the connection wiring 20. And a step of pressing a part or more of the root portion of the lead frame 17 against the heat transfer layer 18 side using the resin structure 11, and a step of fixing the resin structure 11 to the metal plate 19. The manufacturing method of the vertical multiple substrate 26 including the step of connecting the printed circuit board to the connection wiring 20 can stably manufacture the heat dissipation substrate 16 having high mechanical strength.

  As described above, the heat dissipation substrate according to the present invention, the vertical multiple substrate using the same, and the manufacturing method thereof can increase the strength of the heat dissipation substrate. Can be realized.

The perspective view which shows an example of the resin structure used in order to make the connection wiring part of a thermal radiation board high-intensity A perspective view illustrating an example of a resin structure A perspective view showing an example of a heat dissipation board The perspective view explaining a mode that a resin structure is fixed on a heat sink using a screw. (A) (B) is sectional drawing explaining an example of the manufacturing method of a heat sink. (A) (B) is sectional drawing explaining an example of the manufacturing method of the heat sink which strengthened the connection wiring part together (A) (B) is sectional drawing explaining reinforcement of the connection wiring 20 of a heat sink. (A) (B) is sectional drawing explaining the interface peeling in the root of the connection wiring 20 of the thermal radiation board | substrate 16 when there is no resin structure The perspective view explaining a mode that a printed circuit board is fixed on the heat sink reinforced with the resin structure part Sectional view explaining the mechanism of increasing the strength of a vertical multiple substrate using a resin structure Sectional drawing which shows an example of the conventional heat sink

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Resin structure 12 Mounting hole 13 Wiring hole 14 Opening part 15a, 15b Recessed part 16 Heat dissipation board 17 Lead frame 18 Heat transfer layer 19 Metal plate 20 Connection wiring 21 Arrow 22 Screw 23 Heat transfer resin 24 Printed circuit board 25 General electronic component 26 Vertical multiple substrate 27 Solder

Claims (6)

A metal plate, a sheet-like heat transfer layer formed thereon, a lead frame fixed to the heat transfer layer, and a connection wiring formed by bending a part of the lead frame substantially vertically from the heat transfer layer; A resin structure that fixes a part or more of the connection wiring, and a heat dissipation board,
A part or more of the connection wiring and the resin structure are formed on the peripheral edge of the heat dissipation substrate,
A heat dissipation board in which a part or more of a base portion of the connection wiring is pressed against the heat transfer layer by the resin structure. A metal plate, a lead frame fixed thereon using a sheet-like heat transfer layer, a connection wiring formed by bending a part of the lead frame substantially vertically from the heat transfer layer, and a part of the connection wiring A heat dissipation substrate comprising a resin structure for fixing the above,
The connection wiring and the resin structure are formed on two or more sides of the heat dissipation substrate,
A heat dissipation board in which a part or more of a base portion of the connection wiring is pressed against the heat transfer layer by the resin structure. A metal plate, a sheet-like heat transfer layer formed thereon, a lead frame fixed to the heat transfer layer, and a connection wiring formed by bending a part of the lead frame substantially vertically from the heat transfer layer; A resin structure that fixes a part or more of the connection wiring, and a heat dissipation substrate portion,
A printed circuit board unit, and
Part or more of the base portion of the connection wiring is pressed against the heat transfer layer by the resin structure,
A vertical multiple substrate in which a part or more of the front end portion of the connection wiring is connected to the printed circuit board portion. A metal plate, a lead frame fixed thereon using a sheet-like heat transfer layer, a connection wiring formed by bending a part of the lead frame substantially vertically from the heat transfer layer, and a part of the connection wiring A resin structure for fixing the above, and a heat dissipation substrate portion,
A printed circuit board part fixed so as to be substantially parallel to the heat dissipation board part, and
Part or more of the base portion of the connection wiring is pressed against the heat transfer layer by the resin structure,
A vertical multiple substrate in which a part or more of the tip of the connection wiring is connected to the printed circuit board. Fixing a lead frame on a metal plate using a sheet-like heat transfer layer;
A step of bending a part of the lead frame substantially perpendicularly from the heat transfer layer and connecting wiring;
Using a resin structure, a step of pressing a part of the lead frame against the heat transfer layer side;
Fixing the resin structure to the metal plate;
A method for manufacturing a heat dissipation board. Fixing a lead frame on a metal plate using a sheet-like heat transfer layer;
A step of bending a part of the lead frame substantially perpendicularly from the heat transfer layer and connecting wiring;
Using a resin structure, a step of pressing a part or more of the lead frame against the heat transfer layer side;
Fixing the resin structure to the metal plate;
Connecting a printed circuit board to the tip of the connection wiring; and
A method for manufacturing a vertical multiple substrate having:

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