JP2009188307A - Circuit module and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem wherein the fixation force of an odd-shaped component, or the like is small, and a thick circuit conductor fixed to an insulating substrate comes off in a conventional thermal dissipation substrate. <P>SOLUTION: In a circuit module, not less than one portion of the odd-shaped component 15 is fixed to a resin structure 11, and the resin structure 11 is directly fixed to a metal plate 21 by a screw 23, or the like, thus tightly fixing even the odd-shaped component 15 having low mounting properties or a large weight to the resin structure, improving vibration-resistance properties of the odd-shaped component 15, and locally increasing the adhesion strength between a lead frame 19 and a heat transfer layer 20. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a circuit module used in a hybrid car including a mild hybrid car and an industrial device, and a manufacturing method thereof.

  In recent years, hybrid cars and various industrial devices that achieve low power consumption by accumulating regenerative power during braking in an electric double layer capacitor or the like have attracted attention.

  Such a device requires a circuit module that handles a large current, such as a DCDC converter that controls a large current exceeding 100 A with high accuracy (herein, DCDC means a converter that converts a DC input into a DC output). The power semiconductor and the like used for these are mounted on a heat dissipation board corresponding to heat dissipation and a large current to constitute a circuit module. Here, the circuit module is a voltage converter with a large current of 50 A or more, including a power supply module, a DCDC converter, and the like.

  Such a circuit module includes a heat dissipation board portion on which a power semiconductor or the like is mounted, a circuit board portion on which a general electronic component that controls the power semiconductor or the like is mounted, and a surface mount (so-called SMD mounting) such as a coil, transformer, capacitor, or leaded component In addition, it is composed of difficult-to-form deformed parts (including deformed parts such as columnar, coin-shaped, cube and heavy parts).

  Then, it is necessary to install a circuit board on which various electronic components such as a semiconductor chip for controlling the power semiconductor and the odd-shaped parts are mounted at high density as close as possible to the circuit module on which the power semiconductor is mounted. This is to reduce the size of the circuit module and to prevent circuit noise.

  In a circuit module having such deformed parts, fixing the deformed parts is an important issue.

  FIG. 14 is a cross-sectional view illustrating an example of a conventional circuit module in which odd-shaped parts having different heights are mounted. In FIG. 14, a flat thick circuit conductor 2 and a stepped thick circuit conductor 3 are formed on the surface of the insulating substrate 1. The odd-shaped parts 4a and 4b are parts that are difficult to surface-mount and have different heights. The deformed component 4 b is mounted on the flat thick circuit conductor 2, and the low-profile deformed component 4 a is mounted on the stepped thick circuit conductor 3 using the screws 7 through the holes 5. Further, the heat generated in the odd-shaped parts 4a and 4b is diffused to the heat sink 6 for fixing them as indicated by an arrow 8.

For example, Patent Document 1 is known as prior art document information relating to the invention of this application.
Japanese Patent No. 2786343

  However, in the conventional circuit module shown in FIG. 14, it is necessary to fix at least one surface of the deformed parts 4a and 4b to the heat sink 6 or the like. Further, fixing to the heat sink 6 becomes difficult depending on the number and shape of the odd-shaped parts 4a and 4b.

  As a result, in the conventional deformed component mounting structure, when a tensile force is transmitted from the outside to the insulating substrate 1 or the like, the screw 7 is broken, the deformed components 4a and 4b are deformed, or the deformed components 4a and 4b themselves are heat sinks. There was a problem of peeling off from 6.

  In addition, it is difficult to install adjacent circuit boards on which power semiconductors and general electronic parts for controlling the odd-shaped parts 4a and 4b are mounted.

  In order to solve the above problems, the present invention provides a metal plate, a sheet-like heat transfer layer formed on the metal plate, a lead frame fixed to the heat transfer layer, and a part of the lead frame. A connection wiring that is bent substantially vertically from the heat transfer layer, a resin structure that fixes a part or more of the connection wiring, and a deformed part, and a part or more of the deformed part is the resin structure The circuit module is fixed to the body.

  As described above, according to the present invention, a deformed part is fixed to at least a part of a deformed part such as a coil, a transformer (including a choke transformer), a capacitor (including an electrolytic capacitor and an electric double layer capacitor), and a leaded part. By fixing directly to the resin structure having such a shape, even deformed parts of various shapes, weights, and quantities can be firmly fixed without affecting the heat dissipation substrate side.

  In addition, by using a resin structure in which a part or more of the odd-shaped parts is fixed, the connection wiring part consisting of a part of the lead frame that constitutes the heat dissipation board is fixed, so that from the connection wiring part or the heat transfer layer of the lead frame itself As well as increasing the peel strength, the heat dissipation substrate itself is increased in strength. This is to increase the tensile strength of the lead frame sandwiched between the resin structure and the metal plate by directly attaching the resin structure to the metal plate using a screw or a fixing jig.

  In addition, a circuit board on which general electronic components that control power semiconductors, etc., mounted on a heat dissipation board can be installed in parallel with the heat dissipation board, and a circuit module including the circuit board can be produced. Miniaturization and improved noise resistance. The electrical connection of the odd-shaped parts may be connected to the heat dissipation board.

  Note that some of the manufacturing steps shown in the embodiments of the present invention are performed using a molding die or the like. However, the molding die is not shown unless it is necessary for explanation. Further, the drawings are schematic views and do not show the positional relations in terms of dimensions.

(Embodiment 1)
Hereinafter, the structure of the circuit module according to the first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view illustrating the configuration of a circuit module. In FIG. 1, 11 is a resin structure, 12 is a mounting hole, 13 is a wiring hole, 14 is a dotted line, 15 is a deformed part, 16 is a mounting jig, 17 is an arrow, 18 is a heat dissipation board, 19 is a lead frame, 20 Is a heat transfer layer, 21 is a metal plate, 22 is a connection wiring, 23 is a screw, 24 is a circuit board, and 25 is an electronic component.

  In FIG. 1, the circuit board 24 is not an essential element. This is because the circuit module is configured without including the circuit board 24.

  In FIG. 1, a mounting hole 12 for fixing the resin structure 11 to the heat dissipation board 18 and a connection wiring 22 that is a part of the lead frame 19 of the heat dissipation board 18 are protected on the outer periphery of the resin structure 11 and the like. A wiring hole 13 is formed for this purpose.

  In FIG. 1, the wiring composed of the lead frame 19, the power semiconductor mounted thereon, the solder resist, etc. are not shown.

  A deformed part 15 is fitted into a concave portion (not shown) formed in a predetermined portion (for example, the central portion) of the resin structure 11 (shown by a dotted line 14), and the mounting jig 16 is fixed. In this way, a part or more of the odd-shaped part 15 is fixed to the resin structure 11.

  For fixing the deformed component 15 to the resin structure 11, the mounting jig 16 can be omitted by devising the mounting structure (or fitting structure) of the deformed component 15 of the resin structure 11.

  In FIG. 1, the heat dissipation board 18 includes a metal plate 21, a sheet-like heat transfer layer 20 formed thereon, a lead frame 19 fixed to the heat transfer layer 20, and a part of the lead frame 19. The connection wiring 22 protrudes from the heat transfer layer 20.

  The connection wiring 22 is bent substantially perpendicularly from the heat transfer layer 20 because it protrudes through the wiring hole 13 formed in the resin structure 11 and is connected to the circuit board 24 as indicated by an arrow 17. It is. As described above, the lead frame 19 may be bent substantially vertically at the optimal portion (for example, the peripheral portion) of the heat dissipation substrate 18 to form the connection wiring 22, and it is not necessary to bend all the peripheral portions (or all four sides). . A part of the lead frame 19 at the peripheral edge may be protruded from the heat radiating board 18 as it is without being bent substantially vertically (while being substantially parallel to the heat transfer layer 20).

  In FIG. 1, an arrow 17 toward the attachment hole 12 indicates a state in which the resin structure 11 in which a part or more of the deformed component 15 is fixed on the heat dissipation substrate 18 is fixed by the screw 23.

  Further, a part of the resin structure 11 fixed by the screw 23 strongly presses the lead frame 19 and a part of the connection wiring 22 (or the root of the connection wiring 22 or the vicinity of the root bent substantially vertically). Increase overall strength.

  Further, the electronic component 25 (for example, a control semiconductor) mounted on the surface of the circuit board 24 is connected to the power semiconductor or the like (not shown) mounted on the heat dissipation board 18 via the connection wiring 22 (or the shortest distance). Because it is connected by the line length), it is not affected by noise.

  Thus, the metal plate 21, the sheet-like heat transfer layer 20 formed on the metal plate 21, the lead frame 19 fixed to the heat transfer layer 20, and a part of the lead frame 19 are removed from the heat transfer layer 20. A connection wiring 22 bent substantially vertically, a resin structure 11 for fixing a part or more of the connection wiring 22, a deformed component 15, and a circuit board 24 fixed substantially parallel to the metal plate 21. A part or more of the deformed part 15 is fixed to the resin structure 11, and a part or more of the connection wiring 22 realizes a circuit module connected to the circuit board 24.

  Next, an example of a method for fixing the deformed component 15 to the resin structure 11 will be described with reference to FIG. FIGS. 2A and 2B are perspective views illustrating a state in which a part or more of the deformed component 15 is fixed using the resin structure 11. In FIGS. 2A and 2B, reference numeral 26 denotes a recess.

  FIG. 2A shows a state where the deformed component 15 is fixed to one surface of the resin structure 11. As shown by the arrow 17 in FIG. 2A, the deformed component 15 is set in the recess 26 of the resin structure 11 in which the recess 26 has been formed in advance. The recess 26 uses not only the recessed portion but also a recess, a frame, a mounting hole, a fixing hole, and the like necessary for fixing the deformed component 15 by using the good moldability of the resin structure 11 in advance. it can. Thereafter, as shown in FIG. 2 (B), the fixing jig 16 is set on the deformed part 15, thereby fixing the deformed part 15 firmly. A dotted line 14 in FIG. 2B indicates a part or more of the embedded deformed part 15.

  The mounting jig 16 may be a metal plate or the like (including a spring-like metal piece), or may be a resin plate or a resin molded body. Alternatively, a plurality of resin structures 11 may be prepared, and the deformed parts 15 may be sandwiched therebetween to be fixed. As described above, the resin structure 11 (or a part thereof) may be used as the mounting jig 16 (or used as the mounting jig 16). Further, it is possible to cope with the problem by devising the shape of the resin structure 11 (for example, by forming a lid-shaped molded body at the same time).

  Thereafter, as shown in FIG. 2B, the resin structure 11 is attached to a metal plate 21 (not shown) using screws 23 or the like.

  FIG. 3 is a perspective view for explaining a state in which the resin structure 11 to which the odd-shaped part 15 is attached is fixed to the heat dissipation board 18 using the screws 23.

  In FIG. 3, since the resin structure 11 is used to fix the deformed component 15, the deformed component 15 may be a plurality of deformed components 15 or deformed components 15 having various different external shapes (further, a plurality of deformed components 15. However, it can be fixed to the resin structure 11.

  In FIG. 3, the wiring hole 13 formed in the resin structure 11 protects the connection wiring 22 of the heat dissipation board 18. Further, a part of the resin structure 11 increases the adhesion strength by pressing the base of the connection wiring 22 against the heat radiating substrate side (that is, the pressing force by the screw 23 is applied to the lead frame 19 via the resin structure 11). As a result, the lead frame 19 is strongly pressed against the heat transfer layer 20 by the pressing force of the screw 23, and the lead frame 19 is not peeled off.

  In addition to the mounting jig 16, the deformed component 15 may be attached to the resin structure 11 by processing the resin structure 11 itself (in addition to the mounting hole 12, a mounting groove, a fitting structure, or the like). And the recessed part 26 which fixes the deformed component 15 in the resin structure 11 is a part which a part or more of the deformed component 15 in the resin structure 11 touches. The concave portion 26 for fixing the deformed component 15 includes a mounting portion of the mounting jig 16 for the deformed component 15 (for example, a dotted line portion 14 in FIG. 2A), and a structure portion for fixing the mounting jig 16. (In the case where the mounting jig 16 is fixed using holes, protrusions, or the like, such holes, protrusions, and the vicinity thereof are also included in the structure part. These parts are not shown). This is because the fixing portion of the mounting jig 16 (including the mounting portion as well as the vicinity thereof) is also a structural portion for fixing the deformed component 15 (further considered to be a part of the recess 26).

  Thus, on the resin structure 11 side, the mounting recess 26 according to the shape of the odd-shaped part 15 (note that the shape does not have to be limited to a hollow shape. A plurality of convex structures are combined to form a recess. It is possible to cope with various shapes of the deformed component 15 by forming a structure portion (which may be 26). In addition, the resin structure 11 can be produced by using a commercially available thermoplastic resin that can be injection-molded (desirably, a high-strength resin material such as engineering plastic or liquid crystal polymer).

  The deformed part 15 fixed to the resin structure 11 will be described. The deformed part 15 is also applicable even if it has a large mass (for example, 5 g or more. In the case of a light deformed part 15 of less than 5 g, it may be directly fixed on the heat dissipation board 18). Parts that are difficult to mount with SMD, such as coils, transformers, capacitors, and leaded parts, are also shaped parts 15 (the shape of the shaped parts 15 is a cylinder, a coin, a cube, etc.).

  When a plurality of deformed parts 15 or heavy deformed parts 15 are fixed, they are fixed at an optimal position such as near the center of the circuit module or at an optimal balance position.

  Thus, the shape of the resin structure 11 (including the thickness of the resin structure 11) is designed in consideration of the size, shape, number, weight, and the like of the deformed component 15 to be mounted.

  FIG. 4 is a perspective view for explaining a state in which the resin structure 11 to which the odd-shaped part 15 is attached is fixed to the heat radiating board 18 with screws 23.

  As shown in FIG. 4, a part or more of the connection terminals protrude from the resin structure 11 so that the circuit board 24 to be mounted thereon is mounted. Thereafter, as shown in FIG. 1, a circuit board 24 is mounted to form a circuit module.

(Embodiment 2)
Next, an example of a method for manufacturing a heat dissipation board used in the circuit module described in Embodiment 1 will be described with reference to FIGS.

  5A and 5B are cross-sectional views illustrating an example of a method for manufacturing the heat dissipation substrate 18. In FIG. 5A, 27 is a heat transfer resin.

  First, as shown in FIG. 5A, the heat transfer resin 27 is set on the metal plate 21, and the lead frame 19 processed into a predetermined pattern shape is set thereon. And as shown by the arrow 17, these are integrated by heat-pressing using a metal mold | die and a press (both are not shown in figure). Then, the heat transfer resin 27 is cured to form the heat transfer layer 20.

  FIG. 5B is a cross-sectional view showing a state after the heat transfer resin 27 is cured to form the heat transfer layer 20. As shown in FIG. 5B, the lead frame 19 constituting the heat dissipation substrate 18 is embedded in the heat transfer layer 20 at least a part thereof, thereby increasing the contact area between the lead frame 19 and the heat transfer layer 20. The heat of the power semiconductor (not shown) mounted on the surface of the lead frame 19 can be easily radiated from the lead frame 19 to the metal plate 21 via the heat transfer layer 20. Further, an effect of increasing the bonding strength (or peel strength) between the lead frame 19 and the heat transfer layer 20 is obtained.

  Even when a thick lead frame 19 (for example, 0.2 mm or more, desirably 0.3 mm or more) is used by embedding a part or more of the lead frame 19 in the heat transfer layer 20 in the heat dissipation substrate 18, Since the thickness does not appear as a step on the surface of the heat dissipation substrate 18, an effect of improving the printability of a solder resist (not shown) on the lead frame 19 is obtained.

  An arrow 17 shown in FIG. 5B indicates a state in which a part of the lead frame 19 is bent so as to be substantially perpendicular to the metal plate 21. As shown in FIG. 6A described later, a part of the lead frame 19 is peeled off from the heat transfer layer 20 so as to be substantially vertical. By doing so, the creepage distance (a kind of insulation distance) between the lead frame 19 (or the connection wiring 22 constituted by the lead frame 19) and the metal plate 21 (or a housing or chassis for fixing the metal plate 21). Secure.

  FIG. 6 is a cross-sectional view showing the heat dissipation substrate 18 and the resin structure 11. As shown in FIG. 6, a part of the lead frame 19 protrudes substantially in parallel with the heat transfer layer 20, and is bent and protruded substantially vertically.

  Thereafter, a separately prepared resin structure 11 is set on the heat dissipation substrate 18 as indicated by an arrow 17. At this time, the connection wiring 22 of the heat dissipation board 18 is inserted into the wiring hole 13 formed in the resin structure 11.

  In addition, the deformed component 15 is set in the recess 26 formed in a part of the resin structure 11 as indicated by an arrow 17. And it fixes with the attachment jig 16 grade | etc.,.

  The screws 23 in FIG. 6 are for fixing the resin structure 11 to the heat dissipation board 18.

  In FIG. 6, reference numerals 28a and 28b denote openings. A creeping distance is obtained by forming an opening 28b (a groove formed by peeling the lead frame 19) in a part of the heat dissipation substrate 18.

  Further, by forming the opening 28a in a part of the resin structure 11, the fixing property of the resin structure 11 to the heat dissipation substrate 18 is improved, and further visual inspection or the like is facilitated.

  As described above, the opening 28 a is formed by opening at least one side surface of the wiring hole 13 formed in the resin structure 11. Thus, the contact state between the resin structure 11 and the lead frame 19 is adjusted by the opening 28 a formed in a part of the resin structure 11. As shown in FIGS. 9 and 10 to be described later, even if the heat dissipation substrate 18 is warped or undulated, by providing the opening 28a, it is ensured on the side where the opening is not provided (that is, the lead frame 19 side). The resin structure 11 and the lead frame 19 are in contact with each other.

  FIG. 7 is a cross-sectional view for explaining a state in which the resin structure 11 to which a part or more of the odd-shaped part 15 is fixed is fixed. By using the mounting jig 16 to fix the deformed component 15, the mechanical strength is increased. And the resin structure 11 is fixed to the thermal radiation board 18 with the screw | thread 23 (it is desirable to attach to the metal plate 21).

  In FIG. 7, the resin structure 11 in which a part or more of the deformed component 15 is fixed in advance is set on the heat dissipation substrate 18 and fixed with screws 23 or the like. Thereafter, the circuit board 24 is fixed. The order is also changed according to the application.

  FIG. 8 is a cross-sectional view showing a state in which the resin structure 11 is fixed to the heat dissipation board 18 with screws 23. As shown in FIG. 8, workability is improved by fixing the heat dissipation board 18 and the resin structure 11 before mounting the circuit board 24. Further, the wiring hole 13 formed in the resin structure 11 corrects the bending, warping, distortion, and the like of the connection wiring 22.

  FIG. 9 is a cross-sectional view showing how the circuit board 24 is set. As shown in FIG. 9, the connection wiring 22 is inserted into the wiring hole 13 formed in the circuit board 24 and fixed with solder 29. Further, the resin structure 11 is physically firmly fixed to the metal plate 21 (further, the housing and chassis of the device to which the metal plate 21 is fixed. The housing and chassis are not shown) by the screw 23. .

  FIG. 10 is a cross-sectional view showing a state in which the circuit board 24 is fixed. In FIG. 10, 29 is solder. As shown in FIG. 10, by providing a gap between the circuit board 24 and the resin structure 11, the solder 29 is attached to the connection wiring 22 and the like (including evaluation of solder flow and solder amount). To do.

  An arrow 17 in FIG. 10 indicates a force with which the screw 23 fixes the resin structure 11. By screwing the resin structure 11 in this way, the lead frame 19 which is a part of the heat dissipation board 18 is also fixed at the same time.

  In FIG. 10, the terminal portion of the resin structure 11 (the terminal portion also includes a lead wire for connection. These are not shown) is extended to the mounting jig 16 side (or through a gap of the mounting jig 16). It is fixed to the circuit board 24 (or the connecting lead wires may be electrically connected to the holes formed in the circuit board 24 by insertion soldering (note that these are not shown). In this way, the deformed component 15 fixed to the resin structure 11 and the circuit board 24 are electrically connected.

  In FIG. 10, the odd-shaped part 15 is embedded in the resin structure 11, but it may be embedded completely or partially so as to be exposed. Moreover, the attachment jig | tool 16 can be abbreviate | omitted by sandwiching the deformed component 15 between the some resin structures 11. FIG.

  FIG. 11 is a cross-sectional view for explaining how the vibration resistance is improved by fixing the resin structure 11 to the metal plate 21 or the like with the screw 23. When vibration is applied to the circuit module shown in FIG. 11 from the outside, a force indicated by an arrow 17 is generated in the deformed component 15. The force indicated by the arrow 17 in FIG. 11 can be canceled out by the force indicated by the arrow 17 shown in FIG. 10 (attachment force by the screw 23) and is not directly transmitted to the lead frame 19 in FIG.

  Thus, the peeling force (for example, the arrow 17) by the deformed component 15 is canceled by the screw 23, and the resin structure 11 is not detached.

  In FIG. 11, the resin structure 11 and the heat dissipation substrate 18 may be in direct contact with each other, or a cushioning material (or vibration absorber) such as rubber or sponge may be sandwiched therebetween. Further, in order to increase the strength of the resin structure 11, a part thereof may be a ramen structure (Rahmen. Meaning of a frame in German, consisting of a column and a beam), and a crosspiece or a beam may be provided (not shown) ). Moreover, you may reinforce a required part with a metal etc.

Furthermore, by forming a large attachment hole 12 called a fool hole or the like in the metal plate 21, the resin structure 11 itself is attached to the casing or chassis of the device. As a result, the number of mounting steps can be reduced, and more powerful fixing is possible. Here, the fool hole is one of machine terms also called a clearance hole, and includes a hole for inserting a through bolt or a buried bolt.

  12A and 12B are cross-sectional views illustrating a case where the resin structure 11 is not used. In FIG. 12A, the odd-shaped component 15 is directly attached to the heat radiating substrate 18 using the attachment jig 16. If vibration (or external force) as shown by the arrow 17 is applied in this state, the odd-shaped component 15 or the mounting jig 16 may be detached from the heat dissipation substrate 18 as shown in FIG. In particular, when the mass of the deformed part 15 increases (especially 5 g or more), it is easily detached even if the mounting jig 16 is devised. This is because the mass of the mounting jig 16 itself also increases. Further, when part of the lead frame 19 is detached together with the mounting jig 16, the circuit operation itself is also affected.

  13A and 13B are cross-sectional views illustrating problems that may occur when the odd-shaped component 15 is attached to the circuit board 24 side.

  As shown in FIGS. 13A and 13B, even if the deformed component 15 is fixed to the circuit board 24 by using the mounting jig 16 or the like, if the force shown by the arrow 17 is generated, the lead frame 19 Every time, there is a possibility of deviating as indicated by an arrow 17.

(Embodiment 3)
In the third embodiment, members used for the heat dissipation substrate 18 and the resin structure 11 used in the circuit module will be described.

  As the lead frame 19, a member having high thermal conductivity such as copper or aluminum is used. The lead frame 19 has a thickness of 0.2 mm or more (preferably 0.3 mm or more). When the thickness of the lead frame 19 is less than 0.2 mm, the strength of the connection wiring 22 is lowered and bends during work.

  The thickness of the lead frame 19 is desirably 10.0 mm or less (preferably 5.0 mm or less). When the thickness of the lead frame 19 exceeds 10.0 mm, it affects the fine patterning of the connection wiring 22.

  Next, the heat transfer resin 27 will be described. The heat transfer resin 27 is made of, for example, a resin and a filler, whereby the thermal conductivity can be increased. And the reliability is improved by using a thermosetting resin as resin.

  Here, as the inorganic filler, for example, it has a substantially spherical shape, and its diameter is suitably 0.1 μm or more and 100 μm or less (if it is less than 0.1 μm, it becomes difficult to disperse in the resin. The thickness of 20 becomes thick and affects the thermal diffusivity). Therefore, the filling amount of the inorganic filler in the heat transfer layer 20 is filled at a high concentration of 70 to 95% by weight in order to increase the thermal conductivity. In particular, in the present embodiment, the inorganic filler is a mixture of two types of alumina having an average particle diameter of 3 μm and an average particle diameter of 12 μm. By using alumina having two kinds of large and small particle diameters, it is possible to fill the gaps between the large particle diameters of alumina with small particle diameters, so that alumina is filled at a high concentration to nearly 90% by weight. As a result, the heat conductivity of these heat transfer layers 20 is about 5 W / (m · K).

  The inorganic filler is at least one selected from the group consisting of alumina, magnesium oxide, boron nitride, silicon oxide, silicon carbide, silicon nitride, and aluminum nitride, zinc oxide, silica, titanium oxide, tin oxide, and zircon silicate. It is desirable from the viewpoint of thermal conductivity and cost.

  In addition, when using a thermosetting resin, at least 1 type of thermosetting resin chosen from the group of an epoxy resin, a phenol resin, cyanate resin, a polyimide resin, an aramid resin, and PEEK resin is included. This is because these resins are excellent in heat resistance and electrical insulation.

  In particular, in order to increase the heat dissipation of the heat transfer layer 20, it is necessary to increase the content of the inorganic filler. As a result, the content of the thermosetting resin in the heat transfer layer 20 may be reduced. is there. And when the content rate of the thermosetting resin in the heat-transfer layer 20 is reduced, the adhesive force between the heat-transfer layer 20 and the lead frame 19 may fall. When the connection wiring 22 which is a part of the lead frame 19 and the circuit board 24 connected to the connection wiring 22 are repeatedly peeled off with a very strong force, the heat transfer layer 20 on the heat dissipation board 18 There is a possibility that the interface of the lead frame 19 is peeled off.

  However, as shown in FIGS. 10 to 11, by fixing the resin structure 11 to the metal plate 21 using screws 23 and a fixing jig (not shown), the lead frame 19 and the connection wiring 22 The peel strength between the heat transfer layer 20 can be increased.

  As described above, the metal plate 21, the sheet-like heat transfer layer 20 formed on the metal plate 21, the lead frame 19 fixed to the heat transfer layer 20, and a part of the lead frame 19 are transferred to the heat transfer layer 20. It is composed of a connection wiring 22 bent substantially vertically from the thermal layer 20, a resin structure 11 for fixing a part or more of the connection wiring 22, and a deformed part 15. Then, the circuit module fixed to the resin structure 11 realizes a circuit module with improved attachment of the deformed component 15.

  A metal plate 21, a sheet-like heat transfer layer 20 formed on the metal plate 21, a lead frame 19 fixed to the heat transfer layer 20, and a part of the lead frame 19 are substantially omitted from the heat transfer layer 20. It is composed of a connection wiring 22 bent vertically, a resin structure 11 for fixing a part or more of the connection wiring 22, a deformed component 15, and a circuit board 24 fixed substantially parallel to the metal plate 21. A part or more of the deformed component 15 is fixed to the resin structure 11, and a part or more of the connection wiring 22 is pressed against the heat transfer layer 20 by the resin structure 11. A part or more of the circuit modules are connected to the circuit board 24, thereby improving the mounting property of the deformed component 15 and enhancing the vibration resistance.

  A metal plate 21, a lead frame 19 in which a part or more is embedded in a sheet-like heat transfer layer 20 on the metal plate 21, a resin structure 11 that fixes a part or more of the lead frame 19, and a deformed part 15 And a circuit board 24 fixed substantially parallel to the metal plate 21, a part or more of the deformed component 15 is fixed to the resin structure 11, and a part or more of the connection wiring 22 is The resin structure 11 is pressed against the heat transfer layer 20, and a part or more of the connection wiring 22 is a circuit module connected to the circuit board 24, thereby improving the mountability of the deformed component 15. Increase its vibration resistance.

  The deformed component 15 provides a circuit module that can cope with the deformed component 15 that is one or more of a coil, a transformer, a capacitor, and a leaded component.

  By embedding the deformed part 15 in the resin structure 11 (or sandwiching with a plurality of resin structures 11), the attachment strength can be increased and the attachment jig 16 can be omitted.

  A step of fixing the lead frame 19 on the metal plate 21 by using the sheet-like heat transfer layer 20; a step of bending a part of the lead frame 19 from the heat transfer layer 20 substantially vertically to form the connection wiring 22; The step of fixing the deformed component 15 to the resin structure 11, the step of pressing a part of the lead frame 19 against the heat transfer layer 20 using the resin structure 11, and the resin structure 11 The circuit module can be produced by a circuit module manufacturing method having a step of fixing to the metal plate 21, and the connection wiring 22 is connected to a circuit board 24 installed substantially parallel to the metal plate 21. By adding a process, it is possible to increase the functionality of the circuit module.

  As the circuit board 24, a commercially available printed wiring board made of glass epoxy (glass fiber cured with epoxy resin) or the like can be used.

  As described above, by using the circuit module and the manufacturing method thereof according to the present invention, it is possible to firmly fix the deformed part having low mountability or heavy weight to the resin structure, and to have vibration resistance and noise resistance. Because it is excellent, it is possible to reduce the size and strength of various devices.

A perspective view illustrating the configuration of a circuit module (A) and (B) are perspective views explaining a state in which a part or more of deformed parts are fixed using a resin structure. The perspective view explaining a mode that the resin structure which attached the odd-shaped part is fixed to a heat sink using a screw The perspective view explaining a mode that it fixes with a screw, after attaching a resin structure which attached a deformed part to a heat sink. (A) (B) is sectional drawing explaining an example of the manufacturing method of a heat sink. Sectional view showing heat dissipation board and resin structure Sectional drawing explaining how to set a resin structure to which a part or more of odd-shaped parts is fixed Sectional drawing which shows a mode that resin structure is fixed to a heat sink with a screw Sectional view showing how to set the circuit board Sectional view showing how the circuit board is fixed Sectional drawing explaining how vibration resistance improves by fixing a resin structure to a metal plate or the like with a screw (A) (B) is sectional drawing explaining the case where neither a resin structure is used (A) (B) is sectional drawing explaining the subject which may generate | occur | produce when both odd-shaped components are attached to the circuit board side. Sectional drawing explaining an example of the conventional circuit module which mounted the odd-shaped components which have different height

Explanation of symbols

DESCRIPTION OF SYMBOLS 11 Resin structure 12 Mounting hole 13 Wiring hole 14 Dotted line 15 Deformed part 16 Mounting jig 17 Arrow 18 Heat sink 19 Lead frame 20 Heat transfer layer 21 Metal plate 22 Connection wiring 23 Screw 24 Circuit board 25 Electronic component 26 Recess 27 Heat transfer Resin 28, 28a, 28b Opening 29 Solder

Claims (6)

A metal plate, a sheet-like heat transfer layer formed on the metal plate, a lead frame fixed to the heat transfer layer, and a connection wiring formed by bending a part of the lead frame substantially vertically from the heat transfer layer And a resin structure that fixes a part or more of the connection wiring, and a deformed part,
A circuit module in which a part or more of the odd-shaped parts is fixed to the resin structure. A metal plate, a sheet-like heat transfer layer formed on the metal plate, a lead frame fixed to the heat transfer layer, and a connection wiring formed by bending a part of the lead frame substantially vertically from the heat transfer layer And a resin structure that fixes a part or more of the connection wiring, a deformed component, and a circuit board fixed substantially parallel to the metal plate,
A part or more of the deformed parts are fixed to the resin structure,
A part or more of the connection wiring is pressed against the heat transfer layer by the resin structure,
A circuit module in which a part or more of the connection wiring is connected to the circuit board. A metal plate, a lead frame in which a part or more is embedded in a sheet-like heat transfer layer on the metal plate, a resin structure that fixes a part or more of the lead frame, a deformed part, and the metal plate A circuit board fixed in parallel,
Fixing at least a part of the deformed parts to the resin structure;
A circuit module in which a part or more of the connection wiring is pressed against the heat transfer layer by the resin structure and a part or more of the connection wiring is connected to the circuit board. The circuit module according to any one of claims 1 to 3, wherein the odd-shaped component is at least one of a coil, a transformer, a capacitor, and a leaded component. The circuit module according to any one of claims 1 to 3, wherein the odd-shaped part is embedded in a resin structure. Fixing a lead frame on a metal plate using a sheet-like heat transfer layer;
A step of bending a part of the lead frame from the heat transfer layer substantially perpendicularly to form a connection wiring;
Fixing the odd-shaped part to the resin structure;
Using the resin structure, pressing a part of the lead frame against the heat transfer layer, fixing the resin structure to the metal plate,
A method for manufacturing a circuit module.

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