12463701246370
尤指於具導熱 效能之發 五、發明說明（1) 【發明所屬技術領域】 本發明係有關一種模組基板 光二極體模組基板。 【先前技術】 般發光二極體所用之模 P C B 1 ，如 1 1上 ，製作 先將印 刻把不 為導電 線即是 於印刷 發光， 呈現的 因此發 升高之 板1並 二極體 ，當發 電迴路 的導熱 …等現 (print circui 圖一所示，乃是 ，該基板 時，基板 刷油墨依 必要的銅 迴路1 2 所需要的 電路板1 其中，發 發光二極 光二極體 問題，次 不考慮散 2之接腳 光二極體 1 2本身 性非常差 象，而造 1 1大 1 1預 線路圖 洗去， ，該導 電路， 基板1 光二極 體，會 2會隨 请茶閱 熱問題 2 1以 2因通 少許的 ，又， 成發光 按， 路板，簡稱 印刷電路板 刷在一基板 性樹脂製成 箔，通常係 然後經由蝕 上的銅箔即 導線，該導 2 ’而設置 以電流使其 以陣列形態 發光效率， 部熱量過度 之印刷電路 僅是將發光 迴路1 2上 工作僅靠導 刷電路板1 假焊、偏移 t board ), 將欲運用之 多係以坡ί离 先覆蓋著一 的樣子構圖 餘刻後留下 電迴路1 2 用以連接發 1上之發光 體2若屬高 需要較大的 著電流提高 ®二，習知 ’亦無設置 焊接的方式 電而發熱時 效益而已， 焊接的方式 一極體與導 $為印刷電 而習知之 電子線路印 纖維或熱塑 層彳艮薄的銅 在銅箱上， 在基板1 1 係用來代替 光二極體 二極體2係 功率者或是 電流來提高 而伴隨著局 模組基板用 散熱裝置， 烊接在導電 ，其散熱的 由於一般印 有時會發生 電銅·箔之間Especially for hair with thermal conductivity. V. Description of the invention (1) [Technical field to which the invention belongs] The present invention relates to a module substrate, a photodiode module substrate. [Previous technology] The mold PCB 1 used for general light-emitting diodes, such as 1 1, is produced by printing the engraved handles that are not conductive wires to emit light on the printing. The heat conduction of the power generation circuit is shown in Fig. 1. However, when the substrate is printed, the substrate is printed with the necessary copper circuit 1 2 and the circuit board 1 is required. Among them, the light emitting diode is a problem. Regardless of the photodiodes 1 and 2 of the scattered 2 pins, the inherent characteristics of the photodiodes 1 2 are very poor, but the 1 1 large 1 1 pre-circuit diagram is washed away. This conductive circuit, the substrate 1 photodiodes, will 2 Question 2 1 2 is a small, but light-emitting, circuit board, printed circuit board, or printed circuit board for short. A foil is made of a substrate resin. Usually, it is set through the etched copper foil, which is the wire. The current is used to make it emit light in an array. The printed circuit with excessive heat only works on the light-emitting circuit 12 and only relies on the guide brush circuit board 1 for false soldering and offset t board. First covered with one After leaving the composition for a while, the electrical circuit 1 2 is left to connect the light-emitting body 2 on the hair 1. If it is high, it needs a large working current to increase® II. It is known that there is no way to set the welding and it is effective when heating. Welding method: a polar body and an electronic circuit printed fiber or a thermoplastic layer that is known for printing electricity. Thin copper is on a copper box, and the substrate 1 1 is used to replace the photodiode 2 power. Or the current is increased to accompany the heat dissipation device for the local module substrate, which is connected to the conductive, and the heat dissipation may occur between the copper and the foil due to the general printing.
1246370 五、發明說明（2) 的導熱不良，令發光二極體2有因過熱而減損發光功率或 損壞之虞，若單一發光二極體散熱不良，極可能會影響整 片模組基板上的其他發光二極體發揮應有之效能 為了改善上述缺點，已有業者開發出經 鈞局核准之 我國專利，公告號為「5 4 9 5 9 0」之「高功率發光二 極體外加散熱裝置」，請參閱圖三，該散熱裝置3上係組 設有一印刷電路板4 ，且該印刷電路板4上係組設有多數 個高功率發光二極體5 ，其中，該散熱裝置3具有一本體 3 1 ，該本體3 1開設有一凹陷槽3 2 ，且於該凹陷槽 3 2之底部凸設有一接觸部3 3 ，並於該凹陷槽3 2二壁 面鄰近接觸部3 3之位置分別設有一滑槽3 4 ，又於該本 體3 1底緣延伸有多數個散熱鰭片3 5 ，其組裝時，藉由 滑槽3 4將印刷電路板4二侧滑設於散熱裝置3中，達到 便於組裝、拆卸之功效，惟，此一散熱裝置3須以外加方 式為之，不但成本高，且易造成印刷電路板大型化之缺 點。 藉由上述可知，模組基板用之習知印刷電路板1 ，於 基板1 1上僅設有導電迴路1 2 ，有容易因發光二極體2 之局部熱度過度升高，而造成發光二極體2有因過熱而減 損發光功率甚至損壞之虞，若是外加一散熱裝置3 ，不但 成本高，且易造成印刷電路板4大型化之缺點，故實有加 以改良之必要性。 發明人乃係從事電子相關產業開發之專業人員，有鑑 於習知的發光二極體模組之散熱方法未臻完善，乃以長年 1246370 五、發明說明（3) 工作經驗積極 本發明。 【發明内容】 本發明之 二極體模組基 體的位置底部 熱體，並於模 導熱體及導敎 ^ /、、、 能直接導引出 發光功率或損 【實施方式】 為使 貴 達到之功效， 首先請參 電路板6及發 之電子線路印 一層彳艮薄的銅 箔上，然後經 板6 1上的銅 來代替導線， 極體7 ，其中 有較大面積之 熱構件6 3， 設有複數個導 的進行研究 主要目的， 板，其主要 基座設以複 組基板避開 構件之快速 ，使發光二 壞之情事。 審查委員能 兹配合圖示 閱圖四，本 光二極體7 刷在一基板 箔，通常係 由钱刻把不 箔及是導電 該導線即是 ’於基板6 導熱構件6 且基板6 1 熱孔6 1 1 ，在不斷的試驗及改良後終獲致 在於提供—種具導熱效能.之笋光 係於設置在模組基板之: 數個導熱孔，該導熱孔填匕； 2迴路處設以導熱構件，= v…、性，將發光二極體產生之埶 極體達到避免因過熱而發生減;員 更易於了解 說明如下： 發明之模組 ’該印刷電 6 1上，此 先將印刷油 必要的鋼洗 迴路6 2， 所需要的電 1的上層避 3 ，而下層 對應於發光 ’次請參閱 本發明之結構及所能 基板主 路板6 基板6 墨依線 去，飾 該導電 路，用 開導電 亦設有 二極體 圖五， 要包含 乃是將 1預先 路圖構 刻後留 迴路6 以連接 迴路6 較大面 7的位 該導熱 有印刷 欲運用 覆蓋著 圖在銅 下在基 2係用 發光二 2處設 積之導 置處， 孔1246370 V. Description of the invention (2) Poor thermal conductivity of the light emitting diode 2 may cause the light emitting power to be reduced or damaged due to overheating. If a single light emitting diode has poor heat dissipation, it will most likely affect the entire module substrate. In order to improve the above-mentioned shortcomings, other light-emitting diodes have been developed. In order to improve the above-mentioned shortcomings, some companies have developed a Chinese patent approved by the Jun Bureau. Please refer to FIG. 3, the heat dissipation device 3 is provided with a printed circuit board 4 on the system, and the printed circuit board 4 is provided with a plurality of high-power light emitting diodes 5, wherein the heat dissipation device 3 has a The main body 31 is provided with a recessed groove 3 2, and a contact portion 3 3 is protruded from the bottom of the recessed groove 32, and is provided at a position adjacent to the contact portion 33 on the second wall surface of the recessed groove 3 2. There is a slide groove 3 4, and a plurality of heat dissipation fins 3 5 extend from the bottom edge of the body 31. During assembly, the printed circuit board 4 is slid into the heat dissipation device 3 through the slide groove 3 4 to reach Easy to assemble and disassemble, but this one dissipates heat 3 is set to be worth an applied manner, not only the high cost, easily lead to the printed circuit board and the size of the disadvantages. From the above, it is known that the conventional printed circuit board 1 for the module substrate is provided with only the conductive circuit 1 2 on the substrate 11, which may easily cause the local heat of the light-emitting diode 2 to be excessively increased, resulting in the light-emitting diode. The body 2 may reduce the luminous power or even be damaged due to overheating. If a heat dissipation device 3 is added, not only the cost is high, but also the disadvantages of the large size of the printed circuit board 4 are easily caused. Therefore, it is necessary to improve it. The inventor is a professional engaged in the development of electronics-related industries. It is known that the heat dissipation method of the conventional light-emitting diode module has not been perfected, but based on long-term 1246370 V. Description of the invention (3) Working experience is positive. [Summary of the invention] The base body of the diode module of the present invention is located at the bottom of the body, and can directly guide the luminous power or damage to the mold heat conductor and the guide. [Embodiment] In order to make it expensive, Efficacy, please first refer to the circuit board 6 and the electronic circuit printed on a thin layer of copper foil, and then replace the wire through the copper on the board 61, the pole body 7, which has a large area of the thermal member 6 3, There are several guides for conducting research. The main purpose of the board is to set the main base of the board to avoid the rapidity of the component base and to make the light shine. The review committee can read the picture with the illustration. The photodiode 7 is brushed on a substrate foil. Usually, the non-foil and the conductive wire are carved by money. 6 1 1, after continuous testing and improvement, it is finally provided-a kind of thermal conductivity. The bamboo shoots are installed on the module substrate: several thermal holes, the thermal holes are filled with daggers; 2 circuits are provided with thermal conductivity The component, = v ..., will reduce the emission of the phosphor produced by the light-emitting diode to avoid overheating; it will be easier for the staff to understand and explain as follows: The module of the invention 'The printed electricity 61, this will be printed oil first The necessary steel washing circuit 6 2, the upper layer of the required electricity 1 avoids 3, and the lower layer corresponds to the light emission. Please refer to the structure of the present invention and the capable substrate main circuit board 6 substrate 6 ink line to decorate the conductive circuit There is also a diode figure 5 with open conductors. To include, it is necessary to structure 1 in advance and leave the circuit 6 to connect the circuit 6 to the larger surface of the 7 bit. The thermal conductivity is printed. It is used to cover the figure under copper. In the base 2 system, the product of the light emitting 2 is set. , Hole
1246370 五、發明說明（4) * 6 1 1之周壁亦設有導熱構件6 3 1 ，以供導熱構件6 3 藉由導熱孔6 1 1周壁之導熱構件6 3 1使其為上下相連 之狀態，另於導熱孔6 1 1内填充有導熱體6 4 ，該導熱 體6 4與導熱構件6 3 、6 3 1係由導熱係數高之金屬材 質所製成，本發明以銅為例。 本發明於實施時，由於模組基板之印刷電路板6上的 、. 導電迴路6 2、導熱構件6 3及導熱孔6 1 1周壁之導熱 構件6 3 1皆係事先設於基板6 1上，而導熱體6 4亦可 … 於製作印刷電路板6時，事先填設於印刷電路板6之基板 6 1且對應於發光二極體7之導熱孔6 1 1中，故，本發 鲁 明之模組基板，僅需將發光二極體7設於對應在基板6 1 之導熱孔6 1 1上，並將發光二極體7之接腳7 1以焊接 的方式焊接在導電迴路6 2上，只要電流通過，即可使發 光二極體7發光，而無論發光二極體7係為一般功率或屬 高功率者，或是以陣列形態呈現的發光二極體，其因電流 之通過所產生出之熱度，一部份可藉由基板6 1對應於發 光二極體7底部導熱孔6 1 1中之導熱體6 4將熱傳導至 基板6 1底部散熱；另一部分則可藉由導熱體6 4將熱經 由導熱孔6 1 1周壁之導熱構件6 3 1傳導至基板6 1之 上、下之導熱構件6 3 ，藉由大表面積之導熱構件6 3 ， - 較具良好之導熱效能，使發光二極體7所產生之熱能獲得 有效之向外導引，避免發光二極體7因過度聚熱而發生減 損發光功率或損壞之情事。 再請參閱圖六，為本發明之另一實施例，本發明之模1246370 V. Description of the invention (4) * 6 1 1 The peripheral wall is also provided with a thermally conductive member 6 3 1 for the thermally conductive member 6 3 through the thermally conductive hole 6 1 1 The peripheral wall of the thermally conductive member 6 3 1 is connected to the upper and lower states. A heat conductor 6 4 is filled in the heat conducting hole 6 1 1. The heat conductor 6 4 and the heat conducting members 6 3 and 6 3 1 are made of a metal material with high thermal conductivity. The present invention takes copper as an example. During the implementation of the present invention, the conductive circuit 6 2, the thermally conductive member 6 3, and the thermally conductive hole 6 1 1 on the printed circuit board 6 of the module substrate are all provided on the substrate 6 1 in advance. And the thermal conductor 6 4 can also be ... When making the printed circuit board 6, the substrate 6 1 of the printed circuit board 6 is filled in advance and corresponds to the thermal conduction hole 6 1 1 of the light-emitting diode 7. Therefore, the present invention The module substrate of the Ming only needs to set the light emitting diode 7 on the heat conducting hole 6 1 1 corresponding to the substrate 6 1 and solder the pin 7 1 of the light emitting diode 7 to the conductive circuit 6 2 by welding. Above, as long as the current passes, the light-emitting diode 7 can be made to emit light, regardless of whether the light-emitting diode 7 is of a general power or a high power, or a light-emitting diode in the form of an array, which is passed by the current Part of the generated heat can be conducted by the substrate 6 1 corresponding to the heat conduction hole 6 4 in the bottom of the light-emitting diode 7 to the heat conduction body 6 4 in the bottom of the light emitting diode 7; the other part can be conducted by heat conduction The body 6 4 conducts heat to the substrate 6 1 above and below the substrate 6 1 through a heat conducting member 6 3 1 on the peripheral wall of the heat conducting hole 6 1 1. The thermal member 6 3, with a large surface area of the thermally conductive member 6 3,-has a relatively good thermal conductivity, so that the thermal energy generated by the light emitting diode 7 can be effectively guided outward, and the light emitting diode 7 is prevented from being excessively concentrated. The heat may reduce the luminous power or damage. Please refer to FIG. 6 again, which is another embodiment of the present invention.
第9頁 1246370 五、發明說明（5) 組基板，亦 6 1 2，該 以供導熱構 6 3 1使其 充有導熱體 於對應在基 之接腳7 1 流通過，即 因電流之通 應於發光二 傳導至基板 熱經由導熱 6 1上、下 熱之功效。 綜上所 板，乃係於 導熱構件及 填充導熱體 能，迅速引 損發光功率 他的發光二 省成本，確 之要件，爰 鑑，惠賜為 可將複 導熱孔 件6 3 為上、 6 4。 板6 1 以焊接 可使發 過所產 極體7 6 1底 孔6 1 之導熱 數個導 6 12 措由導 下相連 而實施 之導熱 的方式 光二極 生出之 底部導 部散熱 2周壁 構件6 述，本發 模組基板 與發光二 ，藉由導 導出，以 或損壞之 極體’不 實達到散 依法提出 准予專利 1 1設為一單 亦設有導熱構 1 2周壁之導 ，另於導熱孔 樣僅需將發光 2上，並將發 導電迴路6 2 光，而此時發 一部份可藉由 1 2中之導熱 分則可藉由導 構件6 3 1傳 發光二極體7 二極體 電迴路 並於導 電所產 聚熱而 組基板 器，能 穎性及 審查委 熱孔6 之周壁 熱孔6 之狀態 時，同 孔6 1 焊接在 體7發 熱度， 熱孔6 ;一部 之導熱 3 ，使 明之具導熱 之印刷電路 極體相對應 熱體將發光 避免發光二 情形，因而 僅簡單且不 熱之功效， 發明之申請 之審定，至 效能之發光 板上避開導 之導熱孔， 二極體因通 極體因過度 影響整片模 需外加散熱 顯已具有新 ，祈請 貴 感德便。 孔導熱孔 件 6 3 1， 熱構件 6 1 2内填 二極體7設 光二極體7 上，·只要電 光二極體7 基板6 1對 體6 4將熱 熱體6 4將 導至基板 達到迅速導 模組基 處設以 熱孔中 生之熱 發生減 上的其 有效節 進步性 員之詳Page 9 1246370 V. Description of the invention (5) Group of substrates, also 6 1 2 This is for the heat conductive structure 6 3 1 to be filled with a heat conductor corresponding to the base pin 7 1 flow, that is, due to the current flow The effect of heat transfer from the light-emitting diode 2 to the substrate through the heat conduction 61 1 should be applied. To sum up, the board is based on the heat-conducting member and filling the heat-conducting body energy, which quickly damages the luminous power. The cost of the light-emitting two provinces. . The plate 6 1 can be welded so that the heat conduction of the produced pole body 7 6 1 bottom hole 6 1 can be conducted by a plurality of guides 6 12 The heat conduction method of the bottom of the photodiode is conducted by the bottom guide 6 and the peripheral wall member 6 As mentioned above, the module substrate and the light-emitting module of the hair module are derived through the guidance, and the patented body with the damaged pole body is unrealistic, and the patent is granted in accordance with the law. The thermal hole sample only needs to light up 2 and emit a light from the conductive circuit 6 2, and at this time, a part of the light-emitting diode can be transmitted by the heat-conducting component in 12 and the light-emitting diode 7 by the conductive member 6 3 1. Diode electrical circuit and the heat generated by the conductive substrate assembly group, the ability to examine the state of the thermal wall 6 on the peripheral wall of the thermal hole 6, the same hole 6 1 is welded to the body 7 heat, thermal hole 6; The thermal conductivity of one part 3 makes the printed circuit pole body with thermal conductivity corresponding to the thermal body. It will emit light and avoid light emission. Therefore, it has only simple and non-heating effect. The approval of the application for the invention will avoid the guidance on the light-emitting board of efficiency. Thermally conductive holes, diodes due to excessive effects Piece mold need external heat already has significant new sense of ethics will be your prayer. The hole heat conducting hole 6 3 1 and the thermal member 6 1 2 are filled with the diode 7 and the photodiode 7 is provided. As long as the electro-optic diode 7 is on the substrate 6 1 pair 6 4 the hot body 6 4 will be guided to the substrate To reach the rapid guide module at the base of the heat generated by the thermal holes to reduce the effective section of the progress
第10頁 1246370 圖式簡單說明 一、 圖式說明 圖一係習知印刷電路板之立體圖。 圖二係習知印刷電路板之剖視圖。 圖三係另一習知印刷電路板與散熱器結合之側視圖 圖四係本發明印刷電路板之立體圖。 圖五係本發明印刷電路板之剖視圖。 圖六係本發明另一實施例之剖視圖。 二、 圖號說明 印刷電路板 發光二極體 散熱裝置 1 2導電迴路 3 2凹陷槽 3 4滑槽 1 1基板 2 1接腳 3 1本體 3 3接觸部 3 5散熱鰭片 611導熱孔 6 3導熱構件 6 4導熱體 4印刷電路板 5發光二極體 6印刷電路板 7發光二極體 6 1基板 6 2導電迴路 6 3 1導熱構件 7 1接腳 ·Page 10 1246370 Brief description of the drawings I. Description of the drawings Fig. 1 is a perspective view of a conventional printed circuit board. Figure 2 is a sectional view of a conventional printed circuit board. Figure 3 is a side view of another conventional printed circuit board combined with a heat sink. Figure 4 is a perspective view of a printed circuit board of the present invention. Fig. 5 is a sectional view of a printed circuit board of the present invention. FIG. 6 is a sectional view of another embodiment of the present invention. Second, the drawing number shows the printed circuit board light emitting diode heat dissipation device 1 2 conductive circuit 3 2 recessed groove 3 4 slide groove 1 1 substrate 2 1 pin 3 1 body 3 3 contact 3 5 heat dissipation fin 611 heat conduction hole 6 3 Thermally conductive member 6 4 Thermally conductive body 4 Printed circuit board 5 Light-emitting diode 6 Printed circuit board 7 Light-emitting diode 6 1 Substrate 6 2 Conductive circuit 6 3 1 Thermally conductive member 7 1 Pin ·
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