200410607200410607
五、發明說明（1) 【發明所屬技術領域】 本發明係有關一種模組基板，尤指於具導埶效 光二極體模組基板。 ‘、b之聲 【先前技術】 按，一 路板，簡稱 印刷電路板 刷在一基板 性樹脂製成 箔，通常係 然後經由姓 上的銅箔即 導線，該導 2 ，而設置 以電流使其 以陣列形態 發光效率， 部熱量過度 之印刷電路 僅是將發光 迴路1 2上 工作僅靠導 刷電路板1 假焊、偏移 般發光二極 P C B (pr 1 ’如圖— 1 1上，該 ，製作時， 先將印刷油 刻把不必要 為導電迴路 線即是所需 於印刷電路 發光，其中 呈現的發光 因此發光二 升高之問題 板1並不考 二極體2之 ’當發光二 電迴路1 2 的導熱性非 •••等現象， 體所用之模 i n t c i rcu i 所示，乃是 基板1 1大 基板1 1預 墨依線路圖 的銅洗去， 1 2 ，該導 要的電路， 板1基板1 ，發光二極 二極體，會 極體2會隨 ，次請參閱 慮散熱問題 接腳2 1以 極體2因通 本身少許的 常差，又， 而造成發光 組基板，通 t board ) 將欲運用之 多係以破ί离 先覆蓋著一 的樣子構圖 蝕刻後留下 電迴路1 2 用以連接發 1上之發光 體2若屬高 需要較大的 著電流提高 圖二，習知 亦無設置 焊接的方式 電而發熱時 效益而已， 焊接的方式 一極體與導 常為印刷電 ，而習知之 電子線路印 纖維或熱塑 層很薄的銅 在銅落上， 在基板1 1 係用來代替 光二極體 二極體2係 功率者或是 電流來提高 而伴隨著局 模組基板用 散熱裝置， 焊接在導電 ，其散熱的 由於一般印 有時會發生 電銅箔之間V. Description of the Invention (1) [Technical Field of the Invention] The present invention relates to a module substrate, and more particularly to a light-emitting diode module substrate having a conductive effect. "Voice of b" [Previous technology] Press, a circuit board, referred to as a printed circuit board, is brushed with a substrate resin to make a foil, usually through a copper foil on the last name, that is, a wire. The luminous efficiency of the array form, the printed circuit with excessive heat is only to work on the light-emitting circuit 12 and only rely on the guide brush circuit board 1 to be soldered and offset, such as a light-emitting diode PCB (pr 1 'as shown in Figure — 1 When making, first engraving the printing oil is not necessary to be a conductive circuit line, that is, it is necessary to emit light in the printed circuit. The luminescence presented in it is therefore the problem of the increase in the light emission. The board 1 does not consider the diode 2 as the light emission two electricity. The thermal conductivity of circuit 1 2 is non- ••• and other phenomena, as shown in the mold intci rcu i used in the body, which is the substrate 1 1 large substrate 1 1 pre-ink washed away by the copper of the circuit diagram, 1 2, the main circuit The board 1 substrate 1 and the light-emitting diode diode will follow the pole body 2. Please refer to the consideration of the heat dissipation problem pin 2 1 to the pole body 2 due to the little difference between the itself and the light-emitting group substrate, T board) will be used It is covered with the first one, and the electrical circuit 1 2 is left after the etching. It is used to connect the luminous body 2 on the hair 1. If it is high, a larger current is required to increase the figure 2. There is no known welding method. It is only effective when heating. The welding method is that the polar body and the conductor are usually printed electricity, and the conventional electronic circuit printed fiber or thermoplastic layer is very thin copper on the copper. It is used to replace the photodiode on the substrate 1 1 The diode 2 series power or the current is increased to accompany the heat dissipation device for the local module substrate, which is soldered to conductive, and its heat dissipation may occur between the electrical copper foil due to general printing.
第6頁 200410607 五、發明說明（2) ^ ~^ --- 的導熱不良，令發光二極體2有因過熱而減損發光功率或 才貝^^之虞’各單一發光二極體散熱不良，極可能會影響整 片模組基板上的其他發光二極體發揮應有之效能7 為了改善上述缺點，已有業者開發出經 ^局核准之 我國專利，公告號為「5 4 9 5 9 〇」之「高功率發光二 極體外加散熱裝置」，請參閱圖三，該散熱=置3;係: 設有/印刷電路板4 ，且該印刷電路板4上係組設有多數 個高功率發光二極體5 ，其中，該散熱裝置3呈有一本體 3 i，財體3 1開設有-凹陷槽.3 2，且於該凹陷槽 32=:ΐΓ接觸部33，並於該凹陷槽32二壁 面鄰近3 3之位置分別設有一滑槽3 4，又於該本 體3 1底、，彖延伸有多數個散熱鰭片3 5 ，其組 滑槽3 4將印刷電路板4二側滑設於散熱狀^ ^ 便於組裝、拆卸之功效，惟，此—散:衣3中’達J 式為之’不但成本高’且易造成印=置3須以外加方 μ。 電路板大型化之缺 寶占 ° ”、’藉由上述可知，模組基板用之習4 基板1 1上僅設有導電迴路丄2， 知印刷電路板1 ，於 以之:ΐ:成〜d之缺…實有加 不但 之扃部熱度過度升高，而造成發’> 有容易因發光二極體2 損發光功率甚至損壞之步& ^ |光二極體2有因過熱而減 、丄客’且层i告说匕右疋外加一散熱裝置3 發明人乃係從事電 於 習妒的發光二極體模：：f業開發之專業人員，有鑑 、、且之放熱方法未壤完善，乃以長年 200410607 五、發明說明（3) 工作經驗積極 本發明。 【發明内容】 本發明之 二極體模組基 體的位置底部 熱體，並於模 導熱體及導熱 能直接導引出 發光功率或損 【實施方式】 為使 貴 達到之功效， 首先請參 電路板6及發 之電子線路/p …層很薄的銅 箔上，然後經 板6 1上的鋼 來代替導線， 極體7 ，其中 有較大面積之 熱構件6 3， 設有複數個導 的進行研究’纟不斷的試驗及改良後終獲致 主要目的，在於提供—種具導熱效能之發光 板，其主要係於設置在模組基板之發光二極 設以複數個導熱孔，該導熱孔填充有導 板避開導電迴路處設以導熱構件，藉由 ，彳& =陕速導熱性，將發光二極體產生之熱 .1 =光二極體達到避免因過熱而發生減損 壞之情事。 審查委員 茲配合圖 閱圖四， 光一極體 刷在一基 箔，通常 由飿刻把 箔及是導 該導線即 ，於基板 導熱構件 且基板6 熱孔6 1 能更易 示說明 本發明 7，該 板6 1 係先將 不必要 電迴路 是所需 6 1的6 3, 1對應 1 ，次 於了解 如下： 之模組 印刷電 上，此 印刷油 的銅洗 6 2, 要的電 上層避 而下層 於發光 請參閱 本發明之結構.及所能 基板主 路板6 基板6 墨依線去，I虫 該導電 路，用 開導電 亦設有 二極體 圖五， 要包含 乃是將 1預先 路圖構 刻後留 迴路6 以連接 迴路6 較大面 7的位 該導埶 有印刷 欲運用 覆蓋著 圖在銅 下在基 2係用 發光二 2處設 積之導 置處， 孔Page 6 200410607 V. Description of the invention (2) Poor heat conduction of ^ ~ ^ --- makes the light-emitting diode 2 have a risk of reducing the luminous power or the ability of the light-emitting diode 2 due to overheating. 'Each single light-emitting diode has poor heat dissipation. It is likely to affect the performance of other light-emitting diodes on the entire module substrate. 7 In order to improve the above-mentioned shortcomings, some companies have developed Chinese patents approved by the Bureau, and the announcement number is "5 4 9 5 9 〇 "" High-power light-emitting diodes with external heat-dissipating device ", please refer to Figure 3, the heat-dissipation = set 3; Department: with / printed circuit board 4, and the printed circuit board 4 is equipped with a number of high Power light-emitting diode 5, wherein the heat sink 3 has a body 3 i, and the body 31 is provided with a -recessed groove. 3 2, and in the recessed groove 32 =: ΐΓ contact portion 33, and in the recessed groove 32 two wall surfaces are respectively provided with a chute 3 4 at a position adjacent to 3 3, and a plurality of heat dissipation fins 3 5 are extended at the bottom and the base of the body 3 1. The group of chute 3 4 slides the printed circuit board 4 on both sides. Set in a heat-dissipating shape ^ ^ The effect of easy assembly and disassembly, but this-scattered: the 'J-style' in clothing 3 is not only costly = Easily lead plate 3 is set to be other than the Canadian μ. The lack of treasures in the enlargement of the circuit board accounts for "°" From the above, it can be known that the practice of the module substrate 4 is only provided with a conductive circuit 丄 2 on the substrate 11 and the printed circuit board 1 is known as: ΐ: 成 〜 The shortcoming of d ... It is not only that the heat of the crotch is excessively increased, which causes hair loss &'; it is easy to cause the light emitting diode 2 to lose luminous power or even damage the step & ^ | the light diode 2 is reduced due to overheating , 丄 客 'and layer i told you that the right side plus a heat sink 3 The inventor is a light-emitting diode phantom that is engaged in electric jealousy: a professional in the development of the industry, and has a method of heat dissipation The soil is perfect, and it is based on the long-term 200410607. V. Description of the invention (3) Working experience actively invents the invention. [Content of the invention] The base of the diode module of the present invention is located at the bottom of the heat body, and is directly guided by the mold heat conductor and heat conduction energy. Output luminous power or loss [Embodiment] In order to achieve the most expensive effect, first refer to the circuit board 6 and the electronic circuit / p… on a very thin layer of copper foil, and then use steel on the board 61 to replace the wires. Polar body 7, which has a large area of thermal members 6 3, is provided with The research of several guides': The main purpose after continuous experimentation and improvement is to provide a kind of light-emitting board with thermal conductivity, which is mainly based on the light-emitting diodes provided on the module substrate with a plurality of heat-conducting holes. The heat conduction hole is filled with a guide plate and a heat conducting member is provided to avoid the conductive circuit. By means of 彳 & = Shaanxi thermal conductivity, the heat generated by the light emitting diode is achieved. 1 = The light diode is prevented from being reduced due to overheating. The situation of the damage. The reviewing committee hereby cooperates with the drawing to read the figure 4. The photo-polar body is brushed on a base foil, usually by engraving the foil and the conductive wire, that is, the heat conducting member on the substrate and the thermal hole 6 1 on the substrate can be more easily illustrated. According to the invention 7, the plate 6 1 is firstly the unnecessary electric circuit is the required 6 1 6 3, 1 corresponds to 1, and the second is to understand as follows: On the module printing electricity, the copper of this printing oil is washed 6 2. The electric upper layer avoids the lower layer to emit light, please refer to the structure of the present invention. And the substrate can be printed on the main circuit board 6 substrate 6 ink line, I, the conductive circuit, also used to open the conductor is also provided with a diode Figure 5. Is engraving 1 road map Left circuit 6 to connect the circuit 6 bits larger surface 7 of the guide skillfulness to be printed using FIG covered at the opposite conductivity copper-based group 2 provided with a luminescent product 2 place two holes
第8頁 200410607Page 8 200410607
1 ，以供導熱構件6 3 6 3 1使其為上下相連 有導熱體6 4 ，該導熱 由導熱係數高之金屬材 五、發明說明（4) 6 1 1之周壁亦設有導熱構件6 3 藉由導熱孔6 1 1周壁之導熱構件 之狀態，另於導熱孔6 1 1内填充 體6 4與導熱構件6 3、6 3 1係 質所製成，本發明以銅為例。 、本發明於實施時，由於模組基板之印刷電路板6上的 導電迴路6 2、導熱構件6 3及導熱孔6 i周壁之導熱 構件6 3 1皆係事先設於基板6 i上，而導敎體6 4亦可 於製作印刷電路板6時，事先填設於印刷電路板6之基板 6 1且對應於發光二極體7之導熱孔6丄丄中，故，本發 明之模組基板，僅需將發光二極體7設於對應在基板6 1 之導熱孔6 1 1上，並將發光二極體7之接腳7 i以焊接 的方式焊接在導電迴路6 2上，只要電流通過.，即可使發 ，一極體7發光，而無論發光二極體7係為一般功率或屬 局功率者’或是以陣列形態呈現的發光二極體，其因電流 之通過所產生出之熱度，一部份可藉由基板Θ 1對應於發 光二極體7底部導熱孔δ 1 1中之導熱體β 4將熱傳導至 基板6 1底部散熱；另一部分則可藉由導熱體6 4將熱經 由導熱孔6 1 1周壁之導熱構件6 3 1傳導至基板6 ；[之 上下之‘熱構件6 3，藉由大表面積之導熱構件6 3 ， 較具良好之導熱效能，使發光二極體7所產生之熱能獲得 有效之向外導引，避免發光二極體7因過度聚熱而.發生減 損發光功率或損壞之情事。 再請參閱圖六，為本發明之另一實施例，本發明之模1 for the heat-conducting member 6 3 6 3 1 so that it is a heat-conducting body 6 4 connected up and down. The heat-conducting is made of a metal material with high thermal conductivity. 5. Description of the invention (4) 6 1 1 The peripheral wall is also provided with a heat-conducting member 6 3 Based on the state of the thermally conductive member on the peripheral wall of the thermally conductive hole 6 1 1, it is also made of the filling material 6 4 and the thermally conductive member 6 3, 6 3 1 in the thermally conductive hole 6 1 1. The present invention takes copper as an example. When the present invention is implemented, since the conductive circuit 6 on the printed circuit board 6 of the module substrate 2, the thermally conductive member 6 3 and the thermally conductive hole 6 i, the thermally conductive member 6 3 1 on the peripheral wall is provided on the substrate 6 i in advance, and The guide body 64 can also be filled in the substrate 61 of the printed circuit board 6 in advance when the printed circuit board 6 is produced, and corresponds to the heat conduction hole 6 丄 丄 of the light emitting diode 7. Therefore, the module of the present invention For the substrate, it is only necessary to set the light emitting diode 7 on the heat conducting hole 6 1 1 corresponding to the substrate 6 1 and solder the pin 7 i of the light emitting diode 7 to the conductive circuit 62 by welding, as long as When the current passes through, the light emitting diode 7 can emit light, regardless of whether the light emitting diode 7 is of ordinary power or local power, or the light emitting diode in the form of an array. Part of the generated heat can be transferred to the bottom of the substrate 6 1 by the substrate Θ 1 corresponding to the thermal conduction hole δ 1 in the bottom of the light-emitting diode 7, and the other portion can be dissipated by the thermal conductor. 6 4 conducts heat to the substrate 6 via the heat conducting member 6 3 1 on the peripheral wall of the heat conducting hole 6; [上下 的 '热The piece 63, with a large surface area heat conducting member 63, has better heat conduction performance, so that the thermal energy generated by the light emitting diode 7 can be effectively guided outward, and the light emitting diode 7 is prevented from being overheated by excessive heat. . Occurrence of loss of luminous power or damage. Please refer to FIG. 6 again, which is another embodiment of the present invention.
第9頁 200410607 五、發明說明（5) - -- 組基板，亦可將複數個導熱孔6丄1設為一單孔導熱孔 6 12 "亥$熱孔6 1 2之周壁亦設有導熱構件6 3 1 ， 以供導熱構件6 3藉由導熱孔6 1 2周壁之導熱構件 6 3 1使其為上、下相連之狀態，另於導熱孔6丄2内填 充有導熱體6 4。而實施時，同樣僅需將發光二極體7設 於對應在基板6 1之導熱孔6 1 2上，並將發光二極體7 之接腳7 1以焊接的方式焊接在導電迴路6 2上，只要電 流通過，即可使發光二極體7發光，而此時發光二極體7 因電流之通過所產生出之熱度，一部份可藉由基板6丄對 應=發光二極體7底部導熱孔6 i 2中之導熱體6 4將熱 傳導至基板6 1底部散熱；一部分則可藉由導熱體6 4將 熱經由導熱孔6 1 2周壁之導熱構件6 3 1傳導至.基板 6 1上、下之導熱構件6 3，使發光二極體7達到迅速導 熱之功效。 ^ ^ “上所述，本發明之具導熱效能之發光二極體模組基 板，乃係於模組基板之印刷電路板上避開導電迴路處設以 導熱構件及與發光二極體相對應之導熱孔，並於導熱^中 填充&熱體，藉由導熱體將發光二極體因通電所產生之熱 能，迅速引導出，以避免發光二極體因過度聚熱而發生& 損發光功率或損壞之情形，因而影響整片模組基板上的其 他的發光二極體，不僅簡單且不需外加散熱器，能有效節 省成本，確實達到散熱之功效，顯已具有新穎性及進步性 之要件，爰依法提出發明之申請，祈請貴審查委員之詳 鑑’惠賜為准予專利之審定，至感德便。Page 9 200410607 V. Explanation of the invention (5)--For the base plate, a plurality of heat conducting holes 6 丄 1 can also be set as a single hole heat conducting hole 6 12 " 海 $ 热 孔 6 1 2 The peripheral wall is also provided The thermally conductive member 6 3 1 is provided for the thermally conductive member 6 3 to be connected to the upper and lower sides by the thermally conductive member 6 3 1 of the peripheral wall, and the thermally conductive body 6 4 is filled with the thermally conductive body 6 4 . In the implementation, it is only necessary to set the light emitting diode 7 on the heat conducting hole 6 1 2 corresponding to the substrate 6 1, and solder the pin 7 1 of the light emitting diode 7 to the conductive circuit 6 2 by welding. Above, as long as the current passes, the light-emitting diode 7 can be made to emit light, and at this time, the heat generated by the light-emitting diode 7 due to the passage of the current can be partially corresponded by the substrate 6 丄 = the light-emitting diode 7 The heat conducting body 6 4 in the bottom heat conducting hole 6 i 2 conducts heat to the bottom of the substrate 6 1 to dissipate heat; part of the heat can be conducted by the heat conducting body 6 4 through the heat conducting hole 6 1 2 of the peripheral wall of the heat conducting member 6 3 1 to the substrate 6 1 The upper and lower heat conducting members 6 3 enable the light emitting diode 7 to achieve rapid heat conduction. ^ "" As mentioned above, the light-emitting diode module substrate with thermal conductivity of the present invention is provided on the printed circuit board of the module substrate with a heat-conducting member and a light-emitting diode corresponding to the light-emitting diode, avoiding the conductive circuit. The heat conduction hole is filled with & thermal body in the heat conduction ^, and the thermal energy generated by the light-emitting diode by the heat conduction body is quickly guided to avoid the & damage caused by the excessive heat accumulation of the light-emitting diode. Luminous power or damage, which affects other light-emitting diodes on the entire module substrate, is not only simple and does not require an external heat sink, which can effectively save costs and indeed achieve the effect of heat dissipation. It is obviously new and improved. The nature of the matter, I filed an application for an invention according to the law, and I ask your reviewing committee to examine the 'blessings of the patent for approval, to the merits of virtue.
第10頁 200410607 圖式簡單說明 一、 圖式說明 圖一係習知印刷電路板之立體圖。 · 圖二係習知印刷電路板之剖視圖。 圖三係另一習知印刷電路板與散熱器結合之側視圖 圖四係本發明印刷電路板之立體圖。 圖五係本發明印刷電路板之剖視圖。 圖六係本發明另一實施例之剖視圖。 二、 圖號說明 印刷電路板 發光二極體 散熱裝置 2導電迴路 2凹陷槽 4滑槽 1 1基板 2 1接腳 3 1本體 3 3接觸部 3 5散熱鰭片 611導熱孔 6 3導熱構件 6 4導熱體 4印刷電路板 5發光二極體 6印刷電路板 7發光二極體 6 1基板 6 2導電迴路 6 3 1導熱構件 7 1接腳Page 10 200410607 Brief description of the drawings I. Description of the drawings Fig. 1 is a perspective view of a conventional printed circuit board. · Figure 2 is a sectional view of a conventional printed circuit board. Figure 3 is a side view of another conventional printed circuit board combined with a heat sink. Figure 4 is a perspective view of a printed circuit board of the present invention. Fig. 5 is a sectional view of a printed circuit board of the present invention. FIG. 6 is a sectional view of another embodiment of the present invention. Second, the figure shows the printed circuit board light emitting diode heat sink 2 conductive circuit 2 recessed groove 4 slide groove 1 1 substrate 2 1 pin 3 1 body 3 3 contact 3 5 heat dissipation fin 611 heat conduction hole 6 3 heat conduction member 6 4 thermal conductor 4 printed circuit board 5 light emitting diode 6 printed circuit board 7 light emitting diode 6 1 substrate 6 2 conductive circuit 6 3 1 heat conducting member 7 1 pin
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