TW201935602A - System, apparatus and method for contactless transportation of a carrier in a deposition system - Google Patents

Abstract

The present disclosure provides an apparatus for contactless transportation of a carrier (220) in a deposition system. The carrier (220) includes a guiding structure (210) having one or more active magnet units (112) configured to face a magnet structure (222) of the carrier (220), and one or more sensors (230) configured to detect a presence of the carrier (220), wherein the one or more active magnet units (112) and the one or more sensors (230) are arranged to define a guiding space (S) for the magnet structure (222) therebetween.

Description

System for non-contact transfer of carrier in deposition system and method for non-contact transfer of carrier

Embodiments of the present disclosure relate to a device for non-contact transfer of a carrier in a deposition system, a system for non-contact transfer of a carrier, and a method for non-contact transfer of a carrier in a deposition system. The embodiments disclosed in this disclosure are particularly related to an electrostatic chuck (E-chuck) for holding a substrate and / or a mask, which is used for manufacturing an organic light emitting diode (OLED) device.

Techniques for depositing a layer on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates can be used in a variety of applications and in various technical fields. For example, coated substrates can be used in the field of organic light emitting diode devices. Organic light emitting diodes are used in the manufacture of television screens, computer monitors, mobile phones, other handheld devices, and the like for displaying information. Organic light emitting diode devices, such as organic light emitting diode displays, can include one or more layers of organic material between two electrodes, both electrodes being deposited on a substrate.

During processing, the substrate may be supported on a carrier configured to hold the substrate and an optional mask. This carrier can be transported non-contact in a deposition system, such as a vacuum deposition system, using magnetic force. For applications like organic light emitting diodes, the organic layer deposited on the substrate should have high purity and uniformity. Furthermore, it is challenging to use non-contact transmission to transport and transport the carrier supporting the substrate and the mask, but without sacrificing yield due to the damage of the substrate.

In summary, a new device for non-contact transport of a carrier in a deposition system, a system for non-contact transport of a carrier, and a non-contact transport of a carrier in a deposition system that overcome at least some of the problems in the art The method of transporting the carrier is advantageous. This disclosure is specifically directed to providing a carrier that can be efficiently and smoothly transported in a deposition system, such as a vacuum deposition system.

In view of this, a device for non-contact transport of a carrier in a deposition system, a system for non-contact transport of a carrier, and a method for non-contact transport of a carrier in a deposition system are provided. Further aspects, benefits, and features of the present disclosure will be apparent from the scope of the patent application, the description, and the drawings.

According to an aspect of this disclosure, an apparatus is provided for contactlessly transporting a carrier in a deposition system. The device includes a guiding structure with one or more active magnet units, a magnet structure configured to face the carrier, and one or more sensors configured to detect the presence of the carrier. One or more active magnet units and the one or more sensors are configured to define a guiding space of the magnet structure therebetween.

According to another aspect of the present disclosure, an apparatus is provided for contactlessly transporting a carrier in a deposition system. The device includes one or more sensors configured to detect the presence of the carrier, wherein each of the one or more sensors has a sensor in a transmission direction of the carrier Expansion, where the sensor expansion is 1% or more of a carrier expansion in the transmission direction.

According to other aspects of this disclosure, a system is provided for contactless transport of a carrier. This system includes a device for non-contact transport of a carrier and a carrier according to the present disclosure.

According to still other aspects of the present disclosure, a method of non-contact transporting a carrier in a deposition system is provided. The method includes detecting a first side of a detectable device of the carrier and controlling at least one active magnet unit. The active magnet unit is disposed on a second side of the detectable device, and the first side and This second side is opposite.

The embodiments are also related to a device for performing the disclosed method, and include device components for performing each of the described method aspects. These method aspects may be implemented by hardware components, a computer programmed with suitable software, any combination of the two, or any other means. Furthermore, the embodiments according to the present disclosure also relate to a method for operating the device. Such methods for operating the described device include method aspects for performing each function of the device.

Various embodiments of the present disclosure will now be described in detail. One or more examples of the present disclosure are shown in the drawings. In the following description of the drawings, the same components are designated by the same component symbols. Only the differences between the embodiments will be described. Each example is provided to explain the present disclosure and is not intended to limit the present disclosure. In addition, features illustrated or described as part of one embodiment can be used in or combined with other embodiments to produce yet another embodiment. The content is intended to include such adjustments and changes.

The carrier may be used in a deposition system, such as a vacuum deposition system, to hold and transport a substrate and / or a mask in a deposition chamber of the deposition system. For example, when the substrate is supported on a carrier, one or more layers of material may be deposited on the substrate. For applications like organic light emitting devices, it may be advantageous to deposit a high purity and high uniformity organic layer on a substrate. Further, it is advantageous to transport the carrier smoothly in the deposition system, for example, to reduce damage to the substrate.

According to the embodiment of the present disclosure, one or more active magnet units and one or more sensors are disposed on opposite sides of the guide space. In particular, the one or more active magnet units and the one or more sensors are disposed on opposite sides of the magnet structure of the carrier. The space for magnetic guidance can be used efficiently. Further, interference between the magnetic guidance and the one or more sensors can be avoided, and smooth transmission in the transmission direction of the carrier can be achieved. Damage to the substrate due to unstable transport of the carrier and / or generation of particles can be reduced or even avoided.

FIG. 1 shows a schematic diagram of the carrier 100 and a part of the transmission device configured for non-contact transmission of the carrier 100 in the transmission direction 1. The transmission direction 1 may be a horizontal direction.

This transmission device includes a guiding structure 110, which may be an active guiding structure. The guiding structure 110 includes a plurality of guiding units 111, which are arranged along a transmission direction. Each guide unit 111 includes an actuator (such as a magnetic actuator). The actuator is like an active magnet unit 112. The controller 114 is configured to control the actuator, and a distance sensor (not shown) is configured. It is used to measure the gap to the carrier 100. The guide structure 110 may be configured to contact the magnetically levitated carrier 100 using a magnetic force.

When the carrier 100 approaches or moves away from the guide unit 111, the accuracy of the magnetic levitation and / or the stability of the magnetic levitation may be affected. In particular, when the carrier 100 approaches or moves away from the guide unit 111, a large and / or pulse-like force may be generated, which may cause the carrier 100 to accelerate or decelerate suddenly. This force may depend on the geometric configuration and the configuration of the components of the guiding structure 110, in particular a plurality of guiding units 111 (such as magnetic actuators and distance sensors). This force may cause unwanted and sudden movements of the carrier 100, and may even cause accidental mechanical contact between the carrier 100 and the guide structure 110. Damage to the carrier 100, the substrate, and / or the guide structure 110 may result. Further, particles that deteriorate the quality of the deposition process can be generated.

When the carrier 100 disappears suddenly (such as disappearing from below the distance sensor), a pulsed force or a change in the direction of the magnetic levitation force may occur, especially the direction of the magnetic force provided by the actuator (such as 3) vertical direction. This may cause the signal value of the distance sensor to be the same as the signal value when the carrier moves rapidly away from the distance sensor in the direction of the distance (such as vertical direction 3). In other words, the distance sensor shows an enlarged gap. The change of the signal can cause the controller to strongly change the force of the actuator, so that the “moving” carrier 100 returns to the preset distance between the guide structure 110 and the carrier 100.

In addition, when the carrier 100 approaches or moves away from the guide unit 111, a force in the transmission direction 1 may be generated. This force may even be strong enough to impede other transmissions of the carrier 100. The force along the transmission direction 1 may be a reluctance from the actuator, which acts on the front and / or the back of the carrier (for example, the leading edge or the trailing edge). This is exemplarily shown in FIG. 1 by the magnetic field lines on the back of the carrier 100.

FIG. 2 shows a schematic diagram of an apparatus for contactlessly transporting a carrier 220 in a deposition system according to an embodiment described herein.

The device includes a guide structure 210 having a magnet structure 222 configured with one or more active magnet units 112 to face the carrier 220, and one or more sensors 230 configured to detect the presence of the carrier 220. The one or more active magnet units 112 and the one or more sensors 230 are configured to define a guiding space S of the magnet structure 222 therebetween. The magnet structure 222 of the carrier 220 extends along the transmission direction 1 of the carrier 220. Similarly, the one or more active magnet units 112 are arranged along the transmission direction 1 of the carrier 220. The magnet structure 222 may be a ferromagnetic material, and the magnet structure 222 extends along the length of the carrier 220.

In some embodiments, the magnet structure 222 may provide a sensor trail for one or more sensors 230. In other embodiments, the sensor tracking is provided by a separate element, which may be attached to the magnet structure 222. An example of sensor tracking that can be provided by a separate component is shown in Figure 3A as a detectable device (like tilt).

According to some embodiments that can be combined with other embodiments described herein, with respect to the vertical direction 3, the one or more active magnet units 112 are disposed above the guide space S, and the one or more sensors 230 It is arranged below the guide space S. The distance between the one or more active magnet units 112 and the one or more sensors 230 defining the guidance space S, for example, the distance in the vertical direction 3, may be greater than the magnet structure 222 in the same direction. Extension. In particular, for example, in the vertical direction 3, a first gap G1 may be provided between the one or more active magnet units 112 and the magnet structure 222. Similarly, for example, in the vertical direction 3, a second gap G2 may be provided between the one or more sensors 230 and the magnet structure 222. The first gap G1 and the second gap G2 may be substantially equal or may be unequal. Such gaps can avoid, for example, interference or contact between the carrier 220 and the transmission device due to a slight vertical and / or horizontal movement of the carrier 220 during its transmission.

The carrier 220 is configured for non-contact transport through one or more chambers (such as a vacuum chamber) of a deposition system along a transport path (such as a linear transport path), and in particular through at least one deposition area. The carrier 220 may be configured for non-contact transmission in the transmission direction 1, which may be a horizontal direction.

According to some embodiments that may be combined with other embodiments described herein, the deposition system may include a transfer device configured for non-contact geomagnetic levitation and / or non-contact transfer of the carrier 220 in the deposition system. Transport management may include a guiding structure 210 and a driving structure. The guiding structure 210 is used to provide a magnetic levitation force for suspending the carrier 220. The driving structure is used to move the carrier 220 in the transmission direction 1. The magnet structure 222 of the carrier 220 may include one or more first magnet units configured to magnetically interact with the guide structure. In some embodiments, the one or more first magnet units may be passive magnet units, such as permanent magnet units and / or ferromagnetic components.

According to some embodiments that can be combined with other embodiments described herein, the carrier 220 includes another magnet structure including one or more second magnet units (not shown) configured to magnetically couple with the driving structure. Interact to move the carrier 220 in the transmission direction 1. In some embodiments, the one or more second magnet units may be passive magnet units, such as ferromagnetic. The guide structure 210 and the driving structure may be disposed at opposite ends or end portions of the carrier 220. In particular, the one or more first magnet units and the one or more second magnet units may be disposed at opposite ends or end portions of the carrier 220.

The deposition system and particularly the transfer device may include a guiding structure having a plurality of guiding units 111. Each guide unit 111 may include an actuator such as an active magnet unit 112, the controller 114 is configured to control the actuator, and an individual sensor 230 is configured to sense or measure a magnet structure (especially among them) Gap between one or more first magnet units) and the actuator. This gap can be measured in a direction perpendicular to the transmission direction 1 (like vertical direction 3), like the first gap G1. Particularly, for example, when the carrier 220 is located at the sensor 230 to sense or measure the gap between the one or more first magnet units and the active magnet unit 112, the sensor 230 may be configured to face one or more first magnet units. A magnet unit. The sensor 230 may be a distance sensor.

The controller 114 may be configured to control the active magnet unit 112 to adjust a magnetic force provided by the actuator based on the gap measured by the sensor 230. In particular, the controller 114 may be configured to control the active magnet unit 112 such that when the carrier 220 is transported through the deposition system, the distance between the first magnet unit and the active magnet unit 112 is substantially constant. Even if FIG. 2 exemplarily shows that each guide unit 111 has its own controller, it can be understood that the present disclosure is not limited thereto, and one controller may be assigned to two or more guide units. For example, a single controller may be provided to all guidance units.

The carrier 220 may be configured to hold a substrate and / or a mask (not shown) utilized during substrate processing, such as vacuum processing. In some embodiments, the carrier 220 may be configured to support both the substrate and the mask. In other embodiments, the carrier 220 may be configured to support one of a substrate or a mask. In this case, the carrier 220 may be referred to as a "substrate carrier" and a "mask carrier", respectively.

The carrier 220 may include a support structure or body 225 that provides a support surface, which may be a substantially flat surface configured to contact a rear surface, such as a substrate. In particular, the substrate may have a front surface (also referred to as a "treated surface") opposite the rear surface, and during a process such as a vacuum deposition process, a layer is deposited on the previous surface. The magnet structure 222 may be provided at the main body 225.

The term "vacuum" as used throughout this disclosure can be understood as a technical vacuum having a vacuum pressure less than, for example, 10 mbar. Pressure in the vacuum chamber may be between about 10 ^-5 mbar to about 10 ^-8 mbar, in particular between 10 ^-5 mbar to 10 ^-7 mbar, and more particularly between about 10 ^-6 mbar to about 10 ^- Between ⁷ mbar. One or more vacuum pumps, such as turbo pumps and / or cryo-pumps, connected to the vacuum chamber may be provided for generating a vacuum in the vacuum chamber.

The carrier 220 disclosed herein may be an electrostatic chuck, which provides an electrostatic force to hold the substrate and / or cover the carrier 220. For example, the carrier 220 includes an electrode device configured to provide an attractive force acting on one of the substrate and the mask. The electrode device may be embedded in the main body 225 or provided to the main body 225, for example, placed on the main body 225. According to some embodiments that may be combined with other embodiments described herein, the body 225 is a dielectric body, such as a dielectric plate. The dielectric body may be made of a dielectric material. The dielectric material is preferably a high thermal conductivity dielectric material, such as pyrolytic boron nitride, aluminum nitride, and silicon nitride. ), Alumina, or equivalent materials, but can also be made of materials such as polyimide. In some embodiments, the electrode device includes a plurality of electrodes (such as a thin metal strip) placed on a dielectric plate and covered by a thin dielectric layer.

The electrode device and, in particular, the plurality of electrodes may be configured to provide an attractive force, such as an attractive force. The attractive force may be a force acting on the substrate and / or the mask at a specific relative distance between the plurality of electrodes (or supporting surfaces) and the substrate and / or the mask. The attractive force may be an electrostatic force provided by a voltage applied to the plurality of electrode devices.

The substrate may be attracted by the attractive force provided by the carrier 220 toward the support surface (for example, in a direction perpendicular to the transmission direction), and the carrier may be an electrostatic suction seat. The attractive force can be strong enough to hold the substrate, for example, to hold the substrate in a vertical position by friction. In particular, the attractive force may be configured to secure the substrate to a support surface that is substantially immovable. For example, in order to hold a glass substrate of 0.5 millimeters (mm) in a vertical position using friction, a suction pressure of about 50 to 100 Pa (N / m ² , Pa) may be used, depending on the coefficient of friction.

According to some embodiments that may be combined with other embodiments described herein, the carrier 220 is configured to hold or support the substrate and / or the mask in a substantially vertical orientation or a substantially horizontal orientation. In particular, the carrier may be configured for transmission in a vertical orientation. As used throughout this disclosure, and especially when referring to substrate orientation, "substantially vertical" is understood to allow deviations from the vertical direction or orientation by ± 20 degrees or less, such as ± 10 degrees or less. This deviation may be provided, for example, because a substrate support with some deviation from the vertical orientation may result in a more stable substrate position. Furthermore, when the substrate is tilted forward, fewer particles reach the surface of the substrate. However, for example, during the deposition process, the substrate orientation is considered to be substantially vertical, vertical is considered to be different from horizontal substrate orientation, and horizontal substrate orientation is considered to be horizontal ± 20 degrees or less.

The term "vertical orientation" or "vertical orientation" should be understood as distinguishing from "horizontal orientation" or "horizontal orientation". That is, "vertical direction" or "vertical orientation" is related to, for example, the substantially vertical orientation of the carrier and the substrate, in which the precise vertical direction or vertical orientation deviates from some angles, such as up to 10 degrees or even up to 15 degrees is still considered "substantially vertical" or "substantially vertical". This vertical orientation may be substantially parallel to gravity.

The embodiments described herein can be used for evaporation on large-area substrates, such as the manufacture of organic light emitting diode displays. In particular, the substrates provided by the structures and methods of the embodiments described herein are large-area substrates. For example, a large-area substrate or carrier may be the 4.5th generation corresponding to a surface area of approximately 0.67m² (0.73mx 0.92m), the 5th generation corresponding to a surface area of approximately 1.4m² (1.1mx 1.3m), and approximately 4.29 Generation 7.5 of m² (1.95 mx 2.2 m) surface area corresponds to generation 8.5 of surface area of approximately 5.7m² (2.2 mx 2.5 m), or even generation 10 of surface area of approximately 8.7 m² (2.85 mx 3.05 m). It can be similarly implemented in even higher generations, such as 11th and 12th generation substrates, and corresponding substrate areas. A half-size substrate of each generation can also be provided in the manufacture of organic light emitting diode displays.

According to some embodiments that may be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm. The substrate thickness may be about 0.9 mm or less, such as 0.5 mm. The term "substrate" as used herein may particularly include a substrate that is substantially inflexible, such as a wafer, a slice of transparent crystal like sapphire or the like, or a glass plate. However, this disclosure is not limited to this, and the term "substrate" may further include a flexible substrate such as a web or foil. The term "inflexible" should be understood as distinguishing from "flexible". In particular, a substantially inflexible substrate may have flexibility at a specific angle, for example, a glass plate has a thickness of 0.9 mm or less, such as 0.5 mm or less, where compared to a bendable substrate, The substantially inflexible substrate has less flexibility.

According to the embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of a material selected from the group: glass (such as soda-lime glass, borosilicate glass, and the like), metal, A polymer, ceramic, compound, carbon fiber material, or any other material, or a combination of materials that can be coated by a deposition process.

FIG. 3A shows a schematic diagram of an apparatus for contactlessly transporting a carrier 320 in a deposition system according to an embodiment described herein. The device and the carrier 320 in FIG. 3A are similar to the device and the carrier shown in FIG. 2, and similar or identical elements are not described repeatedly.

According to some embodiments that can be combined with other embodiments described herein, the carrier 320 includes a detectable device 340 that can be detected by one or more sensors 230 to detect the presence of the carrier 320. In some embodiments, for example, when the detectable device 340 is located above an individual sensor, for example, the detectable device 340 is configured to face one or more sensors 230. According to some embodiments, one or more sensors 230 face the sensor tracking provided by the detectable device 340, and an actuator (such as one or more active magnet units 112) faces the magnet structure 222 (particularly one Or multiple first magnet units) provided by the actuator tracking. The detectable device 340 may have a first side and a second side opposite to the first side. For example, the first side may be the lower side of the detectable device 340, and the second side may be the higher side of the detectable device 340. One or more sensors 230 may face the first side. One or more active magnet units 112 may face the second side.

The detectable device 340 and the magnet structure 222 may be integrally formed, or may be provided as separate components. According to some embodiments that can be combined with other embodiments described herein, the detectable device 340 and the magnet structure 222 (especially one or more first magnet units) may be configured to be adjacent to each other, such as The transmission direction 1 is on a horizontal plane, like a substantially horizontal plane. For example, the detectable device 340 can be attached to the magnet structure 222 of the carrier 320, which has one or more first magnet units.

The detectable device 340 may be disposed at an end portion of the carrier 320 and extends along the transmission direction 1. The detectable device 340 may be detected by one or more sensors 230 of the transport device of the deposition system to determine the carrier 320 or the end of the carrier 320 relative to at least one of the plurality of guide units 111 of the guide structure 210. position. In this regard, the detectable device 340 may also be referred to as "sensor tracking".

The carrier has a terminal portion, such as a first terminal portion and a second terminal portion opposite the first terminal portion. The substrate may be located between the first end portion and the second die end portion. The first end portion may be a top (or upper) end portion, and the second end portion may be a bottom (or lower) end portion. The first end portion and the second end portion may extend substantially in parallel, for example, in a substantially horizontal direction. A detectable device 340 may be provided at the first end portion and / or the second end portion. The example in FIG. 3A exemplarily shows the detectable device 340 and the magnet structure 222 at the first end portion, and the first end portion is the top or upper end portion of the carrier 320. The detectable device 340 and the magnet structure 222, particularly one or more first magnet units, can face the guide structure 210 of the transmission device. One or more second magnet units may be located at the second end portion, and the second end portion may be a bottom or lower end portion of the carrier 320. One or more second magnet units may face the driving structure of the transmission device.

According to some embodiments that can be combined with other embodiments described herein, the detectable device 340 is, for example, an element extending in the transmission direction 1 over the entire length L of the carrier 320. The length L of the carrier 320 may be defined along the transmission direction 1, for example, between the first end 201 and the second end 202 of the carrier 320 in the transmission direction 1.

In some embodiments, the detectable device 340 includes or is a geometric profile that changes along the transmission direction 1 and can be detected by one or more sensors 230. The one or more sensors 230 may be distance sensors configured to detect the distance between the individual sensors and the geometric contour, especially the surface of the individual sensors and the geometric contour facing the sensor the distance between. This distance can be measured in a direction perpendicular to the transmission direction 1, which is like the vertical direction 3 or the horizontal direction 2. In some embodiments, each guide unit 111 includes an individual sensor to detect a geometric contour.

The geometric contour can be changed between the first end 201 and the second end 202 of the carrier 320 in the transmission direction 1. The geometric profile may provide an extension of the sensor tracking between the first end 201 and the second end 202. The term "geometric profile" as used throughout this disclosure refers to a profile or an element that has a profile extending in the transmission direction 1, and is in the transmission direction 1 and at least one direction perpendicular to the transmission direction 1 (like The vertical direction 3) has a discontinuous (or changed) cross-sectional shape on a defined plane. When viewed in the transmission direction 1, the geometric profile can be defined at the first end 201 of the carrier 320 (for example, the front side of the leading edge, which can define the outermost boundary of the carrier 320 in the transmission direction 1) and the second end 202 ( For example, the back surface of the trailing edge may define the outermost edge of the carrier 320 in a direction opposite to the transmission direction 1). In other words, the changed geometric profile does not refer to the edge of the first end 201 or the second end 202 of the carrier 320, but refers to other structural changes between the first end 201 and the second end 202, which can be changed by one or more Detected by the sensor 230.

According to some embodiments that may be combined with other embodiments described herein, the geometrical contour includes one or more shape elements. In some embodiments, one or more shape elements may be selected from the following group: discontinuity, inclination, arc shape, or any combination thereof. For example, the geometric profile may be an element that extends along the length of the carrier 220 and has one or more shape elements, such as an inclination 342.

In some embodiments, one or more shape elements, such as inclined, are disposed on the first end 201 and / or the second end 202 of the carrier 320. For example, at least one first shape element may be disposed at the first end 201 and / or at least one second shape element may be disposed at the second end 202. The at least one first shape element and the at least one second shape element may be substantially the same or may be different. In the example of FIG. 3A, both the at least one first shape element and the at least one second shape element are inclined in the element providing the geometric outline.

The one or more shape elements may be arranged at the end of the carrier 320 so that the position of the end of the carrier relative to the guide structure 210 may be determined. The one or more active magnet units 112 of the guide unit 111 may be controlled to provide smooth transmission of the carrier 320 in the transmission direction 1. In particular, actuators located at and / or near the edges of the carrier can be controlled. For example, the magnetic force provided by the actuators may be continuously increased or decreased to provide smooth transport of the ends of the carrier 320 between adjacent actuator / magnet units. For example, the operation of the actuator may be reduced so that when the carrier 320 is “away” from the actuator, the actuator does not substantially exert a force on the carrier 320.

According to some embodiments, the independent shape element of the one or more shape elements may have a length extension in the transmission direction 1 along the geometric contour and / or the length of the carrier 320. The length extension of this independent shape element may correspond to at least 1% of the length of the geometric contour and / or the carrier 320, in particular at least 4% of the length, and in particular at least 8% of the length.

FIG. 3A exemplarily illustrates the tilt 342 as one or more shape elements. However, the disclosure is not limited to this, and other shape elements may be provided, such as a cutout or a continuously changing shape. In some embodiments, the tilt 342 may be a surface on which the carrier 320 is tilted with respect to the transmission direction 1. For example, the tilt 342 may be tilted relative to a horizontal plane. In some embodiments, the tilt 342 is disposed on the first end 201 and / or the second end 202 of the carrier 320. For example, at least one first tilt may be configured at the first end 201 of the carrier 320, and / or at least one second tilt may be configured at the second end 202 of the carrier 320. The at least one first inclination and the at least one second inclination may be inclined in opposite directions. In particular, the at least one first tilt and the at least one second tilt may be mirror symmetrical.

The sensor 230 may be configured to face the tilt 342. In particular, when the carrier 320 moves in the transmission direction 1, the sensor 230 may be configured to detect the tilt 342. The increase or decrease in the distance detected between the sensor and the tilt depends on the transmission direction 1 and / or the tilt direction. One or more active magnet units of the guide unit 111 may be controlled to provide smooth transmission of the carrier 320 in the transmission direction. In particular, the actuator located at the tilt can be controlled. For example, changing the distance provided based on tilt to provide smooth transportation of the end of the carrier between adjacent actuator / magnet units can continuously increase or decrease the magnetic force provided by the actuator. In particular, in FIG. 3A, the tilt on the left side of the carrier can cause the detection signal of the sensor to be the same as the signal when the carrier moves upward. The controller can reduce the force of the actuator, for example, by reducing the current of the actuator, so that when the carrier is "away" from the actuator, the left actuator does not apply a magnetic levitation force on the carrier.

Figure 3B shows a schematic diagram of an apparatus for non-contact transport of a carrier 320 'in a deposition system according to an embodiment described herein. The device and the carrier 320 'of FIG. 3B are similar to the device and the carrier shown in FIG. 3A, and similar or identical elements are not described repeatedly.

According to an aspect of the present disclosure, a device for contactlessly transporting a carrier 320 'in a deposition system includes one or more sensors 330 configured to detect the presence of the carrier 320'. Each of the one or more sensors 330 has a sensor extension d in the transmission direction 1 of the carrier 320 ′, where the sensor extension d may be a carrier extension in the transmission direction 1 (that is, The length L) of the carrier is at least 1%, especially at least 2%, especially at least 4%, especially at least 8%, and more particularly at least 10%. The sensor extension d may be even 10% or more of the length L of the carrier 320 ', especially 15% or more, especially 20% or more, and more particularly 25% or more.

One or more sensors 330 extend in the transmission direction 1. When the carrier 320 ' (or the sensor tracking of the carrier 320 ') moves away from the sensor 330, the signal or signal value of the sensor 330 is gradually changed in a manner, just as the carrier 320 ' The force provided by the active magnet unit 112 may be (gradually) reduced to 0 according to a change in the signal, so that a smooth transmission of the carrier 320 'may be achieved. Gradual (or oblique) signal changes can be achieved by extended sensors. In contrast, for example, the short sensor shown in Figure 2 provides a sudden signal change when the sensor reaches the edge of the carrier. This embodiment can reduce or even avoid the occurrence of pulse-like forces, which may cause the carrier to suddenly accelerate or decelerate.

4A and 4B illustrate schematic diagrams of an apparatus 400 for contactlessly transporting a carrier 410 according to the embodiments described herein. The device and the carrier 410 may be configured according to the embodiments described herein.

The device 400 includes a transmission device with a guiding structure 470. According to the present disclosure, the guiding structure 470 includes a plurality of active magnetic units 475, one or more sensors (not shown) for detecting the presence of the carrier 410, and the carrier. 410. The one or more sensors may be configured to detect a distance between the one or more sensors and a detectable device of the carrier 410. The device 400 may further include a controller configured to selectively control at least one active magnet unit of the plurality of active magnet units 475 based on detection data provided by one or more sensors. According to some embodiments described herein, the transfer device may be configured in a vacuum chamber of a vacuum system. The vacuum chamber may be a vacuum deposition chamber. However, this disclosure is not limited to a vacuum system, and the carriers and transport devices described herein may be implemented in an atmospheric environment.

The carrier 410 may include a magnet structure having one or more first magnet units configured to magnetically interact with the guide structure 470 of the vacuum system to provide a magnetic suspension carrier 410. Magnetic levitation force. The one or more first magnet units may be a first passive magnetic unit 450. The guide structure 470 may extend in a transmission direction 1 of the carrier 410, and the transmission direction 1 may be a horizontal direction. The guide structure 470 may include a plurality of active magnetic units 475. The carrier 410 may be movable along the guide structure 470. The first passive magnetic unit 450 (for example, a piece of ferromagnetic material) and the plurality of active magnetic units 475 of the guiding structure 470 may be configured to provide a first magnetic levitation force for the magnetic levitation carrier 410. The device for magnetic levitation described herein is a device for providing a non-contact force to magnetic levitation (for example, the carrier 410).

According to some embodiments, the transmission device may further include a driving structure 480. The driving structure 480 may include a plurality of other magnet units, such as other active magnetic units. The carrier 410 may include one or more second magnet units configured to magnetically interact with the driving structure 480. In particular, the one or more second magnetic units may be a second passive magnetic unit 460, such as a piece of ferromagnetic material, to interact with other active magnetic units 485 of the driving structure 480.

Fig. 4B shows another side view of the transmission device. FIG. 4B illustrates an active magnetic unit of the plurality of active magnetic units 475. The active magnetic unit provides a magnetic force that interacts with the first passive magnetic unit 450 of the carrier 410. For example, the first passive magnetic unit 450 may be a rod of a ferromagnetic material. A rod may be part of the carrier 410 connected to the support structure 412. The support structure 412 may be provided by the body of the carrier 410. The rod member or the first passive magnetic unit may also be integrally formed with the supporting structure 412 to support the substrate 10. The detectable device may be attached to the first passive magnetic unit 450 or may be provided by the first passive magnetic unit 450. The carrier 410 may further include a second passive magnetic unit 460, such as other rods. This other rod may be connected to the carrier 410. This rod or the second passive magnetic unit may also be integrally formed with the support structure 412, respectively.

The term "passive" magnetic unit is used here to distinguish the concept of "active" magnetic unit. A passive magnetic unit may refer to an element having magnetic properties, and this passive magnetic unit is not actively controlled or adjusted at least during operation of the transmission device. For example, in general, the magnetic properties of a passive magnetic unit (such as a rod or other rod of the carrier) are not actively controlled during the movement of the carrier through a vacuum chamber or vacuum system. According to some embodiments that can be combined with other embodiments described herein, the controller of the transmission device is not configured to control the passive magnetic unit. The passive magnetic unit may be adapted to generate a magnetic field, such as a static magnetic field. The passive magnetic unit may not be configured to generate an adjustable magnetic field. The passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnetic properties.

According to the embodiments described herein, the plurality of active magnetic units 475 provide a magnetic force on the first passive magnetic unit 450, thereby providing a magnetic force on the carrier 410. A plurality of active magnetic units 475 magnetically levitate the carrier 410. The other active magnetic unit 485 can drive the carrier 410 in the vacuum chamber, for example, the carrier 410 is driven along the transmission direction 1. When the carrier 410 is magnetically levitated by a plurality of active magnetic units 475 located above it, a plurality of other active magnetic units 485 form a driving structure for moving the carrier 410 in the transmission direction 1. The other active magnetic unit 485 may interact with the second passive magnetic unit 460 to provide a force in the transmission direction 1. For example, the second passive magnetic unit 460 may include a plurality of permanent magnets configured with alternating polarities. The generated magnetic field of the second passive magnetic unit 460 may interact with a plurality of other active magnetic units 485 to move the carrier 410 when the carrier 410 is magnetically levitated.

In order to utilize multiple active magnetic units 475 magnetically levitating the carrier 410, and / or to use multiple other active magnetic units 485 to move the carrier 410, the active magnetic units may be controlled to provide an adjustable magnetic field. The adjustable magnetic field can be a static or dynamic magnetic field. According to embodiments that can be combined with other embodiments described herein, the active magnetic unit is configured to generate a magnetic field to provide a magnetic levitation force extending in the vertical direction 3. According to other embodiments that may be combined with further embodiments described herein, the active magnetic unit may be configured to provide a magnetic force extending in a lateral direction. An active magnetic unit as described herein may be or include components selected from the group consisting of a magnetic device, a solenoid, a coil, a superconducting magnet, or any of the above combination.

The embodiments described herein relate to the transmission and / or alignment of non-contact geomagnetic levitation, carriers, substrates and / or masks. The disclosure relates to a carrier, which may include one or more elements in the following group: a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support. As used throughout this disclosure, the term "non-contact" can be understood as, for example, the weight of the carrier and the substrate, not held by mechanical contact or mechanical force, but by magnetic force. In particular, the carrier is held in a magnetically levitated or floating state using magnetic force rather than mechanical force. For example, the transfer device described herein may not have a mechanical device that supports the weight of the carrier, such as a mechanical track. In some embodiments, there may be no mechanical contact between the carrier and other devices during magnetic levitation of the carrier in a vacuum system, and for example during movement.

According to an embodiment of the present disclosure, magnetic levitation (levitating or levitation) refers to a state of an object, wherein the object floats without mechanical contact or support. Further, moving an object refers to providing a driving force, for example, a force in a direction different from the magnetic levitation force, where the object is moved from one position to another different position. For example, an object can be magnetically suspended from a carrier, that is, magnetically suspended by a force that cancels gravity, and when the carrier is magnetically suspended, it can be moved in a direction different from the direction parallel to gravity.

According to the embodiments described herein, non-contact magnetic levitation and transfer of the carrier is advantageous, so that during the transfer or alignment of the carrier, there is no mechanical contact between the carrier and part of the transfer device (such as a mechanical track) particle. Accordingly, the embodiments described herein provide improved purity and uniformity of a layer deposited on a substrate, particularly since particle generation is minimized when utilizing non-contact magnetic levitation, transport, and / or alignment.

FIG. 5 illustrates a system 500 for processing a substrate according to an embodiment described herein. The system 500 may be a vacuum system, and the system 500 may be configured to deposit one or more layers (eg, one or more organic materials) on the substrate 10.

The system 500 includes a deposition chamber (such as a vacuum chamber 502), a carrier 520 according to embodiments described herein, and a transfer device 510 configured to transport the carrier 520 in the deposition chamber. In some embodiments, the system 500 includes one or more material deposition sources 580 in a deposition chamber. During a deposition process, such as a vacuum deposition process, the carrier 520 may be configured to hold the substrate 10. The system 500 may be configured for, for example, evaporation of organic materials to manufacture organic light emitting diode devices. In another example, the system 500 may be configured for chemical vapor deposition or physical vapor deposition, such as sputtering deposition.

In some embodiments, the one or more material deposition sources 580 may be evaporation sources, in particular evaporation sources for depositing one or more organic materials onto a substrate to form an organic light emitting diode device layer. For example, during the process of layer deposition, the carrier 520 used to support the substrate 10 may be transferred into and through the deposition chamber, and especially along a transfer path (like a linear transfer path) through the deposition area.

Material may be emitted by one or more material deposition sources 580 in an emission direction toward a deposition area, where the substrate 10 to be coated is located in this deposition area. For example, the one or more material deposition sources 580 may provide a line source having a plurality of openings and / or nozzles. The line source is configured along one or more The material deposition source 580 is in at least one line in length. Material may be ejected through multiple openings and / or nozzles.

As shown in FIG. 5, other chambers adjacent to the vacuum chamber 502 may be provided. The vacuum chamber 502 can be separated from an adjacent chamber by a valve having a valve housing 504 and a valve unit 506. After the carrier 520 with the substrate 10 thereon is placed in the vacuum chamber 502 (as shown by the arrow), the valve unit 506 can be closed. By generating a technical vacuum, for example, using a vacuum pump connected to the vacuum chamber 502, the atmosphere in the vacuum chamber 502 can be independently controlled.

According to some embodiments, during the deposition of the deposition material, the carrier 520, the substrate 10, and the optional mask 20 are static or dynamic. According to some embodiments described herein, a dynamic deposition process may be provided, such as for manufacturing an organic light emitting diode device.

In some embodiments, the system 500 may include one or more transmission paths that extend through the vacuum chamber 502. The carrier 520 may be configured for transmission along one or more transmission paths, such as transmission through one or more material deposition sources 580. Even though one transmission path is exemplarily shown by an arrow in FIG. 5, it should be understood that the present disclosure is not limited thereto, and two or more transmission paths may be provided. For example, at least two transmission paths substantially parallel to each other may be configured for transmitting individual carriers. This one or more material deposition sources 580 may be configured between two transmission paths.

FIG. 6 shows a schematic diagram of a system 600 for processing (such as vacuum processing) a substrate 10 according to a further embodiment described herein.

According to the present disclosure, the system 600 includes two or more processing regions and a transfer device 660 configured to sequentially transfer the carrier substrate 601 to the two or more processing regions supporting the support substrate 10 and an optional mask. For example, the transporting device 660 may be configured to transport the carrier 601 in the transporting direction 1 through two or more processing areas for substrate processing. In other words, the same carrier is used to transport the substrate 10 through a plurality of processing regions. In particular, between the substrate processing in the processing region and the substrate processing in the subsequent processing region, the substrate 10 is not removed from the carrier 601, that is, the substrate stays on the same carrier to perform Two or more substrate processing procedures. According to some embodiments, the carrier 601 may be configured according to the embodiments described herein. Alternatively or alternatively, the transmission device 660 may be configured as described with respect to, for example, Figures 4A and 4B.

As exemplarily shown in FIG. 6, the two or more processing regions may include a first deposition region 608 and a second deposition region 612. Alternatively, a transmission region 610 may be provided between the first deposition region 608 and the second deposition region 612. Multiple areas can be provided in one vacuum chamber, such as two or more processing areas and transfer areas. Alternatively, multiple regions may be provided in different vacuum chambers connected to each other. For example, each vacuum chamber may provide one area. In particular, the first vacuum chamber may provide a first deposition region 608, the second vacuum chamber may provide a transfer region 610, and the third vacuum chamber may provide a second deposition region 612. In some embodiments, the first vacuum chamber and the third vacuum chamber may be referred to as "deposition chambers". The second vacuum chamber may be referred to as a "processing chamber". Other vacuum chambers or areas may be provided adjacent to the area shown in FIG. 6, for example.

The vacuum chamber or area can be separated from the adjacent area by a valve having a valve housing 604 and a valve unit 605. After the carrier 601 with the substrate 10 thereon is placed in an area (such as the second deposition area 612), the valve unit 605 can be closed. Independently by generating a technical vacuum (e.g., using a vacuum pump connected to the area) and / or by placing one or more process gases into, e.g., the first deposition area 608 and / or the second deposition area 612 Controls the atmosphere in the area. A transmission path, such as a linear transmission path, can be provided to transport the carrier 601 with the substrate 10 on it to enter, pass through, and leave the area. The transfer path may extend at least partially through two or more processing regions (such as the first deposition region 608 and the second deposition region 612) and optionally through the transfer region 610.

The system 600 may include a transmission area 610. In some embodiments, the transmission area 610 may be omitted. The transmission area 610 may be provided by a rotation module, a transmission module, or a combination thereof. FIG. 6 shows a combination of a rotation module and a transmission module. In the rotation module, the track device and the carrier arranged on the rotation module can rotate around a rotation axis (such as a vertical rotation axis). For example, the carrier may be transferred from the left side of the system 600 to the right side of the system 600, or vice versa. The transmission module may include a cross track, so that the carrier can be transmitted through the transmission modules in different directions (for example, directions perpendicular to each other).

In the deposition area, such as the first deposition area 608 and the second deposition area 612, one or more deposition sources may be provided. For example, a first deposition source 630 may be provided in the first deposition region 608. A second deposition source 650 may be provided in the second deposition region 612. The one or more deposition sources may be evaporation sources configured to deposit one or more organic layers on the substrate 10 to form an organic stack, and the organic stack is used in an organic light emitting diode device.

FIG. 7 shows a flowchart of a method 700 for non-contact transport of a carrier in a deposition system, such as a vacuum system, according to an embodiment described herein. The method 700 may utilize carriers, devices, and systems according to the present disclosure.

The method 700 includes a block 710 and a block 720. The block 710 includes a first side of a detectable device that detects a carrier. The block 720 includes at least one active magnet unit configured to be disposed on a second side of the detectable device, wherein the first side Opposite the second side. In some embodiments, when the detected signal shows a change (eg, in distance), the method 700 may determine a position (eg, at the end of the carrier in the deposition system). According to some embodiments, two or more sensors may form a group based on which individual active magnet units are controlled. For example, if the signals provided by the sensors of the active magnet unit and the signals provided by one or more adjacent sensors of the sensor are different from each other, the active magnet unit may be controlled.

In one embodiment, the current flowing through the at least one active magnet unit can be changed according to the detection signal. For example, when the carrier is “away”, the current of the active magnet unit may be gradually or continuously reduced to zero. Further, when the carrier is "close" or "entering", the current of the active magnet unit may gradually or continuously increase from 0 to a set value.

According to the embodiments described herein, a computer program, software, computer software products, and related controllers can be used to perform a method for non-contact transfer of a carrier in a deposition system, the controller having a central processing unit (CPU ), Memory, user interface, and input and output devices, the input and input devices can communicate with the corresponding components of the carrier, device, and / or system.

According to the embodiment of the present disclosure, one or more active magnet units and one or more sensors are disposed on opposite sides of the guide space. In particular, the one or more active magnet units and the one or more sensors are disposed on opposite sides of the magnet structure of the carrier. Magnetic guidance can be effectively implemented in space. Further, interference between magnetic guidance and one or more sensors can be avoided, and smooth transmission in the transmission direction of the carrier can be achieved. It is possible to reduce or even avoid substrate damage and / or particle generation due to unstable transport of the carrier.

Although the above contents are related to the embodiments of the present disclosure, other and further embodiments of the present disclosure can be designed without departing from the basic scope. The scope is determined by the scope of the following patent applications.

1‧‧‧ transmission direction

2‧‧‧horizontal

3‧‧‧ vertical

10‧‧‧ Substrate

20‧‧‧Mask

100‧‧‧ carrier

110‧‧‧Guide Structure

111‧‧‧ boot unit

112‧‧‧Active Magnet Unit

114‧‧‧controller

201‧‧‧ first end

202‧‧‧ second end

210‧‧‧Guide Structure

220‧‧‧ Carrier

222‧‧‧Magnet structure

225‧‧‧Subject

230‧‧‧Sensor

320‧‧‧ carrier

320’‧‧‧ carrier

330‧‧‧Sensor

340‧‧‧ detectable device

342‧‧‧tilt

400‧‧‧ device

410‧‧‧ carrier

412‧‧‧ support structure

450‧‧‧The first passive magnetic unit

460‧‧‧Second Passive Magnetic Unit

470‧‧‧Guide Structure

475‧‧‧active magnetic unit

480‧‧‧Drive Structure

485‧‧‧Other Active Magnetic Unit

500‧‧‧ system

502‧‧‧vacuum chamber

504‧‧‧valve housing

506‧‧‧valve unit

510‧‧‧Transmission device

520‧‧‧ carrier

580‧‧‧ material deposition source

600‧‧‧ system

601‧‧‧ carrier

604‧‧‧valve housing

605‧‧‧valve unit

608‧‧‧First deposition area

610‧‧‧Transmission area

612‧‧‧Second deposition area

630‧‧‧First sedimentary source

650‧‧‧Second sedimentary source

660‧‧‧Transmission device

700‧‧‧ Method

710‧‧‧block

720‧‧‧box

S‧‧‧Guide Space

G1‧‧‧First clearance

G2‧‧‧Second Gap

L‧‧‧ length

d‧‧‧sensor extension

In order to be able to understand the details of the above-mentioned features of this disclosure, reference may be made to the embodiments to obtain a more detailed description of the present invention simply summarized above. The attached drawings are related to the embodiments of the present invention and are described as follows: Fig. 1 shows a schematic diagram of a carrier and a guide structure; Fig. 2 shows an embodiment for non-contact transmission according to the embodiment described herein Schematic diagram of device and carrier; Figures 3A and 3B illustrate schematic diagrams of a device and a carrier for non-contact transmission according to other embodiments described herein; Figures 4A and 4B illustrate implementations according to this For example, a schematic diagram of a device and a carrier for non-contact transfer; FIG. 5 shows a schematic diagram of a system for processing a substrate according to the embodiment described herein; FIG. 6 shows a Other embodiments are schematic diagrams of a system for processing a substrate; and FIG. 7 illustrates a flowchart of a method for non-contact transport of a carrier in a deposition system according to embodiments described herein.

Claims (20)

A system for contactlessly transporting a carrier in a deposition system, comprising: a carrier; a guide structure having one or more active magnet units configured to face a magnet structure of the carrier; and one or more A sensor configured to detect the presence of the carrier, wherein the one or more active magnet units and the one or more sensors are configured to define the one or more active magnet units and the A guiding space of the magnet structure between one or more sensors; wherein the carrier includes a detectable device, the detectable device includes a geometric profile, and the geometric profile changes along a transmission direction of the carrier, It can be detected by the one or more sensors. The system according to item 1 of the patent application scope, wherein the one or more sensors are distance sensors configured to measure a distance to the carrier. The system according to item 1 or 2 of the patent application scope, wherein the one or more active magnet units are disposed on one side of the guide space, and the one or more sensors are disposed on the opposite side of the guide space On the other side in a vertical direction or a horizontal direction. The system according to item 1 or 2 of the patent application scope, wherein each of the one or more sensors has a sensor extension in a transmission direction of the carrier, wherein the The sensor extension is 1% or more of a carrier extension in the transmission direction. The system according to item 3 of the scope of patent application, wherein each of the one or more sensors has a sensor extension in a transmission direction of the carrier, wherein the sensor extension is at A carrier in the transmission direction is expanded by 1% or more. The system described in item 1 or 2 of the patent application scope further includes a driving structure with a plurality of other active magnet units. The system described in item 3 of the patent application scope further includes a driving structure with a plurality of other active magnet units. A device for contactlessly transporting a carrier in a deposition system includes: one or more sensors configured to detect the presence of the carrier, wherein each of the one or more sensors senses the The sensor has a sensor extension in a transmission direction of the carrier, and wherein the sensor extension is 1% or more of a carrier extension in the transmission direction. The device according to item 8 of the patent application scope, wherein the sensor expansion is at least 2% of the carrier expansion or at least 4% of the carrier expansion. The device according to item 8 or 9 of the scope of patent application, wherein the one or more sensors are distance sensors configured to measure a distance to the carrier. The system according to item 1 or 2 of the patent application scope, wherein the detectable device is configured to face the one or more sensors. The system as described in claim 3, wherein the detectable device is configured to face the one or more sensors. The system according to item 1 or 2 of the patent application scope, wherein the detectable device is disposed at an end portion of the carrier. The system according to item 3 of the patent application scope, wherein the detectable device is disposed at an end portion of the carrier. The system as described in claim 1 or 2, wherein the geometric contour has one or more shape elements selected from the following group: an oblique, a discontinuous, an arc, and any combination thereof . The system of claim 3, wherein the geometric profile has one or more shape elements selected from the following group: an oblique, a discontinuous, an arc, and any combination thereof. The system according to item 1 or 2 of the patent application scope, wherein the one or more sensors are configured to detect a distance between the one or more sensors and the geometric contour. The system according to item 3 of the patent application scope, wherein the one or more sensors are configured to detect a distance between the one or more sensors and the geometric contour. A method for non-contact transporting a carrier in a deposition system, comprising: detecting a first side of a detectable device of the carrier, the detectable device including a change in a transport direction of the carrier; A geometric profile; and controlling at least one active magnet unit, the at least one active magnet unit is disposed on a second side of the detectable device, and the first side is opposite to the second side. The method according to item 19 of the application, wherein the at least one active magnet unit faces a magnet structure of the carrier.