KR102171255B1 - System for non-contact transfer of carriers, and method for non-contact transfer of carriers in a deposition system - Google Patents

Abstract

The present disclosure provides an apparatus for non-contact transfer of carrier 220 in a deposition system. The device includes an inductive structure 210 having one or more active magnet units 112 configured to face the magnet structure 222 of the carrier 220, and one or more configured to detect the presence of the carrier 220. Including more than one sensor 230, one or more active magnet units 112 and one or more sensors 230 between them is an induction space (S) for the magnet structure 222 ) Are arranged to define.

Description

System for non-contact transfer of carriers, and method for non-contact transfer of carriers in a deposition system

Embodiments of the present disclosure relate to an apparatus for contactless transfer of a carrier in a deposition system, a system for contactless transfer of a carrier, and a method for contactless transfer of a carrier in a deposition system. Embodiments of the present disclosure particularly relate to an electrostatic chuck (E-chuck) for holding substrates and/or masks used in the manufacture of organic light-emitting diode (OLED) devices. will be.

Techniques for layer deposition on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates can be used in some applications and in some fields of technology. For example, coated substrates can be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used in the manufacture of television screens, computer monitors, mobile phones, other hand-held devices, and the like for displaying information. An OLED device, such as an OLED display, may comprise one or more layers of organic material lying between two electrodes, all of which are deposited on a substrate.

[0003] During processing, a substrate may be supported on a carrier configured to hold the substrate and an optional mask. The carrier may be transported contactlessly inside a deposition system, such as a vacuum deposition system, using magnetic forces. For applications such as organic light emitting devices, the purity and uniformity of organic layers deposited on a substrate must be high. Additionally, the transport and handling of carriers supporting substrates and masks using contactless transport without sacrificing throughput due to substrate breakage is a challenge.

[0004] In view of the above, new devices for non-contact transfer of a carrier in a deposition system, systems for non-contact transfer of a carrier, and in a deposition system that overcome at least some of the problems in the technical field Methods for contactless transport of the carrier are beneficial. The present disclosure aims in particular to provide carriers that can be transported efficiently and smoothly in a deposition system, such as a vacuum deposition system.

[0005] In view of the above, an apparatus for non-contact transfer of a carrier in a deposition system, a system for non-contact transfer of a carrier, and a method for non-contact transfer of a carrier in a deposition system are provided. Additional aspects, benefits, and features of the present disclosure are apparent from the claims, the detailed description, and the accompanying drawings.

[0006] In accordance with an aspect of the present disclosure, an apparatus for contactless transfer of a carrier in a deposition system is provided. The device comprises a guiding structure having one or more active magnet units configured to face the magnetic structure of the carrier, and one or more sensors configured to detect the presence of the carrier, and one or more The active magnet units and one or more sensors are arranged to define an induction space for the magnet structure between them.

[0007] In accordance with another aspect of the disclosure, an apparatus for contactless transfer of a carrier in a deposition system is provided. The device comprises one or more sensors configured to detect the presence of a carrier, each sensor of the one or more sensors having a sensor extension in the transport direction of the carrier, the sensor extension 1% or more of the carrier extension.

[0008] According to a further aspect of the present disclosure, a system for contactless transport of a carrier is provided. The system includes an apparatus for contactless transfer of a carrier according to the present disclosure, and a carrier.

[0009] According to another further aspect of the present disclosure, a method for non-contact transfer of a carrier in a deposition system is provided. The method includes detecting a first side of the detectable device of the carrier, and controlling at least one active magnet unit arranged on a second side of the detectable device opposite the first side.

[0010] Embodiments also relate to apparatuses for performing the disclosed methods, including apparatus portions for performing each described method aspect. These method aspects may be performed through hardware components, through a computer programmed by suitable software, by any combination of the two, or in any other way. Additionally, embodiments according to the present disclosure also relate to methods for operating the described apparatus. Methods for operating the described apparatus include method aspects for performing all respective functions of the apparatus.

[0011] In such a way that the above mentioned features of the present disclosure can be understood in detail, a more specific description of the present disclosure briefly summarized above may be made by reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described in the following:
1 shows a schematic diagram of a carrier and inductive structure;
2 shows a schematic view of a carrier and an apparatus for contactless transfer, according to embodiments described herein;
3A and 3B show schematic views of a carrier and an apparatus for contactless transfer, according to further embodiments described herein;
4A and 4B show schematic views of a carrier and an apparatus for contactless transport, according to embodiments described herein;
5 shows a schematic diagram of a system for substrate processing, according to embodiments described herein;
6 shows a schematic diagram of a system for substrate processing, according to additional embodiments described herein; And
7 shows a flow diagram of a method for contactless transfer of a carrier in a deposition system, according to embodiments described herein.

[0012] Reference will now be made in detail to various embodiments of the present disclosure, and one or more examples of such various embodiments are illustrated in the drawings. Within the following description of the drawings, like reference numbers refer to like components. In general, only the differences for the individual embodiments are described. Each example is provided throughout the description of the present disclosure and is not considered a limitation of the present disclosure. In addition, features illustrated or described as part of one embodiment may be used for or in conjunction with another embodiment, and further embodiments may be calculated. It is intended that the detailed description includes such modifications and variations.

[0013] In a deposition system, such as a vacuum deposition system, carriers for holding and transferring substrates and/or masks within a deposition chamber of the deposition system may be used. For example, while the substrate is supported on the carrier, one or more layers of material may be deposited on the substrate. For applications such as organic light emitting devices, a high purity and uniformity of organic layers deposited on a substrate can be beneficial. Additionally, for example to reduce substrate breakage, a smooth transfer of carriers inside the deposition system is beneficial.

[0014] In accordance with embodiments of the present disclosure, one or more active magnet units and one or more sensors are arranged on opposite sides of the induction space. In particular, one or more active magnet units and one or more sensors are arranged on opposite sides of the magnetic structure of the carrier. The space where magnetic induction is performed can be used efficiently. Additionally, interference between the magnetic induction and one or more sensors can be prevented, and smooth transfer of the carrier in the transfer direction can be achieved. Substrate breakage due to the generation of particles and/or unstable transport of the carrier can be reduced or even prevented.

1 shows a schematic view of a carrier 100 and a portion of a transfer arrangement configured for non-contact transfer of the carrier 100 in a transfer direction 1 which may be a horizontal direction.

[0016] The transfer arrangement includes an induction structure 110, which may be an active induction structure. The induction structure 110 includes a plurality of induction units 111 arranged along the transport direction. Each induction unit 111 includes an (e.g., electromagnetic) actuator, such as an active magnet unit 112, and a controller 114 configured to control the actuator, and a distance sensor configured to measure the gap for the carrier 100 ( Not shown). The induction structure 110 may be configured to levitate the carrier 100 in a non-contact manner using magnetic forces.

When the carrier 100 approaches the induction unit 111 or leaves the induction unit 111, the injured accuracy and/or injured stability may be affected. In particular, significant and/or pulse-like forces, which can lead to a sudden acceleration or deceleration of the carrier 100, when the carrier 100 approaches or leaves the induction unit 111 Can be created. This force may depend on the geometric arrangement and configuration of the components of the induction structure 110 and, in particular, of the plurality of induction units 111 (e.g., electromagnetic actuator(s) and distance sensor(s)). . This force can lead to unwanted and sudden movements of the carrier 100 and even lead to accidental mechanical contact between the carrier 100 and the guide structure 110. The carrier 100, the substrate and/or the guide structure 110 may be damaged. Additionally, particles can be created that degrade the quality of the deposition process.

[0018] A change in the force in the direction of the levitation force, and in particular in the direction of the magnetic force provided by the actuator (eg, in the vertical direction 3), or a pulse-like force, can be obtained from the carrier ( It can happen when 100) suddenly disappears. This can result in the same signal value in the distance sensor as if the carrier performs a high-speed movement away from the distance sensor in the distance (or measurement) direction, for example in the vertical direction 3. In other words, the distance sensor indicates gap expansion. The signal change may cause the controller to change the actuator force strongly to return the “moving” carrier 100 to a set distance between the guide structure 110 and the carrier 100.

In addition, when the carrier 100 approaches the induction unit 111 or leaves the induction unit 111, a force component along the transport direction 1 may be generated. This force component can even be strong enough to impede further transport of the carrier 100. The force component along the conveying direction 1 may result from the reluctance of the actuator acting on the front and/or rear surfaces of the carrier (eg leading edge or trailing edge). This is illustratively illustrated in FIG. 1 by magnetic force lines at the rear surface of the carrier 100.

[0020] FIG. 2 shows a schematic diagram of an apparatus for contactless transfer of a carrier 220 in a deposition system, according to embodiments described herein.

The device is configured to detect the presence of the inductive structure 210 with one or more active magnet units 112 configured to face the magnet structure 222 of the carrier 220, and the carrier 220 One or more sensors 230 configured. One or more active magnet units 112 and one or more sensors 230 are arranged to define an induction space S for the magnet structure 222 between them. The magnet structure 222 of the carrier 220 extends along the transport direction 1 of the carrier 220. Likewise, one or more active magnet units 112 are arranged along the transport direction 1 of the carrier 220. The magnet structure 222 may be a ferromagnetic material extending along the length of the carrier 220.

In some embodiments, the magnet structure 222 may provide a sensor trail for one or more sensors 230. In further embodiments, the sensor trail is provided by a separate element that can be attached to the magnetic structure 222. Examples of sensor trails that may be provided by a separate element are illustrated in FIG. 3A in the form of a detectable device, such as an inclination.

[0023] According to some embodiments that may be combined with other embodiments described herein, with respect to the vertical direction 3, one or more active magnet units 112 are above the induction space S. Arranged, and one or more sensors 230 are arranged under the induction space S. The distance between one or more active magnet units 112 and one or more sensors 230 defining the induction space S, e.g. in the vertical direction 3, is the magnetic structure 222 in the same direction. Can be larger than the extension of ). In particular, a first gap G1 may be provided between the magnet structure 222 and one or more active magnet units 112, for example in the vertical direction 3. Likewise, a second gap G2 may be provided between the magnet structure 222 and one or more sensors 230, for example in the vertical direction 3. The first gap G1 and the second gap G2 may be essentially the same or may be different. The gaps may prevent interference or contact between the carrier 220 and the transfer arrangement, for example due to small vertical and/or horizontal movements of the carrier 220 during transfer of the carrier 220.

[0024] The carrier 220 performs non-contact transfer through a transfer path, such as through one or more chambers of the deposition system, such as a vacuum chamber, and in particular through at least one deposition area, along a linear transfer path. Is configured for The carrier 220 may be configured for non-contact transfer in the transfer direction 1, and the transfer direction 1 may be a horizontal direction.

[0025] In accordance with some embodiments that may be combined with other embodiments described herein, the deposition system includes a transfer arrangement configured for contactless floating and/or non-contact transfer of the carrier 220 in the deposition system. can do. The transfer management unit may include an induction structure 210 for providing a magnetic levitation force for floating the carrier 220, and a driving structure for moving the carrier 220 in the transfer direction 1. The magnet structure 222 of the carrier 220 may be composed of one or more first magnet units configured to magnetically interact with the inductive structure. In some implementations, the one or more first magnet units may be passive magnet units, such as permanent magnets unit and/or ferromagnetic components.

[0026] According to some embodiments that may be combined with other embodiments described herein, the carrier 220 magnetically mutually with a drive structure for moving the carrier 220 in the transport direction (1). And another magnetic structure composed of one or more second magnetic units (not shown) configured to act. In some implementations, the one or more second magnet units may be passive magnet units, such as ferromagnetic materials. The induction structure 210 and the drive structure may be arranged at opposite ends or end portions of the carrier 220. Specifically, one or more first magnet units and one or more second magnet units may be arranged at opposite ends or end portions of the carrier 220.

[0027] The deposition system, and in particular, the transfer arrangement may include an induction structure having a plurality of induction units 111. Each induction unit 111 is an actuator, such as an active magnet unit 112, a controller 114 configured to control this actuator, and a magnet structure and in particular one or more first magnet units and actuators of this magnet structure. It may include individual sensors 230 configured to detect or measure gaps therebetween. The gap, such as the first gap G1, may be measured in a direction perpendicular to the transport direction 1, such as a vertical direction 3. In particular, the sensor 230 detects or measures a gap between the one or more first magnetic units and the active magnet unit 112, for example when the carrier 220 is in the sensor 230 , It may be arranged to face one or more first magnet units. The sensor 230 may be a distance sensor.

The controller 114 may be configured to control the active magnet unit 112 to adjust the magnetic force provided by the actuator based on the gap measured by the sensor 230. In particular, the controller 114 is active in order to ensure that the distance between the one or more first magnet units and the active magnet unit 112 is essentially constant while the carrier 220 is transported through the deposition system. It may be configured to control the magnet unit 112. Although Figure 2 illustratively illustrates that each induction unit 111 has its own controller, the present disclosure is not limited thereto, and that the controller may be assigned to two or more induction units. It must be understood. For example, one single controller can be provided for all induction units.

[0029] The carrier 220 may be configured to hold a substrate and/or a mask (not shown) used during substrate processing, such as vacuum processing. In some implementations, the carrier 220 can be configured to support both a substrate and a mask. In further implementations, the carrier 220 can be configured to support either a substrate or a mask. In such case, the carrier 220 may be referred to as "substrate carrier" and "mask carrier", respectively.

[0030] The carrier 220 may include a support structure or body 225 that provides a support surface, which support surface may be essentially planar configured to contact the bottom surface of the substrate, for example. In particular, the substrate may have an opposite front surface (also referred to as a “processing surface”) at the bottom, and a layer is deposited on this front surface during processing, such as a vacuum deposition process. The magnet structure 222 may be provided on the body 225.

[0031] The term "vacuum" as used throughout the present disclosure may be understood in the sense of a technical vacuum having a vacuum pressure of less than 10 mbar, for example. The pressure in the vacuum chamber may be from 10 ^-5 mbar to about 10 ^-8 mbar, specifically, from 10 ^-5 mbar to 10 ^-7 mbar, and more specifically from about 10 ^-6 mbar to about 10 ^-7 mbar. One or more vacuum pumps, such as turbo pumps and/or cryo-pumps, connected to the vacuum chamber may be provided for the creation of a vacuum inside the vacuum chamber.

The carrier 220 according to the present disclosure may be an electrostatic chuck (E-chuck) that provides an electrostatic power for holding the substrate and/or mask to the carrier 220. For example, the carrier 220 includes an electrode arrangement configured to provide an attractive force acting on at least one of a substrate and a mask. The electrode arrangement may be embedded in the body 225, or provided on the body 225, for example, may be disposed. In accordance with some embodiments, which may be combined with other embodiments described herein, body 225 is a dielectric body, such as a dielectric plate. The dielectric body can be made of a dielectric material, preferably a dielectric material of high thermal conductivity, such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina or equivalent material, but can be made as polyimide from such materials. . In some embodiments, the electrode arrangement comprises a plurality of electrodes disposed on a dielectric plate and covered with a thin dielectric layer, such as a grid of fine metal strips.

[0033] An electrode arrangement, and in particular, a plurality of electrodes may be configured to provide an attractive force, such as a chucking force. The attractive force may be a force acting on the substrate and/or mask at a predetermined relative distance between the plurality of electrodes (or support surface) and the substrate and/or mask. The attractive force may be constant power provided by voltages applied to the plurality of electrode arrangements.

[0034] The substrate may be pulled toward the support surface (eg, in a direction perpendicular to the transport direction) by an attraction provided by the carrier 220, which may be an E-chuck. The attractive force may be strong enough to hold the substrate in a vertical position, for example by friction forces. In particular, the attractive force can be configured to fix the substrate on the support surface in an essentially immobile manner. For example, to hold a 0.5 mm glass substrate in a vertical position using friction forces, an attracting pressure of about 50 to 100 N/m ² (Pa) may be used, depending on the coefficient of friction.

[0035] In accordance with some embodiments that may be combined with other embodiments described herein, the carrier 220 is configured to hold or support the substrate and/or mask in a substantially vertical orientation or in a substantially horizontal orientation. Is composed. In particular, the carrier can be configured for transport in a vertical orientation. As used throughout the present disclosure, "substantially perpendicular" refers to a deviation from a vertical direction or orientation, in particular of ±20° or less, such as ±10° or less, especially when referring to a substrate orientation. It is understood to allow. This deviation can be provided, for example, because a substrate support having a slight deviation from the vertical orientation can lead to a more stable substrate position. Additionally, when the substrate is tilted forward, fewer particles reach the substrate surface. However, for example, the substrate orientation during the deposition process is considered to be substantially vertical, which is considered different from the horizontal substrate orientation, which can be considered as horizontal ±20° or less.

[0036] The term "vertical direction" or "vertical orientation" is understood to distinguish between "horizontal direction" or "horizontal orientation". That is, "vertical direction" or "vertical orientation" relates, for example, to a substantially vertical orientation of the carrier and the substrate, where a deviation of several degrees, such as up to 10° or even up to 15° from the correct vertical direction or vertical orientation is still It is considered as "substantially vertical orientation" or "substantially vertical orientation". The vertical direction can be substantially parallel to gravity.

[0037] The embodiments described herein can be utilized for evaporation on large area substrates, for example, for manufacturing an OLED display. Specifically, the substrates on which structures and methods according to embodiments described herein are provided are large area substrates. For example, a large-area substrate or carrier has a GEN 4.5 corresponding to a surface area of about 0.67 m² (0.73 x 0.92 m), a GEN 5 corresponding to a surface area of about 1.4 m² (1.1 mx 1.3 m), and a GEN 5 of about 4.29 m² (1.95 mx 2.2 m). m), GEN 7.5, corresponding to a surface area of about 5.7 m² (2.2 mx 2.5 m), GEN 8.5, or even GEN 10, corresponding to a surface area of about 8.7 m² (2.85 mx 3.05 m). Even larger generations, such as GEN 11 and GEN 12, and corresponding surface areas can be similarly implemented. Half sizes of GEN generations can also be provided in OLED display manufacturing.

[0038] In accordance with some embodiments that may be combined with other embodiments described herein, the substrate thickness may be 0.1 to 1.8 mm. The substrate thickness may be about 0.9 mm or less, such as 0.5 mm. As used herein, the term “substrate” may in particular encompass substantially inflexible substrates, such as slices of transparent crystals such as wafers, sapphire, or the like, or a glass plate. However, the present disclosure is not limited thereto, and the term “substrate” may also encompass flexible substrates, such as a web or foil. The term “substantially inflexible” is understood to distinguish between “flexible”. Specifically, a substantially non-flexible substrate, such as a glass plate having a thickness of 0.9 mm or less, such as 0.5 mm or less, may have some degree of flexibility, wherein when compared to flexible substrates, substantially As a result, the flexibility of the non-flexible substrate is small.

[0039] In accordance with the embodiments described herein, the substrate may be made of any material suitable for material deposition. For example, the substrate may be made of glass (e.g., soda lime glass, borosilicate glass, etc.), metal, polymer, ceramic, compound materials, carbon fiber materials, or any other material or combination of materials that may be coated by a deposition process. It can be made of a material selected from the group consisting of.

3A shows a schematic diagram of an apparatus for non-contact transfer of a carrier 320 in a deposition system, according to embodiments described herein. The device and carrier 320 of FIG. 3A is similar to the device and carrier illustrated in FIG. 2, and descriptions of similar or identical elements are not repeated.

[0041] According to some embodiments, which may be combined with other embodiments described herein, the carrier 320 is by one or more sensors 230 for detecting the presence of the carrier 320. And a detectable detectable device 340 that is detectable. In some implementations, for example, when the detectable device 340 is located on an individual sensor(s), for example, when located on the individual sensor(s), the detectable device 340 may be one or more It is arranged to face the sensors 230. According to some embodiments, one or more sensors 230 are directed towards a first sensor trail provided by detectable device 340, and actuators, such as one or more active magnet units 112 ) Faces the magnet structure 222 and, in particular, the actuator trail provided by one or more first magnet units. The detectable device 340 may have a first side and a second side opposite the first side. For example, the first side may be the lower surface of the detectable device 340 and the second side may be the upper surface of the detectable device 340. One or more sensors 230 may be directed toward the first side. One or more active magnet units 112 may face the second side.

[0042] The detectable device 340 and the magnet structure 222 may be formed integrally, or may be provided as separate elements. According to some embodiments, which may be combined with other embodiments described herein, the detectable device 340 and the magnet structure 222, and in particular, one or more first magnet units, are, for example, the direction of transport. It can be arranged adjacent to each other in a plane parallel to (1), such as in an essentially horizontal plane. For example, the detectable device 340 can be attached to the magnetic structure 222 of the carrier 320 having one or more first magnetic units.

[0043] The detectable device 340 is arranged at the end portion of the carrier 320 and can extend along the conveying direction 1. To determine the position of the carrier 320 relative to at least one of the plurality of induction units 111 of the inductive structure 210 or the positions of the ends of the carrier 320, the detectable device 340 is deposited It may be detectable by one or more sensors 230 of the system's transport arrangement. In this regard, the detectable device 340 may also be referred to as a “sensor trail”.

[0044] The carrier 320 has an end portion(s), such as a first end portion and a second end portion opposite the first end portion. The substrate may be positioned between the first end portion and the second end portion. The first end portion can be a top (or top) end portion, and the second end portion can be a bottom (or bottom) end portion. The first end portion and the second end portion may extend essentially parallel, for example in an essentially horizontal direction. The detectable device 340 may be provided at the first end portion and/or the second end portion. The example of FIG. 3A illustratively illustrates the detectable device 340 and magnet structure 222 at a first end portion that is a top or upper end portion of the carrier 320. The detectable device 340 and the magnet structure 222, in particular one or more first magnet units, can be directed towards the guide structure 210 of the transfer arrangement. One or more second magnet units may be located at a second end portion, which may be a bottom or lower end portion of the carrier 320. One or more second magnetic units may be directed towards the drive structure of the transfer arrangement.

[0045] According to some embodiments, which may be combined with other embodiments described herein, the detectable device 340 is, for example, the entire length L of the carrier 320 in the transport direction 1 It is an element that extends over. The length L of the carrier 320 is defined along the conveying direction 1, for example, defined between the first end 201 and the second end 202 of the carrier 320 along the conveying direction 1 Can be.

In some implementations, the detectable device 340 is, or includes, a geometric profile that varies along the transport direction 1 and is detectable by one or more sensors 230. One or more of the sensors 230 may be distance sensors configured to detect a distance between an individual sensor and a geometrical profile, and in particular between an individual sensor and a surface of the geometrical profile facing the individual sensor. The distance may be measured in a direction perpendicular to the transport direction 1, such as a vertical direction 3 or a horizontal direction 2. In some implementations, each induction unit 111 includes a separate sensor for detecting a geometrical profile.

[0047] The geometrical profile can vary along the conveying direction 1 between the first end 201 and the second end 202 of the carrier 320. The geometrical profile can provide a sensor trail extending between the first end 201 and the second end 202. The term "geometric profile", as used throughout the present disclosure, extends in the conveying direction (1) and is at least one direction perpendicular to the conveying direction (1) and the conveying direction (1), such as a vertical direction (3). Refers to a profile or an element having a profile that has a non-uniform (or varying) cross-sectional shape in the plane defined by. The geometrical profile is a front or leading edge that can define the outermost boundary of the carrier 320 in the first end 201 of the carrier 320 (e.g., in the transport direction 1) when viewed in the transport direction 1 ) And the second end 202 (e.g., a rear surface or trailing edge that may define the outermost boundary of the carrier 320 in a direction opposite to the transport direction 1). In other words, the varying geometric profile does not refer to an edge at the first end 201 or the second end 202 of the carrier 320, but can be detected by one or more sensors 230. There are additional structural variations between the first end 201 and the second end 202.

[0048] In accordance with some embodiments, which may be combined with other embodiments described herein, the geometrical profile includes one or more shape elements. In some implementations, the one or more shape elements may be selected from the group including discontinuities, inclinations, arc shapes, and any combination thereof. For example, the geometrical profile is an element extending along the length of the carrier 220 and may have one or more shape elements, such as one or more slopes 342.

In some embodiments, one or more shape elements, such as slopes, are arranged at the first end 201 and/or the second end 202 of the carrier 320. For example, at least one first shape element can be arranged at the first end 201 and/or at least one second shape element can be arranged at the second end 202. The at least one first shape element and the at least one second shape element may be essentially the same or may be different. In the example of FIG. 3A, both at least one first shape element and at least one second shape element are slopes of the element that provide a geometric profile.

[0050] One or more shape elements may be arranged at the ends of the carrier 320 so that where the ends of the carrier 320 are located relative to the guide structure 210 may be determined. One or more active magnet units 112 of the induction units 111 can be controlled to provide a smooth transfer of the carrier 320 in the transfer direction 1. In particular, actuators located at the edge(s) of the carrier and/or to which the edge(s) approaches can be controlled. For example, in order to provide a smooth transition of the ends of the carrier 320 between adjacent actuators/magnet units, the magnetic force provided by the actuator(s) may be continuously increased or decreased. For example, when the carrier 320 “leaves” the actuator, the operation of the actuator may be reduced so that the actuator essentially does not exert any force on the carrier 320.

[0051] According to some embodiments, an individual shape element of one or more shape elements may have a length extension along the length of the carrier 320 and/or the geometrical profile in the transport direction 1. The length extensions of the individual shape elements may correspond to at least 1% of the length of the carrier 320 and/or the geometric profile, specifically at least 4% of the length, specifically at least 8% of the length.

[0052] FIG. 3A illustratively illustrates the slopes 342 as one or more shape elements. However, the disclosure is not limited thereto, and other shape elements such as cutouts or continuously changing shapes may be provided. In some implementations, the inclined portion 342 can be a surface of the carrier 320 that is inclined with respect to the transport direction 1. For example, the inclined portion 342 may be inclined with respect to a horizontal plane. In some embodiments, the slopes 342 are arranged at the first end 201 and/or the second end 202 of the carrier 320. For example, at least one first slope may be arranged at the first end 201 of the carrier 320, and/or at least one second slope may be arranged at the second end 202 of the carrier 320. I can. The at least one first slope and at least one second slope may be sloped in opposite directions. In particular, at least one first slope and at least one second slope may be mirror-symmetric.

The sensors 230 may be arranged to face the inclined portions 342. In particular, the sensors 230 may be configured to detect the inclined portions 342 when the carrier 320 moves in the transport direction 1. The detected distance between the sensor and the inclined portion increases or decreases depending on the conveying direction 1 and/or the inclined portion direction. One or more active magnet units of the induction units 111 can be controlled to provide a smooth transfer of the carrier 320 in the transfer direction. In particular, actuators positioned on the inclined portion(s) can be controlled. For example, to provide a smooth transition of the ends of the carrier between adjacent actuators/magnet units, based on the varying distance provided by the slope, the magnetic force provided by the actuator(s) continues to increase or Can be reduced. In particular, in Fig. 3A, the slope on the left side of the carrier may cause a detection signal in the sensor as if the carrier moves upward. The controller may, for example, reduce the actuator force by reducing the actuator current so that the actuator does not exert a levitation force on the carrier when the carrier "leaves" the actuator on the left.

[0054] FIG. 3B shows a schematic diagram of an apparatus for contactless transfer of a carrier 320' in a deposition system, according to embodiments described herein. The device and carrier 320' of FIG. 3B is similar to the device and carrier illustrated in FIG. 3A, and descriptions of similar or identical elements are not repeated.

[0055] In accordance with an aspect of the present disclosure, an apparatus for contactless transfer of a carrier 320 ′ in a deposition system includes one or more sensors 330 configured to detect the presence of a carrier 320 ′. do. Each sensor of one or more sensors 330 has a sensor extension (d) in the transfer direction (1) of the carrier (320'), where the sensor extension (d) is the transfer direction (1) As a carrier extension, that is, at least 1%, specifically at least 2%, specifically at least 4%, specifically at least 8%, and more specifically at least 10% of the length L of the carrier. The sensor extension (d) is even 10% or more, specifically 15% or more, specifically 20% or more, and more specifically 25% or more of the length L of the carrier 320'. Can be

One or more sensors 330 extend in the transport direction (1). When the carrier 320' (or the sensor trail of the carrier 320') leaves the sensor 330, the signal or signal value of the sensor 330 is as if the carrier 320' moves upward (slowly). Change gradually in the same way. The force provided by the active magnet unit 112 can be (gradually) reduced to zero according to the signal change, so that smooth transport of the carrier 320' can be achieved. Incremental (or ramped) signal change can be achieved by elongated sensors. Conversely, the short sensors illustrated in FIG. 2, for example, provide an abrupt signal change when the sensor reaches the edge of the carrier. This embodiment can reduce or even prevent the generation of pulse-like forces that can lead to sudden acceleration or deceleration of the carrier.

4A and 4B show schematic views of an apparatus 400 for non-contact transfer of a carrier 410, according to embodiments described herein. The device and carrier 410 may be configured according to some embodiments described herein.

Device 400, according to the present disclosure, a transport arrangement having an inductive structure 470 comprising a plurality of active magnetic units 475, one or more for detecting the presence of a carrier 410 It includes excess sensors (not shown), and a carrier 410. One or more sensors may be configured to detect a distance between the one or more sensors and a detectable device of the carrier 410. The apparatus 400 may further include a controller configured to selectively control at least one of the plurality of active magnet units 475 based on detection data provided by the one or more sensors. have. In accordance with some embodiments described herein, the transfer arrangement may be arranged in a vacuum chamber of a vacuum system. The vacuum chamber may be a vacuum deposition chamber. However, the present disclosure is not limited to vacuum systems, and the carriers and transfer arrangements described herein may be implemented in atmospheric environments.

[0059] The carrier 410 is one or more first magnetic units configured to magnetically interact with the induction structure 470 of the vacuum system, to provide a magnetic levitation force for floating the carrier 410 It may include a magnetic structure having the. One or more of the first magnetic units may be a first passive magnetic unit 450. The guide structure 470 may extend in the transport direction 1 of the carrier 410, which may be in a horizontal direction. The inductive structure 470 may include a plurality of active magnetic units 475. Carrier 410 may be movable along guide structure 470. A first passive magnetic unit 450, e.g., a bar of ferromagnetic material, and a plurality of active magnetic units 475 of the inductive structure 470 are configured to provide a first magnetic levitation force to levitate the carrier 410 Can be. Devices for levitating as described herein are, for example, devices for providing a non-contact force to levitate the carrier 410.

In accordance with some embodiments, the transfer arrangement may further include a drive structure 480. The drive structure 480 may include a plurality of additional magnetic units, such as additional active magnetic units. Carrier 410 may include one or more second magnet units configured to magnetically interact with drive structure 480. In particular, the one or more second magnetic units may be a second passive magnetic unit 460 for interacting with additional active magnetic units 485 of the drive structure 480, such as a bar of ferromagnetic material.

[0061] Figure 4b shows another side view of the transfer arrangement. In FIG. 4B, an active magnetic unit of a plurality of active magnetic units 475 is shown. The active magnetic unit provides a magnetic force that interacts with the first passive magnetic unit 450 of the carrier 410. For example, the first passive magnetic unit 450 may be a rod of ferromagnetic material. The rod may be part of the carrier 410, which is connected to the support structure 412. The support structure 412 may be provided by the body of the carrier 410. In addition, the rod or the first passive magnetic unit may be integrally formed with the support structure 412 for supporting the substrate 10, respectively. The detectable device may be attached to the first passive magnetic unit 450 or may be provided by the first passive magnetic unit 450. The carrier 410 may further include a second passive magnetic unit 460, such as an additional rod. Additional rods may be connected to the carrier 410. Further, the rod or the second passive magnetic unit may be formed integrally with the support structure 412, respectively.

[0062] The term "passive" magnetic unit is used herein to distinguish it from the notion of "active" magnetic unit. A passive magnetic unit may refer to an element having magnetic properties that do not undergo active control or coordination—at least not during operation of the transfer arrangement. For example, the magnetic properties of a passive magnetic unit, such as a rod of a carrier or an additional rod, generally do not undergo active control during movement of the carrier through a vacuum chamber or vacuum system. According to some embodiments, which may be combined with other embodiments described herein, the controller of the transfer arrangement is not configured to control the passive magnetic unit. The passive magnetic unit can be adapted to generate a magnetic field, such as a static magnetic field. The passive magnetic unit may not be configured to generate an adjustable magnetic field. The passive magnetic unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnetic properties.

In accordance with embodiments described herein, the plurality of active magnetic units 475 provides magnetic force to the first passive magnetic unit 450 and consequently the carrier 410. The plurality of active magnetic units 475 floats the carrier 410. Additional active magnetic units 485 may drive the carrier 410 in a vacuum chamber, for example along the transport direction 1. The plurality of additional active magnetic units 485 is a drive structure for moving the carrier 410 in the transport direction 1 while being floated by the plurality of active magnetic units 475 positioned on the carrier 410 To form. Additional active magnetic units 485 may interact with the second passive magnetic unit 460 to provide force along the transport direction 1. For example, the second passive magnetic unit 460 may include a plurality of permanent magnets arranged in an alternating polarity. The resulting magnetic fields of the second passive magnetic unit 460 may interact with a plurality of additional active magnetic units 485 to move the carrier 410 while it is floating.

[0064] In order to float the carrier 410 using a plurality of active magnetic units 475 and/or to move the carrier 410 using a plurality of additional active magnetic units 485, active magnetic Units can be controlled to provide adjustable magnetic fields. The adjustable magnetic field can be a static or dynamic magnetic field. According to embodiments that can be combined with other embodiments described herein, the active magnetic unit is configured to generate a magnetic field for providing a magnetic levitation force extending along the vertical direction 3. According to other embodiments, which may be combined with the additional embodiments described herein, the active magnetic unit may be configured to provide a magnetic force extending along the transverse direction. The active magnetic unit described herein may be or include an element selected from the group consisting of an electromagnetic device, a solenoid, a coil, a superconducting magnet, or any combination thereof.

[0065] Embodiments described herein relate to non-contact floating, transfer and/or alignment of a carrier, substrate and/or mask. The present disclosure refers to a carrier that may include one or more elements of a group consisting of a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support. The term "non-contact" as used throughout this disclosure may be understood to mean, for example, that the weight of the carrier and substrate is held by magnetic forces, not by mechanical contact or mechanical forces. Specifically, the carrier is kept in a floating or floating state using magnetic forces instead of mechanical forces. As an example, the transport arrangement described herein may not have any mechanical devices, such as mechanical rails, to support the weight of the carrier. In some implementations, there may be no mechanical contact between the carrier and the rest of the device, such as during floatation and movement of the carrier in the vacuum system.

In accordance with embodiments of the present disclosure, levitating or levitating refers to the state of an object, where the objects float without mechanical contact or support. Additionally, moving an object refers to providing a force in a direction different from a driving force, such as a levitation force, wherein the object is moved from one position to another different position. For example, an object, such as a carrier, can be floated, ie, it can be lifted by a force counteracting gravity, and while being floated, it can move in a direction different from that parallel to gravity.

[0067] In accordance with the embodiments described herein, the non-contact flotation and transfer of the carrier may result in any particles resulting from mechanical contact between the carrier and sections of the transfer arrangement, such as mechanical rails, during transfer or alignment of the carrier. It is beneficial in that it is not generated. Accordingly, the embodiments described herein provide improved purity and uniformity of the layers deposited on the substrate, since particle generation is minimized, particularly when using contactless flotation, transfer and/or alignment. .

5 shows a system 500 for substrate processing, according to embodiments described herein. System 500, which may be a vacuum system, may be configured to deposit one or more layers of, for example, an organic material on a substrate 10.

The system 500 includes a deposition chamber, such as a vacuum chamber 502, a carrier 520 according to embodiments described herein, and a transfer arrangement 510 configured for transfer of the carrier 520 in the deposition chamber. Includes. In some implementations, system 500 includes one or more material deposition sources 580 in a deposition chamber. The carrier 520 may be configured to hold the substrate 10 during a deposition process, such as a vacuum deposition process. System 500 may be configured for the manufacture of OLED devices, such as for evaporation of organic materials. In another example, system 500 may be configured for CVD or PVD, such as sputter deposition.

[0070] In some implementations, the one or more material deposition sources 580 are evaporation sources, in particular, evaporation to deposit one or more organic materials on a substrate to form a layer of an OLED device. It can be sources. For example, the carrier 520 for supporting the substrate 10 during the layer deposition process can be transferred into and through the deposition chamber, and in particular through the deposition region, along a transfer path, such as a linear transfer path. .

[0071] The material may be emitted from one or more material deposition sources 580 in an emission direction towards the deposition region in which the substrate 10 to be coated is located. For example, one or more material deposition sources 580 may be a line having a plurality of openings and/or nozzles arranged in at least one line along the length of the one or more material deposition sources 580. You can provide the source. The material may be discharged through a plurality of openings and/or nozzles.

As indicated in FIG. 5, additional chambers may be provided adjacent to the vacuum chamber 502. The vacuum chamber 502 can be separated from adjacent chambers by a valve having a valve housing 504 and a valve unit 506. After the carrier 520 on which the substrate 10 is placed is inserted into the vacuum chamber 502 as indicated by the arrow, the valve unit 506 can be closed. By creating a technical vacuum using, for example, vacuum pumps connected to the vacuum chamber 502, the atmosphere in the vacuum chamber 502 can be individually controlled.

[0073] In accordance with some embodiments, the carrier 520, the substrate 10, and optionally the mask 20 are static or dynamic during the deposition of the deposition material. In accordance with some embodiments described herein, for example, for the manufacture of OLED devices, a dynamic deposition process may be provided.

In some implementations, system 500 may include one or more transport paths extending through vacuum chamber 502. The carrier 520 may be configured for transport along one or more transport paths, such as past one or more material deposition sources 580. In FIG. 5, one transport path is illustrated by way of an arrow, but it should be understood that the present disclosure is not limited thereto, and two or more transport paths may be provided. For example, at least two transport paths can be arranged substantially parallel to each other for transport of individual carriers. One or more material deposition sources 580 may be arranged between the two transport paths.

6 shows a schematic diagram of a system 600 for processing of a substrate 10, such as vacuum processing, according to further embodiments described herein.

The system 600 is configured to sequentially transfer two or more processing regions, and a carrier 601 supporting the substrate 10 and optionally the mask, to the two or more processing regions. , And a transfer arrangement 660 according to the present disclosure. For example, the transfer arrangement 660 may be configured to transfer the carrier 601 along the transfer direction 1 through two or more processing zones for substrate processing. In other words, the same carrier is used for transport of the substrate 10 through multiple processing regions. In particular, the substrate 10 is not removed from the carrier 601 between substrate processing in the processing zone and subsequent processing in the processing zone, i.e. the substrate is the same for two or more substrate processing procedures. Stay on the carrier. According to some embodiments, the carrier 601 may be configured according to the embodiments described herein. Alternatively or alternatively, the transfer arrangement 660 may be configured as described with respect to FIGS. 4A and 4B, for example.

As illustratively illustrated in FIG. 6, the two or more processing zones may include a first deposition zone 608 and a second deposition zone 612. Optionally, a transfer zone 610 may be provided between the first deposition zone 608 and the second deposition zone 612. A plurality of zones, such as two or more processing zones and a transfer zone, may be provided in one vacuum chamber. Alternatively, a plurality of zones may be provided in different vacuum chambers connected to each other. For example, each vacuum chamber can provide one zone. Specifically, a first vacuum chamber can provide a first deposition zone 608, a second vacuum chamber can provide a transfer zone 610, and a third vacuum chamber can provide a second deposition zone 612. Can provide. In some implementations, the first vacuum chamber and the third vacuum chamber may be referred to as “deposition chambers”. The second vacuum chamber may be referred to as a “processing chamber”. Adjacent to the zones shown in the example of FIG. 6, additional vacuum chambers or zones may be provided.

Vacuum chambers or zones may be separated from adjacent zones by a valve with a valve housing 604 and a valve unit 605. After the carrier 601 on which the substrate 10 is placed has been inserted into the zone, such as the second deposition zone 612, the valve unit 605 may be closed. Zones, such as by creating a technical vacuum using vacuum pumps connected to the zones, and/or by inserting one or more process gases into, for example, first deposition zone 608 and/or second deposition zone 612 The atmosphere within the field can be individually controlled. In order to transport the carrier 601 carrying the substrate 10 thereon into, through, and out of the zones, a transfer path, such as a linear transfer path, may be provided. The transfer path may extend at least partially through two or more processing zones, such as first deposition zone 608 and second deposition zone 612, and optionally, through transfer zone 610. have.

[0079] System 600 may include a delivery zone 610. In some embodiments, the delivery zone 610 may be omitted. The delivery zone 610 may be provided by a rotating module, a transit module, or a combination thereof. 6 illustrates a combination of a rotation module and a transit module. In the rotation module, the track arrangement and the carrier(s) arranged on the track arrangement can be rotated around an axis of rotation, such as a vertical axis of rotation. For example, the carrier(s) may be transferred from the left side of the system 600 to the right side of the system 600, or vice versa. The transit module may comprise crossing tracks such that the carrier(s) can be conveyed through the transit module in different directions, eg directions perpendicular to each other.

[0080] One or more deposition sources may be provided within deposition zones, such as first deposition zone 608 and second deposition zone 612. For example, first deposition sources 630 may be provided in the first deposition zone 608. A second deposition source 650 may be provided in the second deposition zone 612. The one or more deposition sources may be evaporation sources configured for the deposition of one or more organic layers on the substrate 10 to form an organic layer stack for an OLED device.

7 shows a flow diagram of a method 700 for contactless transfer of a carrier in a deposition system, such as a vacuum system, according to embodiments described herein. Method 700 may utilize carriers, devices, and systems according to the present disclosure.

[0082] The method 700 includes, at block 710, detecting a first side of the detectable device of the carrier, and at block 720, on a second side of the detectable device, opposite the first side. And controlling at least one active magnet unit arranged in the. In some implementations, the method 700 can determine the position of the ends of the carrier in the deposition system, such as when the detected signals indicate a change in distance, for example. According to some embodiments, two or more sensors may form a group, and based on this group, an individual active magnet unit is controlled. For example, if the signal provided by the sensor of the active magnet unit and the (a) signal(s) provided by one or more neighboring sensors of the sensor are different from each other, the active magnet unit can be controlled.

In one embodiment, the current flowing through the at least one active magnet unit may be changed according to the detection signals. For example, for an active magnet unit where the carrier "leaves" the current can be gradually or continuously reduced to zero. Additionally, for an active magnet unit to which the carrier "approaches" or "enters" the current can be incrementally or continuously increased from zero to a set value.

[0084] In accordance with embodiments described herein, a method for contactless transfer of a carrier in a deposition system may be performed using computer programs, software, computer software products, and interrelated controllers, Associated controllers may have input and output devices that communicate with the CPU, memory, user interface, and corresponding components of the carrier, apparatus, and/or system.

[0085] According to embodiments of the present disclosure, one or more active magnet units and one or more sensors are arranged on opposite sides of the induction space. In particular, one or more active magnet units and one or more sensors are arranged on opposite sides of the magnetic structure of the carrier. The space where magnetic induction is performed can be used efficiently. Additionally, magnetic induction and interference between one or more sensors can be prevented, and smooth transfer of the carrier in the transfer direction can be achieved. Substrate breakage due to the generation of particles and/or unstable transport of the carrier can be reduced or even prevented.

[0086] Although the above description relates to embodiments of the present disclosure, other and additional embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is It is determined by the following claims.

Claims (15)

As a system for non-contact transport of carriers in a deposition system,
carrier;
A guiding structure having one or more active magnet units configured to face the magnet structure of the carrier; And
One or more sensors configured to detect the presence of the carrier
Including,
The one or more active magnet units and the one or more sensors define an induction space for the magnet structure between the one or more active magnet units and the one or more sensors. Are arranged to be
The carrier comprises a detectable device, the detectable device comprising a geometric profile that varies along the transport direction of the carrier and is detectable by the one or more sensors,
The geometrical profile having one or more shape elements,
System for non-contact transport of carriers in deposition systems. The method of claim 1,
The one or more sensors are distance sensors configured to measure the distance to the carrier,
System for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
With respect to the vertical or horizontal direction, the one or more active magnet units are arranged on one side of the induction space, and the one or more sensors are arranged on the other side of the induction space,
System for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
Each sensor of the one or more sensors has a sensor extension in the transport direction of the carrier, and the sensor extension is 1% or more of the carrier extension in the transport direction,
System for non-contact transport of carriers in deposition systems. The method of claim 3,
Each sensor of the one or more sensors has a sensor extension in the conveying direction of the carrier, and the sensor extension is 1% or more of the carrier extension in the conveying direction,
System for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
Further comprising a drive structure having a plurality of additional active magnet units,
System for non-contact transport of carriers in deposition systems. As an apparatus for non-contact transfer of carriers in a deposition system,
And one or more sensors configured to detect the presence of the carrier, each sensor of the one or more sensors having a sensor extension in the transport direction of the carrier, and the sensor extension part of the carrier in the transport direction 1% or more of the extension,
Apparatus for non-contact transport of carriers in deposition systems. The method of claim 7,
The sensor extension is at least 2% of the carrier extension or at least 4% of the carrier extension,
Apparatus for non-contact transport of carriers in deposition systems. The method according to claim 7 or 8,
The one or more sensors are distance sensors configured to measure the distance to the carrier,
Apparatus for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
The detectable device is arranged to face the one or more sensors,
System for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
The detectable device is arranged at the end portion of the carrier,
System for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
The one or more shape elements are selected from a group consisting of an inclination, a discontinuity, an arc shape, and any combination thereof,
System for non-contact transport of carriers in deposition systems. The method according to claim 1 or 2,
The one or more sensors are configured to detect a distance between the one or more sensors and the geometrical profile,
System for non-contact transport of carriers in deposition systems. As a method for non-contact transfer of carriers in a deposition system,
Detecting a first side of the detectable device of the carrier, the detectable device comprising a geometrical profile having one or more geometrical elements that varies along a transport direction of the carrier; And
Controlling at least one active magnet unit arranged on a second side of the detectable device, opposite the first side.
Containing,
Method for contactless transfer of carriers in a deposition system. The method of claim 14,
The at least one active magnet unit faces the magnetic structure of the carrier,
Method for contactless transfer of carriers in a deposition system.

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