JP2020500256A - System for contactlessly conveying a carrier and method for contactlessly conveying a carrier in a deposition system - Google Patents

Abstract

The present disclosure provides an apparatus for contactlessly transporting a carrier (220) in a deposition system. The carrier (220) includes a guide structure (210) having one or more active magnet units (112) configured to face the magnet structure (222) of the carrier (220), and the presence of the carrier (220). One or more sensors (230) configured to detect the one or more active magnet units (112) and the one or more sensors (230) between them for the magnet structure (222). And one or more sensors (230) arranged to define the guide space (S) of the first and second sensors. [Selection] Figure 2

Description

  [0001] Embodiments of the present disclosure relate to an apparatus for contactlessly transporting a carrier in a deposition system, a system for contactlessly transporting a carrier, and a method for contactlessly transporting a carrier in a deposition system. Embodiments of the present disclosure specifically relate to electrostatic chucks (E-chucks) for holding substrates and / or masks used in the manufacture of organic light emitting diode (OLED) devices.

  [0002] Techniques for depositing layers on a substrate include, for example, thermal evaporation, physical vapor deposition (PVD), and chemical vapor deposition (CVD). Coated substrates can be used in some applications and in some technical fields. For example, coated substrates can be used in the field of organic light emitting diode (OLED) devices. OLEDs can be used in the manufacture of television screens, computer monitors, mobile phones, other portable devices, etc. for displaying information. OLED devices, such as OLED displays, may include one or more layers of organic material disposed between two electrodes, all of which are deposited on a substrate.

  [0003] During processing, a substrate may be supported on a carrier configured to hold the substrate and the optical mask. The carrier can be contactlessly transported in a deposition system, such as a vacuum deposition system, using magnetic force. In applications such as organic light emitting devices, the purity and uniformity of the organic layer deposited on the substrate must be high. Furthermore, it is difficult to handle and transport a carrier that supports a substrate and a mask using non-contact transport without reducing throughput due to destruction of the substrate.

  [0004] In view of the foregoing, a new apparatus for contactlessly transporting a carrier in a deposition system, a system for contactlessly transporting a carrier, and a deposition system that overcome at least some of the problems in the art. In the above, a method for transporting the carrier in a non-contact manner is useful. The present disclosure is specifically directed to providing a carrier that can be transported efficiently and smoothly in a deposition system, such as a vacuum deposition system.

  [0005] In light of the above, there is provided an apparatus for contactlessly transporting a carrier in a deposition system, a system for contactlessly transporting a carrier, and a method for contactlessly transporting a carrier in a deposition system. Other aspects, advantages, and features of the disclosure will be apparent from the claims, the description, and the accompanying drawings.

  [0006] According to one aspect of the present disclosure, there is provided an apparatus for contactlessly transporting a carrier in a deposition system. The apparatus includes a guide structure having one or more active magnet units configured to face a magnet structure of the carrier, and one or more sensors configured to detect the presence of the carrier. Alternatively, the plurality of active magnet units and the one or more sensors are arranged to define a guide space for the magnet structure between the one or more active magnet units and the one or more sensors.

  [0007] According to another aspect of the present disclosure, there is provided an apparatus for contactlessly transporting a carrier in a deposition system. The apparatus includes one or more sensors configured to detect the presence of the carrier, each sensor of the one or more sensors having a sensor extension in a carrier transport direction, wherein the sensor extension is in the transport direction. 1% or more of the carrier extension portion in the above.

  [0008] According to another aspect of the present disclosure, a system for contactlessly transporting a carrier is provided. The present system includes an apparatus for transporting a carrier according to the present disclosure in a non-contact manner and a carrier.

  [0009] According to yet another aspect of the present disclosure, a method is provided for contactlessly transporting a carrier in a deposition system. The method includes detecting a first side of a detectable device of a carrier, and controlling at least one active magnet unit disposed on a second side of the carrier opposite the first side. And doing.

  [0010] Embodiments are also directed to apparatus for performing the disclosed methods, and include apparatus portions for performing each described method aspect. These method aspects can be implemented using hardware components, using a computer programmed with appropriate software, by any combination of the two, or in any other manner. Furthermore, embodiments according to the present disclosure are also directed to a method of operating the described apparatus. The methods of operating the described apparatus include aspects of the method for performing any of the functions of the apparatus.

  [0011] In order that the foregoing features of the disclosure may be understood in detail, the present disclosure, briefly summarized above, will now be described with reference to embodiments. The accompanying drawings relate to embodiments of the present disclosure and are described below.

It is the schematic which shows a carrier and a guide structure. FIG. 2 is a schematic view showing an apparatus and a carrier for non-contact conveyance according to the embodiment described in this document. FIG. 4 is a schematic diagram showing a device and a carrier for non-contact conveyance according to another embodiment described in this document. FIG. 4 is a schematic diagram showing a device and a carrier for non-contact conveyance according to another embodiment described in this document. FIG. 2 is a schematic view showing an apparatus and a carrier for non-contact conveyance according to the embodiment described in this document. FIG. 2 is a schematic view showing an apparatus and a carrier for non-contact conveyance according to the embodiment described in this document. FIG. 1 is a schematic diagram illustrating a system for processing a substrate according to embodiments described herein. FIG. 4 is a schematic diagram illustrating a system for processing a substrate according to further embodiments described herein. FIG. 4 is a flow diagram illustrating a method for contactlessly transporting a carrier in a deposition system according to embodiments described herein.

  [0012] Reference will now be made in detail to various embodiments of the present disclosure. One or more examples of these embodiments are illustrated in the figures. In the following description of the drawings, the same reference numbers represent the same components. Generally, only the differences with respect to the individual embodiments are described. Each example is provided by way of explanation of the disclosure, but is not intended to limit the disclosure. Furthermore, features illustrated or described as part of one embodiment, may be used on another embodiment or used with another embodiment to create a further embodiment. It is possible. The description is intended to include such modifications and variations.

  [0013] A carrier can be used in a deposition system, such as a vacuum deposition system, to hold and transport a substrate and / or mask within a deposition chamber of the deposition system. For example, one or more layers of material can be deposited on the substrate while the substrate is supported by the carrier. For applications such as organic light emitting devices, high purity and uniformity of the organic layer deposited on the substrate can be advantageous. In addition, smooth transport of the carrier in the deposition system is beneficial to reduce substrate breakage.

  [0014] According to an embodiment of the present disclosure, one or more active magnet units and one or more sensors are located on opposite sides of the guide space. In particular, one or more active magnet units and one or more sensors are arranged on the carrier on the opposite side of the magnet structure. The space where the magnetic guide is implemented can be used efficiently. Furthermore, interference between the magnetic guide and one or more sensors is avoided, and smooth transport of the carrier in the transport direction can be achieved. Substrate damage due to unstable carrier transport and / or particle generation may be reduced or even avoided.

  [0015] FIG. 1 shows a schematic view of a carrier 100 and a portion of a transport component configured to transport the carrier 100 in a non-contact manner in a transport direction 1, which may be horizontal.

  [0016] The transport component includes a guide structure 110, which may be an active guide structure. The guide structure 110 includes a plurality of guide units 111 arranged along the transport direction. Each guide unit 111 includes, for example, an (eg, electromagnetic) actuator such as an active magnet unit 112, a controller 114 configured to control the actuator, and a distance sensor configured to measure a gap to the carrier 100 (FIG. Not shown). The guide structure 110 may be configured to levitate the carrier 100 in a non-contact manner using a magnetic force.

  [0017] When the carrier 100 approaches or moves away from the guide unit 111, levitation accuracy and / or levitation stability may be affected. In particular, as the carrier 100 approaches or moves away from the guide unit 111, significant and / or pulsed forces can be generated that can lead to sudden acceleration or deceleration of the carrier 100. This force may vary depending on the geometric arrangement and configuration of the components of the guide structure 110, especially the plurality of guide units 111 (eg, one or more electromagnetic actuators and distance sensors). This force may cause unwanted abrupt movement of the carrier 100 and may even cause accidental mechanical contact between the carrier 100 and the guide structure 110. The carrier 100, the substrate and / or the guide structure 110 may be damaged. In addition, particles can be generated that degrade the quality of the deposition process.

  [0018] A pulsed force or a change in force in the direction of the levitation force, particularly in the direction of the magnetic force applied by the actuator (e.g., the vertical direction 3) occurs when the carrier 100 suddenly disappears, e. sell. As a result, in the distance sensor, the same signal value can be obtained as in the case where the carrier moves away from the distance sensor in a distance (or measurement) direction such as the vertical direction 3 at a high speed. That is, the distance sensor indicates an increase in the gap. A change in the signal can cause the controller to strongly change the force of the actuator such that the "moving" carrier 100 returns to the set distance between the guide structure 110 and the carrier 100.

  [0019] Furthermore, when the carrier 100 approaches or moves away from the guide unit 111, a force component along the transport direction 1 may be generated. The force component may be strong enough to prevent further transport of the carrier 100. The force component along the transport direction 1 can result from the magnetic reluctance of the actuator acting on the front and / or rear surface of the carrier (eg the leading or trailing edge). This is exemplarily shown in FIG. 1 by the magnetic field lines on the rear surface of the carrier 100.

  [0020] FIG. 2 shows a schematic diagram of an apparatus for contactlessly transporting a carrier 220 in a deposition system according to an embodiment described herein.

  [0021] The apparatus includes a guide structure 210 having one or more active magnet units 112 configured to face a magnet structure 222 of a carrier 220, and one or more configured to detect the presence of the carrier 220. And a plurality of sensors 230. One or more active magnet units 112 and one or more sensors 230 are arranged to define a guide space S of magnet structure 222 therebetween. The magnet structure 222 of the carrier 220 extends along the transport direction 1 of the carrier 220. Similarly, one or a plurality of active magnet units 112 may be arranged along the transport direction 1 of the carrier 220. The magnet structure 222 may be a ferromagnetic material extending along the length of the carrier 220.

  [0022] In certain embodiments, the magnet structure 222 may provide a sensor trail for one or more sensors 230. In another embodiment, the sensor trail is provided by a separate element that can be attached to the magnet structure 222. An example of a sensor trail that may be provided by a separate element is shown in FIG. 3A in the form of a detectable device such as a ramp.

  [0023] According to some embodiments, which may be combined with other embodiments described herein, one or more active magnet units 112 are disposed above guide space S and one or more sensors 230 are provided. It is arranged below the guide space S with respect to the vertical direction 3. The distance between the one or more active magnet units 112 and the one or more sensors 230, for example in the vertical direction 3, defining the guide space S may be greater than the extension of the magnet structure 222 in the same direction. In particular, the first gap G1 may be provided, for example, between one or more active magnet units 112 and the magnet structure 222 in the vertical direction 3. Similarly, a second gap G2 may be provided, for example, between one or more sensors 230 in the vertical direction 3 and the magnet structure 222. The first gap G1 and the second gap G2 may be basically the same or may be different. The gap may prevent collision or contact between the carrier 220 and the transport component, for example, due to the carrier moving slightly vertically and / or horizontally during transport of the carrier 220.

  [0024] The carrier 220 is contactlessly transported through one or more chambers, such as, for example, a vacuum chamber of the deposition system, and in particular, through at least one deposition area along a transport path, such as, for example, a linear transport path. It is configured to be. The carrier 220 can be configured to be transported in a non-contact manner in a transport direction 1 which may be a horizontal direction.

  [0025] According to some embodiments that can be combined with other embodiments described herein, the deposition system is configured to contactlessly levitate and / or transport the carrier 220 in the deposition system. Transport components. The transport management may include a guide structure 210 for applying a magnetic levitation force to levitate the carrier 220, and a drive structure for moving the carrier 220 in the transport direction 1. The magnet structure 222 of the carrier 220 may consist of one or more first magnet units configured to magnetically interact with the guide structure. In some implementations, the one or more first magnet units may be passive magnet units such as, for example, permanent magnet units and / or ferromagnetic components.

  [0026] According to some embodiments, which can be combined with other embodiments described herein, the carrier 220 magnetically interacts with a drive structure for moving the carrier 220 in the transport direction 1. , And another magnet structure including one or more second magnet units (not shown). In some implementations, the one or more second magnet units may be passive magnet units, for example, ferromagnetic. The guide structure 210 and the drive structure may be located at opposite ends or ends of the carrier 220. In particular, one or more first magnet units and one or more second magnet units may be located at opposite ends or ends of carrier 220.

  [0027] The deposition system, and specifically the transport component, may include a guide structure having a plurality of guide units 111. Each guide unit 111 senses, for example, an actuator, such as an active magnet unit 112, a controller 114 configured to control the actuator, and a gap between the magnet structures, and especially between the one or more first magnet units. Each sensor 230 may be configured to perform or measure, and may include an actuator. The gap, for example the first gap G1, can be measured in a direction perpendicular to the transport direction 1, such as the vertical direction 3. In particular, the sensor 230 is configured to sense or measure a gap between the one or more first magnet units and the active magnet unit 112, for example, when the carrier 220 is at It may be arranged to face the first magnet unit. Sensor 230 may be a distance sensor.

  [0028] The controller 114 may be configured to control the active magnet unit 112 to adjust the magnetic force provided by the actuator based on the gap measured by the sensor 230. In particular, the controller 114 controls the distance between the one or more first magnet units and the active magnet unit 112 to be essentially constant while the carrier 220 is transported through the deposition system. , May be configured to control the active magnet unit 112. Although FIG. 2 exemplarily shows that each guide unit 111 has its own controller, it is understood that the present disclosure is not limited to this, and that a controller can be assigned to more than one guide unit. Should. For example, a single controller may be provided for all guide units.

  [0029] The carrier 220 may be configured to hold a substrate and / or mask (not shown) used during substrate processing, for example, during vacuum processing. In some implementations, carrier 220 can be configured to support both a substrate and a mask. In a further implementation, the carrier 220 can be configured to support either a substrate or a mask. In such a case, carrier 220 may be referred to as a “substrate carrier” and a “mask carrier”, respectively.

  [0030] The carrier 220 can include a support structure or body 225 that provides a support surface, which can be, for example, an essentially flat surface configured to contact the backside of the substrate. In particular, the substrate may have a front surface opposite the back surface (also referred to as a "processing surface") on which layers are deposited during processing, such as a vacuum deposition process. The magnet structure 222 may be provided on the main body 225.

[0031] The term "vacuum" as used throughout this disclosure may be understood as meaning an industrial vacuum having a vacuum pressure of, for example, less than 10 mbar. The pressure in the vacuum chamber is between 10 ⁻⁵ mbar and about 10 ⁻⁸ mbar, specifically between 10 ⁻⁵ mbar and 10 ⁻⁷ mbar, more specifically about 10 ⁻⁶ mbar And about 10 ⁻⁷ mbar. One or more vacuum pumps, such as a turbo pump and / or a cryopump, may be provided connected to the vacuum chamber to generate a vacuum inside the vacuum chamber.

  [0032] The carrier 220 according to the present disclosure may be an electrostatic chuck (E-chuck) that applies an electrostatic force for holding the substrate and / or the mask with the carrier 220. For example, the carrier 220 includes an electrode component configured to apply an attractive force acting on at least one of the substrate and the mask. The electrode configuration may be embedded in the body 225, or may be disposed (eg, arranged) on the body 225. According to some embodiments, which can be combined with other embodiments described herein, the body 225 is a dielectric, such as a dielectric plate. The dielectric may be made from a dielectric material, preferably a highly thermally conductive dielectric material such as pyrolytic boron nitride, aluminum nitride, silicon nitride, alumina, or equivalent material, but may also be made from a material such as polyimide. In some embodiments, the electrode configuration includes a plurality of electrodes, such as a grid of fine metal bands, that can be mounted on a dielectric plate and covered with a thin dielectric layer.

  [0033] The electrode component, and particularly the plurality of electrodes, can be configured to provide an attractive force, such as a chucking force. Attraction may be a force acting on the substrate and / or mask at some relative distance between the plurality of electrodes (or support surfaces) and the substrate and / or mask. The attractive force may be an electrostatic force caused by a voltage applied to the plurality of electrode components.

[0034] The substrate may be attracted by the carrier 220 (which may be an E-chuck) by an attractive force exerted toward the support surface (eg, in a direction orthogonal to the transport direction). The attraction can be strong enough to hold the substrate in a vertical position, for example, by frictional forces. In particular, the attractive force can be configured such that the substrate is fixed essentially in a fixed manner on the support surface. For example, to hold a 0.5 mm glass substrate in a vertical position using frictional force, an attraction pressure of about 50-100 N / m ² (Pa) may be used, depending on the coefficient of friction.

  [0035] According to some embodiments, which can be combined with other embodiments described herein, the carrier 220 holds the substrate and / or mask in a substantially vertical or substantially horizontal orientation. Or, it is configured to support. Specifically, the carrier can be configured to be transported in a vertical orientation. The term "substantially perpendicular" as used throughout this disclosure is understood to allow a deviation of ± 20 ° or less (eg, ± 10 ° or less) from the vertical or orientation, especially when referring to the orientation of the substrate. You. For example, a substrate support having some deviation from the vertical orientation may provide a more stable substrate position, and such deviations may be provided. Furthermore, if the substrate is tilted forward, fewer particles will reach the substrate surface. However, for example, the substrate orientation during the deposition process is considered to be substantially vertical, which is considered different from the horizontal substrate orientation. Horizontal substrate orientation can be considered to be no more than ± 20 ° horizontal.

  [0036] The expression "vertical" or "vertical orientation" is understood to be distinguished from "horizontal" or "horizontal orientation". That is, “vertical” or “vertical orientation” refers to, for example, a substantially vertical orientation of the carrier and substrate, but a few degrees from strict vertical or vertical orientation (eg, up to 10 °, or Deviations of up to 15 °) are still considered “substantially vertical directions” or “substantially vertical orientations”. The vertical direction may be substantially parallel to gravity.

[0037] Embodiments described herein may be utilized for deposition on large area substrates, for example, for OLED display fabrication. In particular, the substrates for which the structures and methods according to the embodiments described herein are provided are large area substrates. For example, large area substrates or carriers, corresponding to GEN4.5 corresponds to about 0.67 m ² surface area (0.73 × 0.92 m), about 1.4 m ² surface area (1.1 m × 1.3 m) to GEN5, about 4.29M ² of surface area (1.95 m × 2.2 m) corresponding to GEN7.5, about 5.7 m ² of surface area corresponding to the (2.2m × 2.5m) GEN8.5, or Further, it may be GEN10 corresponding to a surface area of about 8.7 m ² (2.85 m × 3.05 m). Further generations, such as GEN11 and GEN12, and corresponding surface areas may be implemented as well. In the manufacture of OLED displays, a half-size GEN generation may also be provided.

  [0038] According to some embodiments that may be combined with other embodiments described herein, the thickness of the substrate may be 0.1-1.8 mm. The thickness of the substrate may be up to about 0.9 mm, for example 0.5 mm. As used herein, the term "substrate" may specifically include, for example, wafers, transparent crystal pieces such as sapphire, or substantially non-flexible substrates such as glass plates. However, the disclosure is not limited to these and the term "substrate" may also include a flexible substrate such as a web or foil. The term "substantially inflexible" is to be understood separately from "flexible". Specifically, a substantially non-flexible substrate such as a glass plate having a thickness of 0.9 mm or less (eg, 0.5 mm or less) can also have some flexibility, but a substantially non-flexible substrate Is less flexible than a flexible substrate.

  [0039] According to embodiments described herein, the substrate may be made from any material suitable for depositing a material. For example, the substrate can be glass (eg, soda-lime glass, borosilicate glass, etc.), metal, polymer, ceramic, composite, carbon fiber material, or any other material that can be coated by a deposition process, or a combination of such materials. Made of a material selected from the group consisting of:

  [0040] FIG. 3A shows a schematic diagram of an apparatus for contactlessly transporting a carrier 320 in a deposition system, according to an embodiment described herein. The device and carrier 320 of FIG. 3A is similar to the device and carrier shown in FIG. 2, and description of similar or identical elements will not be repeated.

  [0041] According to some embodiments, which can be combined with other embodiments described herein, the carrier 320 is a detectable device detectable by one or more sensors 230 that detect the presence of the carrier 320. 340. In some implementations, the detectable device 340 is positioned to face one or more sensors 230, for example, when the detectable device 340 is positioned over, for example, the respective sensor (s). You. According to some embodiments, one or more sensors 230 face a first sensor trail provided by detectable device 340, and an actuator such as, for example, one or more active magnet units 112 comprises a magnet structure 222; Specifically, it faces an actuator trail provided by one or more first magnet units. The detectable device 340 may have a first side and a second side opposite to the first side. For example, the first side may be the lower side of the detectable device 340, and the second side may be the upper side. One or more sensors 230 may face the first side. One or more active magnet units 112 may face the second side.

  [0042] The detectable device 340 and the magnet structure 222 may be integrally formed, or may be disposed as separate elements. According to some embodiments that can be combined with other embodiments described herein, the detectable device 340 and the magnet structure 222, and specifically one or more of the first magnet units, are, for example, in principle May be arranged adjacent to each other in a plane parallel to the transport direction 1 such as a horizontal plane. For example, the detectable device 340 can be attached to the magnet structure 222 of the carrier 320 having one or more first magnet units.

  [0043] The detectable device 340 may be located at the end of the carrier 320 and extend along the transport direction 1. The detectable device 340 is configured to determine a position of the carrier 320 or an end of the carrier 320 with respect to at least one of the plurality of guide units 111 of the guide structure 210 by a transport component of the deposition system. It may be detectable by one or more sensors 230. In this regard, the detectable device 340 may also be referred to as a "sensor trail."

  [0044] The carrier 320 has one or more ends, such as, for example, a first end and a second end opposite the first end. The substrate may be located between the first end and the second end. The first end may be a top (or upper) end and the second end may be a bottom (or lower) end. The first end and the second end may extend essentially parallel, for example essentially horizontally. The detectable device 340 may be disposed at a first end and / or a second end. FIG. 3A exemplarily shows the detectable device 340 and the magnet structure 222 at a first end, which is the upper or upper end of the carrier 320. The detectable device 340 and the magnet structure 222, specifically one or more first magnet units, may face the guide structure 210 of the transport component. One or more second magnet units may be located at a second end, which may be the bottom or lower end of carrier 320. One or more second magnet units may face the drive structure of the transport component.

  [0045] According to some embodiments that can be combined with other embodiments described herein, the detectable device 340 is, for example, an element that extends in the transport direction 1 over the entire length L of the carrier 320. The length L of the carrier 320 can be defined along the transport direction 1, for example, between the first end 201 and the second end 202 of the carrier 320 along the transport direction 1.

  [0046] In some implementations, the detectable device 340 changes along transport direction 1 and includes a geometric profile that can be detected by one or more sensors 230, or changes along transport direction 1. , A geometric shape that can be detected by one or more sensors 230. The one or more sensors 230 are distances configured to detect a distance between each sensor and the geometry, in particular, between each sensor and a surface of the geometry facing the sensor. It may be a sensor. The distance may be measured in a direction perpendicular to the transport direction 1, for example, vertical 3 or horizontal 2. In some implementations, each guide unit 111 includes a respective sensor that detects a geometric profile.

  [0047] The geometry may vary along the transport direction 1 between the first end 201 and the second end 202 of the carrier 320. The geometry may provide a sensor trail extending between the first end 201 and the second end 202. As used throughout this disclosure, the term “geometric contour” is defined by the contour, or transport direction 1, and defined by transport direction 1 and at least one direction perpendicular to transport direction 1 (eg, vertical direction 3). Refers to an element having an outer shape with a non-constant (or varying) cross-sectional shape in a given plane. The geometrical profile is such that, when viewed in the transport direction 1, the first end 201 of the carrier 320 (eg, the front or leading edge that can define the outermost boundary of the carrier 320 in the transport direction 1) and the second end A portion 202 (e.g., a rear surface or a rear edge that can define an outermost boundary of the carrier 320 in a direction opposite to the transport direction 1). That is, the various geometric shapes do not refer to the edge of the first end 201 or the second end 202 of the carrier 320, but rather the first end 201 that can be detected by one or more sensors 230. Refers to a further structural variation between the second end 202.

  [0048] According to some embodiments, which may be combined with other embodiments described herein, the geometric profile includes one or more shape elements. In some implementations, the one or more shape elements may be selected from the group including discontinuities, ramps, arc shapes, and any combination thereof. For example, the geometric profile may be an element that extends along the length of the carrier 220 and has one or more shape elements, such as, for example, one or more ramps 342.

  [0049] In some embodiments, one or more shaped elements, such as, for example, ramps, are disposed at the first end 201 and / or the second end 202 of the carrier 320. For example, at least one first shape element may be located at the first end 201 and / or at least one second shape element may be located at the second end 202. The at least one first shape element and the at least one second shape element may be basically the same or different. In the embodiment of FIG. 3A, the at least one first shape element and the at least one second shape element are both ramps in the element that provide the geometric profile.

  [0050] One or more shape elements may be disposed at an end of the carrier 320 such that it may determine where the end of the carrier 320 is located relative to the guide structure 210. One or more active magnet units 112 of the guide unit 111 can be controlled to provide a smooth transport of the carrier 320 in the transport direction 1. In particular, it is possible to control an actuator located at one or more edges of the carrier and / or approaching one or more edges. For example, the magnetic force provided by one or more actuators can be continuously increased or decreased to obtain a smooth transition at the end of carrier 320 between adjacent actuator / magnet units. For example, actuation of the actuator can be reduced such that essentially no force is applied to the carrier 320 when the carrier 320 "separates" the actuator.

  [0051] According to an embodiment, the individual shape elements of the one or more shape elements have a geometrical profile in the transport direction 1 and / or a length extension along the length of the carrier 320. sell. The extension of the length of the individual shape elements may be at least 1% of the geometry and / or the length of the carrier 320, specifically at least 4% of the length, specifically at least 4% of the length 8%.

  [0052] FIG. 3A exemplarily shows the ramp 342 as one or more shape elements. However, the present disclosure is not limited to this, and other shape elements such as cutouts or continuously changing shapes can be provided. In some implementations, the ramp 342 may be a surface of the carrier 320 that is inclined with respect to the transport direction 1. For example, the inclined portion 342 may be inclined with respect to a horizontal plane. In some embodiments, the ramp 342 is located at the first end 201 and / or the second end 202 of the carrier 320. For example, at least one first ramp may be located at the first end 201 of the carrier 320 and / or at least one second ramp may be located at the second end 202. The at least one first ramp and the at least one second ramp may be inclined in opposite directions. Specifically, at least one first slope and at least one second slope may be mirror symmetric.

  [0053] The sensor 230 may be positioned to face the ramp 342. Specifically, the sensor 230 can be configured to detect the inclined portion 342 when the carrier 320 moves in the transport direction 1. The distance detected between the sensor and the inclined portion increases or decreases depending on the transport direction 1 and / or the inclination direction. One or more active magnet units of the guide unit 111 can be controlled to provide smooth transport of the carrier 320 in the transport direction. Specifically, actuators located on one or more slopes can be controlled. For example, the magnetic force exerted by one or more actuators is continuously based on the various distances provided by the ramps to provide a smooth transition at the end of the carrier between adjacent actuator / magnet units. It can increase or decrease. Specifically, in FIG. 3A, the same detection signal as when the carrier has moved upward can be obtained at the sensor by the inclined portion on the left side of the carrier. The controller may reduce the force of the actuator, such as by reducing the current in the actuator, such that the left actuator does not impart levitation to the carrier as the carrier "leaves" the actuator.

  [0054] FIG. 3B shows a schematic diagram of an apparatus for contactlessly transporting a carrier 320 'in a deposition system, according to an embodiment described herein. The device and carrier 320 'of FIG. 3B is similar to the device and carrier shown in FIG. 3A, and description of similar or identical aspects will not be repeated.

  [0055] According to one aspect of the present disclosure, an apparatus for contactlessly transporting a carrier 320 'in a deposition system includes one or more sensors 330 configured to detect the presence of the carrier 320'. Each of the one or more sensors 330 has a sensor extension d in the transport direction 1 of the carrier 320 ′, and the sensor extension d is at least one of the carrier extension, ie, the length L of the carrier in the transport direction 1. %, Specifically at least 2%, specifically at least 4%, specifically at least 8%, and more specifically at least 10%. The sensor extension d may be 10% or more of the length L of the carrier 320 ', specifically 15% or more, specifically 20% or more, and more specifically 25% or more.

  [0056] The one or more sensors 330 are elongated in the transport direction 1. As the carrier 320 '(or its own sensor trail) moves away from the sensor 330, the signal or signal value of the sensor 330 changes gradually as if the carrier 320' was moving upward (slowly). The force applied by the active magnet unit 112 may be (gradually) reduced to zero as the signal changes so that a smooth transport of the carrier 320 'can be achieved. A gradual (fixed rate) signal change can be achieved by an elongated sensor. Conversely, short sensors, such as those shown in FIG. 2, exhibit a sudden signal change when the sensor reaches the edge of the carrier. This embodiment can reduce or even avoid the generation of pulsed forces that can lead to sudden acceleration or deceleration of carriers.

  [0057] FIGS. 4A and 4B show schematic diagrams of an apparatus 400 for non-contact transport of a carrier 410 according to an embodiment described herein. The device and carrier 410 can be configured according to the embodiments described herein.

  [0058] The apparatus 400 includes a guide structure 470 including a plurality of active magnet units 475, one or more sensors (not shown) for detecting the presence of the carrier 410, and a carrier 410 according to the present disclosure. Including parts. The one or more sensors may be configured to detect a distance between the one or more sensors and a detectable device on the carrier 410. Apparatus 400 may further include a controller configured to selectively control at least one of the plurality of active magnet units 475 based on detection data provided by the one or more sensors. . According to some embodiments described herein, the transport component may be located in a vacuum chamber of a vacuum system. The vacuum chamber may be a vacuum deposition chamber. However, the present disclosure is not limited to vacuum systems, and the carriers and transport components described herein can be implemented in an atmospheric environment.

  [0059] The carrier 410 has one or more first magnet units configured to magnetically interact with a guide structure 470 of a vacuum system to provide a magnetic levitation force to levitate the carrier 410. Structure. The one or more first magnet units may be a first passive magnet unit 450. The guide structure 470 may extend in the transport direction 1 of the carrier 410, which may be horizontal. The guide structure 470 may include a plurality of active magnet units 475. Carrier 410 may be movable along guide structure 470. The first passive magnet unit 450, for example, a bar of ferromagnetic material, and the plurality of active magnet units 475 of the guide structure 470 can be configured to provide a first magnetic levitation force that causes the carrier 410 to levitate. The device for levitation described herein is, for example, a device that provides a non-contact force to levitate the carrier 410.

  [0060] According to some embodiments, the transport component may further include a drive structure 480. Drive structure 480 may include a plurality of additional magnet units, such as additional active magnet units. Carrier 410 may include one or more second magnet units configured to magnetically interact with drive structure 480. Specifically, the one or more second magnet units are second passive magnet units 460, such as, for example, bars of ferromagnetic material, that interact with another active magnet unit 485 of drive structure 480. Good.

  [0061] FIG. 4B illustrates another aspect of the transport component. FIG. 4B is a diagram illustrating an active magnet unit of a plurality of active magnet units 475. The active magnet unit provides a magnetic force that interacts with the first passive magnet unit 450 of the carrier 410. For example, the first passive magnet unit 450 can be a rod of a ferromagnetic material. The rod may be part of the carrier 410 connected to the support structure 412. The support structure 412 may be provided by the body of the carrier 410. The rod or the first passive magnet unit may be formed integrally with the support structure 412 that supports the substrate 10, respectively. The detectable device can be attached to the first passive magnet unit 450 or can be provided by the first passive magnet unit 450. The carrier 410 may further include a second passive magnet unit 460, for example, a further rod. Additional rods may be connected to the carrier 410. The rod or the second passive magnet unit, respectively, may be formed integrally with the support structure 412.

  [0062] The term "passive" magnet unit is used herein to distinguish it from the concept of "active" magnet unit. Passive magnet units may refer to elements having magnetic properties that are not subject to active control or adjustment, at least during operation of the transport component. For example, the magnetic properties of a passive magnet unit (eg, a rod of a carrier or a further rod) are generally not subject to active control during movement of the carrier through a vacuum chamber or system. According to some embodiments that may be combined with other embodiments described herein, the controller of the transport component is not configured to control the passive magnet unit. The passive magnet unit can be adapted to generate a magnetic field (eg, a static magnetic field). The passive magnet unit may not be configured to generate an adjustable magnetic field. The passive magnet unit may be a magnetic material, such as a ferromagnetic material, a permanent magnet, or may have permanent magnet properties.

  [0063] According to the embodiments described herein, the plurality of active magnet units 475 impart magnetic force to the first passive magnet unit 450 and, consequently, the carrier 410. The plurality of active magnet units 475 levitate the carrier 410. The further active magnet unit 485 can drive the carrier 410 inside the vacuum chamber, for example, along the transport direction 1. The plurality of further active magnet units 485 form a drive structure for moving the carrier 410 in the transport direction 1 while levitating by the plurality of active magnet units 475 located on the carrier 410. A further active magnet unit 485 can interact with the second passive magnet unit 460 to apply a force along the transport direction 1. For example, the second passive magnet unit 460 may include a plurality of permanent magnets arranged with alternating polarities. The magnetic field obtained from the second passive magnet unit 460 can interact with a plurality of further active magnet units 485 to move the levitating carrier 410.

  [0064] To levitate carrier 410 with a plurality of active magnet units 475 and / or move carrier 410 with a plurality of additional active magnet units 485, control the active magnet unit to produce an adjustable magnetic field. Can be done. The tunable magnetic field can be a static magnetic field or a dynamic magnetic field. According to an embodiment that can be combined with other embodiments described herein, the active magnet unit is configured to generate a magnetic field for imparting a magnetic levitation extending along the vertical direction 3. . According to another embodiment, which can be combined with the further embodiments described herein, the active magnet unit can be configured to apply a magnetic force extending along the lateral direction. The active magnet unit described herein may be or include an element selected from the group consisting of an electromagnetic device, a solenoid, a coil, a superconducting magnet, or any combination thereof.

  [0065] Embodiments described herein relate to non-contact levitation, transport, and / or alignment of carriers, substrates, and / or masks. The present disclosure refers to a carrier, which may include one or more members of the group consisting of a carrier supporting a substrate, a carrier without a substrate, a substrate, or a substrate supported by a support. The term "non-contact" as used throughout this disclosure should be understood to mean, for example, that the weight of the carrier and the substrate is not retained by mechanical contact or mechanical force, but is retained by magnetic force. In particular, the carrier is held in a floating state or a floating state by using magnetic force instead of mechanical force. As an example, the transport components described herein may not have mechanical devices such as mechanical rails that support the weight of the carrier. In some implementations, there may be no mechanical contact between the carrier and the rest of the device during ascent and during movement of the carrier, for example, in a vacuum system.

  [0066] According to embodiments of the present disclosure, levitating, or levitating, refers to the state of an object, which floats without mechanical contact or support. Further, movement of an object refers to applying a driving force, for example, a force in a direction different from a levitation force, and the object moves from one position to another different position. For example, an object such as a carrier can levitate, i.e., by a force that reacts with gravity, and can move in a direction different from a direction parallel to gravity while floating.

  [0067] Non-contact levitation and transport of a carrier according to embodiments described herein is achieved by mechanical contact between the carrier and a section of the transport component, such as a mechanical rail, during transport or alignment of the carrier. Is not generated. Accordingly, embodiments described herein provide improved purity and uniformity of the layers deposited on the substrate, particularly when non-contact levitation, transport, and / or alignment is used to minimize particle generation. To improve.

  [0068] FIG. 5 illustrates a system 500 for processing a substrate according to embodiments described herein. System 500, which can be a vacuum system, can be configured to deposit one or more layers, such as, for example, an organic material layer, on substrate 10.

  [0069] The system 500 includes a deposition chamber, such as a vacuum chamber 502, a carrier 520 according to embodiments described herein, and a transport component 510 configured to transport the carrier 520 within the deposition chamber. In some implementations, system 500 includes one or more material deposition sources 580 in a deposition chamber. Carrier 520 may be configured to hold substrate 10 during a deposition process, such as a vacuum deposition process. System 500 may be configured for deposition of organic materials, for example, for OLED device fabrication. In another example, system 500 may be configured for CVD or PVD, such as sputter deposition.

  [0070] In some implementations, the one or more material deposition sources 580 may be a deposition source, particularly for depositing one or more organic materials on a substrate to form a layer of an OLED device. May be an evaporation source. For example, a carrier 520 for supporting the substrate 10 during a layer deposition process passes through the deposition area into and through the deposition chamber, specifically along a transport path such as a linear transport path. Can be transported.

  [0071] Material is emitted from one or more material deposition sources 580 in an emission direction toward a deposition area where the substrate 10 to be coated is located. For example, one or more material deposition sources 580 may provide a source having a plurality of openings and / or nozzles arranged in at least one line along the length of one or more material deposition sources 580. . The material can be ejected through a plurality of openings and / or nozzles.

  [0072] As shown in FIG. 5, an additional chamber may be provided next to the vacuum chamber 502. The vacuum chamber 502 can be separated from an adjacent chamber by a valve having a valve housing 504 and a valve unit 506. As shown by the arrow, after the carrier 520 on which the substrate 10 is placed is inserted into the vacuum chamber 502, the valve unit 506 can be closed. The atmosphere in the vacuum chamber 502 can be individually controlled, for example, by creating an industrial vacuum with a vacuum pump connected to the vacuum chamber 502.

  [0073] According to some embodiments, the carrier 520, the substrate 10, and optionally the mask 20, are static or dynamic during deposition of the deposition material. According to some embodiments described herein, for example, a dynamic deposition process may be provided for the manufacture of an OLED device.

  [0074] In some implementations, system 500 may include one or more transport paths extending through vacuum chamber 502. The carrier 520 may be configured to be transported along one or more transport paths, for example, through one or more material deposition sources 580. Although one transport path is exemplarily shown in FIG. 5 by an arrow, it should be understood that the present disclosure is not limited to this, and that two or more transport paths may be provided. For example, for transport of each carrier, at least two transport paths can be arranged substantially parallel to each other. One or more material deposition sources 580 may be located between the two transport paths.

  [0075] FIG. 6 shows a schematic diagram of a system 600 for processing a substrate 10, eg, vacuum processing, according to a further embodiment described herein.

  [0076] The system 600 includes a transport component 660 according to the present disclosure configured to sequentially transport a carrier 601 supporting two or more processing areas and a substrate 10 and optionally a mask to the two or more processing areas. And For example, the transport component 660 can be configured to transport the carrier 601 along the transport direction 1 through two or more processing areas for substrate processing. In other words, the same carrier is used to transport the substrate 10 through a plurality of processing areas. Specifically, the substrate 10 is not removed from the carrier 601 between the substrate processing in the processing area and the substrate processing in the subsequent processing area. That is, in two or more substrate processing procedures, the substrates remain on the same carrier. According to some embodiments, the carrier 601 may be configured according to the embodiments described herein. Optionally or alternatively, the transport configuration 660 may be configured, for example, as described in connection with FIGS. 4A and 4B.

  [0077] As exemplarily shown in FIG. 6, the two or more processing regions may include a first deposition region 608 and a second deposition region 612. Optionally, a transfer region 610 can be provided between the first deposition region 608 and the second deposition region 612. Multiple regions, such as two or more processing regions and a transfer region, can be provided in a single vacuum chamber. Alternatively, the plurality of regions can be provided in different vacuum chambers connected to each other. For example, each vacuum chamber can provide one area. Specifically, a first vacuum chamber can provide a first deposition area 608, a second vacuum chamber can provide a transfer area 610, and a third vacuum chamber can provide a second deposition area. 612 can be provided. In some implementations, the first vacuum chamber and the third vacuum chamber may be referred to as a "deposition chamber." The second vacuum chamber may be referred to as a "processing chamber." Further, a vacuum chamber or region may be provided adjacent to the region shown in the embodiment of FIG.

  [0078] A vacuum chamber or region may be separated from an adjacent region by a valve having a valve housing 604 and a valve unit 605. After the carrier 601 on which the substrate 10 is placed is inserted into a region (such as the second deposition region 612), the valve unit 605 can be closed. The atmosphere in the region may be one or more, for example, by creating an industrial vacuum with a vacuum pump connected to the region and / or, for example, in first deposition region 608 and / or second deposition region 612. By injecting a plurality of processing gases, they can be individually controlled. A transport path, such as a straight transport path, may be provided to transport the carrier 601 on which the substrate 10 is loaded into and through the area. The transport path may extend at least partially through two or more processing regions (first deposition region 608, second deposition region 612, etc.), and may optionally extend through transfer region 610.

  [0079] The system 600 may include a transfer area 610. In some embodiments, transfer area 610 may be omitted. The transfer area 610 may be provided by a rotating module, a transit module, or a combination thereof. FIG. 6 shows a combination of a rotating module and a relay module. In a rotating module, the track component and the carrier (s) disposed thereon are rotatable about an axis of rotation, such as a vertical axis of rotation. For example, carrier (s) may be transported from the left side of system 600 to the right side of system 600, or vice versa. The relay module may include crossing tracks so that the carrier (s) are transported via the relay module in different directions, for example, in directions orthogonal to each other.

  [0080] Within a deposition area, such as the first deposition area 608 and the second deposition area 612, one or more deposition sources may be disposed. For example, first deposition source 630 may be disposed within first deposition region 608. A second deposition source 650 may be disposed in the second deposition area 612. The one or more deposition sources may be deposition sources configured to deposit one or more organic layers on the substrate 10 to form an organic layer stack for the OLED device.

  [0081] FIG. 7 shows a flow diagram of a method 700 for contactlessly transporting a carrier in a deposition system, such as a vacuum system, according to embodiments described herein. Method 700 may utilize carriers, devices, and systems according to the present disclosure.

  [0082] The method 700 includes, at block 710, detecting a first side of the detectable device of the carrier, and at block 720, a second side of the detectable device opposite the first side. Controlling at least one active magnet unit located at In some implementations, the method 700 can determine the position of the edge of the carrier in the deposition system, for example, when the detected signal indicates a change in distance, for example. According to some embodiments, two or more sensors may form a group based on each active magnet unit being controlled. For example, the active magnet unit can be controlled when the signal sent by the sensor of the active magnet unit and one or more signals sent by one or more adjacent sensors of the sensor are different from each other.

  [0083] In one embodiment, the current flowing through the at least one active magnet unit may be changed according to the detection signal. For example, the current in the active magnet unit that the carriers "separate" can decrease gradually or continuously to zero. Further, the current of the active magnet unit to which the carrier "approaches" or "enters" may increase gradually or continuously from zero to a set value.

  [0084] According to embodiments described herein, a method for contactlessly transporting a carrier in a deposition system may be implemented using a computer program, software, a computer software product, and an interrelated controller. An interaction controller may have a CPU, memory, user interface, and input / output devices that can communicate with carriers, corresponding components of the apparatus and / or system.

  [0085] According to an embodiment of the present disclosure, one or more active magnet units and one or more sensors are located on opposite sides of the guide space. Specifically, one or more active magnet units and one or more sensors are located on opposite sides of the magnet structure of the carrier. The space where the magnetic guide is implemented can be used efficiently. Further, interference between the magnetic guide and one or more sensors can be avoided, and smooth transport of the carrier in the transport direction can be achieved. Substrate damage due to unstable carrier transport and / or particle generation may be reduced or even avoided.

  [0086] Although the above description is directed to embodiments of the present disclosure, other and further embodiments of the present disclosure may be devised without departing from the basic scope of the present disclosure. Is determined by the following claims.

Claims (15)

An apparatus for contactlessly transporting a carrier in a deposition system,
A guide structure having one or more active magnet units configured to face the magnet structure of the carrier;
One or more sensors configured to detect the presence of the carrier, wherein the one or more active magnet units and the one or more sensors are the one or more active magnet units and the one or more. An apparatus comprising one or more sensors arranged to define a guide space for said magnet structure between said plurality of sensors.   The apparatus of claim 1, wherein the one or more sensors is a distance sensor configured to measure a distance to the carrier.   The vertical or horizontal direction, wherein the one or more active magnet units are arranged on one side of the guide space, and the one or more sensors are arranged on the other side of the guide space. 3. The device according to 1 or 2.   4. The sensor according to claim 1, wherein each sensor of the one or more sensors has a sensor extension in a transport direction of the carrier, and the sensor extension is 1% or more of the carrier extension in the transport direction. 5. An apparatus according to claim 1.   Apparatus according to any of the preceding claims, further comprising a drive structure having a plurality of further active magnet units. An apparatus for contactlessly transporting a carrier in a deposition system,
One or more sensors configured to detect the presence of the carrier, wherein each of the one or more sensors has a sensor extension in the carrier transport direction, and wherein the sensor extension is An apparatus comprising one or more sensors that is 1% or more of the carrier extension in the transport direction.   7. The device of claim 6, wherein the sensor extension is at least 2% of the carrier extension or at least 4% of the carrier extension.   The apparatus according to claim 6 or 7, wherein the one or more sensors are distance sensors configured to measure a distance to the carrier. A system for non-contact transport of a carrier,
An apparatus according to any one of claims 1 to 8, and
A system comprising the carrier.   The system of claim 9, wherein the carrier includes a detectable device detectable by the one or more sensors.   The system of claim 10, wherein the detectable device is positioned to face the one or more sensors.   The system of claim 10 or 11, wherein the detectable device includes a geometric shape that varies along a transport direction and is detectable by the one or more sensors.   13. The system of claim 12, wherein the geometric profile has one or more shape elements selected from the group consisting of slope, discontinuity, arc, and any combination thereof.   14. The system of claim 12 or 13, wherein the one or more sensors are configured to detect a distance between the one or more sensors and the geometric profile. A method for contactlessly transporting a carrier in a deposition system, comprising:
Detecting a first side of the detectable device of the carrier;
Controlling at least one active magnet unit located on a second side of said detectable device opposite said first side.

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