TW201930450A - 樹脂組成物 - Google Patents

樹脂組成物 Download PDF

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Publication number
TW201930450A
TW201930450A TW107126619A TW107126619A TW201930450A TW 201930450 A TW201930450 A TW 201930450A TW 107126619 A TW107126619 A TW 107126619A TW 107126619 A TW107126619 A TW 107126619A TW 201930450 A TW201930450 A TW 201930450A
Authority
TW
Taiwan
Prior art keywords
resin composition
resin
epoxy resin
layer
mass
Prior art date
Application number
TW107126619A
Other languages
English (en)
Chinese (zh)
Inventor
渡邊□俊
長□□毅
Original Assignee
日商味之素股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商味之素股份有限公司 filed Critical 日商味之素股份有限公司
Publication of TW201930450A publication Critical patent/TW201930450A/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L21/00—Compositions of unspecified rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L27/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers
    • C08L27/02—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L27/12—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by a halogen; Compositions of derivatives of such polymers not modified by chemical after-treatment containing fluorine atoms
    • C08L27/18—Homopolymers or copolymers or tetrafluoroethene
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Inorganic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
TW107126619A 2017-08-21 2018-08-01 樹脂組成物 TW201930450A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017158929A JP6801608B2 (ja) 2017-08-21 2017-08-21 樹脂組成物
JP2017-158929 2017-08-21

Publications (1)

Publication Number Publication Date
TW201930450A true TW201930450A (zh) 2019-08-01

Family

ID=65514551

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107126619A TW201930450A (zh) 2017-08-21 2018-08-01 樹脂組成物

Country Status (4)

Country Link
JP (1) JP6801608B2 (ja)
KR (1) KR20190020622A (ja)
CN (1) CN109423011B (ja)
TW (1) TW201930450A (ja)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7283208B2 (ja) * 2019-04-26 2023-05-30 Ａｇｃ株式会社 パウダー分散液、積層体の製造方法、積層体及びプリント基板の製造方法
JP7283274B2 (ja) 2019-07-02 2023-05-30 味の素株式会社 樹脂組成物
CN110437784B (zh) * 2019-07-22 2021-06-22 苏州盛达飞智能科技股份有限公司 低折射率oca光学胶及其使用方法
WO2021108955A1 (zh) * 2019-12-02 2021-06-10 中国科学院深圳先进技术研究院 一种高频低损耗绝缘胶膜材料及其制备方法
KR102324559B1 (ko) * 2020-02-28 2021-11-10 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
KR102324560B1 (ko) * 2020-03-03 2021-11-11 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
KR102324561B1 (ko) * 2020-03-03 2021-11-10 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
KR102259098B1 (ko) * 2020-03-03 2021-06-03 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
KR102259099B1 (ko) * 2020-03-03 2021-06-03 (주)이녹스첨단소재 접착 필름, 이를 포함하는 접착 필름 부착 적층체 및 이를 포함하는 금속박 적층체
CN116496720A (zh) * 2021-11-04 2023-07-28 荣耀终端有限公司 绝缘胶、绝缘胶带及绝缘胶的制备方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003286390A (ja) * 2002-03-28 2003-10-10 Nippon Steel Chem Co Ltd エポキシ樹脂組成物、ワニス、このエポキシ樹脂組成物を用いたフィルム状接着剤及びその硬化物
TWI335347B (en) * 2003-05-27 2011-01-01 Ajinomoto Kk Resin composition for interlayer insulation of multilayer printed wiring board, adhesive film and prepreg
JP4983228B2 (ja) * 2005-11-29 2012-07-25 味の素株式会社 多層プリント配線板の絶縁層用樹脂組成物
JPWO2007129662A1 (ja) * 2006-05-08 2009-09-17 積水化学工業株式会社 絶縁材料、電子部品装置の製造方法及び電子部品装置
TWI565750B (zh) * 2009-02-20 2017-01-11 Ajinomoto Kk Resin composition
JP2010209140A (ja) * 2009-03-06 2010-09-24 Kyocera Chemical Corp プリプレグ、金属張り積層板及びプリント配線板
JP5589292B2 (ja) * 2009-03-27 2014-09-17 日立化成株式会社 熱硬化性絶縁樹脂組成物、並びにこれを用いた支持体付絶縁フィルム、プリプレグ、積層板及び多層プリント配線板
TWI540170B (zh) * 2009-12-14 2016-07-01 Ajinomoto Kk Resin composition
JP2013079326A (ja) * 2011-10-04 2013-05-02 Adeka Corp 樹脂組成物、該組成物を含有するビルドアップ用絶縁体、及び該組成物を用いたプリプレグ
JP6163803B2 (ja) * 2013-03-14 2017-07-19 味の素株式会社 樹脂組成物
CN103937157A (zh) * 2014-03-05 2014-07-23 浙江华正新材料股份有限公司 无卤树脂组合物及采用其制造半固化片及层压板的方法
JP6754999B2 (ja) 2015-03-05 2020-09-16 パナソニックＩｐマネジメント株式会社 樹脂組成物、低誘電率樹脂シート、プリプレグ、金属箔張り積層板、高周波回路基板および多層配線基板
JP2017141414A (ja) * 2016-02-12 2017-08-17 株式会社ダイセル 光反射用硬化性樹脂組成物及びその硬化物、並びに光半導体装置
JP6694833B2 (ja) * 2017-01-10 2020-05-20 味の素株式会社 樹脂組成物

Also Published As

Publication number Publication date
JP2019035059A (ja) 2019-03-07
KR20190020622A (ko) 2019-03-04
CN109423011B (zh) 2023-01-13
JP6801608B2 (ja) 2020-12-16
CN109423011A (zh) 2019-03-05

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