TW201927674A - Tape attaching device including a first roller unit, an attaching means, a disposal means, a second roller unit, a positioning means, a tape group guiding means and a cutting means - Google Patents
Tape attaching device including a first roller unit, an attaching means, a disposal means, a second roller unit, a positioning means, a tape group guiding means and a cutting means Download PDFInfo
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- TW201927674A TW201927674A TW107145418A TW107145418A TW201927674A TW 201927674 A TW201927674 A TW 201927674A TW 107145418 A TW107145418 A TW 107145418A TW 107145418 A TW107145418 A TW 107145418A TW 201927674 A TW201927674 A TW 201927674A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/79—Apparatus for Tape Automated Bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/6834—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used to protect an active side of a device or wafer
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68381—Details of chemical or physical process used for separating the auxiliary support from a device or wafer
- H01L2221/68386—Separation by peeling
- H01L2221/68395—Separation by peeling using peeling wheel
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Replacement Of Web Rolls (AREA)
- Basic Packing Technique (AREA)
- Package Closures (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
本發明係關於在晶圓黏貼黏著性之膠帶的膠帶黏貼裝置。The present invention relates to a tape sticking device for sticking an adhesive tape on a wafer.
分割晶圓等之被加工物之情況，例如在膠帶黏貼裝置(膠帶固定機)，在具有開口部之環形框黏貼黏著膠帶，在從該開口部露出之黏著膠帶黏貼晶圓，依此使環形框和晶圓一體化，防止在晶圓之分割時的晶片分散。在膠帶黏貼裝置中，有依分割晶圓之加工條件不同使用不同品種的黏著膠帶之情形。In the case of dividing a processed object such as a wafer, for example, an adhesive tape is adhered to a ring frame having an opening portion in an adhesive tape attaching device (tape fixing machine), and the wafer is adhered to the adhesive tape exposed from the opening portion. The frame and the wafer are integrated to prevent the wafer from being scattered when the wafer is divided. In the tape adhesive device, there are cases where different types of adhesive tapes are used depending on the processing conditions of the divided wafers.
通常，黏著膠帶成為基材和黏著劑層之兩層構造。作為黏著膠帶之材質，除例如具有硬之基材的膠帶、具有彈力性之基材的膠帶、具有熱收縮之基材的膠帶等之基材不同的情況外，有例如具有以紫外線硬化之黏著劑層之膠帶、黏著劑層厚的膠帶等之黏著劑層不同之情況。再者，因黏著膠帶防止塵埃附著於黏著劑層，故在黏著劑層貼附保護薄膜，捲筒狀地被捲在筒芯而成為捲筒膠帶之形態。例如，有使支持棒進入至捲筒膠帶之筒芯內而旋轉自如地支持捲筒膠帶之膠帶黏貼裝置(例如，參照下述專利文獻1及2)。在該膠帶黏貼裝置中，從捲筒膠帶之外側同時拉出保護薄膜和黏著膠帶，並使通過複數滾輪，將黏著膠帶從保護薄膜剝離而可以將黏著膠帶黏貼在環形框和晶圓。 [先前技術文獻] [專利文獻]Generally, an adhesive tape has a two-layer structure of a base material and an adhesive layer. As the material of the adhesive tape, there are cases in which, for example, a tape having a hard substrate, a tape having an elastic substrate, and a tape having a heat-shrinkable substrate are different. The adhesive layer of the adhesive layer and the adhesive layer with a thick adhesive layer may be different. Furthermore, since the adhesive tape prevents dust from adhering to the adhesive layer, a protective film is affixed to the adhesive layer, and is rolled into a roll core to form a roll tape. For example, there is a tape sticking device that allows the support rod to enter the core of the roll tape and rotatably supports the roll tape (for example, refer to Patent Documents 1 and 2 below). In this adhesive tape sticking device, the protective film and the adhesive tape are simultaneously pulled out from the outside of the roll tape, and the adhesive tape can be peeled from the protective film by a plurality of rollers, so that the adhesive tape can be stuck on the ring frame and the wafer. [Prior Art Literature] [Patent Literature]
[專利文獻1]日本特開2014-27171號公報 [專利文獻2]日本特開2016-008104號公報[Patent Document 1] Japanese Patent Laid-Open No. 2014-27171 [Patent Document 2] Japanese Patent Laid-Open No. 2016-008104
[發明所欲解決之課題][Problems to be Solved by the Invention]
在上述般之膠帶黏貼裝置中，當切換黏著膠帶之品種時，必須使不同品種之黏著膠帶通過複數滾輪，需要用以連結切換膠帶之品種之前的黏著膠帶之未端，和之後切換的新黏著膠帶之前端的連結用之膠帶。In the above-mentioned tape adhesive device, when switching the types of adhesive tapes, different types of adhesive tapes must be passed through a plurality of rollers. It is necessary to connect the ends of the adhesive tapes before switching the types of tapes, and the new adhesion after switching Adhesive tape for the front end of the tape.
本發明之目的在於膠帶黏著裝置中，能夠不使用連結用之膠帶而進行不同品種之黏著膠帶之切換而可以有效利用黏著膠帶。 [用以解決課題之手段]The object of the present invention is that in an adhesive tape adhesive device, it is possible to switch between different types of adhesive tapes without using adhesive tapes, and to effectively use the adhesive tapes. [Means to solve the problem]
本發明係一種膠帶黏貼裝置，其具備支持具有開口之環形框並且支持被定位在該開口之晶圓的平台，在被支持於該平台之環狀框和晶圓黏貼黏著膠帶而使一體化，該膠帶黏貼裝置至少具備：捲筒膠帶支持部，其係能夠旋轉地支持捲筒膠帶，且該捲筒膠帶係將事先對應於該環狀框而成形的複數該黏著膠帶隔著間隔被配設在帶狀的保護薄膜的膠帶組設成捲筒狀，捲筒膠帶支持手段，其係配設兩個以上該捲筒膠帶支持部；第1滾輪單元，其係將從該捲筒膠帶拉出之該膠帶組從該捲筒膠帶支持手段引導至該平台；黏貼手段，其係使該黏著膠帶從被引導至該平台之該膠帶組剝離，並使該黏著膠帶黏貼於該平台支持的該環狀框和晶圓；廢棄手段，捲取該黏著膠帶被剝離的該保護薄膜並予以廢棄；第2滾輪單元，其係將該黏著膠帶被剝離的該保護薄膜從該平台引導至該廢棄手段；定位手段，其係被配設在該捲筒膠帶支持手段和該第1滾輪單元之間，選擇被支持於兩個以上之該捲筒膠帶支持部的該捲筒膠帶中之任一者且把持該膠帶組之端部而予以拉出，定位在該平台；膠帶組引導手段，其係把持該定位手段定位的該膠帶組之端部而通過該第2滾輪單元而引導至該廢棄手段；及切斷手段，其係被配設在該平台和該廢棄手段之間，切斷該黏著膠帶被剝離的該保護薄膜，將新選擇的該膠帶組藉由該定位手段從該捲筒膠帶支持手段拉出之時，藉由該切斷手段切斷現在使用的該膠帶組之該保護薄膜，該廢棄手段捲取並予以廢棄，並且使現在使用的該捲筒膠帶支持部作動而可以捲取該膠帶組。 [發明效果]The invention relates to an adhesive tape sticking device, which comprises a platform supporting a ring frame with an opening and a wafer positioned at the opening, and attaching an adhesive tape to the ring frame supported on the platform and the wafer to integrate the tape. The tape sticking device includes at least a roll tape support portion that rotatably supports the roll tape, and the roll tape is provided with a plurality of the sticky tapes formed in advance corresponding to the ring frame and arranged at intervals. The tape assembly of the belt-shaped protective film is provided in a roll shape, and the roll tape support means is provided with two or more roll support portions; the first roller unit is pulled out from the roll tape The tape set is guided to the platform from the reel tape support means; the sticking means is to peel the sticky tape from the tape set guided to the platform, and make the sticky tape stick to the ring supported by the platform Shape frame and wafer; discard means, take up the protective film from which the adhesive tape is peeled off and discard it; second roller unit, which guides the protective film from which the adhesive tape is peeled off from the platform The discarding means; the positioning means, which is disposed between the roll tape support means and the first roller unit, and selects any one of the roll tapes supported by two or more of the roll tape support portions. One of them holds the end of the tape set and pulls it out, and positions it on the platform; the guide means of the tape set, which grips the end of the tape set positioned by the positioning means, is guided to the second roller unit by the Discarding means; and cutting means, which are arranged between the platform and the discarding means, cut off the protective film from which the adhesive tape has been peeled, and remove the newly-selected tape set from the roll by the positioning means When the tape support means is pulled out, the protective film of the tape group currently used is cut by the cutting means, the disposal means is taken up and discarded, and the currently used tape support means is actuated. The tape set can be taken up. [Inventive effect]
因與本發明有關之膠帶黏貼裝置被構成至少具備：捲筒膠帶支持部，其係能夠旋轉地支持將膠帶組設成捲筒狀的捲筒膠帶；捲筒支持手段，其係配設有兩個以上捲筒膠帶支持部；第1滾輪單元，其係將從捲筒膠帶拉出之膠帶組從捲筒膠帶支持手段引導至平台；黏貼手段，其係使黏著膠帶從被引導至平台之膠帶組剝離，並使黏著膠帶黏貼於平台支持的環狀框和晶圓；廢棄手段，捲取黏著膠帶被剝離的保護薄膜並予以廢棄；第2滾輪單元，其係將黏著膠帶被剝離的保護薄膜從膠帶引導至廢棄手段；定位手段，其係選擇捲筒膠帶中之任一者且把持膠帶組之端部而予以拉出，定位在平台；膠帶組引導手段，其係把持定位手段定位的膠帶組之端部而通過第2滾輪單元而引導至廢棄手段；及切斷手段，其係被配設在平台和廢棄手段之間，切斷黏著膠帶被剝離的保護薄膜，將新選擇的膠帶組藉由定位手段從捲筒膠帶支持手段拉出之時，藉由切斷手段切斷現在使用的膠帶組之保護薄膜，廢棄手段捲取並予以廢棄，並且使現在使用的捲筒膠帶支持部作動而可以捲取膠帶組，故可以容易將藉由定位手段拉出之膠帶組切換成不同品種之膠帶組，無須以連結用膠帶連結使用中之膠帶組之切斷端，和欲重新使用的膠帶組之前端。因此，可以不使用連結用膠帶，選擇希望的膠帶組而將黏著膠帶黏貼於環形框和晶圓。 再者，若藉由本發明時，因以捲筒膠帶支持部捲取被切斷的剩餘膠帶組，故不會浪費膠帶組，可以有效利用。The tape sticking device according to the present invention is configured to include at least: a reel tape support portion that can rotatably support a set of tapes into a roll shape; and a roll support means that is provided with two More than one roll tape support part; the first roller unit, which guides the set of tapes pulled from the roll tape from the roll tape support means to the platform; the sticking means, which is an adhesive tape that guides the adhesive tape from the platform The group is peeled off, and the adhesive tape is adhered to the ring frame and the wafer supported by the platform; the discarding means is to take up the peeled protective film of the adhesive tape and discard it; the second roller unit is a protective film to which the adhesive tape is peeled Guidance from the tape to the discarding means; positioning means, which selects any one of the rolls of tape and holds the end of the tape group to be pulled out and positioned on the platform; tape guide means, which is the tape holding the positioning means The end of the group is guided to the disposal means by the second roller unit; and the cutting means is arranged between the platform and the disposal means to cut off the protection of the adhesive tape from being peeled off. Film, when the newly selected tape set is pulled out of the roll tape support means by the positioning means, the protective film of the currently used tape set is cut by the cutting means, the discard means is taken up and discarded, and the current The used tape support can act to wind the tape set, so it is easy to switch the tape set pulled out by the positioning means to different types of tape sets, without the need to use the connection tape to cut the tape set in use. End, and the front end of the tape set to be reused. Therefore, the adhesive tape can be adhered to the ring frame and the wafer by selecting a desired tape group without using the connecting tape. Furthermore, when the present invention uses the roll tape support portion to take up the cut remaining tape set, the tape set is not wasted and can be effectively used.
圖1所示之膠帶黏貼裝置1係在具有開口之環形框F和被加工物之一例的晶圓W黏貼黏著膠帶並使一體化的膠帶黏貼裝置。膠帶黏貼裝置1具備支持環形框F並且支持被定位在開口之晶圓W的平台10，和使平台10在水平方向(X軸方向)移動的平台移動手段13。The tape sticking device 1 shown in FIG. 1 is an integrated tape sticking device for sticking an adhesive tape to a wafer W having an opening of an annular frame F and an object to be processed. The adhesive tape bonding apparatus 1 includes a stage 10 that supports the ring frame F and supports the wafer W positioned in the opening, and a stage moving means 13 that moves the stage 10 in the horizontal direction (X-axis direction).
在平台10之周圍，設置有支持環形框F之框支持部11。平台10及框支持部11藉由支持台12從下方被支持。平台移動手段13具備在X軸方向延伸的基座14，和能夠沿著基座14在X軸方向移動的移動基台15。在移動基台15配設支持台12，移動基台15在X軸方向移動，依此可以使平台10及框支持部11經由支持台12在X軸方向移動。Around the platform 10, a frame support portion 11 supporting a ring frame F is provided. The platform 10 and the frame support part 11 are supported from below by the support stand 12. The platform moving means 13 includes a base 14 extending in the X-axis direction, and a moving base 15 capable of moving along the base 14 in the X-axis direction. A support base 12 is provided on the mobile base 15, and the mobile base 15 moves in the X-axis direction, so that the platform 10 and the frame support portion 11 can be moved in the X-axis direction through the support 12.
膠帶黏貼裝置1至少具備：捲筒膠帶支持部20、20A，其係能夠旋轉地支持將膠帶組3、3A設成捲筒狀之捲筒膠帶2、2A；捲筒膠帶支持手段21、21A，其係配設兩個以上捲筒膠帶支持部20、20A；第1滾輪單元30，其係將從捲筒膠帶2、2A拉出之膠帶組3、3A從捲筒膠帶支持手段21、21A引導至平台10；黏貼手段50，其係從被引導至平台10之膠帶組3、3A，剝離圖2所示之黏著膠帶4，使黏著膠帶4黏貼於平台10支持的環形框F和晶圓W；廢棄手段60，捲取黏著膠帶4被剝離的保護薄膜5並予以廢棄；第2滾輪單元70，其係將該黏著膠帶4被剝離的保護薄膜5從平台10引導至廢棄手段60；定位手段40，其係被配設在捲筒膠帶支持手段21、21A和第1滾輪單元30之間，選擇被支持於捲筒膠帶支持部20、20A之捲筒膠帶2、2A中之任一者且把持膠帶組3、3A之端部而予以拉出，定位在平台10；膠帶組引導手段80，其係把持定位手段40定位的膠帶組3、3A之端部而通過第2滾輪單元70而引導至廢棄手段60；及切斷手段90，其係被配設在平台10和廢棄手段60之間，切斷剝離黏著膠帶4的保護薄膜5。The tape sticking device 1 includes at least: roll tape support portions 20 and 20A, which are rotatably supporting roll tapes 2 and 2A in which the tape sets 3 and 3A are formed into rolls; roll tape support means 21 and 21A, It is provided with two or more roll tape support portions 20 and 20A; the first roller unit 30 is a tape set 3 and 3A pulled from the roll tape 2 and 2A and guided from the roll tape support means 21 and 21A To the platform 10; an adhesive means 50, which peels the adhesive tape 4 shown in FIG. 2 from the adhesive tape groups 3 and 3A guided to the platform 10, so that the adhesive tape 4 is adhered to the ring frame F and the wafer W supported by the platform 10. Disposal means 60, take off the peeled protective film 5 of the adhesive tape 4 and discard it; second roller unit 70, which guides the peeled protective film 5 of the adhesive tape 4 from the platform 10 to the discard means 60; positioning means 40, which is disposed between the roll tape support means 21 and 21A and the first roller unit 30, and selects any one of the roll tapes 2 and 2A supported by the roll tape support portions 20 and 20A and Hold the ends of the tape sets 3 and 3A and pull them out, and position them on the platform 10; the tape set guide means 80 It is to hold the ends of the tape sets 3 and 3A positioned by the positioning means 40 and guide it to the disposal means 60 through the second roller unit 70. The cutting means 90 is disposed between the platform 10 and the disposal means 60. , Cut off and peel off the protective film 5 of the adhesive tape 4.
如圖2所示般，膠帶組3成為貼合帶狀之黏著膠帶4和帶狀之保護薄膜5的構造。黏著膠帶4係由基材4a和黏著劑層4b所構成，在黏著劑層4b側黏貼保護薄膜5。本實施形態所示之膠帶組3成為事先對應於圖1所示之環形框F而被成形的複數黏著膠帶4隔著間隔被配置在保護薄膜5的構成。圖示之例之黏著膠帶4因應成為黏著對象之環形框F之直徑而被全切割成圓形狀，在保護薄膜5例如隔著等間隔配設複數被全切割的黏著膠帶4。黏著膠帶4及保護薄膜5不特別限定於材質等。針對本實施形態所示之膠帶組3A，設成與膠帶組3不同之品種。即是，膠帶組3A係在由與膠帶組3之黏著膠帶4之材料或厚度不同的黏著膠帶黏貼保護薄膜5者。As shown in FIG. 2, the tape group 3 has a structure in which a tape-shaped adhesive tape 4 and a tape-shaped protective film 5 are bonded together. The adhesive tape 4 is composed of a base material 4a and an adhesive layer 4b, and a protective film 5 is adhered on the adhesive layer 4b side. The adhesive tape group 3 shown in this embodiment has a configuration in which a plurality of adhesive tapes 4 formed in advance corresponding to the ring frame F shown in FIG. 1 are arranged on the protective film 5 with an interval therebetween. The adhesive tape 4 of the example shown in the figure is completely cut into a circular shape in accordance with the diameter of the ring frame F to be adhered, and the protective film 5 is provided with a plurality of fully cut adhesive tapes 4 at regular intervals, for example. The adhesive tape 4 and the protective film 5 are not particularly limited to materials and the like. The tape group 3A shown in this embodiment is set to a different type from the tape group 3. That is, the adhesive tape group 3A is the one in which the protective film 5 is adhered with an adhesive tape having a different material or thickness from the adhesive tape 4 of the adhesive tape group 3.
捲筒膠帶支持部20藉由例如筒芯被構成。膠帶組3捲筒狀地被捲在該捲筒膠帶支持部20而成為捲筒膠帶2。在捲筒膠帶支持部20之筒芯內，雖然無圖示，但被插入能夠旋轉地支持捲筒膠帶支持部20之支持棒。支持棒連接有使捲筒支持部20正轉、逆轉之圖1所示的旋轉手段22。旋轉手段22係由例如伺服馬達所構成。即使針對捲筒膠帶支持部20A，也係與捲筒膠帶支持部20相同之構成，膠帶組3A捲筒狀地被捲在捲筒膠帶支持部20A而成為捲筒膠帶2A。當藉由定位手段40，將膠帶組3、3A從捲筒膠帶2、2A拉出之時，藉由旋轉手段22，使捲筒膠帶支持部20、20A朝正轉方向(例如順時鐘方向)旋轉。另外，藉由切斷手段90切斷保護薄膜5之後，以捲筒膠帶支持部20、20A捲取剩餘的膠帶組3、3A之時，藉由旋轉手段22，使捲筒膠帶支持部20、20A朝逆轉方向(例如逆時鐘方向)旋轉。The roll tape support part 20 is comprised by a core, for example. The tape group 3 is wound around the roll tape support portion 20 in a roll shape to form a roll tape 2. Although not shown in the figure, the support core of the roll tape support portion 20 is inserted into a support rod that rotatably supports the roll tape support portion 20. The support rod is connected to a rotation means 22 shown in FIG. 1 for rotating the reel support part 20 forward and reverse. The rotating means 22 is constituted by, for example, a servo motor. The roll tape support portion 20A has the same configuration as the roll tape support portion 20, and the tape group 3A is rolled around the roll tape support portion 20A to form a roll tape 2A. When the tape sets 3 and 3A are pulled out from the roll tapes 2 and 2A by the positioning means 40, the roll tape support portions 20 and 20A are turned in the forward direction (for example, clockwise) by the rotation means 22. Spin. In addition, after the protective film 5 is cut by the cutting means 90, when the remaining tape groups 3 and 3A are wound up by the roll tape support portions 20 and 20A, the roll tape support portion 20, 20A rotates in a reverse direction (for example, counterclockwise direction).
捲筒膠帶支持手段21具有收容捲筒膠帶2之框體210。在框體210之底壁，形成有用以使膠帶組3通過之開口211。在開口211之端部，配設有檢測出膠帶組3之前端的前端檢測部24。在開口211之正下方，配設有一對引導滾輪25，可以將膠帶組3引導至下方。即使針捲筒膠帶支持手段21A，也與捲筒膠帶支持手段21相同的構成。在圖示之例中，在捲筒膠帶支持手段21A側之引導滾輪25之附近，配設有朝向第1滾輪單元30而引導膠帶組3、3A之引導滾輪26。另外，在框體210之前方側(Y軸方向前方側)配設有能夠開關的蓋部。The reel tape support means 21 includes a frame 210 that houses the reel tape 2. An opening 211 is formed in the bottom wall of the frame 210 to allow the adhesive tape group 3 to pass through. At the end of the opening 211, a front-end detection unit 24 is provided which detects the front end of the tape group 3. Directly below the opening 211, a pair of guide rollers 25 are provided to guide the tape group 3 downward. The needle roll support means 21A has the same configuration as the roll support means 21A. In the example shown in the figure, a guide roller 26 is provided near the guide roller 25 on the side of the reel tape support means 21A to guide the tape groups 3 and 3A toward the first roller unit 30. A cover portion that can be opened and closed is disposed on the front side (front side in the Y-axis direction) of the housing 210.
在捲筒膠帶支持部20具備有將所使用之膠帶組3之品種資訊予以編碼化的二維碼23。在與二維碼23相向之位置，於上述蓋部之背面(捲筒膠帶支持部20側之面)具備有讀取二維碼23之攝影機。當以捲筒膠帶支持部20支持捲筒膠帶2而關閉蓋部時，藉由攝影機讀取二維碼23，可以識別被支持於捲筒膠帶支持部20之膠帶組3之品種。即使針對捲筒膠帶支持部20A也具備有將所使用之膠帶組3之品質資訊予以編碼化的二維碼23A。另外，二維碼23、23A之配設位置不限定於在本實施形態所示之位置，為任意。The reel tape support unit 20 is provided with a two-dimensional code 23 that encodes the type information of the used tape group 3. At a position facing the two-dimensional code 23, a camera for reading the two-dimensional code 23 is provided on the back surface of the cover (the surface on the side of the roll tape support portion 20). When the cover is closed with the roll tape support portion 20 supporting the roll tape 2, the type of the tape group 3 supported by the roll tape support portion 20 can be identified by reading the two-dimensional code 23 by a camera. Even the roll tape support portion 20A is provided with a two-dimensional code 23A that encodes the quality information of the used tape group 3. In addition, the arrangement positions of the two-dimensional codes 23 and 23A are not limited to the positions shown in this embodiment, and are arbitrary.
定位手段40具備被支持於支持構件41之一端的第1挾持部42，和被連接於支持構件41之另一端的旋轉機構43，和使第1挾持部42在水平方向(X軸方向)移動之滑動機構44。在第1挾持部42中，能夠挾持膠帶組3、3A之端部之兩端。The positioning means 40 includes a first holding portion 42 supported by one end of the supporting member 41, a rotation mechanism 43 connected to the other end of the supporting member 41, and a movement of the first holding portion 42 in the horizontal direction (X-axis direction).之 滑 机构 44。 The sliding mechanism 44. The first gripping portion 42 can grip both ends of the end portions of the tape groups 3 and 3A.
旋轉機構43成為能夠順時鐘及逆時鐘旋轉，可以定位在挾持從捲筒膠帶2被拉出之膠帶組3之第1挾持位置P1，和挾持從捲筒膠帶2A被拉出之膠帶組3A之第2挾持位置P2，和第1挾持部42開放膠帶組3、3A之開放位置P3(參照圖4)。第1挾持位置P1及第2挾持位置P2係指第1挾持部42可以挾持從捲筒膠帶2、2A被拉出且藉由一對引導滾輪25被引導之膠帶組3、3A的位置。開放位置P3係指可以將藉由第1挾持部42被挾持之膠帶組3、3A交給膠帶組引導手段80的位置。The rotation mechanism 43 is capable of rotating clockwise and counterclockwise, and can be positioned at the first holding position P1 holding the tape group 3 pulled out from the roll tape 2 and holding the tape group 3A pulled out from the roll tape 2A The second holding position P2 and the opening position P3 of the first holding part 42 opening the tape groups 3 and 3A (see FIG. 4). The first holding position P1 and the second holding position P2 refer to positions where the first holding part 42 can hold the tape sets 3 and 3A that are pulled out from the roll tapes 2 and 2A and guided by a pair of guide rollers 25. The open position P3 is a position where the tape groups 3 and 3A held by the first holding portion 42 can be passed to the tape group guide means 80.
滑動機構44係藉由在X軸方向延伸之基座45，在基座45能夠於X軸方向滑動的滑件46所構成。滑件46經由旋轉機構43支持第1挾持部42。而且，藉由滑件46在基座45於X軸方向滑動，可以使第1挾持部42與旋轉機構43一起在X軸方向滑動。The sliding mechanism 44 is constituted by a base 45 extending in the X-axis direction, and a slider 46 capable of sliding in the X-axis direction on the base 45. The slider 46 supports the first gripping portion 42 via the rotation mechanism 43. In addition, by sliding the slider 46 on the base 45 in the X-axis direction, the first holding portion 42 can be slid in the X-axis direction together with the rotating mechanism 43.
第1滾輪單元30至少藉由驅動滾輪31、兩個從動滾輪32、使驅動滾輪31和從動滾輪32相對性接近及分離之移動機構33所構成。移動機構33係藉由在X軸方向延伸之導軌34，和在導軌34能夠水平移動之移動部35所構成。移動部35在其前端部支持兩個從動滾輪32。藉由移動部35沿著導軌34移動，可以使驅動滾輪31和從動滾輪32相對性接近及分離。The first roller unit 30 is constituted by at least a driving roller 31, two driven rollers 32, and a moving mechanism 33 that relatively approaches and separates the driving roller 31 and the driven roller 32. The moving mechanism 33 is constituted by a guide rail 34 extending in the X-axis direction and a moving portion 35 capable of horizontally moving on the guide rail 34. The moving portion 35 supports two driven rollers 32 at its front end portion. By moving the moving part 35 along the guide rail 34, the driving roller 31 and the driven roller 32 can be relatively approached and separated.
黏貼手段50具備有將圖2所示之黏著膠帶4朝環狀框F及晶圓W推壓並與黏貼的黏貼滾輪51，和將黏貼膠帶4從通過第1滾輪單元30而被送出之保護薄膜5剝離的剝離板53。黏貼滾輪51被配設在平台10之上方側且成為能夠以軸部為中心而旋轉。在黏貼滾輪51連接黏貼滾輪推壓手段52，成為能夠在藉由黏貼滾輪推壓手段52朝平台10接近及分離的Z軸方向升降。黏貼滾輪51可以對被保持於平台10之晶圓W和被支持於框支持部11之環狀框F，推壓藉由剝離板53從保護薄膜5被剝離之黏著膠帶4並予以黏貼。The sticking means 50 is provided with a sticking roller 51 that pushes the sticking tape 4 shown in FIG. 2 toward the ring frame F and the wafer W and sticks, and protects the sticking tape 4 from being sent out through the first roller unit 30. The film 5 is a peeling plate 53. The sticking roller 51 is disposed above the platform 10 and is rotatable around a shaft portion. The sticking roller pressing means 52 is connected to the sticking roller 51 so as to be able to move up and down in the Z-axis direction approaching and separating from the platform 10 by the sticking roller pressing means 52. The adhesive roller 51 can press and adhere the wafer W held on the platform 10 and the ring frame F supported by the frame support portion 11 by peeling off the protective film 5 from the protective film 5 by the peeling plate 53.
剝離板53係藉由前端側朝黏貼滾輪51傾斜之臂部54，和被連接於臂部54之前端的推壓部55所構成。推壓部55成為能夠沿著臂部54往返移動，藉由以推壓部55推壓膠帶組3中保護薄膜5而形成銳角，可以將黏著膠帶4從保護薄膜5剝離。The peeling plate 53 is composed of an arm portion 54 which is inclined toward the sticking roller 51 at the front end side, and a pressing portion 55 connected to the front end of the arm portion 54. The pressing portion 55 can move back and forth along the arm portion 54, and the protective film 5 in the tape group 3 is pressed by the pressing portion 55 to form an acute angle, and the adhesive tape 4 can be peeled from the protective film 5.
廢棄手段60具備有挾持保護薄膜5之端部的兩端並且捲取成捲筒狀的捲取部61，和使捲取部61旋轉之馬達62，和被配設在捲取部61之下方且用以回收被捲取成捲筒狀之保護薄膜5的廢棄箱63。The disposal means 60 includes a winding portion 61 that holds both ends of the end portion of the protective film 5 and is wound into a roll shape, a motor 62 that rotates the winding portion 61, and is disposed below the winding portion 61. The waste box 63 is used for recycling the protective film 5 rolled into a roll shape.
第2滾輪單元70被配置在膠帶組引導手段80之移動路徑(X軸方向)上，成為與第1滾輪單元30相同的構成。即是，第2滾輪單元70至少藉由驅動滾輪71、兩個從動滾輪72、使驅動滾輪71和從動滾輪72相對性接近及分離之移動機構73所構成。移動機構73係藉由在Z軸方向延伸之導軌74，和在導軌74能夠水平移動之移動部75所構成。移動部75在其前端部支持兩個從動滾輪72。藉由移動部75沿著導軌74移動，可以使驅動滾輪71和從動滾輪72相對性接近及分離。The second roller unit 70 is arranged on the movement path (X-axis direction) of the tape set guide means 80 and has the same configuration as the first roller unit 30. That is, the second roller unit 70 is configured by at least a driving roller 71, two driven rollers 72, and a moving mechanism 73 that relatively closes and separates the driving roller 71 and the driven roller 72. The moving mechanism 73 is constituted by a guide rail 74 extending in the Z-axis direction and a moving portion 75 capable of horizontally moving on the guide rail 74. The moving portion 75 supports two driven rollers 72 at its front end portion. By moving the moving part 75 along the guide rail 74, the driving roller 71 and the driven roller 72 can be relatively approached and separated.
膠帶組引導手段80具備被支持於支持構件81之一端的第2挾持部82，和被連接於支持構件81之另一端的且使第2挾持部82在水平方向(X軸方向)滑動之滑動機構85。在第2挾持部82之上端，安裝有載置藉由第2滾輪單元70被引導之保護薄膜5的載置台83。在載置台83形成有用以膠帶切斷器之刀頭的退避溝84。第2挾持部82可以接住第1挾持部42挾持的膠帶組3之端部的兩端並予以挾持。The tape guide means 80 includes a second holding portion 82 supported by one end of the supporting member 81 and a slide connected to the other end of the supporting member 81 and sliding the second holding portion 82 in the horizontal direction (X-axis direction). Agency 85. On the upper end of the second gripping portion 82, a mounting table 83 on which the protective film 5 guided by the second roller unit 70 is mounted is mounted. An evacuation groove 84 having a blade with a tape cutter is formed on the mounting table 83. The second holding portion 82 can hold and hold both ends of the end of the tape group 3 held by the first holding portion 42.
滑動機構85係藉由在X軸方向延伸之基座86，在基座86能夠於X軸方向滑動的滑件87所構成。滑件87連接有第2挾持部82。滑件87可以藉由在基座86於X軸方向做一直線水平滑動，使支持構件81及第2挾持部82在同方向滑動。The sliding mechanism 85 is constituted by a base 86 extending in the X-axis direction, and a slider 87 capable of sliding in the X-axis direction on the base 86. The slider 87 is connected to the second gripping portion 82. The slider 87 can slide horizontally and linearly on the base 86 in the X-axis direction, so that the support member 81 and the second holding portion 82 slide in the same direction.
切斷手段90具備有切斷被載置於第2挾持部82之載置台83的保護薄膜5的膠帶切斷器91，和使膠帶切斷器91在Z軸方向升降之升降機構92，和推壓被載置於載置台83之保護薄膜5的推壓部93。雖然無圖示，膠帶黏貼裝置1具備控制膠帶黏貼裝置1之各種機構的控制部。控制部例如可以控制定位手段40以使選擇捲筒膠帶2、2A中之任一方而拉出膠帶組3或膠帶組3A。The cutting means 90 includes a tape cutter 91 that cuts the protective film 5 placed on the mounting table 83 of the second gripping section 82, and a lifting mechanism 92 that raises and lowers the tape cutter 91 in the Z-axis direction, and The pressing portion 93 of the protective film 5 placed on the mounting table 83 is pressed. Although not shown, the tape sticking device 1 includes a control unit that controls various mechanisms of the tape sticking device 1. For example, the control unit may control the positioning means 40 so that any one of the roll tapes 2 and 2A is selected to pull out the tape group 3 or the tape group 3A.
接著，針對膠帶黏貼裝置1之動作例予以說明。晶圓W為圓形板狀之被加工物之一例，並非特別限定於材質或大小。將晶圓W載置於平台10，並且將環形框F載置於框支持部11。接著，無圖示之吸引源動作動，以平台10之保持面吸引保持晶圓W。Next, an operation example of the tape sticking device 1 will be described. The wafer W is an example of a circular plate-shaped workpiece, and is not particularly limited to a material or a size. The wafer W is placed on the stage 10, and the ring frame F is placed on the frame support portion 11. Next, an unillustrated attraction source operates to attract and hold the wafer W with the holding surface of the stage 10.
定位手段40例如選擇例如被支持於捲筒膠帶支持部20之捲筒膠帶2，從捲筒膠帶2拉出膠帶組3。具體而言，一面藉由旋轉手段22使捲筒支持部20朝正轉方向(例如，順時鐘方向)旋轉，一面使膠帶組3從捲筒膠帶2通過一對引導滾輪25之間，藉由引導滾輪25朝下方送出。通常，位於捲筒膠帶2之最外周的膠帶組3之端部側僅露出保護薄膜5。因此，從捲筒膠帶2拉出膠帶組3之情況，藉由旋轉機構43將第1挾持部42定位在第1挾持位置P1，藉由引導滾輪25被送出之膠帶組3之端部，即是藉由第1挾持部42挾持保護薄膜5之端部的兩端。The positioning means 40 selects, for example, the roll tape 2 supported by the roll tape support portion 20, and pulls out the tape group 3 from the roll tape 2. Specifically, while the roll support portion 20 is rotated in the forward rotation direction (for example, clockwise direction) by the rotation means 22, the tape set 3 is passed from the roll tape 2 through the pair of guide rollers 25 by The guide roller 25 is sent downward. Generally, only the protective film 5 is exposed on the end side of the tape group 3 located on the outermost periphery of the roll tape 2. Therefore, when the tape group 3 is pulled out from the reel tape 2, the first gripping portion 42 is positioned at the first gripping position P1 by the rotation mechanism 43, and the end of the tape group 3 is sent out by the guide roller 25, that is, Both ends of the end portion of the protective film 5 are held by the first holding portion 42.
如圖3所示般，藉由滑動機構44，使第1挾持部42與滑件46一起滑動至基座45之端部(在圖示之例中，為右方側之端部)為止，例如+X方向。依此，藉由挾持保護薄膜5之第1挾持部42從捲筒膠帶2拉出膠帶組3，並且將第1挾持部42定位在第1滾輪單元30側。As shown in FIG. 3, the first holding portion 42 and the slider 46 are slid to the end portion of the base 45 (in the example shown in the figure, the end portion on the right side) by the sliding mechanism 44, For example + X direction. According to this, the first holding portion 42 holding the protective film 5 is pulled out of the tape group 3 from the roll tape 2, and the first holding portion 42 is positioned on the first roller unit 30 side.
如圖4所示般，藉由旋轉機構43朝例如順時鐘方向旋轉，將以第1挾持部42挾持的保護薄膜5掛在引導滾輪26，並且通過驅動滾輪31和從動滾輪32之間而掛在驅動滾輪31，使第1挾持部42移動至開放位置P3。As shown in FIG. 4, by rotating the rotation mechanism 43 in a clockwise direction, for example, the protective film 5 held by the first holding portion 42 is hung on the guide roller 26, and is driven between the driving roller 31 and the driven roller 32. Hanging on the driving roller 31 moves the first gripping portion 42 to the open position P3.
接著，如圖5所示般，膠帶組引導手段80在開放位置P3挾持保護薄膜5。具體而言，藉由滑動機構85，使滑件87沿著基座86例如+X方向滑動，使第2挾持部82移動至開放位置P3。當第1挾持部42在開放位置P3開放保護薄膜5時，藉由第2挾持部82接住保護薄膜5之端部的兩端並予以挾持。Next, as shown in FIG. 5, the adhesive tape guide means 80 holds the protective film 5 in the open position P3. Specifically, the slider 87 is slid along the base 86, for example, in the + X direction by the slide mechanism 85, so that the second gripping portion 82 is moved to the open position P3. When the first holding portion 42 opens the protective film 5 at the open position P3, the second holding portion 82 catches and holds both ends of the end portion of the protective film 5 through the second holding portion 82.
如圖6所示般，藉由滑動機構85，使滑件87沿著基座86而在例如-X方向滑動。依此，將以第2挾持部82挾持之保護薄膜85朝同方向拉伸，通過第2滾輪單元70之驅動滾輪71和從動滾輪72之間，將保護薄膜5引導至廢棄手段60。而且，廢棄手段60之捲取部61挾持保護薄膜5之端部的兩端。As shown in FIG. 6, the slider 87 is caused to slide along the base 86 in, for example, the -X direction by the sliding mechanism 85. Accordingly, the protective film 85 held by the second holding portion 82 is stretched in the same direction, and the protective film 5 is guided to the disposal means 60 between the driving roller 71 and the driven roller 72 of the second roller unit 70. The winding section 61 of the disposal means 60 holds both ends of the end portion of the protective film 5.
如圖7所示般，藉由第1滾輪單元30之移動機構33作動，移動部35沿著導軌34在例如-X方向移動，使兩個從動滾輪32接近於驅動滾輪31，使兩個從動滾輪32接觸於膠帶組3而藉由驅動滾輪31和兩個從動滾輪32挾入膠帶組3。再者，藉由第2滾輪單元70之移動機構73作動，移動部75沿著導軌74在例如-Z方向移動，使兩個從動滾輪72接近於驅動滾輪71，使兩個從動滾輪72接觸於保護薄膜5而藉由驅動滾輪71和兩個從動滾輪72挾入保護薄膜5。As shown in FIG. 7, by the moving mechanism 33 of the first roller unit 30, the moving part 35 moves along the guide rail 34 in, for example, the -X direction, so that the two driven rollers 32 approach the driving roller 31, so that the two The driven roller 32 contacts the tape group 3 and is driven into the tape group 3 by the driving roller 31 and the two driven rollers 32. Furthermore, by the moving mechanism 73 of the second roller unit 70, the moving portion 75 moves along the guide rail 74 in, for example, the -Z direction, so that the two driven rollers 72 approach the driving roller 71, and the two driven rollers 72 The protective film 5 is brought into contact with the protective film 5 by the driving roller 71 and the two driven rollers 72.
接著，如圖8所示般，剝離板53係以推壓部55將膠帶組3之中之保護薄膜5朝向下方推壓而將保護薄膜5形成銳角。如此一來，黏著膠帶4從保護薄膜5剝離，黏著膠帶4被送入至黏貼滾輪51之下方。此時，使保持晶圓W之平台10及支持環狀框F之框支持部11事先移動至膠帶組3之下方側。Next, as shown in FIG. 8, the peeling plate 53 presses the protective film 5 in the adhesive tape group 3 downward with the pressing portion 55 to form the protective film 5 at an acute angle. In this way, the adhesive tape 4 is peeled from the protective film 5, and the adhesive tape 4 is fed under the adhesive roller 51. At this time, the stage 10 holding the wafer W and the frame support portion 11 supporting the ring frame F are moved to the lower side of the tape group 3 in advance.
一面以特定旋轉速度使黏貼滾輪51旋轉，一面藉由黏貼滾輪推壓手段52使黏貼滾輪51朝例如-Z方向下降，依此，從被支持於框支持部11之環形框F之一方側推壓黏著膠帶4。藉由平台移動手段13將平台10及框支持部11朝例如+X方向送出，以旋轉之黏貼滾輪51對晶圓W及環形框F推壓黏著膠帶4。此時，第1滾輪單元30邊以特定旋轉速度使驅動滾輪31旋轉，邊使兩個從動滾輪32也隨著驅動滾輪31之旋轉而旋轉，將膠帶組3朝向平台10引導至下方。再者，第2滾輪單元70邊以特定旋轉速度使驅動滾輪71旋轉，邊使兩個從動滾輪72也隨著驅動滾輪71之驅動而旋轉，藉由剝離板53將黏著膠帶4被剝離之保護薄膜5從平台10引導至廢棄手段60。The sticking roller 51 is rotated at a specific rotation speed, and the sticking roller 51 is lowered, for example, in the -Z direction by the sticking roller pressing means 52. Accordingly, the sticking roller 51 is pushed sideways from one of the ring frames F supported by the frame support portion 11. Press the adhesive tape 4. The platform 10 and the frame support portion 11 are sent out, for example, in the + X direction by the platform moving means 13, and the adhesive tape 4 is pressed against the wafer W and the ring frame F by the rotating adhesive roller 51. At this time, the first roller unit 30 rotates the driving roller 31 at a specific rotation speed, while rotating the two driven rollers 32 as the driving roller 31 rotates, and guides the adhesive tape group 3 toward the platform 10 downward. In addition, the second roller unit 70 rotates the driving roller 71 at a specific rotation speed, while rotating the two driven rollers 72 as the driving roller 71 is driven, and the adhesive tape 4 is peeled off by the peeling plate 53. The protective film 5 is guided from the platform 10 to the disposal means 60.
當一面以黏貼滾輪51推壓黏著膠帶4，一面如圖9所示般，使平台10及框支持部11在+方向移動至特定位置時，可以將黏著膠帶4黏貼於晶圓W和環形框F。黏著膠帶4被剝離之保護薄膜5在藉由馬達62旋轉之捲取部61的外周，被捲取成捲筒狀，形成保護薄膜輥5A。經由黏著膠帶4而與環形框F成為一體之晶圓W，藉由無圖示之搬運手段，被移送至例如切割裝置等而進行切割等。如此一來，當完成黏著膠帶4對一片晶圓W的黏貼動作時，依序將新的晶圓W搬運至平台10，並且將環形框F搬運至框支持部11，與上述相同，重複進行黏著膠帶4之黏貼動作，和從黏著膠帶4被剝離的保護薄膜5之捲取動作。When the adhesive tape 4 is pushed by the adhesive roller 51 on one side, and the platform 10 and the frame support portion 11 are moved to a specific position in the + direction as shown in FIG. 9, the adhesive tape 4 can be adhered to the wafer W and the ring frame. F. The protective film 5 from which the adhesive tape 4 is peeled is wound into a roll shape on the outer periphery of the winding section 61 rotated by the motor 62 to form a protective film roller 5A. The wafer W integrated with the ring frame F via the adhesive tape 4 is transferred to, for example, a dicing device by a conveying means (not shown) for dicing or the like. In this way, when the sticking operation of the adhesive tape 4 to one wafer W is completed, the new wafer W is sequentially transferred to the platform 10, and the ring frame F is transferred to the frame support portion 11, which is the same as above, and is repeated. The sticking operation of the adhesive tape 4 and the winding operation of the protective film 5 peeled from the adhesive tape 4.
藉由從捲筒膠帶2持續拉出膠帶組3，如圖10所示般，被支持於滾筒膠帶支持手段21之捲筒膠帶2縮徑。在此，在膠帶黏貼裝置1中，例如變更膠帶組3之品種之情況，藉由控制手段控制定位手段40，選擇新的膠帶組3A，從捲筒膠帶支持手段21A拉出。此時，藉由切斷手段90切斷現在使用的膠帶組3之保護薄膜5，並且以廢棄手段60捲取被切斷之保護薄膜5而予以廢棄。從膠帶組3切換至膠帶組3A而予以拉出之情況，在切斷手段90之下方，事先定位膠帶組引導手段80之載置台83。As the tape group 3 is continuously pulled out from the roll tape 2, as shown in FIG. 10, the roll tape 2 supported by the roll tape support means 21 is reduced in diameter. Here, for example, in the case of changing the type of the tape set 3 in the tape sticking device 1, the positioning means 40 is controlled by the control means, a new tape set 3A is selected, and it is pulled out from the roll tape support means 21A. At this time, the protective film 5 of the currently used tape group 3 is cut by the cutting means 90, and the cut protective film 5 is wound up by the discarding means 60 and discarded. When the tape set 3 is switched from the tape set 3 to the tape set 3A and pulled out, the mounting table 83 of the tape set guide 80 is positioned under the cutting means 90 in advance.
切斷手段90藉由升降機構92使推壓部93及膠帶切斷器91朝例如-Z方向下降，以推壓部93朝向載置台83從上方推壓保護薄膜5，並且將膠帶切斷器91之刀頭切入至退避溝84為止而完全切斷保護薄膜5。被切斷之保護薄膜5藉由捲取部61，進一步被捲取，保護薄膜輥5A成為大徑化。The cutting means 90 lowers the pressing portion 93 and the tape cutter 91 in, for example, the -Z direction by the lifting mechanism 92, presses the protective film 5 from above with the pressing portion 93 toward the mounting table 83, and pushes the tape cutter The blade of 91 cuts into the retraction groove 84 to completely cut the protective film 5. The cut protective film 5 is further taken up by the winding section 61, and the protective film roll 5A has a larger diameter.
之後，如圖11所示般，切斷手段90朝+Z方向上升，朝離開載置台83之方向退避，並且保護薄膜輥5A被廢棄至廢棄箱63。此時，藉由旋轉手段22使現在使用的捲筒膠帶支持部20朝逆轉方向(例如，逆時鐘方向)旋轉，將被切斷之剩餘的膠帶組3捲取在捲筒膠帶支持部20。即是，朝平台10側被拉出的膠帶組3通過第1滾輪單元30、一對引導滾輪25及框體210之開口211而被捲取在捲筒膠帶支持部20。而且，當以前端檢測部24檢測出保護薄膜5時，停止捲筒膠帶支持部20之旋轉即可。Thereafter, as shown in FIG. 11, the cutting means 90 rises in the + Z direction, retreats in a direction away from the mounting table 83, and the protective film roll 5A is discarded to the waste box 63. At this time, the currently used reel tape support portion 20 is rotated by the rotating means 22 in a reverse direction (for example, counterclockwise direction), and the remaining tape group 3 that has been cut off is taken up in the reel tape support portion 20. That is, the tape group 3 pulled out toward the platform 10 is taken up by the roll tape support portion 20 through the first roller unit 30, a pair of guide rollers 25, and the opening 211 of the frame 210. In addition, when the protective film 5 is detected by the front-end detection portion 24, the rotation of the roll tape support portion 20 may be stopped.
針對藉由定位手段40從滾筒膠帶2A拉出膠帶組3A之動作，與從上述捲筒膠帶2拉出膠帶組3之動作相同。即是，藉由旋轉機構43將第1挾持部42定位在第2挾持位置P2，藉由第1挾持部42挾持藉由引導滾輪25被送出之膠帶組3A之端部，即是保護薄膜5之端部之兩端，若與上述同樣地拉出即可。而且，即使針對新被拉出之膠帶組3A，重複進行黏著膠帶4之黏貼動作和從黏著膠帶4被剝離之保護薄膜5之捲取動作。The operation of pulling the tape group 3A from the roll tape 2A by the positioning means 40 is the same as the operation of pulling the tape group 3 from the roll tape 2 described above. That is, the first holding portion 42 is positioned at the second holding position P2 by the rotation mechanism 43, and the end portion of the tape group 3A sent out by the guide roller 25 is held by the first holding portion 42, that is, the protective film 5 Both ends of the end portion may be pulled out as described above. Further, even for the newly drawn tape group 3A, the sticking operation of the adhesive tape 4 and the winding operation of the protective film 5 peeled from the adhesive tape 4 are repeated.
如同上述般，因與本發明有關之膠帶黏貼裝置1被構成至少具備：捲筒膠帶支持部20、20A，其係能夠旋轉地支持將膠帶組3、3A設成捲筒狀之捲筒膠帶2、2A；捲筒膠帶支持手段21、21A，其係配設兩個以上捲筒膠帶支持部20、20A；第1滾輪單元30，其係將從捲筒膠帶2、2A拉出之膠帶組3、3A從捲筒膠帶支持手段21、21A引導至平台10；黏貼手段50，其係從被引導至平台10之膠帶組3、3A，剝離黏著膠帶4，使黏著膠帶4黏貼於平台10支持的環形框F和晶圓W；廢棄手段60，捲取黏著膠帶4被剝離的保護薄膜5並予以廢棄；第2滾輪單元70，其係將該黏著膠帶4被剝離的保護薄膜5從平台10引導至廢棄手段60；定位手段40，其係選擇捲筒膠帶2、2A中之任一者且把持膠帶組3、3A之端部而予以拉出，定位在平台10；膠帶組引導手段80，其係把持定位手段40定位的膠帶組3、3A之端部而通過第2滾輪單元70而引導至廢棄手段60；及切斷手段90，其係被配設在平台10和廢棄手段60之間，切斷黏著膠帶4被剝離的保護薄膜5，將新選擇的該膠帶組3、3A藉由定位手段40從捲筒膠帶支持手段21、21A拉出之時，藉由該切斷手段90切斷現在使用的該膠帶組3、3A之保護薄膜5，廢棄手段60捲取並予以廢棄，並且使現在使用的捲筒膠帶支持部20、20A作動而可以捲取該膠帶組3、3A，故可以容易將藉由定位手段40拉出之膠帶組從例如膠帶組3切換成不同品種之膠帶組3A，無須以連結用膠帶連結膠帶組3之切斷端，和膠帶組3A之前端。因此，可以不使用連結用膠帶，選擇希望的膠帶組3、3A而將黏著膠帶4黏貼於環形框F和晶圓W。 再者，若藉由本發明時，由於以捲筒膠帶支持部20、20A捲取被切斷之剩餘的膠帶組3、3A，故不會浪費膠帶組3、3A，可以有效地利用。As described above, the tape sticking device 1 according to the present invention is configured to include at least: a roll tape support portion 20, 20A, which is a roll tape 2 that rotatably supports the tape groups 3 and 3A in a roll shape. , 2A; roll tape support means 21, 21A, which is equipped with two or more roll tape support sections 20, 20A; the first roller unit 30, which is a tape group 3 pulled out from the roll tape 2, 2A 3 and 3A are guided from the reel tape support means 21 and 21A to the platform 10; and the sticking means 50 is to peel off the adhesive tape 4 from the tape group 3 and 3A guided to the platform 10 so that the adhesive tape 4 is adhered to the platform 10 support. Ring frame F and wafer W; discarding means 60, winding up and peeling off the protective film 5 with the adhesive tape 4 peeled off; and a second roller unit 70, which guides the protective film 5 with the peeled off adhesive tape 4 from the platform 10 To the discarding means 60; the positioning means 40, which selects any one of the reel tapes 2 and 2A and holds the ends of the tape sets 3 and 3A to be pulled out, and is positioned on the platform 10; the tape set guide means 80, which Holds the ends of the tape sets 3 and 3A positioned by the positioning means 40 and passes the second roller The unit 70 is guided to the disposal means 60; and the cutting means 90, which is disposed between the platform 10 and the disposal means 60, cuts off the protective film 5 from which the adhesive tape 4 is peeled off, and applies the newly selected tape set 3 When the 3A and 3A are pulled out from the roll tape support means 21 and 21A by the positioning means 40, the cutting film 90 is used to cut the protective film 5 of the tape group 3 and 3A currently used, and the waste means 60 is rolled up and Discard it, and operate the currently used reel tape support sections 20 and 20A to take up the tape sets 3 and 3A. Therefore, the tape set pulled out by the positioning means 40 can be easily switched from, for example, the tape set 3 to a different one. It is not necessary to connect the cut end of the tape group 3 and the front end of the tape group 3A with the adhesive tape group 3A. Therefore, the adhesive tape 4 can be adhered to the ring frame F and the wafer W by selecting the desired tape groups 3 and 3A without using the connecting tape. Furthermore, when the present invention is used, the remaining tape groups 3 and 3A are wound by the roll tape support portions 20 and 20A, so the tape groups 3 and 3A are not wasted and can be effectively used.
1‧‧‧膠帶黏貼裝置1‧‧‧ Adhesive tape device
2、2A‧‧‧捲筒膠帶2, 2A‧‧‧ reel tape
3、3A‧‧‧膠帶組3, 3A‧‧‧ tape set
4‧‧‧黏著膠帶4‧‧‧ Adhesive tape
4a‧‧‧基材4a‧‧‧ substrate
4b‧‧‧黏著劑層4b‧‧‧Adhesive layer
5‧‧‧保護薄膜5‧‧‧ protective film
10‧‧‧平台10‧‧‧platform
11‧‧‧框支持部11‧‧‧Frame Support Department
12‧‧‧支持台12‧‧‧ Support Desk
13‧‧‧平台移動手段13‧‧‧Platform moving means
14‧‧‧基座14‧‧‧ base
15‧‧‧移動基台15‧‧‧ Mobile Abutment
20、20A‧‧‧捲筒膠帶支持部20, 20A‧‧‧Reel tape support
21、21A‧‧‧捲筒膠帶支持手段21, 21A‧‧‧ Reel tape support means
210‧‧‧框體210‧‧‧Frame
211‧‧‧開口211‧‧‧ opening
22‧‧‧旋轉手段22‧‧‧ Rotation means
23‧‧‧二維碼23‧‧‧ QR code
24‧‧‧前端檢測部24‧‧‧Front end detection
25‧‧‧引導滾輪25‧‧‧Guide Wheel
26‧‧‧引導滾輪26‧‧‧Guide Wheel
30‧‧‧第1滾輪單元30‧‧‧The first roller unit
31‧‧‧驅動滾輪31‧‧‧Drive roller
32‧‧‧從動滾輪32‧‧‧ driven roller
33‧‧‧移動機構33‧‧‧ Mobile agency
34‧‧‧導軌34‧‧‧rail
35‧‧‧移動部35‧‧‧Mobile
40‧‧‧定位手段40‧‧‧ positioning means
41‧‧‧支持構件41‧‧‧ supporting components
42‧‧‧第1挾持部42‧‧‧The first holding section
43‧‧‧旋轉機構43‧‧‧Rotating mechanism
44‧‧‧滑動機構44‧‧‧ sliding mechanism
45‧‧‧基座45‧‧‧ base
46‧‧‧滑件46‧‧‧ Slider
50‧‧‧黏貼手段50‧‧‧ sticking means
51‧‧‧黏貼滾輪51‧‧‧ Sticky Roller
52‧‧‧黏貼滾輪推壓手段52‧‧‧Adhesive roller pressing method
53‧‧‧剝離板53‧‧‧ peeling plate
54‧‧‧臂部54‧‧‧arm
55‧‧‧推壓部55‧‧‧Pressing section
60‧‧‧廢棄手段60‧‧‧ Disposal methods
61‧‧‧捲取部61‧‧‧ Take-up Department
62‧‧‧馬達62‧‧‧Motor
63‧‧‧廢棄箱63‧‧‧waste box
70‧‧‧第2滾輪單元70‧‧‧ 2nd roller unit
71‧‧‧驅動滾輪71‧‧‧Drive roller
72‧‧‧從動滾輪72‧‧‧ driven roller
73‧‧‧移動機構73‧‧‧ mobile agency
74‧‧‧導軌74‧‧‧rail
75‧‧‧移動部75‧‧‧Mobile
80‧‧‧膠帶組引導手段80‧‧‧Tape group guide means
81‧‧‧支持構件81‧‧‧ supporting components
82‧‧‧第2挾持部82‧‧‧ 2nd holding section
83‧‧‧載置台83‧‧‧mounting table
84‧‧‧退避溝84‧‧‧Retreat
85‧‧‧滑動機構85‧‧‧ sliding mechanism
86‧‧‧基座86‧‧‧ base
87‧‧‧滑件87‧‧‧ Slider
90‧‧‧切斷手段90‧‧‧ cutting means
91‧‧‧膠帶切斷器91‧‧‧Tape cutter
92‧‧‧升降機構92‧‧‧Lifting mechanism
93‧‧‧推壓部93‧‧‧Pressing Department
圖1為表示膠帶黏貼裝置之構成的剖面圖。 圖2為表示捲筒狀地被捲在捲筒膠帶支持部的膠帶組之構成的斜視圖。 圖3為表示維持定位手段夾持膠帶組之端部之原樣滑動至第1滾輪單元側之狀態的剖面圖。 圖4為表示挾持膠帶組之端部的定位手段被定位在開放位置之狀態的剖面圖。 圖5為表示膠帶組引導手段在開放位置挾持膠帶組之端部之狀態的剖面圖。 圖6為表示維持膠帶組引導手段挾持膠帶組之端部之原樣滑動至廢棄手段之狀態的剖面圖。 圖7為表示以第1滾輪單元及第2滾輪單元挾持膠帶組之狀態的剖面圖。 圖8為表示藉由剝離板從保護薄膜剝離黏著膠帶，藉由黏貼滾輪將黏著膠帶黏貼於環形框及晶圓之狀態的剖面圖。 圖9為表示黏著膠帶被黏貼於環形框及晶圓之狀態，並且藉由廢棄手段捲取保護薄膜之狀態的剖面圖。 圖10為表示藉由切斷手段切斷黏著膠帶被剝離之保護薄膜之狀態的剖面圖。 圖11為表示定位手段挾持新選擇的膠帶組並予以拉出之時，以廢棄手段廢棄被切斷之保護薄膜，並且以捲筒膠帶支持部捲取現在使用的膠帶組之狀態的剖面圖。FIG. 1 is a cross-sectional view showing a configuration of an adhesive tape bonding apparatus. FIG. 2 is a perspective view showing a configuration of an adhesive tape group wound in a roll shape on a roll tape support portion. FIG. 3 is a cross-sectional view showing a state in which the ends of the tape holding group held by the positioning means are slid to the first roller unit side as they are. FIG. 4 is a cross-sectional view showing a state where the positioning means of the end portion of the grip tape group is positioned at the open position. FIG. 5 is a cross-sectional view showing a state where the tape group guide means holds the end of the tape group in the open position. FIG. 6 is a cross-sectional view showing a state where the end of the tape group is held by the tape guide mechanism and the end of the tape group is slid to the disposal means. FIG. 7 is a cross-sectional view showing a state where the first roller unit and the second roller unit hold the tape group. FIG. 8 is a cross-sectional view showing a state in which the adhesive tape is peeled from the protective film by a release plate, and the adhesive tape is adhered to the ring frame and the wafer by an adhesive roller. FIG. 9 is a cross-sectional view showing a state where an adhesive tape is stuck on a ring frame and a wafer, and a protective film is wound by a discarding method. FIG. 10 is a cross-sectional view showing a state where the protective film from which the adhesive tape is peeled off is cut by a cutting means. FIG. 11 is a cross-sectional view showing a state in which the positioning means holds a newly selected tape set and pulls it out, discards the cut protective film by discarding means, and takes up a currently used tape set with a roll tape support portion.
Claims (1)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-241724 | 2017-12-18 | ||
| JP2017241724A JP7049822B2 (en) | 2017-12-18 | 2017-12-18 | Tape sticking device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201927674A true TW201927674A (en) | 2019-07-16 |
| TWI779140B TWI779140B (en) | 2022-10-01 |
Family
ID=67104881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107145418A TWI779140B (en) | 2017-12-18 | 2018-12-17 | Tape sticking device |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7049822B2 (en) |
| KR (1) | KR102640590B1 (en) |
| CN (1) | CN110010540B (en) |
| TW (1) | TWI779140B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7351703B2 (en) * | 2019-10-09 | 2023-09-27 | 株式会社ディスコ | tape mounter |
| JP2022103995A (en) | 2020-12-28 | 2022-07-08 | 株式会社ディスコ | Tape mounter |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57159391A (en) * | 1981-03-28 | 1982-10-01 | Nippon Signal Co Ltd | Residual paper disposal for ticketing apparatus |
| TW450936B (en) * | 1998-09-03 | 2001-08-21 | Japan Tobacco Inc | Adhering device for adhesive sheet |
| KR100633159B1 (en) * | 2004-11-26 | 2006-10-11 | 삼성전자주식회사 | Anisotropic Conductive Film Feeding Device |
| JP2006341989A (en) * | 2005-06-10 | 2006-12-21 | Toyo Network Systems Co Ltd | Printing device and automatic ticket vending machine |
| JP4836827B2 (en) * | 2007-02-22 | 2011-12-14 | 日東電工株式会社 | Adhesive tape pasting device |
| JP4868591B2 (en) * | 2007-02-23 | 2012-02-01 | 株式会社タカトリ | Method and apparatus for attaching tape to substrate |
| JP4995796B2 (en) * | 2008-09-30 | 2012-08-08 | 日東電工株式会社 | Adhesive tape application method and adhesive tape application device |
| JP2014027171A (en) | 2012-07-27 | 2014-02-06 | Lintec Corp | Sheet sticking device and sheet sticking method |
| JP6030909B2 (en) * | 2012-10-02 | 2016-11-24 | リンテック株式会社 | Sheet sticking device and sheet sticking method |
| JP6216584B2 (en) * | 2013-09-13 | 2017-10-18 | リンテック株式会社 | Sheet sticking device and sticking method |
| JP6316673B2 (en) * | 2014-06-24 | 2018-04-25 | 株式会社ディスコ | Tape sticking device |
-
2017
- 2017-12-18 JP JP2017241724A patent/JP7049822B2/en active Active
-
2018
- 2018-12-06 KR KR1020180155875A patent/KR102640590B1/en active IP Right Grant
- 2018-12-14 CN CN201811530912.4A patent/CN110010540B/en active Active
- 2018-12-17 TW TW107145418A patent/TWI779140B/en active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2019110189A (en) | 2019-07-04 |
| TWI779140B (en) | 2022-10-01 |
| CN110010540A (en) | 2019-07-12 |
| KR102640590B1 (en) | 2024-02-23 |
| CN110010540B (en) | 2023-10-03 |
| JP7049822B2 (en) | 2022-04-07 |
| KR20190073269A (en) | 2019-06-26 |
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