TW201923789A - 各向異性導電薄膜及積層體 - Google Patents

各向異性導電薄膜及積層體 Download PDF

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Publication number
TW201923789A
TW201923789A TW107135890A TW107135890A TW201923789A TW 201923789 A TW201923789 A TW 201923789A TW 107135890 A TW107135890 A TW 107135890A TW 107135890 A TW107135890 A TW 107135890A TW 201923789 A TW201923789 A TW 201923789A
Authority
TW
Taiwan
Prior art keywords
conductive film
anisotropic conductive
plate
curable resin
conductive particles
Prior art date
Application number
TW107135890A
Other languages
English (en)
Chinese (zh)
Inventor
小林浩行
Original Assignee
日商富士軟片股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商富士軟片股份有限公司 filed Critical 日商富士軟片股份有限公司
Publication of TW201923789A publication Critical patent/TW201923789A/zh

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Wire Bonding (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Laminated Bodies (AREA)
  • Non-Insulated Conductors (AREA)
TW107135890A 2017-10-12 2018-10-12 各向異性導電薄膜及積層體 TW201923789A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017198207 2017-10-12
JP2017-198207 2017-10-12

Publications (1)

Publication Number Publication Date
TW201923789A true TW201923789A (zh) 2019-06-16

Family

ID=66101483

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107135890A TW201923789A (zh) 2017-10-12 2018-10-12 各向異性導電薄膜及積層體

Country Status (3)

Country Link
JP (1) JP6944534B2 (ja)
TW (1) TW201923789A (ja)
WO (1) WO2019074064A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113870732A (zh) * 2021-09-30 2021-12-31 惠科股份有限公司 显示装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003187885A (ja) * 2001-12-20 2003-07-04 Sony Corp 異方性導電フィルムおよび異方性導電フィルムの製造方法ならびに電子部品の実装体
JP2005251647A (ja) * 2004-03-05 2005-09-15 Fuji Photo Film Co Ltd 異方性導電膜及びその製造方法
JP4760066B2 (ja) * 2005-03-14 2011-08-31 住友電気工業株式会社 異方導電性接着剤
JP4595646B2 (ja) * 2005-04-19 2010-12-08 住友電気工業株式会社 エポキシ樹脂組成物
JP7047282B2 (ja) * 2016-12-01 2022-04-05 デクセリアルズ株式会社 フィラー含有フィルム

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113870732A (zh) * 2021-09-30 2021-12-31 惠科股份有限公司 显示装置
CN113870732B (zh) * 2021-09-30 2024-02-02 惠科股份有限公司 显示装置

Also Published As

Publication number Publication date
WO2019074064A1 (ja) 2019-04-18
JPWO2019074064A1 (ja) 2020-11-26
JP6944534B2 (ja) 2021-10-06

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