TW201918800A - Exposure system, exposure method, and manufacturing method of panel substrate for display especially having exposure patterns of different sizes on a single substrate - Google Patents

Abstract

The present invention provides an exposure system that exposes patterns of different sizes on a single substrate with high positional accuracy without significantly increasing equipment or steps, a marking device that includes a photoresist applied to be coated on the substrate to form a plurality of substrate marks at specified intervals, and a plurality of exposure devices. Each of the plurality of exposure devices detects the offset between the mask mark and the substrate mark from images of mask mark and substrate mark obtained by the image acquisition device, and detects the position of the platform using the laser measuring device and then correspondingly detects the offset value, performs the position calibration of mask mark and substrate mark, and performs relative positioning of mask mark and substrate. Based on the detection result of the laser measuring device, the pattern is controlled at the position where the substrate is exposed, the pattern is exposed on the substrate, and the patterns having different sizes are exposed on the substrate.

Description

Exposure system, exposure method, and manufacturing method of panel substrate for display

The present invention relates to an exposure system using a proximity method, an exposure system for exposing a plurality of patterns on a single substrate, an exposure method, and a method of manufacturing a display panel substrate using the same, and more particularly to using a plurality of exposure devices. An exposure system for exposing patterns of different sizes of a sheet substrate, an exposure method, and a method of manufacturing a panel substrate for display using the same.

Manufacturing of a TFT (Thin Film Transistor) substrate, a color filter substrate, a plasma display panel substrate, and the like of a liquid crystal display device used as a display panel, using an exposure apparatus to form a pattern on a substrate by photolithography To proceed. As an exposure apparatus, there is a projection method in which a pattern of a mask is projected onto a substrate using a lens or a mirror, and a pattern of a mask is transferred to the substrate by providing a slight gap between the mask and the substrate. Close connection method. Although the proximity method has poor resolution compared to the projection method, the structure of the illumination optical system is simple, and the processing capability is high, so that it is suitable for mass production.

In the manufacture of various substrates for the display panel, a relatively large substrate is prepared in accordance with the increase in size and size, and a single or a plurality of display panels are formed on a single substrate in accordance with the size of the display panel. In this case, if one side of the substrate is to be exposed by the proximity method, it is necessary to have a mask of the same size as the substrate, and the cost of the high mask is further increased. Here, a mask having a smaller footprint than the substrate is used, and the substrate is stepped in the XY direction by the moving platform, and the split surface of the substrate is divided into a plurality of lenses to expose the exposure.

In order to bond the TFT substrate to the color filter substrate of the liquid crystal display device, the position of each pattern spread over the entire substrate is required to be high precision. In the split exposure method of the proximity method, a CCD camera or the like is used for each lens to obtain an image of the calibration mark of the mask and the calibration mark of the substrate, and the offset between the two is detected by image processing to perform masking and substrate Position calibration. However, in the exposure of the black matrix formed first on the color filter substrate, the alignment mark is not formed on the surface of the substrate. Therefore, in the exposure of the black matrix of the color filter substrate, when the substrate is stepwise moved, the position of the substrate is accurately performed using the laser measurement system, and the positional accuracy is ensured. a laser measuring system comprising a light source for generating laser light, a reflecting mechanism (column mirror) mounted on a chuck or a moving platform, and a laser light for measuring the light source and a reflecting mechanism (column mirror) Interferometric laser interferometer for reflected laser light.

On the other hand, Patent Document 1 discloses a technique for forming a substrate by applying a laser marking layer to a photoresist layer coated on a substrate by exposure using a color filter substrate or the like. The alignment mark of the exposure region is performed by sharing exposure of a plurality of exposure regions of the single substrate between a plurality of exposure devices. [Previous Technical Literature] [Patent Literature]

Patent Document 1: Japanese Laid-Open Patent Publication No. 2004-294770

[Problems to be Solved by the Invention] In recent years, as the size of the display panel has increased, the size of the substrate has also increased in size. In order to use a large-sized substrate as much as possible without waste, it is necessary to expose a pattern of a display panel having a different size to a single-piece substrate, and to improve the surface use efficiency (ratio of the area of use of the area of the entire substrate) of the panel. In order to expose patterns of different sizes, it becomes necessary to have a plurality of masks and become a plurality of exposure positions. However, the above-described positioning by the laser measuring system can only maintain positional accuracy between a plurality of patterns exposed in a single exposure apparatus. Therefore, if the substrate is taken out from the chuck and moved to another exposure device, the positional accuracy between the already exposed pattern and the pattern to be exposed cannot be maintained. Therefore, conventionally, a mask dedicated to a calibration mark of a calibration mark having a pattern of different sizes is prepared, and an exposure apparatus dedicated to the calibration mark is provided, and a step of forming a calibration mark on the substrate in advance is necessary. Therefore, there is a problem that the equipment cost and the operation cost associated with the calibration mark forming step increase.

On the other hand, in the technique described in Patent Document 1, a calibration mark for each exposure region of the substrate is formed on the photoresist layer applied to the substrate by using a laser marking device. In this marking device, a laser measuring system is used in order to measure the position of the optical system for performing the marked laser light (see paragraphs [0022], [0033], and [0036] of Patent Document 1). In order to form a plurality of calibration marks having different positions depending on the respective dimensions of the pattern and to spread over a large substrate as a whole, a highly accurate and expensive laser measurement system is necessary, and the equipment cost of the marking device increases. Further, even if the substrate is moved in the XY direction, it is necessary to use a laser measuring system for detecting the position of the XY stage and the XY stage of the moving substrate, thereby increasing the equipment cost and the installation space. Further, in the technique described in Patent Document 1, a step of forming a calibration mark in each exposure region of the substrate is further added, and there is a problem that the production tact is greatly increased.

An object of the present invention is to expose a pattern having a different size to a single substrate with high positional accuracy without greatly increasing the number of devices or steps. Further, an object of the present invention is to produce a display panel substrate having excellent surface utilization efficiency with high precision. [Technical means to solve the problem]

The exposure system of the present invention comprises a marking device for forming a plurality of substrate marks at a predetermined interval on a photoresist coated on a substrate; and a plurality of exposure devices for exposing a pattern to the substrate, wherein a plurality of the exposure devices each comprising a mask frame for supporting a mask, the mask is smaller in size than the substrate, and the pattern and the plurality of mask marks are formed, and the mask marks are Formed at the same spacing as the substrate; a chuck for mounting the substrate, the substrate is formed with a plurality of the substrate marks; a platform for moving the mask frame and the chuck relatively; a driving a circuit for driving the platform; an image acquisition device for acquiring the mask mark and the image of the substrate mark, and outputting an image signal of the obtained image; an image processing device, The image signal output from the image acquisition device is processed to detect the offset of the mask mark from the substrate mark; a laser measuring device is used to detect the position of the platform And one control The device is configured to control the driving circuit, corresponding to the offset of the mask mark and the substrate mark detected by the image processing device, to move the platform to perform the mask mark and the substrate mark Position calibration, and performing relative positioning of the mask and the substrate, and then moving the platform to control the pattern to the exposed position of the substrate based on the detection result of the laser measuring device, wherein the exposure systems will each other The pattern of different sizes is exposed to the substrate.

The exposure method of the present invention further comprises the steps of: forming a plurality of substrate marks at a predetermined interval on a photoresist coated on a substrate by a marking device; and separately covering the plurality of exposure devices The cover is supported by a mask frame having a smaller size than the substrate, and the pattern and the plurality of mask marks are formed, the mask marks are formed at the same interval as the substrate mark; The substrate marked by the substrate is mounted on a chuck; the mask frame and the chuck are relatively moved by a platform; and the mask mark and the substrate mark are obtained by an image acquisition device And outputting an image signal of the obtained image; and processing the image signal outputted from the image obtaining device by an image processing device to detect the mask mark and the substrate mark Offset; detecting the position of the platform by using a laser measuring device; and offsetting the mask mark and the substrate mark detected by the image processing device, moving the platform, and performing The mask Recording the position of the substrate mark, and performing relative positioning of the mask and the substrate, and then moving the platform based on the detection result of the laser measuring device, and controlling the pattern to the position where the substrate is exposed. The substrate is exposed to the pattern, and the pattern of mutually different sizes is exposed to the substrate.

Since the substrate mark is formed at a predetermined interval on the photoresist applied to the substrate by the marking device, the installation cost and the operation cost are greatly reduced as compared with the case of the exposure device dedicated to the calibration mark. Further, compared with the technique described in Patent Document 1, the installation cost and the operation cost are greatly reduced. Further, in a plurality of exposure apparatuses, since the offset amount of the mask mark and the substrate mark are respectively detected, the offset amount of the mask mark and the substrate mark to be detected is moved, the platform is moved, and the mask mark is performed. The positional alignment of the substrate mark is performed to position the relative position of the mask and the substrate. Therefore, even if the substrate is moved from one exposure device to another exposure device, the relative position of the mask and the substrate can be maintained, and each exposure device can be The positions of the exposed patterns are maintained at high precision. And in a plurality of exposure devices, respectively, using a laser measuring device to detect the position of the platform, and after ending the position calibration of the mask mark and the substrate mark, based on the detection result of the laser measuring device, moving the platform, controlling the pattern to be exposed on the substrate At the position, the pattern is exposed to the substrate, and the patterns different in size from each other are exposed on the substrate, so that the patterns of the respective sizes can be exposed with high precision at a desired position. Therefore, it is possible to expose different sizes of patterns to a single sheet substrate with high positional accuracy without greatly increasing the equipment or steps.

Further, in the exposure system of the present invention, the mask forms two or more mask marks in two directions, the substrate is rectangular, and two or more substrate marks are formed in the longitudinal direction or the short side direction, and plural numbers are formed. In the exposure apparatus, the substrate is mounted on the chuck in a longitudinal or lateral direction, and an image of the mask mark and the substrate mark is obtained by the image acquisition device, and the position of the mask mark and the substrate mark is aligned.

Further, in the exposure method of the present invention, two or more mask marks are formed in two directions of the mask, and two or more substrate marks are formed in the longitudinal direction or the short side direction of the rectangular substrate, and the plurality of exposure means are formed. In this case, the substrate is mounted on the chuck in a longitudinal or lateral direction, and an image of the mask mark and the substrate mark is obtained by the image acquisition device, and the position of the mask mark and the substrate mark is aligned.

Since two or more mask marks are respectively formed in two directions of the mask, and two or more substrate marks are formed in the longitudinal direction or the short side direction of the rectangular substrate, the substrate mark formed on the substrate by the marking device is used. For a small amount. Further, since the substrate is mounted on the chuck in a longitudinal or lateral direction in a plurality of exposure apparatuses, the rectangular exposure region disposed on the substrate is exposed in the longitudinal and lateral directions.

Further, in the exposure system of the present invention, at least one of the plurality of exposure devices performs movement of the plurality of stages based on the detection result of the laser measuring device, and exposes the plurality of patterns to the substrate. Further, in the exposure method of the present invention, at least one of the plurality of exposure apparatuses performs movement of the plurality of stages based on the detection result of the laser measuring apparatus, and exposes the plurality of patterns to the substrate. Thereby, a large number of surfaces on which the same pattern having a relatively small size is disposed are efficiently exposed by a substrate having good efficiency.

Further, in the exposure system of the present invention, the marking device has an exposure element that irradiates the periphery of the substrate mark with the exposure light to expose the substrate mark. Further, in the exposure method of the present invention, the marking device has an exposure element which irradiates the periphery of the substrate mark with the exposure light and exposes the substrate mark. The present invention has been recognized by the fact that the substrate mark is formed on the substrate and the presence of the substrate mark is confirmed.

In the exposure system of the present invention, the exposure device that is finally exposed in the plurality of exposure devices performs the positional alignment of the mask mark and the substrate mark, and then exposes the mask mark and the substrate mark to the substrate. Further, in the exposure method of the present invention, the exposure device that is finally exposed in the plurality of exposure devices exposes the mask mark and the substrate mark to the substrate after performing the positional alignment of the mask mark and the substrate mark. The present invention has been recognized by the fact that the mask mark and the substrate mark are formed on the substrate, and the presence of the mask mark and the substrate mark is confirmed.

In the method for producing a panel substrate for display according to the present invention, exposure of the substrate is performed by any one of the above exposure systems, or exposure of the substrate is performed by any of the above exposure methods. [Compared with the efficacy of prior art]

According to the exposure system and the exposure method of the present invention, it is possible to expose a pattern having a different size to a single substrate with high positional accuracy without greatly increasing the number of devices or steps.

Further, two or more mask marks are formed in each of the two directions of the mask, and two or more substrate marks are formed in the longitudinal direction or the short side direction of the rectangular substrate, whereby the marking device can be formed on the substrate. The substrate is marked as a small amount. Further, in a plurality of exposure apparatuses, the substrate is mounted on the chuck in the longitudinal direction or the lateral direction, whereby the rectangular exposure region disposed on the substrate can be exposed in the longitudinal and lateral directions.

Further, at least one of the plurality of exposure devices performs movement of the plurality of stages based on the detection result of the laser measuring device, and the pattern is exposed to the substrate a plurality of times, whereby a plurality of sizes can be arranged with a relatively small size. The surface of the pattern is efficiently exposed using a substrate that is efficient.

Further, the exposure device is provided in the marking device, and the exposure light is applied from the exposure member to the periphery of the substrate mark to expose the substrate mark, whereby the substrate mark is formed on the substrate, and the presence of the substrate mark is confirmed, whereby the present invention is recognized.

Alternatively, the exposure device that performs the last exposure in the plurality of exposure devices exposes the mask mark and the substrate mark to the substrate after performing the positional alignment of the mask mark and the substrate mark, thereby forming the mask mark and the substrate mark on the substrate. Further, by confirming the presence of the mask mark and the substrate mark, it is recognized that the present invention is implemented.

According to the method for manufacturing a display panel of the present invention, since a pattern having a different size can be exposed to a single substrate with high positional accuracy, a display panel having excellent surface use efficiency can be manufactured with high precision.

[Embodiment] (Configuration of Exposure System) Fig. 1 is a view showing a schematic configuration of an exposure system according to an embodiment of the present invention. The exposure system of this embodiment is configured as two exposure devices including an exposure device A and an exposure device B, and a marking device C. In addition, three or more exposure apparatuses can be provided. The exposure apparatus A and the exposure apparatus B of the present embodiment have the same structure, and the directions of the mask used and the substrate mounted on the chuck are different.

Fig. 2(a) is a plan view showing the exposure device A, and Fig. 2(b) is a side view showing the exposure device A. 3(a) shows a plan view of the exposure device B, and FIG. 3(b) shows a side view of the exposure device B. The exposure device A is configured to include a substrate 3, an X guide 4, an X platform 5, a Y guide 6, a Y platform 7, a θ stage 8, a chuck support table 9, a chuck 10, a mask frame 20, and image processing. The device 30, the plurality of camera elements 31, the laser measuring device 40, the platform driving circuit 50, and the main control device 60. The exposure device A is provided with two groups of an X platform 5, a Y guide 6, a Y platform 7, a θ platform 8, a chuck support table 9, and a chuck 10. The exposure device B is also configured to be the same as the exposure device A.

In addition, in FIGS. 1 and 3, the image processing device 30, the laser measuring device 40, the platform driving circuit 50, and the main control device 60 of the exposure device B are omitted. In FIG. 2, the image processing device 30, the laser measuring device 40, the platform driving circuit 50, and the main control device 60 of the exposure device A are omitted. In addition to these, the exposure apparatuses A and B also have an illumination optical system that illuminates the exposure light, and an exposure shutter that partially blocks the exposure light. Further, in addition to the exposure apparatuses A and B and the marking device C, the exposure system also has the chuck 10 for carrying the substrate 1 into the exposure apparatuses A and B, or the substrate 1 is carried out from the chucks 10 of the exposure apparatuses A and B. The substrate transfer robot and temperature control elements for performing temperature management in the device.

In addition, the XY direction in the embodiment described below is an example, and the X direction and the Y direction may be mutually adjusted.

In FIGS. 2 and 3, each of the chucks 10 is placed at a mounting/unloading position at which the substrate 1 is mounted and unloaded. At each of the mounting/unloading positions, the substrate 1 is carried into the respective chucks 10 by the substrate transfer robot, or the substrates 1 are carried out from the respective chucks 10. Each of the chucks 10 is alternately moved from the respective mounting/unloading positions to the exposure positions at which the exposure of the substrate 1 is performed.

Above the exposure position, a mask frame 20 is provided. In FIG. 2, the mask 2 is supported by the mask frame 20 of the exposure apparatus A. In Fig. 3, the mask 2' is supported by the mask frame 20 of the exposure device B. The mask frame 20 is provided with an opening through which the exposure light passes, and the mask frame 20 is vacuum-sucked and supported by the peripheral portions of the masks 2, 2' by an adsorption groove provided around the opening (not shown). An exposure shutter (not shown) and an illumination optical system are disposed above the masks 2, 2' supported by the mask frame 20, respectively. At the time of exposure, the exposure light from each illumination optical system is irradiated to the substrate 1 through the masks 2, 2', and the patterns of the masks 2, 2' are transferred to the surface of the substrate 1 to form a pattern on the substrate 1. .

Four camera elements 31 are disposed above the mask frame 20. Each of the camera elements 31 obtains an image of the mask marks of the masks 2, 2' and the substrate marks of the substrate 1 to be described later, and outputs the image signals of the acquired images to the image processing apparatus 30 of Fig. 1 . The image processing device 30 processes the image signals output from the respective camera elements 31, and detects the offset amount of the mask marks of the masks 2, 2' and the substrate marks of the substrate 1. The main control device 60 controls the platform driving circuit 50 to perform position calibration of the mask mark and the substrate mark corresponding to the offset amount of the mask mark and the substrate mark detected by the image processing device 30, and performs masking and masking. The relative position of the substrate is positioned. Further, the camera element can also be configured such that one or two or more camera elements move in accordance with the position of the mask mark of the masks 2, 2'.

In (b) of FIG. 2 and (b) of FIG. 3, each chuck 10 is mounted on the θ stage 8 through the chuck support table 9, and the Y stage 7 and the X stage 5 are provided below the θ stage 8. The X stage 5 is mounted on the X guide 4 provided on the base 3, and moves along the X guide 4 in the X direction (the horizontal direction in the drawings of FIG. 2(b) and FIG. 3(b)). The Y stage 7 is mounted on the Y guide 6 provided on the X stage 5, and moves along the Y guide 6 in the Y direction (the depth direction in FIG. 2(b) and FIG. 3(b)). The θ stage 8 is mounted on the Y stage 7 and rotates in the θ direction. The chuck support table 9 is mounted on the θ stage 8, and supports the inside of the chuck 10 at a plurality of locations. The X platform 5, the Y platform 7, and the θ stage 8 are provided with drive mechanisms (not shown) such as a ball screw, a motor, and a linear motor, and each drive mechanism is driven by the stage drive circuit 50 of FIG.

Each of the chucks 10 is moved between each of the mounting/unloading positions and the exposure position by the movement of the X stages 5 in the X direction and the movement of the Y stages 7 in the Y direction. At each of the mounting/unloading positions, the movement of each of the X stages 5 in the X direction, the movement of the Y stages 7 in the Y direction, and the rotation of the θ stages 8 in the θ direction are performed on the substrate 1 of each of the chucks 10 . Pre-alignment. At the exposure position, the substrate 1 mounted on the chuck 10 is moved in the XY direction by the movement of the X stages 5 in the X direction and the movement of the Y stages 7 in the Y direction. Further, the mask frame 20 is moved and tilted in the Z direction (the vertical direction in the drawings of FIG. 2(b) and FIG. 3(b)) by a Z-tilt mechanism (not shown) to perform the masks 2, 2 'Curve calibration with the substrate 1. In FIG. 1, the main control unit 60 controls the stage drive circuit 50 to move the X stages 5 in the X direction, the Y stages 7 in the Y direction, and the θ stages 8 in the θ direction.

Further, in the present embodiment, the gap between the masks 2, 2' and the substrate 1 is calibrated by moving and tilting the mask frame 20 in the Z direction. However, Z- may be provided for each of the chuck support tables 9. The tilt mechanism adjusts the gap between the masks 2, 2' and the substrate 1 by moving and tilting the chucks 10 in the Z direction. In the present embodiment, the chuck 10 is moved in the XY direction by each of the X stages 5 and the Y stages 7. However, a platform for moving the mask frame 20 in the XY direction may be provided, and the mask frame 20 may be moved in the XY direction. .

The laser measuring device 40 can use a laser measuring system including a laser light source, a laser interferometer, and a lenticular lens, and a laser measuring system control device described in Japanese Laid-Open Patent Publication No. 2009-31639, the details of which are omitted.

Fig. 4 is a view showing a configuration example of a marking device. The marking device C is configured to include a gantry 70, a table 71, a laser marker 72, a marker drive circuit 73, a marker moving device 74, and an exposure element 75. The table 71 supported by the gantry 70 is a cooling plate for mounting the substrate 1 and, for example, for temperature adjustment of the substrate 1 before exposure. Two laser markers 72 are provided below the table 71. Each of the laser markers 72 is driven by a marker drive circuit 73 to generate laser light. The table 71 is provided with a window 71a through which laser light can pass. The laser light generated from each of the laser markers 72 passes through the window 71a, penetrates the substrate 1, and illuminates the photoresist applied to the surface of the substrate 1. The irradiated laser light is focused on the surface of the photoresist, and the light resistance of the surface of the substrate 1 is sublimated by the heat of the laser light to be reduced, and the substrate mark is formed on the substrate 1.

In the present embodiment, two sets of the laser marker 72 and the marker drive circuit 73 are provided. Further, the distance d between the centers of the laser light irradiated from the laser marker 72 is set to be equal to the distance between the mask marks of the mask to be described later. Thereby, the two substrate marks are correctly formed on the substrate 1 at intervals of the distance d. Further, the laser marker 72 may be one, and the structure of the table 71 on which the substrate 1 is mounted may be moved.

The two substrate marks can be formed in the longitudinal direction of the rectangular substrate 1 or in the short side direction. When the arrangement of the substrate marks is changed from the longitudinal direction to the short side direction of the substrate 1 or from the short side direction to the long side direction, the direction of the substrate 1 mounted on the table 71 is changed to the longitudinal direction or the lateral direction. Further, the position of each of the laser markers 72 is adjusted by the marker moving device 74 by moving each of the laser markers 72 to the depth direction in the drawing or the front direction in the drawing. The marker moving device 74 is configured to include a drive mechanism including a ball screw, a motor, and a linear motor. Alternatively, instead of moving the laser marker 72, the structure of the table 71 on which the substrate 1 is mounted may be moved.

The marking device of Patent Document 1 forms an alignment mark on the color filter substrate in accordance with the position of the alignment mark provided around the opposite region of the TFT substrate, whereas the marking device of the present invention and the TFT substrate are opposed to each other. Regardless of the bit mark, it is sufficient that the substrate 1 is formed with two or more substrate marks at a predetermined interval. Therefore, in the present invention, the equipment cost and the marking step are greatly reduced as compared with the technique described in Patent Document 1.

Above the table 71, two exposure elements 75 are provided. In addition, it is also possible to move the configuration of a single exposure element 75. The exposure element 75 irradiates the periphery of the substrate mark formed on the photoresist applied to the substrate 1 with spot-shaped exposure light to expose the substrate mark. The present invention is recognized by the fact that the substrate 1 is formed with a substrate mark and the presence of the substrate mark is confirmed. As will be described later, when the exposure of the mask mark and the substrate mark is simultaneously performed by the exposure device B, the exposure of the substrate mark by the marking device C is not performed.

Further, in the example shown in FIG. 4, the laser marker 72 is provided below the table 71, but the laser marker 72 can be placed above the table 71 and coated from above the substrate 1. The photoresist on the substrate 1 illuminates the laser light. It is also possible to provide the marking device C with an exposure device that is first exposed in a plurality of exposure devices, and form a substrate mark on the substrate 1 before exposure.

Fig. 5 is a view showing an example of a mask used in the exposure device A. 6 is a view showing an example of a mask used in the exposure device B. The mask used in the exposure system of the present invention has two or more mask marks at the same intervals in both directions along with the exposed surface (the lower surface) of the mask. In the examples of the masks 2, 2' shown in Figs. 5 and 6, two mask marks 2a, 2a' are arranged in parallel in the X direction and the Y direction, respectively. In the present embodiment, the mask 2 and the mask 2a' have the same size, and the distances d in the longitudinal direction and the lateral direction of the two mask marks 2a and 2a' are respectively provided in two directions, and the marking device is provided by the marking device. The spacing of the substrate marks formed by C on the substrate 1 is the same. Further, the mask 2 and the mask 2' differ in the number, size, and position of the patterns 2b and 2b' indicated by broken lines.

The mask marks 2a and 2a' shown in Figs. 5 and 6 are merely examples, and the shape of the mask marks is not limited thereto, and may be a shape that is easily recognized by the image processing device 30. Further, the patterns 2b and 2b' shown in Figs. 5 and 6 are merely examples, and the number, size, and position of the patterns of the respective masks are not limited thereto. When the exposure system is configured to include three or more exposure devices, a mask formed with a different pattern is further used.

Further, in Fig. 5 and Fig. 6, in order to make the mask marks 2a and 2a' easy to see, the mask marks 2a and 2a' are displayed to have larger sizes than the masks 2 and 2'. The actual mask marks 2a, 2a' have a size of about several hundred μm compared to the dimension of the mask 2 which is approximately several m.

(First Embodiment) In the longitudinal direction or the short-side direction of the substrate 1, two or more substrate marks are formed at predetermined intervals by the marking device C. Fig. 7 is a view showing an example of a substrate on which two substrate marks are formed in the longitudinal direction in the first embodiment of the present invention. The example shown in Fig. 7 is among the four mask marks 2a of the mask 2 shown in Fig. 5, and two mask marks 1a are provided corresponding to the two mask marks 2a on the left side. The mask marks 2a, 2a' and the substrate mark 1a have a shape in which they do not overlap each other when the center positions thereof are identical. In Fig. 7, the exposed area 1b of the pattern 2b of the mask 2 and the exposed area 1b' of the pattern 2b' of the mask 2' are arranged on the substrate 1 as indicated by a broken line, for example.

The substrate mark 1a shown in FIG. 7 is exemplified, and the shape of the substrate mark is not limited thereto, and may be a shape that is easily recognizable by image recognition by the image processing device 30. Further, the exposure regions 1b and 1b' shown in Fig. 7 are exemplified, and the number, size, and position of each exposure region exposed to the substrate 1 are not limited thereto. Further, when the exposure system is configured to include three or more exposure devices, the exposure regions of the patterns of different sizes are disposed on the substrate 1.

Further, in FIG. 7, in order to make the substrate mark 1a easy to see, the substrate mark 1a is shown to be larger than the actual size of the substrate 1. The actual substrate mark 1 has a size of about several hundred μm compared to the longitudinal and lateral dimensions of the substrate 1 of about several m.

Fig. 8 is a view showing a direction of the substrate shown in Fig. 7 on the chuck in the first embodiment of the present invention. (a) of FIG. 8 shows the exposure device A, and (b) of FIG. 8 shows the exposure device B. In the exposure apparatus A shown in FIG. 8(a), the substrate 1 of FIG. 7 in which the two substrate marks 1a are formed in the longitudinal direction is mounted on each of the chucks 10 in the vertical direction. In (a) of FIG. 8, the substrate 1 mounted on the chuck 10 on the left side of the drawing is not exposed. The exposure device A exposes the pattern 2b of the mask 2 to the substrate 1. In (a) of FIG. 8, the substrate 1 mounted on the chuck 10 on the right side in the drawing ends the exposure of the pattern 2b of the mask 2. In the exposure apparatus A, the substrate 1 which has finished the exposure of the pattern 2b of the mask 2 is transported to the chuck 10 on the right side in the drawing of the exposure apparatus B shown in FIG. 8(b) by the substrate transfer robot.

In the exposure apparatus B shown in FIG. 8(b), the substrate 1 of FIG. 7 in which two substrate marks 1a are formed in the longitudinal direction is mounted on each of the chucks 10 in a lateral direction. Further, the exposure device B exposes the pattern 2b' of the mask 2' to the substrate 1. In Fig. 8(b), the substrate 1 on which the chuck 10 on the right side is mounted, the pattern 2b' of the mask 2' is not exposed. In Fig. 8(b), the substrate 1 mounted on the chuck 10 on the left side in the drawing ends the exposure of the pattern 2b' of the mask 2'.

In (a) of FIG. 8, the exposure apparatus A acquires the mask mark 2a of the mask 2 and the board|substrate mark 1a of the board|substrate 1 using the two camera elements 31 of the left side of the four camera elements 31. Further, the control device 60 of the exposure device A moves the X platform 5 and the Y platform 7 by the platform driving circuit 50 in accordance with the offset amount of the mask mark 2a and the substrate mark 1a detected by the image processing device 30. The positional alignment of the mask mark 2a and the substrate mark 1a is performed, and the relative positional positioning of the mask 2 and the substrate 1 is performed. When the exposure apparatus A finishes the positional alignment of the mask mark 2a and the substrate mark 1a, each camera element 31 is removed from the upper side of the mask 2 by a moving mechanism (not shown). As the moving mechanism, for example, a camera element moving mechanism described in Japanese Laid-Open Patent Publication No. 2012-234021 can be used.

Fig. 9 is a view showing the positions of the mask and the substrate in a state where the positional calibration of the mask mark and the substrate mark is completed in the exposure apparatus A. As shown in FIG. 9, in the state where the position alignment of the mask mark 2a and the board|substrate mark 1a has completed, the center of each mask mark 2a and the center of each board|substrate mark 1a correspond. However, in this state, the position of the pattern 2b of the mask 2 does not coincide with the position of the exposure area 1b of the substrate 1.

The control device 60 of the exposure apparatus A registers in advance the X direction of the substrate 1 necessary for the position of the pattern 2b to match the position of the exposure region 1b after the position alignment of the mask mark 2a and the substrate mark 1a is completed. The amount of movement in the Y direction. This amount of movement is determined in accordance with the position of the exposure region 1b exposed on the substrate 1 in the exposure step of, for example, a TFT substrate to be described later. Further, in the exposure processing corresponding to the black matrix forming step of the color filter substrate to be described later, the position of the exposure region 1b exposed to the TFT substrate bonded to the color filter substrate is determined.

The control device 60 of the exposure device A uses the registered movement amount, and based on the detection result of the laser measurement device 40, the X platform 5 and the Y stage 7 are moved by the platform drive circuit 50 to separate the single exposure region 1b of the substrate 1. The position is calibrated to the position of the pattern 2b of the mask 2. FIG. 10 is a view showing the positions of the mask 2 and the substrate 1 in a state where the position of the single exposure region 1b of the substrate 1 is aligned to the position of the pattern 2b of the mask 2. The exposure device A performs the first exposure of the pattern 2b of the mask 2 in this state.

Further, at this time, the exposure device A covers the upper surface of the mask mark 2a of the mask 2 by an exposure shutter (not shown), so that the mask mark 2a is not exposed to other exposure areas. The exposure after the exposure device A is also the same. As the shutter for exposure, for example, the article described in JP-A-2005-140936 can be used.

Next, the control device 60 of the exposure device A moves the X stage 5 by the stage drive circuit 50 based on the detection result of the laser measuring device 40, and aligns the position of the other exposure region 1b of the substrate 1 to the pattern of the mask 2. 2b location. FIG. 11 is a view showing the positions of the mask 2 and the substrate 1 in a state where the position of the other exposure region 1b of the substrate 1 is aligned to the position of the pattern 2b of the mask 2. The exposure device A performs the second exposure of the pattern 2b of the mask 2 in this state. In the present embodiment, in the second exposure, the exposure of the pattern 2b of the mask 2 is completed, and the substrate 1 is transported to the exposure device B.

In (b) of FIG. 8, the exposure device B obtains the mask mark 2a' of the mask 2' and the substrate mark 1a of the substrate 1 using the two camera elements 31 on the upper side in the four camera elements 31. image. Further, the control device 60 of the exposure device B corresponds to the offset amount of the mask mark 2a' and the substrate mark 1a detected by the image processing device 30, and the X platform 5 and the Y platform 7 are driven by the platform drive circuit 50. Moving, the positional alignment of the mask mark 2a' and the substrate mark 1a is performed, and the relative positional positioning of the mask 2' and the substrate 1 is performed. When the exposure device B finishes the positional alignment of the mask mark 2a' and the substrate mark 1a, each camera element 31 is removed from the upper side of the mask 2' by a moving mechanism (not shown).

Fig. 12 is a view showing the positions of the mask and the substrate in a state where the positional calibration of the mask mark and the substrate mark is completed in the exposure apparatus B. As shown in Fig. 12, in the state where the positional alignment of the mask mark 2a' and the substrate mark 1a is completed, the center of each mask mark 2a' coincides with the center of each substrate mark 1a. However, in this state, the position of the pattern 2b' of the mask 2' does not coincide with the position of the exposure area 1b' of the substrate 1.

When the exposure of the substrate mark 1a by the marking device C described above is not performed, in this state, the exposure device B exposes the mask mark 2a' and the substrate mark 1a which coincide with the center of each substrate mark 1a of the substrate 1. On the substrate 1. At this time, the exposure device B covers the pattern 2b' of the mask 2' and the other mask marks 2a' which are not exposed by the exposure shutter (not shown) so that these are not exposed to the substrate 1.

The control device 60 of the exposure device B is preliminarily registered in order to match the position of the pattern 2b' with the position of the exposure region 1b' after the position of the mask mark 2a' and the substrate mark 1a is completed. The amount of movement in the X direction and the Y direction. This amount of movement is determined in accordance with the position of the exposure region 1b' exposed on the substrate 1 in the exposure step of, for example, a TFT substrate to be described later. Further, in the exposure processing corresponding to the black matrix forming step of the color filter substrate to be described later, the position of the exposure region 1b' exposed to the TFT substrate bonded to the color filter substrate is determined.

Next, the control device 60 of the exposure apparatus A uses the registered movement amount to move the X stage 5 and the Y stage 7 by the stage drive circuit 50 based on the detection result of the laser measurement apparatus 40, and exposes the exposure area 1b of the substrate 1. 'The position is calibrated to the position of the pattern 2b' of the mask 2'. Fig. 13 is a view showing the positions of the mask 2' and the substrate 1 in a state where the positions of the two exposure regions 1b' of the substrate 1 are aligned at the position of the pattern 2b' of the mask 2'. The exposure device B performs the first exposure of the pattern 2b' of the mask 2' in this state.

Further, at this time, the exposure device B covers the mask mark 2a' of the mask 2' by an exposure shutter (not shown) so that the mask mark 2a' is not exposed to other exposure regions. The exposure after exposure device B is also the same.

Next, the control device 60 of the exposure device B moves the X platform 5 by the platform driving circuit 50 based on the detection result of the laser measuring device 40, and aligns the position of the other exposure region 1b' of the substrate 1 to the mask 2'. The position of the pattern 2b'. Fig. 14 is a view showing the positions of the mask 2' and the substrate 1 in a state where the positions of the other two exposure regions 1b' of the substrate 1 are aligned to the positions of the two patterns 2b' of the mask 2'. The exposure device B performs the second exposure of the pattern 2b' of the mask 2' in this state.

Next, the control device 60 of the exposure device B, based on the detection result of the laser measuring device 40, moves the Y stage 7 by the stage drive circuit 50, and aligns the position of the other exposed region 1b' of the substrate 1 to the cover. The position of the pattern 2b' of the cover 2'. Fig. 15 is a view showing the positions of the mask 2' and the substrate 1 in a state where the position of the other single exposure region 1b' of the substrate 1 is aligned to the position of the single pattern 2b' of the mask 2'. The exposure device B performs the third exposure of the pattern 2b' of the mask 2' in this state. Further, at this time, the exposure device B covers the two patterns 2b' of the mask 2' by an exposure shutter (not shown), and is not used for the exposed pattern 2b' (in the example of Fig. 15, the upper pattern) Above the 2b'), the exposure light is not passed through the pattern 2b' which is not used for exposure.

Next, the control device 60 of the exposure device B, based on the detection result of the laser measuring device 40, moves the X stage 5 by the stage driving circuit 50, and aligns the position of the other exposed region 1b' of the substrate 1 to the cover. The position of the pattern 2b' of the cover 2'. Fig. 16 is a view showing the positions of the mask 2' and the substrate 1 in a state where the position of the other single exposure region 1b' of the substrate 1 is aligned to the position of the single pattern 2b' of the mask 2'. The exposure device B performs the fourth exposure of the pattern 2b' of the mask 2' in this state. Further, at this time, the exposure device B covers the two patterns 2b' of the mask 2' by an exposure shutter (not shown), and is not used for the exposed pattern 2b' (in the example of Fig. 16, the upper pattern) Above the 2b'), the exposure light is not passed through the pattern 2b' which is not used for exposure. In the present embodiment, the exposure of the pattern 2b' of the mask 2' is ended in the fourth exposure. The entire substrate 1 is exposed by the above series of operations.

(Second Embodiment) Fig. 17 is a view showing an example of a substrate in which two substrate marks are formed in the short-side direction in the second embodiment of the present invention. In the example shown in Fig. 17, among the four mask marks 2a of the mask 2 shown in Fig. 5, two mask marks 1a are provided corresponding to the two mask marks 2a on the upper side. The mask marks 2a and 2a' and the substrate mark 1a have a shape in which they do not overlap each other when the center positions of the two are aligned. In Fig. 17, the exposed region 1b of the pattern 2b of the mask 2 and the exposed region 1b' of the pattern 2b' of the mask 2' are arranged on the substrate 1 as indicated by a broken line.

Fig. 18 is a view showing a direction of the substrate shown in Fig. 17 on the chuck in the second embodiment of the present invention. (a) of FIG. 18 shows the exposure device A, and (b) of FIG. 18 shows the exposure device B. In the exposure apparatus A shown in FIG. 18(a), the substrate 1 of FIG. 17 in which the two substrate marks 1a are formed in the short-side direction is mounted on each of the chucks 10 in the vertical direction. Further, the exposure device A acquires the image of the mask mark 2a of the mask 2 and the substrate mark 1a of the substrate 1 by using the two camera elements 31 on the upper side in the four camera elements 31, and performs the mask mark 2a. Calibration with the position of the substrate mark 1a. The operation of aligning the position of the exposure region 1b of the substrate 1 to the position of the pattern 2b of the mask 2 by the laser measuring device 40 is the same as the operation of the first embodiment.

On the other hand, in the exposure apparatus B shown in FIG. 18(b), the substrate 1 of FIG. 17 in which the two substrate marks 1a are formed in the short-side direction is mounted on each of the chucks 10 in the lateral direction. Further, the exposure device B obtains an image of the mask mark 2a' of the mask 2' and the substrate mark 1a of the substrate 1 by using the two camera elements 31 on the left side of the four camera elements 31, and performs masking. The position of the mark 2a' is aligned with the position of the substrate mark 1a. The operation of aligning the position of the exposure region 1b' of the substrate 1 to the position of the pattern 2b' of the mask 2' by the laser measuring device 40 is the same as that of the first embodiment.

In the first embodiment and the second embodiment described above, since the substrate mark 1a is formed at a predetermined interval by the marking device C, the photoresist applied to the substrate 1 is used, and therefore, the alignment mark is dedicated. Compared with the exposure device, the equipment cost and operating cost are greatly reduced. Further, in a plurality of exposure apparatuses A and B, the offset amounts of the mask marks 2a and 2a' of the masks 2 and 2' and the substrate 1a are detected, respectively, corresponding to the detected mask marks 2a and 2a' and the substrate. Marking the offset of the mark 1a, moving the platform, performing positional alignment of the mask marks 2a, 2a' and the substrate mark 1a, and positioning the relative positions of the masks 2, 2' and the substrate 1, so that even if the substrate 1 is exposed from one exposure When the apparatus A is moved to another exposure apparatus B, the relative positions of the masks 2, 2' and the substrate 1 can be maintained, and the positions of the patterns 2b and 2b' exposed by the respective exposure apparatuses A and B can be maintained with high precision. Further, the laser measuring device 40 detects the position of the platform in the plurality of exposure devices A and B, and the detection result of the laser measuring device 40 is determined after the position calibration of the mask marks 2a, 2a' and the substrate mark 1a is completed. After the mobile platform controls the patterns 2b and 2b' at the position where the substrate 1 is exposed, the patterns 2b and 2b' are exposed on the substrate 1, and the patterns 2b and 2b' having different sizes are exposed on the substrate 1. The patterns 2b, 2b' of the respective sizes are exposed with high precision at a desired position. Therefore, the patterns 2b, 2b' having different sizes are exposed on the single-piece substrate 1 with high positional accuracy without greatly increasing the equipment or steps.

[Effect of the embodiment] According to the embodiment described above, the following effects can be achieved. (1) It is possible to expose the patterns 2b, 2b' having different sizes on the single-piece substrate 1 with high positional accuracy without greatly increasing the number of devices or steps.

(2) Further, two or more mask marks 2a and 2a' are formed in the directions of the masks 2 and 2', and two or more substrate marks 1a are formed in the longitudinal direction or the short side direction of the rectangular substrate 1. Thereby, the substrate mark 1a formed on the substrate 1 by the marking device C may be made small. Further, in the plurality of exposure apparatuses A and B, the substrate 1 is mounted on the chuck 10 in the longitudinal direction or the lateral direction, whereby the rectangular exposure regions 1b and 1b' disposed on the substrate 1 are corresponding to the longitudinal and lateral directions thereof. exposure.

(3) Further, at least one of the plurality of exposure devices A and B performs a plurality of movements of the X platform 5 or the Y platform 7 based on the detection result of the laser measuring device 40, and performs the pattern 2b, 2b' in plural times. By exposure to the substrate 1 , a large number of surfaces of the same pattern 2b, 2b' having a relatively small size can be efficiently exposed by the substrate 1 having good efficiency.

(4) Further, the exposure device 75 is provided on the marking device C, and the exposure light is irradiated from the exposure member 75 to the periphery of the substrate mark 1a to expose the substrate mark 1a, whereby the substrate mark 1a is formed on the substrate 1, and the substrate mark 1a is confirmed. Existence, thereby recognizing that the present invention is implemented.

(5) Alternatively, after performing the positional alignment of the mask mark 2a' and the substrate mark 1a in the exposure apparatus B that is finally exposed, the mask mark 2a' and the substrate mark 1a are exposed on the substrate 1, whereby the substrate is exposed. 1 The mask mark 2a' and the substrate mark 1a are formed, and the presence of the mask mark 2a' and the substrate mark 1a is confirmed, whereby the present invention is recognized.

[Manufacturing Method of Panel Substrate for Display] When exposure of a substrate is performed by using the exposure system of the present invention, or exposure of a substrate is performed using the exposure system of the present invention, exposure light is irradiated from the exposure element of the marking device to the periphery of the substrate mark, and the substrate is irradiated. When the mark is exposed, the substrate mark is formed on the display panel substrate before being cut into the display panels. The position of the substrate mark formed is significantly different from the position of the alignment mark of each of the conventional exposure regions. Therefore, by confirming the presence of the substrate mark, it is possible to recognize that the substrate is exposed or exposed using the present invention. Made by the device.

Or, in the exposure device that is finally exposed to the plurality of exposure devices, after the position of the mask mark and the substrate mark is calibrated, the mask mark and the substrate mark are exposed on the substrate, and then the front surface of each display panel is cut. The display panel substrate forms a mask mark substrate mark. Therefore, by confirming the presence of these mask marks and substrate marks, it is possible to recognize that the substrate is manufactured using the exposure system or the exposure apparatus of the present invention.

By exposure of the substrate by the exposure system of the present invention or exposure of the substrate by the exposure method of the present invention, it is possible to expose a pattern having a different size to a single substrate with high positional accuracy, and thus it is possible to manufacture with high precision. A display panel with a good surface utilization efficiency.

For example, FIG. 19 is a flowchart showing an example of a manufacturing procedure of a TFT substrate of a liquid crystal display device. In the film forming step (step 101), a film such as a conductor film or an insulator film that serves as a transparent electrode for driving a liquid crystal is formed on the substrate by a sputtering method or a plasma chemical vapor deposition (CVD) method. In the resistance coating step (step 102), a photosensitive resin material (photoresist) is applied by a slit coating method or the like to form a photoresist film on the film formed in the film forming step (step 101). In the exposure step (step 103), the pattern of the mask is transferred to the photoresist film using a proximity exposure device or a projection exposure device. In the developing step (step 104), the developer is supplied onto the photoresist film by a spray development method or the like to remove unnecessary portions of the photoresist film. In the etching step (step 105), the portion of the film formed in the film forming step (step 101) which is not shielded by the photoresist film is removed by wet etching. In the stripping step (step 106), the photoresist film that has completed the action of the mask in the etching step (step 105) is peeled off by the stripper. The washing/drying step of the substrate should be carried out before or after these steps. These steps were repeated several times to form a TFT array on the substrate.

FIG. 20 is a flowchart showing an example of a manufacturing procedure of a color filter substrate of a liquid crystal display device. In the black matrix forming step (step 201), a black matrix is formed on the substrate by a process such as photoresist coating, exposure, development, etching, and lift-off. In the coloring pattern forming step (step 202), a coloring pattern is formed on the substrate by a dyeing method, a pigment dispersion method, a printing method, a plating method, or the like. This step is repeated in accordance with the coloring patterns of R, G, and B. In the protective film forming step (step 203), a protective film is formed over the colored pattern, and in the transparent electrode film forming step (step 204), a transparent electrode film is formed over the protective film. Before and after these steps, the substrate cleaning/drying step is required during and after the process.

In the manufacturing step of the TFT substrate shown in FIG. 19, the exposure system or the exposure method of the present invention can be applied in the exposure step (step 103), in the manufacturing step of the color filter substrate shown in FIG. 20, on the black matrix. The forming step (step 201) can utilize the exposure system or exposure method of the present invention. Further, the exposure system or the exposure method of the present invention can be applied to an exposure step of another substrate such as a printed circuit board having the same steps as those of the TFT substrate of the liquid crystal display device.

A, B‧‧‧ exposure device

C‧‧‧ marking device

1‧‧‧Substrate

1a‧‧‧Substrate marking

1b, 1b’‧‧‧ exposed areas

2, 2'‧‧‧ mask

2a, 2a’‧‧‧ mask marks

2b, 2b’‧‧‧ pattern

3‧‧‧Base

4‧‧‧X guide

5‧‧‧X platform

6‧‧‧Y guide

7‧‧‧Y platform

8‧‧ θ platform

9‧‧‧Chuck support table

10‧‧‧ chuck

20‧‧‧Mask rack

30‧‧‧Image processing device

31‧‧‧ camera components

40‧‧‧Laser measuring device

50‧‧‧ platform drive circuit

60‧‧‧Master control unit

70‧‧‧ 台台

71‧‧‧Table

71a‧‧‧ window

72‧‧‧Laser marker

73‧‧‧Marker drive circuit

74‧‧‧Marker mobile device

75‧‧‧Exposure components

Fig. 1 is a view showing a schematic configuration of an exposure system according to an embodiment of the present invention. Fig. 2(a) is a plan view showing the exposure device A, and Fig. 2(b) is a side view showing the exposure device A. Fig. 3(a) is a plan view showing the exposure device B, and Fig. 3(b) is a side view showing the exposure device B. Fig. 4 is a view showing a configuration example of a marking device. Fig. 5 is a view showing an example of a mask used in the exposure device A. Fig. 6 is a view showing an example of a mask used in the exposure device B. Fig. 7 is a view showing an example of a substrate in which two substrate marks are formed in the longitudinal direction in the first embodiment of the present invention. Fig. 8 is a view showing a direction of the substrate shown in Fig. 7 on the chuck in the first embodiment of the present invention. Fig. 9 is a view showing the positions of the mask and the substrate in a state where the positional calibration of the mask mark and the substrate mark is completed in the exposure apparatus A. Fig. 10 is a view showing the positions of the mask and the substrate in a state where the position of the single exposure region of the substrate is aligned to the position of the pattern of the mask. Fig. 11 is a view showing the positions of the mask and the substrate in a state where the position of the other exposed region of the substrate is aligned to the position of the pattern of the mask. Fig. 12 is a view showing the positions of the mask and the substrate in a state where the positional calibration of the mask mark and the substrate mark is completed in the exposure device B. Fig. 13 is a view showing the positions of the mask and the substrate in a state where the positions of the two exposure regions of the substrate are aligned to the positions of the two patterns of the mask. Fig. 14 is a view showing the positions of the mask and the substrate in a state where the positions of the other two exposure regions of the substrate are aligned to the positions of the two patterns of the mask. Fig. 15 is a view showing the positions of the mask and the substrate in a state where the position of the other single exposure region of the substrate is aligned to the position of one pattern of the mask. Fig. 16 is a view showing the positions of the mask and the substrate in a state where the position of the other one exposed area of the substrate is aligned to the position of one pattern of the mask. Fig. 17 is a view showing an example of a substrate in which two substrate marks are formed in the short-side direction in the second embodiment of the present invention. Fig. 18 is a view showing a direction of the substrate shown in Fig. 17 on the chuck in the second embodiment of the present invention. 19 is a flow chart showing an example of a manufacturing procedure of a TFT substrate of a liquid crystal display device. Fig. 20 is a flow chart showing an example of a manufacturing procedure of a color filter substrate of a liquid crystal display device.

Claims (12)

An exposure system comprising a marking device for coating a plurality of substrate marks at a predetermined interval on a photoresist coated on a substrate; and a plurality of exposure devices for exposing a pattern to the substrate, wherein Each of the exposure devices includes a mask frame for supporting a mask, the mask is smaller in size than the substrate, and the pattern and the plurality of mask marks are formed, and the mask marks are associated with the The substrate is formed by the same spacing; a chuck for mounting the substrate, the substrate is formed with a plurality of the substrate marks; a platform for moving the mask frame and the chuck relatively; a driving circuit The image acquisition device is configured to obtain an image of the mask mark and the substrate mark, and output an image signal of the obtained image; an image processing device is used The image signal outputted from the image acquisition device is processed to detect an offset of the mask mark from the substrate mark; a laser measuring device is configured to detect the position of the platform; a control device for controlling the driving circuit to move the platform to perform the mask mark and the substrate mark corresponding to the offset of the mask mark and the substrate mark detected by the image processing device Position calibration, and performing relative positioning of the mask and the substrate, and then moving the platform to control the pattern to the exposed position of the substrate based on the detection result of the laser measuring device, wherein the exposure system The pattern of mutually different sizes is exposed to the substrate. The exposure system according to claim 1, wherein the mask forms two or more mask marks in two directions, the substrate is rectangular, and two or more are formed in a longitudinal direction or a short side direction thereof. The substrate mark, the plurality of exposure devices are mounted on the chuck in a longitudinal or lateral direction, and the image acquisition device acquires an image of the mask mark and the substrate mark The mask mark is aligned with the position of the substrate mark. The exposure system of claim 1 or 2, wherein at least one of the plurality of exposure devices performs movement of the platform a plurality of times based on a detection result of the laser measurement device, and exposing the plurality of patterns to the plurality of patterns The substrate. The exposure system according to any one of claims 1 to 3, wherein the marking device has an exposure element from which the exposure light is irradiated to the periphery of the substrate mark to expose the substrate mark. The exposure system according to any one of claims 1 to 3, wherein the exposure device that is the last exposure of the plurality of exposure devices, after performing the positional calibration of the mask mark and the substrate mark, the mask The mark and the substrate mark are exposed to the substrate. An exposure method comprising the steps of: forming a plurality of substrate marks at a predetermined interval on a photoresist coated on a substrate by a marking device; respectively, supporting a mask in the plurality of exposure devices In a mask frame, the size of the mask is smaller than the substrate, and the pattern and a plurality of mask marks are formed, the mask marks are formed at the same interval as the substrate mark; a plurality of the plurality of the mask marks are formed The substrate labeled with the substrate is mounted on a chuck; the mask frame and the chuck are relatively moved by a platform; and an image capturing device is used to obtain an image of the mask mark and the substrate mark. And outputting an image signal of the obtained image; processing the image signal outputted from the image obtaining device by an image processing device, and detecting the bias of the mask mark and the substrate mark Transmitting; using a laser measuring device to detect the position of the platform; and corresponding to the offset of the mask mark and the substrate mark detected by the image processing device, moving the platform, and performing the covering Marking the position of the substrate mark and performing the relative positional positioning of the mask and the substrate, and then moving the platform based on the detection result of the laser measuring device to control the pattern to the position where the substrate is exposed. The substrate is exposed to the pattern, and the pattern of mutually different sizes is exposed to the substrate. The exposure method according to claim 6, wherein the mask forms two or more of the mask marks in two directions, and two or more of the substrates are formed in a longitudinal direction or a short side direction of the rectangular substrate. In the plurality of exposure apparatuses, the substrate is mounted on the chuck in a longitudinal or lateral direction, and the image capturing device acquires an image of the mask mark and the substrate mark to perform the mask The hood mark is aligned with the position of the substrate mark. The exposure method according to claim 6 or 7, wherein at least one of the plurality of exposure devices performs movement of the platform a plurality of times based on a detection result of the laser measurement device, and the pattern is exposed plural times On the substrate. The exposure method according to any one of claims 6 to 8, wherein the marking device has an exposure element from which the exposure light is irradiated to the periphery of the substrate mark to expose the substrate mark. The exposure method according to any one of claims 6 to 8, wherein the exposure device that is finally exposed in the plurality of exposure devices performs the mask after performing the positional calibration of the mask mark and the substrate mark The mark and the substrate mark are exposed to the substrate. A method of manufacturing a panel substrate for display, wherein the exposure of the substrate is performed by the exposure system according to any one of claims 1 to 5. A method of manufacturing a panel substrate for display, wherein the exposure of the substrate is performed by the exposure method according to any one of claims 6 to 10.