TW201916274A - 具有可撓性基板的晶片封裝構造 - Google Patents

具有可撓性基板的晶片封裝構造 Download PDF

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TW201916274A
TW201916274A TW106133279A TW106133279A TW201916274A TW 201916274 A TW201916274 A TW 201916274A TW 106133279 A TW106133279 A TW 106133279A TW 106133279 A TW106133279 A TW 106133279A TW 201916274 A TW201916274 A TW 201916274A
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flexible substrate
pressure
chip
wafer
chip package
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TW106133279A
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TWI681516B (zh
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蘇俊揚
王昭昕
楊念慈
羅信偉
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頎邦科技股份有限公司
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Priority to TW106133279A priority Critical patent/TWI681516B/zh
Priority to CN201710964288.8A priority patent/CN109585382A/zh
Priority to KR1020170137124A priority patent/KR101992732B1/ko
Priority to JP2017232519A priority patent/JP2019068024A/ja
Priority to US15/841,424 priority patent/US10168582B1/en
Publication of TW201916274A publication Critical patent/TW201916274A/zh
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Abstract

一種具有可撓性基板的晶片封裝構造，其在一可撓性基板的一第一表面設置有一晶片及一防壓件，且在該可撓性基板的一第二表面設置有一補強片，該防壓件至少具有一對防壓凸肋，各該防壓凸肋分別位於該晶片外的二相對應外側，藉由位於該晶片外側的該防壓件避免該封裝構造以外的元件(如曲面面板)壓迫該晶片，而造成該晶片損壞。

Description

具有可撓性基板的晶片封裝構造
本發明是關於一種具有可撓性基板的晶片封裝構造，其用以防止設置於一可撓性基板的一晶片被該封裝構造以外的元件(如曲面面板)壓迫而造成損。
現行電子產品驅向於輕、薄及可彎曲，如具有曲面螢幕的電視或手機等電子產品，然由於電子產品的螢幕為曲面面板，因此會造成曲面面板壓迫電子元件，而造成電子元件損壞。
請參閱第5圖，一種電子產品的液晶顯示螢幕10具有一曲面面板11及一設置於一電路基板12上的一晶片13，由於該曲面面板11彎曲而壓迫該晶片13，使得該晶片損壞，無法與該電路基板12電性連接，相對地，也提高了該電子產品10的不良率或損壞率。
本發明具有可撓性基板的晶片封裝構造的發明目的是在一可撓性基板的不同表面分別設有一防壓件及一補強片，藉由該防壓件防止設置於該可撓性基板的一晶片受壓迫而損壞。
本發明的一種具有可撓性基板的晶片封裝構造包含一可撓性基板、一晶片、一補強片以及一防壓件，該可撓性基板具有一第一表面及一第二表面，該晶片設置於該可撓性基板的該第一表面，該晶片具有一主動面及一背面，該主動面朝向該第一表面並電性連接該可撓性基板，該晶片的該背面至該可撓性基板的該第一表面之間具有一第一高度，該補強片結合於可撓性基板的該第二表面，該補強片在該可撓性基板的該第一表面形成有一投影區，該晶片位於該投影區中，該防壓件設置於該可撓性基板的該第一表面，且該防壓件至少具有一對防壓凸肋，各該防壓凸肋分別位於該晶片外的二相對應外側，各該防壓凸肋具有一顯露面及一相對於該顯露面的接合面，該防壓凸肋以該接合面朝向該可撓性基板的該第一表面，該顯露面至該可撓性基板的該第一表面之間具有一第二高度，該第二高度不小於該第一高度。
當該具有可撓性基板的晶片封裝構造被裝設於一具有一曲面面板的電子產品(如液晶顯示螢幕(Liquid Crystal Display,LCD)中時，由於設置於該第一表面的該防壓件高於設置於該第一表面的該晶片，因此可藉由該防壓件接觸該曲面面板，以避免該晶片被該曲面面板壓迫而損壞。
此外，當該防壓凸肋位於該投影區時，可增加該具有可撓性基板的晶片封裝構造的抗壓及抗彎曲強度，且可防止該防壓件受該曲面面板壓迫變形而彎曲，以避免該晶片被該曲面面板壓迫而損壞。
請參閱第1及2圖，本發明的一種具有可撓性基板的晶片封裝構造100包含一可撓性基板110(例如運用於捲帶承載封裝(Tape Carrier Package,TCP)的基板或運用於薄膜覆晶封裝(Chip on Film,COF)用基板)、一晶片120及分別設置於該可撓性基板110不同表面的一補強片130及一防壓件140。
請參閱第1及2圖，該可撓性基板110具有一第一表面111及一第二表面112，該晶片120設置於該可撓性基板110的該第一表面111，該晶片120具有一主動面121及一背面122，該主動面121朝向該第一表面111並電性連接該可撓性基板111，請參閱第3及4圖，在本實施例中，該晶片120以複數個凸塊120a電性連接該可撓性基板110的複數個導接墊110a，較佳地，在該晶片120與該可撓性基板110填充一填充膠170，以密封該些凸塊120a及該些導接墊110a，請參閱第3及4圖，該晶片120的該背面122至該可撓性基板110的該第一表面111之間具有一第一高度H1。
請參閱第1及2圖，該補強片130結合於可撓性基板110的該第二表面112，請參閱第3及4圖，在本實施例中，該補強片130以一黏膠150結合於可撓性基板110的該第二表面112，該補強片130在該可撓性基板110的該第一表面111形成有一投影區130A，該晶片120位於該投影區130A中，較佳地，該補強片130的鋼性大於該可撓性基板110，其可避免在該投影區130A內的該可撓性基板110彎曲變形，較佳地，該補強片130可選自金屬板以對該晶片封裝構造100進行散熱。
請參閱第1及2圖，該防壓件140設置於該可撓性基板110的該第一表面111，且該防壓件140至少具有一對防壓凸肋141，各該防壓凸肋141分別位於該晶片120外的二相對應外側，請參閱第3及4圖，在本實施例中，該防壓件140以一黏膠160結合於該可撓性基板110的該第一表面111，該防壓件的材質選自於聚醯亞胺薄膜(PI)、聚對苯二甲酸乙二酯(PET)、不鏽鋼(SUS)。
請參閱第1及2圖，在本實施例中，該些防壓凸肋141相互連接，使該防壓件140形成為一環狀，且該防壓件140環繞該晶片120，較佳地，各該防壓凸肋141對稱地設置於該晶片120外。
請參閱第1、2、3及4圖，各該防壓凸肋141具有一顯露面141a及一相對於該顯露面141a的接合面141b，各該防壓凸肋141以該接合面141b朝向該可撓性基板110的該第一表面111，在本實施例中，該接合面141b以該黏膠160結合於該可撓性基板110的該第一表面111，該顯露面141a至該可撓性基板110的該第一表面111之間具有一第二高度H2，該第二高度H2不小於該第一高度H1，較佳地，該第二高度H2高於該第一高度H1，且該防壓件140位於該投影區130A。
請參閱第1、3及4圖，當該晶片封裝構造100被裝設於一具有一曲面面板200的電子產品(如液晶顯示螢幕(Liquid Crystal Display,LCD)中，若發生該曲面面板200彎曲度過大而壓迫該晶片封裝構造100時，由於該防壓凸肋141的該顯露面141a至該可撓性基板110的該第一表面111之該第二高度H2不小於該晶片120的該背面122至該可撓性基板110的該第一表面111的該第一高度H1，因此該曲面面板200會先壓迫該防壓凸肋141，而不會壓迫位於該對防壓凸肋141之間的該晶片120，其可避免該晶片120受該曲面面板200壓迫而損壞。
請參閱第1、3及4圖，由於該防壓件140位於該投影區130A，因此可增加該具有可撓性基板的晶片封裝構造100的抗壓及抗彎曲強度，且可防止該防壓件140受該曲面面板200壓迫變形而彎曲，進而壓迫該晶片120。
本發明之保護範圍當視後附之申請專利範圍所界定者為準，任何熟知此項技藝者，在不脫離本發明之精神和範圍內所作之任何變化與修改，均屬於本發明之保護範圍。
10‧‧‧液晶顯示螢幕
11‧‧‧曲面面板
12‧‧‧電路基板
13‧‧‧晶片
100‧‧‧晶片封裝構造
110‧‧‧可撓性基板
110a‧‧‧導接墊
111‧‧‧第一表面
112‧‧‧第二表面
120‧‧‧晶片
120a‧‧‧凸塊
121‧‧‧主動面
122‧‧‧背面
130‧‧‧補強片
130A‧‧‧投影區
140‧‧‧防壓件
141‧‧‧防壓凸肋
141a‧‧‧顯露面
141b‧‧‧接合面
150‧‧‧黏膠
160‧‧‧黏膠
170‧‧‧填充膠
H1‧‧‧第一高度
H2‧‧‧第二高度
200‧‧‧曲面面板
第1圖：本發明具有可撓性基板的晶片封裝構造的立體圖。 第2圖：本發明具有可撓性基板的晶片封裝構造的立體分解圖。 第3圖：本發明具有可撓性基板的晶片封裝構造與曲面面板的剖視圖。 第4圖：本發明具有可撓性基板的晶片封裝構造與曲面面板的剖視圖。 第5圖：習知技術的晶片封裝構造與曲面面板的剖視圖。

Claims (8)

  1. 一種具有可撓性基板的晶片封裝構造，包含： 一可撓性基板，具有一第一表面及一第二表面； 一晶片，設置於該可撓性基板的該第一表面，該晶片具有一主動面及一背面，該主動面朝向該第一表面並電性連接該可撓性基板，該晶片的該背面至該可撓性基板的該第一表面之間具有一第一高度； 一補強片，結合於可撓性基板的該第二表面，該補強片在該可撓性基板的該第一表面形成有一投影區，該晶片位於該投影區中；以及 一防壓件，設置於該可撓性基板的該第一表面，且該防壓件至少具有一對防壓凸肋，各該防壓凸肋分別位於該晶片外的二相對應外側，各該防壓凸肋具有一顯露面及一相對於該顯露面的接合面，該防壓凸肋以該接合面朝向該可撓性基板的該第一表面，該顯露面至該可撓性基板的該第一表面之間具有一第二高度，該第二高度不小於該第一高度。
  2. 如申請專利範圍第1項所述之具有可撓性基板的晶片封裝構造，其中該防壓件為一環狀，該防壓件環繞該晶片。
  3. 如申請專利範圍第1或2項所述之具有可撓性基板的晶片封裝構造，其中該防壓件位於該投影區。
  4. 如申請專利範圍第1項所述之具有可撓性基板的晶片封裝構造，其中各該防壓凸肋對稱地設置於該晶片外。
  5. 如申請專利範圍第1項所述之具有可撓性基板的晶片封裝構造，其中該補強片的鋼性大於該可撓性基板。
  6. 如申請專利範圍第1項所述之具有可撓性基板的晶片封裝構造，其中該防壓件的材質選自於聚醯亞胺薄膜(PI)、聚對苯二甲酸乙二酯(PET)、不鏽鋼(SUS)。
  7. 如申請專利範圍第1項所述之具有可撓性基板的晶片封裝構造，其中該補強片以一黏膠結合於該可撓性基板的該第二表面。
  8. 如申請專利範圍第1項所述之具有可撓性基板的晶片封裝構造，其中各該防壓凸肋具有一顯露面及一相對於該顯露面的接合面，各該防壓凸肋以該接合面朝向該可撓性基板的該第一表面，該接合面以一黏膠結合於該可撓性基板的該第一表面。
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