TW201901767A - Separating device and separation method - Google Patents
Separating device and separation method Download PDFInfo
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- TW201901767A TW201901767A TW107103782A TW107103782A TW201901767A TW 201901767 A TW201901767 A TW 201901767A TW 107103782 A TW107103782 A TW 107103782A TW 107103782 A TW107103782 A TW 107103782A TW 201901767 A TW201901767 A TW 201901767A
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- 238000000926 separation method Methods 0.000 title claims description 40
- 239000000853 adhesive Substances 0.000 claims abstract description 73
- 230000001070 adhesive effect Effects 0.000 claims abstract description 73
- 238000000034 method Methods 0.000 claims abstract description 11
- 230000000717 retained effect Effects 0.000 claims 2
- 239000013256 coordination polymer Substances 0.000 abstract description 38
- 235000012431 wafers Nutrition 0.000 description 10
- 239000010410 layer Substances 0.000 description 9
- 239000004065 semiconductor Substances 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000011347 resin Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000001464 adherent effect Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000013305 food Nutrition 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 230000005291 magnetic effect Effects 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L2021/60007—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process
- H01L2021/60022—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving a soldering or an alloying process using bump connectors, e.g. for flip chip mounting
- H01L2021/60097—Applying energy, e.g. for the soldering or alloying process
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Dicing (AREA)
- Adhesive Tapes (AREA)
Abstract
Description
本發明係關於分離裝置及分離方法。The present invention relates to a separation device and a separation method.
以往已知一種將被黏貼在接著薄片的複數被黏附體的相互間隔加寬的分離裝置(參照例如專利文獻1)。 [先前技術文獻] [專利文獻]Conventionally, there has been known a separation device that widens the interval between a plurality of adherends adhered to a sheet (see, for example, Patent Document 1). [Prior Art Literature] [Patent Literature]
[專利文獻1] 日本特開2016-127124號公報[Patent Document 1] Japanese Patent Laid-Open No. 2016-127124
(發明所欲解決之課題)(Problems to be solved by the invention)
但是，在如專利文獻1所記載之習知之分離裝置中，由於為以下支持構件22(保持構件)與上支持構件24(保持構件)保持接著薄片AS(接著薄片)，且對該接著薄片賦予張力而將晶片CP(被黏附體)的相互間隔加寬的構成，因此以保持構件所保持的接著薄片的接著面接著在該保持構件，導致難以由保持構件卸下接著薄片的不良情形、或必須要有用以將附著在保持構件的接著劑去除的作業的不良情形。However, in the conventional separation device described in Patent Document 1, the adhesive sheet AS (adhesive sheet) is held for the following support members 22 (holding members) and upper support member 24 (holding members), and the adhesive sheet is given to the adhesive sheet. A structure in which the distance between the wafers CP (adhered bodies) is widened by the tension, so that the bonding surface of the bonding sheet held by the holding member is adhered to the holding member, resulting in a problem that it is difficult to remove the bonding sheet from the holding member or It is necessary to have a disadvantage in the work of removing the adhesive adhered to the holding member.
本發明之目的在提供可防止以保持構件所保持的接著薄片的被保持區域接著在該保持構件的情形的分離裝置及分離方法。 (解決課題之手段)An object of the present invention is to provide a separation device and a separation method that can prevent a holding region of a bonding sheet held by a holding member from adhering to the holding member. (Means for solving problems)
本發明係採用請求項所記載的構成。 (發明之效果)The present invention adopts the configuration described in the claims. (Effect of the invention)
藉由本發明，由於保持構件可透過預定能量，因此對於因被賦予預定能量，其接著力會降低的接著薄片，可防止以保持構件所保持的接著薄片的被保持區域接著於該保持構件。 此外，若能量賦予手段具備有第1能量賦予手段及第2能量賦予手段，可以第2能量賦予手段使接著薄片的被保持區域的接著力重點式降低，可更加確實防止被保持區域接著於保持構件。According to the present invention, since the holding member can transmit a predetermined energy, it is possible to prevent the held area of the bonding sheet held by the holding member from adhering to the holding member with respect to the bonding sheet whose bonding force is reduced due to the given predetermined energy. In addition, if the energy imparting means includes the first energy imparting means and the second energy imparting means, the second energy imparting means can reduce the adhesion force of the area to be held to the sheet in a focused manner, which can more surely prevent the area to be adhered to the area from being held. member.
以下根據圖示，說明本發明之實施形態。 其中，本實施形態中的X軸、Y軸、Z軸係處於分別呈正交的關係，X軸及Y軸係形成為預定平面內的軸，Z軸係形成為與前述預定平面呈正交的軸。此外，在本實施形態中，將由與Y軸呈平行的箭號BD方向觀看時為基準，若不列舉成為基準的圖而表示方向時，「上」為Z軸的箭號方向，「下」為其相反方向，「左」為X軸的箭號方向，「右」為其相反方向，「前」為Y軸的箭號方向，「後」為其相反方向。Hereinafter, embodiments of the present invention will be described based on the drawings. Among them, the X-axis, Y-axis, and Z-axis systems in the present embodiment are orthogonal to each other. The X-axis and Y-axis systems are formed as axes in a predetermined plane, and the Z-axis system is formed to be orthogonal to the predetermined plane. Of axes. In addition, in this embodiment, when viewing from the direction of the arrow BD parallel to the Y axis as a reference, if the direction is not listed as a reference figure, "up" is the direction of the Z axis arrow and "down" It is the opposite direction, "Left" is the direction of the arrow on the X axis, "Right" is the direction of the arrow, "Front" is the direction of the arrow on the Y axis, and "Back" is the direction opposite.
本發明之分離裝置10係具備有：以保持構件22保持在其中一面AS1黏貼有複數被黏附體CP的接著薄片AS的端部的複數保持手段20；使保持有接著薄片AS的端部的保持手段20相對移動，對接著薄片AS賦予張力而將被黏附體CP的相互間隔加寬的分離手段30；可感測被黏附體CP的相互間隔或各被黏附體CP的全體集合形狀等的攝影機或投影機等攝像手段、光學感測器或音波感測器等各種感測器等感測手段40；及對接著薄片AS賦予形成為預定能量的紫外線UV的能量賦予手段50。 其中，接著薄片AS係採用積層有因在基材薄片的其中一面被賦予紫外線UV，其接著力會降低的接著劑層者。The separation device 10 of the present invention includes a plurality of holding means 20 for holding the end of the sheet AS adhering to the adherend CP with the holding member 22 held on one side AS1 and holding the end of the sheet AS. Means 20 that relatively moves and applies tension to the sheet AS to increase the distance between the adherends CP; a separation means 30 that can sense the distance between the adherends CP or the overall shape of each adherent CP An imaging device such as a projector, a sensor 40 such as various sensors such as an optical sensor or an acoustic sensor; and an energy applying device 50 that applies ultraviolet rays formed into predetermined energy to the subsequent sheet AS. Among them, the adhesive sheet AS is an adhesive layer in which laminated substrates are provided with ultraviolet rays on one side of the substrate sheet, and the adhesive force thereof is reduced.
保持手段20係具備有：作為驅動機器的旋動馬達21、及保持接著薄片AS的端部的保持構件22。 保持構件22係形成為以抵接於接著薄片AS的其中一面AS1側的一方側保持構件22A、及被支持在分離手段30且抵接於接著薄片AS的另一面AS2側的另一方側保持構件22B，夾入接著薄片AS的端部來進行保持的構成，一方側保持構件22A係設成可透過紫外線UV。 其中，一方側保持構件22A係被支持在另一方側保持構件22B上所支持的旋動馬達21的輸出軸21A。The holding means 20 includes a rotation motor 21 as a driving device, and a holding member 22 that holds an end portion of the sheet AS. The holding member 22 is formed to hold one side holding member 22A abutting on one side AS1 side of the bonding sheet AS, and the other side holding member supported by the separation means 30 and abutting the other surface AS2 side of the bonding sheet AS. 22B is a structure in which the end portion of the sheet AS is sandwiched and held, and the one side holding member 22A is provided to be transparent to ultraviolet rays. Among them, the one-side holding member 22A is an output shaft 21A of the rotary motor 21 supported by the other-side holding member 22B.
分離手段30係具備有：作為驅動機器的線性馬達31、及被支持在其滑件31A，在上面側支持另一方側保持構件22B的保持臂32。The separating means 30 includes a linear motor 31 as a driving device, and a holding arm 32 supported by the slider 31A and supporting the other holding member 22B on the upper surface side.
能量賦予手段50係具備有：對接著薄片AS中黏貼有複數被黏附體WK的被黏附體接著區域CE賦予紫外線UV的第1能量賦予手段51；及對以保持構件22所保持的接著薄片AS的被保持區域HE賦予紫外線UV的第2能量賦予手段52。 第1能量賦予手段51係具備有：位於被保持在保持手段20的接著薄片AS的下方的被黏附體接著區域用紫外線發光源51A。 第2能量賦予手段52係具備有：被支持在保持臂32上的支架52A；及被支持在支架52A，且位於被保持在保持手段20的接著薄片AS的端部上方的被保持區域用紫外線發光源52B。The energy applying means 50 is provided with the first energy applying means 51 for applying ultraviolet UV to the adherend adhered region CE to which the adherends WK are adhered in the adhered sheet AS, and the adhesive sheet AS held by the holding member 22. The second energy imparting means 52 that imparts ultraviolet UV to the held region HE. The first energy applying means 51 is provided with an ultraviolet light emitting source 51A for an adherend adhered area located below the adhesive sheet AS held by the holding means 20. The second energy applying means 52 includes a holder 52A supported by the holding arm 32 and ultraviolet rays for a held area supported by the holder 52A and located above an end of the sheet AS held by the holding means 20. Luminescent source 52B.
說明以上之分離裝置10的動作。 首先，對各構件在圖1(A)、(B)中以實線所示之初期位置待機的分離裝置10，該分離裝置10的使用者(以下僅稱之為「使用者」)透過操作面板或個人電腦等未圖示之操作手段，輸入自動運轉開始的訊號。之後，若作業者、或驅動機器或輸送機等未圖示之搬送手段將黏貼有複數被黏附體CP的接著薄片AS載置於另一方側保持構件22B上時，保持手段20驅動各旋動馬達21，且如圖1(B)中二點鏈線所示，以一方側保持構件22A與另一方側保持構件22B保持接著薄片AS的端部。The operation of the separation device 10 described above will be described. First, the separation device 10 in which each component stands by at the initial position shown by the solid line in FIGS. 1 (A) and (B) is operated by a user of the separation device 10 (hereinafter simply referred to as "user"). The operation means (not shown), such as a panel or a personal computer, inputs a signal to start automatic operation. After that, if an operator or a conveying means (not shown) such as a driving machine or a conveyor places the adhesive sheet AS to which the plurality of adherends CP are attached on the other side holding member 22B, the holding means 20 drives each rotation. As shown by a two-dot chain line in FIG. 1 (B), the motor 21 holds the end portion of the sheet AS with one side holding member 22A and the other side holding member 22B.
接著，分離手段30驅動各線性馬達31，如圖2(A)所示，使保持手段20相互分離，將被黏附體CP的相互間隔加寬。此時，各被黏附體CP係因接著薄片AS的變形等，而有相互間隔未加寬成預定間隔的情形。因此，根據感測手段40的感測結果，分離手段30驅動各線性馬達31，以各被黏附體CP的相互間隔成為預定間隔的方式，使各保持手段20個別移動。Next, the separation means 30 drives the linear motors 31 to separate the holding means 20 from each other, as shown in FIG. 2 (A), to widen the interval between the adherends CP. At this time, each of the adherends CP may not be widened to a predetermined interval due to deformation or the like of the sheet AS. Therefore, based on the sensing result of the sensing means 40, the separating means 30 drives the linear motors 31 to move the holding means 20 individually so that the mutual distance between the adherends CP becomes a predetermined interval.
之後，能量賦予手段50驅動被黏附體接著區域用紫外線發光源51A，如圖2(A)所示，對被黏附體接著區域CE賦予紫外線UV而使接著薄片AS對被黏附體CP的接著力降低。接著，若藉由拾取裝置或搬送裝置等未圖示之被黏附體取出手段，全部被黏附體CP或預定量的被黏附體CP由接著薄片AS被卸下時，能量賦予手段50驅動被保持區域用紫外線發光源52B，如圖2(B)所示，透過一方側保持構件22A而對被保持區域HE賦予紫外線UV而使接著薄片AS對該一方側保持構件22A的接著力降低。之後，分離手段30驅動各線性馬達31，且使各自的滑件31A恢復成初期位置之後，保持手段20驅動旋動馬達21，且使一方側保持構件22A恢復成初期位置。接著，作業者、或未圖示之搬送手段將殘留在另一方側保持構件22B上的接著薄片AS去除，以下反覆上述同樣的動作。After that, the energy applying means 50 drives the ultraviolet light emitting source 51A for the adherend adherence region, as shown in FIG. 2 (A), and applies ultraviolet UV to the adherend adherence region CE to make the adhesive force of the adhesive sheet AS to the adherend CP reduce. Next, if all adherends CP or a predetermined amount of adherends CP are removed by the adhesive sheet AS by means of a to-be-adhered body removal means such as a pickup device or a conveying device, the energy application means 50 is driven to be held As shown in FIG. 2 (B), the region ultraviolet light emitting source 52B transmits ultraviolet light to the region HE to be held through the one-side holding member 22A, thereby reducing the adhesive force of the bonding sheet AS to the one-side holding member 22A. After that, the separating means 30 drives the linear motors 31 and returns the respective sliders 31A to the initial positions, and then the holding means 20 drives the rotary motor 21 to return the one-side holding member 22A to the initial positions. Next, the operator or a conveyance means (not shown) removes the adhesive sheet AS remaining on the other side holding member 22B, and repeats the same operation as described above.
藉由如以上所示之分離裝置10，由於一方側保持構件22A可透過紫外線UV，因此對於因被賦予紫外線UV而其接著力會降低的接著薄片AS，可防止以一方側保持構件22A所保持的接著薄片AS的被保持區域HE接著在該一方側保持構件22A。With the separation device 10 as described above, since the one-side holding member 22A can transmit ultraviolet UV, it is possible to prevent the one-side holding member 22A from being held by the one-side holding member 22A due to the ultraviolet ray given to the bonding sheet AS. The held area HE of the subsequent sheet AS is then held on the one side holding member 22A.
本發明中的手段及工程只要可達成針對該等手段及工程所說明的動作、功能或工程，並沒有任何限定，而且並無完全限定於前述實施形態中所示之僅為一實施形態的構成物或工程的情形。例如，能量賦予手段若為可對接著薄片賦予預定能量者，對照申請時之技術常識，若為該技術範圍內者，並沒有任何限定(其他手段及工程亦同)。The means and processes in the present invention are not limited in any way as long as they can achieve the actions, functions, or processes described with respect to the means and processes, and they are not completely limited to the constitution of only one embodiment shown in the foregoing embodiments. Things or projects. For example, if the energy imparting means is a person who can impart a predetermined energy to the adhesive sheet, according to the technical common sense at the time of application, if it is within the technical scope, there is no limitation (the same applies to other means and engineering).
本發明之分離裝置係如圖3(A)所示，亦可形成為一種分離裝置10A，其係具備有：保持手段20；在比接著薄片AS中的被黏附體接著區域CE更為外側且為被保持區域HE的內側，抵接於該接著薄片AS的抵接手段60；使保持接著薄片AS的端部的保持手段20及抵接手段60相對移動，對接著薄片AS賦予張力而將被黏附體CP的相互間隔加寬的分離手段30A；感測手段40；及能量賦予手段50。 其中，在分離裝置10A中，具有與分離裝置10同等的構成且同等功能者，係標註與該分離裝置10相同編號且省略其構成說明，簡化動作說明。As shown in FIG. 3 (A), the separation device of the present invention can also be formed as a separation device 10A, which is provided with: holding means 20; and is further outside than the adherend bonding area CE in the sheet AS To the inside of the held area HE, the abutment means 60 abuts against the adhesive sheet AS; the holding means 20 and the abutment means 60 that hold the ends of the adhesive sheet AS are relatively moved, and tension is applied to the adhesive sheet AS to be clamped. Separation means 30A for widening the interval between the adherends CP; sensing means 40; and energy imparting means 50. Among them, in the separation device 10A, those having the same configuration and the same function as the separation device 10 are denoted by the same numbers as the separation device 10, and the description of the structure is omitted to simplify the description of the operation.
分離手段30A係具備有：被支持在底板BP上之作為驅動機器的直線馬達33；及被支持在其輸出軸33A，且在上面側支持另一方側保持構件22B及支架52A的保持臂34。 抵接手段60係具備有：被支持在底板BP上的圓筒狀的抵接構件61，在抵接構件61的內部的底板BP上支持有被黏附體接著區域用紫外線發光源51A。The separating means 30A includes a linear motor 33 as a driving device supported on the base plate BP, and a holding arm 34 supported on the output shaft 33A and supporting the other holding member 22B and the bracket 52A on the upper side. The abutment means 60 includes a cylindrical abutment member 61 supported on the bottom plate BP, and an ultraviolet light source 51A for an adherend-adhered area is supported on the bottom plate BP inside the abutment member 61.
如上所示之分離裝置10A係與分離裝置10同樣地若黏貼有複數被黏附體CP的接著薄片AS被載置於另一方側保持構件22B上時，保持手段20驅動旋動馬達21，如圖3(A)中二點鏈線所示，以一方側保持構件22A與另一方側保持構件22B保持接著薄片AS的端部。接著，分離手段30A驅動直線馬達33，使保持手段20下降而使保持手段20及抵接手段60相對移動，如圖3(B)所示，對接著薄片賦予張力而將被黏附體CP的相互間隔加寬。之後，與分離裝置10同樣地，能量賦予手段50驅動被黏附體接著區域用紫外線發光源51A，且在使接著薄片AS對被黏附體CP的接著力降低之後，未圖示之被黏附體取出手段將各被黏附體CP搬送至其他工程。接著，若藉由未圖示之被黏附體取出手段，被黏附體CP由接著薄片AS被卸下時，能量賦予手段50驅動被保持區域用紫外線發光源52B，如圖3(C)所示，使接著薄片AS對一方側保持構件22A的接著力降低。接著，各手段驅動各自的驅動機器，使各構件恢復到初期位置之後，將殘留在另一方側保持構件22B上的接著薄片AS去除，以下反覆上述同樣的動作。When the separating device 10A shown above is the same as the separating device 10, if the adhesive sheet AS having a plurality of adherends CP is attached to the holding member 22B on the other side, the holding means 20 drives the rotation motor 21, as shown in FIG. As shown by the two-dot chain line in 3 (A), one end of the sheet AS is held by the one side holding member 22A and the other side holding member 22B. Next, the separating means 30A drives the linear motor 33 to lower the holding means 20 to relatively move the holding means 20 and the abutment means 60. As shown in FIG. 3 (B), tension is applied to the adhesive sheet to mutually adhere the CP to be adhered. The interval is widened. After that, as in the separating device 10, the energy applying means 50 drives the ultraviolet light emitting source 51A for the adherend adherence region, and after reducing the adhesion force of the adhesive sheet AS to the adherend CP, the adherend not shown is removed. Means: Transfer each adherend CP to another process. Next, when the adherend CP is removed from the adhesive sheet AS by the adherend extraction means (not shown), the energy applying means 50 drives the ultraviolet light emitting source 52B for the held area, as shown in FIG. 3 (C). This reduces the adhesive force of the adhesive sheet AS to the one-side holding member 22A. Next, each means drives its own driving machine to return each member to the initial position, and then removes the adhesive sheet AS remaining on the other holding member 22B, and repeats the same operation as described above.
藉由如上所示之分離裝置10A，亦可得與分離裝置10同樣的效果。With the separation device 10A as described above, the same effect as that of the separation device 10 can also be obtained.
保持手段20亦可為保持在另一面AS2、或其中一面AS1及另一面AS2之雙方的面黏貼有複數被黏附體CP的接著薄片AS的端部的構成，亦可為以機械式夾頭或夾頭汽缸等把持手段、庫侖力、接著劑、黏著劑、磁力、伯努利吸附、驅動機器等保持接著薄片AS的端部的構成，若保持接著薄片AS的保持構件22可透過紫外線UV，亦可為任何構成。 保持手段20亦可形成為另一方側保持構件22B可透過紫外線UV的構成，或形成為一方側保持構件22A及另一方側保持構件22B之雙方可透過紫外線UV的構成，在如上所示之情形下，能量賦予手段50驅動被黏附體接著區域用紫外線發光源51A，當對被黏附體接著區域CE賦予紫外線UV時，透過另一方側保持構件22B而對被保持區域HE亦賦予紫外線UV，可使接著薄片AS對一方側保持構件22A的接著力降低。此時，能量賦予手段50可具備亦可不具備被保持區域用紫外線發光源52B。 在分離裝置10的情形下，保持手段20亦可由例如將朝右方移動的該保持手段20形成為1體，且將朝左方移動的該保持手段20形成為1體的2體所構成，例如，亦可由朝右方、左方及其他方向移動的3體以上所構成。 在分離裝置10A的情形下，保持手段20可為1體，亦可為2體以上。The holding means 20 may be a structure in which the ends of the sheet AS that are adhered to the plurality of adherends CP are adhered to the other surface AS2, or one of the surfaces AS1 and the other surface AS2, or a mechanical chuck or The holding means such as a chuck cylinder, coulomb force, adhesive, adhesive, magnetic force, Bernoulli adsorption, driving machine, and the like hold the end of the bonding sheet AS. If the holding member 22 holding the bonding sheet AS is transparent to ultraviolet UV, It can be any structure. The holding means 20 may be formed as a configuration in which the other side holding member 22B is transparent to ultraviolet UV, or a configuration in which both the one side holding member 22A and the other side holding member 22B are transparent to ultraviolet UV, as shown above. Next, the energy applying means 50 drives the ultraviolet light emitting source 51A for the adherend adherence region, and when ultraviolet UV is applied to the adherend adherence region CE, ultraviolet light is also imparted to the adhered region HE through the other holding member 22B. The adhesive force of the adhesive sheet AS to the one-side holding member 22A is reduced. In this case, the energy applying means 50 may or may not include the ultraviolet light emitting source 52B for the held area. In the case of the separating device 10, the holding means 20 may be formed by, for example, forming the holding means 20 moving to the right into one body and forming the holding means 20 moving to the left into two bodies with one body. For example, it may be composed of three or more bodies moving in the right, left, and other directions.保持 In the case of the separation device 10A, the holding means 20 may be a single body or two or more bodies.
分離手段30、30A亦可為單數，而非為複數，此時，例如，分離裝置10係以1體的線性馬達的2個滑件，將保持手段20分別各1體支持，形成為將被黏附體CP的相互間隔加寬的構成，亦可形成為將被黏附體CP的相互間隔僅以1軸方向(例如X軸方向或Y軸方向等)加寬的構成。 分離手段30亦可為將相互間隔以3軸以上的方向(例如X軸方向、Y軸方向及其他軸方向)加寬的構成，亦可例如形成為使以X軸方向移動的複數保持手段20分別以Y軸方向移動的構成(使以Y軸方向移動的複數保持手段20分別以X軸方向移動的構成)，將被黏附體CP的相互間隔加寬，亦可為以被黏附體CP的相互間隔成為預定間隔的方式無法作動的構成。 分離手段30A亦可一邊使保持手段20停止或移動，一邊使抵接手段60移動，藉此使保持手段20及抵接手段60相對移動，且對接著薄片AS賦予張力而將被黏附體CP的相互間隔加寬。 分離手段30、30A亦可作業者操作按鈕或搖桿等，來驅動線性馬達31、直線馬達33，此時，構成為例如將藉由感測手段40所得之感測結果顯示在監視器或檢測器等顯示器，藉由該顯示器所顯示的感測結果，以被黏附體CP的相互間隔成為預定間隔的方式，或以各被黏附體CP的全體集合形狀相對於基本的全體集合形狀成為相似關係的方式，作業者使線性馬達31、直線馬達33驅動。The separation means 30 and 30A may also be singular, rather than plural. At this time, for example, the separation device 10 is based on two sliders of a linear motor of one body, and each of the holding means 20 is supported by one body, so as to be The structure in which the distance between the adherends CP is widened may also be a structure in which the distance between the adherends CP is widened in only one axis direction (for example, the X-axis direction or the Y-axis direction). The separation means 30 may be configured to widen the interval between three or more axes (for example, the X-axis direction, the Y-axis direction, and other axis directions), or may be formed as a plurality of holding means 20 that moves in the X-axis direction. The structure that moves in the Y-axis direction (the structure that moves the plural holding means 20 that moves in the Y-axis direction in the X-axis direction) widens the interval between the adherends CP. The structure in which the mutual intervals become a predetermined interval cannot be operated. The separating means 30A may also move the abutment means 60 while stopping or moving the holding means 20, thereby moving the holding means 20 and the abutting means 60 relatively, and applying tension to the adhesive sheet AS, and Widen each other. The separation means 30 and 30A may also operate a button or a joystick to drive the linear motor 31 and the linear motor 33. At this time, for example, it is configured to display a sensing result obtained by the sensing means 40 on a monitor or a detection Monitors such as monitors use the sensing results displayed on the display so that the mutual distance between the adherends CP becomes a predetermined interval, or the overall aggregate shape of each adherend CP becomes similar to the basic aggregate shape. In this manner, the operator drives the linear motor 31 and the linear motor 33.
感測手段40亦可構成為亦可以作業者的目視，例如作業者藉由目視，以被黏附體CP的相互間隔成為預定間隔的方式，或以各被黏附體CP的全體集合形狀相對於基本的全體集合形狀成為相似關係的方式，操作按鈕或搖桿等，來驅動線性馬達31、直線馬達33，亦可在本發明之分離裝置10、10A中未配備。The sensing means 40 may also be configured to be visualized by the operator. For example, the operator may visually set the interval between the adherends CP to be a predetermined interval, or the shape of the entire set of each adherend CP relative to the basic The manner in which the overall shape of the entire set becomes a similar relationship. The operation of a button or a joystick to drive the linear motor 31 and the linear motor 33 may not be provided in the separation devices 10 and 10A of the present invention.
能量賦予手段50係採用對接著薄片AS的其中一面AS1側及另一面AS2側的至少一方賦予紫外線UV的構成者，作為第1能量賦予手段51，亦可以如上所示之構成的第1能量賦予手段51，亦對被保持區域HE賦予紫外線UV而使接著薄片AS對一方側保持構件22A或另一方側保持構件22B的接著力降低，亦可透過形成為可透過紫外線UV的保持構件22，對以該保持構件22所保持的接著薄片AS的被保持區域賦予紫外線UV，若可使該被保持區域的接著力降低，亦可不具第1能量賦予手段51及第2能量賦予手段52之中至少一方。 能量賦予手段50係採用對接著薄片AS的其中一面AS1側及另一面AS2側的至少其中一面側賦予紫外線UV的構成者，作為第2能量賦予手段52，亦可以如上所示之構成的第2能量賦予手段52，對被保持區域HE賦予紫外線UV而使接著薄片AS對一方側保持構件22A或另一方側保持構件22B的接著力降低。 能量賦予手段50亦可為將所有波長的電磁波(例如X線或紅外線等)、經加熱或冷卻的氣體或液體等流體等作為能量而賦予給接著薄片AS者，若為可賦予可按照接著薄片AS的構成而將該接著薄片AS的接著力降低的能量者，則可為任意者，亦可為對接著薄片AS全體或部分賦予能量的構成，以被黏附體接著區域用紫外線發光源51A或被保持區域用紫外線發光源52B而言，亦可採用LED(Light Emitting Diode，發光二極體)燈、高壓水銀燈、低壓水銀燈、金屬鹵素燈、氙燈、鹵素燈等任意者，亦可採用將該等適當組合者。 第1能量賦予手段51及第2能量賦予手段52亦可在未將被黏附體CP的相互間隔加寬的狀態下，對接著薄片AS照射紫外線UV，第2能量賦予手段52亦可在被黏附體CP由接著薄片AS被卸下之前，對接著薄片AS照射紫外線UV。The energy imparting means 50 is a structure that applies ultraviolet rays to at least one of the one side AS1 side and the other side AS2 side of the sheet AS. As the first energy imparting means 51, the first energy imparting may be configured as shown above. Means 51 also applies ultraviolet UV to the region HE to be held, thereby reducing the adhesive force of the bonding sheet AS to the one side holding member 22A or the other side holding member 22B, and it is also possible to transmit through the holding member 22 formed to be transparent to ultraviolet UV. Ultraviolet UV is applied to the held area of the bonding sheet AS held by the holding member 22, and if the bonding force of the held area can be reduced, at least one of the first energy applying means 51 and the second energy applying means 52 may not be provided. Party. The energy imparting means 50 is a structure that applies ultraviolet UV to at least one of the one side AS1 side and the other side AS2 side of the sheet AS. As the second energy imparting means 52, a second structure having the above-mentioned configuration may be used. The energy applying means 52 applies ultraviolet UV to the region HE to be held, thereby reducing the adhesive force of the bonding sheet AS to one of the holding members 22A or 22B. The energy imparting means 50 may be a device that applies electromagnetic waves (such as X-rays or infrared rays) of all wavelengths, heated or cooled fluids such as gas or liquid to the bonding sheet AS as energy. The structure of the AS can reduce the adhesive force of the adhesive sheet AS. The energy can be any, or it can be a structure that imparts energy to the entire or part of the adhesive sheet AS. The ultraviolet light source 51A or As for the ultraviolet light source 52B for the held area, any one of an LED (Light Emitting Diode) light, a high-pressure mercury lamp, a low-pressure mercury lamp, a metal halide lamp, a xenon lamp, and a halogen lamp may be used. Wait for the right combination. The first energy imparting means 51 and the second energy imparting means 52 may irradiate ultraviolet rays to the adhesive sheet AS without widening the interval between the adherends CP, and the second energy imparting means 52 may also be adhered. Before the body CP is removed from the bonding sheet AS, the bonding sheet AS is irradiated with ultraviolet rays UV.
抵接手段60係除了角筒狀或橢圓筒狀等之外，亦可採用圓柱、角柱、橢圓柱等其他形狀的抵接構件61。The abutting means 60 may be a cylindrical, corner, or elliptical abutting member 61 other than a rectangular tube or an elliptical tube.
本發明中的接著薄片AS及被黏附體CP的材質、類別、形狀等並無特別限定。例如，接著薄片AS若為因被賦予能量，其接著力會降低者，並沒有任何限定的情形，亦可為感壓接著性、感熱接著性等接著形態者。此外，接著薄片AS或被黏附體CP亦可為例如圓形、橢圓形、三角形或四角形等多角形、其他形狀。此外，接著薄片AS亦可為例如：僅有接著劑層的單層者、在基材與接著劑層之間具有中間層者、在基材的上面具有覆蓋層等3層以上者、甚至可將基材由接著劑層剝離之所謂兩面接著薄片者，如上所示之兩面接著薄片亦可為具有單層或複層中間層者、或不具中間層的單層或複層者。此外，以被黏附體CP而言，亦可為例如食品、樹脂容器、矽半導體晶圓或化合物半導體晶圓等半導體晶圓、半導體晶片、電路基板、光碟等資訊記錄基板、玻璃板、鋼板、陶器、木板或樹脂等單體物，亦可為以該等2個以上所形成的複合物，任意形態的構件或物品等亦可作為對象。其中，接著薄片AS換成功能上、用途上讀法，亦可為例如資訊記載用標籤、裝飾用標籤、保護薄片、切割膠帶、晶片接合薄膜、黏晶膠帶、記錄層形成樹脂薄片等任意薄片、薄膜、膠帶等。 被黏附體CP亦可為預先存在複數在接著薄片AS上者，在以分離手段30、30A、其他機構或人手等賦予外力的時點被分割為複數，被分割成存在複數在接著薄片AS上而成為複數者。以如上所示之經分割而成為複數的被黏附體CP而言，例如對半導體晶圓或基板等照射雷射，在該半導體晶圓或基盤等形成線狀或格子狀等脆弱的脆弱層，在對接著薄片AS賦予張力，或對半導體晶圓或基盤等直接或間接賦予外力的時點進行個片化，成為複數被黏附體CP者、或例如在樹脂或玻璃板等以切刀片切入，在該樹脂或玻璃板等形成線狀或格子狀等不會有貫穿至表背的切入或孔狀接線等切斷預定線，在對接著薄片AS賦予張力、或對樹脂或玻璃板等直接或間接賦予外力的時點進行個片化，且成為複數被黏附體CP者等，並非為受到任何限定者。The material, type, shape, and the like of the adhesive sheet AS and the adherend CP in the present invention are not particularly limited. For example, if the bonding sheet AS is energized and its bonding force is reduced, it is not limited in any way, and it can also be bonding type such as pressure-sensitive adhesiveness and heat-sensitive adhesiveness. In addition, the sheet AS or the adherend CP may also have a polygonal shape such as a circle, an oval, a triangle, or a quadrangle, or other shapes. In addition, the adhesive sheet AS can also be, for example, a single layer having only an adhesive layer, an intermediate layer between the base material and the adhesive layer, a three or more layers such as a cover layer on the base material, or the like. The so-called two-sided adhesive sheet which peels off the substrate from the adhesive layer, the two-sided adhesive sheet as shown above may be a single layer or a multi-layer intermediate layer, or a single layer or a multi-layer without an intermediate layer. In addition, the adherend CP may be, for example, a food wafer, a resin container, a semiconductor wafer such as a silicon semiconductor wafer or a compound semiconductor wafer, a semiconductor wafer, a circuit board, an information recording substrate such as an optical disc, a glass plate, a steel plate, Single objects such as pottery, wooden boards, and resins can also be composites formed of two or more of these, and any form of component or article can also be targeted. Among them, the sheet AS is then replaced with a functional and application method, and may be any sheet such as a label for information recording, a decorative label, a protective sheet, a dicing tape, a wafer bonding film, a sticky crystal tape, or a recording layer forming resin sheet. , Film, tape, etc. The adherend CP may also be a pre-existing plural on the adhering sheet AS. When the external force is applied by the separation means 30, 30A, other mechanisms, or human hands, it is divided into plural numbers. Become plural. In the case of the divided adherends CP shown above, for example, a semiconductor wafer or a substrate is irradiated with a laser, and a fragile layer such as a line or a grid is formed on the semiconductor wafer or substrate. When tension is applied to the adhesive sheet AS, or when an external force is directly or indirectly applied to a semiconductor wafer or a substrate, the individual pieces are converted into a plurality of adherends CP, or, for example, a resin or glass plate is used to cut into the blade. The resin or glass plate is formed into a linear or lattice shape, and there is no cut-off line such as a cut-in or hole-like wiring penetrating through the front and back, and a tension is applied to the bonding sheet AS, or the resin or glass plate is directly or indirectly formed. Individuals are applied at the point of application of the external force, and they become a plurality of adherends CP, etc., and are not intended to be limited in any way.
前述實施形態中的驅動機器係可採用旋動馬達、直線馬達、線性馬達、單軸機器人、多關節機器人等電動機器、空氣汽缸、油壓汽缸、無桿汽缸、及旋轉汽缸等致動器等，亦可採用將該等直接或間接組合者。In the foregoing embodiment, the driving machine may be an electric machine such as a rotary motor, a linear motor, a linear motor, a single-axis robot, a multi-joint robot, an actuator such as an air cylinder, a hydraulic cylinder, a rodless cylinder, or a rotary cylinder. It is also possible to use a combination of these directly or indirectly.
10、10A‧‧‧分離裝置10, 10A‧‧‧ separation device
20‧‧‧保持手段20‧‧‧ means of retention
21‧‧‧旋動馬達21‧‧‧Rotary motor
21A‧‧‧輸出軸21A‧‧‧Output shaft
22‧‧‧保持構件22‧‧‧ holding member
22A‧‧‧一方側保持構件22A‧‧‧One side holding member
22B‧‧‧另一方側保持構件22B‧‧‧ The other side holding member
30、30A‧‧‧分離手段30, 30A‧‧‧ Separation means
31‧‧‧線性馬達31‧‧‧ Linear Motor
31A‧‧‧滑件31A‧‧‧Slider
32‧‧‧保持臂32‧‧‧ holding arm
33‧‧‧直線馬達33‧‧‧ Linear Motor
33A‧‧‧輸出軸33A‧‧‧Output shaft
34‧‧‧保持臂34‧‧‧ holding arm
40‧‧‧感測手段40‧‧‧sensing means
50‧‧‧能量賦予手段50‧‧‧ Energy Empowerment Means
51‧‧‧第1能量賦予手段51‧‧‧The first means of empowering energy
51A‧‧‧被黏附體接著區域用紫外線發光源51A‧‧‧Ultraviolet light source for adherend
52‧‧‧第2能量賦予手段52‧‧‧The second means of empowering energy
52A‧‧‧支架52A‧‧‧Scaffold
52B‧‧‧被保持區域用紫外線發光源52B‧‧‧ Ultraviolet light source for holding area
60‧‧‧抵接手段60‧‧‧Arrival means
61‧‧‧抵接構件61‧‧‧ abutment member
AS‧‧‧接著薄片AS‧‧‧thin sheet
AS1‧‧‧其中一面One of AS1‧‧‧
AS2‧‧‧另一面AS2‧‧‧ the other side
CE‧‧‧被黏附體接著區域CE‧‧‧ Adhered to the area
CP‧‧‧被黏附體CP‧‧‧ adherend
HE‧‧‧被保持區域HE‧‧‧ Area to be maintained
UV‧‧‧紫外線(預定能量)UV‧‧‧ultraviolet light (predetermined energy)
圖1(A)係本發明之實施形態之分離裝置的平面圖。(B)係圖1(A)的側面圖。 圖2(A)、(B)係本發明之實施形態之分離裝置的動作說明圖。 圖3(A)～(C)係本發明之其他例的說明圖。Fig. 1 (A) is a plan view of a separating apparatus according to an embodiment of the present invention. (B) is a side view of FIG. 1 (A). (2) (A) and (B) are operation explanatory diagrams of the separation device according to the embodiment of the present invention. FIGS. 3 (A) to (C) are explanatory diagrams of other examples of the present invention.
Claims (5)
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| JP2017-093949 | 2017-05-10 | ||
| JP2017093949A JP6820099B2 (en) | 2017-05-10 | 2017-05-10 | Separation device and separation method |
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| JPH10286791A (en) * | 1997-04-14 | 1998-10-27 | Orc Mfg Co Ltd | Drop of work preventing mechanism and method thereof |
| JP2001225986A (en) | 2000-02-16 | 2001-08-21 | Ricoh Co Ltd | Sheet material holding device |
| JP2006054246A (en) | 2004-08-10 | 2006-02-23 | Disco Abrasive Syst Ltd | Wafer separation method |
| JP4754278B2 (en) * | 2005-06-23 | 2011-08-24 | リンテック株式会社 | Chip body manufacturing method |
| JP2008294191A (en) * | 2007-05-24 | 2008-12-04 | Disco Abrasive Syst Ltd | Wafer dividing method |
| JP5111938B2 (en) * | 2007-05-25 | 2013-01-09 | 日東電工株式会社 | Method for holding semiconductor wafer |
| JP5307384B2 (en) | 2007-12-03 | 2013-10-02 | 株式会社ディスコ | Wafer division method |
| JP2011040476A (en) * | 2009-08-07 | 2011-02-24 | Lintec Corp | Device and method for applying energy |
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| CN108878311B (en) | 2023-09-26 |
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