TW201839052A - 熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物 - Google Patents
熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物 Download PDFInfo
- Publication number
- TW201839052A TW201839052A TW107106883A TW107106883A TW201839052A TW 201839052 A TW201839052 A TW 201839052A TW 107106883 A TW107106883 A TW 107106883A TW 107106883 A TW107106883 A TW 107106883A TW 201839052 A TW201839052 A TW 201839052A
- Authority
- TW
- Taiwan
- Prior art keywords
- meth
- acrylate
- weight
- thermosetting resin
- group
- Prior art date
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M5/00—Duplicating or marking methods; Sheet materials for use therein
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/30—Inkjet printing inks
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Epoxy Resins (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017-039666 | 2017-03-02 | ||
JP2017039666 | 2017-03-02 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW201839052A true TW201839052A (zh) | 2018-11-01 |
Family
ID=63370957
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW107106883A TW201839052A (zh) | 2017-03-02 | 2018-03-01 | 熱硬化性樹脂組成物、硬化膜、帶硬化膜基板、電子零件及噴墨用墨水組成物 |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPWO2018159675A1 (ja) |
TW (1) | TW201839052A (ja) |
WO (1) | WO2018159675A1 (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112625479A (zh) * | 2019-10-09 | 2021-04-09 | 捷恩智株式会社 | 热硬化性组合物、硬化膜及彩色滤光片 |
CN113372691A (zh) * | 2021-06-23 | 2021-09-10 | 宁波长阳科技股份有限公司 | 树脂组合物、强化液、强化层和光学保护膜 |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102143261B1 (ko) * | 2016-04-01 | 2020-08-10 | 주식회사 엘지화학 | 잉크 조성물, 이로 제조된 경화 패턴, 이를 포함하는 발열체 및 이의 제조방법 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1996011239A1 (fr) * | 1994-10-05 | 1996-04-18 | Goo Chemical Co., Ltd. | Encre resist de photosoudure, carte a circuit imprime et procede de fabrication |
JP6123354B2 (ja) * | 2013-03-01 | 2017-05-10 | Jnc株式会社 | 熱硬化性組成物 |
JP6127908B2 (ja) * | 2013-10-24 | 2017-05-17 | Jnc株式会社 | 熱硬化性樹脂組成物 |
CN107254205B (zh) * | 2013-11-05 | 2020-08-14 | 太阳油墨制造株式会社 | 固化型组合物、使用其的固化涂膜和印刷电路板 |
TWI692505B (zh) * | 2014-11-18 | 2020-05-01 | 日商捷恩智股份有限公司 | 感光性組成物與其用途 |
-
2018
- 2018-02-28 JP JP2019503061A patent/JPWO2018159675A1/ja active Pending
- 2018-02-28 WO PCT/JP2018/007499 patent/WO2018159675A1/ja active Application Filing
- 2018-03-01 TW TW107106883A patent/TW201839052A/zh unknown
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112625479A (zh) * | 2019-10-09 | 2021-04-09 | 捷恩智株式会社 | 热硬化性组合物、硬化膜及彩色滤光片 |
CN113372691A (zh) * | 2021-06-23 | 2021-09-10 | 宁波长阳科技股份有限公司 | 树脂组合物、强化液、强化层和光学保护膜 |
CN113372691B (zh) * | 2021-06-23 | 2022-06-28 | 宁波长阳科技股份有限公司 | 树脂组合物、强化液、强化层和光学保护膜 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2018159675A1 (ja) | 2020-01-16 |
WO2018159675A1 (ja) | 2018-09-07 |
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