TW201835252A - 封裝組成物 - Google Patents
封裝組成物 Download PDFInfo
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- TW201835252A TW201835252A TW106143419A TW106143419A TW201835252A TW 201835252 A TW201835252 A TW 201835252A TW 106143419 A TW106143419 A TW 106143419A TW 106143419 A TW106143419 A TW 106143419A TW 201835252 A TW201835252 A TW 201835252A
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/101—Inks specially adapted for printing processes involving curing by wave energy or particle radiation, e.g. with UV-curing following the printing
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F16/00—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical
- C08F16/12—Homopolymers and copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by an alcohol, ether, aldehydo, ketonic, acetal or ketal radical by an ether radical
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/223—Di-epoxy compounds together with monoepoxy compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/226—Mixtures of di-epoxy compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
- C08G59/22—Di-epoxy compounds
- C08G59/24—Di-epoxy compounds carbocyclic
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
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- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/08—Saturated oxiranes
- C08G65/10—Saturated oxiranes characterised by the catalysts used
- C08G65/105—Onium compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
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- C08G65/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring
- C08G65/04—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from cyclic ethers by opening of the heterocyclic ring from cyclic ethers only
- C08G65/06—Cyclic ethers having no atoms other than carbon and hydrogen outside the ring
- C08G65/16—Cyclic ethers having four or more ring atoms
- C08G65/18—Oxetanes
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- C—CHEMISTRY; METALLURGY
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Abstract
本申請案關於一種封裝組成物,一種有機電子裝置,一種評估該有機電子裝置之可靠度的方法,及一種製備該有機電子裝置的方法,並提供封裝組成物,其可改善密封有機電子元件之有機層的平坦性及黏著性,以有效地阻擋濕氣或氧從外側引入到有機電子裝置中,進而確保有機電子裝置的壽命。
Description
本申請案關於一種封裝組成物,一種有機電子裝置,一種評估該有機電子裝置之可靠度的方法,及一種製備該有機電子裝置的方法。
有機電子裝置(OED)是指包含一層有機材料之裝置,該有機材料使用電洞及電子產生交流電荷電流,且裝置之實例可包括光伏裝置,整流器,電晶體及有機發光二極體(OLED)等。
於有機電子裝置中,有機發光二極體(OLED)具有比傳統光源來得較低的電力消耗及較快的反應速度,且有利於薄化顯示器裝置或照明器(illuminations)。此外,OLED具有優異空間利用率,以致預期將其應用在涵蓋各種可攜式裝置、監視器、筆記型電腦及電視之各種領域。
在OLED的商業化及應用擴展中,最重要的問題是耐用度問題。OLED中所含的有機材料及金屬電極等很容易被外部因子諸如濕氣氧化。故而,包含OLED的產品對環境因子高度敏感。據此,已提出各種有效阻擋氧或濕氣從外側穿透到有機電子裝置諸如OLED中的方法。
技術課題
本申請案提供一種封裝組成物,其可改善密封有機電子元件之有機層的平坦性(flatness)及黏著性(adhesion),以有效地阻擋濕氣或氧從外側引入到有機電子裝置中,進而確保有機電子裝置的壽命;一種有機電子裝置;一種評估有機電子裝置之可靠度的方法;及一種製備有機電子裝置的方法。 技術手段
本申請案關於一種封裝組成物。封裝組成物可為密封材料,其施加以密封或封裝有機電子裝置諸如,例如OLED。於一種實例中,可施加本申請案的封裝組成物以密封或封裝有機電子元件的整個表面。故而,在將封裝組成物施加到封裝後,其可以密封有機電子元件整個表面的有機層形式出現。在此說明書中,有機層、密封層及密封材料可以相同意義使用。此外,有機層可與將於下面描述之保護層及/或無機層一起層壓(laminated)在有機電子元件上,以形成密封結構。
於本申請案的一具體實例中,本申請案關於一種可應用於噴墨程序(inkjet process)之用於密封有機電子元件之封裝組成物,其中當藉由使用能夠用非接觸型圖案化的噴墨印刷而將組成物排放到基板上時,組成物可經設計以具有適當物理性質。
在此說明書中,用語“有機電子裝置”是指具有包含有機材料層在彼此面對的電極對間之結構的物件或裝置,該有機材料層使用電洞及電子產生交流電荷電流,且該物件或裝置之實例可包括光伏裝置,整流器,電晶體及有機發光二極體(OLED)等,但不限於此。於本申請案的一個實例中,有機電子裝置可為OLED。
在以包含於一方向上延伸之主要圖案及於一方向上延伸並相鄰於該主要圖案形成之次要圖案的有機層形式固化的狀態下,本申請案的封裝組成物可具有主要圖案與次要圖案間溝渠部分之高度h對該有機層之厚度H的比率h/Hx100為50%或更少,48%或更少,45%或更少,或44%或更少。不特別限制該比率之下限,其可為0%或1%。在此說明書中,彼此相鄰形成可指其經定位成與於主要圖案一方向上延伸的方向垂直的方向接觸。故而,於主要圖案與次要圖案中的該一方向可為相同方向。藉由控制上述比率,本申請案可實現於噴墨程序中施加並形成之有機層的優異平坦性,其中此一有機層也可實現與待附接至其上方部(upper part)之無機層的優異黏著性,如下所述者。
封裝組成物可藉由一個液滴印刷以在一條線上形成主要圖案及次要圖案,且更具體地,可將藉由一個液滴印刷的封裝組成物鋪展,以形成於一方向上延伸的直線或矩形形狀的圖案,其中不特別限制圖案的形狀。本申請案可同時或分開地形成上述主要圖案與次要圖案。
於一種實例中,主要之印刷圖案或次要之印刷圖案可具有寬度(W)於範圍2 mm至150 mm,3 mm至130 mm,5 mm至100 mm,或10 mm至80 mm。於本申請案中,藉由將圖案的寬度控制到上述範圍,而可提供於噴墨印刷時有機層具有優異平坦性之有機電子裝置。
有機層可具有厚度厚度H於範圍2至25 μm,2.3 μm至20 μm,2.8 μm至15 μm,或3.1 μm至13 μm。藉由調整有機層中主要圖案與次要圖案間溝渠部分之高度,本申請案可優異地控制有機層的平坦性。溝渠部分可用h表示,如圖2所示,且有機層的厚度H可指主要圖案中或次要圖案中的平均厚度。溝渠部分可存在於主要圖案與次要圖案間的界面處。
透過封裝組成物的組成或形成有機層之方法,如下所述,本申請案可優異地實現如上之平坦性。
於本申請案的一具體實例中,封裝組成物可包含可固化化合物。可固化化合物可包含具有環狀結構於其分子結構中之可固化化合物及乙烯基醚(vinyl ether)可固化化合物。於本申請案的一具體實例中,封裝組成物可包含量分別為5至50重量份及25至80重量份;8至48重量份及26至75重量份;13至45重量份及28至70重量份或18至43重量份及29至68重量份的具有環狀結構於其分子結構中之可固化化合物及乙烯基醚可固化化合物。此外,於不受限於上述者下,本申請案的封裝組成物可包含,以100重量份的乙烯基醚化合物計,量為25至145重量份,26至140重量份,27至138重量份,28至135重量份或29至134重量份的具有環狀結構於其分子結構中之可固化化合物。本文中用語“重量份”可指各別組份的重量比。本申請案控制含乙烯基醚之可固化化合物與具有環狀結構之可固化化合物的含量比,進而實現優異平坦性,尤其,於上述形成印刷圖案之程序中,當有機層是藉由噴墨程序形成時,防止有機電子元件損傷,甚至是在液體組成物是直接施加到元件的情況下亦然,且也提供固化敏感性及固化後黏著性。
於一種實例中,不特別限制乙烯基醚可固化化合物,只要它具有乙烯基醚基。乙烯基醚可固化化合物可具有單官能性或更多,或雙官能性或更多,且不特別限制其上限,其可為10或更少。亦,該化合物可具有環狀結構於其分子結構中,但不限於此,其可為直鏈或支鏈。用語雙官能性或更多可指出現二或更多個乙烯基醚基。又者,當乙烯基醚可固化化合物具有環狀結構於其分子結構中,其可與上述具有環狀結構之可固化化合物藉由存在或不存在乙烯基醚加以區別,並據此,上述具有環狀結構之可固化化合物不可包含乙烯基醚基或下述之氧雜環丁烷基(oxetane group)。當乙烯基醚可固化化合物具有環狀結構於其分子結構中時,分子中出現之環構成原子可為於範圍3至10,4至8,或5至7個。環狀結構可為脂環族或芳香族環,但不限於此。例如,乙烯基醚可固化化合物可藉由1,4-環己烷二甲醇二乙烯基醚、丁二醇單乙烯基醚、三乙二醇二乙烯基醚或十二烷基乙烯基醚例示,但不限於此。
在此說明書中,可固化化合物可統稱為具有可固化官能基之化合物。可固化化合物可包含,例如上述乙烯基醚可固化化合物,將於下面敘述的具有環狀結構於其分子結構中之可固化化合物,直鏈或支鏈脂族可固化化合物,或具有氧雜環丁烷基之可固化化合物。
於本申請案中,上述可固化化合物的可固化官能基可為,例如,一或多種選自乙烯基醚基,氧雜環丁烷基,環氧丙基,異氰酸基(isocyanate group),羥基,羧基,醯胺基,環氧基(epoxide group),硫基(sulfide group),縮醛基及內酯基中者。取決於可固化化合物之種類,其可具有一個或二個或更多個可固化官能基,但不限於此,其可具有一個可固化官能基。不特別限制其之上限,其可為10或更少。於一種實例中,可固化化合物可包含具有環狀結構於其分子結構中之可固化化合物,如上所述者。於一種實例中,具有環狀結構於其分子結構中之化合物可具有於範圍3至10,4至8,或5至7個環構成原子於分子結構中。具有環狀結構之可固化化合物可包含至少一個或更多個可固化官能基,其中可固化官能基可為一或多種選自環氧丙基,異氰酸基,羥基,羧基,醯胺基,環氧基,硫基,縮醛基及內酯基中者。
於本申請案的一具體實例中,封裝組成物可進一步包含具有氧雜環丁烷基之可固化化合物。具有氧雜環丁烷基之可固化化合物可具有至少二個或更多個氧雜環丁烷基。不特別限制其之上限,其可為10或更少。可相對於100重量份的乙烯基醚可固化化合物,以5至90重量份,8至88重量份,10至83重量份,15至79重量份,20至75重量份,25至73重量份,或32至70重量份的量包含具有氧雜環丁烷基之可固化化合物。藉由控制具有氧雜環丁烷基之可固化化合物的含量,本申請案可藉由噴墨方法形成有機層於有機電子元件上,且所施加之封裝組成物可提供具有短時間內優異可鋪展性且固化後具有優異強度之有機層。
具有氧雜環丁烷基之化合物可具有重量平均分子量於範圍150至1,000 g/mol,173至980 g/mol,188至860 g/mol,210至823 g/mol或330至780 g/mol。藉由控制具有氧雜環丁烷基之化合物的重量平均分子量為低重量平均分子量,當應用於噴墨印刷時,本申請案可實現優異可印刷性並同時提供濕氣阻障物性質及優異固化敏感性。在此說明書中,重量平均分子量是指藉由GPC(凝膠滲透層析術)測量轉換成標準聚苯乙烯的值。於一種實例中,以3至20 mm的聚苯乙烯珠填充具有長度250至300 mm及內徑4.5至7.5 mm之金屬管製管柱。當藉由溶解待測物質在THF溶劑中而稀釋之溶液穿通過管柱時,可根據流動時間間接測量重量平均分子量。其可藉由繪製各時點依尺寸從管柱分離出量的圖。
具有氧雜環丁烷基之化合物可具有沸點於範圍90至300℃,98至270℃,110至258℃,或138至237℃。藉由將化合物的沸點控制到上述範圍中,本申請案可提供密封材料,其可具有優異外側濕氣阻障物性質同時實現優異可印刷性,甚至是在噴墨程序中高溫的情況下亦然,且由於抑制釋氣(outgas)防止對元件造成損傷。在此說明書中,除非另行指明,沸點可在1 atm測量。
於一種實例中,可固化化合物可進一步包含直鏈或支鏈脂族可固化化合物。脂族可固化化合物可具有至少二個或更多個可固化官能基,且上限可為10或更少。亦,脂族可固化化合物可相對於組成物中100重量份的整個可固化化合物,以5重量份至37重量份,或5重量份至35重量份或5.3重量份至33重量份的量包括。藉由控制脂族可固化化合物的含量,本申請案可改善在基板(其上形成有有機電子元件)上的黏著力,加上優異光學特性,並控制物理性質以致組成物可藉由噴墨施加。
於一種實例中,具有環狀結構之可固化化合物可為環氧化合物,且當該化合物為環氧化合物時,具有環狀結構之可固化化合物可具有環氧當量於範圍50至350 g/eq,73至332 g/eq,94至318 g/eq或123至298 g/eq。亦,直鏈或支鏈脂族化合物可具有環氧當量於範圍120 e/eq至375 e/eq或120 e/eq至250 e/eq。藉由控制環氧當量為低,本申請案可防止因組成物黏度變得過高而使得噴墨程序不可行,但改善密封材料固化後的固化完成度,並同時提供濕氣阻障物性質及優異固化敏感性。在此說明書中,環氧當量為含有一公克當量環氧基之樹脂的公克數(g/eq),其可根據JIS K 7236中所定義之方法測量。
於一種實例中,本申請案的封裝組成物對玻璃可具有接觸角為30°或更少,25°或更少,20°或更少,15°或更少,或12°或更少。不特別限制下限,但可為1°或3°或更多。藉由將接觸角調整成30°或更少,本申請案可確保噴墨塗覆中之短時間內可鋪展性,進而形成薄膜有機層。於本申請案中,可藉由將封裝組成物液滴施加到玻璃上而使用座滴量測法(sessile drop measurement method)來測量接觸角,其可為施加5次後測量的平均值。
於一種實例中,具有環狀結構於其分子結構中之化合物可藉由檸檬烯二氧化物,3’,4’-環氧基環己烷羧酸3,4-環氧基環己基甲酯(EEC)及其衍生物,二環戊二烯二氧化物及其衍生物,乙烯基環己烯二氧化物及其衍生物,或1,4-環己烷二甲醇雙(3,4-環氧基環己烷羧酸酯)例示,但不限於此。
在此說明書中,具有環狀結構之可固化化合物可為脂族化合物,其可以其具有環狀結構而與直鏈或支鏈脂族化合物區別。亦,具有氧雜環丁烷基之可固化化合物可為直鏈、支鏈或環狀脂族化合物,但其可以其具有氧雜環丁烷基與上述兩種化合物區別。又者,乙烯基醚可固化化合物為具有乙烯基醚基之化合物,其可與上述三種化合物區別。
於一種實例中,不限制包含氧雜環丁烷基之可固化化合物的結構,只要它具有該官能基,且可例示者為例如,購自TOAGOSEI之OXT-221、CHOX、OX-SC、OXT101、OXT121、或OXT212、OXT-211、PNOX-1009;或購自ETERNACOLL之EHO、OXBP、OXTP或OXMA。亦,直鏈或支鏈脂族可固化化合物可包括脂族環氧丙基醚,1,4-丁二醇二環氧丙基醚,乙二醇二環氧丙基醚,1,6-己二醇二環氧丙基醚,丙二醇二環氧丙基醚,二甘醇二環氧丙基醚,丁基環氧丙基醚,2-乙基己基環氧丙基醚或新戊二醇二環氧丙基醚,但不限於此。
於本申請案的一具體實例中,封裝組成物可進一步包含界面活性劑。於一種實例中,界面活性劑可包含極性官能基,且極性官能基可出現在界面活性劑的化合物結構端。極性官能基可包括,例如,羧基,羥基,磷酸酯(phosphate),銨鹽,羧酸酯基(carboxylate group),硫酸酯或磺酸酯。又者,於本申請案的一具體實例中,界面活性劑可為非聚矽氧系(non-silicone-based)界面活性劑或氟系界面活性劑。非聚矽氧系界面活性劑或氟系界面活性劑可與上述可固化化合物一起施加以於有機電子元件上提供優異塗覆性質。另一方面,在包含極性反應性基之界面活性劑的情況下,其可具有與封裝組成物的其他組份之高親合性,進而實現就黏著性而言優異的效果。於本申請案的一具體實例中,可使用親水性氟系界面活性劑或非聚矽氧系界面活性劑來改善基底材料(base material)的塗覆性質。
具體地,界面活性劑可為聚合物種類或寡聚物種類之氟系界面活性劑。作為該界面活性劑,可使用市售產品,其可選自下列所組成群組:購自TEGO之Glide 100、Glide 110、Glide 130、Glide 460、Glide 440、Glide 450或RAD 2500;購自DIC (DaiNippon Ink Chemicals)之Megaface F-251、F-281、F-552、F554、F-560、F-561、F-562、F-563、F-565、F-568、F-570及F-571;或購自Asahi Glass Co.之Surflon S-111、S-112、S-113、S-121、S-131、S-132、S-141及S-145;購自Sumitomo 3M Ltd.之Fluorad FC-93、FC-95、FC-98、FC-129、FC-135、FC-170C、FC-430及FC-4430;或購自DuPont之Zonyl FS-300、FSN、FSN-100及FSO;及購自BYK之BYK-350、BYK-354、BYK-355、BYK-356、BYK-358N、BYK-359、BYK-361N、BYK-381、BYK-388、BYK-392、BYK-394、BYK-399、BYK-3440、BYK-3441、BYKETOL-AQ、BYK-DYNWET 800;等。
界面活性劑可相對於組成物中100重量份的整個可固化化合物,以0.01至10重量份,0.05至10重量份,0.1至10重量份,0.5至8重量份,或1至4重量份的量包括。在該含量範圍內,本申請案使得可能將封裝組成物應用於噴墨方法而形成薄膜有機層。
於本申請案的一具體實例中,封裝組成物可進一步包含光起始劑。光起始劑可為離子性光起始劑。亦,光起始劑可為吸收範圍180 nm至400 nm的波長之化合物。藉由使用光起始劑,本申請案可於本申請案之特定組成物中實現優異固化性質。
作為陽離子性光聚合起始劑,可使用本領域中已知材料且例如,其可包括具有陽離子部分(cation moiety)及陰離子部分的化合物,該陽離子部分包含芳族硫鎓,芳族碘鎓,芳族重氮鎓(aromatic diazonium),或芳族銨,該陰離子部分包含AsF6 -
,SbF6 -
,PF6 -
,或肆(五氟苯基)硼酸根。又者,作為陽離子性光聚合起始劑,可例示的是鎓鹽或有機金屬鹽系列的離子化陽離子性起始劑,或有機矽烷或隱伏磺酸系列的的非離子化陽離子性光聚合起始劑。可將二芳基碘鎓鹽,三芳基硫鎓鹽或芳基重氮鎓鹽等例示作為鎓鹽系列的起始劑,可將鐵芳烴等例示作為有機金屬鹽鹽系列的起始劑,可將o-硝基苄基三芳基矽基醚,三芳基矽基過氧化物,或醯基矽烷等例示作為有機矽烷系列的起始劑,以及可將α-磺醯氧基酮或α-羥甲基安息香磺酸鹽等例示作為隱伏磺酸系列的起始劑,但不限於此。
於一種實例中,本申請案的封裝組成物可包含包含硫鎓鹽之光起始劑作為上述特定組成物中之光起始劑,以便適於藉由噴墨方法密封有機電子元件之用途。即使是在根據上述組合物之封裝組成物直接密封於有機電子元件上的情況下,其可防止因小量產生釋氣而對元件造成化學損害。又者,包含硫鎓鹽之光起始劑也可具有優異溶解性,進而適於將其應用於噴墨程序。
於本申請案的一具體實例中,光起始劑可相對於組成物中100重量份的整個可固化化合物,以0.1至15重量份,0.2至13重量份,或0.3至11重量份的量出現。藉由控制光起始劑含量範圍,由於直接施加到有機電子元件上之組成物的天性所致,本申請案可最小化對元件的物理及化學損害。
於本申請案的一具體實例中,封裝組成物可進一步包含光敏劑,以茲補充在300 nm或更長的長波活化能量束下的固化性質。光敏劑可為吸收200 nm至400 nm範圍波長之化合物。
光敏劑可為一或多種選自所組成群組者:蒽系化合物,諸如蒽、9,10-二丁氧基蒽、9,10-二甲氧基蒽、9,10-二乙氧基蒽、及2-乙基-9,10-二甲氧基蒽;二苯甲酮系化合物,諸如二苯甲酮、4,4-雙(二甲基胺基)二苯甲酮、4,4-雙(二乙基胺基)二苯甲酮、2,4,6-三甲基胺基二苯甲酮、鄰苯甲醯基苯甲酸甲酯、3,3-二甲基-4-甲氧基二苯甲酮及3,3,4,4-肆(第三丁基過氧羰基)二苯甲酮;酮系化合物,諸如苯乙酮、二甲氧基苯乙酮、二乙氧基苯乙酮、2-羥基-2-甲基-1-苯基丙-1-酮及丙酮;苝;茀系化合物,諸如9-茀酮、2-氯-9-茀酮及2-甲基-9-茀酮;噻噸酮系化合物,諸如噻噸酮、2,4-二乙基噻噸酮、2-氯噻噸酮、1-氯-4-丙氧基噻噸酮、異丙基噻噸酮(ITX)及二異丙基噻噸酮;呫噸酮(氧蒽酮)系化合物,諸如呫噸酮及2-甲基呫噸酮;蒽醌系化合物,諸如蒽醌、2-甲基蒽醌、2-乙基蒽醌、第三丁基蒽醌及2,6-二氯-9,10-蒽醌;吖啶系化合物,諸如9-苯基吖啶、1,7-雙(9-吖啶基)庚烷、1,5-雙(9-吖啶基)戊烷及1,3-雙(9-吖啶基)丙烷;二羰基化合物,諸如苄基、1,7,7-三甲基-雙環[2,2,1]庚烷-2,3-二酮及9,10-菲醌;氧化膦系化合物,諸如2,4,6-三甲基苯甲醯基二苯基氧化膦及雙(2,6-二甲氧基苯甲醯基)-2,4,4-三甲基戊基氧化膦;苯甲酸酯系化合物,諸如4-(二甲基胺基)苯甲酸甲酯、4-(二甲基胺基)苯甲酸乙酯、4-(二甲基胺基)苯甲酸2-正丁氧基乙酯;胺基增效劑,諸如2,5-雙(4-二乙基胺基亞芐基)環戊酮、2,6-雙(4-二乙基胺基亞芐基)環己酮及2,6-雙(4-二乙基胺基亞芐基)-4-甲基-環戊酮;香豆素系化合物,諸如3,3-羰基乙烯基-7-(二乙基胺基)香豆素、3-(2-苯并噻唑基)-7-(二乙基胺基)香豆素、3-苯甲醯基-7-(二乙基胺基)香豆素、3-苯甲醯基-7-甲氧基香豆素及10,10-羰基雙[1,1,7,7-四甲基-2,3,6,7-四氫-1H,5H,11H-Cl]-[6,7,8-ij]喹嗪-11-酮;查耳酮化合物,諸如4-二乙基胺基查耳酮及4-疊氮基亞苄基苯乙酮(4-azidobenzalacetophenone);2-苯甲醯基甲烯(2-benzoylmethylene);及3-甲基-b-萘并噻唑啉。
光敏劑可相對於100重量份的光起始劑,以28至55重量份,31至52重量份或32至40重量份的範圍包括。藉由控制光敏劑的含量,本發明可實現於所欲波長之固化敏感性的協同性作用,且也藉由不溶解於噴墨塗層中而防止光敏劑降低黏著力。
本申請案的封裝組成物可進一步包含耦合劑。本申請案可改善封裝組成物的固化產品對黏附物的黏合性或固化產品的濕氣穿透抗性。耦合劑可包括,例如,鈦系耦合劑、鋁系耦合劑、或矽烷耦合劑。
於本申請案的一具體實例中,矽烷耦合劑可包括,具體地,環氧基系矽烷耦合劑,諸如3-環氧丙基氧基丙基三甲氧基矽烷、3-環氧丙基氧基丙基三乙氧基矽烷、3-環氧丙基氧基丙基(二甲氧基)甲基矽烷及2-(3,4-環氧基環己基)乙基三甲氧基矽烷;巰基系矽烷耦合劑,諸如3-巰基丙基三甲氧基矽烷、3-巰基丙基三乙氧基矽烷、3-巰基丙基甲基二甲氧基矽烷及11-巰基十一基三甲氧基矽烷;胺基系矽烷耦合劑,諸如3-胺基丙基三甲氧基矽烷、3-胺基基丙基三乙氧基矽烷、3-胺基基丙基二甲氧基甲基矽烷、N-苯基-3-胺基丙基三甲氧基矽烷、N-甲基胺基丙基三甲氧基矽烷、N-(2-胺基乙基)-3-胺基丙基三甲氧基矽烷及N-(2-胺基乙基)-3-胺基基丙基二甲氧基甲基矽烷;脲系(ureide-based)矽烷耦合劑,諸如3-脲丙基三乙氧基矽烷;乙烯基系矽烷耦合劑,諸如乙烯基三甲氧基矽烷、乙烯基三乙氧基矽烷及乙烯基甲基二甲氧基矽烷;苯乙烯基系矽烷耦合劑,諸如p-苯乙烯基三甲氧基矽烷;丙烯酸酯系矽烷耦合劑,諸如3-丙烯醯氧基丙基三甲氧基矽烷及3-甲基丙烯醯氧基丙基三甲氧基矽烷;異氰酸酯系矽烷耦合劑,諸如3-異氰酸基丙基三甲氧基矽烷;硫化物系矽烷耦合劑,諸如雙(三乙氧基矽基丙基)二硫化物及雙(三乙氧基矽基丙基)四硫化物;苯基三甲氧基矽烷、甲基丙烯醯氧基丙基三甲氧基矽烷、咪唑矽烷、三嗪矽烷等。
於本申請案中,耦合劑可相對於組成物中100重量份的整個可固化化合物,以0.1至10重量份或0.5至8重量份的量包括。在上述範圍內,本申請案藉由添加耦合劑可實現改善黏合性的效果。
除上述組份外,根據本申請案之封裝組成物可包含範圍在不會影響發明上述效果的各種添加劑。例如,取決於所欲物理性質,封裝組成物可包含適當含量範圍之濕氣吸收劑、無機填料、消泡劑、增稠劑、紫外光安定劑或抗氧化劑等。
於一種實例中,封裝組成物可於室溫呈液體相,例如,於約25℃。於本申請案的一具體實例中,封裝組成物可呈無溶劑型式液體相。可施加封裝組成物以密封有機電子元件,及具體地,可施加封裝組成物以密封有機電子元件的整個表面。因封裝組成物於室溫具有液體形式,本申請案可藉由將組成物施加到元件側之方法來密封有機電子元件。
亦,本申請案的封裝組成物可為墨水組成物。本申請案的封裝組成物可為能用於噴墨程序之墨水組成物。本申請案的封裝組成物可具有特定組成及物理性質,以致可進行噴墨。
亦,於本申請案的一具體實例中,固化後,於可見光區中,封裝組成物可具有透光率90%或更多,92%或更多,或95%或更多。於上述範圍內,藉由將封裝組成物施加到頂部發射型有機電子裝置,本申請案提供具有高解析度、低電力消耗及長壽命之有機電子裝置。又者,固化後,根據JIS K7105標準測試,本申請案的封裝組成物可具有霧度3%或更少,2%或更少或1%或更少,且不特別限制下限,但可為0%。於霧度範圍內,固化後,封裝組成物可具有優異光學性質。在此說明書中,上述透光率或霧度可在其中封裝組成物已固化到有機層上之狀態下測量,且可為有機層厚度為2 μm至50 μm之任一厚度下所測量之光學特性。於本申請案的一具體實例中,為了實現光學特性,可不包括上述濕氣吸收劑或無機填料。
本申請案也關於一種有機電子裝置。如圖1所示,例示性有機電子裝置(3)可包含基板(31);形成於基板(31)上之有機電子元件(32);及密封有機電子元件(32)的整個表面之有機層(33)。有機層可包含上述封裝組成物。
亦,在以於一方向上延伸之主要圖案及於一方向上延伸並相鄰於該主要圖案形成之次要圖案固化之狀態下,有機層可具有主要圖案與次要圖案間溝渠部分之高度h對該有機層之厚度H的比率h/Hx100為50%或更少。
於本申請案中,有機層可為有機薄膜層,並可與將於下描述之無機層及/或保護層一起形成密封結構。
於本申請案的一具體實例中,有機電子元件可包含第一電極層,形成於第一電極層上並含有至少一發光層之有機層,及形成於有機層上之第二電極層。第一電極層可為透明電極層或反射電極層,而第二電極層也可為透明電極層或反射電極層。更具體地,有機電子元件可包含形成於基板上之反射電極層,形成於反射電極層上並含有至少一發光層之有機層,及形成於有機層上之透明電極層。
於本申請案中,有機電子元件(23)可為有機發光二極體。
於一種實例中,根據本申請案之有機電子裝置可為發射型,但不限於此,且可應用於底部發射型。
有機電子裝置可進一步包含保護層(35),以保護元件的電極及發光層。保護層可為無機保護層(35)。保護層可為藉由化學氣相沉積(CVD)之保護層,其中作為材料,可使用已知無機材料且例如,可使用氮化矽(SiNx)。於一種實例中,用作為保護層之氮化矽(SiNx)可沉積成厚度0.01 μm至5 μm。
於本申請案的一具體實例中,有機電子裝置(3)可進一步包含形成於有機層(33)上之無機層(34)。不特別限制無機層(34)的材料,其可與上述保護層相同或不同。於一種實例中,無機層可為一或多種選自Al、Zr、Ti、Hf、Ta、In、Sn、Zn及Si所組成群組之金屬氧化物或金屬氮化物。無機層可具有厚度為5至100 nm、10 nm至90 nm、或10至80 nm。於一種實例中,本申請案的無機層可為沒有任何摻雜劑之無機材料,或可為含有摻雜劑之無機材料。可摻雜之摻雜劑可為一或多種選自Ga、Si、Ge、Al、Sn、Ge、B、In、Tl、Sc、V、Cr、Mn、Fe、Co及Ni所組成群組之元素,或該元素之氧化物,但不限於此。
本申請案之有機電子裝置(3)可包含:包含如上所述之有機層(33)及無機層(34)之密封結構,其中密封結構可包含至少一或多層有機層及至少一或多層無機層,且有機層與無機層可重覆地層壓。例如,有機電子裝置可具有基板(31)/有機電子元件(32)/保護層(35)/(有機層(33)/無機層(34))n之結構,其中n可為於範圍1至100的數字。圖1為例示性顯示其中n為1之情況的橫截面圖。
有機層(33)可密封元件(32)的上表面,且可一起密封側表面以及上表面。於一種實例中,本申請案之有機電子裝置(3)可進一步包含:出現在有機層(33)上之覆蓋基板。不特別限制基板及/或覆蓋基板的材料,且可使用本領域中已知材料。例如,基板或覆蓋基板可為玻璃、金屬基底材料或聚合物膜。作為聚合物膜,可使用例如,聚對苯二甲酸乙二酯膜、聚四氟乙烯膜、聚乙烯膜、聚丙烯膜、聚丁烯膜、聚丁二烯膜,氯乙烯共聚物膜、聚胺酯膜、乙烯-乙酸乙烯酯膜、乙烯-丙烯共聚物膜、乙烯-丙烯酸乙酯共聚物膜、乙烯-丙烯酸甲酯共聚物膜或聚醯亞胺膜等。
亦,如圖3所示,有機電子裝置(3)可進一步包含出現在覆蓋基板(38)與其上形成有有機電子元件(32)之基板(31)間之封裝膜(37)。可施加封裝膜(37)以供附接其上形成有有機電子元件(32)之基板(31)與覆蓋基板(38),其可為例如,壓敏性黏著劑膜或黏著劑膜,但不限於此。封裝膜(37)可密封層壓在有機電子元件(32)上之上述有機層與無機層之密封結構(36)的整個表面。
本申請案也提供一種評估有機電子裝置之可靠度的方法。可靠度的評估方法可在該封裝組成物係在基板(其上形成有機電子元件)上以包含於一方向上延伸之主要圖案及於一方向上延伸並相鄰於該主要圖案形成之次要圖案的有機層形式固化之狀態下,透過該主要圖案與該次要圖案間溝渠部分之高度h對該有機層之厚度H的比率h/Hx100是否為50%或更少來進行。圖案可藉由噴墨方法形成。在上述比率的範圍內,本申請案可提供密封有機電子元件之密封結構的黏著性,以及高溫高濕耐熱保持力。
本申請案也提供一種製備有機電子裝置的方法。
製備方法可包含於基板上形成有機層之步驟,其中該基板上方部上形成有有機電子元件,以致上述封裝組成物密封有機電子元件的整個表面。
形成有機層之步驟可包含形成於一方向上延伸之主要圖案及於一方向上延伸並相鄰於主要圖案形成之次要圖案。主要圖案及次要圖案之形成可一起進行,次要圖案可在主要圖案先形成後形成,以及相反地主要圖案可在次要圖案先形成後形成。當主要圖案及次要圖案一起形成時,主要及次要圖案可同時形成或可重覆主要圖案化,次要圖案化,再次主要圖案化及再次次要圖案化。在先形成主要圖案的情況下,於先形成二或更多種空間分開之主要圖案後,可在一主要圖案另一主要圖案間的區中形成次要圖案。
於一種實例中,主要之印刷圖案意指二或更多條彼此空間分開之印刷圖案線,且次要之印刷圖案也意指二或更多條彼此空間分開之印刷圖案線。於一種實例中,本申請案之製備有機電子裝置的方法可包含步驟:於其上形成有有機電子元件之基板上,形成二或更多種主要之印刷圖案而使得彼等於一方向上延伸並具有預定節距;及形成次要之印刷圖案而使得彼等於一方向上延伸並與主要之印刷圖案交替地形成。次要之印刷圖案可形成於經印刷以便以預定節距於一方向上延伸之主要之印刷圖案間,亦即,次要之印刷圖案可形成於未形成有主要圖案之區域中。在形成主要之印刷圖案的步驟中,主要之印刷圖案間的節距可於範圍10 μm至300 mm或3 mm至250 mm,出現在印刷圖案中之封裝組成物的點節距可於範圍10 μm至650 μm,20 μm至590 μm,30 μm至480 μm,40 μm至370 μm,50 μm至390 μm,或70 μm至260 μm。封裝組成物可藉由一個液滴印刷,以在一條線上形成主要之印刷圖案,且更具體地,可將藉由一個液滴印刷的封裝組成物鋪展,以形成呈於一方向上延伸的直線或矩形形狀的圖案,其中不特別限制圖案的形狀。藉由先形成二或更多種彼此空間分開之主要之印刷圖案,並接著進行形成次要之印刷圖案的步驟,當封裝組成物係以有機層形式形成在有機電子元件上時,本申請案可實現優異平坦性,其中此一有機層也具有與附接至上方部之無機層間的優異黏著性,其將描述於下。
在此說明書中,用語“節距”可意指主要之印刷圖案的形成點與另一相鄰主要之印刷圖案的形成點間的距離。亦即,用語“節距”可意指主要之印刷圖案於上述垂直方向上開始處的點與另一相鄰主要之印刷圖案於該垂直方向上開始處的點間的距離。
於本申請案的一具體實例中,形成印刷圖案的步驟可藉由噴墨印刷,凹版塗佈,旋塗,網版印刷或反轉膠版印刷進行,其中不特別限制印刷方法。
於一種實例中,形成主要或次要之印刷圖案的步驟係藉由噴墨印刷形成,其中噴墨印刷可具有50 dpi至1000 dpi或80 dpi至800 dpi的範圍。亦即,封裝組成物用來作為噴墨印刷的墨水,以致可印刷每節距50至1000個點。本申請案可藉由控制上述數值將封裝組成物精確印刷在基板上。
於一種實例中,主要之印刷圖案或次要之印刷圖案可具有厚度為2 μm至25 μm,2.3 μm至20 μm,2.8 μm至15 μm或3.1 μm至13 μm。於有機電子裝置的製造中,藉由將封裝組成物印刷成非常薄的厚度,本申請案可最小化有機層的厚度而提供薄膜有機電子裝置。
於一種實例中,製備方法可進一步包含將印刷之封裝組成物平坦化的步驟。在加工主要之印刷圖案與次要之印刷圖案後,平坦化步驟可維持40至180秒。由於平坦化步驟中的鋪展,以點形式施加之封裝組成物可填充在主要之印刷圖案與次要之印刷圖案間。
於本申請案的一具體實例中,製備方法可進一步包含以光照射印刷之封裝組成物的步驟。可以光照射組成物來誘導固化。光照射可包含以具有250 nm至450 nm或300 nm至450 nm區帶範圍波長之光,於0.3至6J/cm2
的光量或0.5至5J/cm2
的光量照射。
此外,本申請案之製備方法可包含,在以封裝組成物形成印刷圖案前,於基板上形成有機電子元件。形成有機電子元件可包含形成下列者之步驟:於基板上的第一電極層,形成於第一電極層上並包含至少一發光層之有機層,及形成於有機層上之第二電極層。此處,其上形成有有機電子元件的基板可藉由例如於基板(諸如玻璃或聚合物膜)上以諸如真空沉積或濺鍍之方法形成反射電極或透明電極並在反射電極上形成有機材料層而製造。有機材料層可包含電洞注入層,電洞傳輸層,發光層,電子注入層及/或電子傳輸層。之後,於有機材料層上進一步形成第二電極層。第二電極可為透明電極或反射電極。
本申請案之製備方法可進一步包含於第一電極層、有機材料層及第二電極層(其等已形成於基板上)上形成保護層的步驟。保護層可為無機保護層。保護層可為藉由化學氣相沉積(CVD)形成之保護層,其中作為材料,可使用已知無機材料且可使用,例如氮化矽(SiNx)。於一種實例中,用作為保護層之氮化矽(SiNx)可沉積成厚度0.01 μm至50 μm。
又者,本申請案之製備方法可進一步包含於有機層上形成無機層的步驟。形成無機層的方法可與上述形成保護層的方法相同。 有利效果
本申請案提供一種封裝組成物,其可改善密封有機電子元件之有機層的平坦性及黏著性,以有效地阻擋濕氣或氧從外側引入到有機電子裝置中,進而確保有機電子裝置的壽命;一種有機電子裝置;一種評估有機電子裝置之可靠度的方法;及一種製備有機電子裝置的方法。
最佳模式
後文中,將透過根據本發明之實施例及不符合本發明之比較例更詳細描述本發明,但本發明之範疇不限於下列實施例。
實施例1
將購自Daicel之脂環族環氧化合物Celloxide 2021P(後文中,CEL2021P)及檸檬烯二氧化物(LDO)用來作為具有環狀結構之可固化化合物。作為乙烯基醚可固化化合物,使用1,4-環己烷二甲醇二乙烯基醚(CHDVE)。作為含氧雜環丁烷基之可固化化合物,使用購自TOAGOSEI之OXT-221。又者,使用購自Tetrachem之碘鎓鹽光起始劑TTA UV-694 (後文中,UV694)作為光起始劑,並使用購自DIC之氟系界面活性劑F430作為界面活性劑。此外,使用矽烷耦合劑(KBM-403)作為耦合劑,並使用2-異丙基噻噸酮(ITX)作為光敏劑。亦,使用2,6-二(第三丁基)-p-甲酚(購自SIGMA aldrich之BHT)作為熱安定劑。
如下表1之重量比配製上述組成物,並將之引入到混合管中。於混合管中,使用行星式混合器(Kurabo, KK-250s)製備均一之封裝組成物墨水。
使用Unijet UJ-200 (噴墨頭-Dimatix 10Pl 256),令上面所製備之封裝組成物歷經噴墨而形成有機層。更具體地,以該封裝組成物於基板上形成於一方向上延伸之主要圖案,其中該基板上形成有有機電子元件,並在停留20秒的間隔後,印刷於一方向上延伸之次要圖案,以使其相鄰於主要圖案形成。噴墨條件如下。
噴墨條件:
波浪形- Var1:2μs,主要:8μs,Var2:2μs,加熱溫度:-45℃
噴射電壓- 100V,噴射頻率- 1000Hz
使印刷之有機層歷經平坦化步驟40秒,且使用LED燈以1000mJ/cm2
的UV(具有395 nm波長範圍及1000 mW/cm2
強度)照射經平坦化之有機層並固化。
實施例2
以與實施例1相同之方式形成有機層,除了改使用氟系界面活性劑F-444 (Megaface)而非F430作為界面活性劑。
實施例3
以與實施例1相同之方式形成有機層,除了改使用氟系界面活性劑F-251 (Megaface)而非F430作為界面活性劑。
實施例4
以與實施例1相同之方式形成有機層,除了改使用氟系界面活性劑F-510 (Megaface)而非F430作為界面活性劑。
比較例1至3
以與實施例1相同之方式形成封裝組成物及有機層,除了改以如下表1之重量比配製並引入到混合容器中。表1中,單位為重量份。
以下列方式評估實施例與比較例中的物理性質。
1. 平坦性之量測
對實施例中製備之固化有機層,測量並計算主要圖案與次要圖案間溝渠部分之高度h與有機層之厚度H的比率h/Hx100。值越低表示越優異的平坦性。
於量測中,使用Alpha step(KLA-Tencor)測量厚度H與溝渠部分之高度h。
2. 可鋪展性
在將實施例中製備之封裝組成物透過噴墨各以10 pL的一個液滴施加後,將其保持60秒,然後光固化,以透過光學顯微鏡測量鋪展程度。點的尺寸越大,鋪展性越佳,其中其係藉由具有相同的Dimatix 10pL Q頭噴嘴間距並將點節距設定為254μm施加,然後測量。測量施加成單一點之封裝組成物的直徑。在210μm或更多的情況下,鋪展性被分類成非常良好,而在180μm或更多的情況下,鋪展性被分類成良好。
3‧‧‧有機電子裝置
31‧‧‧基板
32‧‧‧有機電子元件
33‧‧‧有機層
34‧‧‧無機層
35‧‧‧保護層
36‧‧‧袋結構
37‧‧‧封裝膜
38‧‧‧覆蓋基板
圖1及3為顯示根據本發明一種實例之有機電子裝置的橫截面圖。
圖2為顯示根據本發明一種實例之有機層的主要圖案(圖案1)及次要圖案(圖案2)的橫截面圖。
Claims (15)
- 一種封裝組成物,其在以包含於一方向上延伸之主要圖案及於一方向上延伸並相鄰於該主要圖案形成之次要圖案的有機層形式固化的狀態下,具有該主要圖案與該次要圖案間溝渠部分之高度h對該有機層之厚度H的比率h/Hx100為50%或更少。
- 如請求項1之封裝組成物,其中該主要圖案或次要圖案具有寬度於2至150 mm範圍。
- 如請求項1之封裝組成物,其中該有機層的厚度H於2至25 μm範圍。
- 如請求項1之封裝組成物,其包含可固化化合物。
- 如請求項4之封裝組成物,其中該可固化化合物包含至少一個或多個可固化官能基。
- 如請求項4之封裝組成物,其中該可固化化合物包含5至50重量份之具有環狀結構於分子結構中之可固化化合物及25重量份至80重量份之乙烯基醚可固化化合物。
- 如請求項6之封裝組成物,其中該可固化化合物進一步包含具有氧雜環丁烷基之可固化化合物。
- 如請求項7之封裝組成物,其中該具有氧雜環丁烷基之可固化化合物之含量相對於100重量份該乙烯基醚可固化化合物為5至90重量份。
- 如請求項1之封裝組成物,其進一步包含界面活性劑。
- 如請求項1之封裝組成物,其進一步包含光起始劑。
- 如請求項1之封裝組成物,其進一步包含光敏劑。
- 一種有機電子裝置,其包含基板;形成於該基板上之有機電子元件;及密封該有機電子元件的整個表面之有機層, 其中該有機層在以於一方向上延伸之主要圖案及於一方向上延伸並相鄰於該主要圖案形成之次要圖案固化的狀態下,具有該主要圖案與該次要圖案間溝渠部分之高度h對該有機層之厚度H的比率h/Hx100為50%或更少。
- 一種評估有機電子裝置之可靠度的方法,在封裝組成物於一其上形成有有機電子元件之基板上以包含於一方向上延伸之主要圖案及於一方向上延伸並相鄰於該主要圖案形成之次要圖案的有機層形式固化的狀態下,該有機電子裝置具有該主要圖案與該次要圖案間溝渠部分之高度h對該有機層之厚度H的比率h/Hx100為50%或更少。
- 一種製備有機電子裝置的方法,其包含於基板上形成有機層的步驟,其中於該基板之上方部上形成有有機電子元件,而使得如請求項1之封裝組成物密封該有機電子元件的整個表面。
- 如請求項14之製備有機電子裝置的方法,其中該形成有機層的步驟係以噴墨印刷,凹版塗佈,旋塗,網版印刷或反轉膠版塗佈(reverse offset coating)進行。
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