TW201832413A - 製品的製造方法、外裝部品及天線圖案選擇裝置 - Google Patents

製品的製造方法、外裝部品及天線圖案選擇裝置 Download PDF

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Publication number
TW201832413A
TW201832413A TW106141173A TW106141173A TW201832413A TW 201832413 A TW201832413 A TW 201832413A TW 106141173 A TW106141173 A TW 106141173A TW 106141173 A TW106141173 A TW 106141173A TW 201832413 A TW201832413 A TW 201832413A
Authority
TW
Taiwan
Prior art keywords
antenna
resin molded
product
integrated circuit
molded body
Prior art date
Application number
TW106141173A
Other languages
English (en)
Chinese (zh)
Inventor
川井若浩
Original Assignee
日商歐姆龍股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商歐姆龍股份有限公司 filed Critical 日商歐姆龍股份有限公司
Publication of TW201832413A publication Critical patent/TW201832413A/zh

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00—Details of, or arrangements associated with, antennas
    • H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
    • H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07728—Physical layout of the record carrier the record carrier comprising means for protection against impact or bending, e.g. protective shells or stress-absorbing layers around the integrated circuit

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Details Of Aerials (AREA)
  • Credit Cards Or The Like (AREA)
TW106141173A 2017-02-22 2017-11-27 製品的製造方法、外裝部品及天線圖案選擇裝置 TW201832413A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017030838A JP6658607B2 (ja) 2017-02-22 2017-02-22 製品の製造方法、外装部品およびアンテナパターン選択装置
JP2017-030838 2017-02-22

Publications (1)

Publication Number Publication Date
TW201832413A true TW201832413A (zh) 2018-09-01

Family

ID=63254193

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106141173A TW201832413A (zh) 2017-02-22 2017-11-27 製品的製造方法、外裝部品及天線圖案選擇裝置

Country Status (6)

Country Link
US (1) US11322828B2 (enExample)
EP (1) EP3588384B1 (enExample)
JP (1) JP6658607B2 (enExample)
CN (1) CN109997153A (enExample)
TW (1) TW201832413A (enExample)
WO (1) WO2018154880A1 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023139864A1 (ja) * 2022-01-24 2023-07-27 サトーホールディングス株式会社 成形体及び成形体の製造方法
US12400100B2 (en) * 2022-11-17 2025-08-26 Hid Global Corp. On-metal RFID tag

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3661482B2 (ja) 1999-04-06 2005-06-15 ソニーケミカル株式会社 半導体装置
JP3916405B2 (ja) 2001-03-06 2007-05-16 松下電器産業株式会社 電子部品実装済部品の製造方法、電子部品実装済完成品の製造方法、及び半導体部品実装済完成品
JP4089167B2 (ja) 2001-03-30 2008-05-28 三菱マテリアル株式会社 Ｒｆｉｄ用タグ
JP4052111B2 (ja) * 2002-06-07 2008-02-27 ソニー株式会社 無線情報記憶媒体
JP2005301443A (ja) 2004-04-07 2005-10-27 Bridgestone Corp Ｒｆｉｄタグ及びｒｆｉｄタグの回路定数調整方法
JP2006039902A (ja) * 2004-07-27 2006-02-09 Ntn Corp Ｕｈｆ帯無線ｉｃタグ
JP4290620B2 (ja) * 2004-08-31 2009-07-08 富士通株式会社 Ｒｆｉｄタグ、ｒｆｉｄタグ用アンテナ、ｒｆｉｄタグ用アンテナシートおよびｒｆｉｄタグの製造方法
EP1833290A4 (en) * 2004-12-03 2009-11-11 Hallys Corp METHOD FOR MANUFACTURING ELECTRONIC COMPONENT AND EQUIPMENT FOR MANUFACTURING ELECTRONIC COMPONENT
JP4075919B2 (ja) 2005-09-29 2008-04-16 オムロン株式会社 アンテナユニットおよび非接触ｉｃタグ
WO2007141836A1 (ja) 2006-06-02 2007-12-13 Hitachi, Ltd. Ｉｃタグ用インレットの製造方法
JP2008210344A (ja) 2007-02-28 2008-09-11 Omron Corp Ｉｃタグ及びその製造方法
CN101587845A (zh) * 2008-05-21 2009-11-25 资茂科技股份有限公司 电子卷标的封装方法、封装结构及无尘室人员的管控方法
WO2013070747A1 (en) * 2011-11-07 2013-05-16 Tego Inc. Rfid drive management facility
US9286564B2 (en) * 2012-11-20 2016-03-15 Xerox Corporation Apparatuses and methods for printed radio frequency identification (RFID) tags
DE102014119663A1 (de) * 2014-12-29 2016-06-30 Infineon Technologies Ag Chipkarte
US11239179B2 (en) * 2018-11-28 2022-02-01 Shiann-Tsong Tsai Semiconductor package and fabrication method thereof

Also Published As

Publication number Publication date
US11322828B2 (en) 2022-05-03
EP3588384A1 (en) 2020-01-01
EP3588384A4 (en) 2020-08-12
US20190386390A1 (en) 2019-12-19
CN109997153A (zh) 2019-07-09
JP6658607B2 (ja) 2020-03-04
JP2018136746A (ja) 2018-08-30
EP3588384B1 (en) 2021-12-29
WO2018154880A1 (ja) 2018-08-30

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